TW201715640A - Processing device for preventing a rotary adapter from rotation and vibration and easily switching to required suction holding surfaces corresponding to plate-type workpieces having different dimensions and shapes - Google Patents
Processing device for preventing a rotary adapter from rotation and vibration and easily switching to required suction holding surfaces corresponding to plate-type workpieces having different dimensions and shapes Download PDFInfo
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Description
本發明涉及一種具備吸引保持板狀工件之保持機構的加工裝置。 The present invention relates to a processing apparatus including a holding mechanism for sucking and holding a plate-like workpiece.
切削裝置和研磨裝置等之加工裝置具備吸引保持做為加工對象之板狀工件的吸盤工作台。吸盤工作台至少具有，上面有吸引保持板狀工件之吸引保持面的多孔體，和圍繞多孔體的框體。框體中形成有連通吸引保持面和吸引源的吸引通道，通過此吸引通道使吸引保持面發揮吸引作用而吸引保持板狀工件。 A processing device such as a cutting device and a polishing device is provided with a suction cup table that sucks and holds a plate-shaped workpiece to be processed. The suction cup table has at least a porous body having an attraction holding surface for holding the plate-like workpiece, and a frame surrounding the porous body. A suction passage that communicates with the suction holding surface and the suction source is formed in the casing, and the suction passage causes the suction holding surface to attract and suck and hold the plate-shaped workpiece.
另外，作為吸盤工作台，有一種是即使變更板狀工件的尺寸依然可以用同一個吸盤工作台進行吸引保持的通用吸盤工作台。通用吸盤工作台被裝配成，將對應於板狀工件的尺寸之複數個吸引保持面，利用間隔區分開而成為以工作台的中心為中心之呈同心圓狀的複數個區域。且，使用通用吸盤工作台來吸引保持板狀工件時係，開啟對應於板狀工件的尺寸之吸引通道，從而變更吸引源之吸引力起作用之吸引保持面的直徑(例如，參見以下的專利文獻1 及2)。 Further, as the suction cup table, there is a general-purpose suction cup table which can be sucked and held by the same suction cup table even if the size of the plate-shaped workpiece is changed. The universal suction cup table is assembled such that a plurality of suction holding surfaces corresponding to the size of the plate-like workpiece are separated by a space to form a plurality of concentric circles centering on the center of the table. Further, when the universal suction cup table is used to attract and hold the plate-like workpiece, the suction passage corresponding to the size of the plate-like workpiece is opened, thereby changing the diameter of the suction holding surface in which the attraction force of the suction source acts (for example, see the following patent) Literature 1 And 2).
【專利文獻1】特開2000-232083號公報 [Patent Document 1] JP-A-2000-232083
【專利文獻2】特開2001-385562號公報 [Patent Document 2] JP-A-2001-385562
但是，在如上所述的吸盤工作台中，必須配備使框體內的各個吸引通道開關的閥門，使得配合欲吸引保持之板狀工件的尺寸之各個吸引保持面連通到吸引源。 However, in the suction cup table as described above, it is necessary to provide a valve for each of the suction passage switches in the casing so that the respective suction holding faces of the size of the plate-like workpiece to be attracted and held are communicated to the suction source.
另外，對板狀工件施行例如研磨加工時，因為吸盤工作台必須一邊吸引保持板狀工件一邊旋轉，所以必須在吸盤工作台安裝旋轉接合器。亦即，為了使各個吸引保持面與吸引源連通，必須在旋轉接合器上安裝與吸引保持面的數量相同數量之吸引通道，因而有旋轉接合器的構造變複雜而且價格變高的問題。 Further, when the plate-shaped workpiece is subjected to, for example, a grinding process, since the chuck table must be rotated while sucking and holding the plate-like workpiece, it is necessary to attach the rotary joint to the chuck table. That is, in order to allow the respective suction holding faces to communicate with the suction source, it is necessary to attach the same number of suction passages to the number of the suction holding faces on the rotary joint, and thus the structure of the rotary joint becomes complicated and the price becomes high.
像這樣，如果在旋轉接合器內形成複數個吸引通道，旋轉接合器的構造在軸向就會增長，以致變成在吸盤工作台的下側長長地突出的構造。因此，在吸盤工作台的旋轉中，旋轉接合器的軸心偏離的可能性提高，在旋轉接合器發生旋轉振動，此振動又被傳達給吸盤工作台，出現在板狀工件之被研磨面產生不均勻現象的不良影響。 As such, if a plurality of suction passages are formed in the rotary joint, the configuration of the rotary joint increases in the axial direction so as to become a structure that protrudes long on the lower side of the suction cup table. Therefore, in the rotation of the suction cup table, the possibility of the axis deviation of the rotary joint is increased, and the rotary vibration is generated in the rotary joint, and the vibration is transmitted to the suction cup table, which occurs on the polished surface of the plate-shaped workpiece. The adverse effects of unevenness.
本發明即是有鑑於上述情事而完成的，目的在於既要防止旋轉接合器的旋轉振動，同時又能夠容易地切換 對應於尺寸和形狀不同之板狀工件的吸引保持面。 The present invention has been made in view of the above circumstances, and aims to prevent rotational vibration of a rotary joint while being easily switchable. A suction holding surface corresponding to a plate-shaped workpiece having different sizes and shapes.
本發明是一種配備吸引保持板狀工件的保持機構、和對該保持機構所吸引保持之板狀工件進行加工的加工機構之加工裝置；該保持機構具備：吸盤工作台、安裝該吸盤工作台的基台、和連接至吸引源且具有分岐成複數個的分岐管之切換部；該吸盤工作台具備：具有多孔質構件並且被境界部區劃成複數個吸引保持面之保持板，和，使該保持板之該吸引保持面露出並收容該保持板之框體；該框體具有對應於各該吸引保持面之吸引孔；該基台具有：該框體所裝設之安裝面、和使裝設在該安裝面之該框體的各該吸引孔連通至該吸引源之複數個吸引通道；透過選擇對應於板狀工件之被保持面的尺寸之該吸引通道，並將之連接到該切換部之該分岐管，使對應於該保持面的尺寸之該吸引保持面連通至該吸引源，藉而將板狀工件保持在該吸引保持面並以該加工機構進行加工。 The present invention relates to a processing apparatus equipped with a holding mechanism for sucking and holding a plate-like workpiece, and a processing mechanism for processing a plate-shaped workpiece sucked and held by the holding mechanism; the holding mechanism includes: a suction cup table, and a suction cup table a base, and a switching portion connected to the suction source and having a plurality of branching tubes; the suction cup having: a holding plate having a porous member and partitioned into a plurality of suction holding surfaces by the boundary portion, and Holding the suction holding surface of the holding plate and accommodating the frame of the holding plate; the frame body has a suction hole corresponding to each of the suction holding surfaces; the base plate has: a mounting surface on which the frame body is mounted, and a mounting surface Each of the suction holes of the frame provided on the mounting surface communicates with a plurality of suction passages of the suction source; the suction passage corresponding to the size of the held surface of the plate-shaped workpiece is selected and connected to the switch The branching pipe of the portion communicates the suction holding surface corresponding to the size of the holding surface to the suction source, thereby holding the plate-shaped workpiece on the suction holding surface and using the processing mechanism Line processing.
本發明之加工裝置配備吸引保持板狀工件的保持機構，和對保持機構所吸引保持之板狀工件進行加工的加工機構；保持機構具備吸盤工作台、安裝吸盤工作台的基台，和，連接至吸引源且具有分岐成複數個的分岐管之切換部；吸盤工作台具備具有以境界區劃成複數個吸引保持面之保持板，和，收容保持板的框體；框體為了使吸引保持面連通至吸引源而具有對應於各個吸引保持面之吸引 孔；基台具有框體所裝設之安裝面，和使裝設在安裝面之該框體的各個吸引孔連通至吸引源的吸引通道；由於裝配成依據板狀工件之被保持面的尺寸來選擇基台之吸引通道並連接到切換部之分岐管，以便切換形成吸引源之連通端的吸引保持面，因此，例如，不須要在基台下端所連結之旋轉接合器內設置複數個吸引通道，並且可以將旋轉接合器縮短組裝。藉此，在板狀工件的加工中，由於在旋轉的旋轉接合器發生旋轉振動的情形得到防止，旋轉振動不會傳達到吸盤工作台，因此可以防止對加工造成不良影響。 The processing apparatus of the present invention is provided with a holding mechanism for sucking and holding a plate-like workpiece, and a processing mechanism for processing a plate-shaped workpiece sucked and held by the holding mechanism; the holding mechanism is provided with a suction cup table, a base for mounting the suction cup table, and a connection a switching unit that has a plurality of branching tubes to the suction source; the chucking table has a holding plate having a plurality of suction holding surfaces in a boundary area, and a frame for accommodating the holding plate; the frame body is for attracting the holding surface Connected to the attraction source and has an attraction corresponding to each attraction retention surface a mounting surface on which the frame is mounted, and a suction passage that connects the respective suction holes of the frame mounted on the mounting surface to the suction source; and is assembled into a size of the held surface according to the plate-shaped workpiece Selecting the suction passage of the base and connecting to the branching pipe of the switching portion to switch the suction holding surface forming the communication end of the suction source, and therefore, for example, it is not necessary to provide a plurality of suction passages in the rotary joint to which the lower end of the base is coupled And the rotary adapter can be shortened for assembly. Thereby, in the processing of the plate-shaped workpiece, since the rotational vibration of the rotating rotary joint is prevented, the rotational vibration is not transmitted to the chuck table, and thus it is possible to prevent adverse effects on the processing.
1‧‧‧加工裝置 1‧‧‧Processing device
10,30‧‧‧保持機構 10,30‧‧‧ Keeping institutions
11,31‧‧‧吸盤工作台 11,31‧‧‧Sucker Workbench
12,32‧‧‧保持板 12,32‧‧‧keeping board
120,320‧‧‧第1吸引保持面 120,320‧‧‧1st attraction holding surface
121,321‧‧‧第2吸引保持面 121,321‧‧‧2nd attraction holding surface
122,322‧‧‧第3吸引保持面 122,322‧‧‧3rd attraction holding surface
13a,13b,33a,33b,33c‧‧‧境界部 13a, 13b, 33a, 33b, 33c‧‧
14,34‧‧‧框體 14,34‧‧‧ frame
140,340‧‧‧嵌合凹部 140,340‧‧‧ fitting recess
15a,15b,15c,35a,35b,35c,35d‧‧‧吸引孔 15a, 15b, 15c, 35a, 35b, 35c, 35d‧‧‧ attracting holes
16,36‧‧‧基台 16,36‧‧‧Abutment
160,360‧‧‧安裝面 160,360‧‧‧Installation surface
17a,17b,17c,37a,37b,37c,37d‧‧‧第1吸引通道 17a, 17b, 17c, 37a, 37b, 37c, 37d‧‧‧ first attraction channel
18,38‧‧‧第2吸引通道 18,38‧‧‧2nd attraction channel
19‧‧‧吸引源 19‧‧‧Attraction source
2‧‧‧裝置機台 2‧‧‧Installation machine
20,40,41‧‧‧切換部 20,40,41‧‧‧Switching Department
21a,21b,21c,42a,42b,42c,42d‧‧‧分岐管 21a, 21b, 21c, 42a, 42b, 42c, 42d ‧ ‧ 岐
22‧‧‧旋轉接合器 22‧‧‧Rotary adapter
220‧‧‧流路 220‧‧‧flow path
23,53,61‧‧‧馬達 23,53,61‧‧ ‧motor
24‧‧‧驅動帶輪 24‧‧‧ drive pulley
25‧‧‧從動帶輪 25‧‧‧ driven pulley
26‧‧‧皮帶 26‧‧‧Land
27,27a‧‧‧支架 27,27a‧‧‧ bracket
3‧‧‧外蓋 3‧‧‧ Cover
323‧‧‧第4吸引保持面 323‧‧‧4th attraction holding surface
4‧‧‧柱體 4‧‧‧Cylinder
5‧‧‧加工機構 5‧‧‧Processing institutions
50‧‧‧主軸 50‧‧‧ spindle
51‧‧‧主軸套 51‧‧‧Spindle sleeve
52‧‧‧托座 52‧‧‧ bracket
54‧‧‧安裝座 54‧‧‧ Mounting
55‧‧‧研磨輪 55‧‧‧ grinding wheel
56‧‧‧研磨石 56‧‧‧ Grinding stone
6‧‧‧昇降機構 6‧‧‧ Lifting mechanism
60‧‧‧滾珠螺桿 60‧‧‧Rolling screw
62‧‧‧導軌 62‧‧‧rails
63‧‧‧昇降板 63‧‧‧ lifting plate
【圖1】加工裝置之一例的構成之示意斜視圖。 Fig. 1 is a schematic perspective view showing a configuration of an example of a processing apparatus.
【圖2】保持機構之構成的示意分解斜視圖。 Fig. 2 is a schematic exploded perspective view showing the configuration of a holding mechanism.
【圖3】保持機構之構成的示意斷面圖。 Fig. 3 is a schematic cross-sectional view showing the configuration of a holding mechanism.
【圖4】保持機構之構成的示意平面圖。 Fig. 4 is a schematic plan view showing the configuration of a holding mechanism.
【圖5】保持機構及研磨機構的動作例之示意斷面圖。 Fig. 5 is a schematic cross-sectional view showing an operation example of a holding mechanism and a polishing mechanism.
【圖6】保持機構之變形例的構成之示意斷面圖。 Fig. 6 is a schematic cross-sectional view showing a configuration of a modification of the holding mechanism.
【圖7】保持機構之變形例的構成之示意平面圖。 Fig. 7 is a schematic plan view showing a configuration of a modification of the holding mechanism.
如圖1所示，加工裝置1是對被加工物，即板狀工件進行研磨加工的加工裝置之一例，具有於Y軸方向延伸的裝置機座2。在裝置機座2的上面，吸引保持板狀工件的保持機構10被外蓋3覆住，並且形成能夠於Y軸方向移動的構成。 As shown in FIG. 1, the processing apparatus 1 is an example of a processing apparatus which grinds a workpiece, ie, a plate-shaped workpiece, and has the apparatus base 2 extended in the Y-axis direction. On the upper surface of the apparatus base 2, the holding mechanism 10 that sucks and holds the plate-like workpiece is covered by the outer cover 3, and is configured to be movable in the Y-axis direction.
在Z方向延伸的柱體4直立設置於裝置機座2的Y軸方向後部。在柱體4的Y軸方向前方配設著對保持機構10所吸引保持之板狀工件進行研磨加工的加工機構5，和使加工機構5在接近及背離保持機構10的研磨進給方向(Z軸方向)上做昇降之昇降機構6。加工機構5具備：具有Z軸方向之旋轉軸的主軸50、圍繞主軸50周圍的主軸套51、保持主軸套51的托座52、安裝於主軸50的一端之馬達53、以安裝座54為中介而裝設在主軸50的下端之研磨輪55，和呈環狀地固設在研磨輪55的下部之研磨石56。加工機構5可以利用馬達53的驅動而使研磨輪55以指定的旋轉速度轉動。 The column 4 extending in the Z direction is erected at the rear of the apparatus housing 2 in the Y-axis direction. A processing mechanism 5 for polishing a plate-shaped workpiece sucked and held by the holding mechanism 10 is disposed in front of the column 4 in the Y-axis direction, and the processing mechanism 5 is brought to and away from the holding direction of the holding mechanism 10 (Z) Lifting mechanism 6 for lifting and lowering in the axial direction). The machining mechanism 5 includes a main shaft 50 having a rotating shaft in the Z-axis direction, a main shaft sleeve 51 surrounding the main shaft 50, a bracket 52 for holding the main shaft sleeve 51, and a motor 53 attached to one end of the main shaft 50, and interposed by the mounting seat 54. Further, a grinding wheel 55 attached to the lower end of the main shaft 50 and a grinding stone 56 fixed to the lower portion of the grinding wheel 55 in an annular shape are provided. The machining mechanism 5 can rotate the grinding wheel 55 at a predetermined rotational speed by the driving of the motor 53.
昇降機構6具備：在z軸方向延伸的滾珠螺桿60、連接於滾珠螺桿60一端的馬達61、與滾珠螺桿60平行地延伸之一對導軌62，和，安裝在內部的螺帽與滾珠螺桿60螺合而且側部滑動式地接觸導軌62之昇降板63。托座52連結於昇降板63。而，馬達61如果讓滾珠螺桿60轉動，就能夠沿著一對導軌62，讓昇降板63連同加工機構5在Z軸方向昇降。 The elevating mechanism 6 includes a ball screw 60 extending in the z-axis direction, a motor 61 connected to one end of the ball screw 60, a pair of guide rails 62 extending in parallel with the ball screw 60, and a nut and ball screw 60 mounted inside. The lifting plate 63 of the guide rail 62 is screwed and laterally slidably contacted. The bracket 52 is coupled to the lift plate 63. On the other hand, if the motor 61 rotates the ball screw 60, the lift plate 63 can be moved up and down along the pair of guide rails 62 together with the machining mechanism 5 in the Z-axis direction.
保持機構10具備：吸引保持板狀工件之吸盤工作台11、吸盤工作台11所安裝之基台16，和具有連接至吸引源且分岐成複數個的分岐管之切換部20。吸盤工作台11具備：具有多孔質構件並以境界部區劃之吸引保持面的保持板12，和使保持板12之吸引保持面露出且圍繞保持板12的周圍加以收容之框體14。 The holding mechanism 10 includes a suction table 11 for sucking and holding a plate-shaped workpiece, a base 16 to which the suction table 11 is attached, and a switching unit 20 having a branching tube connected to a suction source and branched into a plurality of branches. The chuck table 11 includes a holding plate 12 having a porous member and a suction holding surface partitioned by a boundary portion, and a frame body 14 that exposes the suction holding surface of the holding plate 12 and is housed around the periphery of the holding plate 12.
圖2顯示保持板12被收容到框體14之前的狀態。 保持板12形成圓盤狀，其上面形成吸引保持圓形板狀之板狀工件的複數個吸引保持面。複數個吸引保持面是由圓環狀的境界部13a,13b區劃成之3個區域所構成。亦即，保持板12的吸引保持面是分別區劃成，包含境界部13a外側的面之最大的環狀第1吸引保持面120、由境界部13a內側的環狀所形成之第2吸引保持面121，和由境界部13b內側的環狀所形成之第3吸引保持面122的構成。此外，吸引保持面的區域數並無特殊限制。 FIG. 2 shows a state before the holding plate 12 is housed in the frame 14. The holding plate 12 is formed in a disk shape, and a plurality of suction holding faces for sucking a plate-like workpiece that holds a circular plate shape are formed on the upper surface. The plurality of suction holding surfaces are composed of three regions defined by the annular boundary portions 13a and 13b. In other words, the suction holding surface of the holding plate 12 is divided into the largest annular first suction holding surface 120 including the outer surface of the boundary portion 13a, and the second suction holding surface formed by the inner ring of the boundary portion 13a. 121 and a third suction holding surface 122 formed by a ring shape inside the boundary portion 13b. Further, the number of regions for attracting the holding surface is not particularly limited.
在框體14形成有供保持板12嵌入的嵌合凹部140。嵌合凹部140的底部上有用來將吸引力作用於保持12的各個吸引保持面之複數個吸引孔15a,15b及15c。吸引孔15c配設在嵌合凹部140的中心，吸引孔15a,15b配設在徑向之彼此互異的位置。而，如圖3所示，若將保持板12嵌入框體14的嵌合凹部140，吸引孔15a就被定位在第1吸引保持面120的下方側，吸引孔15b被定位在第2吸引保持面121的下方側，吸引孔15c則被定位在第3吸引保持面122的下方側，構成吸盤工作台11。 A fitting recess 140 into which the holding plate 12 is fitted is formed in the frame 14. The bottom of the fitting recess 140 has a plurality of suction holes 15a, 15b and 15c for applying suction force to the respective suction holding faces of the holding 12. The suction hole 15c is disposed at the center of the fitting recess 140, and the suction holes 15a, 15b are disposed at positions different from each other in the radial direction. As shown in FIG. 3, when the holding plate 12 is fitted into the fitting recess 140 of the frame 14, the suction hole 15a is positioned below the first suction holding surface 120, and the suction hole 15b is positioned at the second suction holding. On the lower side of the surface 121, the suction hole 15c is positioned below the third suction holding surface 122, and constitutes the suction cup table 11.
基台16係如圖3所示，具有框體14被裝設的安裝面160，和用於使裝設在安裝面160之框體14的各個吸引孔15a~15c連通到吸源19之複數個吸引通道。複數個吸引通道由，連通到吸引孔15a之第1吸引通道17a、連通到吸引孔15b之第1吸引通道17b、連通到吸引孔15c之第1吸引通道17c，和以切換部20為中介，連通到第1吸引通道17a~17c當中之一個以上的第2吸引通道18所構成。第2吸引通道18 通過形成於連結在基台16的下端之旋轉接合器22的內部的流路220而連通至吸引源19。此旋轉接合器22因為是僅具有1個流路220的構造，所以形成軸向長度比較短的構成。 As shown in FIG. 3, the base 16 has a mounting surface 160 on which the frame 14 is mounted, and a plurality of suction holes 15a to 15c for connecting the frame 14 mounted on the mounting surface 160 to the suction source 19. Attractive channels. The plurality of suction passages are connected to the first suction passage 17a of the suction hole 15a, the first suction passage 17b that communicates with the suction hole 15b, the first suction passage 17c that communicates with the suction hole 15c, and the switching portion 20. The second suction passage 18 is connected to one or more of the first suction passages 17a to 17c. Second attraction channel 18 The suction source 19 is connected to the flow path 220 formed inside the rotary joint 22 connected to the lower end of the base 16 . Since the rotary joint 22 has a structure in which only one flow path 220 is provided, a configuration in which the axial length is relatively short is formed.
旋轉接合器22中配設了用於使基台16旋轉的旋轉機構。旋轉機構由馬達23、安裝於馬達23的驅動帶輪24、安裝於旋轉接合器22的從動帶輪25，和捲繞驅動帶輪24和從動帶輪25的皮帶26構成。而，當透過馬達23驅動驅動帶輪24時，皮帶26會帶動從動帶輪25發生從動而使基台16轉動，連帶地可以使裝設在基台16的吸盤工作台11旋轉。 A rotation mechanism for rotating the base 16 is disposed in the rotary joint 22. The rotation mechanism includes a motor 23, a drive pulley 24 attached to the motor 23, a driven pulley 25 attached to the rotary joint 22, and a belt 26 that winds the drive pulley 24 and the driven pulley 25. On the other hand, when the drive pulley 24 is driven by the motor 23, the belt 26 drives the driven pulley 25 to rotate, and the base 16 is rotated, and the suction table 11 attached to the base 16 can be rotated in conjunction with the belt.
切換部20係，例如，以岐管構成，且如圖3所示地通過，例如，支架27而安裝在基台16的側部。切換部20具有連接於第1吸引通道17a~17c的複數個分岐管21a,21b及21c。如圖4所示，分岐管21a形成，對應於連通到吸引孔15a的第1吸引通道17a，分岐管21b對應於連通到吸引孔15b的第1吸引通道17b，分岐管21c對應於連通到吸引孔15c的第1吸引通道17c之構成。像這樣，就可以在切換部20，選擇對應於作為加工對象之板狀工件的被保持面的尺寸之第1吸引通道17a~17c當中的一個以上，並連接到與第1吸引通道17a~17c有對應關係的分岐管21a~21c，藉而使第1吸引保持面120、第2吸引保持面121或第3吸引保持面122連通至吸引源19。 The switching unit 20 is configured by, for example, a manifold, and is passed through the side portion of the base 16 by, for example, the bracket 27 as shown in FIG. The switching unit 20 has a plurality of branching tubes 21a, 21b and 21c connected to the first suction passages 17a to 17c. As shown in Fig. 4, the branching pipe 21a is formed corresponding to the first suction passage 17a that communicates with the suction hole 15a, the branching pipe 21b corresponds to the first suction passage 17b that communicates with the suction hole 15b, and the branching pipe 21c corresponds to the communication to attract The configuration of the first suction passage 17c of the hole 15c. In this way, one or more of the first suction passages 17a to 17c corresponding to the size of the held surface of the plate-shaped workpiece to be processed can be selected in the switching unit 20, and connected to the first suction passages 17a to 17c. The branching pipes 21a to 21c having the corresponding relationship are connected to the suction source 19 by the first suction holding surface 120, the second suction holding surface 121, or the third suction holding surface 122.
接著，將就加工裝置1中，以保持機構10吸引保持示於圖5之板狀工件W的動作，以及用加工機構5研磨板狀工件W的動作進行說明。板狀工件W是圓形板狀的被加 工物之一例。此外，本實施態樣中，是將第1吸引保持面120設定成例如直徑450mm，將第2吸引保持面121設定成例如直徑300mm，將第3吸引保持面122設定成例如直徑150mm，作為吸盤工作台11之各吸引保持面的尺寸。 Next, in the processing apparatus 1, the operation of sucking and holding the plate-like workpiece W shown in FIG. 5 by the holding mechanism 10 and the operation of polishing the plate-shaped workpiece W by the processing mechanism 5 will be described. The plate-shaped workpiece W is a circular plate-shaped addition An example of a work item. In the present embodiment, the first suction holding surface 120 is set to have a diameter of, for example, 450 mm, the second suction holding surface 121 is set to have a diameter of, for example, 300 mm, and the third suction holding surface 122 is set to have a diameter of, for example, 150 mm, as a suction cup. Each of the table 11 attracts the size of the holding surface.
例如，如圖5所示，在以保持機構10吸引保持直徑大的板狀工件W(例如直徑450mm)的情形下，係透過切換部20，使吸引力作用於吸盤工作台11的第1吸引保持面120。具體地說，選擇基台16內部之第1吸引通道17a並連接到分岐管21a，使吸引源19連通到第1吸引保持面120。另外，選擇第1吸引通道17b並連接到分岐管21b，使吸引源19連通到第2吸引保持面121。再者，選擇第1吸引通道17c並連接到分岐管21c，使吸引源19連通到第3吸引保持面122。藉此，可以在吸引力起作用的第1吸引保持面120、第2吸引保持面121以及第3吸引保持面122，吸引保持板狀工件W。 For example, as shown in FIG. 5, when the plate-shaped workpiece W having a large diameter (for example, 450 mm in diameter) is sucked by the holding mechanism 10, the attraction portion is applied to the first suction of the chuck table 11 through the switching portion 20. Hold face 120. Specifically, the first suction passage 17a inside the base 16 is selected and connected to the branching pipe 21a, and the suction source 19 is communicated to the first suction holding surface 120. Further, the first suction passage 17b is selected and connected to the branching pipe 21b, and the suction source 19 is communicated to the second suction holding surface 121. Further, the first suction passage 17c is selected and connected to the branching pipe 21c, and the suction source 19 is communicated to the third suction holding surface 122. Thereby, the plate-shaped workpiece W can be sucked and held by the first suction holding surface 120, the second suction holding surface 121, and the third suction holding surface 122 in which the suction force acts.
之後，一旦將板狀工件W吸引保持在第1吸引保持面120、第2吸引保持面121以及第3吸引保持面122，馬達23就會讓吸盤工作台11在例如，箭頭A的方向旋轉，同時讓吸盤工作台11移動到加工機構5的下方。接著，以圖1中所示之昇降機構6，使加工機構5往加工機構5和吸盤工作台11相對地接近的方向下降。加工機構5一邊透過使主軸50旋轉，讓研磨輪55在例如，箭頭A的方向旋轉，一邊透過昇降機構6使加工機構5往接近吸盤工作台11的方向下降，並且用研磨石56將板狀工件W研磨至達到指定的厚度為止。此時，旋轉的旋轉接合器22之軸心沒有偏離的情形，在旋轉接合 器22中，旋轉振動受到抑制。因此，吸盤工作台11不會振動而安定地旋轉，故而可以良好地研磨板狀工件W。 After that, when the plate-shaped workpiece W is sucked and held by the first suction holding surface 120, the second suction holding surface 121, and the third suction holding surface 122, the motor 23 rotates the chuck table 11 in the direction of, for example, the arrow A. At the same time, the suction cup table 11 is moved to the lower side of the processing mechanism 5. Next, with the elevating mechanism 6 shown in Fig. 1, the processing mechanism 5 is lowered in a direction in which the processing mechanism 5 and the chuck table 11 are relatively close to each other. The processing mechanism 5 rotates the spindle 50 to rotate the grinding wheel 55 in the direction of the arrow A, for example, and lowers the processing mechanism 5 toward the chuck table 11 through the elevating mechanism 6, and the plate is shaped by the grinding stone 56. The workpiece W is ground until it reaches a specified thickness. At this time, the axis of the rotating rotary joint 22 does not deviate, in the rotary joint In the device 22, the rotational vibration is suppressed. Therefore, the chuck table 11 does not vibrate and rotates stably, so that the plate-like workpiece W can be polished well.
本實施態中，雖然針對在吸盤工作台11之第1吸引保持面120、第2吸引保持面121及第3吸保持面122中吸引保持板狀工件W的情形做了說明，但是，構成加工對象的板狀件如果是小尺寸時，只要透過切換部20，選擇第1吸引通道17b和第1吸引通道17c，並且連接到分岐管21b及21c，或僅連接到分岐管21c，讓吸引力作用於第2吸引保持面121及第3吸引保持面122，或僅作用於第3吸引保持面122即可。此外，當選擇第1吸引通道17a~17c當中的一個以上做使用時，宜從未使用之第1吸引通道17a~17c，將分岐管21a~21c先卸除並關上。 In the present embodiment, the case where the plate-shaped workpiece W is sucked and held by the first suction holding surface 120, the second suction holding surface 121, and the third suction holding surface 122 of the chuck table 11 has been described. When the shape of the plate member is small, the first suction passage 17b and the first suction passage 17c are selected through the switching portion 20, and are connected to the branch pipes 21b and 21c, or only to the branch pipe 21c, so that the attraction is attractive. It is sufficient to act on the second suction holding surface 121 and the third suction holding surface 122 or only on the third suction holding surface 122. Further, when one or more of the first suction passages 17a to 17c are selected for use, it is preferable that the branching pipes 21a to 21c are first removed and closed before the first suction passages 17a to 17c that have never been used.
像這樣，加工裝置1具備吸引保持板狀工件的吸引保持機構10，而因為吸引保持機構10組裝成，在吸盤工作台11被裝設之基台16的側部安裝具有分岐管21a,21b及21c之切換部20，並透過切換部20，選擇基台16內部之第1吸引通道17a,17b或17c，切換構成吸引源19之連通端的第1吸引保持面120、121或122，所以，變成不須要在連接於基台16的下端之旋轉接合器22內設置複數個吸引通道，和以往相比，可以簡易地製作旋轉接合器22的構成。因此，在板狀工件W的研磨中，可以防止旋轉振動發生在旋轉的旋轉接合器22的情形，並且因為旋轉振動不會傳達到吸盤工作台11，所以能夠抑制對研磨加工造成不良影響的狀況。 In this manner, the processing apparatus 1 includes the suction holding mechanism 10 that sucks and holds the plate-like workpiece, and the suction holding mechanism 10 is assembled, and the branching pipes 21a and 21b are attached to the side of the base 16 on which the suction cup table 11 is mounted. The switching unit 20 of 21c selects the first suction passages 17a, 17b or 17c inside the base 16 through the switching unit 20, and switches the first suction holding surfaces 120, 121 or 122 constituting the communication end of the suction source 19, so that It is not necessary to provide a plurality of suction passages in the rotary joint 22 connected to the lower end of the base 16, and the rotary adapter 22 can be easily manufactured as compared with the related art. Therefore, in the polishing of the plate-like workpiece W, it is possible to prevent the occurrence of the rotational vibration from occurring in the rotating rotary joint 22, and since the rotational vibration is not transmitted to the suction cup table 11, it is possible to suppress the situation that adversely affects the grinding processing. .
另外，在保持機構10，因為可以依據欲加工之椴 狀工件的被保持面的尺寸，透過切換部20，在基台16側進行第1吸引通道17a~17c進行選擇，使吸引源19連通到所須要的第1吸引保持面120、第2吸引保持面121或第3吸保持面122，所以能夠對吸盤工作台11之吸引保持面的區域做多重設定。以往，吸引保持面的區域多於旋轉接合器的流路數時，要從基台將吸盤工作台取出以關閉不使用的吸引通道，但是，如果用保持機構10，即使設定之吸引保持面的區域比旋轉接合器22的流路220數目多，也不須要從基台16取出吸盤工作台11，而可以切換所需要的第1吸引保持面120、第2吸引保持面121或第3吸保持面122做使用。 In addition, in the holding mechanism 10, because it can be processed according to The size of the surface to be held of the workpiece is transmitted through the switching unit 20, and the first suction passages 17a to 17c are selected on the base 16 side to connect the suction source 19 to the required first suction holding surface 120 and the second suction holding. Since the surface 121 or the third suction holding surface 122 is provided, it is possible to multiplex the area of the suction holding surface of the suction cup table 11. Conventionally, when the area for attracting the holding surface is larger than the number of flow paths of the rotary joint, the suction table is taken out from the base to close the suction passage that is not used. However, if the holding mechanism 10 is used, even the area where the holding surface is suctioned is set. The number of the flow paths 220 of the rotary joint 22 is larger than that of the rotary table 22, and the first suction holding surface 120, the second suction holding surface 121, or the third suction holding surface can be switched. 122 to use.
示於圖6及圖7的保持機構30是吸引保持板狀工件的保持機構之變形例，除了圓形板狀的板狀工件外，也能夠吸引保持矩形的板狀工件。保持機構30具備吸盤工作台31、吸盤工作台31被裝設的基台36，和連接到吸引源19並具有複數個分岐管的2個切換部40,41。 The holding mechanism 30 shown in Figs. 6 and 7 is a modification of the holding mechanism for sucking and holding the plate-like workpiece, and it is also possible to attract a rectangular plate-shaped workpiece in addition to the circular plate-shaped workpiece. The holding mechanism 30 includes a suction table 31, a base 36 on which the suction table 31 is mounted, and two switching units 40, 41 that are connected to the suction source 19 and have a plurality of branch pipes.
吸盤工作台31具備有複數個吸引保持面的矩形保持板32，和使保持板32之吸引保持面露出且圍繞保持板32的周圍加以收容之框體34。保持板32的複數個吸引保持面由被圓環狀的境界部33a,33b及33c區劃成的4個區域構成。亦即，保持板32之吸引保持面係如圖7所示，形成被分別區劃成，包含境界部33a外側的面之四角形的第1吸引保持面320、由境界部33a內側的環狀所形成之第2吸引保持面321、由境界部33b內側的環狀所形成之第3吸引保持面322，和境界部33c內側的環狀所形成之第4吸引保持面323的構 成。此外，吸引保持面的區域數和保持機構10同樣地沒有特殊限制。 The chuck table 31 includes a rectangular holding plate 32 having a plurality of suction holding surfaces, and a frame body 34 that exposes the suction holding surface of the holding plate 32 and is housed around the periphery of the holding plate 32. The plurality of suction holding faces of the holding plate 32 are composed of four regions partitioned by the annular boundary portions 33a, 33b, and 33c. In other words, as shown in FIG. 7, the suction holding surface of the holding plate 32 is formed into a first suction holding surface 320 which is divided into a square shape including a surface on the outer side of the boundary portion 33a, and is formed by a ring shape inside the boundary portion 33a. The second suction holding surface 321 , the third suction holding surface 322 formed by the ring shape inside the boundary portion 33b, and the fourth suction holding surface 323 formed by the ring shape inside the boundary portion 33c to make. Further, the number of regions for attracting the holding surface is similar to the holding mechanism 10 in the same manner.
框體34係如圖6所示，形成有用於嵌入保持板32的嵌合凹部340。在嵌合凹部340的底部具有用於使吸引力作用於保持板32的各個吸引保持面之複數個吸引孔35a,35b,35c及35d。而，如果將保持板32嵌入框體34的嵌合凹部340，吸引孔35a就被定位到第1吸引保持面320的下方側，吸引孔35b被定位到第2吸引保持面321的下方側，吸引孔35c被定位到第3吸引保持面322的下方側，吸引孔35d則是被定位到第4吸引保持面323的下方側，構成了吸盤工作台31。 As shown in FIG. 6, the frame 34 is formed with a fitting recess 340 for inserting the holding plate 32. At the bottom of the fitting recess 340, a plurality of suction holes 35a, 35b, 35c, and 35d for causing suction force to act on the respective suction holding faces of the holding plate 32 are provided. When the holding plate 32 is fitted into the fitting recessed portion 340 of the frame body 34, the suction hole 35a is positioned below the first suction holding surface 320, and the suction hole 35b is positioned below the second suction holding surface 321 . The suction hole 35c is positioned below the third suction holding surface 322, and the suction hole 35d is positioned below the fourth suction holding surface 323 to constitute the suction cup table 31.
基台36具有框體34被裝設的安裝面360，和，用於使裝設在安裝面360之框體34的各個吸引孔35a~35d連通到吸引源19之複數個吸引通道。複數個吸引通道由，連通至吸引孔35a之第1吸引通道37a、連通至吸引孔35b之第1吸引通道37b、連通至吸引孔35c之第1吸引通道37c、連通至吸引孔35d之第1吸引通道37d，和以切換部40,41作為中介而連通至第1吸引通道37a~37c當中的一個以上之第2吸引通道38所構成。和保持機構10同樣地，第2吸引通道38係通過連結於基台36的下端之旋轉接合器22內部的流路220而連通至吸引源19。於旋轉接合器22，和上述保持機構10同樣地，配設了用來使基台36旋轉之旋轉機構。 The base 36 has a mounting surface 360 to which the frame body 34 is mounted, and a plurality of suction passages for connecting the respective suction holes 35a to 35d of the frame body 34 mounted on the mounting surface 360 to the suction source 19. The plurality of suction passages are connected to the first suction passage 37a of the suction hole 35a, the first suction passage 37b that communicates with the suction hole 35b, the first suction passage 37c that communicates with the suction hole 35c, and the first passage that communicates with the suction hole 35d. The suction passage 37d is configured to communicate with one or more of the first suction passages 37a to 37c via the switching portions 40 and 41. Similarly to the holding mechanism 10, the second suction passage 38 communicates with the suction source 19 via the flow path 220 connected to the inside of the rotary joint 22 at the lower end of the base 36. Similarly to the above-described holding mechanism 10, the rotary joint 22 is provided with a rotating mechanism for rotating the base 36.
切換部40,41藉支架27,27a安裝在基台36的側部。切換部40,41有連接於第1吸引通道37a~37d的分岐管42a, 42b,42c及42d。如圖7所示地形成，分岐管42a對應於連通吸引孔35a之第1吸引通道37a，分岐管42b對應於連通吸引孔35b之第1吸引通道37b，分岐管42c對應於連通吸引孔35c之第1吸引通道37c，分岐管42d對應於連通吸引孔35d之第1吸引通道37d的構成。在切換部40,41，和上述之切換部20同樣地，可以透過選擇對應於做為加工對象之板狀工件的被保持面的尺寸之第1吸引通道37a~37d當中的一個以上，並連接到與第1吸引通道37a~37d有對應關係的分岐管42a~42d，使第1吸引保持面320、第2吸引保持面321、第3吸引保持面322或第4吸引保持面323連通至吸引源19。 The switching portions 40, 41 are attached to the side portions of the base 36 by brackets 27, 27a. The switching units 40 and 41 have branching tubes 42a connected to the first suction passages 37a to 37d. 42b, 42c and 42d. As shown in Fig. 7, the branching pipe 42a corresponds to the first suction passage 37a that communicates with the suction hole 35a, the branching pipe 42b corresponds to the first suction passage 37b that communicates with the suction hole 35b, and the branching pipe 42c corresponds to the communication suction hole 35c. The first suction passage 37c and the branching pipe 42d correspond to the configuration of the first suction passage 37d that communicates with the suction hole 35d. In the same manner as the above-described switching unit 20, the switching units 40 and 41 can select one or more of the first suction passages 37a to 37d corresponding to the size of the held surface of the plate-shaped workpiece to be processed, and connect them. The branching pipes 42a to 42d corresponding to the first suction passages 37a to 37d connect the first suction holding surface 320, the second suction holding surface 321, the third suction holding surface 322, or the fourth suction holding surface 323 to the suction. Source 19.
例如，在以保持機構30吸引保持矩形的板狀工件的情形中係，透過切換部40,41，選擇基台36內之第1吸引通道37a並連接到分岐管42a以使吸引源19連通到第1吸引保持面320，選擇第1吸引通道37b並連接到分岐管42b以使吸引源19連通到第2吸引保持面321，選擇第1吸引通道37c並連接到分岐管42c以使吸引源19連通到第3吸引保持面322，選擇第1吸引通道37d並連接到分岐管42d以使吸引源19連通到第4吸引保持面323，從而能夠在吸引力起作用的第1吸引保持面320、第2吸引保持面321、第3吸引保持面322及第4吸引保持面吸引保持板狀工件。像這樣，關於保持機構30也和上述保持機構10同樣地，在圓形板狀或矩形的板狀工件之研磨中，可以防止旋轉振動發生於旋轉接合器22的情形，並且可以抑制對研磨加工造成不良影響的情況。 For example, in the case where the plate-shaped workpiece holding the rectangular shape is sucked by the holding mechanism 30, the first suction passage 37a in the base 36 is selected through the switching portions 40, 41 and connected to the branching pipe 42a to connect the suction source 19 to The first suction holding surface 320 selects the first suction passage 37b and is connected to the branching tube 42b to connect the suction source 19 to the second suction holding surface 321, and selects the first suction passage 37c and connects to the branching tube 42c to make the suction source 19 It is connected to the third suction holding surface 322, and the first suction passage 37d is selected and connected to the branching pipe 42d so that the suction source 19 can communicate with the fourth suction holding surface 323, so that the first suction holding surface 320 in which the suction force acts can be The second suction holding surface 321 , the third suction holding surface 322 , and the fourth suction holding surface suck and hold the plate-shaped workpiece. In the same manner as the above-described holding mechanism 10, the holding mechanism 30 can prevent the occurrence of the rotational vibration from occurring in the rotary joint 22 in the polishing of the circular plate-shaped or rectangular plate-shaped workpiece, and can suppress the grinding process. A situation that causes adverse effects.
本實施態樣中所示之加工裝置1雖然是以研磨裝 置做說明，但是並不限於此構成，例如，也可以將本發明應用在刀尖()切削裝置。 Although the processing apparatus 1 shown in this embodiment is described by a polishing apparatus, it is not limited to this configuration. For example, the present invention can also be applied to a tool tip ( ) Cutting device.
本實施態樣中所示之保持機構10,30雖然是做成能夠旋轉的構成，不過也可以是不旋轉的構成。以往，在不旋轉的吸盤工作台中，為了進行吸引通道的切換作業而將吸盤工作台從基台取出時，會有加工中所使用的加工水等落到裝置內的情形，並不理想，但是，如果用本實施態樣中所示的切換部20,40及41，由於不用將吸盤工作台從基台取出，能夠容易地進行吸引通道的切換作業，因此對於不旋轉的吸盤工作台而言也是有用的。 Although the holding mechanisms 10 and 30 shown in this embodiment are configured to be rotatable, they may be configured to be non-rotating. In the conventional suction cup table that does not rotate, when the suction table is taken out from the base in order to perform the switching operation of the suction passage, the processing water used in the machining or the like falls into the apparatus, which is not preferable. According to the switching units 20, 40, and 41 shown in the present embodiment, since the suction table can be easily taken out without removing the chuck table from the base, the suction table can be easily rotated. It is also useful.
1‧‧‧加工裝置 1‧‧‧Processing device
2‧‧‧裝置機台 2‧‧‧Installation machine
3‧‧‧外蓋 3‧‧‧ Cover
4‧‧‧柱體 4‧‧‧Cylinder
5‧‧‧加工機構 5‧‧‧Processing institutions
6‧‧‧昇降機構 6‧‧‧ Lifting mechanism
10‧‧‧保持機構 10‧‧‧ Keeping institutions
11‧‧‧吸盤工作台 11‧‧‧Sucker Workbench
12‧‧‧保持板 12‧‧‧ Keeping board
14‧‧‧框體 14‧‧‧ frame
16‧‧‧基台 16‧‧‧Abutment
20‧‧‧切換部 20‧‧‧Switching Department
50‧‧‧主軸 50‧‧‧ spindle
51‧‧‧主軸套 51‧‧‧Spindle sleeve
52‧‧‧托座 52‧‧‧ bracket
53‧‧‧馬達 53‧‧‧Motor
54‧‧‧安裝座 54‧‧‧ Mounting
55‧‧‧研磨輪 55‧‧‧ grinding wheel
56‧‧‧研磨石 56‧‧‧ Grinding stone
60‧‧‧滾珠螺桿 60‧‧‧Rolling screw
61‧‧‧馬達 61‧‧‧Motor
62‧‧‧導軌 62‧‧‧rails
63‧‧‧昇降板 63‧‧‧ lifting plate
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015201932A JP6654850B2 (en) | 2015-10-13 | 2015-10-13 | Processing equipment |
| JP2015-201932 | 2015-10-13 |
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| Publication Number | Publication Date |
|---|---|
| TW201715640A true TW201715640A (en) | 2017-05-01 |
| TWI693668B TWI693668B (en) | 2020-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105127516A TWI693668B (en) | 2015-10-13 | 2016-08-26 | Grinding device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6654850B2 (en) |
| TW (1) | TWI693668B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI760551B (en) * | 2017-08-22 | 2022-04-11 | 日商迪思科股份有限公司 | Grinding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108747698B (en) * | 2018-05-21 | 2020-01-21 | 深圳市昌建顺科技有限公司 | Grinding device is used in metal material processing |
| CN109676515B (en) * | 2018-12-26 | 2020-09-11 | 江苏纳沛斯半导体有限公司 | Semiconductor wafer grinding device with cleaning function |
| CN114871911A (en) * | 2022-03-29 | 2022-08-09 | 洛阳领英机械设备有限公司 | Application method of fine machining grinding machine |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS627343U (en) * | 1985-06-24 | 1987-01-17 | ||
| JP2546652B2 (en) * | 1986-09-03 | 1996-10-23 | ロ−ム株式会社 | Check table |
| JPH07231033A (en) * | 1994-02-16 | 1995-08-29 | Nikon Corp | Board holder |
| DE19700839C2 (en) * | 1997-01-13 | 2000-06-08 | Siemens Ag | Chuck arrangement |
| JP2000232083A (en) * | 1999-02-10 | 2000-08-22 | Okamoto Machine Tool Works Ltd | Universal chucking mechanism for semiconductor wafer |
| JP2003257909A (en) * | 2002-03-04 | 2003-09-12 | Nippei Toyama Corp | Processing device of semiconductor wafer |
| US8336188B2 (en) * | 2008-07-17 | 2012-12-25 | Formfactor, Inc. | Thin wafer chuck |
| JP5932457B2 (en) * | 2012-04-24 | 2016-06-08 | 株式会社ディスコ | Chuck table and processing apparatus including the chuck table |
| JP2016532282A (en) * | 2013-09-26 | 2016-10-13 | ズス・マイクロテック・リソグラフィ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＳｕｓｓ ＭｉｃｒｏＴｅｃ Ｌｉｔｈｏｇｒａｐｈｙ ＧｍｂＨ | Chuck for sucking and holding wafers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI760551B (en) * | 2017-08-22 | 2022-04-11 | 日商迪思科股份有限公司 | Grinding method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI693668B (en) | 2020-05-11 |
| JP2017074628A (en) | 2017-04-20 |
| JP6654850B2 (en) | 2020-02-26 |
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