TW201701409A - Manufacturing apparatus and manufacturing method - Google Patents

Abstract

A QFN substrate is cut at three stages along a plurality of cutting lines set in a grid pattern in the QFN substrate. First, on the cutting lines along the longer direction of the QFN substrate, a portion substantially corresponding to a thickness of a tie bar of a lead frame is cut, thereby forming cut trenches. Next, on the cutting lines along the shorter direction of the QFN substrate, the lead frame and a sealing resin are collectively cut. Next, on the cut trenches along the longer direction of the QFN substrate, a portion corresponding to a remaining thickness of the sealing resin is cut. Since only the portion of the sealing resin is cut on the cut trenches, the processing load when the QFN substrate is finally divided into QFN products can be reduced. Therefore, it is possible to prevent the QFN product from being displaced or scattered from a prescribed position of a cutting jig.

Description

Manufacturing device and manufacturing method

The present invention relates to a manufacturing apparatus and a manufacturing method for cutting a cut object to produce a singulated plurality of products.

A substrate formed of a printed circuit board or a lead frame is virtually divided into a plurality of lattice-shaped regions, and a wafer-shaped device (for example, a semiconductor wafer) is mounted in an individual region, and then the entire substrate is sealed by a resin. Substrate. The sealed substrate is cut by a cutting mechanism such as a rotary blade, and the individual is singulated into individual products.

Conventionally, a predetermined region of the sealed substrate has been cut by a cutting mechanism such as a rotary blade using a manufacturing apparatus. First, the sealed substrate is placed on the cutting jig mounted on the cutting table and sucked. Next, the sealed substrate is positioned (positionally aligned). By positioning, the position of the imaginary cut line dividing the plural area is set. Next, the cutting table that sucks the sealed substrate and the cutting mechanism are relatively moved. The cutting water is sprayed onto the cut portion of the sealed substrate, and the sealed substrate is cut along the cutting line set on the sealed substrate by the cutting mechanism. The singulated article is manufactured by cutting the sealed substrate.

Along with the progress of the miniaturization of semiconductors, the manufactured articles tend to become smaller. Products having a size of 2 mm or less on one side are added. system When the product is small, the diameter of the suction hole for cutting the jig is also small, and the suction force of the absorbing product is small. When the absorbing power of the absorbing article is small, for example, a machining load such as a rotary blade or an external force such as cutting water causes a phenomenon in which the singulated product deviates from the predetermined position of the cutting jig and scatters. If such a phenomenon occurs, cracks or cracks or the like occur in the product, so that the quality of the product is remarkably lowered. In addition, the yield of the product is greatly deteriorated. Therefore, when the product is small, the moving speed of the cutting table is later than the normal speed (for example, about 1/10 of the normal speed), and the machining load is reduced to perform cutting.

In recent years, electronic devices such as mobile phones and personal computers have been miniaturized and multi-functional, and packaging technologies capable of high-density packaging are strongly demanded. As one of the high-density packaging technologies, a product called a Quad Flat Non-leaded Package (QFN) manufactured using a lead frame made of a metal such as copper or a 42 alloy (Fe-Ni) is used. Semiconductor devices are attracting attention. A plurality of semiconductor wafers mounted on a predetermined region (die pad) of the lead frame are collectively sealed with a resin and cut along the cutting line to manufacture QFN. Hereinafter, a sealed semiconductor substrate in which a plurality of semiconductor wafers for mounting a QFN is mounted with a resin is collectively referred to as a QFN substrate, and a product produced by singulating a QFN substrate is referred to as a QFN product.

The cut portion of the QFN substrate is composed of a slender portion (a connecting rod, Tie Bar) included in the lead frame and a multilayer structure of a resin-sealed sealing resin. When the metal and the sealing resin are collectively cut by the rotary blade, the processing load is increased by cutting the multilayer structure including the metal and the sealing resin which are composed of different materials. In particular, copper is used as a ductile material of a material of a lead frame (a material having a property of not extending even if a stress object exceeding an elastic limit does not break) In the case, it is prone to blockage of the rotating blade. In addition, the processing load is even larger. When the processing load is increased, the singulated product is easily deviated from the predetermined position of the cutting jig and scattered. In the case of singulating the QFN substrate, it is necessary to cut the cutting speed of the cutting table at a later time than the case of the normal sealed substrate. Therefore, there is a problem that productivity is lowered at the time of manufacturing a QFN product.

In the case of manufacturing a semiconductor device such as a QFN, a semiconductor device unit for improving the productivity of a semiconductor device has been proposed. (Slightly, an individual semiconductor element is mounted on a plurality of semiconductor element mounting portions provided in a lead frame. In a case where the semiconductor elements are sealed by a sealing resin, the semiconductor devices of the plurality of semiconductor devices are obtained (slightly) along the outer periphery of each semiconductor device formed of the sealing resin. A semiconductor device unit in which a recessed portion is formed on the upper surface of the sealing resin when a plurality of semiconductor devices are cut (see, for example, paragraph [0012] and FIG. 1 of Japanese Patent Laid-Open Publication No. 2001-343817 , Figure 2).

According to the prior art, a concave portion is formed on the upper surface of the sealing resin, and a convex portion is formed inside the mold member (refer to paragraph [0034] and Fig. 5 of Japanese Patent Laid-Open Publication No. 2002-343817). Therefore, there is a problem that the manufacturing cost of the mold member (forming mold) for forming the sealing resin is increased. In addition, the semiconductor device unit (QFN unit) 10 disclosed in Japanese Patent Laid-Open Publication No. 2002-43-31717 is cut by using an adhesive sheet at the time of cutting (for example, refer to paragraphs of Japanese Patent Publication No. 2002-343817) [0030] Figure 4). Therefore, there is a problem that the running cost increases when the product is manufactured by cutting (single piece).

An object of the present invention is to provide a manufacturing apparatus and a manufacturing method capable of suppressing at least one of reduction in productivity when manufacturing a product, an increase in manufacturing cost of a molding die, and an increase in running cost when manufacturing a product, and will be The cut pieces are singulated to produce an article.

In order to solve the above problems, the manufacturing apparatus of the present invention is used for a plurality of first cutting lines having a plurality of directions along a first direction, and a second cutting line of a plurality of second directions intersecting with a first direction. When the object to be cut in the plurality of regions surrounded by the first cutting line and the second cutting line is cut, and the plurality of products corresponding to the plurality of regions are separately manufactured, the manufacturing apparatus includes the object to be cut. a table that cuts a rotating blade of the object to be cut, and a moving mechanism that relatively moves the table and the rotating blade at a relative moving speed, at least controls a rotation of the rotating blade and a movement of the moving mechanism, and the control unit The manufacturing apparatus controls the manufacturing apparatus in such a manner as to perform the following operations.

(1) In the plurality of first cutting lines, the rotary blade cuts the first operation of the object to be cut by the first moving speed.

(2) In the plurality of second cutting lines, the rotating blade cuts a part of the thickness of the cut object by the second moving speed to form the second operation of the cutting groove.

(3) The third operation of cutting the residual thickness in the full thickness of the object to be cut by the third moving speed in the cutting groove.

In the manufacturing apparatus of the present invention, in the above-described manufacturing apparatus, the object to be cut includes a substrate and functional elements individually provided in a plurality of regions of the substrate.

In the manufacturing apparatus of the present invention, in the above-described manufacturing apparatus, the object to be cut includes a substrate, a functional element individually provided in a plurality of regions of the substrate, and a sealing resin for protecting the functional element.

In the manufacturing apparatus of the present invention, in the above manufacturing apparatus, the substrate is a lead frame, and the thickness of the rotating blade is larger than the width of the connecting rod included in the lead frame.

In the manufacturing apparatus of the present invention, in the above-described manufacturing apparatus, the plurality of products are QFN.

In the manufacturing apparatus of the present invention, in the above-described manufacturing apparatus, the third moving speed is the same as or shorter than the second moving speed.

In order to solve the above problems, the manufacturing method of the present invention has a plurality of first cutting lines along the first direction, a second cutting line along a plurality of second directions intersecting the first direction, and the first cutting line The cut product of the plurality of regions surrounded by the cutting line and the second cutting line is cut, thereby manufacturing a plurality of products corresponding to the plurality of regions, and includes the steps of preparing a table including the object to be cut a step of manufacturing a moving mechanism that cuts a rotating blade of the object to be cut and relatively moves the table and the rotating blade at a relative moving speed; and in the plurality of first cutting lines, the rotating blade is moved by the first The first step of cutting the object to be cut at a speed; in the plurality of second cutting lines, the rotating blade cuts a part of the thickness of the cut object by the second moving speed to form a cutting groove The second step is a third step of cutting the residual thickness in the full thickness of the object to be cut by the third moving speed in the cutting groove.

In the manufacturing method of the present invention, in the above-described manufacturing method, the object to be cut includes a substrate and functional elements individually provided in a plurality of regions of the substrate.

In the above-described manufacturing method, the object to be cut includes a substrate, a functional element individually provided in a plurality of regions of the substrate, and a sealing resin for protecting the functional element.

The manufacturing method of the present invention, in the above manufacturing method, the substrate For the lead frame, the thickness of the rotating blade is greater than the width of the connecting rod included in the lead frame.

In the production method of the present invention, in the above production method, the plurality of products are QFN.

In the manufacturing method of the present invention, in the above manufacturing method, the third moving speed is the same as or shorter than the second moving speed.

According to the invention, the control unit controls the first cutting line of the plurality of cutting lines, and the first operation of cutting the object to be cut by the rotary blade; and the cutting edge of the plurality of cutting lines The thickness of a portion of the thickness is the second operation for forming the cutting groove; and the third operation for cutting the residual thickness of the entire thickness of the object to be cut in the cutting groove. Thereby, the processing load can be reduced when the object to be cut formed of the multilayered structure is singulated to manufacture a product. Therefore, it is possible to prevent the product from deviating from the predetermined position of the stage and scattering. According to this, first, it is possible to suppress a decrease in productivity when manufacturing a product. Secondly, since it is not necessary to form a convex portion on the inner surface of the molding die, an increase in the manufacturing cost of the molding die can be suppressed. Thirdly, since it is not necessary to use an adhesive sheet, it is possible to suppress an increase in running cost when manufacturing a product.

The above and other objects, features, aspects and advantages of the present invention will become apparent from the accompanying Detailed Description.

1‧‧‧QFN substrate (cut object)

2‧‧‧ lead frame (substrate)

3‧‧‧Semiconductor wafer (functional element)

4‧‧‧ die pad

4a‧‧‧ below the die pad

5‧‧‧Lead

5a‧‧‧ below the lead

5b‧‧‧ side of the lead

6‧‧‧ Connecting rod

7‧‧‧Combined lead

8‧‧‧ Sealing resin

9‧‧‧ cutting line (first cutting line, second cutting line)

10‧‧‧ cutting line (second cutting line, first cutting line)

11‧‧‧Area

12‧‧‧Rotary blade

13‧‧‧QFN products (products)

14‧‧‧Severance desk (set)

15‧‧‧Cut cutting tool

16‧‧‧metal knife

17‧‧‧Resin sheet

18‧‧‧Protruding

19‧‧‧Sucking holes

20‧‧‧ space

21, 22‧‧‧ cut the ditch

23‧‧‧Cutting trench

24, 26‧‧‧ cut marks

25‧‧‧Intermediate

27‧‧‧Manufacture of equipment

28‧‧‧Substrate supply mechanism

29‧‧‧Mobile agencies

30‧‧‧Rotating mechanism

31‧‧‧ mandrel

32‧‧‧Checking desk

33‧‧‧Cuted QFN substrate

34‧‧‧Tray

A‧‧‧Substrate supply module

B‧‧‧Substrate cutting module

C‧‧‧Check module

CTL‧‧‧Control Department

X, Y, Z‧‧ Direction

θ ‧‧‧ angle

Fig. 1A is a plan view showing a QFN substrate cut by a manufacturing apparatus according to an embodiment of the present invention, and Fig. 1B is a cross-sectional view taken along line A-A.

2A is a plan view showing a state before the QFN substrate shown in FIGS. 1A and 1B is cut, and FIG. 2B is a plan view showing a state after the QFN substrate is singulated.

Fig. 3A is a bottom view showing a QFN product in which the QFN substrate shown in Figs. 1A and 1B is diced, and Fig. 3B is a perspective view.

Fig. 4A is a plan view showing a cutting jig used in a manufacturing apparatus of one embodiment of the present invention, and Fig. 4B is a cross-sectional view taken along line B-B.

Fig. 5A is a plan view showing a state in which a part of the full thickness of the QFN substrate is cut along the longitudinal direction of the QFN substrate by using the manufacturing apparatus of one embodiment of the present invention, and Fig. 5B is a cross-sectional view taken along line C-C.

6A is a plan view showing a state in which a full thickness portion corresponding to the QFN substrate is cut along the short side direction of the QFN substrate by using the manufacturing apparatus of one embodiment of the present invention, and FIG. 6B is a DD line sectional view. .

Fig. 7A is a plan view showing a state in which the remaining portion of the full thickness of the QFN substrate is cut along the longitudinal direction of the QFN substrate by using the manufacturing apparatus of one embodiment of the present invention, and Fig. 7B is a sectional view taken along line EE. .

Fig. 8 is a plan view showing an outline of a manufacturing apparatus of one embodiment of the present invention.

As shown in FIGS. 7A and 7B, the QFN substrate is cut in three stages along a plurality of cutting lines which are set in a lattice shape on the QFN substrate 1. First, in the cutting line 9 along the longitudinal direction of the QFN substrate 1, a portion corresponding to the thickness of the connecting rod 6 of the lead frame 2 is cut to form a cutting groove 23 (half-cut). Next, in the cutting line 10 along the short-side direction of the QFN substrate 1, a portion corresponding to all (full thickness) of the thickness of the QFN substrate, in other words, the lead frame 2 and the sealing resin 8 are cut together. Broken (full cut). Next, in the cutting groove 23 along the longitudinal direction of the QFN substrate 1, the residual equivalent is A portion of the thickness of the sealing resin 8 is cut. By cutting only the portion of the sealing resin 8 in the cutting groove 23, the processing load at the time of singulating the QFN substrate 1 into the QFN article 13 can be reduced. Therefore, it is possible to prevent the QFN product 13 from being deviated from the predetermined position of the cutting jig 15 and scattering.

[Example 1]

The first embodiment of the manufacturing apparatus of the present invention will be described with reference to Figs. 1A to 7B. The drawings in any of the present documents are appropriately omitted or exaggerated and depicted in the drawings for the sake of easy understanding. The same components are denoted by the same reference numerals, and their descriptions are omitted as appropriate.

As shown in FIGS. 1A and 1B, the QFN substrate 1 has a lead frame 2. In the lead frame 2, a semiconductor wafer mounting portion (die pad) 4 on which a semiconductor wafer (functional element) 3 is mounted is arranged in a lattice pattern. The lead frame 2 is made of a metal such as copper (Cu) or 42 alloy (Fe-Ni), and a lead-free solder plating treatment (not shown) is applied to the surface. A plurality of leads 5 are disposed around each of the die pads 4. In FIGS. 1A and 1B, the leads 5 connected to the electrodes (not shown) of the semiconductor wafer 3 are individually arranged on each side of the die pad 4 in four. A plurality of lead wires 5 disposed around the respective die pad 4 are individually connected to the connecting rods 6 of the metal frame arranged in a lattice shape in the lead frame 2.

In the first drawing, three lead frames in the longitudinal direction (in the vertical direction in the drawing) and three in the short-side direction (the horizontal direction in the drawing) are shown, and a total of twelve die pads 4 are arranged. 2. For example, in the case of a small QFN product having a side of 2 mm or less, 4,000 to 6,000 semiconductor wafers 3 are mounted on one QFN substrate 1.

As shown in FIG. 1B, semiconductor crystals are individually mounted on each of the die pads 4. Slice 3. The electrodes (not shown) provided in the respective semiconductor wafers 3 are electrically connected to the leads 5 disposed around the die pad 4 by bonding wires 7 made of gold wires or copper wires. All the semiconductor wafers 3 and the bonding leads 7 mounted on the die pad 4 of the lead frame 2 are collectively resin-sealed by the sealing resin 8. The QFN substrate 1 is a multilayer structure having a lead frame 2 and a sealing resin 8. The QFN substrate 1 is a cut object that is finally cut and singulated.

As shown in FIG. 1A, in the QFN substrate 1, a plurality of cutting lines 9 are set along the longitudinal direction of the connecting rod 6 arranged along the longitudinal direction. Similarly, a plurality of cutting lines 10 are set along the short-side direction on the center line of the connecting rod 6 arranged in the short-side direction. The plurality of cutting lines 9 and the plurality of cutting lines 10 are lattice-shaped cutting lines that are imaginarily set in the QFN substrate 1.

As shown in FIG. 1B, the cut line of the cutting line 9 and the QFN substrate 1 of the cutting line 10 is a multilayer structure in which the sealing resin 8 is formed on the connecting rod 6 made of metal (two-layer structure) ). Therefore, the QFN substrate 1 is singulated by cutting the multilayer structure in which the connecting rod 6 and the sealing resin 8 are laminated. The plurality of QFN products are individually singulated by the plurality of regions 11 surrounded by the cutting line 9 and the cutting line 10.

As shown in FIG. 2A, the QFN substrate 1 is cut by, for example, a cutting mechanism (not shown) having a rotary blade 12 along a plurality of cutting lines 9 and a plurality of cutting lines 10 of the QFN substrate 1. In this case, the QFN substrate 1 is cut using the rotary blade 12 which is thicker than the width of the connecting rod 6. Since the thickness of the rotary blade 12 is larger than the width of the connecting rod 6, the connecting rod 6 is cut by the full width by the rotary blade 12. Therefore, after the end of the cutting, the connecting rod 6 is completely removed. In FIG. 2A, for example, the width of the connecting rod 6 of the lead frame 2 is formed to be 0.2 mm. The QFN substrate 1 was cut using a rotary blade 12 having a thickness of 0.3 mm.

As shown in FIG. 2B, the QFN substrate 13 is manufactured by cutting and singulating the QFN substrate 1. By completely removing the connecting rod 6, the individual leads 5 connected to the connecting rod 6 are cut away from the connecting rod 6. Therefore, the lead wires 5 of the singulated QFN product 13 are terminals which are individually separated from the connecting rod 6 and are electrically independent. The lead 5 of the electrically independent terminal is connected to an electrode (not shown) of the semiconductor wafer 3 via the bonding wire 7. The case where the QFN product 13 is viewed from the plane is a leadless type product which does not have a lead for electrical connection on the outside of the product. Since the exterior of the article does not have leads, the package area of the article can be reduced. In addition, in FIGS. 2A and 2B, in order to show the state of the inside of the QFN substrate 1 and the QFN article 13, the illustration of the sealing resin 8 is omitted.

3A and 3B individually show the state of the singulated QFN article 13 as viewed from below. Leads 5 of electrically independent terminals are individually arranged on the four sides below the QFN article 13. In the 3A and 3B drawings, four lead wires 5 are individually arranged on each side. In the singulated QFN product 13, the lower surface 4a of the die pad 4 and the lower surface 5a of each lead 5 (see FIG. 1A and FIG. 1B) are maintained in the initial state in which the plating process is applied. However, the side surface 5b of each lead 5 cut by the rotary blade 12 is in a state in which the original metal which is not plated is exposed by cutting. Therefore, the lower surface 5a of the plated lead 5 is used as an electrode of the QFN article 13. The lower surface 5a of each lead 5 of the QFN product 13 is connected to a printed circuit board (PCB: Print Circuit Board) via solder, for example, and the QFN product 13 is used.

As shown in FIGS. 4A and 4B, the cutting table 14 is a table for cutting and singulating the QFN substrate 1 in a manufacturing apparatus. The cutting jig 15 corresponding to the product is attached to the cutting table 14. The cutting fixture 15 includes a metal knife 16 And a resin sheet 17 fixed to the metal blade 16. The resin sheet 17 is required to have moderate flexibility for mitigating the impact of the machine. The resin sheet 17 is preferably formed of, for example, an anthrone-based resin or a fluorine-based resin. In order to reduce the operating cost of the manufacturing apparatus, the cutting table 14 is common to the plurality of products, and only the size and number of the products corresponding to the jig 15 are replaced.

The resin sheet 17 of the cutting jig 15 is provided with a plurality of terrace-like projections 18 that individually adsorb and hold the plurality of regions 11 of the QFN substrate 1. In Fig. 4A, six projections 18 having a total length of six in the longitudinal direction and three in the short side direction are shown. In the cutting jig 15 , a plurality of suction holes 19 penetrating the resin sheet 17 and the metal blade 16 from the surface of the plurality of projections 18 are provided. The plurality of suction holes 19 are individually connected to the space 20 provided in the cutting table 14. The space 20 of the cutting table 14 is connected to an external suction mechanism (not shown). The plurality of regions 11 of the QFN substrate 1 are attracted to the cutting jig 15 by the respective corresponding suction holes 19.

As shown in FIG. 4A, for example, a plurality of cutting grooves are provided along the longitudinal direction so as to correspond to the cutting line 9 along the longitudinal direction of the QFN substrate 1 shown in FIGS. 1A and 1B. twenty one. Similarly, a plurality of cutting grooves 22 are provided along the short side direction so as to correspond to the cutting line 10 along the short side direction. In the longitudinal direction of the resin sheet 17 (cutting jig 15), the plurality of cutting grooves 21 are formed separately along the short side direction of the resin sheet 17 (cutting jig 15). . The depth of the plurality of cutting grooves 21 and the plurality of cutting grooves 22 (the distance from the upper surface of the protruding portion 18 to the inner bottom surface of each groove) is set to about 0.5 mm to 1.0 mm.

Please refer to Figure 5A ~ Figure 7B for the cutting and singulation of QFN The step of the substrate 1. First, as shown in FIGS. 5A and 5B, the surface of the QFN substrate 1 on the lead frame 2 side faces upward to mount the QFN substrate 1 on the cutting table 14. In this state, the short-side direction of the cutting table 14 of the manufacturing apparatus is arranged along the X direction and the longitudinal direction in the Y direction.

In a state in which the QFN substrate 1 is placed on the cutting table 14, the respective regions 11 of the QFN substrate 1 are individually placed on the protruding portion 18 of the cutting jig 15 fixed to the cutting table 14. Therefore, a plurality of cutting lines 9 along the longitudinal direction of the QFN substrate 1 are disposed on a plurality of cutting grooves 21 formed along the longitudinal direction of the cutting jig 15 . Similarly, a plurality of cutting lines 10 along the short side direction of the QFN substrate 1 are disposed on a plurality of cutting grooves 22 (see FIG. 4A) formed along the short side direction of the cutting jig 15 (see FIG. 4A). . In a state in which the QFN substrate 1 is placed at a predetermined position of the cutting table 14, the respective regions 11 of the QFN substrate 1 are individually sucked by the respective suction holes 19 provided in the cutting jig 15 . The respective regions 11 are individually sucked by the cutting jig 15 to fix the QFN substrate 1 to the cutting table 14.

Next, the cutting table 14 is moved relative to the cutting mechanism (not shown). The so-called "relative movement" words include the following three aspects. In such a manner, the cutting table 14 is fixed and the cutting mechanism is moved, the cutting mechanism is fixed, and the cutting table 14 is moved, and both the cutting table 14 and the cutting mechanism are provided. The way of moving. In the first embodiment, the cutting mechanism is fixed and the cutting table 14 is moved. Specifically, the state in which the QFN substrate 1 is cut by the rotary blade 12 attached to the cutting mechanism is shown.

As shown in FIGS. 5A and 5B, in the manufacturing apparatus, the cutting table 14 is movable in the Y direction of the drawing and is rotatable in the θ direction. The cutting mechanism (not shown) is movable in the X direction and the Z direction, and the rotary blade 12 moves in the X direction and the Z direction together with the moving mechanism. In the present embodiment, the rotary blade 12 having a larger width than the connecting rod 6 is used (refer to FIGS. 2A and 2B).

Next, as shown in FIG. 5B, the rotary blade 12 attached to the cutting mechanism is lowered outside the QFN substrate 1. The lower end of the rotary blade 12 is reached to the lower surface of the lead frame 2 of the QFN substrate 1, and specifically, the rotary blade 12 is lowered to the connecting rod 6 disposed along the longitudinal direction of the QFN substrate 1 (1A). Figure, Figure 1B) The deeper position below. Preferably, the rotary blade 12 is lowered such that the lower end of the rotary blade 12 is deeper than the lower surface of the lead frame 2 by 0.1 mm to 0.2 mm. The rotary blade 12 is rotated at a high speed of, for example, 30,000 to 40,000 rpm at a position along the cutting line 9 along the longitudinal direction of the QFN substrate 1. Next, the cutting table 14 is moved in the +Y direction by using a moving mechanism (not shown). For example, the movement is performed at the same moving speed (for example, 200 mm/sec) as the condition of the normal product having a large cutting area. The portion formed by the lead frame 2 (portion substantially corresponding to the thickness of the lead frame 2) is cut along the cutting line 9 along the longitudinal direction of the QFN substrate 1 by the rotating blade 12 that rotates at a high speed. In other words, only the lead frame 2 is cut substantially along the cutting line 9.

Since the lower end of the rotary blade 12 is lowered to a position deeper than the lower surface of the lead frame 2, the lead frame 2 is formed with a connecting rod 6 (see FIGS. 1A and 1B) (which is roughly equivalent to the thickness of the lead frame 2). Part), cutting across the full width of the connecting rod 6. A part of the sealing resin 8 is cut along the cutting line 9 along the longitudinal direction of the QFN substrate 1, and most of the sealing resin 8 remains without being cut. In this state, the cutting groove 23 (the portion of the thick broken line shown in FIG. 5A) is formed along the longitudinal direction of the QFN substrate 1. Along QFN All of the cutting lines 9 set in the longitudinal direction of the substrate 1 are cut by a portion (a portion corresponding to the thickness of the lead frame 2) formed by the lead frame 2. In Fig. 5A, the cutting line 9 on the left side of the drawing is sequentially cut.

The processing load when the lead frame 2 formed of the ductile material is cut is cut as compared with the processing load when the sealing resin 8 is cut, and the rotating blade 12 is easily clogged and becomes large. Therefore, in the QFN substrate 1, the portion of the lead frame 2 having a large processing load, in which the connecting rod 6 (see FIG. 1A and FIG. 1B) is formed (the portion corresponding to the thickness of the lead frame 2) is first cut off. .

Next, as shown in Fig. 6A, the cutting table 14 is rotated by 90 degrees using a rotating mechanism (not shown). In this state, the cutting line 10 along the short side direction of the QFN substrate 1 is arranged along the Y direction. In the longitudinal direction of the QFN substrate 1, a cutting groove 23 (a thick broken line as shown) is formed along the cutting line 9 in the longitudinal direction.

Next, as shown in FIG. 6B, on the outer side of the QFN substrate 1, the lower end of the rotary blade 12 reaches a position deeper than the lower surface of the sealing resin 8 of the QFN substrate 1, and the rotary blade 12 is lowered. It is preferable to lower the rotary blade 12 such that the lower end of the rotary blade 12 is deeper than the sealing resin 8 by 0.1 mm to 0.2 mm. Next, the rotary blade 12 is rotated at a high speed in accordance with the position along the cutting line 10 of the QFN substrate 1. Next, the cutting table 14 is moved in the +Y direction by a moving mechanism (not shown) to move at a normal moving speed of 200 mm/sec. The portion formed by the lead frame 2 and the sealing resin 8 (corresponding to the full thickness portion of the QFN substrate 1) is formed along the cutting line 10 set in the short-side direction of the QFN substrate 1 by the rotating blade 12 that rotates at a high speed. ) cut off together.

The lower end of the rotary blade 12 is lowered to a position deeper than the lower surface of the sealing resin 8, and the connecting rod 6 of the lead frame 2 (please refer to FIG. 1A and FIG. 1B). The portion formed by the sealing resin 8 is cut across the entire width of the connecting rod 6. In this state, the slit-shaped cut marks 24 (portions of the thick solid lines shown in FIG. 6A) are formed along the short-side direction of the QFN substrate 1. The intermediate portion 25 (portion shown by the halftone dot in the figure) is formed by cutting a portion corresponding to the full thickness of the QFN substrate 1 in the short-side direction of the QFN substrate 1. In the intermediate body 25, three regions 11 arranged in the short side direction are connected. The intermediate body 25 is separated by the cutting marks 24 corresponding to the two cutting lines 10 . The portions formed by the lead frame 2 and the sealing resin 8 are collectively cut along all the cutting lines 10 set in the short-side direction of the QFN substrate 1. In Fig. 6A, the cutting line 10 on the left side of the drawing is sequentially cut. In this process, unnecessary portions of both ends (left end and right end of FIG. 6A) of the QFN substrate 1 are cut away and removed.

The lead frame 2 is cut together with the QFN substrate 1 of the multilayer structure in which the sealing resin 8 is laminated along the short side direction of the QFN substrate 1. Since the lead frame is a ductile material, the rotary blade 12 is easily clogged at the time of cutting, and the processing load is increased. Therefore, the processing load becomes larger as the lead frame 2 and the sealing resin 8 are collectively cut as compared with the case where the lead frame 2 or the sealing resin 8 is separately cut. Therefore, in this state, the intermediate body 25 is stably sucked and cut by the individual suction holes 19 (see FIGS. 4A and 4B) which are arranged in the three regions 11 in the short-side direction. Fixture 15. Therefore, when the cutting table 14 is moved at a normal speed and the QFN substrate 1 is cut in the short-side direction, the intermediate body 25 is not displaced from the predetermined position of the cutting jig 15 and is scattered. In the actual QFN substrate 1, the intermediate portion 25 is stably adsorbed to the cutting jig 15 by arranging the regions 11 of about 40 to 60 in the short-side direction.

Next, as shown in Fig. 7A, a rotating mechanism (not shown) is used. The cutting table 14 is rotated by 90 degrees. In this state, the cutting grooves 23 formed along the longitudinal direction of the QFN substrate 1 are arranged along the Y direction. The cutting marks 24 formed along the short side direction of the QFN substrate 1 are arranged along the X direction. The six intermediate bodies 25 are individually separated from each other by cutting the cut marks 24 corresponding to the entire thickness of the QFN substrate 1 in the short-side direction of the QFN substrate 1.

Next, as shown in FIG. 7B, the rotary blade 12 is formed on the outer side of the assembly of the intermediate body 25 such that the lower end of the rotary blade 12 is lowered to a position deeper than the lower surface of the sealing resin 8 of the QFN substrate 1. decline. It is preferable that the lower end of the rotary blade 12 is made deeper than the lower surface of the sealing resin 8 by about 0.1 mm to 0.2 mm to lower the rotary blade 12. Next, the rotary blade 12 is aligned with the position of the cutting groove 23 (the thick broken line shown in FIG. 7A) formed along the longitudinal direction of the QFN substrate 1. Next, the cutting table 14 is moved in the +Y direction at 200 mm/sec of the normal moving speed. The remaining portion (portion substantially corresponding to the thickness of the sealing resin 8) formed by the sealing resin 8 is cut along the cutting groove 23 formed along the longitudinal direction of the QFN substrate 1 by the rotating blade 12 that rotates at a high speed.

Since the lower end of the rotary blade 12 is lowered to a position deeper than the lower surface of the sealing resin 8, the remaining portions formed by the sealing resin 8 are cut along the cutting groove 23. In this state, the cut mark 26 (the portion of the thick solid line shown in FIG. 7A) which is cut in the full thickness portion of the QFN substrate 1 is formed along the longitudinal direction of the QFN substrate 1. The remaining portion formed by the sealing resin 8 is cut along all the cutting grooves 23 formed along the longitudinal direction of the QFN substrate 1. In Fig. 7A, the cutting grooves 23 on the left side of the drawing are sequentially cut. In this process, the unnecessary portions of the both ends of the QFN substrate 1 (left end and right end in FIG. 7A) are cut away and removed.

The remaining portion of the sealing resin 8 is cut along the cutting groove 23 formed along the longitudinal direction of the QFN substrate 1, and the QFN substrate 1 is completely cut along the longitudinal direction. As a result, as shown in FIG. 7A, the QFN article 13 which is singulated by the cutting marks 24 formed along the short side direction and the cutting marks 26 formed along the longitudinal direction is individually manufactured.

As shown in Fig. 7B, the manufactured QFN product 13 is adsorbed to the cutting jig 15 by the respective corresponding suction holes 19. In the case where the processing load at the time of singulation of the intermediate body 25 is large, the QFN product 13 is displaced from the predetermined position of the cutting jig 15 and scattered. In the present embodiment, the remaining portion formed by the sealing resin 8 is cut along the cutting groove 23 formed along the longitudinal direction of the QFN substrate 1 to singulate the QFN article 13. Therefore, when the QFN product 13 is singulated, since the portion corresponding to the thickness of the sealing resin 8 is substantially cut, the processing load can be reduced. Since the processing load at the time of final singulation can be reduced, even if the cutting table 14 is moved at a normal speed to singulate the QFN substrate 1 into the QFN product 13, the QFN product 13 can be prevented from being cut. The specified position of the jig 15 is deviated and scattered.

In the present embodiment, in the case where the QFN substrate 1 is singulated into the QFN article 13, the QFN substrate is cut in three stages in three stages along a plurality of cutting lines set on the QFN substrate 1. First, the portion formed by the lead frame 2 is cut along the cutting line 9 set along the longitudinal direction of the QFN substrate 1. In this step, the cutting table 14 is moved at a normal speed of 200 mm/sec, and only a portion corresponding to the thickness of the lead frame 2 is cut. Accordingly, a portion corresponding to a part of the thickness of the full thickness of the QFN substrate 1 is cut along the longitudinal direction of the QFN substrate 1. Next, along the short side direction of the QFN substrate 1, the lead frame 2 and the sealing resin 8 are The laminated multilayer structure is cut off together. In this step, the cutting table 14 is moved at a normal speed of 200 mm/sec, and a portion corresponding to the full thickness of the QFN substrate 1 is cut along the short-side direction of the QFN substrate 1. Next, the remaining portion formed by the sealing resin 8 is cut along the cutting groove 23 formed along the longitudinal direction of the QFN substrate 1. In this step, the cutting table 14 is moved at a normal speed of 200 mm/sec, and the QFN substrate 1 is completely cut along the longitudinal direction. The QFN substrate 1 is singulated into a QFN article 13 by dividing the QFN substrate 1 into three stages.

According to the present embodiment, finally, only the residual portion formed by the sealing resin 8 is cut along the cutting groove 23 formed along the longitudinal direction of the QFN substrate 1. Thereby, the QFN substrate 1 is singulated into the QFN article 13. Since only the remaining portion formed by the sealing resin 8 is cut at the end, the processing load at the time of singulation into the QFN product 13 can be reduced. Therefore, even if the cutting table 14 is moved and singulated into the QFN product 13 at the same moving speed as the normal product having a large cutting area, the QFN product 13 can be prevented from being cut from the jig 15 The specified position deviates and scatters. Even in the case of manufacturing a small-sized QFN product having a side of 2 mm or less, it is possible to prevent the positional deviation from the predetermined position of the cutting jig 15 from being scattered. Therefore, the quality and productivity of the QFN product can be improved.

According to the present embodiment, as in the case of singulation of a normal product having a large area, the cutting table 14 can be moved at 200 mm/sec. at the same normal moving speed, and the QFN substrate 1 can be cut and singulated. . Even when the cutting table 14 is moved and the QFN substrate 1 is cut at the same moving speed as the normal moving speed, the QFN product 13 can be prevented from being displaced from the predetermined position of the cutting jig 15 and scattered. Therefore, it is not necessary to adopt a conventional method, and the moving speed of the cutting table 14 at the time of final cutting and singulation is as late as 1/10 and singulated Methods. Therefore, compared with the case of the conventional two-stage cutting, the moving speed of the cutting table 14 can be substantially increased by cutting the QFN substrate 1 in three stages as in the present embodiment. Therefore, the productivity of the manufacturing apparatus can be improved, and the operating cost of the manufacturing apparatus can be reduced.

The "moving speed that is the same as the normal moving speed" means substantially the same moving speed. Even if the moving speed of the manufacturing apparatus is slightly delayed compared with the moving speed of the conventional manufacturing apparatus, the manufacturing apparatus can achieve the same level of UPH (Unit Per Hour) as compared with the conventional manufacturing apparatus. It is considered to be "the same moving speed as the normal moving speed".

In particular, in recent years, with the increase in the size of the QFN substrate 1 and the miniaturization of the QFN product 13, the traveling distance of the rotary blade 12 is long when a large number of QFN products 13 are cut by cutting one QFN product 1 . According to the present invention, when the traveling distance of the rotary blade 12 is long when one QFN substrate 1 is cut, the moving speed of the cutting table 14 at the time of final cutting and singulation is not required. The degree of movement speed is 1/10. According to this, the productivity of the manufacturing apparatus can be improved, and the present invention produces a remarkable effect as compared with the prior art.

Further, in the connecting rod 6 of the lead wire 2, the rotary blade 12 cuts only the portion corresponding to the thickness of the lead frame 2. In this case, the processing load individually received by the QFN substrate 1 and the rotary blade 12 is reduced as compared with the case where the rotating blade 12 cuts the full thickness of the QFN substrate. Accordingly, it is not preferable to prevent the side surface 5b of the lead 5 near the upper edge of the product from being pulled to the rotational direction of the rotary blade 12 and deforming (in particular, the case where the lead frame 2 is made of copper is likely to occur).

Still, as in this embodiment, it is singulated with a conventional product. In the same manner, the moving speed of the cutting table 14 is set to 200 mm/sec which is the same as the normal moving speed, and the next step is performed to singulate the QFN substrate 1. These steps are a step of cutting a portion corresponding to a thickness of a part of the full thickness of the QFN substrate 1, a step of cutting a portion corresponding to the full thickness of the QFN substrate 1, and a step of cutting a portion corresponding to the residual thickness in the full thickness. . In addition, in the case where the portion corresponding to the full thickness of the QFN substrate 1 is cut, the cutting table 14 can be moved and the QFN substrate 1 can be cut at a moving speed that is later than the normal speed. In the case where the object to be cut has a more difficult machinability, for example, the moving speed may be about 2/5 to 1/2 of the normal moving speed.

[Example 2]

The second embodiment of the manufacturing apparatus of the present invention will be described with reference to Fig. 8. As shown in Fig. 8, the manufacturing apparatus 27 is a device for singulating a cut object (multilayer structure) into a plurality of products. The manufacturing apparatus 27 includes a substrate supply module A, a substrate cutting module B, and an inspection module C as individual constituent elements. Each component (each module A to C) is detachable and exchangeable with respect to other components.

The substrate supply mechanism 28 is provided in the substrate supply module A. The QFN substrate 1 corresponding to the object to be cut is carried out from the substrate supply mechanism 28, and transferred to the substrate cutting module B by a transfer mechanism (not shown). The board supply module A is provided with a control unit CTL that sets the operation and cutting conditions of the manufacturing apparatus 27 and controls them.

The manufacturing apparatus 27 shown in Fig. 8 is a manufacturing apparatus of a single cutting table type. Therefore, one cutting table 14 is provided in the substrate cutting module B. The cutting table 14 is movable in the Y direction of the drawing by the moving mechanism 29, and is rotatable in the θ direction by the rotating mechanism 30. The cutting jig 15 is attached to the cutting table 14 (see FIGS. 4A and 4B), and is placed on the cutting jig 15 And sucking the QFN substrate 1.

The cutting mechanism and the mandrel 31 are provided in the substrate cutting module B. The manufacturing apparatus 27 is a manufacturing apparatus which consists of a single spindle which provided one spindle 31. The mandrel 31 is independently movable in the X direction and the Z direction. A rotating blade 12 is mounted on the mandrel 31. A cutting water nozzle (not shown) for jetting cutting water to suppress frictional heat generated by the rotating blade 12 that rotates at a high speed is provided in the mandrel 31. The QFN substrate 1 is cut by the relative movement of the cutting table 14 and the mandrel 31. The rotary blade 12 cuts the QFN substrate 1 by including in-plane rotation in the Y direction and the Z direction.

In the substrate cutting module B, first, the thickness of a part of the full thickness of the QFN substrate 1 is cut along the cutting line along the longitudinal direction of the QFN substrate 1. Then, the QFN substrate 1 is rotated by 90 degrees by the rotating mechanism 30, and a portion corresponding to the full thickness of the QFN substrate 1 is cut along a cutting line along the short side direction of the QFN substrate 1. Then, the QFN substrate 1 is rotated by 90 degrees by the rotating mechanism 30, and a portion corresponding to the thickness of the entire thickness of the QFN substrate 1 is cut along the cutting groove along the longitudinal direction of the QFN substrate 1. The QFN product 13 is manufactured by cutting the QFN substrate 1 in three stages (refer to Figs. 5A to 7B).

An inspection table 32 is provided in the inspection module C. An assembly of a plurality of QFN products 13 that are singulated by cutting the QFN substrate 1 is placed on the inspection table 32, that is, the cut QFN substrate 33 is placed. The plurality of QFN products 13 are inspected by an inspection camera (not shown) to select good products and defective products. The good product is contained in the tray 34.

In the present embodiment, the control unit CTL that performs all operations and control of the operation of the manufacturing apparatus 27, the transport of the QFN substrate 1, the cutting of the QFN substrate 1, and the inspection of the QFN product 13 is provided in the substrate supply module. A. However, the present invention is not limited thereto, and the control unit CTL may be provided in another module.

In the present embodiment, a manufacturing apparatus 27 having a single cutting mechanism and a single spindle is described. However, the present invention is not limited thereto, and the present invention can also be applied to a manufacturing apparatus including a single cutting table system and a double mandrel or a manufacturing apparatus having a single cutting table type and a double mandrel.

In each of the embodiments, first, the thickness of a part of the full thickness of the QFN substrate 1 is cut along the cutting line along the longitudinal direction of the QFN substrate 1, and secondly, along the short side direction of the QFN substrate 1. The wire breakage corresponds to the thickness of the full thickness of the QFN substrate 1, and finally, the portion corresponding to the thickness of the entire thickness of the QFN substrate 1 is cut along the cutting groove along the longitudinal direction of the QFN substrate 1. However, the present invention is not limited thereto. First, in the modified example, the thickness of a part of the full thickness of the QFN substrate 1 is cut along the cutting line along the short side direction of the QFN substrate 1, and secondly, along the QFN substrate 1. The cutting line in the longitudinal direction cuts the portion corresponding to the full thickness of the QFN substrate 1, and finally cuts along the cutting groove along the short side direction of the QFN substrate 1 corresponding to the total thickness of the QFN substrate 1. Part of the thickness.

In each of the embodiments, the QFN substrate 1 having a rectangular shape including a long side direction and a short side direction is cut as a cut object. However, the present invention is not limited thereto, and the case of cutting a QFN substrate having a square shape is also applicable to the present invention.

In each of the examples, the QFN substrate 1 on which the sealing resin 8 is formed on the lead frame 2 is cut as a cut object. However, the glass epoxy laminate, the printed wiring board, the ceramic substrate, the metal base substrate, the film base substrate, or the like may be used as the substrate to be cut, and the sealed substrate on which the sealing resin is formed may be used. Suitable for use in the present invention.

The functional element includes a semiconductor element such as an integrated circuit, a transistor, a diode, and the like, and further sensors, filters, actuators, vibrators, and the like. A plurality of functional elements can also be mounted in one area.

In each of the embodiments, the configuration in which the object to be cut is fixed by using the cutting jig 15 (see FIGS. 4A and 4B) attached to the cutting table 14 is applied to the present invention. However, the present invention is not limited thereto, and a configuration in which an object to be cut is fixed by using an adhesive tape may be applied to the present invention.

Further, in the case where the wafer of the germanium semiconductor or the compound semiconductor is maintained in the state of the wafer and the wafer-level package of the resin is sealed, the substantially cut object having a circular shape is cut, and it is also applicable to the description so far. Content. The object to be cut of the present invention may be a multilayer structure composed of two or more materials.

In the manufacturing apparatus of the present invention, when a product such as the QFN product 13 is produced by cutting a multilayer structure such as the QFN substrate 1, the following operation is performed. This operation is an operation of cutting the QFN substrate 1 by the rotary blade 12 in the cutting groove 23 formed before the final step in the final step (final step) of manufacturing the QFN product 13 or the like. Based on this, the manufacturing apparatus can also be controlled in the following order. First, a portion corresponding to the full thickness of the QFN substrate 1 is cut along a plurality of cutting lines 10 along the short side direction of the QFN substrate 1.

Second, the thickness of a part of the full thickness of the QFN substrate 1 is cut along a plurality of cutting lines 9 along the longitudinal direction of the QFN substrate 1, thereby forming the cutting grooves 23. Third, the portion of the thickness of the entire thickness of the QFN substrate 1 is cut along the cutting groove 23 formed by the plurality of cutting lines 9 along the longitudinal direction of the QFN substrate 1.

According to the present invention, in the cutting groove 23 formed before the final step, the multilayer structure of the QFN substrate 1 or the like is cut by the rotary blade 12, and finally the QFN product 13 or the like is finally produced. If this is the case, when the QFN substrate 1 is placed on the stage cutting table 14, the surface of the lead frame 2 side may be placed downward.

The gist of the present invention is that the following configuration is employed when the object to be cut is cut to produce a plurality of products which are singulated. In this configuration, in the final step (final step) of manufacturing a plurality of products, the cut object is cut by a rotary blade in the cutting groove formed before the final step. In other words, the gist of the present invention is to cut the thickness of the remaining portion of the full thickness of the object to be cut in the final step by cutting the object to be cut to manufacture a plurality of singulated articles. .

As the gist of the present invention is satisfied, the object to be cut may be a multilayer structure or a substantially single layer structure. As an example of a substantial single-layer structure, a functional element which functions as an electronic circuit or an actuator, and a substrate made of a material such as Si, SiC, SiN, GaN, diamond, or sapphire (crystal) may be used. circle). Other examples of the single-layer structure include ceramics and glass-based materials. Since these materials are hard and brittle materials, it is prone to occurrence of chipping, cracking, and the like when the material is cut.

According to the present invention, the processing load can be reduced in the case where the substantial single-layer structure is cut to complete the final product. According to this, first, it is possible to prevent the product from being deviated from the predetermined position of the cutting jig and scattering. Therefore, the yield can be improved at the time of manufacturing the product. Secondly, it is possible to prevent the occurrence of defects such as cracks and cracks in the product. Therefore, the quality of the product can be improved at the time of manufacturing the product.

In one of the case where the object to be cut is a multilayer structure and the case of a substantially single layer structure, the manufacturing apparatus of the present invention performs the following 3 Actions.

(1) In the plurality of cutting lines along the first direction, the rotary blade cuts a portion corresponding to the full thickness of the object to be cut.

(2) In the plurality of cutting lines along the second direction intersecting the first direction, the rotating blade cuts a part of the thickness of the entire thickness of the object to be cut, thereby forming a cutting groove.

(3) In the cutting groove formed along the second direction, the rotary blade cuts a portion of the total thickness of the object to be cut.

The order of the above operations (1) to (3) may be the order of the actions (1), (2), and (3), or the actions (2), (1), and actions (1). 3) The order.

In the above operation (2), the rotary blade cuts a part of the thickness of the upper side of the full thickness of the object to be cut. In the above operation (3), the rotary blade cuts the residual thickness of the middle and lower sides of the full thickness of the object to be cut (the residual thickness of a part of the thickness is removed by cutting from the full thickness in the operation (2)). Therefore, in any of the operations (2) and (3), the rotary blade and the object to be cut are processed in comparison with the case where the rotary blade is cut by the full thickness of the cut end. The load is reduced. Accordingly, in the operation (2), it is possible to prevent occurrence of defects such as cracks and cracks in the vicinity of the upper edge of the product. In the operation (3), it is possible to prevent the product from being deviated from the predetermined position of the cutting jig and scattering.

In the case where the object to be cut has a greater hardness or the case where the object to be cut has greater brittleness, in other words, in the case where the object to be cut has greater difficulty in cutting, the present invention The manufacturing apparatus performs the following four operations.

(1) In a plurality of cutting lines along the first direction, the rotary blade cuts a part of the thickness of the entire thickness of the object to be cut, thereby forming a cutting groove.

(2) In the cutting groove formed along the first direction, the rotary blade cuts off a portion of the total thickness of the object to be cut.

(3) In the plurality of cutting lines along the second direction intersecting the first direction, the rotary blade cuts a part of the thickness of the entire thickness of the object to be cut, thereby forming a cutting groove.

(4) In the cutting groove formed along the second direction, the rotary blade cuts a portion of the remaining thickness of the entire thickness of the object to be cut.

The above four actions are applied to one of the case where the object to be cut is a multilayer structure and the case of a substantially single layer structure. The order of the above operations (1) to (4) may be performed in accordance with the second order. First, the action (2) is performed after the action (1). Second, the action (4) is performed after the action (3). The order of operation is preferably the action (1), the action (2), and the action (3) by the minimum number of rotations of the cutting table 14 by the rotation mechanism 30 (refer to FIGS. 5A to 8). The order of the action (4), or the order of the action (3), the action (4), the action (1), and the action (2). By performing the above four operations as appropriate, it is possible to prevent the occurrence of cracks, cracks, and the like in the vicinity of the upper edge of the product, and to prevent the occurrence of scattering or scattering of the product from the predetermined position of the cutting jig.

In general, in the case where the object to be cut has a large difficulty in cutting property, the cutting device of the present invention performs the following operation. In the plurality of cutting lines along the first direction, the rotating blade cuts the object to be cut by N-stage cutting (N is an integer of N≧1). In the plurality of cutting lines along the second direction, the rotating blade cuts the object to be cut by M-stage cutting (M is an integer of M≧2). When the difficult-to-cut property of the object to be cut differs depending on the direction of cutting, the number of stages cut in a direction having a large hard-working property can be made larger than a direction cut along a direction having a small hard-to-cut property. The number of stages.

While the embodiments of the present invention have been described, the entire contents of the embodiments disclosed herein are considered to be illustrative and not restrictive. The scope of the present invention is intended to be embraced by the scope of the claims

1‧‧‧QFN substrate (cut object)

12‧‧‧Rotary blade

13‧‧‧QFN products (products)

14‧‧‧Severance desk (set)

27‧‧‧Manufacture of equipment

28‧‧‧Substrate supply mechanism

29‧‧‧Mobile agencies

30‧‧‧Rotating mechanism

31‧‧‧ mandrel

32‧‧‧Checking desk

33‧‧‧Cuted QFN substrate

34‧‧‧Tray

A‧‧‧Substrate supply module

B‧‧‧Substrate cutting module

C‧‧‧Check module

CTL‧‧‧Control Department

X, Y, Z‧‧ Direction

θ ‧‧‧ angle

Claims (12)

A manufacturing apparatus for use a first cutting line having a plurality of first directions along a first direction, a second cutting line along a second direction intersecting with a first direction, and a first cutting line by the first cutting line When the object to be cut in the plurality of regions which are individually surrounded by the second cutting line is cut, and the plurality of products corresponding to the plurality of regions are individually manufactured, the manufacturing apparatus includes a table on which the object to be cut is placed a cutting blade that cuts the object to be cut, a moving mechanism that relatively moves the table and the rotating blade at a relative moving speed, and a control unit that controls at least the rotation of the rotating blade and the movement caused by the moving mechanism The control unit controls the manufacturing apparatus such that the manufacturing apparatus performs the following operation: (1) in the plurality of first cutting lines, the rotating blade cuts the object to be cut by the first moving speed (1) In the plurality of second cutting lines, the rotating blade cuts a part of a thickness of the entire thickness of the object to be cut by a second moving speed to form a cutting groove 2 actions; and (3) the aforementioned cut In the groove, the third operation of cutting the remaining thickness of the full thickness of the object to be cut by the third moving speed is performed. The manufacturing apparatus according to claim 1, wherein the object to be cut includes a substrate and functional elements individually provided in the plurality of regions of the substrate. The manufacturing apparatus according to claim 1, wherein the object to be cut includes a substrate, a functional element individually provided in the plurality of regions of the substrate, and a sealing resin that protects the functional element. The manufacturing apparatus according to claim 3, wherein the substrate is a lead frame, and a thickness of the rotating blade is larger than a width of a connecting rod included in the lead frame. The manufacturing apparatus according to claim 4, wherein the plurality of products are Quad Flat Non-leaded Package (QFN). The manufacturing apparatus according to claim 1, wherein the third moving speed is the same as or shorter than the second moving speed. A manufacturing method of a plurality of first cutting lines along a first direction, a second cutting line along a second direction intersecting with a first direction, and the first cutting line and the aforementioned The object to be cut in the plurality of regions surrounded by the second cutting line is cut, thereby producing a plurality of products corresponding to the plurality of regions, and includes the steps of preparing a table having the object to be cut and cutting a step of manufacturing a moving mechanism that breaks a rotating blade of the object to be cut and relatively moves the table and the rotating blade at a relative moving speed; and in the plurality of first cutting lines, the rotating blade is a first step of cutting the object to be cut by the first moving speed; and in the plurality of second cutting lines, the rotating blade cuts a part of the full thickness of the cut object by the second moving speed Thickness to form a second step of the cutting groove; In the cutting groove, the third step of cutting the remaining thickness of the entire thickness of the object to be cut by the third moving speed is the third step. The manufacturing method according to claim 7, wherein the object to be cut includes a substrate and functional elements individually provided in the plurality of regions of the substrate. The manufacturing method according to claim 7, wherein the object to be cut includes a substrate, a functional element individually provided in the plurality of regions of the substrate, and a sealing resin that protects the functional element. The manufacturing method according to claim 9, wherein the substrate is a lead frame, and a thickness of the rotating blade is larger than a width of a connecting rod included in the lead frame. The manufacturing method according to claim 10, wherein the plurality of products are Quad Flat Non-leaded Package (QFN). The manufacturing method according to claim 7, wherein the third moving speed is the same as or shorter than the second moving speed.