JP2017130627A - Chuck table - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chuck table which can prevent clogging caused by fluid invasion.SOLUTION: A chuck table (10, 38), provided on processing equipment (2) to process a tabular workpiece (11), which holds a workpiece unit (1) constituted by a workpiece, an annular frame (15) which surrounds the workpiece, a pressure sensitive adhesive tape (13) which is adhered to the workpiece and the frame, includes: a body part (42) having a holding surface (42a) for sucking and holding the workpiece through the pressure sensitive adhesive tape; and a frame support (48) which supports the frame outside the body part. The frame support is formed to have a smaller outer diameter than the frame. When the frame is overlaid on the frame support in such a manner that the outer edge (15a) of the frame protrudes to the outside of the frame support, the overall top faces of the body part and the frame support are covered with the workpiece unit.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a chuck table that sucks and holds a plate-like workpiece.

  A processing apparatus for processing a workpiece such as a semiconductor wafer or a package substrate is provided with, for example, a chuck table that sucks and holds the workpiece with a negative pressure (vacuum). By sucking and holding the workpiece by the chuck table, the workpiece can be processed with sufficiently high accuracy.

  In recent years, in order to make it easier to handle workpieces before and after processing, a workpiece unit in which an adhesive tape larger in diameter than the workpiece is attached to the workpiece and an annular frame is fixed to the outer edge of the adhesive tape Opportunities to form (frame units) are increasing. In this case, the chuck table is configured to be able to hold the entire workpiece unit (see, for example, Patent Document 1).

JP 2010-21464 A

  When processing the above-described workpiece, it is common to supply a processing fluid such as pure water to the workpiece and the tool in order to promote the discharge of processing scraps, the cooling of each part, and the like. However, since there is a slight gap between the workpiece unit and the chuck table, the machining liquid containing machining waste is sucked into this gap and the chuck table (especially the negative pressure transmission path) is clogged. There was a problem that it was easy.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a chuck table that can prevent clogging due to liquid entering from a gap.

  According to one aspect of the present invention, a processing apparatus that processes a plate-shaped workpiece, the workpiece, an annular frame that surrounds the workpiece, the workpiece and the frame are attached to the workpiece. A chuck table for holding a workpiece unit composed of an adhesive tape to be attached, a main body having a holding surface for sucking and holding the workpiece through the adhesive tape, and A frame support portion that supports the frame on the outside, and the frame support portion is formed to have an outer diameter smaller than that of the frame, and an outer edge of the frame protrudes outside the frame support portion. Thus, when the frame is overlaid on the frame support portion, the chuck table is provided in which the entire upper surface of the main body portion and the frame support portion is covered with the workpiece unit.

  In one aspect of the present invention, the frame support part further includes a magnetic force generation part, and when the frame is made of a ferromagnetic material, it is preferable to adsorb and hold the frame with a magnetic force.

  In one embodiment of the present invention, the frame support portion extends outward from a position lower than the holding surface on the outer peripheral side surface of the main body portion, and a step is formed between the frame support portion and the holding surface. It is preferable that

  In one embodiment of the present invention, it is preferable that a part of the frame support portion is cut out.

  The chuck table according to one aspect of the present invention includes a main body portion having a holding surface for holding a workpiece and a frame support portion having an outer diameter smaller than that of the frame, so that the outer edge of the frame is outside the frame support portion. When the frame is superimposed on the frame support portion so as to protrude from the edge, the entire upper surface of the main body portion and the frame support portion is covered with the workpiece unit.

  As a result, the liquid supplied to the workpiece unit is less likely to flow down to the frame support portion, and the liquid can be prevented from entering the gap between the workpiece unit and the frame support portion. That is, according to the chuck table according to one aspect of the present invention, the holding surface can be prevented from being clogged by the liquid entering from the gap.

It is a perspective view which shows typically the structural example of a cutting device provided with a chuck table. It is a top view which shows typically the structural example of a workpiece unit. It is a top view which shows typically the structural example of a chuck table. FIG. 4A is a plan view schematically showing a state in which the workpiece unit is held by the chuck table, and FIG. 4B is a drawing of the workpiece sucked and held by the chuck table. It is a partial cross section side view which shows a mode typically.

  Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically illustrating a configuration example of a cutting apparatus including a chuck table according to the present embodiment. In the present embodiment, a cutting apparatus will be described as an example. However, the processing apparatus according to the present invention may be a grinding apparatus, a polishing apparatus, or the like.

  As shown in FIG. 1, the cutting device (processing device) 2 includes a base 4 that supports each structure. On the upper surface of the base 4, a rectangular opening 4 a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed. In this opening 4a, there are provided an X-axis moving table 6, an X-axis moving mechanism (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dustproof and drip-proof cover 8 that covers the X-axis moving mechanism. Yes.

  The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table 6 is slidably attached to the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 6, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 6 moves in the X-axis direction along the X-axis guide rail.

  On the X-axis moving table 6, a chuck table 10 for sucking and holding the workpiece unit (frame unit) 1 is provided. The chuck table 10 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis parallel to the Z-axis direction (vertical direction). The chuck table 10 is processed and fed in the X-axis direction by the above-described X-axis moving mechanism. Details of the chuck table 10 will be described later.

  FIG. 2 is a plan view schematically showing a configuration example of the workpiece unit 1. The workpiece unit 1 includes a plate-like workpiece 11. The workpiece 11 is, for example, a circular semiconductor wafer made of a semiconductor material such as silicon, and the upper surface (front surface) side thereof is divided into a plurality of regions by division lines (streets) arranged in a lattice pattern. Yes.

  An adhesive tape 13 having a diameter larger than that of the workpiece 11 is attached to the lower surface (back surface) side of the workpiece 11. An annular frame 15 is fixed to the outer edge portion of the adhesive tape 13. That is, one adhesive tape 13 is attached to the workpiece 11 and the frame 15, and the workpiece 11 is supported by the frame 15 via the adhesive tape 13.

  In the present embodiment, a circular semiconductor wafer made of a semiconductor material such as silicon is used as the workpiece 11. However, the material, shape, and the like of the workpiece 11 are not limited. For example, a package substrate, a ceramic substrate, a glass substrate, a resin substrate, a metal substrate, or the like can be used as the workpiece 11.

  On the upper surface of the base 4, a gate-type support structure 14 that supports a cutting unit (processing unit) 12 for cutting the workpiece 11 is disposed so as to straddle the opening 4 a. A cutting unit moving mechanism 16 that moves the cutting unit 12 in the Y-axis direction (left-right direction, index feed direction) and the Z-axis direction is provided on the upper front surface of the support structure 14.

  The cutting unit moving mechanism 16 includes a pair of Y-axis guide rails 18 arranged on the front surface of the support structure 14 and parallel to the Y-axis direction. A Y-axis moving plate 20 constituting the cutting unit moving mechanism 16 is slidably attached to the Y-axis guide rail 18.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of the Y-axis moving plate 20, and a Y-axis ball screw 22 parallel to the Y-axis guide rail 18 is screwed to the nut portion. Yes. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 22. When the Y-axis ball screw 22 is rotated by the Y-axis pulse motor, the Y-axis moving plate 20 moves in the Y-axis direction along the Y-axis guide rail 18.

  A pair of Z-axis guide rails 24 parallel to the Z-axis direction are provided on the surface (front surface) of the Y-axis moving plate 20. A Z-axis moving plate 26 is slidably attached to the Z-axis guide rail 24.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 26, and a Z-axis ball screw 28 parallel to the Z-axis guide rail 24 is screwed into the nut portion. Yes. A Z-axis pulse motor 30 is connected to one end of the Z-axis ball screw 28. If the Z-axis ball screw 28 is rotated by the Z-axis pulse motor 30, the Z-axis moving plate 26 moves in the Z-axis direction along the Z-axis guide rail 24.

  A cutting unit 12 for cutting the workpiece 11 is provided below the Z-axis moving plate 26. A camera (imaging unit) 32 that images the upper surface side of the workpiece 11 is installed at a position adjacent to the cutting unit 12. If the cutting unit moving mechanism 16 moves the Y-axis moving plate 20 in the Y-axis direction, the cutting unit 12 and the camera 32 are indexed, and if the Z-axis moving plate 26 is moved in the Z-axis direction, the cutting unit is moved. 12 and the camera 32 move up and down.

  The cutting unit 12 includes an annular cutting blade 34 attached to one end of a spindle that constitutes a rotation axis parallel to the Y-axis direction. A rotational drive source (not shown) such as a motor is connected to the other end side of the spindle, and rotates the cutting blade 34 mounted on the spindle. Further, a nozzle 35 for supplying a cutting fluid (processing fluid) such as pure water to the cutting blade 34 and the workpiece 11 is disposed in the vicinity of the cutting blade 34.

  A circular opening 4b is formed at a position adjacent to the opening 4a. A cleaning unit 36 for cleaning the workpiece 11 is disposed in the opening 4b. The cleaning unit 36 includes a chuck table 38 that sucks and holds the workpiece unit 1, and a nozzle 40 that ejects a cleaning fluid toward the workpiece 11. The chuck table 38 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis parallel to the Z-axis direction. Details of the chuck table 38 will be described later.

  When cutting the workpiece 11 with the cutting apparatus 2 configured in this way, first, the workpiece unit 1 is carried into the chuck table 10 and held. Next, the chuck table 10 and the cutting unit 12 are relatively moved and rotated, and the position of the cutting blade 34 is aligned with the extended line of the division planned line to be processed.

  Thereafter, the cutting blade 34 is lowered to a height at which it can contact the workpiece 11 and rotated, and further, the chuck table 10 is moved in parallel to the division line to be processed while supplying the cutting fluid. Thereby, the to-be-processed object 11 can be cut along a division | segmentation schedule line. For example, the workpiece 11 after cutting is unloaded from the chuck table 10 and cleaned by the cleaning unit 36.

  FIG. 3 is a plan view schematically showing a configuration example of the chuck tables 10 and 38. The chuck tables 10 and 38 include a main body 42. The main body portion 42 includes a disk-shaped frame body 44 formed of a metal such as stainless steel or aluminum. A circular opening 44a is formed at the center of the upper surface of the frame 44, and a suction plate 46 matching the shape of the opening 44a is fitted into the opening 44a.

  The suction plate 46 is formed, for example, in a plate shape with a porous material, and the upper surface thereof serves as a holding surface 42 a that sucks and holds the workpiece 11 through the adhesive tape 13. The opening 44a is connected to a suction source (not shown) through a flow path 44b (see FIG. 4B) formed inside the frame body 44 and the like. By applying a negative pressure (vacuum) of the suction source to the suction plate 46, a suction force for sucking the workpiece 11 is generated on the holding surface 42a.

  A frame support portion 48 for supporting the frame 15 is provided on the outer peripheral side surface 42 b (side surface of the frame body 44) of the main body portion 42. The frame support 48 is formed in a plate shape using a metal such as stainless steel or aluminum. The frame support 48 is provided with a magnet (magnetic force generator) 50 that generates a magnetic force. When the frame 11 is made of a ferromagnetic material, the frame 11 is attracted by the magnetic force of the magnet 50. Can hold. As the magnet 50, either an electromagnet or a permanent magnet may be used.

  The frame support portion 48 is typically formed in an annular shape in which the outer edge 48a side is partially cut out. A distance 48c from the outer edge 48a of the frame support 48 to the center 48b is smaller than a distance 15c from the outer edge 15a of the frame 15 constituting the workpiece unit 1 to the center 15b. That is, the frame support portion 48 is formed so that the outer diameter is smaller than that of the frame 15.

  Thus, by making the outer diameter of the frame support portion 48 smaller than the frame 15, the entire upper surface of the main body portion 42 and the frame support portion 48 can be covered with the workpiece unit 1. In other words, since the workpiece unit 1 can function like an umbrella, the liquid (cutting fluid or cleaning fluid) supplied to the upper surface of the workpiece unit 1 is particularly supported by the workpiece unit 1 and the frame. It becomes difficult to enter the gap with the portion 48.

  Further, the frame support portion 48 extends outward from a position lower than the holding surface 42a of the outer peripheral side surface 42b (see FIG. 4B), and between the holding surface 42a and the frame support portion 48. , A step is formed. Therefore, even if the liquid enters the gap between the workpiece unit 1 and the frame support 48 through the adhesive tape 13 or the like, most of the liquid falls in the gap between the step and the adhesive tape 13, There is no step up. In other words, since the liquid is prevented from entering by this step, the liquid hardly reaches the holding surface 42a.

  Further, since a part of the frame support portion 48 is cut away, the probability that the liquid enters the gap between the workpiece unit 1 and the frame support portion 48 is further reduced, and the liquid that has entered the gap is also cut. It is easily discharged through the notch 48d. In the present embodiment, four deep cutouts 48d extending from the outer edge 48a to the main body 42 are provided at approximately equal intervals, but the shape, quantity, arrangement, etc. of the cutouts 48 can be arbitrarily changed. .

  FIG. 4A is a plan view schematically showing a state in which the workpiece unit 1 is held by the chuck tables 10 and 38. As shown in FIG. 4A, when the frame 15 is overlapped on the frame support 48 so that the outer edge 15a of the frame 15 protrudes outside the frame support 48, the entire upper surface of the main body 42 and the frame support 48 is formed. It will be covered with the workpiece unit 1.

  FIG. 4B is a partial cross-sectional side view schematically showing how the workpiece 11 sucked and held by the chuck table 10 is cut. As shown in FIG. 4B, when the rotated cutting blade 34 is cut into the workpiece 11, the cutting fluid 21 is supplied to the workpiece 11 and the cutting blade 34.

  As described above, the entire upper surfaces of the main body 42 and the frame support 48 are covered with the workpiece unit 1. Therefore, the workpiece unit 1 plays a role like an umbrella with respect to the cutting fluid 21. As a result, the cutting fluid 21 is less likely to adhere to the frame support 48 or the like covered with the workpiece unit 1, and the cutting fluid 21 enters the gap between the workpiece unit 1 and the frame support 48. Is prevented.

  As described above, the chuck tables 10 and 38 according to the present embodiment include the main body portion 42 having the holding surface 42 a that holds the workpiece 11 and the frame support portion 48 having an outer diameter smaller than that of the frame 15. Therefore, when the frame 15 is overlaid on the frame support 48 so that the outer edge 15a of the frame 15 protrudes outside the frame support 48, the entire upper surface of the main body 42 and the frame support 48 is covered with the workpiece unit 1. .

  As a result, the liquid supplied to the workpiece unit 1 does not easily flow down to the frame support portion 48, and the liquid can be prevented from entering the gap between the workpiece unit 1 and the frame support portion 48. That is, according to the chuck tables 10 and 38 according to the present embodiment, it is possible to prevent clogging of the holding surface 42a due to the liquid entering from the gap.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the frame support unit 48 that attracts and holds the frame 15 by the magnet (magnetic force generation unit) 50 is illustrated, but the frame support unit 48 attracts the frame 15 by negative pressure (vacuum), You may be comprised so that it can hold | maintain.

  Moreover, in the said embodiment, the cutting apparatus (with the chuck table 10 holding the workpiece unit 1 in the case of cutting (working)) and the chuck table 38 holding the workpiece unit 1 in the case of washing | cleaning ( Although the processing apparatus 2 is described, there is no particular limitation on the use mode of the chuck table according to the present invention. For example, the processing apparatus may be configured using only one chuck table according to the present invention.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 Cutting equipment (processing equipment)
4 Base 4a, 4b Opening 6 X-axis moving table 8 Dust and drip-proof cover 10, 38 Chuck table 12 Cutting unit (processing unit)
DESCRIPTION OF SYMBOLS 14 Support structure 16 Cutting unit moving mechanism 18 Y-axis guide rail 20 Y-axis moving plate 22 Y-axis ball screw 24 Z-axis guide rail 26 Z-axis moving plate 28 Z-axis ball screw 30 Z-axis pulse motor 32 Camera (imaging unit)
34 Cutting blade 35 Nozzle 36 Cleaning unit 40 Nozzle 42 Main body portion 42a Holding surface 42b Outer peripheral side surface 44 Frame body 44a Opening 44b Flow path 46 Suction plate 48 Frame support portion 48a Outer edge 48b Center 48c Distance 48d Notch portion 50 Magnet (Magnetic force generating portion) )
1 Workpiece unit (frame unit)
11 Workpiece 13 Adhesive Tape 15 Frame 15a Outer Edge 15b Center 15c Distance

Claims (4)

Provided in a processing apparatus for processing a plate-like workpiece, and composed of the workpiece, an annular frame surrounding the workpiece, and the workpiece and an adhesive tape attached to the frame A chuck table for holding a workpiece unit to be processed,
A main body having a holding surface for sucking and holding the workpiece through the adhesive tape;
A frame support part for supporting the frame on the outside of the main body part,
The frame support portion is formed to have an outer diameter smaller than the frame,
When the frame is overlapped with the frame support portion so that the outer edge of the frame protrudes outside the frame support portion, the entire upper surface of the main body portion and the frame support portion is covered with the workpiece unit. Chuck table.   The chuck according to claim 1, wherein the frame support portion further includes a magnetic force generation portion, and when the frame is formed of a ferromagnetic material, the frame support portion is attracted and held by the magnetic force. table.   The frame support portion extends outward from a position lower than the holding surface on the outer peripheral side surface of the main body portion, and a step is formed between the frame support portion and the holding surface. The chuck table according to claim 1 or claim 2.   The chuck table according to any one of claims 1 to 3, wherein a part of the frame support part is cut out.

Images