JP3480617B2 - Method of manufacturing nozzle plate for inkjet printer head - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a nozzle plate for an ink jet printer head, and more specifically,
The present invention relates to a method of manufacturing a nozzle plate by a photoelectroforming method in the field of photofabrication using a photolithography technique and a plating electroforming process, and is suitable for application to gas process and micromachining technology in general.

[0002]

2. Description of the Related Art As typical ones of various recording systems of a recording apparatus, there are three systems of ink jet, transfer type heat sensitive and electrophotographic. The ink jet recording system is a technique for recording characters and images on a medium such as recording paper by forming ink into particles by physical means and controlling the minute ink droplets. The transfer type heat-sensitive method is such that a transfer body having a color material layer of a sublimable dye provided on the surface of a transfer substrate and a receiver are brought into pressure contact with each other,
It is heated in accordance with an image signal and transferred to an image receptor.Electrophotography involves exposing the image by uniformly charging the photoconductor layer by corona discharge or the like to form an electrostatic latent image according to the image. In this method, toner is attached to the electrostatic latent image, and the toner image is electrostatically transferred and fixed on a recording paper.

Among these recording methods, the ink jet recording method does not require development and fixing processes and can record directly on paper. Further, it is a non-percussion type and has little noise and high-definition color printing. It has excellent characteristics. Such an ink jet printer includes a printer head, ink,
It consists of five elements: recording paper, drive system, and electrical control system. In particular, the printer head has an important role of stably ejecting ink from a nozzle of several tens of μm for a long term.

Semiconductor film forming technology that produced ultra-LSI,
The development of measurement and evaluation technology has had a great influence on the processing of inkjet nozzles and heads. As a known document concerning nozzle processing of a nozzle plate for an inkjet printer head, "inkjet recording method (nozzle processing)" by the present inventor (Recently, functional film forming process technology (Koushinsha Technology Publishing Department, June 10, 1987) First edition), and "Nozzle plate for inkjet head" according to Japanese Patent Application Laid-Open No. 2-167750.

In the above-mentioned "ink jet recording method (nozzle processing)", a liquid photoresist is used to form a circular resist pattern on the substrate, which is also the origin of the nozzle, and metal plating is applied to cover the circumference of the circular resist pattern. A method of processing a nozzle so as to surround it with plated metal is disclosed. This nozzle plate manufacturing method will be described below.

FIG. 7 is a diagram for explaining a conventional nozzle processing step by the photoelectroforming method. In the figure, 1 is a substrate, 2 is a circular resist pattern, 3 is Ni or Ni alloy plating, 4 is a nozzle, 5 is a nozzle plate.
The steps (a), (b), and (c) will be described below in this order. (A) A circular resist pattern is formed on the substrate. The substrate 1 is an electrically conductive substrate made of metal or the like, or a ceramic substrate having a surface layer made into a conductor, and a circular resist pattern 2 is patterned on the substrate 1 by a photolithography process. (B) Perform electroforming plating. The substrate 1 having the circular resist pattern 2 is subjected to electrolytic plating 3 with nickel or a nickel alloy. At this time, the plating metal such as nickel is simultaneously deposited in the plate thickness direction and the lateral direction of the substrate, so that the plating metal surrounds and surrounds the circular resist pattern 2, and the nozzle 4 having a horn-shaped curved surface is formed. It is formed. (C) The plated body is separated from the substrate. The plated metal on the substrate 1 has a nozzle 4 formed around the circular resist pattern 2, and this Ni or Ni alloy plate serves as the nozzle plate 5.
Are obtained by peeling from the substrate 1.

FIG. 8 is a diagram for explaining an example of a conventional resist pattern for producing a multi-nozzle by the electroforming method, in which 6 is a pattern of an insulating outer frame. Since it is necessary to provide a large number of nozzles 4 on the high-definition nozzle plate, when the high-definition nozzle plate is processed by the electroforming method, an insulating property made of an insulating resist material is provided between adjacent nozzle plates. The outer frame pattern 6 is provided to partition each nozzle plate, and the nozzle plates made by electroforming can be mass-produced.

In the "ink jet head nozzle plate" disclosed in Japanese Patent Laid-Open No. 2-167750, a resist pattern having an outer surface portion having a spur gear-shaped groove is formed on a substrate, and the same nozzle processing technique as described above is used. There is disclosed a nozzle plate in which an inner wall along a horn-shaped nozzle hole is formed with a plurality of sawtooth grooves by a manufacturing process of an electroforming method.

[0009]

The photofabrication technique applied to the production of the nozzle plate according to the above-mentioned document and the electroplating process for plating are referred to as photofabrica.
If the parts are processed by the photoelectrohoming method, which is one of the techniques, there is a drawback that the process is long, but as described with reference to FIG. ) Has the advantage that a large number of parts (nozzle plates) can be obtained in one step, and compensates for the above drawbacks. In particular, when making a single hole (single), it is possible to pattern and process a large number of single holes on one substrate, and as a result, only good single holes can be selected. Has been done.

However, when a large number of nozzle plates are formed by this processing method and a plurality of nozzles, for example, a multi-nozzle having 32, 64, and 128 nozzles are formed on one nozzle plate, one nozzle plate is used. This means that even if there is one nozzle with a defective dimension or a defective shape in the nozzle plate, the entire nozzle plate will be defective. In particular, recent high-speed, high-definition nozzle plates far exceed the requirements required for conventional nozzle plates, and multi-nozzle nozzles are required to have sub-micron processing accuracy.

[0011] The requirement as described above means that the number of defective products out of the tolerance increases, resulting in a problem that mass production is impossible and an inexpensive nozzle plate cannot be provided. In order to solve this problem, the accuracy of the nozzle dimension is required to be ± 0.5 μm. In contrast,
In the nozzle processing by the conventional photoelectroforming method, the dimensional accuracy is limited to ± 2.0 μm.
We were not able to meet the accuracy requirement of 0.5 μm.

The present invention has a first object to solve the above problems.
In 1. Providing multi-nozzle plates for high-speed, high-resolution color printing 2. Provision of high-precision multi-nozzle plate manufacturing method 3. 3. Providing a method for reducing variations in nozzle diameter formed on a multi-nozzle plate. Nozzle shape variation reduction method 5. Yield improvement in high precision multi nozzle plate fabrication 6. Providing an inexpensive nozzle plate manufacturing method with good productivity 7. Secondly, the purpose is to selectively cut out the non-defective part to improve the non-defective rate. Improvement of adhesion of plated substrate (prevention of substrate peeling during plating of nozzle plate) 9. It is an object of the present invention to provide a high-precision multi-nozzle plate manufacturing method free from defects such as generation of irregular nozzles due to plating deposition inhibition due to contamination of the substrate surface layer.

[0013]

In order to solve the above-mentioned problems, the present invention provides (1) forming a circular resist pattern for forming nozzles on a conductive substrate, and forming a plurality of nozzle plates having the nozzles. An insulating outer frame for separating the nozzle plate is formed on the substrate, and the nozzle plate is formed into a plurality of nozzle plates.
In addition to the insulating outline frame for separating into
The boundary position of the Roh nozzle plate you adjacent in countercurrent, metal plating
Area for forming the conductive layer
It is formed by surrounding it, and metal plating is applied to the region by a photoelectroforming method, so that the region
To deposit a conductive layer in the range, further, (2) in the (1), the width of the insulating outer frame, and 1.5 to 2 times the plating thickness to be the nozzle plate Alternatively, (3) a circular resist pattern for forming nozzles is formed on the conductor substrate, and a plurality of insulating outer frames parallel to the nozzle row on the conductor substrate and the insulating outer frame are formed.
Shaped in a direction orthogonal to the insulating outline frame formed on both ends
It made which was formed only the insulating outer frame, after plated Ri by the photo-electroforming method, acceptable area
Cutting to select only, further, (4) In the (3), before Keno nozzle is arranging the plurality of nozzles in a row or staggered two rows at regular intervals, even (5) In (3) above, there is no gap on the conductor substrate.
Multiple parallel to nozzle rows of the insulating outer frame, is characterized in forming a fine small mark portion at a position separated form the nozzle plate of the multiple.

[0014]

When the nozzle plate is manufactured by the photoelectroforming method, the nozzle diameter is almost determined by the nozzle resist pattern hole diameter and the plating thickness, and the nozzle diameter depends on the plating thickness. The thickness is determined by the current distribution during plating, and the non-uniform current distribution makes the plating thickness non-uniform, resulting in deterioration of the nozzle diameter size and shape accuracy. Based on the experimental results that the current distribution is concentrated at the end of the nozzle plate if there is an insulating outer frame of the nozzle plate, the insulating outer frame of the nozzle plate is removed or the current distribution is concentrated by the insulating outer frame. An electric conductor layer to be eliminated is provided to make a nozzle with a uniform shape with high accuracy and a stable shape.

[0015]

EXAMPLE A photoelectroforming method for producing a nozzle plate for an ink jet printer head according to the present invention is a photofabrication technique which is one technique for performing precision processing on metal and non-metal materials together with photoetching. The photo-etching method is suitable for high-precision processing, while the photo-etching method is excellent in mass productivity.

In the electroforming method, a photoresist is coated on a substrate which serves as a negative electrode for electrolytic plating, and the photoresist, a photo master for photoelectroforming processing, and etching are selectively applied on the substrate. After forming an electric insulating film, electroplating is performed to deposit a metal on an exposed portion of the substrate and peel the deposited metal to produce a product.

When a nozzle for an ink jet printer head having a nozzle diameter dimension and shape is processed by the electroforming method, the processed nozzle diameter D is
It is known that the diameter A of the circular nozzle pattern on the substrate before plating is roughly determined by the thickness t of the plating, and there is a relationship of D = A-2t (1). Therefore, when a nozzle plate of a multi-nozzle is manufactured, even if the circular resist pattern diameter A is constant, if the plating thickness t in the same substrate is not constant, the nozzle diameter D will vary. That is, according to the formula (1), increasing the dimensional accuracy of the nozzle diameter D means how to control the plating thickness t of the same substrate with high accuracy.

The present inventor has further focused on the insulating outer frame 6 of the nozzle plate as a factor of variation in the plating thickness t.
In particular, if there is an insulating outline frame at the nozzle plate adjacent boundary,
During plating, it is predicted that the plating thickness t will vary due to the so-called edge effect, in which the current distribution concentrates at the edge of the nozzle plate, and as a result, the nozzle diameter D will vary, and this temporary construction will be tested. Verified.

FIG. 1 is a diagram for explaining an experimental example showing the mutual relationship between the nozzle diameter and the plating thickness of the multi-nozzle plate, in which the nozzles of the nozzles arranged on the horizontal axis at equal intervals in the multi-nozzle plate. The nozzle diameter D (μm) and the plating thickness t (μm) are plotted on the vertical axis and the number, and the plating thickness t
Shows that the nozzle diameter D becomes smaller as
It is proved that the plating thickness t of the portions close to the outer frame of the nozzle plate at both ends is thick. As described above, in order to reduce the variation in the nozzle diameter of the multi-nozzle plate, the present inventors have found that it is important that the outer shape of the nozzle plate is important. Less than,
The configuration operation of the present invention will be described based on an embodiment.

[Embodiment 1] FIG. 2 is a view for explaining a method of manufacturing a nozzle plate according to the present invention, in which 7 is a plated metal plate. In addition, in the drawings after FIG. 2, parts having the same operations as those shown in FIGS. 7 and 8 are denoted by the same reference numerals as those in FIGS. First, the circular resist patterns 2 serving as nozzles are formed on the substrate 1 in a plurality of rows, such as one row or two rows, or in a staggered multi-stage array (a plurality of rows in the figure) at regular pitch intervals. The array of the circular resist patterns 2 at this time is a repeating unit of a desired number of nozzles provided on the nozzle plate, and is patterned in a multi-cavity form as in the conventional method shown in FIG.
The insulating outline frame 6 has been removed.

Next, plating electroforming is performed on the substrate 1 by a photoelectroforming method to form a metal plate 7 made of plated metal provided with a number of nozzles corresponding to a continuous circular resist pattern 2 having no insulating outer frame 6. Ru can be obtained. Since there is no insulating outline frame 6 on the substrate 1 shown in FIG. 2, there is no edge effect at the time of plating and the current distribution is uniform over a wide range on the substrate 1. As a result, the plating thickness t
Becomes constant, and the dimensional accuracy of the nozzle diameter D is remarkably improved according to the equation (1). Even if the dimensional accuracy of the nozzle diameter D is improved, pattern defects may occur due to the adhesion of fine particles and the like during the processing step, so it is necessary to remove this and obtain a good nozzle plate.

FIG. 3 is a diagram for explaining an example of the non-defective nozzle plate sorting apparatus from the plated metal plate shown in FIG. 2, in which 8 is a nozzle diameter shape discriminator. The nozzle diameter / shape determiner 8 has, for example, an optical detection unit 8a having a metal microscope or the like, and a drive unit (scanning drive the detection unit 8a according to the nozzle array formed on the plated metal plate 7). and not shown), it serves from outer cutting portion for cutting the non-defective area of the nozzle (not shown), which that is integrally formed.

In FIG. 3, the integrated substrate 1 and the plated metal plate 7 on which the nozzle is formed are indicated by a detecting portion 8a.
The drive unit detects the nozzles along the arranged nozzle positions, and the nozzle diameter / shape determining unit 8 automatically determines the nozzle diameter / shape. After that, the nozzle is subjected to address setting of the non-defective area of the metal plate 7 on the basis of the diameter and shape measurement data, which is input, and is input by the integrally formed outer cutting section such as dicing or laser. In addition, according to the non-defective item area data, the non-defective nozzle plate is automatically selected and cut. In this way, after specifying the address and area of the non-defective part,
Since automatic cutting is performed, the rate of non-defective products is improved, resulting in resource saving and cost reduction.

[Embodiment 2] FIG. 4 is a view for explaining another embodiment of the method for manufacturing a nozzle plate according to the present invention, in which 9 is a conductive layer and 61 is a conductive layer.
Is an insulating outline frame. For each nozzle plate of the plurality of nozzle plates on the substrate 1, a circular resist pattern 2 as a source of nozzles provided in the same shape arrangement and a plated metal or the like sandwiching a boundary portion between adjacent nozzle plates 5 are used. Conductive layer 9
Insulating outline frames 61a, 61b, 61 for forming
c, patterned by photolithography an insulating outer frame 61 having a 61d, to facilities the plating on the patterning.

Insulating outer frames 61a, 61 are provided in the middle portion of the nozzle plate 5 adjacent to the substrate 1 having the patterning shown.
Since b, 61c, and 61d are provided, the conductive layer 9 is deposited in this frame when plating is performed by the photoelectroforming method, and the conductive layer 9 absorbs and disperses the electric field concentrated at the end portion of the nozzle plate 5. Therefore, the electric field strength in each nozzle plate 5 becomes uniform, and the circular resist pattern 2 is plated with a uniform plating thickness t to form a nozzle having a uniform and highly accurate diameter D.

[0026] Example 3 In addition, Ru der choose frame width of the insulating outer frame 61 to 1.5 to 2 times the thickness t of the nozzle plate 5 by plating metal. The insulating outer frame 61 has a thickness t of 1.5 of the plating metal of the nozzle plate 5.
~ Adjacent nozzle plates 5 by having twice the width
Each nozzle plate 5 without being spliced by plated metal
Can be divided and formed independently.

[Embodiment 4] FIG. 5 is a view for explaining still another embodiment of the method for producing an inkjet multi-nozzle plate according to the present invention, in which 62 is an insulating outer frame. is there. The insulating outer frame 62 formed by the resist pattern shown in FIG.
In this example, only the insulating outer frame 62 in a portion parallel to the nozzle is continuously formed, and only the insulating outer frames 62 in the boundary regions located on both sides of the nozzles on the left and right ends are removed (not shown). . That is, the vertical frame 62y having the vertical and horizontal outer shapes of the nozzle plate 5, and only two opposite sides of the horizontal frame 62x (horizontal frame 62x in the figure) are formed, and the nozzle plate 5 of the multi-nozzle is formed by the electroforming method. the make, Roh nozzle diameter shape determination unit 8 only acceptable area automatically sorted by dicing vertical frame 62y corresponding portion, by laser or the like, you cut.

As shown in the figure, since either the vertical / horizontal frame 62y or 62x is removed, the insulating outline frame 62 of the removed part is removed.
There is no electric field concentration at the nozzle plate 5 portions sandwiching a position corresponding to, improved Roh nozzle diameter dimensional accuracy, it is possible to eliminate occurrence of defective nozzles.

In order to correspond to a high-definition image and to have multiple nozzles, it is required to arrange the nozzles 4 at regular intervals in one row or two rows in a staggered pattern. In this case, the resist pattern layout is such that the insulating outer frame 62 in the direction perpendicular to the one-row nozzle or the portions of the insulating outer frame 62 located at the left and right ends of the one-row nozzle are removed, that is, the one-row nozzle. The insulating outer frame 62 is provided only on the portion parallel to the nozzle, and the continuous portion of the electroformed metal is separated by a cutting device such as dicing or a laser, and the nozzle diameter, the shape discriminator 8, the nozzle diameter, the dimension, and the shape inspection. Ru resulting nozzle plate good after. The nozzle plate in this case, excellent nozzle plate of dimensional accuracy of the nozzle diameter is no concentration of electric field is obtained.

[Embodiment 5] FIG. 6 is a view for explaining still another embodiment of the method for manufacturing a nozzle plate for an inkjet head according to the present invention, in which 10 is a cut mark. The cut mark 10 shown in FIG. 6 is continuous only in the portion of the insulating outer frame 62 (horizontal outer frame 62x in the figure) of the portion of the insulating outer frame 62 parallel to the nozzle 4 in the resist pattern shown in FIG. Formed by removing the outer frames of the boundary regions located on both sides of the nozzles on both the left and right ends, and adding minute cut marks 10 to the insulating outer frame 62 at positions corresponding to the removed portions. Oh Ru. Since the cut mark 10 is so small that electric field concentration does not occur in the nozzle 4 portion, it is easy to separate and cut the nozzle plate having excellent nozzle diameter dimensional accuracy.

[Embodiment 6] In the production of the nozzle plate 5 by the electroforming method according to the above-mentioned Embodiments 1 to 5, the nozzle 4 formed on the nozzle plate 5 is plated by the direct current power supply in the electrolytic solution. In order to improve the diameter dimension and shape accuracy, it is proposed that the insulating outline frames 61 and 62 and the insulating outline frame 6 having a shape that prevents the plating thickness t from changing due to the electric field concentration be removed. It prevented from being, but the DC power source and a pulse current source, or Ru may be a low DC current source. Since the edge effect can be suppressed by using a pulse current power source or a low current power source as the electroforming power source in the electroforming method, the insulating outer frames 61 and 62 according to Examples 1 to 5 are applied to further reduce the nozzle. It is possible to achieve high precision in diameter dimension and outer shape.

[0032] Example 7 Roh nozzle plate forming photo-electroforming conductor conductor glass substrate as the substrate 1, use cold-rolled stainless steel substrate, electrolytic composite polishing a stainless steel substrate, any of the copper substrate
In addition, it is possible to deposit a plating film on the surface of the substrate or to form a metal oxide layer so that plating can be deposited and peeled off. An inexpensive nozzle plate 5 can be obtained. Also,
As the substrate 1 of the conductor, the substrate 1 using cold rolled stainless steel excluding the conductorized glass substrate, electrolytic composite polishing stainless steel, and copper is used for non-woven surface polishing or a cloth-like surface of the substrate 1 with a wrapping film. by the Ruco be polished, it can be used repeatedly substrate 1. Further, since the material of the substrate 1 is also inexpensive, it can contribute to the production of the inexpensive nozzle plate 5. Further, by polishing the non-woven fabric or polishing the surface with a wrapping film, dirt on the surface can be removed, and further, the adhesion to the substrate and the releasability for finally peeling from the substrate can be adjusted.

Further, the substrate 1 is subjected to an electrolytic treatment in an alkaline electrolytic solution, a saponification effect and a stain on the surface of the substrate 1 due to the generated gas to cause a partial deformation of the plating, resulting in a nozzle deformation and a plating floating phenomenon. While causing trouble due to, more and this subjecting conductor glass substrate, cold rolled stainless steel substrate, electrolytic composite polishing a stainless steel substrate, a manner electroforming electrolytic polishing and electrolytic degreasing the surface of the metal substrate 1 such as a copper plate, said It is possible to eliminate defects.

[0034]

As is apparent from the above description, the present invention has the following effects. (1) an electric field further grant conductor layer in the boundary portion of the adjacent contact the nozzle plate to focus on the nozzle plate end so as to absorb dispersion. Thus suppress electric field concentration to the nozzle plate end, the plate Variations in plating thickness are reduced, and consequently variations in nozzle diameter can be reduced. further,
Set the conductor layer width to the desired plating thickness (nozzle plate thickness) of 1.5
Since it is doubled or doubled, it can be used also as the electric field concentration absorption zone and the nozzle plate division zone, which is advantageous in reducing the variation in nozzle diameter and nozzle plate division property (productivity). (2) arranged several nozzles in a row, so-called insulating external径枠that in parallel with a line-shaped nozzle in the production of multi-nozzle plate is a conventional and by removing the bounds径枠adjacent the nozzle plate removing the split of the併害electric field concentration, since only good products area to automatically select cut by such as a laser, the effect of the nozzle diameter variation reduction and yield rate improvement can be expected. Further, since the cutting position mark is provided to the extent that the electric field concentration is not hindered, it is effective for the effect of dispersing the electric field concentration and the operability of cutting and dividing into individual nozzle plates. ( 3) In addition to the nozzle plate outer diameter frame imparting method of the present invention, the electric field concentration on the end portion of the nozzle plate is controlled by performing pulse waveform electroplating as a plating electroforming power source or DC low current. Therefore, it is effective in further reducing the variation in nozzle diameter. (4) a glass plate as a substrate for a Ki electroforming Tsu because, since the stainless steel plate can be used the substrate cost is inexpensive, as a result it is provided an inexpensive nozzle plate. Since a stainless steel plate subjected to electrolytic composite polishing is used, a stable electroformed substrate surface can be obtained without abnormal slat and burn phenomenon. (5) can be balanced releasability and coating substrate adhesion only suitable degree of surface polishing. Further, the surface portion can be polished many times, the substrate cost is low, and as a result, an inexpensive nozzle plate can be manufactured. Polishing can remove surface stains, thus preventing defects such as irregular nozzles and contributing to yield improvement. (6) The electrolytic treatment with A alkaline electrolyzed solution, the soil removal of the substrate surface by saponification effects and generated gas can improve the defect nozzle profile by inhibition of partial plating deposition, such as by plating floating phenomenon.

[Brief description of drawings]

FIG. 1 is a diagram for explaining an experimental example showing a mutual relationship between a nozzle diameter and a plating thickness of a multi-nozzle plate.

FIG. 2 is a diagram illustrating a method of manufacturing a nozzle plate according to the present invention.

FIG. 3 is a diagram for explaining an example of a non-defective nozzle plate sorting apparatus from the plated metal plate shown in FIG.

FIG. 4 is a view for explaining another embodiment of the method for manufacturing a nozzle plate according to the present invention.

FIG. 5 is a view for explaining still another embodiment of the method for manufacturing an inkjet multi-nozzle plate according to the present invention.

FIG. 6 is a view for explaining still another embodiment of the method of manufacturing the nozzle plate for the inkjet head according to the present invention.

FIG. 7 is a diagram for explaining a conventional nozzle processing step by a photoelectroforming method.

FIG. 8 is a diagram for explaining an example of a conventional resist pattern for manufacturing a multi-nozzle by an electroforming method.

[Explanation of symbols]

1 ... Substrate, 2 ... Circular resist pattern, 3 ... Ni or N
i alloy plating, 4 ... Nozzle, 5 ... Nozzle plate, 6 ... Outline frame pattern, 7 ... Plated metal plate, 8 ... Nozzle diameter shape discriminator, 9 ... Conductive layer, 10 ... Cut mark, 61 ... Nozzle plate outline frame, 62 ... Outline frame.

Claims (5)

(57) [Claims] 1. A circular resist pattern for forming a nozzle is formed on a conductive substrate, and an insulating outline frame for separating a nozzle plate having the nozzle into a plurality of nozzle plates is provided.
Formed on the substrate and separating the nozzle plate into multiple nozzle plates
In addition to the insulating outline frame for
Kick at the boundary position of the Roh nozzle plate that be adjacent, to the metal plating
Enclose the area for forming the conductive layer in
Formed by applying a metal plating by the photo electroforming method with respect to the region, method of manufacturing a nozzle plate for an ink jet printer head, characterized by depositing a conductive layer in said region. 2. The nozzle plate for an ink jet printer head according to claim 1, wherein the width of the insulating outer frame is 1.5 to 2 times the plating thickness of the nozzle plate. Production method. 3. A circular resist pattern for forming nozzles is formed on a conductor substrate, and a plurality of insulating outline frames parallel to the nozzle row on the conductor substrate and the insulating outline frames are formed.
Shaped in a direction orthogonal to the insulating outline frame formed on both ends
It made which was formed only the insulating outer frame, after plated Ri by the photo-electroforming method, acceptable area
A method for manufacturing a nozzle plate for an inkjet printer head, which comprises selecting and cutting only the same . 4. Before Kino nozzle is method of manufacturing a nozzle plate for an ink jet printer head according to claim 3, characterized in that arranging a plurality of nozzles in a row or staggered two rows at regular intervals . 5. A plurality of nozzles arranged parallel to the nozzle row on the conductor substrate
Position of the insulative outer frame of the device that separates and forms multiple nozzle plates
Claim and forming a fine small mark portion 3
A method for manufacturing a nozzle plate for an inkjet printer head according to.