TW201721791A - 黏著帶貼附方法及黏著帶貼附裝置 - Google Patents

黏著帶貼附方法及黏著帶貼附裝置 Download PDF

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Publication number
TW201721791A
TW201721791A TW105132810A TW105132810A TW201721791A TW 201721791 A TW201721791 A TW 201721791A TW 105132810 A TW105132810 A TW 105132810A TW 105132810 A TW105132810 A TW 105132810A TW 201721791 A TW201721791 A TW 201721791A
Authority
TW
Taiwan
Prior art keywords
adhesive tape
wafer
attaching
holding
semiconductor wafer
Prior art date
Application number
TW105132810A
Other languages
English (en)
Chinese (zh)
Inventor
村山聰洋
Original Assignee
日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW201721791A publication Critical patent/TW201721791A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
TW105132810A 2015-10-13 2016-10-12 黏著帶貼附方法及黏著帶貼附裝置 TW201721791A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015201879A JP2017076644A (ja) 2015-10-13 2015-10-13 粘着テープ貼付け方法および粘着テープ貼付け装置

Publications (1)

Publication Number Publication Date
TW201721791A true TW201721791A (zh) 2017-06-16

Family

ID=58518109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105132810A TW201721791A (zh) 2015-10-13 2016-10-12 黏著帶貼附方法及黏著帶貼附裝置

Country Status (3)

Country Link
JP (1) JP2017076644A (ja)
TW (1) TW201721791A (ja)
WO (1) WO2017065006A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254564A (ja) * 1988-08-18 1990-02-23 Nec Corp 半導体ウェハースの粘着テープ貼付け装置
JP2911997B2 (ja) * 1989-10-20 1999-06-28 日本電気株式会社 半導体ウェハーへのテープ貼付装置
JP2925758B2 (ja) * 1991-01-14 1999-07-28 古河電気工業株式会社 半導体ウェーハ用テープ貼着装置
JPH07201956A (ja) * 1993-12-28 1995-08-04 Nippon Steel Corp ウエハ冷却装置
JP2001118811A (ja) * 1999-10-15 2001-04-27 Nitto Denko Corp 基板への粘着テープ貼付け装置
JP5543812B2 (ja) * 2010-03-23 2014-07-09 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP5691364B2 (ja) * 2010-10-06 2015-04-01 富士電機株式会社 テープ貼付装置およびテープ貼付方法

Also Published As

Publication number Publication date
JP2017076644A (ja) 2017-04-20
WO2017065006A1 (ja) 2017-04-20

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