TW201731999A - 接著劑組成物、封密板片及封密體 - Google Patents
接著劑組成物、封密板片及封密體 Download PDFInfo
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- TW201731999A TW201731999A TW105138358A TW105138358A TW201731999A TW 201731999 A TW201731999 A TW 201731999A TW 105138358 A TW105138358 A TW 105138358A TW 105138358 A TW105138358 A TW 105138358A TW 201731999 A TW201731999 A TW 201731999A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
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Abstract
本發明係含有(A)成分:改質聚烯烴系樹脂、(B)成分:多官能環氧化合物、以及(C)成分:咪唑系硬化觸媒的接著劑組成物,具有使用該接著劑組成物所形成之接著劑層的封密板片,以及被封密物以前述封密板片封密而成之封密體。根據本發明,提供接著強度優異的接著劑組成物,使用該接著劑組成物所形成之具有封密性能優異的接著劑層的封密板片,以及被封密物以前述封密板片封密而成之封密體。
Description
本發明係關於接著強度優異的接著劑組成物、使用該接著劑組成物所形成之具有封密性能優異的接著劑層的封密板片、以及被封密物以前述封密板片封密而成的封密體。
近年來,有機EL元件,作為藉由低電壓直流驅動而可高亮度發光的發光元件受到注目。
然而,有機EL元件中,隨著時間經過的同時,有發光亮度、發光效率、發光均一性等發光特性容易降低的問題。
作為該發光特性降低的問題的原因,咸信為氧或水份等浸入有機EL元件的內部,使電極或有機層劣化。
因此,作為對應處理方法,使用封密材的方法有數種提案。例如,專利文獻1中,記載板片狀封密材,其包含融解熱量及重量平均分子量係於特定範圍的烯烴聚合物,以及40℃之動黏度係於特定範圍內之烴系合成油。
專利文獻1:日本特開2015-137333號公報
專利文獻1記載的板片狀封密材,係具有根據需要可剝離之特徵者。然而,該板片狀封密材,接著強度有劣化的傾向。
有機EL元件等被封密物,亦多有使用於屋外或車內等過於嚴苛的條件的情況。因此,正期望即使於該等條件下亦具有優異的接著性能,可將被封密物充分地封密之封密材,以及使用作為該等封密材之成形材料的接著劑組成物。
本發明係有鑒於上述實際情況者,以提供接著強度優異且水分遮斷性亦優異的接著劑組成物、使用該接著劑組成物所形成之具有封密性能優異的接著劑層的封密板片、以及被封密物以前述封密板片封密而成之封密體為目的。
本發明者們為解決上述課題致力研究的結果發現,含有改質聚烯烴系樹脂、環氧化合物、以及咪唑系硬化觸媒的接著劑組成物,接著強度及水分遮斷性能優異,遂而完成本發明。
因此,根據本發明,提供下述(1)至(6)之接著劑組成物、(7)至(9)之封密板片、以及(10)、(11)之封密體。
(1)含有下述(A)成分、(B)成分以及(C)成分之接著劑組成物。
(A)成分:改質聚烯烴系樹脂
(B)成分:環氧化合物
(C)成分:咪唑系硬化觸媒
(2)前述(A)成分係酸改質聚烯烴系樹脂之(1)所記載之接
著劑組成物。
(3)前述(A)成分的含量,相對於接著劑組成物的固形分全量,係45至95質量%之(1)或(2)所記載之接著劑組成物。
(4)前述(B)成分的含量,相對於(A)成分100質量份,係5至110質量份之(1)所記載之接著劑組成物。
(5)前述(C)成分的含量,相對於(B)成分100質量份,係0.1至10質量份之(1)所記載之接著劑組成物。
(6)進一步地,含有下述(D)成分之(1)所記載之接著劑組成物。
(D)成分:矽烷偶合劑
(7)包含2片剝離膜,以及經挾持於該等剝離膜之接著劑層之封密板片,前述接著劑層係使用(1)所記載之接著劑組成物所形成之具有熱硬化性者。
(8)包含剝離膜、氣體阻障性膜、以及經挾持於前述剝離膜與氣體阻障性膜之接著劑層之封密板片,前述接著劑層係使用(1)所記載之接著劑組成物所形成之具有熱硬化性者。
(9)前述氣體阻障性膜係金屬箔、樹脂製膜、或薄膜玻璃之(8)所記載之封密板片。
(10)被封密物係以(7)所記載之封密板片封密而成之封密體。
(11)前述被封密物係有機EL元件、有機EL顯示器元件、液晶顯示器元件、或太陽電池元件之(10)所記載之封密體。
根據本發明,提供接著強度優異的接著劑組成
物、使用該接著劑組成物所形成之具有封密性能優異之接著劑層之封密板片、以及被封密物以前述封密板片封密而成之封密體。
以下,分項詳細地說明本發明之1)接著劑組成物、2)封密板片、以及3)封密體。
1)接著劑組成物
本發明之接著劑組成物,係含有下述(A)成分、(B)成分及(C)成分者。
(A)成分:改質聚烯烴系樹脂
(B)成分:環氧化合物
(C)成分:咪唑系硬化觸媒
(A)成分:改質聚烯烴系樹脂
本發明之接著劑組成物係含有改質聚烯烴系樹脂作為(A)成分。
本發明之接著劑組成物因含有改質聚烯烴系樹脂,成為接著強度優異者。再者,使用含有改質聚烯烴系樹脂之接著劑組成物,可有效率地形成後述厚度之接著劑層。
(A)成分:改質聚烯烴系樹脂
本發明之接著劑組成物係含有改質聚烯烴系樹脂作為(A)成分。
本發明之接著劑組成物因含有改質聚烯烴系樹脂,成為接
著強度優異者。再者,使用含有改質聚烯烴系樹脂之接著劑組成物,可有效率地形成後述厚度之接著劑層。
改質聚烯烴系樹脂,係於作為前驅體之聚烯烴樹脂中,使用改質劑施予改質處理所獲得之經導入官能基之聚烯烴樹脂。
聚烯烴樹脂,意指包含源自烯烴系單體的重複單元之聚合物。聚烯烴樹脂可為僅包含源自烯烴系的重複單元之聚合物,亦可為包含源自烯烴系單體的重複單元以及源自可與烯烴系單體共聚合之單體的重複單元之聚合物。
作為烯烴系單體,較佳為碳數2至8的α-烯烴,更佳為乙烯、丙烯、1-丁烯、異丁烯、或1-己烯,再佳為乙烯或丙烯。
作為可與烯烴系單體共聚合之單體,可列舉乙酸乙烯酯、(甲基)丙烯酸酯、苯乙烯等。
作為聚烯烴樹脂,可列舉超低密度聚乙烯(VLDPE)、低密度聚乙烯(LDPE)、中密度聚乙烯(MDPE)、高密度聚乙烯(HDPE)、直鏈狀低密度聚乙烯、聚丙烯(PP)、乙烯-丙烯共聚物、烯烴系彈性體(TPO)、乙烯-乙酸乙烯酯共聚物(EVA)、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯共聚物等。
聚烯烴樹脂的重量平均分子量(Mw)為10,000至2,000,000,較佳為20,000至1,500,000。
使用於聚烯烴樹脂的改質處理之改質劑,係於分子內具有官能基,亦即後文所述之可賦予交聯反應的基的化合
物。
作為官能基,可列舉羧基、羧酸酐基、羧酸酯基、羥基、環氧基、醯胺基、銨基、腈基、胺基、亞胺基、異氰酸基、乙醯基、硫醇基、醚基、硫醚基、碸基、膦酸基、硝基、胺甲酸酯基、鹵原子等。其等之中,較佳為羧基、羧酸酐基、羧酸酯基、羥基、銨基、胺基、亞胺基、異氰酸基,更佳為羧酸酐基、烷氧矽基,特佳為羧酸酐基。
具有官能基的化合物,分子內亦可具有2種以上的官能基。
作為改質聚烯烴系樹脂,可列舉酸改質聚烯烴系樹脂、矽烷改質聚烯烴系樹脂,由可獲得本發明之更優異效果的觀點而言,較佳為酸改質聚烯烴系樹脂。
酸改質聚烯烴系樹脂,意指對於聚烯烴系樹脂以酸經接枝改質者。例如,可列舉將聚烯烴樹脂與不飽和羧酸反應,經導入羧基(接枝改質)者。又,本說明書中,不飽和羧酸包含羧酸酐的概念,羧基包含羧酸酐基的概念。
作為與聚烯烴樹脂反應的不飽和羧酸,可列舉馬來酸、富馬酸、依康酸、檸康酸、戊烯二酸、四氫酞酸、烏頭酸、馬來酸酐、依康酸酐、戊烯二酸酐、檸康酸酐、烏頭酸酐、降冰片烯二羧酸酐、四氫酞酸酐等。
該等可1種單獨,或2種以上組合使用。其等之中,由容易獲得接著強度更為優異的接著劑組成物而言,較佳為馬來酸酐。
與聚烯烴樹脂反應的不飽和羧酸的量,相對於聚烯烴樹脂100質量份,較佳為0.1至5質量份,更佳為0.2至
3質量份,再佳為0.2至1.0質量份。依該等方式所獲得之含有酸改質聚烯烴樹脂之接著劑組成物係接著強度更為優異。
酸改質聚烯烴系樹脂,亦可使用市售品。作為市售品,例如,可列舉ADMER(註冊商標)(三井化學公司製造)、UNISTOLE(註冊商標)(三井化學公司製造)、BondyRam(Polyrame公司製造)、orevac(註冊商標)(ARKEMA公司製造)、MODIC(註冊商標)(三菱化學公司製造)等。
作為矽烷改質聚烯烴系樹脂的前驅體之聚烯烴樹脂,可列舉作前述之以酸使其接枝改質之聚烯烴樹脂所例示之聚烯烴樹脂。
矽烷改質聚烯烴系樹脂,意指對於聚烯烴樹脂以不飽和矽烷化合物經接枝改質者。矽烷改質聚烯烴系樹脂,係具有主鏈之聚烯烴樹脂於側鏈之不飽和矽烷化合物經接枝共聚合的構造。例如,可列舉矽烷改質聚乙烯樹脂及矽烷改質乙烯-乙酸乙烯酯共聚物,較佳為矽烷改質低密度聚乙烯、矽烷改質超低密度聚乙烯、矽烷改質直鏈狀低密度聚乙烯等矽烷改質聚乙烯樹脂。
作為與上述聚烯烴樹脂反應之不飽和矽烷化合物,較佳為乙烯基矽烷化合物,例如,可列舉乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三丙氧基矽烷、乙烯基三異丙氧基矽烷、乙烯基三丁氧基矽烷、乙烯基三戊氧基矽烷、乙烯基三苯氧基矽烷、乙烯基三苄氧基矽烷、乙烯基三亞甲二氧基矽烷、乙烯基三伸乙二氧基矽烷、乙烯基丙烯氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三羧基矽烷等。該等可1種單
獨或2種以上組合使用。
又,不飽和矽烷化合物與主鏈之聚烯烴樹脂接枝聚合的條件,採用公知的接枝聚合的常法即可。
作為與聚烯烴系樹脂反應的不飽和矽烷化合物的量,相對於聚烯烴系樹脂100質量份,較佳為0.1至10質量份,特佳為0.3至7質量份,再佳為0.5至5質量份。反應之不飽和矽烷化合物的量為上述的範圍,所得之含有矽烷改質聚烯烴系樹脂的接著劑組成物,接著強度更為優異。
矽烷改質聚烯烴系樹脂,亦可使用市售品。作為市售品,例如,可列舉LINKLON(註冊商標)(三菱化學公司製造)等。其中,較佳可使用低密度聚乙烯系的LINKLON、直鏈狀低密度聚乙烯系的LINKLON、超低密度聚乙烯系的LINKLON、以及乙烯-乙酸乙烯酯共聚物系的LINKLON。
改質聚烯烴系樹脂,可1種單獨或2種以上組合使用。
改質聚烯烴系樹脂的含量,相對於本發明接著劑組成物的固形分全量為,較佳為45至95質量%,更佳為50至90質量%。改質聚烯烴系樹脂的含量為該等範圍內的接著劑組成物,接著強度更為優異。
(B)成分:多官能環氧化合物
本發明之接著劑組成物,含有多官能環氧化合物作為成分(B)。
本發明之的接著劑組成物由於含有多官能環氧化合物,其硬化物成為水蒸氣遮斷性優異者。
多官能環氧化合物,意指分子內具有至少2以上的環氧基的化合物。
作為具有2個以上的環氧基的環氧化合物,可列舉雙酚A二環氧丙基醚、雙酚F二環氧丙基醚、雙酚S二環氧丙基醚、溴化雙酚A二環氧丙基醚、溴化雙酚F二環氧丙基醚、溴化雙酚S二環氧丙基醚、清漆型環氧樹脂(例如,酚‧清漆型環氧樹脂、甲酚‧清漆型環氧樹脂、溴化酚‧清漆型環氧樹脂)、氫化雙酚A二環氧丙基醚、氫化雙酚F二環氧丙基醚、氫化雙酚S二環氧丙基醚、新戊四醇多環氧丙基醚、1,6-己二醇二環氧丙基醚、六氫酞酸二環氧丙基醚、新戊二醇二環氧丙基醚、三羥甲基丙烷多環氧丙基醚、2.2-雙(3-環氧丙基-4-環氧丙基氧基苯基)丙烷、二羥甲基三環癸烷二環氧丙基醚等。
該等多官能環氧化合物,可1種單獨或2種以上組合使用。
本發明之接著劑組成物中的多官能環氧化合物的含量,相對於前述(A)成分100質量份,較佳為5至110質量份,更佳為10至100質量份。多官能環氧化合物的含量為該等範圍內的接著劑組成物的硬化物,水蒸氣遮斷性更為優異。
(C)成分:咪唑系硬化觸媒
本發明之接著劑組成物含有咪唑系硬化觸媒作為(C)成分。
本發明之接著劑組成物中,藉由併用改質聚烯烴系樹脂與咪唑系硬化觸媒,其硬化物即使於高溫時亦具有優異的接著性。
作為咪唑系硬化觸媒,可列舉2-甲基咪唑、2-苯
基咪唑、2-十一碳基咪唑、2-十七碳基咪唑、2-乙基-4-甲基咪唑、2-苯基-4-甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2-苯基-4,5-二羥基甲基咪唑等。
該等咪唑系硬化觸媒,可1種單獨或2種以上組合使用。
本發明之接著劑組成物中的硬化觸媒的含量,相對於前述(B)成分100質量份,較佳為0.1至10質量份,更佳為0.5至5質量份。咪唑系硬化觸媒的含量於該等範圍內時,接著劑組成物的硬化物即使於高溫時亦具有優異的接著性。
本發明之接著劑組成物,亦可含有矽烷偶合劑作為成分(D)。
本發明之接著劑組成物,藉由含有矽烷偶合劑,成為於常溫及高溫環境下之接著強度更為優異者。
作為矽烷偶合劑,較佳為分子內具有至少1個烷氧基矽基的有機矽化合物。
作為矽烷偶合劑,可列舉乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷等含有聚合性不飽和基的矽化合物;3-環氧丙氧基丙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、8-環氧丙氧基辛基三甲氧基矽烷等具有環氧構造的矽化合物;3-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷等含有胺基的矽化合物;3-氯丙基三甲氧基矽烷;3-異氰酸基丙基三乙氧基矽烷等。
該等矽烷偶合劑,可1種單獨或2種以上組合使用。
本發明之接著劑組成物含有矽烷偶合劑時,矽烷偶合劑的含量相對於前述(A)成分100質量份,較佳為0.01至5.0質量份,更佳為0.05至1.0質量份。
本發明之接著劑組成物,亦可含有溶媒。
作為溶媒,可列舉苯、甲苯等芳香族烴系溶媒;乙酸乙酯、乙酸丁酯等酯系溶媒;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶媒;正-戊烷、正-己烷、正-庚烷等脂肪族烴系溶媒;環戊烷、環己烷、甲基環己烷等脂環式烴系溶媒等。
該等溶媒,可1種單獨或2種以上組合使用。
溶媒的含量,可考慮塗布性等而適宜決定。
本發明之接著劑組成物,於不妨礙本發明的效果的範圍,亦可含有其他成分。
作為其他成分,可列舉紫外線吸收劑、抗靜電劑、光安定劑、抗氧化劑、樹脂安定劑、填充劑、顏料、增量劑、軟化劑等添加劑。
該等可1種單獨或2種以上組合使用。
本發明之接著劑組成物含有該等添加劑時,其含量可配合目的而適宜決定。
本發明之接著劑組成物,可將規定的成分,依據常法適宜混合、攪拌而調製。
本發明之接著劑組成物,係接著強度優異。因此,本發明之接著劑組成物,適合用於形成封密材時。
2)封密板片
本發明之封密板片,係下述之封密板片(α)或封密板片(β)。
封密板片(α):為包含2片剝離膜以及經挾持於該等剝離膜之接著劑層之封密板片,其特徵為前述接著劑層係使用本發明之接著劑組成物所形成之具有熱硬化性者。
封密板片(β):為包含剝離膜、氣體阻障性膜、及經挾持於前述剝離膜與氣體阻障性膜之接著劑層之封密板片,其特徵為前述接著劑層係使用本發明之接著劑組成物所形成之具有熱硬化性者。
又,該等封密板片係表示使用前的狀態者,使用本發明之封密板片時,通常剝離除去剝離膜。
構成封密板片(α)的剝離膜,係於封密板片(α)的製造步驟中作為支持體的功能,同時直到使用封密板片(α)之間作為接著劑的保護層板片的功能。
作為剝離膜,可利用以往公知者。例如,可列舉於剝離膜用的基材上,具有經由剝離劑之經剝離處理的剝離層者。
作為剝離膜用的基材,可列舉玻璃紙、塗層紙、道林紙等紙基材;於該等紙基材經層合聚乙烯等熱可塑性樹脂之層合紙;聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、聚萘二甲酸乙二酯樹脂、聚丙烯樹脂、聚乙烯樹脂等塑膠膜等。
作為剝離膜,可列舉矽氧系樹脂、烯烴系樹脂、異戊二烯系樹脂、丁二烯系樹脂等膠系彈性體,長鏈烷系樹脂、醇酸系樹脂、氟系樹脂等。
封密板片(α)中的2片剝離膜可相同,亦可不同,較佳為2片的剝離膜具有不同的剝離力者。藉由2片的剝離膜
的剝離力不同,封密板片的使用時難以產生問題。亦即,以2片的剝離膜的剝離力不同的方式,可更有效率地進行最初的將剝離膜剝離的步驟。
封密板片(α)的接著劑層的厚度,通常為1至50μm,較佳為5至25μm。
厚度為上述範圍內的接著劑層,適合使用作為封密材。
封密板片(α)的接著劑層係具有熱硬化性。因此,封密板片(α)的接著劑層,於硬化後,接著強度極為優異。
使接著劑層熱硬化時的條件並無特別限定。
加熱溫度通成為80至200℃,較佳為90至150℃。
加熱時間通常為30分鐘至12小時,較佳為1至6小時。
硬化處理後的接著劑層之23℃的剝離接著強度,通常為1至100N/25mm,較佳為10至50N/25mm,85℃的剝離接著強度,通常為1至100N/25mm,較佳為5至50N/25mm。
上述剝離接著強度,係根據實施例所記載的方法所測定者。
硬化處理後的接著劑層的水蒸氣穿透率,通常為0.1至200g‧m-2‧day-1,較佳為1至150g‧m-2‧day-1。
封密板片(α)的製造方法並無特別限定。例如,可使用鑄模法,製造封密板片(α)。
藉由鑄模法製造封密板片(α)時,使用公知的方法,將本發明之接著劑組成物塗布於剝離膜的剝離處理面,藉由乾燥所製得之塗膜,製造附有剝離膜之接著劑層,其次,藉由於接著劑層上再重疊1片剝離膜,可製得封密板片(α)。
作為塗布接著劑組成物的方法,例如,可列舉旋塗法、噴塗法、棒塗法、刀塗法、輥塗法、刮刀塗法、模塗法、凹版塗法等。
作為乾燥塗膜時的乾燥條件,例如可列舉於80至150℃,30秒至5分鐘。
構成封密板片(β)的剝離膜與接著劑層,各自可列舉與作為構成封密板片(α)的剝離膜與接著劑層所例示者為相同者。
構成封密板片(β)的氣體阻障性膜,只要為具有水分遮斷性的膜,則無特別限定。
氣體阻障性膜,較佳於溫度40℃,相對濕度90%(以下,簡稱為「90%RH」)的環境下的水蒸氣穿透率為0.1g/m2/day以下,更佳為0.05g/m2/day以下,再佳為0.005g/m2/day以下。
氣體阻障性膜之溫度40℃,90%RH的環境下之水蒸氣穿透率為0.1g/m2/day以下時,可有效果地抑制透明基板上所形成之有機EL元件等元件內部浸入氧或水份等,電極或有機層的劣化。
氣體阻障性膜的水蒸氣等的穿透率,可使用公知的氣體穿透率測定裝置而測定。
作為氣體阻障性膜,可列舉金屬箔、樹脂製膜、薄膜玻璃等。其等之中,較佳為樹脂製膜,更佳為具有基材與氣體阻障層之氣體阻障性膜。
作為構成基材之樹脂成分,可列舉聚醯亞胺、聚
醯胺、聚醯胺醯亞胺、聚苯醚、聚醚酮、聚醚醚酮、聚烯烴、聚酯、聚碳酸酯、聚碸、聚醚碸、聚苯硫醚、聚芳基酸酯、丙烯醯系樹脂、環烯烴系聚合物、芳香族系聚合物、聚胺酯系聚合物等。
基材的厚度,雖無特別限制,由操作容易的觀點,較佳為0.5至500μm,更佳為1至200μm,再佳為5至100μm。
氣體阻障層,只要可賦予所期望的氣體阻障性,材質等並無特別限定。作為氣體阻障層,可列舉無機膜,或於包含高分子化合物的層,施以修飾處理所獲得之層。其等之中,由於厚度薄,可更有效率地形成氣體阻障性優異之層,氣體阻障層較佳為包含無機膜之氣體阻障層,以及於包含高分子化合物之層注入離子所獲得之氣體阻障層。
作為無機膜,無特別限制,例如,可列舉無機蒸鍍膜。
作為無機蒸鍍膜,可列舉無機化合物及金屬之蒸鍍膜。
作為無機化合物之蒸鍍膜的原料,可列舉氧化矽、氧化鋁、氧化鎂、氧化鋅、氧化銦、氧化錫等無機氧化物;氮化矽、氮化鋁、氮化鈦等無機氮化物;無機碳化物;無機硫化物;氧化氮化矽等無機氧化氮化物;無機氧化碳化物;無機氮化碳化物;無機氧化氮化碳化物等。
作為金屬之蒸鍍膜的原料,可列舉鋁、鎂、鋅、及錫等。
於包含高分子化合物之層(以下,亦稱為「高分子層」)注入離子所獲得之氣體阻障層,作為所使用之高分子化合物,可列舉聚有機矽氧烷、聚矽氮烷系化合物等含矽之高分子化合
物,聚醯亞胺,聚醯胺,聚醯胺醯亞胺,聚苯醚,聚醚酮,聚醚醚酮,聚烯烴,聚酯,聚碳酸酯,聚碸,聚醚碸,聚苯硫醚,聚芳基酸酯,丙烯醯系樹脂,環烯烴系聚合物,芳香族系聚合物等。該等高分子化合物可1種單獨或2種以上組合使用。
其等之中,由可形成具有優異的氣體阻障性的氣體阻障層的觀點,較佳為含矽之高分子化合物,更佳為聚矽氮烷系化合物。
聚矽氮烷系化合物,係分子內具有包含-Si-N-鍵(矽氮烷)之重複單元的高分子化合物。具體而言,較佳為具有式(I)所示重複單元的化合物。
再者,所使用之聚矽氮烷系化合物的數平均分子量,雖無特限定,較佳為100至50,000。
前述式(I)中,n表示任意的自然數。
Rx、Ry、Rz各自獨立地表示氫原子、無取代或具有取代基的烷基、無取代或具有取代基的環烷基、無取代或具有取代基的烯基、無取代或具有取代基的芳基或烷基矽基等非水解性基。其等之中,作為Rx、Ry、Rz,較佳為氫原子、碳數1至6的烷基、或苯基,特佳為氫原子。作為具有前述式(I)所示重複單元之聚矽氮烷系化合物,可為Rx、Ry、Rz全為氫原子的無機聚矽氮烷,亦可為Rx、Ry、Rz之至少1者不為氫原子的
有機聚矽氮烷之任一者。
聚矽氮烷系化合物1種單獨或2種以上組合使用。本發明中,作為聚矽氮烷系化合物,亦可使用聚矽氮烷改質物。再者,本發明中,作為聚矽氮烷系化合物,亦可直接使用作為玻璃被覆材等之市售之市售品。
前述高分子層,除了上述的高分子化合物以外,於不阻害本發明目的之範圍亦可包含其他成分。作為其他成分,可列舉硬化劑、其他的高分子、抗老化劑、光安定劑、難燃劑等。
高分子層中的高分子化合物的含量,由於可獲得具有更優異的氣體阻障性的氣體阻障層,較佳為50質量%以上,更佳為70質量%以上。
高分子層的厚度並無特別限制,較佳為50至300nm,更佳為50至200nm。
本發明中,即使高分子層的厚度為奈米層級,可獲得具有充分的氣體阻障性的封密板片。
作為形成高分子層的方法,例如,可列舉將含有高分子化合物之至少一種、所期望的其他成分、以及溶劑等之層形成用溶液,使用旋塗器、刀塗器、凹版塗器等公知的裝置,塗布,將獲得之塗膜適度地乾燥而形成的方法。
作為高分子層的修飾處理,可列舉離子注入處理、電漿處理、紫外線照射處理、熱處理等。
離子注入處理,係如後述方式,於高分子層注入離子,而修飾高分子層的方法。
電漿處理,係將高分子層曬於電漿中,而修飾高分子層的方法。例如,可根據日本專利特開2012-106421號公報所記載的方法,進行電漿處理。
紫外線照射處理,係於高分子層照射紫外線而修飾高分子層的方法。例如,可根據日本專利特開2013-226757號公報所記載之方法,進行紫外線修飾處理。
其等之中,由於不侵襲高分子層的表面,至其內部更有效率地修飾,可形成氣體阻障性更優異的氣體阻障層,較佳為離子注入處理。
作為注入於高分子層之離子,可列舉氬、氦、氖、氪、氙等烯有氣體的離子;氟碳、氫、氮、氧、二氧化碳、氯、氟、硫等的離子;甲烷、乙烷等烷系氣體類的離子;乙烯、丙烯等烯系氣體類的離子;戊二烯、丁二烯等烷二烯系氣體類的離子;乙炔等炔系氣體類的離子;苯、甲苯等芳香族烴系氣體類的離子;環丙烷等環烷系氣體類的離子;環戊烯等環烯系氣體類的離子;金屬的離子;有機矽化合物的離子等。
該等離子可1種單獨或2種以上組合使用。
其等之中,由於可獲得可更簡便地注入離子,具有特別優異的氣體阻障性的氣體阻障層,較佳為氬、氦、氖、氪、氙等烯有氣體的離子。
作為注入離子的方法,並無特別限定。例如,可列舉照射藉由電場使其加速的離子(離子束)的方法、注入電漿中的離子(電漿生成氣體的離子)的方法等,由於可簡便地獲得
氣體阻障層,較佳為後者之注入電漿離子的方法。電漿離子注入法,例如,可於包含電漿生成氣體的氛圍下產生電漿,藉由於離子注入層施加負的高電壓脈衝,進行將該電漿中的離子(陽離子),注入於離子注入層的表面部分。
封密板片(β)的製造方法並無特別限定。例如,於先前說明之封密板片(α)的製造方法中,將剝離膜的1片置換為氣體阻障性膜而可製造封密板片(β)。
再者,藉由封密板片(α)的製造後,剝離其1片剝離膜,使露出的接著劑層與氣體阻障性膜貼附,而可製造封密板片(β)。此時,封密板片(α)為具有不同剝離力的2片剝離膜時,由操作性的觀點,較佳為將剝離力小的剝離膜剝離。
3)封密體
本發明之封密體,係將被封密物,以本發明之封密板片封密所成者。
作為本發明之封密體,例如,可為具備透明基板、經形成於該透明基板上的元件(被封密物)、以及用於封密該元件的封密材者,前述封密材可列舉本發明之封密板片的接著劑層者。
透明基板,並無特別限定者,可使用各種基板材料。特別較佳使用可見光的穿透率高的基板材料。再者,較佳為阻止由元件外部浸入之水分及氣體的遮斷性能高,耐溶劑性及耐候性優異的材料。具體而言,可列舉石英或玻璃等透明無機材料;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚碳酸酯、聚苯乙烯、聚乙烯、聚丙烯、聚苯硫醚、聚偏氟化乙烯、乙醯基纖維素、溴化苯氧基、聚芳醯胺類、聚醯亞胺類、聚苯乙烯
類、聚芳基酸酯類、聚碸類、聚烯烴類等透明塑膠。
透明基板的厚度並無特別限制,可考慮光的穿透率或遮斷元件內外的性能,而適宜選擇。
作為被封密物,可列舉有機EL元件、有機EL顯示器元件、液晶顯示器元件、太陽電池元件等。
本發明之被封密物的製造方法並無特別限定。例如,將本發明之接著劑組成物重疊於被封密物上後,藉由加熱,使封密板片的接著劑層與被封密物接著。
其次,藉由使該接著劑層硬化,可製造本發明之被封密體。
使封密板片的接著劑層與被封密物接著時的接著條件並無特別限定。接著溫度,例如為23至100℃,較佳為40至80℃。該接著處理,亦可於加壓下進行。
作為使接著劑層硬化時的硬化條件,可利用前文說明之條件。
本發明之封密體,係將被封密物以本發明之封密板片封密而成者。
因此,本發明之封密體中,歷經長時期仍維持被封密物的性能。
以下,列舉實施例更詳細地說明本發明。惟,本發明不限定以下的實施例。
各例中的份及%,除非特別說明,否則皆以質量基準。
[實施例1]
改質聚烯烴系樹脂(α-烯烴聚合物,三井化學公司製造,商
品名:UNISTOLE H-200,重量平均分子量:52,000)100份、多官能環氧化合物(氫化雙酚A二環氧丙基醚,共榮化學公司製造,商品名:EPOLIGHT 400)25份、以及咪唑系硬化觸媒(四國化成公司製造,商品名:CUREZOL 2E4MZ)1份,溶解於甲基乙基酮,調製固形分濃度18%的塗布液。
將該塗布液塗布於剝離膜(LINTEC公司製造,商品名:SP-PET382150)的剝離處理面上,所獲得塗膜於100℃乾燥2分鐘,形成厚度為25μm的接著劑層,於其上,再貼合1片的剝離膜(LINTEC公司製造,商品名:SP-PET381031)的剝離處理面而製得封密板片1。
[實施例2]
實施例1中,除了使用二羥甲基三環癸烷二環氧丙基醚(ADEKA公司製造,商品名:ADEKA RESIN EP-4088L)作為多官能環氧化合物外,與實施例1同樣方式製得封密板片2。
[實施例3]
實施例1中,除了使用BATG[2,2-雙(3-環氧丙基-4-環氧丙基氧基苯基)丙烷](昭和電工公司製造,商品名:SHOFREE)作為多官能環氧化合物外,與實施例1同樣方式製得封密板片3。
[實施例4]
實施例1中,除了使用氫化雙酚A二環氧丙基醚(三菱化學公司製造,商品名:YX8000)作為多官能環氧化合物外,與實施例1同樣方式製得封密板片4。
[實施例5]
實施例1中,除了使用氫化雙酚A二環氧丙基醚(三菱化學公司製造,商品名:YX8034)作為多官能環氧化合物外,與實施例1同樣方式製得封密板片5。
[實施例6]
實施例4中,除了進一步含有矽烷偶合劑(3-環氧丙氧基丙基三甲氧基矽烷,0.1份,信越化學公司製造,商品名:KBM-403)外,與實施例4同樣方式製得封密板片6。
[實施例7]
實施例4中,除了進一步含有矽烷偶合劑(8-環氧丙氧基辛基三甲氧基矽烷,0.1份,信越化學公司製造,商品名:KBM-4803)外,與實施例4同樣方式製得封密板片7。
[實施例8]
實施例5中,除了進一步含有矽烷偶合劑(3-環氧丙氧基丙基三甲氧基矽烷,0.1份,信越化學公司製造,商品名:KBM-403)外,與實施例5同樣方式製得封密板片8。
[實施例9]
實施例5中,除了進一步含有矽烷偶合劑(8-環氧丙氧基辛基三甲氧基矽烷,0.1份,信越化學公司製造,商品名:KBM-4803)外,與實施例5同樣方式製得封密板片9。
[實施例10]
實施例1中,除了進一步含有矽烷偶合劑(8-環氧丙氧基辛基三甲氧基矽烷,0.1份,信越化學公司製造,商品名:KBM-4803)外,與實施例1同樣方式製得封密板片10。
[比較例1]
實施例1中,除了不使用多官能環氧化合物與咪唑系硬化觸媒的點之外,與實施例1同樣方式製得封密板片11。
[比較例2]
實施例1中,除了不使用咪唑系硬化觸媒的點之外,與實施例1同樣方式製得封密板片12。
[比較例3]
實施例1中,除了將改質聚烯烴系樹脂變更為丙烯醯系聚合物(LINTEC公司製造,商品名:OPTERIA MO-T015)的點之外,與實施例1同樣方式製得封密板片13。
實施例1至10、比較例1至3所製得之封密板片1~13,進行以下的試驗。
[剝離接著強度的測定]
剝離1片經裁斷為25mm×300mm大小的封密板片的剝離膜,露出的接著劑層重疊於聚對苯二甲酸乙二酯板片(東洋紡公司製造,商品名:COSMOSHINE PET50A4300,厚度50μm),使用熱層合機於40℃使該等接著。其次,剝離另1片的剝離膜,露出的接著劑層重疊於玻璃板,使用熱層合機於40℃使該等壓著。其次,將該者於100℃加熱2小時始接著劑層硬化後,靜置24小時。
將其作為試驗片,根據JIS Z0237:2009,溫度23℃、相對濕度50%的環境下與溫度85℃(不調控濕度)的環境下,以剝離角度180°的條件進行剝離試驗,測定剝離接著強度(N/25mm)。
測定結果示於第1表、第2表。
[有機EL元件的評估試驗]
使用經成膜之作為陽極之氧化銦錫(ITO)膜(厚度:100nm,板片電阻:50Ω/□)的玻璃基板,藉由以下的方法製作有機EL元件。
前述玻璃基板的ITO膜上,以0.1至0.2nm/分鐘的速度蒸鍍N,N’-雙(萘-1-基)-N,N’-雙(苯基)-聯苯胺)(Luminescence Technology公司製造),形成厚度為50nm的電洞輸送層,其次,於電洞輸送層上,以0.1至0.2nm/分鐘的速度蒸鍍叁(8-羥基-喹啉基)鋁(Luminescence Technology公司製造),形成厚度為50nm的發光層。於前述發光層上,以0.1nm/分鐘的速度蒸鍍氟化鋰(LiF)(高純度化學研究所公司製造),形成厚度為4nm的電子注入層,其次,於電子注入層上,以0.1nm/分鐘的速度蒸鍍鋁(Al)(高純度化學研究所公司製造),形成厚度為100nm的陰極,製得有機EL元件。又,蒸鍍時的真空度全為1×10-4Pa以下。
實施例及比較例所製得之封密板片1至13各自剝離1片的剝離膜,露出的接著劑層重疊於金屬箔膜上,使用熱層合機於40℃接著。其次,剝離另1片剝離膜,露出的接著劑層以覆蓋有機EL元件的方式重疊於玻璃基板上,使用熱層合機於40℃接著。其次,於100℃加熱2小時使接著劑層硬化,製得有機EL元件經封密之底部發光型的電子裝置。
該電子裝置,於60℃、相對濕度90%的環境下放置250小時後,驅動有機EL元件,觀察暗點(不發光位置)的有無,根據以下的基準評估接著劑層的封密性能。
○:暗點未達發光面積的50%
×:暗點為發光面積的50%以上
評估結果示於第1表、第2表。
由第1表、第2表可知以下事項。
實施例1至10的封密板片1至10的接著劑層,常溫時及高溫時的接著強度優異,有機EL元件的封密性亦優異。
另一方面,比較例1至3的封密板片11至13的接著劑,常溫時及高溫時的接著強度差,有機EL元件的封密性差。
Claims (11)
- 一種接著劑組成物,其係含有下述(A)成分、(B)成分以及(C)成分:(A)成分:改質聚烯烴系樹脂(B)成分:環氧化合物(C)成分:咪唑系硬化劑。
- 如申請專利範圍第1項之接著劑組成物,其中,前述(A)成分係酸改質聚烯烴系樹脂。
- 如申請專利範圍第1項之接著劑組成物,其中,前述(A)成分的含量,相對於接著劑組成物的固形分全量,係45至95質量%。
- 如申請專利範圍第1項之接著劑組成物,其中,前述(B)成分的含量,相對於(A)成分100質量份,係5至110質量份。
- 如申請專利範圍第1項之接著劑組成物,其中,前述(C)成分的含量,相對於(B)成分100質量份,係0.1至10質量份。
- 如申請專利範圍第1項之接著劑組成物,其中,進一步地,含有下述(D)成分:(D)成分:矽烷偶合劑。
- 一種封密板片,其係包含2片剝離膜以及經挾持於該等剝離膜之接著劑層之封密板片,前述接著劑層係使用申請專利範圍第1項之接著劑組成物所形成之具有熱硬化性者。
- 一種封密板片,其係包含剝離膜、氣體阻障性膜、及經挾持於前述剝離膜與氣體阻障性膜之接著劑層之封密板片,前述接著劑層係使用申請專利範圍第1項之接著劑組成物 所形成之具有熱硬化性者。
- 如申請專利範圍第8項之封密板片,其中,前述氣體阻障性膜係金屬箔、樹脂製膜、或薄膜玻璃。
- 一種封密體,其係被封密物係以申請專利範圍第7項之封密板片封密而成。
- 如申請專利範圍第10項之封密體,其中,前述被封密物係有機EL元件、有機EL顯示器元件、液晶顯示器元件、或太陽電池元件。
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JP7334693B2 (ja) * | 2020-08-07 | 2023-08-29 | 株式会社豊田自動織機 | 蓄電装置 |
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JP2007197517A (ja) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機el素子 |
JP4798803B2 (ja) * | 2008-01-22 | 2011-10-19 | 日東電工株式会社 | 電子部品固定用反応性接着剤組成物及びその接着シート |
WO2011062167A1 (ja) | 2009-11-18 | 2011-05-26 | 味の素株式会社 | 樹脂組成物 |
JP5533585B2 (ja) | 2010-11-18 | 2014-06-25 | コニカミノルタ株式会社 | ガスバリアフィルムの製造方法、ガスバリアフィルム及び電子機器 |
WO2013147156A1 (ja) * | 2012-03-30 | 2013-10-03 | 古河電気工業株式会社 | 有機エレクトロルミネッセンス素子封止用樹脂組成物、その製造方法、該樹脂組成物を用いた接着フィルム、ガスバリアフィルム、有機エレクトロルミネッセンス素子および有機エレクトロルミネッセンスパネル |
JP5895687B2 (ja) | 2012-04-26 | 2016-03-30 | コニカミノルタ株式会社 | ガスバリア性フィルム |
EP2940092B1 (en) * | 2012-12-28 | 2020-04-08 | Dai Nippon Printing Co., Ltd. | Adhesive composition and bonding sheet using same |
JP6040901B2 (ja) * | 2013-09-20 | 2016-12-07 | Dic株式会社 | ラミネート積層体用接着剤組成物、これを使用した積層体、および二次電池 |
JP5954283B2 (ja) * | 2013-09-20 | 2016-07-20 | Dic株式会社 | ラミネート積層体用接着剤組成物、これを使用した積層体、および二次電池 |
JP2015137333A (ja) | 2014-01-23 | 2015-07-30 | 三井化学株式会社 | シート状封止材、及びこれを含む封止用シート |
US20170088753A1 (en) | 2014-09-17 | 2017-03-30 | Dic Corporation | Laminating adhesive, laminate using the same, and secondary battery |
JP6718148B2 (ja) * | 2014-09-24 | 2020-07-08 | 東亞合成株式会社 | 接着剤組成物及びこれを用いた接着剤層付き積層体 |
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TWI751989B (zh) | 2022-01-11 |
CN108291125A (zh) | 2018-07-17 |
KR20180087294A (ko) | 2018-08-01 |
KR102522744B1 (ko) | 2023-04-17 |
EP3385349A4 (en) | 2019-07-31 |
EP3385349A1 (en) | 2018-10-10 |
US11162003B2 (en) | 2021-11-02 |
CN108291125B (zh) | 2021-07-13 |
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