TW201715292A - Method of making composite magnetic mask for vapor deposition - Google Patents

Abstract

A method of making a composite magnetic mask for vapor deposition is provided, wherein an organic layer constituting the magnetic mask is very thin, and an opening of the magnetic mask is very small, so that the magnetic mask can be used for vapor deposition to form high-resolution OLED products.

Description

Composite magnetic mask for vapor deposition

The invention belongs to the display panel industry, and relates to a mask for vapor deposition used in the process of manufacturing an OLED display panel, and particularly relates to a method for fabricating a magnetic mask for vapor deposition.

Organic Light-Emitting Diode (OLED) has no backlight, high contrast, thin thickness, wide viewing angle, fast response, and can be used for flexible panels and temperature. It is considered to be the next generation of flat panel display emerging application technology due to its wide range, simple structure and simple process.

The most important part of the OLED production process is to deposit the organic layer onto the substrate according to the requirements of the driving matrix to form a key illuminating display unit. OLED is a solid material, and the development of high-precision coating technology is the key to restricting the productization of OLED. At present, this work is mainly carried out by vacuum deposition or vacuum thermal evaporation (VTE), in which the organic molecules located in the vacuum chamber are slightly heated (evaporated), so that these molecules are condensed in the form of a thin film on a substrate having a lower temperature. on. In this process, a high-precision mask suitable for the accuracy of the OLED light-emitting display unit is required as a medium.

As shown in FIG. 1 , it is a schematic structural view of a mask for OLED evaporation, and a mask 11 having a mask pattern 10 is fixed on the outer frame 12 , wherein the mask 11 and the outer frame 12 are made of a metal material. As shown in FIG. 2, it is an enlarged cross-sectional view in the direction of AA in FIG. 1, 20 is a mask portion, and 21 is a mask opening during vapor deposition of an organic material. Since the mask 11 is generally formed by etching a metal foil, the composition is as follows. The size of the mask portion (20) and the opening (21) of the mask pattern (10) may be limited by the thickness h (h is generally greater than 30 μm) of the foil itself and the technical limit, thereby limiting the resolution of the final OLED product; In other words, the width dimension d1 of the opening (21) is difficult to further reduce (it is very difficult to make an opening with a d1 of less than 30um at present), and even if it is small, the opening of a large aspect ratio cannot satisfy the high-quality evaporation process. . In addition, if a large-sized mask is produced, the metal-type mask body 11 will have a large quality, which may cause the mask body 11 to sag (ie, a concave phenomenon may occur in the middle of the board surface), which is accurate. A higher mask evaporation process is disadvantageous. In view of this, there is a need in the industry for a solution that can solve this problem.

In view of the above, the present invention provides a method for fabricating a magnetic mask for vapor deposition, and the mask formed by the method can effectively overcome the above problems, and the specific technical solutions are as follows.

A method for manufacturing a composite magnetic mask for vapor deposition, comprising the steps of:

S1, a metal support layer is electroformed, and a metal support layer having a certain thickness is formed. The metal support layer is provided with a specific window structure, and the metal support layer is fabricated by electroforming technology, and the electroforming technology includes :

S11, preparing the substrate, and selecting an electroformed deposition substrate with a clean surface;

S12, film, pressing or coating a photosensitive film on a surface of the deposition substrate to form a photosensitive film layer;

S13, exposing, exposing a specific area of the photosensitive film layer in S12, the exposed area of the photosensitive film layer is the area where the window structure is located, and the photosensitive film of other areas outside the window structure is not exposed;

S14, developing, developing the photosensitive film layer after the exposure process in step S13, removing the photosensitive film in the unexposed area to form a deposition area to be electroformed;

S15, electroforming, electroforming the electroformed deposition substrate after the development process is placed in an electroforming tank to form a metal support layer having a window structure;

S2, a surface of the metal support layer is coated, and a surface of the metal support layer having a window structure is coated with a photoresist having a certain thickness to form a photoresist film layer;

S3, exposing the photoresist film layer, performing exposure processing on one side of the metal support layer having the photoresist film layer, exposing the predetermined region, forming a photoresist exposure region and a photoresist non-exposure region on the photoresist film layer ;

S4, developing the photoresist film layer, removing the photoresist in the photoresist non-exposed area in the step S3 by development, retaining the photoresist of the photoresist exposed region, and developing a photoresist film layer having an open structure to form the vapor deposition. a mask layer using a composite magnetic mask;

In the present invention, the metal supporting layer and the photoresist film layer having an opening structure constitute the composite magnetic mask, the opening structure formed on the mask layer and the photoresist non-exposed area in the step S3 Correspondingly, the opening structure formed on the mask layer is inside the window structure of the metal supporting layer, and each window structure on the metal supporting layer has at least one opening structure.

Further, after the S15 electroforming step in the S1 metal support layer electroforming, the method further comprises:

In the film-removing step, the metal supporting layer is subjected to a film-removing treatment, and the photosensitive film inside the metal supporting layer window structure is completely removed.

Further, before or after the step of removing the film, the method further comprises:

In a stripping step, the metal support layer is peeled off from the electroformed deposition substrate.

Further, after the developing step of the S4 photoresist film layer, the method further includes: a peeling step of peeling off the mask layer of the composite magnetic mask for vapor deposition from the electroformed deposition substrate.

Further, after the developing step of the S4 photoresist film layer, the method further comprises: a baking curing step of forming the composite magnetic mask plate in the oven after the S4 photoresist film layer development step to perform baking curing.

Further, the thickness of the photoresist film layer is not greater than the thickness of the metal support layer.

Further, in the S15 electroforming step, the thickness of the metal supporting layer formed by the electroforming is greater than the thickness of the photosensitive dry film in the S12 filming step, and the formed metal supporting layer has a shrinkable window structure.

Further, the window structures on the metal supporting layer are arranged in an array manner.

Further, in the step of coating the surface of the S2 metal supporting layer, the film is coated by a photoresist film or a photoresist film coating method.

Further, the thickness of the metal supporting layer ranges from 20 to 60 μm; the thickness of the mask layer ranges from 2 to 20 μm; and the size of the opening structure formed on the mask layer ranges from 15 to 40 μm.

Preferably, the material of the metal supporting layer in the present invention is a nickel-based alloy such as a nickel-iron alloy.

According to the prior art of the present patent, the constituent materials of the conventional mask are all metal alloys, and the present invention provides a method for fabricating a mask completely different from the existing etching technique, and the magnetic mask produced by the method has the following Advantages: Due to the role of the metal mask support layer, the organic mask layer constituting the mask can be made very thin, so that the width dimension of the opening is further increased under the premise that the opening of the mask layer has a small aspect ratio. Made smaller, so that the final magnetic mask formed can be evaporated to form a higher resolution OLED product; and because of the high precision of electroforming, the metal mask support layer provided by electroforming has a higher Positional accuracy, which in turn ensures a high positional accuracy of the final reticle for better adaptation to evaporation applications.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "back", "inside", "outside", "horizontal", " The orientation or positional relationship of the vertical or the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present invention and the simplified description, and does not indicate or imply that the device or component referred to has a specific orientation. The specific orientation and operation are not to be construed as limiting the invention.

The method for fabricating the magnetic mask of the present invention will be described below with reference to the drawings, as shown in FIG. 3, which is a magnetic mask manufacturing process provided by the present invention; as shown in FIGS. 4 to 7, the present invention is provided. Method A schematic diagram of several different embodiments of mask fabrication. 4 to 7, 40 is an electroformed deposition substrate, 400 is a photosensitive film layer, 401 is an exposed area on the photosensitive film layer 400, 402 is an unexposed area, 403 is an electroformed deposition area, and 41 is electroforming. The metal support layer is formed, 410 is a metal support layer upper window structure, 42 is a photoresist film layer, 420 is an opening structure on the photoresist film layer 42, 421 is a photoresist exposure region, and 422 is a photoresist non-exposure region.

As shown in FIG. 3, the magnetic mask manufacturing process provided by the present invention comprises the steps of: S1, metal support layer electroforming; S2, metal support layer surface coating; S3, photoresist film exposure; S4, photoresist film Layer development.

Embodiment 1

Referring to Figure 4, an embodiment of the present invention is developed as follows:

S1, the metal support layer is electroformed to produce a metal support layer 41 having a certain thickness. The metal support layer 41 is provided with a specific window structure 410. The metal support layer 41 is made by electroforming technology. The specific electroforming technology includes:

S11, the substrate is prepared, and the electroformed deposition substrate 40 with a clean surface is selected;

S12, film, a surface of the deposition substrate 40 is pressed or coated with a photosensitive film to form a photosensitive film layer 400;

S13, exposing, exposing a specific region of the photosensitive film layer 400 in S12, the exposed region 401 of the photosensitive film layer is the region where the window structure 410 is located, and the photosensitive film of the other region 402 outside the window structure 410 is not exposed;

S14, development, the photosensitive film layer 400 after the exposure process of S13 step is developed, the photosensitive film of the unexposed area 402 is removed, forming a deposition area 403 to be electroformed;

S15, electroforming, the electroformed deposition substrate 40 after development processing is electroformed in an electroforming tank, and a metal support layer 41 having a window structure 410 is formed on the electroformed deposition area 403;

S2, a metal support layer surface coating, a surface of the metal support layer 41 having the window structure 410 is coated with a photoresist having a certain thickness to form a photoresist film layer 42;

S3, the photoresist film layer is exposed, and the metal support layer 41 is exposed on one side of the photoresist film layer 42 to expose the predetermined region, and the photoresist exposed region 421 and the photoresist non-exposed region are formed on the photoresist film layer 42. 422;

S4, developing the photoresist film layer, removing the photoresist in the photoresist non-exposed region 422 in the step S3 by development, leaving the photoresist of the photoresist exposure region 421, and forming a photoresist film layer 42 having an opening structure 420 after development. a mask layer of a composite magnetic mask for vapor deposition of the present invention;

In the present invention, the metal supporting layer 41 and the photoresist film layer 42 having the opening structure 420 constitute the composite magnetic mask of the present invention, and the opening structure 420 formed on the mask layer is opposite to the photoresist non-exposed region 422 in the step S3. Correspondingly, the opening structure 420 formed on the mask layer is inside the window structure 410 of the metal supporting layer 41 (the area of the opening structure 420 is smaller than the area of the corresponding window structure 410), and at least the inside of each window structure 410 on the metal supporting layer 41 is at least There is an opening structure 420. Specifically, in the first embodiment, each of the window structures 410 has an opening structure 420 inside.

In the first embodiment, after the S15 electroforming step, the method further comprises:

In the fading step (not shown), the metal supporting layer 41 is subjected to a fading process, and the photosensitive film inside the window structure 410 of the metal supporting layer 41 (that is, the photosensitive film of the exposed region 401) is completely removed.

In the first embodiment, before or after the fading step, the method further comprises:

A stripping step (not shown) separates the metal supporting layer 41 from the electroformed deposition substrate 40.

In some embodiments, the present invention further comprises, after the step of developing the S4 photoresist layer:

a baking curing step (not shown), the composite magnetic mask formed after the S4 photoresist film development step is placed in an oven for baking and curing, so that the photoresist film layer 42 has more stable performance. And a good bonding force with the metal support layer 41.

In order to better embody the advantages of the present invention, the thickness of the photoresist film layer 42 in the present invention is not greater than the thickness of the metal support layer 41. The mask plate produced by the present invention is used for vapor deposition, and the evaporation effect is directly determined by the mask. The opening structure 420 of the mask layer (ie, the photoresist film layer having an open structure), the thinner photoresist film layer 42 can greatly reduce the influence of the mask opening on the evaporation.

In this embodiment, as a disclosure of other technical details of the present invention, in order to adapt to the arrangement of the graphics elements on the OLED display screen in the later stage, the window structure 410 on the metal supporting layer 41 of the magnetic mask board prepared by the present invention is arranged in an array manner. Correspondingly, the opening structures 420 disposed on the mask layer are also arranged in an array manner (further expanded later).

In the present invention, in the step of coating the surface of the S2 metal support layer, the film is coated by a photoresist film or a photoresist film by a photoresist film. Wherein, the photoresist dry film is used for the overmolding method, that is, the photoresist is pre-formed into a dry film of a certain thickness, and then the photoresist dry film is attached to the surface of the metal support layer by pressing; the photoresist is coated with a photoresist The overmolding method is to uniformly coat the emulsion-like wet film on the surface of the metal supporting layer by mechanical coating.

In addition, as a limitation on the thickness of each layer constituting the magnetic mask in the present invention, the thickness of the metal supporting layer 41 ranges from 20 to 60 μm; the thickness of the mask layer (ie, the thickness of the photoresist film layer 42) ranges from: 2-20 μm. As a preferred embodiment, the thickness of the support layer 41 is 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, and the thickness of the photoresist film layer 42 is 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, and 18 μm. Of course, it can be understood that, in the actual application process, the thickness range of the metal supporting layer 41 is not limited to 20-60 μm, and the thickness of the mask layer (ie, the thickness of the photoresist film layer 42) is not limited to 2. -20 μm.

In the present invention, the opening structure formed on the mask layer serves as a final definition of the evaporation quality of the organic material during the evaporation application. As a preferred embodiment, in the embodiment, the size of the opening structure 420 formed on the mask layer is 15-40 μm can be specifically designed to be 18 μm, 20 μm, 25 μm, 30 μm, and 35 μm.

In the present invention, the metal supporting layer is formed by electroforming, and the material thereof is a nickel-based alloy such as a nickel-iron alloy.

Embodiment 2

As a second embodiment of the present invention, as shown in FIG. 5, it differs from the first embodiment in that, in the first embodiment, each of the window structures 410 on the metal supporting layer 41 has only one opening structure 420 therein; Each of the window structures 410 has a plurality of open structures 420 therein.

Embodiment 3

As a third embodiment of the present invention, as shown in FIG. 6, it is different from the first embodiment and the second embodiment. The "peeling step" in the first embodiment and the second embodiment is performed after the electroforming technology is completed (that is, the surface of the metal supporting layer). The film coating step S2 is completed before; in the present embodiment, the "peeling step" (as step S5) is after the S4 photoresist film layer development step. Such a design can prevent better avoidance of damage such as creases in the metal support layer 41 having a thin thickness during the fabrication of the mask.

Embodiment 4

The present embodiment is different from the previous three embodiments, as shown in FIG. 7. In the present embodiment, when electroforming a metal support layer, the thickness of the electroformed deposition is greater than the thickness of the photosensitive dry film in the S12 filming step, and the formed The metal support layer has a shrinkable window structure. As shown in FIG. 7, since the thickness of the electroformed deposition is larger than the thickness of the photosensitive film 40, a certain shrinkage occurs at the upper end of the window structure 410 when the metal supporting layer 41 is formed. Such a design can increase the adhesion area between the metal supporting layer 41 and the photoresist film layer 42 while reducing the influence of the metal supporting layer 41 on the vapor deposition, thereby effectively improving the life of the mask.

In order to better understand the present invention, the following is a detailed demonstration of some of the product structures formed by the present invention.

8 to 12 show a related embodiment of a magnetic mask produced by the technical solution provided by the present invention, which is specifically developed as follows:

8 is a schematic overall view of a magnetic mask produced by the method of the present invention; FIG. 9 is a cross-sectional view taken along line BB of FIG. 8; and FIG. 10 is an overall schematic view of a mask layer constituting a magnetic mask. FIG. 11 is a schematic overall view of a metal supporting layer constituting a magnetic mask; FIG. 12 is an enlarged schematic view showing a region I of FIG.

8 is a schematic overall view of a magnetic mask produced by the method of the present invention. A schematic cross-sectional view is shown in FIG. 9. The magnetic mask 30 is composed of a two-layer structure of a photoresist film layer 42 and a metal support layer 41. The resist layer 42 is provided with a plurality of opening units 311 formed by an array of opening structures 420. As shown in FIG. 12, the width d2 of the gap 312 between the adjacent two opening units 311 is larger than the spacing d3 between the adjacent two opening structures 420 in the same opening unit 311; the metal supporting layer 41 serves as a carrier of the photoresist film layer 42, The metal support layer 41 is provided with a plurality of hollowed window structures 410, which are distinguished by a plurality of internal staggered support bars 411, as shown in FIG. The photoresist film layer 42 of the magnetic mask 30 is closely adhered to the metal supporting layer 41, and the opening unit 311 of the photoresist film layer 42 corresponds to the window structure 410 of the metal supporting layer 41, that is, as shown in FIG. The opening unit 311 composed of the opening structure 420 corresponds to the position of the corresponding window structure 410. The support bars 411 of the metal supporting layer 41 are disposed on the gap 312 formed between the adjacent two opening units 311 on the photoresist film layer 42. As shown in FIGS. 9 and 12, the position of the support bar 411 is between the opening unit 311 and the opening unit 311. The gap 312 position corresponds. The width of the support strip 411 is adapted to the width of the gap 312 formed between the adjacent two opening units 311 on the photoresist film layer 42, and the metal support layer 41 does not block the opening structure 420 of the photoresist film layer 42. As shown in FIG. 12, the width d4 of the support bar 411 is not greater than the width d2 of the gap 312 between the corresponding adjacent two opening cells 311.

As a specific embodiment, the aperture layer 311 of the mask layer of the magnetic mask and the hollow window of the metal supporting layer 41 form an array of 4*3, as shown in FIG. 10 and FIG. 11, the positions of the opening unit 311 are one by one. Corresponds to the position of the window structure 410.

13 to 17 are schematic views showing an embodiment of another different magnetic mask produced by the technical solution provided by the present invention. 13 is an overall schematic view of a magnetic mask; FIG. 14 is an enlarged schematic view of a portion I of FIG. 13; FIG. 15 is a schematic cross-sectional view of the BB direction of FIG. 14; Another structurally similar schematic.

As shown in FIG. 14 to FIG. 16 , in the present embodiment, the window structure 410 of the magnetic mask metal support layer 41 and the opening structure 420 of the photoresist film layer 42 have a one-to-one correspondence, that is, each window structure 410 is internally provided with a The opening structure 420 is integrally formed in an array.

Different from FIG. 14 to FIG. 16, each of the window structures 410 in the embodiment shown in FIG. 17 is internally provided with two opening structures 420.

Based on the above, the mask structure fabricated by the technical solution provided by the present invention may also have a window structure corresponding to three opening structures 420, and even one window structure corresponds to more opening structures 420.

Figure 18 is a schematic view showing the vapor deposition of an organic material using the magnetic mask of the present invention. In the sealed chamber, the mask 30 mounted on the outer frame 12 is fixed to the fixing mechanism 81 by the outer frame 12, and the upper portion of the mask 30 is disposed. The substrate 80 to be vapor-deposited is provided with an organic vapor deposition source 82. The organic material in the organic evaporation source 82 is diffused into the chamber by evaporation, and the diffused organic material is deposited on the substrate 80 through the hollow opening of the mask 30. An organic light emitting layer is formed. A magnetic adsorption device is generally disposed behind the substrate.

The mask plate according to the present invention retains a metal layer structure, which has the magnetic properties of the conventional mask plate, and can be adsorbed by the magnetic adsorption device behind the substrate in the later application process, thereby further reducing the amount of sag of the mask.

In addition, according to the prior art in the prior art, the constituent materials of the conventional mask are all metal alloys, and the present invention provides a method for fabricating a mask completely different from the existing etching technology, and the magnetic mask produced by the method is provided. The utility model has the following advantages: the organic mask layer constituting the mask can be made thin due to the function of the metal mask supporting layer, so that the opening of the opening is further ensured under the premise that the opening of the mask layer has a small aspect ratio The width dimension is made smaller so that the resulting final magnetic mask can be evaporated to form a higher resolution OLED product.

Specifically, the mask plate produced by the present invention finally determines the deposition effect of the organic material as the opening structure 420 of the photoresist film layer 42. Since the photoresist has the characteristics of an organic material, it is relatively easy to achieve "light and thin". Due to the "light" nature, the metal support layer 41 underneath it is easy to support it; and the "thin" feature allows the open structure 42 disposed thereon to more easily achieve a small size opening design.

In the present invention, the "magnetic mask for vapor deposition", "magnetic mask", and "mask" are the same concept; in the present invention, it should be noted that the photoresist and the photosensitive film are two different concepts, although They are all materials with photosensitive properties, but in comparison, the photoresist after exposure has more stable performance than the exposed photosensitive film, and the photoresist is used as a permanent material after exposure, which is not easy to be The outside is damaged, and the photosensitive film is only an etching aid.

In addition, any reference to "an embodiment", "an embodiment", "an exemplary embodiment" or the like means that a particular component, structure or feature described in connection with the embodiment is included in at least one embodiment of the invention. This schematic representation throughout the specification does not necessarily refer to the same embodiment. Further, when a specific component, structure or feature is described in connection with any embodiment, it is claimed that such a component, structure or feature in combination with other embodiments is within the scope of those skilled in the art.

While the embodiments of the present invention have been described in detail with reference to the exemplary embodiments of the embodiments of the invention, it will be understood that those skilled in the art Within the spirit and scope of the principles of the invention. In particular, it is possible to make reasonable modifications and improvements in the arrangement of the components and/or sub-combination arrangements without departing from the spirit of the invention. Variations and modifications in the component parts and/or the scope of the invention are defined by the scope of the appended claims and their equivalents.

10‧‧‧ mask pattern
11‧‧‧ mask
12‧‧‧Front frame
20‧‧‧Mask Department
21‧‧‧ Mask opening for evaporation of organic materials
30‧‧‧Composite magnetic mask for evaporation
311‧‧‧ Opening unit formed by array of openings 420 for vapor deposition on composite magnetic mask 30 for vapor deposition
312‧‧‧Gap between adjacent two opening units 311 on the photoresist film layer 42
40‧‧‧Electroforming deposited substrate
400‧‧‧Photosensitive film layer
401‧‧‧Exposure area on the photosensitive film layer 400
402‧‧‧Unexposed areas
403‧‧‧Electrolytic deposition area
41‧‧‧Metal support layer formed by electroforming
410‧‧‧Metal support layer upper window structure
411‧‧‧ is a support strip between two adjacent window structures 410
42‧‧‧Photoresist film
420‧‧‧Open structure on the photoresist film layer 42
421‧‧‧ photoresist exposure area
422‧‧‧ photoresist non-exposure area
80‧‧‧Substrate
81‧‧‧ is a fixing mechanism for fixing the mask element
82‧‧‧Organic evaporation source
AA‧‧‧section to be sectioned
BB‧‧‧section to be sectioned
D1‧‧‧ width dimension of opening 21
D2‧‧‧ is the gap width between two adjacent opening units 311
D3‧‧‧ is the spacing between adjacent two opening structures 420 in the same opening unit 311 on the mask layer
D4‧‧‧ is the width of the support bar 411
H‧‧‧ mask thickness
H1‧‧‧ Mask layer thickness (ie thickness of photoresist film layer)
H2‧‧‧Metal support layer thickness
I‧‧‧ areas to be enlarged
II‧‧‧ area to be enlarged

1 is a schematic structural view of a mask for OLED evaporation; FIG. 2 is an enlarged cross-sectional view of the AA direction of FIG. 1; FIG. 3 is a composite magnetic mask for vapor deposition provided by the present invention. FIG. 4 is a schematic view showing a first embodiment of a mask plate produced by the method provided by the present invention; FIG. 5 is a schematic view showing a second embodiment of the mask plate produced by the method provided by the present invention; FIG. 7 is a schematic view showing a fourth embodiment of a mask plate produced by the method provided by the present invention; and FIG. 8 is an overall schematic view of a magnetic mask plate fabricated by the method of the present invention. Figure 9 is a schematic cross-sectional view taken along line BB of Figure 8; Figure 10 is a schematic overall view of a mask layer constituting a magnetic mask; Figure 11 is a schematic overall view of a metal supporting layer constituting a magnetic mask; Figure 12 9 is an enlarged schematic view of the I region; FIG. 13 is an overall schematic view of another magnetic mask produced by the method of the present invention; FIG. 14 is a portion I of FIG. Figure 15 is a schematic cross-sectional view of the BB direction of Figure 14; Figure 16 is a schematic view of the reverse side of Figure 14; Figure 17, is a schematic view of another different structure of the reticle of the present invention; A schematic diagram of vapor deposition of an organic material using the magnetic mask of the present invention.

S1‧‧‧Metal support layer electroforming

S11‧‧‧Substrate preparation

S12‧‧· film

S13‧‧‧ exposure

S14‧‧‧Development

S15‧‧‧Electric casting

S2‧‧‧Metal support layer surface coating

S3‧‧‧Photoresist film exposure

S4‧‧‧ photoresist film development

Claims (10)

A method for manufacturing a composite magnetic mask for vapor deposition, comprising the steps of: S1, electroforming a metal support layer to form a metal support layer having a certain thickness, wherein the metal support layer is provided with a specific window structure, the metal support The layer is made by electroforming technology. The electroforming technology includes: S11, substrate preparation, selecting an electroformed deposition substrate with a clean surface; S12, film, pressing or coating a photosensitive film on the surface of the deposition substrate to form a photosensitive film a film layer; S13, exposing, exposing a specific region of the photosensitive film layer in S12, the exposed region of the photosensitive film layer is the region where the window structure is located, and the photosensitive film in other regions outside the window structure is not exposed; S14, Developing, developing the photosensitive film layer after the exposure treatment in step S13, removing the photosensitive film in the unexposed area to form a deposition area to be electroformed; S15, electroforming, electroforming deposition after development processing The substrate is electroformed in an electroforming bath to form a metal support layer having a window structure; S2, a surface of the metal support layer is coated, and has a window structure The surface of the metal supporting layer is covered with a photoresist having a certain thickness to form a photoresist film; S3, the photoresist film layer is exposed, and one side of the metal supporting layer having the photoresist film layer is exposed to expose the preset area. Forming a photoresist exposure region and a photoresist non-exposed region on the photoresist film layer; S4, developing the photoresist film layer, removing the photoresist in the photoresist non-exposed region in the step S3 by development, and retaining the photoresist exposure region a resist layer formed by forming a photoresist film having an open structure to form a mask layer of the composite magnetic mask for vapor deposition; wherein the metal support layer and the photoresist film layer having an open structure constitute the composite a magnetic mask, the opening structure formed on the mask layer corresponds to the photoresist non-exposed area in the step S3, and the opening structure formed on the mask layer is inside the window structure of the metal supporting layer, the metal supporting layer Each of the upper window structures has at least one opening structure therein. The method for fabricating a composite magnetic mask for vapor deposition according to the first aspect of the invention, characterized in that, after the S15 electroforming step in the S1 metal support layer electroforming, the method further comprises: a fading step, the metal support The layer is subjected to a film removal treatment, and the photosensitive film inside the metal support layer window structure is completely removed. The method for fabricating a composite magnetic mask for vapor deposition according to claim 2, characterized in that before or after the step of removing the film, the method further comprises: a stripping step of depositing the metal supporting layer from the electroformed substrate Peel off. The method for producing a composite magnetic mask for vapor deposition according to the second aspect of the invention, characterized in that after the step of developing the S4 photoresist film layer, further comprising: a peeling step of the composite magnetic mask for vapor deposition The mask layer is peeled off from the electroformed deposition substrate. The method for fabricating a composite magnetic mask for vapor deposition according to claim 1, 2, 3 or 4, wherein the step of developing the S4 photoresist layer further comprises: a baking curing step; After the S4 photoresist film layer development step, the composite magnetic mask is formed and placed in an oven for baking and curing. The method for producing a composite magnetic mask for vapor deposition according to claim 1, 2, 3 or 4, wherein the thickness of the photoresist film layer is not greater than the thickness of the metal support layer. The method for fabricating a composite magnetic mask for vapor deposition according to claim 1, 2, 3 or 4, wherein in the S15 electroforming step, the thickness of the metal support layer formed by the electroforming is greater than the S12 The photosensitive dry film thickness in the filming step, the metal support layer formed has a shrinkable window structure. The method for fabricating a composite magnetic mask for vapor deposition according to claim 1, 2, 3 or 4, wherein the window structure on the metal supporting layer is arranged in an array. The method for fabricating a composite magnetic mask for vapor deposition according to claim 1, 2, 3 or 4, wherein the S2 metal support layer surface coating step is performed by using a photoresist dry film. The film is formed by a molding method or a photoresist film coating method. The method for fabricating a composite magnetic mask for vapor deposition according to claim 6, wherein the thickness of the metal supporting layer ranges from 20 to 60 μm; and the thickness of the mask layer ranges from 2 to 20 μm. The opening structure formed on the mask layer has a size ranging from 15 to 40 μm.