TW201732276A - Vision inspection module, focal length adjustment module thereof and device inspection system having the same - Google Patents

Abstract

The present invention relates to an element inspection system and, more specifically, to a vision inspection module for conducting vision inspection on a semiconductor element, a focal distance adjustment module of the vision inspection module, and an element inspection system having same. Disclosed is a vision inspection module (50) for conducting vision inspection on a semiconductor element (1) having a polygonal planar shape, the vision inspection module (50) comprising: a single image obtainment unit (100) for obtaining a first plane image of a first plane of the semiconductor element (1) and side images of the polygonal sides of the semiconductor element (1); and an optical system for forming a first light path (L1) allowing the first plane image of the first plane of the semiconductor element (1) to reach the single image obtainment unit (100) and a plurality of second light paths (L2) allowing each of the side images of the sides at the polygonal sides of the semiconductor element (1) to reach the single image obtainment unit (100).

Description

Visual inspection module, focal length correction module of visual inspection module, and component inspection system having the same

The present invention relates to a visual inspection system, and more particularly to a visual inspection module for performing visual inspection of a semiconductor component, a focus distance correction module of a visual inspection module, and a component inspection system having the visual inspection module.

For the semiconductor component that completes the packaging process, it is loaded on the user tray and then shipped after the completion of the test of the burner.

Then, the surface of the manufactured semiconductor component is subjected to a marking process marked with an identification.

In addition, the semiconductor element is finally subjected to inspection of the appearance state of the semiconductor element and the mark formed on the surface, and specifically whether the lead ball grid is broken, whether or not cracks, scratches, etc. are inspected. .

On the other hand, with the increase of the appearance state of the semiconductor element as described above and the inspection of whether or not the marking is acceptable, the time for executing the overall process and the size of the device are affected according to the inspection time and the configuration of each module.

In particular, the size of the apparatus differs depending on the loading of the tray on which the plurality of components are loaded, the at least one module for visually inspecting the respective components, and the configuration and configuration of the unloading module according to the inspection result after the inspection.

In addition, the size of the device limits the number of component inspection systems that can be set in the component inspection line, or the inspection system is set according to the amount set in advance, affecting the installation cost for the production component.

Recognizing the problems as described above, it is an object of the present invention to provide a visual inspection module and a visual inspection module that perform a visual inspection by acquiring a surface image of a semiconductor element at a time and an image adjacent to a plurality of sides of the surface. A focus distance correction module and a component inspection system having the vision inspection module.

The present invention has been made in order to achieve the object of the present invention as described above. The present invention discloses a visual inspection module as a visual inspection module 50 for performing visual inspection on a semiconductor element 1 having a polygonal planar shape, characterized in that a single image acquisition unit 100 that acquires a first planar image of a first plane of the semiconductor element 1 and a side image of a side of a polygonal side of the semiconductor element 1; and an optical system including the first An optical path L1 and a plurality of second optical paths L1, the first optical path L1 causing a first planar image of the first plane of the semiconductor element 1 to reach the single image acquiring unit 100; the plurality of second optical paths L2 The side image of the side surface of the polygonal side of the semiconductor element 1 is caused to reach the single image acquisition unit 100, respectively.

The focal length correction unit 400 may be further included in the optical system and correct a difference in focus distance between the first optical path L1 and the second optical path L2.

The focal length correction portion 400 includes a dielectric portion 410 that is disposed on the corresponding optical paths L1, L2 and has a transparent material that is transparent to light.

The focus distance correction portion 400 includes a frame portion 420 that is detachably coupled to the structure 520 and the medium portion 410 is detachably disposed to the frame portion 420.

The frame portion 420 removably couples the structure 520 by magnetic force.

The optical system may include: a main reflective member 211 that reflects a first planar image of the first plane toward the single image acquisition unit 100; and an auxiliary reflective member 311 corresponding to the The side surfaces of the respective sides of the polygonal side of the semiconductor element 1 are reflected toward the main reflection member 211 on the respective side faces of the polygonal sides of the semiconductor element 1.

The main reflective member 211 has a light transmissive semi-transmissive material, and may include an illumination system 540 that illuminates light from the back surface of the reflective surface that reflects the first planar image to the first plane and the semiconductor component 1 side of each side of the polygonal side.

The focus distance correction unit 400 is disposed between the respective side faces of the polygonal sides of the semiconductor element 1 and the main reflection member 211 in the second optical path L2, and the main reflection member in the second optical path L2 At least one of 211 and the single image acquisition unit 100.

The focal length correction unit 400 is disposed between the respective side faces of the polygonal sides of the semiconductor element 1 and the main reflection member 211 in the second optical path L2, and the focus distance correction unit 400 can be coupled with the auxiliary The reflecting member 311 is formed integrally.

The present invention also discloses a component inspection system, comprising: a loading unit 10 that loads and linearly moves a tray 2, the tray 2 is provided with a plurality of semiconductor components 1; a visual inspection module 50, and the loading portion 10 The transfer direction of the inner tray 2 is perpendicular, and is disposed on one side of the loading portion 10 to perform visual inspection on the semiconductor element 1; the first guide rail 68 is disposed perpendicular to the moving direction of the tray 2 in the loading portion 10; a first transfer tool 61 coupled to the first rail 68 for movement along the first rail 68, and for performing a visual inspection, picking up components from the loading portion 10 to the visual inspection module 50; The unloading portions 31, 32, 33 receive the tray 2 containing the semiconductor element (1) for performing visual inspection from the loading portion 10, and classify the semiconductor element 1 in the tray 2 based on the visual inspection result; wherein the visual inspection mode Group 50 is a visual inspection module of the structure described above.

The present invention discloses a focus distance correction module as a focus distance correction unit 400 for use in a visual inspection module having the above-described configuration, and for causing a first planar image and four side images to arrive at the above The single image acquisition section 100 is provided with four medium portions 410 corresponding to the second light paths L2 of the four side images, wherein the first planar image is an image of the first plane of the semiconductor element 1 having a planar shape of a rectangular shape The four side images are images of the four sides of the semiconductor component 1, and include: a first frame portion 610 detachably coupled to the structure 520; and a second frame portion 620 Removably coupled to the first frame The frame portion 610 is provided with the four dielectric portions 410 having a light transmissive transparent material to correspond to the second optical path L2 of the four side images.

The first frame portion 610 is provided with at least one magnet 615 to maintain a combined state with the second frame portion 620, and the second frame portion 620 may be provided with a magnetic abutting member 622, and further disposed therein. The magnet 615 of the first frame portion 610 is in close contact with each other.

The second frame portion 620 may vertically penetrate through the first optical path forming opening 629 and the medium portion rear resting portion 621 provided with the four medium portions 410 to form the first optical path L1.

In order to accurately set the first light path forming opening 629 and the medium portion 410, the second frame portion 620 may form a guiding hole 623 along a second joint surface 611 perpendicular to the first frame portion 610. The guide holes 623 are inserted in the longitudinal direction of the at least two guiding members 613 protruding in the direction.

The first frame portion 610 may include a bottom surface support member 614 formed with a bottom surface support portion 612 that supports a bottom surface of the second frame portion 620.

At least one of the first frame portion 610 and the second frame portion 620 incorporates a reflective member support portion 617 for supporting four reflections of the semiconductor element 1 to the respective dielectric portions 410 The auxiliary reflection member 311 on the side surface has four reflection surfaces 311b, and further reflects the four side faces of the semiconductor element 1 toward the respective dielectric portions 410, and the upper side of the auxiliary reflection member 311 is formed to be vertically penetrated. The through hole 311a is such that the semiconductor element 1 picked up and transferred by the first transfer tool 61 is located at the inspection position.

The visual inspection module according to the present invention, the focus distance correction module of the visual inspection module, and the component inspection system having the visual inspection module have the following advantages: obtaining a surface image of the semiconductor component at a time and abutting the surface A plurality of side images are used to perform visual inspection, thereby enabling various visual inspections to be performed quickly.

In particular, when the surface image of the semiconductor element and the plurality of side images adjacent to the surface are acquired at one time, the difference in the focal length of the mutually different optical paths is corrected by using a medium such as transparent glass, and thus one can be used. The single camera acquires an image, so that the structure of the module for performing visual inspection can be simplified and the manufacturing cost can be saved.

Furthermore, it is necessary to accurately set the medium such as transparent glass, and the medium is provided by the modular frame portion, so that the medium for correcting the focal length can be set more accurately and stably, so that the visual inspection can be performed more accurately. , wherein the medium is corrected according to the difference in the focal distance of the mutually different optical paths.

1‧‧‧Semiconductor components

2‧‧‧Tray

10‧‧‧Loading Department

31, 32, 33‧‧‧ Unloading Department

50‧‧‧ visual inspection module

61‧‧‧First Transfer Tool

62‧‧‧Classification tools

68‧‧‧First rail

100‧‧‧Single Image Acquisition Department

110‧‧‧ lens

211‧‧‧Main reflective parts (reflective parts)

311‧‧‧Auxiliary Reflective Parts (Reflecting Parts)

311a‧‧‧through hole

311b‧‧‧reflecting surface

400‧‧‧Focus Distance Correction Department

410‧‧‧Media Department

413‧‧‧Media Department

420‧‧‧Framework

421‧‧‧Frame parts

422‧‧‧Frame parts

424‧‧‧ magnet

429‧‧‧White space

520‧‧‧structure

524‧‧‧ Magnet

540‧‧‧Lighting system

545‧‧‧Light source

610‧‧‧First Frame Department (Framework Department)

611‧‧‧second joint surface

612‧‧‧Bottom support

613‧‧‧Guide parts

614‧‧‧Bottom support parts

615‧‧‧ magnet

617‧‧‧reflector support

618‧‧‧Support

619‧‧‧ openings

620‧‧‧ Second Frame Department (Framework Department)

621‧‧‧Media Department Re-setting Department

622‧‧‧ close parts

623‧‧‧ Guide hole

629‧‧‧The first optical path forms an opening

L1‧‧‧First light path

L2‧‧‧Second light path

1 is a plan view showing an example of a component inspection system according to the present invention; and FIG. 2a is a schematic view showing a structure of an example of a visual inspection module of the component inspection system of FIG. 1 in a side direction; FIG. 2b is a view 2 is a plan view showing an arrangement of a semiconductor element and an auxiliary reflection member in the visual inspection module of FIG. 2a; FIG. 3 is a plan view showing an example of a focus distance correction portion in the visual inspection module of FIG. 2; FIG. 5 is a schematic view showing the structure of another example of the visual inspection module of the component inspection system of FIG. 1 in a side direction; FIG. 6 is a view showing the vision in FIG. 2 or FIG. A schematic diagram of a concept for checking a running distance of an image in a module; FIG. 7 is a schematic diagram showing an image acquired by the visual inspection module of FIG. 2 or FIG. 5; FIG. 8 is a diagram showing FIG. FIG. 9 is an exploded perspective view of the focus distance correction unit of FIG. 8; FIG. 10 is a front view of the focus distance correction unit of FIG. 8; and FIG. 11 is a front view of the focus distance correction unit of FIG. Visual inspection of the focus distance correction unit A partial sectional view of the group of visual inspection process.

Hereinafter, a visual inspection module, a focus distance correction module of a visual inspection module, and a component inspection system having the visual inspection module according to the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, a component inspection system according to an embodiment of the present invention includes a loading unit 10 that loads and linearly moves a tray 2 on which a plurality of semiconductor elements 1 are mounted, a visual inspection module 50, and a tray in the loading unit 10. The transfer direction of 2 is vertically disposed on one side of the loading portion 10, and performs visual inspection on the semiconductor element 1; the first guide rail 68 is disposed perpendicular to the moving direction of the tray 2 in the loading portion 10; the first transfer tool 61, and the A guide rail 68 is coupled to move along the first guide rail 68, and in order to perform a visual inspection, the component is picked up from the loading section 10 for transfer to the visual inspection module 50; and the unloading sections 31, 32, 33 are received from the loading section 10 The tray 2 of the semiconductor element 1 on which the visual inspection is completed is classified into the semiconductor element 1 based on the visual inspection result.

Here, the semiconductor element 1 may be any element as long as it is a semiconductor process, and specifically includes a dynamic memory device, a flash memory, a CPU, a GPU, and the like.

The tray 2 is a structure in which at least one semiconductor element 1 is composed of a matrix of 8 × 10 or the like and is loaded and transferred, and is generally a standardized memory element or the like.

The loading unit 10 has a structure in which the semiconductor element 1 to be inspected is loaded to perform visual inspection, and has various structures.

As an example, the loading unit 10 transfers the tray 2 on which the plurality of semiconductor elements 1 are mounted in a state of being mounted on a mounting groove formed in the tray 2.

The loading portion 10 may have a plurality of structures, as shown in FIG. 1 and disclosed in Korean Patent Publication No. 10-2008-0092671, and may include a guide portion for guiding movement of the tray 2 on which the plurality of semiconductor elements 1 are loaded (FIG. Not shown); and a driving portion (not shown) for moving the tray 2 along the guiding portion.

The visual inspection module 50 has a plurality of configurations and has a structure that is perpendicular to the direction in which the tray 2 in the loading unit 10 is transported and disposed on one side of the loading unit 10, and performs visual inspection on the semiconductor element 1.

Here, the visual inspection module 50 can of course have various structures depending on the structure of the system.

In particular, the visual inspection module 50 can have various configurations and has a configuration in which an external image of the bottom surface of the semiconductor element 1 or the like is acquired by a camera, a scanner, or the like.

Here, the image acquired by the visual inspection module 50 is flexibly applied to a visual inspection, which is to determine whether or not the image is qualified after analyzing the image using a program or the like.

On the other hand, the visual inspection module 50 may have various structures according to the type of visual inspection, and is preferably configured as follows: one of the upper surface and the bottom surface of the semiconductor element 1 (hereinafter, referred to as a first surface) and adjacent All of the sides perform a visual inspection.

More specifically, as shown in FIG. 2a and FIG. 7, the visual inspection module 50 is preferably configured as follows: for the semiconductor element 1 having a rectangular shape in a plan view, the back side is picked up by the first transfer tool 61. And all four sides perform visual inspection.

To this end, as shown in FIG. 2 to FIG. 5, for the visual inspection module 50, as an example, the visual inspection module 50 for performing visual inspection on the semiconductor element 1 having a polygonal planar shape may include: a single The image acquisition unit 100 acquires a first planar image on a first plane of the semiconductor element 1 and acquires a side image on a side of the polygonal side of the semiconductor element 1; the optical system includes a first optical path L1 and a second optical path L2, The first optical path L1 causes the first planar image of the first plane of the semiconductor element 1 to reach the single image acquisition unit 100, and the second optical path L2 causes the side images of the sides of the polygonal side of the semiconductor element 1 to be respectively The single image acquisition unit 100 is reached.

The single image acquisition section 100 may have various structures and has a structure in which a first planar image is acquired for the first plane of the semiconductor element 1 and a side image is acquired for the side of the polygonal side of the semiconductor element 1.

As an example, the single image acquisition unit 100 may use a camera, a scanner, or the like.

Then, as shown in FIG. 7, the single image acquisition section 100 is flexibly applied to visual inspection, specifically, to analyze the acquired image, the first planar image of the first plane of the semiconductor element 1 and the semiconductor element The side image of the side surface of the polygonal side of 1 is transmitted to a control unit (not shown), and the image is analyzed by a program or the like, and then it is judged whether or not it is acceptable.

The optical system may have a plurality of structures and have a structure of forming a first optical path L1 and a second optical path L2, wherein the first optical path L1 causes a first planar image of the first plane of the semiconductor element 1 to reach a single image In the image capturing unit 100, the second optical path L2 causes the side image of the side surface of the polygonal side of the semiconductor element 1 to reach the single image acquiring unit 100, respectively.

Specifically, with respect to the optical system, the number of the lens 110, the reflecting members 211, 311, the semi-transmissive members, the crucibles, and the like, and the installation position can be selected in accordance with the arrangement positions of the semiconductor element 1 and the single image capturing portion 100.

In particular, the optical system may include: a main reflective member 211 that reflects a first planar image of the first plane toward the single image acquisition portion 100; and an auxiliary reflective member 311 corresponding to each of the polygonal sides of the semiconductor element 1. The side surface reflects the side image of each side surface of the polygonal side of the semiconductor element 1 toward the main reflection member 211.

The main reflection member 211 has a configuration in which a first planar image of the first plane is reflected to the single image acquisition unit 100, and various members such as a reflection member and a semi-transmissive member can be used.

The auxiliary reflecting member 311 can be used for various members such as a reflecting member, a semi-transmissive member, and the like, and has a structure corresponding to each side of the polygonal side of the semiconductor element 1, and reflects the semiconductor element 1 toward the main reflecting member 211. Side image of each side of the polygonal side.

On the other hand, the optical system is provided with an illumination system 540 that illuminates light on a first plane, side to perform a visual inspection, and the illumination system 540 can have various arrangement configurations depending on the illumination mode.

The illumination system 540 can illuminate various kinds of light depending on the form of visual inspection, and specifically includes monochromatic light such as laser light, three-color light such as R, G, and B, white light, or the like, and various light sources such as LED elements can be used.

At the same time, the illumination system 540 can implement various configurations in accordance with the optical system structure.

As an example, when the optical system as described above includes the main reflective member 211, the main reflective member 211 may have a translucent material that is transparent to light, and the illumination system 540 reflects the reflective surface of the first planar image. The back surface illuminates the first plane and each side of the polygonal side of the semiconductor element 1.

In addition, as shown in FIG. 2, the illumination system 540 may have a structure in which the first plane and each side surface may be illuminated by another light source 545, so that the auxiliary reflection member 311 has a permeable half as described above. The light transmissive material allows light to be irradiated from the back surface of the reflective surface of the reflective side image to the respective side faces of the polygonal side of the semiconductor element 1.

On the other hand, the first planar image and the side image are acquired through mutually different optical paths (ie, the first optical path L1 and the second optical path L2), and therefore the focal lengths are different from each other because of the optical path difference of the optical path, and thus Through a single image acquisition device (ie, camera) When an image is acquired, the focus of one of the first planar image and the side image is not aligned, and there is a problem that the image is blurred.

Accordingly, as shown in FIG. 2 to FIG. 5, the visual inspection module 50 may further include a focus distance correction unit 400 disposed in the optical system and correcting the first optical path L1 and the second optical path L2. The difference in focus distance.

Since the focal length correction unit 400 is acquired via the first optical path L1 and the second optical path L2, the focus distance correction unit 400 is configured to correct the optical path difference because the optical path difference focal lengths of the optical paths are different from each other. Can have a variety of structures.

As an example, the focus distance correction portion 400 may include a medium portion 410 disposed at the respective optical paths L1, L2 and having a light transmissive transparent material.

The medium portion 410 is configured to be disposed on the corresponding optical paths L1 and L2 and used to correct the focal length. The transparent glass, quartz, or the like is configured to be disposed on the optical paths L1 and L2 to correct the focal length by the difference in refractive index.

In particular, the medium portion 410 is preferably provided in the second optical path L2 in the first optical path L1 and the second optical path L2.

Here, in the medium portion 410, the incident surface and the transmissive surface with the optical path as the reference light are perpendicular to the optical path, and have a columnar shape such as a cylindrical shape or a polygonal column shape which forms a thickness set in advance.

At this time, the thickness t of the dielectric portion 410 in the second optical path L2 direction is calculated by the equation of FIG. 6 and the following.

t=(1-1/n)/A1-A2 (here, t is the thickness of the medium in the optical path direction, n is the refractive index of the medium, A1 is the working distance for acquiring the first planar image, and A2 is used For obtaining the working distance of the side image).

On the other hand, in the case where there is a slight error, the measurement result may be affected, and it is very important to accurately set the medium portion 410, for which the focus distance correction portion 400 may include a frame portion 420 that is detachably coupled to the structure The medium 520 is detachably provided.

The structure 520 has a structure in which the device (i.e., the component inspection system) is used to support the medium portion 410, and may have various structures.

The frame portion 420 has a structure in which the structure portion 420 is detachably coupled to the structure 520 and the medium portion 410 is detachably provided.

As an example, as shown in FIG. 3, the frame portion 420 forms a blank space 429 to be capable of projecting light at the first optical path L1, and may constitute the frame portion 420 by a plurality of frame members 421, 422, and thus may correspond to the second A portion of the optical path L2 is provided with a medium portion 413.

In addition, the frame portion 420 is detachably coupled to the structure 520 by magnetic force, for which at least one of the frame portion 420 and the structure 520 may be provided with at least one magnet 424, 524.

On the other hand, the focus distance correction unit 400 is combined with an optical system and can be configured in various ways.

As an example, as shown in FIG. 2 and FIG. 5, the focal length correction unit 400 may be disposed in each of the side faces of the polygonal sides of the semiconductor element 1 and the main reflective member 211 in the second optical path L2. At least one of the main reflection member 211 and the single image acquisition unit 100 in the second optical path L2.

Further, when the focal length correction unit 400 is disposed between the respective side faces of the polygonal sides of the semiconductor element 1 in the second optical path L2 and the main reflection member 211, the focus distance correction unit 400 may be integrated with the auxiliary reflection member 311. .

By the setting of the focal length correction unit 400 as described above, the following problem can be solved: since the focal lengths are different from each other due to the optical path difference of the optical paths, when the image is acquired by a single image acquiring device (ie, a camera), the first plane The image and the focus of one of the side images are not allowed to cause image blur.

The first transfer tool 61 may have various structures and has a structure in which it is combined with the first guide rail 68 in order to move along the first guide rail 68, and the pickup component is transferred from the loading portion 10 to the visual inspection in order to perform a visual inspection. Module 50.

As an example, the first transfer tool 61 includes at least one pick-up tool (not shown) for picking up the semiconductor component 1. In order to increase the inspection speed, it is preferable to provide a plurality of pick-up tools, which are arranged in one or more columns. Wait.

The pickup tool can have various structures as a structure for picking up the semiconductor element 1 by vacuum pressure.

The first guide rail 68 may have various structures and has a structure in which the movement of the first transfer tool 61 is guided while being disposed perpendicular to the moving direction of the tray 2 in the loading portion 10 to support the first transfer tool 61 to be described later.

The unloading portions 31, 32, 33 may have various structures, and have a structure in which a tray 2 containing a semiconductor element 1 for performing visual inspection is received from the loading portion 10, and the semiconductor element 1 is classified in the tray 2 based on a visual inspection result. .

The unloading portions 31, 32, and 33 have a structure similar to that of the loading portion 10, and are preferably given a classification level according to the number of inspection results of the semiconductor element 1, specifically, a qualified product G, a defective product 1 or an abnormality 1 R1. Failed 2 or abnormal 2 R2, etc.

Then, the unloading portions 31, 32, 33 may be provided in parallel with a plurality of unloading tray portions including a guiding portion (not shown) and a driving portion (not shown), the guiding portions being disposed in parallel in loading One side of the portion 10, and the driving portion is for moving the tray 2 along the guiding portion.

On the other hand, the tray 2 is transferred between the loading portion 10 and the unloading portions 31, 32, 33 by a tray transfer device (not shown), and may further include an empty tray portion 20 to be loaded with semiconductor components. An empty tray 2 of 1 is supplied to the unloading portions 31, 32, 33.

At this time, the empty tray portion 20 may include: a guiding portion (not shown) disposed in parallel on one side of the loading portion 10; and a driving portion (not shown) for moving the tray 2 along the guiding portion .

Further, a sorting tool 62 may be separately provided at the unloading portions 31, 32, 33, and the sorting tool 62 transfers the semiconductor element 1 between the respective unloading tray portions in accordance with the sorting level of each of the unloading tray portions.

The sorting tool 62 has the same or similar structure as the first transfer tool 61 described above, and may have a multi-column structure or a single-column structure.

On the other hand, the unloading portions 31, 32, and 33 illustrate an embodiment in which the unloading is performed in a state where the tray 2 loaded in the loading unit 10 is reloaded, but there are also included a belt and a disk module, etc., as long as The structure of the unloading element after loading the semiconductor element 1 can be used, in which the tape and the disk are unloaded after being loaded on the carrier tape, and the carrier tape forms a pocket in which the semiconductor component 1 is mounted.

On the other hand, the present invention is characterized in that the visual inspection module, in particular, the structure in which the focal length compensation portion is provided on the optical path, as the structure of the proposed component inspection system, As an example, the visual inspection module according to the present invention is of course not limited to the component inspection system provided in accordance with an embodiment of the present invention.

On the other hand, the focus distance correction unit 400 in the visual inspection module according to the present invention constitutes a part of the optical system, and it is preferable to construct the focus distance correction unit 400 more accurately.

Accordingly, as shown in FIGS. 8 to 11, the focus distance correction unit 400 serves as a module and, as an example different from the embodiment shown in FIG. 3, may include at least one frame portion 610, 620, the frame The portions 610, 620 are detachably coupled to the structure 520 and the medium portion 410 is detachably disposed.

The frame portions 610, 620 have various structures and have a structure in which a first planar image of a first plane of the semiconductor element 1 having a planar shape of a right-angled quadrilateral shape and four sides of the semiconductor element 1 The four side images arrive at the single image acquisition unit 100 described above, and the four medium portions 410 are provided to correspond to the second light path L2 of the four side images.

As an example, the frame portions 610, 620 may include: a first frame portion 610 detachably coupled to the structure 520; and detachably coupled to the first frame portion 610, and provided with four media portions 410 is a second frame portion 620 corresponding to the second optical path L2 of the four side images.

The first frame portion 610 has a structure that is detachably coupled to the structure 520, and can be detachably coupled according to the structure 520, and can have various structures.

In particular, the first frame portion 610 preferably has a planar first joint surface that corresponds to the planar support surface of the structure 520 and is thus accurately coupled to the structure 520.

Then, the first frame portion 610 preferably has a planar second joint surface 611 corresponding to the plane joint surface of the second frame portion 620, thereby being accurately combined with the second frame portion 620. .

Then, the first frame portion 610 may be inserted with at least one magnet 615 on the side of the second joint surface 611 to maintain the combined state with the second frame portion 620.

At this time, the second frame portion 620 is preferably provided with a contact member 622 having a magnet to be in close contact with the magnet 615 provided in the first frame portion 610.

The second frame portion 620 has various structures and has a structure in which the first frame portion 610 is detachably coupled and four medium portions 410 are provided to correspond to the second light path L2 of the four side images. .

As an example, the second frame portion 620 may vertically penetrate through the first optical path forming opening 629 to form the first optical path L1, and may form a medium portion in which the four dielectric portions 410 are disposed. The setting unit 621.

The first optical path forming opening 629 is formed in an opening shape to pass the first optical path L1 corresponding to the first planar image of the first plane of the semiconductor element 1, and as long as the opening shape is formed, Can be any structure.

The medium portion rest portion 621 is formed to be vertically formed in the second frame portion 620, and further, four medium portions 410 may be provided to correspond to the installation positions of the four medium portions 410.

On the other hand, it is necessary for the first optical path forming opening 629 and the dielectric portion 410 to correctly correspond to the first optical path L1 and the second optical path L2.

According to this, in order to accurately set the first optical path forming opening 629 and the medium portion 410, the second frame portion 620 may form a guiding hole 623 inserted along the longitudinal direction of the at least two guiding members 613, and the guiding member 613 is vertical It protrudes in the direction of the second joint surface 611 of the first frame portion 610.

The guide hole 623 is inserted into the guiding member 613, so that the second frame portion 620 can be more accurately coupled to the first frame portion 610.

On the other hand, the first frame portion 610 may include a bottom surface supporting member 614 which is formed with a bottom surface supporting portion 612 that supports the bottom surface of the second frame portion 620 in order to stably support the second frame portion 620.

The bottom support member 614 is configured to have a bottom support portion 612 that supports the bottom surface of the second frame portion 620 to stably support the second frame portion 620, and may have a "U" shape and may form a stepped structure to support Both corner portions of the second frame portion 620.

On the other hand, at least one of the first frame portion 610 and the second frame portion 620 may incorporate a reflective member support portion 617 for supporting the auxiliary reflective member 311, the auxiliary reflective member 311 Each of the dielectric portions 410 reflects the four side faces of the semiconductor element 1.

Here, the auxiliary reflection member 311 has four reflection surfaces 311b, and further reflects the four side faces of the semiconductor element 1 toward the respective dielectric portions 410, and a through hole 311a penetrating up and down is formed on the upper side so as to be The semiconductor element 1 picked up and transferred by the transfer tool 61 is located at the inspection position.

In addition, considering that the planar shape of the semiconductor element 1 to be inspected is a right-angled quadrangle, the bottom surface of the auxiliary reflective member 311 may be formed to have a truncated pyramid shape similar to the planar shape of the semiconductor element 1.

The reflection member supporting portion 617 may have a plurality of structures as a structure for supporting the auxiliary reflection member 311, and the auxiliary reflection member 311 is coupled to at least one of the first frame portion 610 and the second frame portion 620 to the respective medium portions 410. The four sides of the semiconductor element 1 are reflected.

As an example, the reflective member support portion 617 is coupled to at least one of the first frame portion 610 and the second frame portion 620 and disposed on an upper side of the second frame portion 620, and is formed with an opening 619 to be The planar image and the four side images reflected by the auxiliary reflecting member 311 are directed toward the lower side, and the supporting portion 618 for supporting the bottom surface of the auxiliary reflecting member 311 may be formed at the edge position of the opening 619.

On the other hand, the frame portions 610, 620 of the embodiment shown in FIGS. 8 to 10 can be disposed at various positions in addition to the structure in combination with the reflecting member 311, and further support the drawing in addition to the structure of the reflecting member supporting portion 617. 2a and the medium portion 410 in the embodiment shown in FIG.

The preferred embodiments of the present invention are exemplified above, but the scope of the present invention is not limited to the specific embodiments described, but may be appropriately changed within the scope of the claims.

1‧‧‧Semiconductor components

61‧‧‧First Transfer Tool

100‧‧‧Single Image Acquisition Department

110‧‧‧ lens

211‧‧‧Main reflective parts (reflective parts)

311‧‧‧Auxiliary Reflective Parts (Reflecting Parts)

410‧‧‧Media Department

540‧‧‧Lighting system

545‧‧‧Light source

L1‧‧‧First light path

L2‧‧‧Second light path

Claims (20)

A visual inspection module as a visual inspection module (50) for performing visual inspection on a semiconductor element (1) having a polygonal planar shape, comprising: a single image acquisition unit (100) for acquiring the semiconductor element (1) a first planar image of the first plane and a side image of a side of the polygonal side of the semiconductor component (1); and an optical system including a first optical path (L1) and a plurality of second optical paths (L2), The first optical path (L1) causes a first planar image of the first plane of the semiconductor element (1) to reach the single image acquisition portion (100); the plurality of second optical paths (L2) The side image of the side surface of the polygonal side of the semiconductor element (1) reaches the single image acquisition unit (100). The visual inspection module according to claim 1, further comprising: a focus distance correction unit (400) disposed in the optical system and correcting the first optical path (L1) and the second optical path (L2) The difference in focus distance. The visual inspection module according to claim 2, wherein the focus distance correction unit (400) includes a medium portion (410) provided in a corresponding optical path (L1, L2) and having a transparent material that can transmit light. ). The visual inspection module according to claim 2, wherein the focus distance correction portion (400) includes a frame portion (420) detachably coupled to the structure (520) And the medium portion (410) is detachably provided to the frame portion (420). The visual inspection module according to claim 4, wherein the frame portion (420) is magnetically coupled to the structure (520) and is detachable. The visual inspection module according to any one of claims 1 to 5, wherein the optical system comprises: a main reflection member (211) that reflects toward the single image acquisition unit (100) a first planar image of the first plane; and an auxiliary reflective member (311) that reflects the semiconductor toward the main reflective member (211) corresponding to each side of the polygonal side of the semiconductor component (1) Side image of each side of the polygonal side of element (1). The visual inspection module according to claim 6, further comprising: an illumination system (540) for illuminating the first plane from the back surface of the reflective surface reflecting the first planar image and the Each side of the polygonal side of the semiconductor component (1); the primary reflective member (211) having a light transmissive semi-transmissive material. The visual inspection module according to claim 7, wherein the focus distance correction unit (400) is disposed in each of the polygonal sides of the semiconductor element (1) in the second optical path (L2) At least somewhere between the side surface and the main reflection member (211), between the main reflection member (211) and the single image acquisition portion (100) in the second optical path (L2). The visual inspection module according to claim 7, wherein the focus distance correction unit (400) is disposed in each of the polygonal sides of the semiconductor element (1) in the second optical path (L2) The focal length correction portion (400) is integrally formed with the auxiliary reflection member (311) between the side surface and the main reflection member (211). A component inspection system comprising: a loading portion (10) for loading and linearly moving a tray (2), the tray (2) being provided with a plurality of semiconductor components (1), a visual inspection module (50), and the loading The transfer direction of the tray (2) in the portion (10) is perpendicular, and is disposed on one side of the loading portion (10) to perform visual inspection on the semiconductor element (1); the first guide rail (68), and the loading The moving direction of the tray (2) in the portion (10) is vertically arranged; the first transfer tool (61) is combined with the first rail (68) to move along the first rail (68), and is executed Visually inspecting, picking up components from the loading portion (10) to the visual inspection module (50); and unloading portions (31, 32, 33), receiving and completing visual inspection from the loading portion (10) a tray (2) of the semiconductor component (1), classifying the semiconductor component (1) in the tray (2) according to a visual inspection result; wherein the visual inspection module (50) is in the scope of claim 1 to The visual inspection module of any of the items 5. The component inspection system of claim 10, wherein the optical system comprises: a main reflective member (211) that reflects a first planar image of the first plane toward the single image acquisition portion (100); and an auxiliary reflective member (311) corresponding to the plurality of semiconductor elements (1) Each side of the angular side reflects the side image of each side of the polygonal side of the semiconductor element (1) toward the main reflective member (211). The component inspection system according to claim 11, further comprising: an illumination system (540) for illuminating light from the back surface of the reflective surface reflecting the first planar image to the first plane and the semiconductor Each side of the polygonal side of the element (1) has a light transmissive semi-transmissive material. The component inspection system according to claim 12, wherein the focus distance correction portion (400) is disposed on each side of the polygonal side of the semiconductor element (1) in the second optical path (L2) At least one of the main reflection member (211) and the single image acquisition portion (100) between the main reflection member (211) and the second optical path (L2). The component inspection system according to claim 12, wherein the focus distance correction portion (400) is disposed on each side of the polygonal side of the semiconductor element (1) in the second optical path (L2) The focal length correction unit (400) is integrally formed with the auxiliary reflection member (311) with the main reflection member (211). A focus distance correction module as a focus distance correction unit (400) for use in the visual inspection module described in claim 3, and for causing the first planar image and the four side images to arrive at the above The single image acquisition unit (100) is provided with four medium portions (410) corresponding to the second light path (L2) of the four side images, wherein the first planar image is a semiconductor element having a planar shape of a rectangular shape ( 1) an image of a first plane, which is an image of four sides of the semiconductor component (1), comprising: a first frame portion (610) bonded to the structure ( 520) detachable; and a second frame portion (620) detachably coupled to the first frame portion (610) and provided with the four dielectric portions (410) having a transparent material that is transparent to light, A second optical path (L2) corresponding to the four side images. The focus distance correction module according to claim 15, wherein the first frame portion (610) is provided with at least one magnet (615) to maintain a combination with the second frame portion (620). In a state, the second frame portion (620) is provided with a magnetic abutting member (622), and is in close contact with a magnet (615) provided on the first frame portion (610). The focus distance correction module according to claim 15, wherein the second frame portion (620) penetrates up and down to form a first optical path forming opening (629), and the four medium portions (410) are provided. a medium portion resetting portion (621) to form the first optical path (L1). The focus distance correction module according to claim 15, wherein the second frame portion (620) is precisely provided for the first optical path forming opening (629) and the medium portion (410). Forming a guide hole (623) into which the guide hole is inserted along a length direction of at least two guiding members (613) protruding in a direction perpendicular to the second joint surface (611) of the first frame portion (610) (623). The focus distance correction module of claim 15, wherein the first frame portion (610) includes a bottom surface support member (614), and the bottom surface support member (614) is formed to support the second A bottom surface support portion (612) of the bottom surface of the frame portion (620). The focus distance correction module according to claim 15, wherein at least one of the first frame portion (610) and the second frame portion (620) is combined with a reflective member support portion (617), The reflective member support portion (617) is for supporting an auxiliary reflective member (311) that reflects four sides of the semiconductor element (1) to each of the dielectric portions (410), the auxiliary reflective member (311) having four The reflecting surface (311b) further reflects the four side faces of the semiconductor element (1) toward the respective dielectric portions (410), and forms a through hole (311a) penetrating vertically on the upper side of the auxiliary reflecting member (311) so that The semiconductor element (1) picked up and transferred by the first transfer tool (61) is located at the inspection position.