TW201729222A - Over-voltage protecting structure and method of manufacturing the same - Google Patents

Abstract

The instant disclosure provides an over-voltage protecting structure and method of manufacturing the same. The over-voltage protecting structure including an over-voltage protecting unit, a phosphate protecting layer, and a terminal electrode unit. The over-voltage protecting unit includes an insulation package, a plurality of first outer conductive layer, and a plurality of second outer conductive layer. The first outer conductive layer includes a first exposed terminal which is exposed from a first side of the over-voltage protecting unit. The second outer conductive layer includes a second exposed terminal which is exposed from a second side of the over-voltage protecting unit. The phosphate protecting layer covered the entire over-voltage protecting unit, but exposed the first exposed terminal and the second exposed terminal. The terminal electrode unit includes a first electrode unit and a second electrode unit. The first electrode unit and the second electrode unit electrically connected to the first exposed terminal and the second exposed terminal, respectively.

Description

Overvoltage protection package structure and manufacturing method thereof

The invention relates to an over-voltage protection package structure and a manufacturing method thereof, in particular to an over-voltage protection package structure in which a phosphate-based protective layer is first disposed on the surface of the over-voltage protection unit to form an end electrode unit on the over-voltage protection unit. And its production method.

First, referring to FIG. 1 to FIG. 4, the conventional method for fabricating the overvoltage protection package structure Q is generally provided with a first electrode layer C1 at both ends of the transformer unit body V (as shown in FIG. 2). Then, a protective layer P (shown in FIG. 3) is disposed between the first electrode layers C1 at both ends to prevent the deformer body V from being corroded by the plating solution in the subsequent electroplating process. Finally, a second electrode layer C2 of a first electrode layer C1 is formed (as shown in FIG. 4).

However, the formation of the first electrode layer C1 of the conventional overvoltage protection package structure Q must be formed by printing, dip coating, roll coating, spray coating or sintering. Subsequently, by forming a protective layer P to protect the transformer body V in the subsequent step of plating a second electrode layer C2, the plating solution is prevented from corroding the transformer body V. Therefore, the overall manufacturing process of the overvoltage protection package structure Q provided by the conventional method is complicated, and the process efficiency is not good.

Therefore, how to provide an overvoltage protection package structure and an overvoltage protection package structure to overcome the above-mentioned shortcomings has become one of the important issues to be solved by the business.

The technical problem to be solved by the present invention is to provide an overvoltage protection package structure and a method for fabricating an overvoltage protection package structure for the deficiencies of the prior art, so as to improve the process efficiency of the overvoltage protection package structure.

In order to solve the above technical problem, one embodiment of the present invention provides an overvoltage protection package structure including an overvoltage protection unit, a phosphate protection layer, and an end electrode unit. The overvoltage protection unit has an insulation package, a plurality of first outer conductive layers, and a plurality of second outer conductive layers, wherein each of the first outer conductive layers has a slave outer package a first exposed side end exposed by the first side end, each of the second outer conductive layers having a second exposed side end exposed from a second side end of the insulating package. The phosphate-based protective layer covers the entire over-voltage protection unit, and only exposes the first exposed side end of each of the first outer conductive layers and each of the second outer conductive layers The second exposed side end. The terminal electrode unit includes a first electrode unit covering a first side end of the overvoltage protection unit and a second electrode unit covering a second side end of the overvoltage protection unit. The first electrode unit and the second electrode unit electrically contact the first exposed side end of the first outer conductive layer and the second exposed side of the second outer conductive layer, respectively end.

A method for fabricating an overvoltage protection package structure according to another embodiment of the present invention includes providing an overvoltage protection unit, wherein the overvoltage protection unit has an insulation package, a plurality of first outer conductive layers, and a plurality of second outer conductive layers, each of the first outer conductive layers having a first exposed side end exposed from a first side end of the insulating package, each of the second joints The outer conductive layer has a second exposed side end exposed from a second side end of the insulating package; a phosphate-based protective layer is formed to cover the entire over-voltage protection unit, and only bare The first exposed side end of each of the first outer conductive layers and the second exposed side end of each of the second outer conductive layers; and an end electrode unit formed, wherein the terminal electrode unit Including a covering of the overvoltage protection unit a first electrode unit of the first side end portion and a second electrode unit covering a second side end portion of the overvoltage protection unit, wherein the first electrode unit and the second electrode unit are respectively electrically Contacting the first exposed side end of the first outer conductive layer and the second exposed side end of the second outer conductive layer.

The beneficial effects of the present invention may be that the overvoltage protection package structure and the overvoltage protection package structure provided by the embodiments of the present invention may cover the entire overvoltage protection unit by a phosphate protective layer. Designing only the first exposed side end of each of the first outer conductive layers and the second exposed side end of each of the second outer conductive layers are exposed to avoid plating electrodes The unit is corroded by the plating solution in the step of the overvoltage protection unit, and at the same time, the overall process efficiency of the overvoltage protection package structure is improved.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

Z, Z', Q‧‧‧Overvoltage protection package structure

1‧‧‧Overvoltage protection unit

11‧‧‧Insulation package

111‧‧‧ first side

112‧‧‧ second side

113‧‧‧ top surface

114‧‧‧Bottom surface

12‧‧‧First external conductive layer

121‧‧‧First exposed side

122‧‧‧First buried side

13‧‧‧Second external conductive layer

131‧‧‧Second exposed side

132‧‧‧Second buried side

14‧‧‧First side end

15‧‧‧Second side end

2‧‧‧phosphate protective layer

3,3’‧‧‧ terminal electrode unit

31,31'‧‧‧First electrode unit

311,311'‧‧‧First conductive layer

312,312'‧‧‧Second conductive layer

313‧‧‧ Third conductive layer

32,32'‧‧‧Second electrode unit

321,321'‧‧‧First Conductive Layer

322,322'‧‧‧Second conductive layer

323‧‧‧ Third conductive layer

S1, S2‧‧‧ roughened surface

V‧‧‧Changer body

P‧‧‧ protective layer

C1‧‧‧first electrode layer

C2‧‧‧Second electrode layer

Figure 1 is a schematic illustration of the first step of the prior art.

2 is a schematic diagram of a second step of the prior art.

Figure 3 is a schematic illustration of the third step of the prior art.

4 is a schematic diagram of a fourth step of the prior art.

FIG. 5 is a schematic flow chart of a method for fabricating an overvoltage protection package structure according to first embodiment and second embodiment of the present invention.

Figure 6 is a cross-sectional view showing the step S102 of the first embodiment of the present invention.

Figure 7 is a cross-sectional view showing the step S104 of the first embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view showing a step S106 of the first embodiment of the present invention.

Figure 9 is a cross-sectional view showing another step S106 of the first embodiment of the present invention.

Figure 10 is a cross-sectional view showing still another step S106 of the first embodiment of the present invention.

Figure 11 is a cross-sectional view showing the overvoltage protection package structure of the first embodiment of the present invention.

Figure 12 is a cross-sectional view showing the step S106 of the second embodiment of the present invention.

The following is a specific example to illustrate the implementation of the "overvoltage protection package structure and its manufacturing method" disclosed by the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in the specification. The present invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

[First Embodiment]

Referring to FIG. 5 to FIG. 9 , FIG. 5 is a schematic flow chart of a method for fabricating an overvoltage protection package structure Z according to an embodiment of the present invention. A method for fabricating an overvoltage protection package structure Z according to a first embodiment of the present invention includes at least the following steps: First, as shown in FIG. 5 and FIG. 6, and referring to step S102, an overvoltage protection unit 1 is provided, wherein the overvoltage protection unit 1 has an insulating package 11, a plurality of first outer conductive layers 12, and a plurality of And a second outer conductive layer 13 , each of the first outer conductive layers 12 having a first exposed side end 121 exposed from a first side end 111 of the insulating package 11 . Each of the second outer conductive layers 13 has a second exposed side end 131 exposed from a second side end 112 of the insulating package 11.

For example, as shown in FIG. 6 , the insulating package 11 can have a first side end 111 , a second side end 112 opposite to the first side end 111 , a top end surface 113 , and a top end surface 113 . The bottom end surface 114. The insulating package 11 may be composed of a zinc oxide-based metal oxide or aluminum oxide, wherein the insulating package 11 may be added with other metal oxides as an additive by a conventional ceramic sintering molding process. Formed by conventional high temperature sintering technology of ceramic materials.

Then, the plurality of first outer conductive layers 12 and the plurality of second outer conductive layers 13 may be The first outer conductive layer 12 has a first exposed side end 121 exposed from the first side end 111 of the insulating package 11 and a first buried in the insulating package 11 . A buried side end 122 is buried. The second outer conductive layer 13 has a second exposed side end 131 exposed from the second side end 112 of the insulating package 11 and a second buried side end 132 buried in the insulating package 11. In addition, for example, the first outer conductive layer 12 and the second outer conductive layer 13 may both be a silver layer (Ag) or may be an alloy layer containing silver (Ag) and palladium (Pd), but the invention Not limited to this. That is, in other embodiments, the first outer conductive layer 12 and the second outer conductive layer 13 may also be copper (Cu), gold (Au), or platinum (Pt), etc. Contains the right amount of vitreous.

In view of the above, please refer to FIG. 5 and FIG. 7 simultaneously, and referring to step S104, a phosphate-based protective layer 2 is formed to cover the entire over-voltage protection unit 1, since the iron phosphate and the zinc phosphate do not The silver or palladium metal reacts, so that only the first exposed side end 121 of each of the first outer conductive layers 12 and the second exposed side end 131 of each of the second outer conductive layers 13 are naturally exposed. In other words, the phosphate-based protective layer 2 may cover the top end surface 113, the bottom end surface 114, the first side end 111, and the second side end 112 of the overvoltage protection unit 1, and only the first exposed outer conductive layer 12 is exposed. An exposed side end 121 and a second exposed side end 131 of the second outer conductive layer 13 such that the first exposed side end 121 and the second exposed side end 131 can respectively be combined with the first electrode unit 31 formed in the subsequent step The second electrode unit 32 is electrically connected. In addition, for example, the phosphate-based protective layer 2 may be a zinc phosphate protective layer or a phosphate iron protective layer, but the invention is not limited thereto. It is worth noting that the phosphate-based protective layer 2 can be formed on the overvoltage protection unit 1 by dipping to coat the overvoltage protection unit 1.

Further, taking the phosphate-zinc protective layer as an example, the protective layer may be formed by replacing the zinc ions in the zinc phosphate with the addition of the transition element ions (for example, iron ions), and then by about 600 to 900. The heat treatment at °C is to enhance the crystallinity, so that in the subsequent step of forming the terminal electrode unit 3 on the overvoltage protection unit 1, the protective insulating package 11 is not corroded by the plating solution.

It should be noted that, in the embodiment of the present invention, the phosphate-based protective layer 2 is formed on the over-voltage protection unit 1 by first maintaining the phosphate-based solution at a high temperature to form a super-saturated solution, so that the phosphoric acid The salt precipitate may be precipitated, and then the phosphate precipitate is deposited on the overvoltage protection unit 1. Then, the crystallizing property of the phosphate-based protective layer 2 is strengthened by a heat treatment step.

In the above, please refer to FIG. 5 and FIG. 8 to FIG. 10 simultaneously, and refer to step S106 to form an end electrode unit 3, wherein the end electrode unit 3 may include a first part for covering the overvoltage protection unit 1. The first electrode unit 31 of one end portion 14 and a second electrode unit 32 for covering a second side end portion 15 of the overvoltage protection unit 1. It is to be noted that, since the phosphate-based protective layer 2 does not cover the first exposed side end 121 of the first outer conductive layer 12 and the second exposed side end 131 of the second outer conductive layer 13 in the foregoing step S104, Therefore, when the first electrode unit 31 and the second electrode unit 32 are respectively coated and disposed on the first side end portion 14 and the second side end portion 15 of the overvoltage protection unit 1, the first electrode unit 31 and the second portion The electrode unit 32 can electrically contact the first exposed side end 121 of the first outer conductive layer 12 and the second exposed side end 131 of the second outer conductive layer 13, respectively.

Further, in the step of forming the terminal electrode unit 3, the first electrode unit 31 and the second electrode unit 32 may be respectively disposed on the first of the overvoltage protection unit 1 by electroplating. The side end portion 14 and the second side end portion 15 are on the side. For example, the first electrode unit 31 may include a first conductive layer 311 covering the first side end portion 14 of the voltage protection unit 1 , a second conductive layer 312 completely covering the first conductive layer 311 , and A third conductive layer 313 completely encasing the second conductive layer 312. In addition, the second electrode unit 32 may also include a first conductive layer 321 covering the second side end portion 15 of the voltage protection unit 1 , a second conductive layer 322 completely covering the first conductive layer 321 , and a The third conductive layer 323 of the second conductive layer 322 is completely covered.

Preferably, in the first embodiment of the present invention, the first conductive layer (311, 321) may be a silver layer (Ag), the second conductive layer (312, 322) may be a nickel layer (Ni), and the third conductive layer (313) , 323) may be a tin layer (Sn), but the invention is not limited thereto. Specifically, as shown in FIG. 8 , a silver layer may be formed on the first side end portion 14 and the second side end portion 15 of the overvoltage protection unit 1 by electroplating, in order to increase the silver layer and the tin layer. The bonding force between them can be as shown in FIG. 9, after forming a nickel layer covering the silver layer, and as shown in FIG. 10, a tin layer covering the nickel layer is formed.

Then, after the terminal electrode unit 3 is formed on the first side end portion 14 and the second side end portion 15 of the overvoltage protection unit 1, a top surface 113 and a bottom end surface 114 of the overvoltage protection unit 1 may be removed and disposed. The step of exposing the phosphate-based protective layer 2 outside the first electrode unit 31 and the second electrode unit 32. The surface of the top end surface 113 and the surface of the bottom end surface 114 of the overvoltage protection unit 1 are reproduced. For example, the phosphate-based protective layer 2 disposed at the aforementioned position can be removed by an organic acid or a mineral acid. Thereby, the overvoltage protection package structure Z completed through the above steps has a partial top end surface 113, a partial bottom end surface 114, a first side end 111, and a second side end 112 of the overvoltage protection unit 1 The phosphate-based protective layer 2 is covered. In other words, after the step of removing the portion of the phosphate-based protective layer 2, the overvoltage protection package structure Z, the phosphate-based protective layer 2 will cover the entire overvoltage protection unit 1, and only expose each of the first joints. a first exposed side end 121 of the outer conductive layer 12, a second exposed side end 131 of each of the second outer conductive layers 13, a top end surface 113 between the first electrode unit 31 and the second electrode unit 32, and a first surface A bottom end surface 114 between the electrode unit 31 and the second electrode unit 32. It is to be noted that after the step of removing a part of the phosphate-based protective layer 2, an organic coating film (not shown) may be further formed to protect the overvoltage protection unit 1. In addition, for example, the organic coating film may be a ylide acid polymer, a polyester polymer, an epoxy resin polymer or other organic polymer which can serve as a protective layer, and other insoluble powders and an appropriate amount of additives. composition.

In addition, it is worth mentioning that in other embodiments, after the terminal electrode unit 3 is formed on the first side end portion 14 and the second side end portion 15 of the overvoltage protection unit 1, a part of the phosphate may not be removed. Protective layer 2, but directly exposed to the first electrode An organic coating film is formed on the phosphate-based protective layer 2 outside the unit 31 and the second electrode unit 32 to protect the overvoltage protection unit 1.

It should be noted that, in the first embodiment of the present invention, it may be stopped after the step S106 is performed, or may be stopped after the step of removing a part of the phosphate-based protective layer 2, or an organic coating film is formed. The steps are stopped after the steps, and the invention is not limited thereto.

[Second embodiment]

First, referring to FIG. 10 and FIG. 12, the comparison between FIG. 10 and FIG. 12 can be made. The greatest difference between the second embodiment and the first embodiment is that the overvoltage protection package structure Z' provided by the second embodiment is Step S106: forming an end electrode unit 3', wherein the end electrode unit 3' may include a first electrode unit 31' for covering a first side end portion 14 of the overvoltage protection unit 1, and a cover for coating In the step of the second electrode unit 32' of the second side end portion 15 of the overvoltage protection unit 1, the first electrode unit 31' and the second electrode unit 32' may be respectively disposed on the overvoltage protection unit by electroplating. The first side end portion 14 and the second side end portion 15 of the first side portion 14.

Specifically, in the second embodiment of the present invention, the first electrode unit 31' may include a first conductive layer 311' covering the first side end portion 14 of the overvoltage protection unit 1, and a completely covered A second conductive layer 312' of a conductive layer 311'. In addition, the second electrode unit 32 ′ may also include a first conductive layer 321 ′ covering the first side end portion 14 of the voltage protection unit 1 and a second conductive layer 322 completely covering the first conductive layer 321 ′. '. In other words, a first conductive layer (311', 321') may be respectively disposed on the first side end portion 14 and the second side end portion 15 of the overvoltage protection unit 1 by electroplating, and then form a first Two conductive layers (312', 322'). It should be noted that, in the second embodiment, in order to increase the bonding force between the first conductive layer (311', 321') and the second conductive layer (312', 322'), the first conductive layer (311) ', 321') is a silver layer whose surface is roughened by pickling treatment, and the second conductive layer (312', 322') is a tin layer. Thereby, the first conductive layers (311, 321) disposed on the first side end portion 14 and the second side end portion 15 may have a roughened surface (S1, S2), respectively.

It should be noted that the overvoltage protection package structure Z' provided by the second embodiment Other structures are similar to the overvoltage protection package structure Z provided by the foregoing first embodiment, and are not described herein again.

[Effective effect of the embodiment]

In summary, the beneficial effects of the present invention may be that the overvoltage protection package structure (Z, Z') and the overvoltage protection package structure (Z, Z') provided by the embodiments of the present invention can be adopted. "The phosphate-based protective layer 2 covers the entire over-voltage protection unit 1 and exposes only the first exposed side end 121 of each of the first outer conductive layers 12 and the second exposed portion of each of the second outer conductive layers 13 The side end 131" is designed to avoid corrosion of the plating solution in the step of plating the terminal electrode unit 3 in the overvoltage protection unit 1, and at the same time, the overall process efficiency of the overvoltage protection package structure Z can be improved.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

Z‧‧‧Overvoltage protection package structure

1‧‧‧Overvoltage protection unit

11‧‧‧Insulation package

111‧‧‧ first side

112‧‧‧ second side

113‧‧‧ top surface

114‧‧‧Bottom surface

12‧‧‧First external conductive layer

121‧‧‧First exposed side

122‧‧‧First buried side

13‧‧‧Second external conductive layer

131‧‧‧Second exposed side

132‧‧‧Second buried side

14‧‧‧First side end

15‧‧‧Second side end

2‧‧‧phosphate protective layer

3‧‧‧End electrode unit

31‧‧‧First electrode unit

311‧‧‧First conductive layer

312‧‧‧Second conductive layer

313‧‧‧ Third conductive layer

32‧‧‧Second electrode unit

321‧‧‧First conductive layer

322‧‧‧Second conductive layer

323‧‧‧ Third conductive layer

Claims (10)

An overvoltage protection package structure includes: an overvoltage protection unit having an insulation package, a plurality of first outer conductive layers, and a plurality of second outer conductive layers, each of which The first outer conductive layer has a first exposed side end exposed from a first side end of the insulating package, and each of the second outer conductive layers has a first outer conductive layer a second exposed side end exposed by the second side end; a phosphate-based protective layer covering the entire over-voltage protection unit, and only exposing each of the first joints The first exposed side end of the outer conductive layer and the second exposed side end of each of the second outer conductive layers; and one end electrode unit, the end electrode unit including a cladding overvoltage protection a first electrode unit of a first side end of the unit and a second electrode unit covering a second side end of the overvoltage protection unit, wherein the first electrode unit and the second electrode unit Electrically contacting the first external guide The first layer and the outer side end of the exposed conductive layer with the second side of the second exposed end. The overvoltage protection package structure according to claim 1, wherein the phosphate-based protective layer also exposes a top end surface between the first electrode unit and the second electrode unit and the first electrode a bottom end surface between the unit and the second electrode unit. The overvoltage protection package structure of claim 1, wherein the first outer conductive layer and the second outer conductive layer are both a silver layer or an alloy layer containing silver and palladium. The overvoltage protection package structure according to claim 1, wherein the phosphate-based protective layer is a zinc phosphate protective layer or a phosphate iron protective layer. The overvoltage protection package structure of claim 1, wherein the first electrode is The element includes a first conductive layer covering the first side end of the overvoltage protection unit and a second conductive layer completely covering the first conductive layer. The overvoltage protection package structure according to claim 5, wherein the first conductive layer is a surface roughened silver layer, and the second conductive layer is a tin layer. The overvoltage protection package structure of claim 1, wherein the first electrode unit comprises a first conductive layer covering the first side end of the overvoltage protection unit, and a completely covered a second conductive layer of the first conductive layer, and a third conductive layer completely covering the second conductive layer. The overvoltage protection package structure of claim 7, wherein the first conductive layer is a silver layer, the second conductive layer is a nickel layer, and the third conductive layer is a tin layer. A method for fabricating an overvoltage protection package structure includes: providing an overvoltage protection unit, wherein the overvoltage protection unit has an insulation package, a plurality of first outer conductive layers, and a plurality of second outer conductive layers Each of the first outer conductive layers has a first exposed side end exposed from a first side end of the insulating package, and each of the second outer conductive layers has a a second exposed side end exposed by a second side end of the insulating package; forming a phosphate-based protective layer to cover the entire over-voltage protection unit, and only barely exposing each of the first external units The first exposed side end of the conductive layer and the second exposed side end of each of the second outer conductive layers; and an end electrode unit is formed, wherein the end electrode unit includes a cladding overvoltage a first electrode unit of a first side end of the protection unit and a second electrode unit covering a second side end of the overvoltage protection unit, the first electrode unit and the second electrode unit Electrically contacting the first The outer conductive layer of the first exposed conductive layer and an outer side end of said second end with a second exposed side. The method for fabricating an overvoltage protection package structure according to claim 9, wherein the phosphate-based protective layer is coated with the overvoltage protection by dipping. The first electrode unit is coated with the first side end of the overvoltage protection unit by electroplating, and the second electrode unit is coated with the overvoltage protection unit by electroplating. The second side end.