KR20160013304A

KR20160013304A - a local polishing machine for coating remover

Info

Publication number: KR20160013304A
Application number: KR1020140093892A
Authority: KR
Inventors: 최동운; 김정환
Original assignee: 주식회사 디엠테크
Priority date: 2014-07-24
Filing date: 2014-07-24
Publication date: 2016-02-04

Abstract

The present invention relates to an automatic polishing apparatus for locally removing a thin coating film for displaying a special mark displayed on a circuit board, and more particularly, to a polishing apparatus for polishing a circuit board supplied on a work bench by a vision camera, , And the coating film is locally polished while being moved in the Y-axis direction so that a special mark can be seen clearly.
The present invention is characterized in that a circuit board 1 placed on a work table 11 composed of an air chamber is sucked and fixed and a first ball nut 11a fixed to a lower portion of the work table 11 A base portion 10 coupled to the one lead screw 11b and moved in the forward and backward directions; A driving motor 22 is vertically mounted on the moving table 21 mounted on the top of the work table 11 and a grinding stone 23 coupled to the rotating shaft 22a of the driving motor 22 is mounted on the circuit board 1, And a second ball nut 21a fixed to the rear of the moving table 21 is coupled to the second lead screw 21b to be moved in both lateral directions; A vision camera (30) mounted on the moving table (21) and photographing the circuit board (1); A first loading section 40A and a first loading section 50A mounted on one side of the work table 11; The circuit board 1 stacked on the first stacking portion 40A is constituted by a second stacking portion 40B and a second stacking portion 50B mounted on the other side of the work table 11, The polishing section 20 partially polishes the surface of the circuit board 1 and the processed circuit board 1 is transported to the second loading section 50B by the second transfer section 50B, 40B, and stacked on the circuit board 40B.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to an automatic polishing apparatus for locally removing a thin coating film for displaying a special mark displayed on a circuit board, and more particularly, to a polishing apparatus for polishing a circuit board supplied on a work bench by a vision camera, , And the coating film is locally polished while being moved in the Y-axis direction so that a special mark can be seen clearly.

In recent years, high density and high mounting of a package, which is a core device, have become important factors in the trend of miniaturization, light weight and high density of electronic devices (electronic devices). In order to secure competitiveness of semiconductor packages, Circuit boards are often used.

Such a matrix type circuit board is configured such that when the package is put into an assembly line after the manufacture of the package is completed, the package is separated and used. In order to accurately classify the package, the circuit board is configured to be aligned and separated by a special mark .

However, when a circuit board is manufactured, coatings are coated on the surface of the mark for insulation and protection, so that the coating is coated on the surface of the mark, and the mark is not clearly identified.

Conventionally, when a coating film is coated, it is coated with a protective tape attached to the surface of a special mark, and then the protective tape is peeled off separately by manual operation. Thus, the efficiency of the operation is significantly reduced, Could not be raised.

Conventional prior art is Patent Publication No. 10-2010-0040607 "method for producing a polishing brush, and a printed circuit board for using the same", and have been proposed, the prior art is to machine a trench in an insulating layer applied to the base substrate step; Forming a plating layer on the insulating layer including the trench; Polishing the plated layer to planarize the plated layer with an abrading brush including an outer core having a hardness larger than that of the inner core on the inner core formed on the outer surface of the rotating shaft, and etching the plated layer to the surface of the insulating layer .

However, since the prior art is a technique of polishing the base substrate as a whole in order to planarize the plating layer with the polishing brush and the polishing brush is composed of the outer core having a hardness larger than that of the inner core, I could not find a technique that made the special mark look good by polishing it.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a polishing apparatus and a workbench which are moved in X and Y axis directions to automatically polish a coating film And a coating film local polishing apparatus of a circuit board which can be removed.

In order to achieve the above object, the present invention is characterized in that a circuit board (1) placed on a work table (11) composed of an air chamber is fixed by suction, and a first ball nut (10) coupled to the first lead screw (11b) so that the first lead screw (11a) is moved in the forward and backward directions; A driving motor 22 is vertically mounted on the moving table 21 mounted on the top of the work table 11 and a grinding stone 23 coupled to the rotating shaft 22a of the driving motor 22 is mounted on the circuit board 1, And a second ball nut 21a fixed to the rear of the moving table 21 is coupled to the second lead screw 21b to be moved in both lateral directions; A vision camera (30) mounted on the moving table (21) and photographing the circuit board (1); A first loading section 40A and a first loading section 50A mounted on one side of the work table 11; The circuit board 1 stacked on the first stacking portion 40A is constituted by a second stacking portion 40B and a second stacking portion 50B mounted on the other side of the work table 11, The polishing section 20 partially polishes the surface of the circuit board 1 and the processed circuit board 1 is transported to the second loading section 50B by the second transfer section 50B, 40B, and stacked on the circuit substrate. The present invention can be achieved by a coating film local polishing apparatus for a circuit board.

As described above, according to the present invention as described above, the circuit boards 1 stacked on the first stacking portion 40A are transferred to the work table 11 by the first transferring portion 50A, When the work table 11 and the moving table 21 are moved in the X and Y axis directions by photographing the substrate 1 to determine the working position, the grinding stone 23 of the polishing section 20 is rotated, The surface is partially polished so that the special mark 1a can be seen clearly and the circuit board 1 processed by the second transfer section 50B is transferred to the second stacking section 40B and stacked. Since the process is automated, the defect rate is minimized and the polishing process of the exact thickness is carried out, so that the coated film can be partially removed. As a result, the factory automation facility can be installed and the labor efficiency can be saved. Sexuality) that can increase Competitiveness is excellent and there is an advantage such as to provide the polishing of a substrate coating apparatus of the functional circuit.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic diagram illustrating an embodiment of the present invention,
FIGS. 2A and 2B are front views illustrating an operating state of the base portion and the abrasive machining portion according to the present invention,
3 is a side view illustrating a base part and a polishing part according to the present invention,
Fig. 4 is a perspective view of a polishing portion according to the present invention,
Fig. 5 is an exploded perspective view of the abrasive machining portion according to the present invention,
6A to 6C are front views illustrating an operation state of the first and second stacking units and the first and second transport units according to the present invention,
7A and 7B are side views illustrating an operation state of the first and second stacking units and the first and second transport units according to the present invention,
8 is a plan view illustrating a circuit board according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 8, the present invention is characterized in that the base portion 10 on which the circuit board 1 is placed and processed, the polishing portion 20 for processing the circuit board 1, the circuit boards 1 First and second stacking units 40A and 40B for stacking and first and second transferring units 50A and 50B for transferring the circuit board 1. [

The work table 11 of the base unit 10 is constituted by an air chamber and the work table 11 is connected to an air pump (not shown) by a hose 12, So that the circuit board 1 can be attracted and fixed. Of course, the top plate of the work table 11 has a number of holes through which air can be sucked.

A first ball nut 11a is fixed to a lower portion of the work table 11. The first ball nut 11a is coupled to a first lead screw 11b rotated by a first motor 11c, Quot; X "axis).

The movable table 21 constituting the abrasive machining section 20 is provided on the upper portion of the work table 11 and the drive motor 22 is vertically mounted on the movable table 21. [

A grinding stone 23 is coupled to the rotating shaft 22a of the driving motor 22. The grinding stone 23 is rotated at a high speed to partly polish the circuit board 1 to form a surface As shown in Fig.

The duct 26 is connected to an air pump (not shown) by a hose 26b and is connected to the grinding stone 23 by a working operation of the grinding stone 23, A soft packing 26a is mounted on the lower circumference of the duct 26 to seal the circuit board 1 with the packing 26a so that the inside of the duct 26 So that dust can be sucked and treated efficiently.

The through hole 23a is formed at the center of the bottom surface of the grinding stone 23 and the through hole 23a is formed by forming the through hole 23a in consideration of the weak wear of the central portion when the grinding stone 23 rotates, So that polishing can be performed.

The grinding stone 23 is coupled to the lower portion of the coupling 24 coupled to the rotary shaft 22a and is lifted and rotated.

That is, the coupling 24 is constituted by a pipe, and when the coupling 24 is moved up and down by the operation of the lifting cylinder 25 mounted on the moving table 21 while being fitted to the lower portion of the rotating shaft 22a And the fixing pin 24b passing through the elongated hole 24a formed in the coupling 24 is fixed to the rotary shaft 22a.

Therefore, when the rotary shaft 22a is rotated by the operation of the driving motor 22, the coupling 24 is caught by the fixing pin 24b passing through the slot 24a, so that the coupling 24 and the rotary shaft 22a When the coupling 24 is lifted and lowered by the lifting cylinder 25, the elongated hole 24a of the coupling 24 is lifted and lowered along the fixing pin 24a, (23) is rotated and elevated.

A second ball nut 21a is fixed to the rear of the moving table 21. The second ball nut 21a is coupled to a second lead screw 21b rotated by the second motor 21c, ("Y" axis).

The vision camera 30 is mounted on the movable table 21 and the vision camera 30 photographs the circuit board 1 to grasp the position of the work table and mounts the work table 11 and the movable table 21 on X, Y axis direction to cut the surface coating of the special mark 1a.

A first mounting portion 40A is mounted on one side of the work table 11, and circuit boards 1 which are not machined are mounted on the first mounting portion 40A.

The first loading section 40A includes a rack mounted vertically on the bottom surface of the pedestal 42 and supported by a guide rod 41a supported by a pedestal 42 mounted on an upper portion of the support frame 41, And the rotation of the pinion 43a is changed into a rectilinear motion so that the pedestal 42 is slowly raised and lowered together with the rack 42a.

The height of the circuit board 1 mounted on the pedestal 42 of the first loading unit 40A is gradually increased to be reduced so that the height of the circuit board 1 can be kept constant.

The second mounting portion 40B is mounted on the other side of the work table 11 and the circuit boards 1 which have been machined are stacked and stacked on the second mounting portion 40B.

The second stacking portion 40B has the same structure as the first stacking portion 40A and is gradually lowered along the height of the circuit board 1 stacked on the pedestal 42 to adjust the height of the circuit board 1 So that it can be kept constant.

The first transfer part 50A is mounted on the upper part of the first mounting part 40A on one side of the work table 11 and the circuit board 1 on which the polishing operation is not performed is mounted on the work table 11, respectively.

In the first transfer part 50A, the operating rod 51 coupled to the rod of the first cylinder 51a is moved along the guide rail 51b, and the elevating frame 52 is mounted on the operating rod 51 The suction cups 53 connected to the air pump are mounted on the lifting frame 52 to pick up the circuit board 1 and lift it up from the first loading unit 40A to the work table 11) so as to be lowered.

The second transfer part 50B is mounted on the upper part of the other second loading part 40B of the work table 11 and the circuit boards 1 which have been processed are mounted on the work table 11 by the second transfer part 50B. To the second loading unit 40B.

The second conveying section 50B has the same configuration as that of the first conveying section 50A and the suction ports 53 of the second conveying section 50B adsorb the circuit board 1 that has been processed in the work table 11 And can be transported to the second loading section 40B for loading and unloading.

The circuit board 1 stacked on the first stacking portion 40A is transferred to the work table 11 by the first transferring portion 50A so that the vision camera 30 can transfer the special mark The work table 11 and the moving table 21 are moved in the X and Y axis directions to determine the working position and the grinding stone 23 of the polishing table 20 is rotated to rotate the circuit board 1, The surface of the circuit board 1 processed by the second transfer section 50B is transferred to and stacked on the second stacking section 40B when the surface of the second transfer section 50B is partially polished and polished so that the special mark 1a can be seen clearly. Since the process is completed automatically, the defect rate is minimized and accurate grinding work can be done, which can increase the productivity (productivity). Since factory automation is possible, it is possible to reduce the labor cost and improve the efficiency of the work The coating film of the circuit board It is possible to maximize the external competitiveness of the local polishing apparatus for removing the polishing pad.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the scope of the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be resorted to without departing from the scope of the appended claims.

1: Circuit board 1a: Special mark
10: base part 11: work table
11a: first ball nut 11b: first lead screw
11c: first motor 12: hose
20: abrasive machining part 21:
21a: first ball nut 21b: first lead screw
21c: second motor 22: drive motor
22a: rotating shaft 23:
23a: through hole 24: coupling
24a: Long hole 24b: Fixing pin
25: lift cylinder 26: duct
26a: packing 26b: hose
30: vision camera 40A: first loading section
40B: second loading section 41: support frame
41a: guide rod 42: pedestal
42a: Rack 43: Deceleration motor
43a: Pinion 50A: First conveyance part
50B: second transfer part 51:
51a: first cylinder 51b: guide rail
52: lift frame 52a: second cylinder
53:

Claims

A circuit board 1 placed on a work table 11 composed of an air chamber is sucked and fixed and a first ball nut 11a fixed to a lower portion of the work table 11 is coupled to a first lead screw 11b A base portion 10 which is moved in the longitudinal direction;
A driving motor 22 is vertically mounted on the moving table 21 mounted on the top of the work table 11 and a grinding stone 23 coupled to the rotating shaft 22a of the driving motor 22 is mounted on the circuit board 1, And a second ball nut 21a fixed to the rear of the moving table 21 is coupled to the second lead screw 21b to be moved in both lateral directions;
A vision camera (30) mounted on the moving table (21) and photographing the circuit board (1);
A first loading section 40A and a first loading section 50A mounted on one side of the work table 11;
A second loading section 40B mounted on the other side of the work table 11, and a second transfer section 50B,
The circuit board 1 stacked on the first stacking portion 40A is transferred to the workbench 11 by the operation of the first transferring portion 50A so that the surface of the circuit board 1 is partially polished , And the processed circuit board (1) is configured to be transported to and stacked on the second loading section (40B) by the second transfer section (50B).

The method according to claim 1,
A through hole 23a is bored in the center of the bottom of the grinding stone 23 and a duct 26 is opened to the outside of the grinding stone 23 and the duct 26 is connected to the air pump and the hose 26b The dust generated by the machining operation of the grinding stone 23 is connected to the duct 26 and the flexible packing 26a is mounted around the lower portion of the duct 26 so that the packing 26a can be closely attached to the circuit board 1. [ Wherein the coating layer is formed on the substrate.

2. The apparatus according to claim 1, wherein the grinding stone (23) is coupled to a lower portion of a coupling (24) coupled to a rotary shaft (22a)
The coupling 24 is constituted by a tube and is fitted to the lower portion of the rotary shaft 22a and the coupling 24 is lifted and lowered by the operation of the lifting cylinder 25 mounted on the moving table 21, When the fixing pin 24b passing through the slot 24a opened in the ring 24 is fixed to the rotary shaft 22a and the coupling 24 is lifted and lowered by the operation of the lifting cylinder 25, 24. The apparatus of claim 22, wherein the slot is formed in a shape of a rectangular parallelepiped.

[2] The apparatus according to claim 1, wherein the first loading part (40A) and the second loading part (40B) mounted on one side and the other side of the work table (11)
A rack 42a vertically fixed to the bottom surface of the pedestal 42 is supported by the power of the decelerating motor 43. The rack 42a is supported by the guide rods 41a, And the pedestal (42) is gradually raised and lowered together with the rack (42a) while being engaged with the pinion (43a) to be rotated.

The apparatus according to claim 1, wherein the first transfer part (50A) and the second transfer part (50B) mounted on one side and the other side of the work table (11)
The operating rod 51 coupled to the rod of the first cylinder 51a is moved along the guide rail 51b and the lifting frame 52 is mounted on the operating rod 51 and the operation of the second cylinder 52a And suction cups 53 connected to the air pump are mounted on the lifting frame 52 to pick up and pick up the circuit board 1 and to lift the work table 11 and the second loading unit 40B from the first loading unit 40A ) To be lowered to be lowered.