KR960009064Y1 - Ceramic coating tantalium electrolytic capacitor - Google Patents
Ceramic coating tantalium electrolytic capacitor Download PDFInfo
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- KR960009064Y1 KR960009064Y1 KR2019930009901U KR930009901U KR960009064Y1 KR 960009064 Y1 KR960009064 Y1 KR 960009064Y1 KR 2019930009901 U KR2019930009901 U KR 2019930009901U KR 930009901 U KR930009901 U KR 930009901U KR 960009064 Y1 KR960009064 Y1 KR 960009064Y1
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- South Korea
- Prior art keywords
- tantalum
- lead
- electrolytic capacitor
- ceramic coating
- tantalium
- Prior art date
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- 239000003990 capacitor Substances 0.000 title claims description 22
- 238000005524 ceramic coating Methods 0.000 title claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 38
- 229910052715 tantalum Inorganic materials 0.000 claims description 33
- 239000010410 layer Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229920002050 silicone resin Polymers 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910007116 SnPb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003481 tantalum Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
내용 없음.No content.
Description
도면은 본 고안의 퓨우즈가 접착된 탄탈 콘덴서의 일실시예를 보인 구조도이다.Figure is a structural diagram showing an embodiment of the fuse tantalum capacitor bonded to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 음극 리드플레임 11 : 탄탈 소자10: cathode lead frame 11: tantalum element
12 : 양극 리드플레임 13 : 세라믹층12: anode lead flame 13: ceramic layer
14 : 퓨우즈 15 : 절연성 에폭시 수지14: Fuse 15: insulating epoxy resin
16 : 탄탈와이어 17 : 에폭시 수지16: tantalum wire 17: epoxy resin
18 : 실리콘 수지 19 : 도전성 은 접착제18: silicone resin 19: conductive silver adhesive
본 고안은 칩형식(chip type) 탄탈륨 고체 전해 콘덴서의 구조에 관한 것으로, 더욱 상세하게는 단열성 수재인 세라믹을 이용하여 외부로부터 인가되는 열적 스트레스를 차단시켜 내열성을 향상케한 세라믹 코팅층이 형성된 탄탈륨 고체 전해 콘덴서에 관한 것이다.The present invention relates to a structure of a chip type tantalum solid electrolytic capacitor, and more particularly, tantalum solid having a ceramic coating layer which improves heat resistance by blocking thermal stress applied from the outside by using a heat insulating material ceramic. It relates to an electrolytic capacitor.
일반적으로 탄탈륨 콘덴서의 내부 구조에 대해서 제조 공정과 함께 간략하게 설명한다.In general, the internal structure of a tantalum capacitor will be briefly described along with a manufacturing process.
탄탈 와이어가 삽입된 탄탈 소자는 성형 공정과 소결 공정을 거치면서 탄탈 분말의 소결 소자를 형성하고 화성 공정을 거치면서 유전체 피막을 형성하고, 고체 전해질로된 이산화 망간층을 질산 망간 수용액에 함침후 열분해에 의하여 형성하고, 그 위에 음극 단자를 인출하기 위하여 카본 분말, 은 분말을 도포 형성한 소자를 케이스에 수함하여 움극 리드선을 솔더링 접속한 후, 외장 공정에서 탄탈 소자를 애폭시 파우더에 코팅후 마킹하여서 탄탈륨 콘덴서를 제조하여 온바, 종래의 탄탈륨 고체 전해 콘덴서는 주석(89∼96%)과 납(4∼11%)이 혼합된 접착제를 이용하여 리드플레임에 카본/은 도포 공정을 종료한 소자를 용접하고 절연성 에폭시 수지를 음극 리드플레임에 도포한후 0.05∼0.1mm의 직경으로된 퓨우즈를 양극 리이드 플레임에 저항 용접하고 음극 소자의 측면에 도전성 은 접착제로 접착 경화하여 몰드 에폭시 수지로 외장을 형성하였다.The tantalum element into which tantalum wire is inserted forms a sintered element of tantalum powder during the forming process and the sintering process, forms a dielectric film during the chemical conversion process, and thermally decomposes the manganese dioxide layer made of solid electrolyte into the aqueous solution of manganese nitrate In order to take out the cathode terminal thereon and to form a carbon powder and silver powder coated element thereon, the lead lead wire is soldered and connected to the case, and the tantalum element is coated on the epoxy powder in the exterior process and then marked. In the manufacture of tantalum capacitors, the conventional tantalum solid electrolytic capacitors are welded to the leadframe after completion of the carbon / silver coating process using a mixture of tin (89 to 96%) and lead (4 to 11%). After applying an insulating epoxy resin to the cathode lead frame, a fuse having a diameter of 0.05 to 0.1 mm was welded to the anode lead frame by resistance welding. On the side of the conductive element it is to form a sheath in a mold an epoxy resin to cure the adhesive with an adhesive.
이와같이 형성된 종래의 탄탈륨 고체 전해 콘덴서는 소자와 음극리드플레임을 도전성 은 접착제를 사용하여 제조한 것으로 외부로부터 열적 스트레스가 인가될 경우에는 도전성 은 접착제의 용융으로 인하여 탄탈 소자와 음극 리드플레임이 분리되는 경우가 종종있었던바, 그러므로 탄탈 콘덴서는 외부로부터 인가되는 열적 스트레스를 견디어야 하는 내적 조건이 요구되었고, 특히 검사 공정에서 탄탈 콘덴서의 고온부하와, 납(pb) 내열성 검사시에 사용온도 조건이 220℃∼230℃ 에서도 5초∼10 초간 방치한 후 탄탈 콘덴서의 전기적 제특성 규격을 만족하여야 하는데 종래에는 이러한 검사 공정시에 열적 스트레스를 견디지 못하여 탄탈륨 콘덴서의 기본 특성이 열화되는 문제점이 있었다.The conventional tantalum solid electrolytic capacitor formed as described above is manufactured by using a conductive silver adhesive for the device and the cathode leadframe. When thermal stress is applied from the outside, the tantalum device and the cathode leadframe are separated due to melting of the conductive silver adhesive. As a result, tantalum capacitors were required to withstand the internal stresses applied to them from the outside. In particular, during the inspection process, the tantalum capacitors were subjected to a high temperature load and a temperature limit of 220 ° C during the thermal test of lead (pb). After leaving for 5 seconds to 10 seconds even at ~ 230 ℃ to satisfy the electrical properties of the tantalum capacitor, the conventional characteristics of the tantalum capacitor deteriorated due to the thermal stress during the inspection process has been a problem.
본 고안은 상기와 같은 문제점을 해결하고자 안출한 것으로, 탄탈 소자의 외벽면에 실리콘 수지로, 언더 코팅하는 외장 공정후에 고내열성의 소재를 용융시켜 분사 코팅하므로써 외부로부터 인가되는 열적 스트레스를 효과적으로 차단할 수 있게한 세라믹 코팅층이 형성된 탄탈륨 고체 전해 콘덴서를 제공하고자 하는 것이다.The present invention has been made to solve the above problems, it is possible to effectively block the thermal stress applied from the outside by melting and spray coating the high heat-resistant material after the outer coating process of the undercoat with a silicone resin on the outer wall surface of the tantalum element. It is an object of the present invention to provide a tantalum solid electrolytic capacitor having a ceramic coating layer.
상기와 같은 목적을 달성하기 위하여 본 고안에 의거하여 제조된 탄탈 콘덴서의 구조 및 작용 효과를 본 고안의 일실시예를 보인 첨부 도면을 참조하여 설명한다.In order to achieve the above object, the structure and the effect of the tantalum capacitor manufactured according to the present invention will be described with reference to the accompanying drawings showing an embodiment of the present invention.
탄탈 와이어(16)에 양극 리드플레임(12)이 접속되고, 음극 리드플레임(10)이 절연성 에폭시 수지로 접속된 조립 공정을 마친 탄탈륨 고체 전해 콘덴서에서, 상기 탄탈 소자(11)의 외벽면에 내습성이 있는 실리콘 수지층(18), 경화성이 있는 에폭시 수지층(17), 내열성이 있는 세라믹층(13)으로 순차도포되어 형성한다.In the tantalum solid electrolytic capacitor that has completed the assembling process in which the positive lead lead 12 is connected to the tantalum wire 16 and the negative lead lead 10 is connected with an insulating epoxy resin, the tantalum element 11 is formed on the outer wall surface of the tantalum element 11. The wet silicone resin layer 18, the curable epoxy resin layer 17, and the heat resistant ceramic layer 13 are sequentially coated and formed.
첨부된 도면에 나타난 탄탈 콘덴서는 음극 리드플레임(10)과 탄탈 소자(11) 사이에 퓨우즈(14)가 설치된 본 고안의 일실시예를 보인 것으로, 퓨우즈(14)와의 접속은 도전성을 지닌 은 접착제를 이용하여 부분 은 도금으로 접합하여 도전성을 향상시키게한 고안이다.Tantalum capacitor shown in the accompanying drawings shows an embodiment of the present invention in which the fuse 14 is installed between the cathode lead flame 10 and the tantalum element 11, the connection with the fuse 14 is conductive It is a device designed to improve conductivity by joining a part silver plating using a silver adhesive.
본 고안은 칩 형식의 탄탈 콘덴서에서 사용되는 형태로서 본 고안의 기본 구조를 살펴보면 다음과 같다.The present invention is a form used in the tantalum capacitor of the chip type and looks at the basic structure of the present invention as follows.
첨부된 도면에서와 같이 리드플레임(12,10)의 기본 소재인 양백 박판 0.1∼0.2μ인 모재에 하지 도금으로 니켈을 0.5∼0.2μ가 되도록 도금한 후 주석 납(SnPb) 도금을 3∼5μ 두께로 도금하게 된다.As shown in the accompanying drawings, a nickel-plated base plate of 0.1-0.2 μm, which is the basic material of the lead frames 12 and 10, was plated with 0.5 to 0.2 μm of nickel by base plating, and then 3 to 5 μm of tin lead (SnPb) plating. Plated to thickness.
퓨우즈(14)가 용접될 리드플레임(10,12)면을 부분 도전성은 접착제(19)로 부분 은 도금하여 퓨우즈(14)와 리드플레임(10,12)과의 접촉 저항을 최소화시킨 것이다.The partial conductivity of the lead flames 10 and 12 to be welded to the fuse 14 is partially silver plated with an adhesive 19 to minimize the contact resistance between the fuse 14 and the lead flames 10 and 12. .
리드플레임 용접은 탄탈 콘덴서의 극성을 인출하는 공정으로서 양극 리드플레임(12)은 탄탈 와이어(16)와 저항 용접을 하고 음극 리드플레임(10)은 절연성 에폭시 수지(15)로 소자의 측면과 완전 절연시킨뒤 솔더 파이버로(solder fiber)로된 퓨우즈(14)로 양극 리드플레임(12)과 음극 리드쪽에는 도전성 은 접착제(19)를 이용하여 탄탈 소자의 외벽면에, 도포 접착하고 경화하여서 음극 리드플레임(10)과 양극 리드플레임(12)을 인출한 후 탄탈 소자(11)의 외벽에 실리콘 수지로 도포하여 실리콘 수지층(18)으로 1차 외장한 다음, 경화성이 있는 몰드(Mold) 에폭시 수지로 에폭시 수지층(17)을 형성하고, 세라믹 분말을 에폭시 수지층(17)의 표면에 용융시켜 분사하여 3∼5μ의 세라믹 코팅층을 유지하도록 하여서 제조된다.Lead flame welding is a process of drawing out the polarity of a tantalum capacitor. The anode lead flame 12 is resistance welded to the tantalum wire 16 and the cathode lead flame 10 is insulated from the side of the device with an insulating epoxy resin 15. After the fuse 14 is made of solder fiber, the anode lead frame 12 and the cathode lead side are coated with a conductive silver adhesive 19 to the outer wall surface of the tantalum element, and then adhered and cured. After the lead frame 10 and the anode lead frame 12 are drawn out, the outer wall of the tantalum element 11 is coated with a silicone resin, and the first exterior is coated with the silicone resin layer 18, and then a moldable epoxy is curable. The epoxy resin layer 17 is formed of resin, and the ceramic powder is melted and sprayed on the surface of the epoxy resin layer 17 to produce a 3 to 5 mu ceramic coating layer.
이와같이 본 고안은 탄탈 소자의 외장시에 고 내열성의 소재인 세라믹 코팅층을 추가로 성형하여 탄탈륨 고체 전해 콘덴서의 내부 소자에 고열을 차단시킬 수 있도록 하므로써, 화상 피막 및 소성 피막을 보호하며 고열로 인한 탄탈 소자내 퓨우즈의 절단 현상을 방지하고 콘덴서의 안전 회로를 유지할 수 있게하여서, 제품의 신뢰성을 크게 개선한 고안이다.As such, the present invention additionally forms a ceramic coating layer, which is a high heat-resistant material, when the tantalum element is externally shielded to block high heat in the internal element of the tantalum solid electrolytic capacitor, thereby protecting the image film and the plastic film, and preventing tantalum due to high heat. It is designed to prevent the breakage of fuse in the device and to maintain the safety circuit of the capacitor, thereby greatly improving the reliability of the product.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930009901U KR960009064Y1 (en) | 1993-06-08 | 1993-06-08 | Ceramic coating tantalium electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930009901U KR960009064Y1 (en) | 1993-06-08 | 1993-06-08 | Ceramic coating tantalium electrolytic capacitor |
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| Publication Number | Publication Date |
|---|---|
| KR950002138U KR950002138U (en) | 1995-01-04 |
| KR960009064Y1 true KR960009064Y1 (en) | 1996-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019930009901U KR960009064Y1 (en) | 1993-06-08 | 1993-06-08 | Ceramic coating tantalium electrolytic capacitor |
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| KR (1) | KR960009064Y1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040048571A (en) * | 2002-12-04 | 2004-06-10 | 파츠닉(주) | Method for preventing doposition solution from climbing tantalum element |
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- 1993-06-08 KR KR2019930009901U patent/KR960009064Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR950002138U (en) | 1995-01-04 |
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