KR100270511B1 - Electrode Attachment Method of Through Capacitor - Google Patents
Electrode Attachment Method of Through Capacitor Download PDFInfo
- Publication number
- KR100270511B1 KR100270511B1 KR1019980019746A KR19980019746A KR100270511B1 KR 100270511 B1 KR100270511 B1 KR 100270511B1 KR 1019980019746 A KR1019980019746 A KR 1019980019746A KR 19980019746 A KR19980019746 A KR 19980019746A KR 100270511 B1 KR100270511 B1 KR 100270511B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- external electrode
- terminal
- capacitor
- attaching
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000003990 capacitor Substances 0.000 title claims description 13
- 238000003466 welding Methods 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 239000006071 cream Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 229910010293 ceramic material Inorganic materials 0.000 abstract 2
- 230000035515 penetration Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
본 발명은 관통형 콘덴서의 전극을 부착시키는 방법에 있어서 두께방향의 관통공을 가진 세라믹소체 자기기판의 양면에다 환형의 은도금 전극을 형성시킨 후 외부 관통단자와 은도금이 된 상부 외부전극을 순간용접으로 접속시키고 하부 외부전극에는 크림 솔더(Cream solder)를 프린팅하여 전자 기기 부품에 부착시키는 방식으로 관통단자와 상부 외부전극, 세라믹소체, 하부 외부전극을 부착시켜 구성된 것을 특징으로 하는 관통형 콘덴서의 접속방법에 관한 것이다According to the present invention, an annular silver plated electrode is formed on both sides of a ceramic element magnetic substrate having a through hole in a thickness direction in the method of attaching an electrode of a through capacitor, and then an external through terminal and a silver plated upper external electrode are formed by instant welding. The connection method of a through-type capacitor, comprising a through terminal, an upper external electrode, a ceramic element, and a lower external electrode attached to the lower external electrode by attaching a cream solder to the electronic device component by printing a cream solder on the lower external electrode. Is about
본 발명과 관련된 종래기술로서 일본 공개실용신안공보 소55-91142(1980. 6. 24)가 있으며 종래의 관통형 콘덴서는 원통형 외부단자와 그 콘덴서의 내부에 위치한 원판형 전극과 그 중심부에 위치한 관통공 내부를 관통하는 관통단자 및 유전체 역할을 하는 소체 등으로 형성되는 한편 절연성 및 내습성을 갖도록 외부단자의 내부를 에폭시 수지로 충전시킨 구조로 되어 있다. 그러나 이와 같은 방법은 전극을 접속 시킬때 납을 사용함으로써 공정수가 많아져 생산단가가 높아질 뿐만 아니라 특히 에폭시 합성수지로 절연층을 형성시킬 때 콘덴서의 내부에서 기포가 발생하는 문제점이 있다.As a related art related to the present invention, there is Japanese Patent Application Laid-Open No. 55-91142 (June 24, 1980), and a conventional through-type condenser has a cylindrical external terminal and a disc-shaped electrode located inside the condenser and a penetration located at the center thereof. It is formed of a through terminal penetrating the inside of the ball and a body serving as a dielectric, and the inside of the outer terminal is filled with epoxy resin to have insulation and moisture resistance. However, this method has a problem in that bubbles are generated in the capacitor when the lead is used to increase the number of processes, thereby increasing production costs, and in particular, when forming an insulating layer with an epoxy synthetic resin.
발명은 종래 기술이 가지고 있는 상기와 같은 문제점을 해결하기 위하여 관통형 콘덴서의 내부전극을 부착시키는 접속공정으로서 먼저 은도금 전극을 형성시킨 후 그 위에 용접용 금속을 프린팅하여 순간적인 용접(Spot welding)으로 관통단자와 접속시키는 공정을 채택함으로써 콘덴서 내부에 합성수지로 절연층을 형성시킬 때 기포가 발생되는 문제점을 해결하고 접속공정의 공정수와 생산단가를 감소시킴은 물론 전기적 특성을 향상시킨 관통형 콘덴서의 전극 부착방법을The present invention is a connection process for attaching the internal electrode of the through-type capacitor in order to solve the above problems of the prior art, first forming a silver-plated electrode and then printing a welding metal thereon to spot welding. By adopting the process of connecting the through terminal, it solves the problem that bubbles are generated when forming the insulating layer of synthetic resin inside the capacitor, reduces the number of processes and production cost of the connecting process and improves the electrical characteristics. How to attach the electrode
제공한다.to provide.
도 1 은 본 발명에 따라 전극이 부착된 관통형 콘덴서의 내부 단면도이다.1 is an internal cross-sectional view of a through capacitor with an electrode according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1. 관통도체 2. 관통단자 3. 용접금속1. Through Conductor 2. Through Terminal 3. Welded Metal
4. 상부 외부전극 5. 세라믹소체 6. 하부 외부전극4. Upper external electrode 5. Ceramic element 6. Lower external electrode
7. 크림 솔더7. Cream Solder
본 발명은 관통형 콘덴서의 전극을 부착시키는 방법에 있어서 두께 방향의 관통공을 가진 세라믹소체(5) 자기기판의 양면에 환형의 은도금 전극을 형성시키고 이렇게 형성된 은도금 전극에 관통본체를 순간용접(Spot welding)하여 관통단자(2)를 부착시킨 것을 특징으로 하는 관통형 콘덴서의 접속방법이다. 이하 본 발명을 도면에 의거하여 설명하면 다음과 같다.According to the present invention, an annular silver plated electrode is formed on both sides of a ceramic substrate 5 having a through hole in a thickness direction in a method of attaching an electrode of a through-type capacitor, and the through body is instantaneously welded to the silver plated electrode thus formed. Through-type condenser connection method characterized in that the through terminal (2) is attached by welding. Hereinafter, the present invention will be described with reference to the drawings.
도 1은 본 발명과 관련된 관통형 콘덴서의 내부 단면을 나타낸 것으로서 먼저 유전체인 세라믹소체(5)를 형성시킴에 있어서 이미 알려진 바와같이 SrTiO3, BaTiO3, Bi2O3, TiO2, PbTiO3등으로 구성되어 있는 고유전율계 자기를 형성한 후 소성시키는데 이는 원판형 디스크를 소성시키는 방법과 별다른 점은 없으나 성형된 디스크 내부에 관통공이 형성되어 있는 점이 서로 다르고 특히 디스크의 관통공 형성시 내부의 직경이 적기 때문에 응력 침투를 방지하는데 주의해야 한다. 이어 콘덴서의 전극 형태로 된 스크린(Screen)을 사용하여 은산화물 분말, 그라스 프릿트(Glass frit) 및 유기 결합제로 구성되어 있는 전극 재료를 상기 세라믹소체(5)의 양면에 도포시키고 가열시키되 이때의 가열온도는 그라스 프릿트의 조성에 따라 결정된다.Figure 1 shows the internal cross section of the through-type capacitor according to the present invention, as is known in the first to form a ceramic body (5) as a dielectric, SrTiO 3 , BaTiO 3 , Bi 2 O 3 , TiO 2 , PbTiO 3, etc. The high dielectric constant magnet is formed and then fired, which is no different from the method of firing a disk-shaped disk, but the through-holes are formed inside the molded disk, and the inner diameter of the disk through-hole is formed. Because of this small amount, care must be taken to prevent stress penetration. Subsequently, an electrode material composed of silver oxide powder, glass frit, and an organic binder was applied to both surfaces of the ceramic element 5 by using a screen in the form of an electrode of a capacitor and heated. The heating temperature is determined by the composition of the glass frit.
상기와 같은 방법에 의해서 세라믹소체(5)의 양면에 은이 도금된 환형 상부 외부전극(4)과 하부 외부전극(6)이 형성되는 것이다. 본 발명에 따르면 상부 외부전극(4)을 관통단자(2)와 부착시키는 공정에 있어서 순간용접(Spot welding)의 방법중 아크용접(Arc welding)을 사용하고 용접순간의 온도가 2,000℃ 이상의 고온에서 상부 외부전극(4)과 관통단자(2)가 접속되기 때문에 접속강도가 기존의 납 또는 주석에 의해서 접속되는 방식에 비해서 증가하고 은으로 도금된 상부 외부전극(4)의 산화를 방지할 수 있다.By the above method, the annular upper external electrode 4 and the lower external electrode 6 plated with silver are formed on both surfaces of the ceramic element 5. According to the present invention, in the process of attaching the upper external electrode 4 to the through terminal 2, arc welding is used in the method of spot welding, and the temperature of the welding moment is higher than 2,000 ° C. Since the upper external electrode 4 and the through terminal 2 are connected, the connection strength is increased compared to the conventional method of connecting by lead or tin, and oxidation of the upper external electrode 4 plated with silver can be prevented. .
하부 외부전극(6), 세라믹소체(5), 관통단자(2)가 조립된 상태에서 하부 외부전극(6)과 전자 기기(Tuner, CA TV converter)를 연결시키기 위한 크림 솔더를 프린팅할 때에는 크림 솔더의 솔벤트 성분이 완전히 건조된 상태에서 관통콘덴서를 제조한다.When printing the cream solder for connecting the lower external electrode 6 and the electronic device (Tuner, CA TV converter) with the lower external electrode 6, ceramic element 5, and through terminal 2 assembled, The through-capacitor is manufactured with the solvent component of the solder completely dried.
상기에 기술한 바와 같이 본 발명에 따른 관통형 콘덴서는 상부 외부전극 및 관통단자가 순간용접 방식으로 연속적으로 부착되기 때문에 종래의 납이나 주석에 의한 부착 방식에 비해서 공정수가 훨씬 감소되었으며 또 접촉 부위가 고온에서 부착됨으로써 불순물의 침투로 인한 전기적 특성이 나빠지는 것을 방지할 수 있다. 특히 종래의 에폭시 수지에 의한 절연층 형성시 기포로 말미암은 내습성 및 내습부하의 저하를 방지할 수 있으며 에폭시 수지가 응고시 발생되는 내부 응력이 없기 때문에 관통단자 및 외부전극이 Instron에 의한 인장시험(Tension test)결과 기존의 전극부착 방식에 비해 10배정도 향상된 기계적 강도를 가질 수 있다.As described above, the through-type capacitor according to the present invention has a much lower process number than the conventional lead or tin attachment method because the upper external electrode and the through terminal are continuously attached by the instant welding method. By attaching at a high temperature it is possible to prevent the electrical characteristics due to the penetration of impurities deteriorate. Particularly, when the insulation layer is formed by the conventional epoxy resin, bubbles can prevent moisture resistance and lowering of the moisture load, and since there is no internal stress generated when the epoxy resin solidifies, the penetration terminal and the external electrode are tensile test by Instron ( Tension test) As a result, it can have 10 times improved mechanical strength than the conventional electrode attachment method.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980019746A KR100270511B1 (en) | 1998-05-29 | 1998-05-29 | Electrode Attachment Method of Through Capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980019746A KR100270511B1 (en) | 1998-05-29 | 1998-05-29 | Electrode Attachment Method of Through Capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990086646A KR19990086646A (en) | 1999-12-15 |
| KR100270511B1 true KR100270511B1 (en) | 2000-11-01 |
Family
ID=19537897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980019746A KR100270511B1 (en) | 1998-05-29 | 1998-05-29 | Electrode Attachment Method of Through Capacitor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100270511B1 (en) |
-
1998
- 1998-05-29 KR KR1019980019746A patent/KR100270511B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990086646A (en) | 1999-12-15 |
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