JP2011035142A - Method of manufacturing circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit device which solves a bad condition due to charging of a sealing resin into an air vent in the resin sealing step. <P>SOLUTION: In the method of manufacturing the circuit device, a recess 22 is provided on an upper surface of a leadframe 10 in a region superposed on the air vent 60 of a mold die. In this manner, as a cross-sectional area of the air vent 60 spreads in accordance with a depth of the recess 22, a sealing resin 36 supplied to a cavity 58 is fully charged into the air vent 60. Consequently, the blockage of the air vent 60 due to the sealing resin 36 is suppressed, and the sealing resin 36 can be charged into the entire area of the cavity 56. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit device manufacturing method capable of efficiently manufacturing a large number of circuit devices from a single lead frame.

  As the capacity of semiconductor devices increases year by year, the number of lead terminals serving as various signal lines tends to increase. With this trend, a QFP (Quad Flat Package) type semiconductor device and a QFN (Quad Flat Non-Leaded Package) type semiconductor device in which lead terminals are derived from four directions have come to be used. . On the other hand, semiconductor devices are required to be reduced in size, thickness, and weight because they are employed in mobile phones, portable computers, and the like. Therefore, in a semiconductor device that requires a reduction in mounting area, a CSP (Chip Size Package) type package is used in which leads are exposed from the back surface of the resin sealing body and the mounting area is equal to or slightly larger than the chip size. Yes.

  In a conventional method for manufacturing a semiconductor device in which resin molding is performed through a sealing sheet in a resin sealing mold, the sealing sheet is attached to the entire opposing surface of the lead frame to which the semiconductor element is fixed. A technique is known in which the attached lead frame is placed in a resin-sealed mold and resin molding is performed (for example, Patent Document 1).

  Below, with reference to FIGS. 9-11, it demonstrates easily regarding the manufacturing method of the semiconductor device which performs resin molding through a sealing sheet in the conventional resin sealing metal mold | die. FIG. 9 is a cross-sectional view for explaining a lead frame with a sealing sheet attached thereto, FIG. 10 is a cross-sectional view for explaining a state in which the lead frame is installed in a resin-sealing mold, and FIG. It is sectional drawing for demonstrating the condition after resin package formation.

  As shown in FIG. 9, first, a plurality of mounting portions each including at least a signal connection terminal 102 and a die pad 103 for mounting a semiconductor chip 104 are formed on the lead frame 101. Then, after the sealing sheet 106 is bonded to the back surface of the lead frame 101, the semiconductor chip 104 is bonded to the upper surface of the die pad 103 with an adhesive. Thereafter, the semiconductor chip 104 bonded on the die pad 103 and the signal connection terminal 102 are electrically connected by the thin metal wire 105.

  Next, as shown in FIG. 10, the sealing sheet 106 is bonded, and the lead frame 101 to which the semiconductor chip 104 is bonded is placed in the cavity 109 of the resin-sealing mold including the upper mold 107 and the lower mold 108. To do. At this time, the cavity 109 is formed by holding the end portions of the lead frame 101 and the sealing sheet 106 with the upper mold 107 and the lower mold 108. And although not shown in figure, sealing resin is inject | poured from the resin injection gate provided in the resin sealing metal mold | die, and resin molding is performed.

  Next, as shown in FIG. 11, the resin-sealed mold is filled with a sealing resin to form the resin package 110, and then the lead frame 101 on which the common resin package 110 is formed is replaced with the resin-sealed mold. Release from the mold. Thereafter, although not shown, the common resin package 110 is cut into individual mounting parts by dicing, and the semiconductor device is completed.

JP 2004-172542 A

  However, in the manufacturing method described above, the following problems occur when the air vent 112 is filled with the sealing resin 114.

  Specifically, referring to FIG. 10, the sealing resin 114 injected into the cavity 109 of the mold moves in the direction indicated by the thick arrow, and a part of the sealing resin 114 passes through the cavity 109. The air vent 112 is filled. Accordingly, when the lead frame 101 is taken out from the upper mold 107 and the lower mold 108 after the sealing resin 114 injected into the cavity 109 is cured, the portion of the sealing resin 114 corresponding to the air vent 112 becomes the lead frame 101. It will be in the state which adhered to the upper surface of. Since the sealing resin 114 filled in the air vent 112 is only attached to the upper surface of the lead frame 101, the adhesion strength between the sealing resin 114 and the lead frame 101 in this portion is low. For this reason, in the process of transporting the lead frame 101, the sealing resin 114 filled in the air vent 112 is detached from the lead frame 101, which causes a problem that the work environment is contaminated.

  Furthermore, since the cross-sectional area of the air vent 112 in the direction in which the sealing resin 114 travels is very narrow, the liquid or semi-solid sealing resin 114 may be clogged in the air vent 112. In such a case, the sealing resin 114 does not reach the cavity 109 near the air vent 112 and a void is generated.

  The present invention has been made in view of the above-described problems, and a main object of the present invention is to provide a method for manufacturing a circuit device that eliminates problems caused by filling an air vent with a sealing resin in a resin sealing step. It is to provide.

  The method of manufacturing a circuit device according to the present invention includes a block configured by arranging units including islands and a plurality of leads in a matrix, and a support portion that surrounds the block, and is arranged along one side of the block. A step of preparing a lead frame in which a concave portion is formed on a main surface of a support portion; a step of fixing a circuit element to the island of each unit; and electrically connecting the circuit element and the lead; By storing the block in the cavity of the mold, injecting a sealing resin from the gate into the cavity, and releasing the air inside the cavity to the outside via the air vent along with the injection of the sealing resin, A step of resin-sealing each unit included in the block, a step of cutting and separating the sealing resin at a boundary of the unit, and Comprising, in the step of the resin sealing, the main surface of the lead frame of the concave portions are provided region, and wherein the facing air vents of the mold.

  In the present invention, a support portion is provided around the block of the lead frame, and the upper surface of the support portion along one side of the block is partially recessed to form a concave portion. In the resin sealing step, the lead frame is placed on the mold so that the concave portion overlaps the air vent. By doing so, the air vent and the concave portion overlap each other, whereby the cross section of the air vent with respect to the direction in which the sealing resin is injected becomes large, and the circulation of the sealing resin in the air vent is improved. Therefore, blocking of the sealing resin at the air vent and generation of voids inside the cavity are suppressed.

  Furthermore, a part of the sealing resin entering the air vent is fitted into a concave portion provided on the upper surface of the lead frame. Therefore, since the sealing resin filled in the air vent is firmly attached to the concave portion, separation of the sealing resin in the lead frame transport process or the like is prevented.

It is a figure which shows the lead frame used with the manufacturing method of the circuit apparatus of this invention, (A) is a top view, (B) is the enlarged top view. It is a figure which shows the lead frame used with the manufacturing method of the circuit device of this invention, (A) And (B) is a top view which expands and shows the area | region in which a recessed part is provided. It is a figure which shows the lead frame used with the manufacturing method of the circuit device of this invention. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) is a top view, (B) is sectional drawing. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) is sectional drawing, (B) is a top view. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) is sectional drawing, (B) is a top view, (C) is sectional drawing. It is a top view which shows the manufacturing method of the circuit apparatus of this invention. It is a figure which shows the circuit apparatus manufactured by the manufacturing method of the circuit apparatus of this invention, (A) is a perspective view, (B) is a perspective view. It is sectional drawing which shows the manufacturing method of the circuit device of background art. It is sectional drawing which shows the manufacturing method of the circuit device of background art. It is sectional drawing which shows the manufacturing method of the circuit device of background art.

  Hereinafter, a method for manufacturing a circuit device of the present invention will be described with reference to the drawings.

  With reference to FIGS. 1 to 3, first, the structure of a lead frame 10 used in the method for manufacturing a circuit device of the present invention will be described. Here, each drawing of FIG. 1 is a plan view showing the lead frame 10 as a whole. Each drawing in FIG. 2 is a diagram showing in detail the concave portion 22 provided in the lead frame 10. FIG. 3 is a plan view showing the configuration of the unit 26 included in the block 12.

  Referring to FIG. 1A, a lead frame 10 is formed into a predetermined shape by etching or punching a conductive foil made of a metal such as copper having a thickness of about 0.2 mm. Yes. The lead frame 10 has a strip shape, and the planar size is, for example, about vertical × horizontal = 60 mm × 140 mm. Further, the surface of the lead frame 10 is covered with a plating film in which, for example, nickel, palladium, and gold are sequentially laminated in this order.

  In the lead frame 10, a plurality of blocks 12 composed of a large number of units 26 are spaced apart. Here, five blocks 12 are arranged in a line along the longitudinal direction of the lead frame 10, but the number of the arranged blocks 12 may be one or two, or a large number of six or more. good.

  A peripheral portion of the block 12 is provided with a first support portion 14 and a second support portion 16 which are remaining regions where the block 12 is not formed, and these constitute a support portion that supports the lead frame 10 as a whole. Has been. The first support portion 14 is formed in a frame shape around the lead frame 10 so as to entirely surround the plurality of blocks 12. The second support portion 16 extends between the blocks 12 so as to connect the inner side sides of the first support portion 14.

  With reference to FIG. 1 (B), the structure of the block 12 provided in the lead frame 10 is demonstrated in detail. Inside the block 12, a plurality of units 26 are arranged in a matrix. Here, the unit 26 is a unit element constituting one circuit device. Referring to this figure, one block 12 is provided with 25 units 26 in 5 rows × 5 columns. However, a larger number of units 26 may be provided in the block 12.

  With reference to FIG. 1 (B), the recessed part 22 provided in the upper surface of the lead frame 10 is demonstrated. In this figure, two blocks provided in the lead frame 10 are shown, and a mold block cavity 56 and the like used in the subsequent resin sealing process are superimposed on the right block 12.

  With reference to this figure, a plurality of concave portions 22 are formed on the upper surface of the first support portion 14 along the side of the upper block 12 on the paper surface. Referring to the block 12 shown on the right side, the block 12 is covered by the cavity 56, a gate 58 is provided along the lower side of the block 12, and an air vent 60 is arranged along the upper side of the block 12. ing. Here, the cavity 56 is a space formed by a mold for sealing the block 12 with resin, and the gate 58 is a path through which liquid sealing resin injected into the cavity 56 flows. The air vent 60 is a path through which air inside the cavity 56 is discharged to the outside as the sealing resin is injected from the gate 58. Here, a plurality of air vents 60 are provided at equal intervals along the upper side of the cavity 56 in order to uniformly fill the cavity 56 with sealing resin.

  The concave portion 22 is provided corresponding to each air vent 60 described above. That is, the concave portion 22 composed of a plurality of grooves is formed on the upper surface of the first support portion 14 (lead frame 10) on which one air vent 60 is superimposed. By doing in this way, effects such as suppression of blockage of the air vent 60 in the resin sealing step are exhibited. This matter will be described later with reference to FIG.

  With reference to FIG. 2, the recessed part 22 provided in the lead frame 10 is explained in full detail. 2A is an enlarged plan view showing a portion of the lead frame 10 where the concave portion 22 is formed, and FIG. 2B is a plan view showing another configuration of the concave portion 22.

  Referring to FIG. 2A, here, a plurality of concave portions 22 that are elongated in the vertical direction on the paper surface are shown. Further, in this figure, the direction in which the sealing resin is injected in the subsequent resin sealing step is indicated by dotted arrows. From this, the longitudinal direction of the concave portion 22 shown in this figure is arranged in parallel to the flow of the sealing resin. These concave portions 22 are formed by etching simultaneously with the unit 26 in the step of forming the unit 26 included in the block 12. The concave portion 22 does not penetrate the lead frame 10, but is formed in a groove shape by half-etching the conductive foil, which is the material of the lead frame 10, about half in the thickness direction.

  The specific size of the concave portion 22 is as follows. First, the length L1 in the longitudinal direction (longitudinal direction) of the concave portion 22 is 1.6 mm or more and 1.7 mm or less as an example. Moreover, the length L2 of the horizontal direction (short direction) of the recessed part 22 is 0.12 mm or more and 0.50 mm or less as an example. Here, the plurality of concave portions 22 are arranged at equal intervals in the horizontal direction on the paper surface, and the length L3 at which the concave portions 22 are separated from each other is, for example, 0.15 mm or more and 0.5 mm or less. Further, here, four concave portions 22 are provided corresponding to one air vent 60 (see FIG. 1B), but the number of the concave portions 22 to be arranged is arbitrary (for example, 3 to 7). The following).

  In the plan view of FIG. 2B, a concave portion 22 that is elongated in the lateral direction on the paper surface is shown. That is, here, the longitudinal direction of the concave portion 22 is orthogonal to the flow of the sealing resin (the direction indicated by the arrow) facing upward on the paper surface. The width L4 in the horizontal direction (longitudinal direction) of the concave portion 22 shown in this figure is, for example, not less than 2.6 mm and not more than 2.8 mm. Moreover, the width L5 of the vertical direction (short direction) of the recessed part 22 is 0.12 mm or more and 0.5 mm or less as an example. Furthermore, the length L6 at which the concave portions 22 are separated from each other is, for example, 0.15 mm or more and 0.5 mm or less. Further, four concave portions 22 are arranged here, but the number of the concave portions 22 arranged may be other than this, for example, two or more and six or less.

  Furthermore, considering the depth of the concave portion 22 formed by wet etching in which the concave portion 22 proceeds isotropic, the depth of the concave portion 22 (L2 shown in FIG. 2A, FIG. 2). This is the same as L5) shown in (B).

  Furthermore, in the above description, the concave portion 22 is formed as an elongated groove on the upper surface of the lead frame 10, but the shape of the concave portion 22 may be other than the groove shape, and may be a square shape such as a dot shape, a circular shape, or a square shape. Etc.

  With reference to FIG. 3, the configuration of the units included in the block 12 will be described. The unit 26 is a unit element that constitutes one circuit device as described above. Here, the unit 26 includes one island 28 and a plurality of leads 30 arranged so as to surround the four sides of the island 28. Yes.

  Tie bars 32 are formed in a lattice shape between the units 26. The lead 30 of each unit 26 continuously extends from the tie bar 32 to the inside of the unit 26. Further, the island 28 is connected to the tie bar 32 via a suspension lead.

  Further, the position of each tie bar 32 accurately corresponds to the dividing lines 18 and 20. Accordingly, when dicing is performed at the dividing lines 18 and 20 in the manufacturing process, the tie bar 32 is removed. In this figure, a dividing line defined between the units 26 provided inside the block 12 (see FIG. 1B) is indicated by a dotted line. Here, since the units 26 are arranged in a matrix, the dividing lines are defined in a lattice. The dividing line 20 is defined in the vertical direction on the paper surface, and the dividing line 18 is defined in the horizontal direction on the paper surface.

  Furthermore, in order to reliably perform the above-described removal, the tie bar 32 is formed thin, and its width W2 is, for example, about 0.2 mm. That is, the width W2 of the tie bar 32 is formed to be narrower than the width of the dicing blade used in the process of separating the units 26 described later.

  Next, referring to FIG. 4, the semiconductor element 44 is fixed to a predetermined portion of the lead frame 10. FIG. 4A is a plan view showing one unit 26 in this step, and FIG. 4B is a cross-sectional view taken along line B-B ′ of FIG.

  In this step, die bonding and wire bonding of the semiconductor element 44 are performed on each block 12 of the lead frame 10 (see FIG. 1B). In this step, die bonding and wire bonding are collectively performed on all the blocks arranged on the lead frame 10 shown in FIG.

  Referring to FIG. 4A, first, the semiconductor element 44 is mounted on the upper surface of the island 28 via a conductive adhesive such as solder or an insulating adhesive such as epoxy resin. Then, the electrode provided on the upper surface of the semiconductor element 44 and the lead 30 are connected via the thin metal wire 46.

  Referring to FIG. 4B, in this step, the lower surface of the lead frame 10 is adhered to the upper surface of the adhesive sheet 48 almost entirely. The adhesive sheet 48 is a resin sheet with a thin adhesive resin applied to the upper surface, and, for example, polyimide or PET (Polyethylene Terephthalate) is adopted as the material thereof. The reason for bonding the back surface of the lead frame 10 to the adhesive sheet 48 is to prevent the sealing resin from flowing around the back surface of the lead frame 10 in the next resin sealing step.

  Next, referring to FIGS. 5 and 6, a sealing resin 36 is formed so as to cover the island 28, the lead 30, the thin metal wire 46 and the semiconductor element 44 shown in FIG. 4.

  Referring to FIG. 5A, in this step, resin sealing is performed using a mold die 50 including an upper die 52 and a lower die 54. In this step, a transfer mold using a thermosetting resin such as an epoxy resin or an injection mold using a thermoplastic resin such as polyethylene is employed.

  The mold 50 includes an upper mold 52 and a lower mold 54, and a gate 58 is provided in a region corresponding to the peripheral part of the block 12, and an air vent 60 is provided in the peripheral part of the block 12 facing the gate 58. Is formed.

  Referring to FIG. 5B, a pod 64 communicating with the cavity 56 via a runner 66 is further provided. Here, two pods 64 are provided via a runner 66 for one cavity 56. One runner communicates with the cavity 56 via a plurality of gates 58. Furthermore, a plurality (four in this case) of air vents 60 are provided at equal intervals on the upper side of the cavity 56. Here, the cavity 56, the gate 58, the runner 66, and the air vent 60 are configured as a gap between the upper mold 52 and the lower mold 54.

  The resin sealing method using the mold 50 having the above-described configuration is as follows.

  First, the lead frame 10 is placed on the upper surface of the lower mold 54 of the mold 50. Here, the lead frame 10 is arranged with respect to the mold 50 so that the air vent 60 provided in the mold 50 and the concave portion 22 provided in the lead frame 10 overlap (see FIG. 5B). When the adhesive sheet 48 is attached to the back surface of the lead frame 10, the lower surface of the adhesive sheet 48 is placed on the upper surface of the lower mold 54 (see FIG. 5A). After the lead frame 10 is placed, the upper mold 52 is lowered and the upper mold 52 is brought into contact with the lower mold 54. As a result, the remaining portions (the first support portion 14 and the second support portion 16 shown in FIG. 1A) of the lead frame 10 are pressed and fixed by the upper mold 52 and the lower mold 54. As a result, the blocks 12 are individually stored in the cavities 56.

  Next, a tablet made of a solid sealing resin having a cylindrical shape is accommodated in the pod 64, and the tablet is heated and melted and then pressurized. In this way, the sealing resin in a liquid or semi-solid state is injected into the cavity 56 after flowing through the runner 66 and the gate 58 (see FIG. 5B). As the sealing resin is injected into the cavity 56, the air inside the cavity 56 is released to the outside via the air vent 60. Thus, each unit included in the block 12 disposed inside the cavity 56 is resin-sealed with the sealing resin. Specifically, referring to FIG. 4B, semiconductor element 44, metal thin wire 46, island 28, and lead 30 included in each unit 26 are covered with a sealing resin. The sealing resin is injected until the air vent 60 is filled in order to reliably fill the sealing resin into the cavity 56.

  After the injection of the sealing resin into each cavity 56 was completed, the sealing resin was heated and cured, the upper mold 52 and the lower mold 54 were released, and each block 12 was individually resin-sealed. The lead frame 10 is taken out from the mold 50.

  With reference to FIG. 6, the role in the resin sealing process of the recessed part 22 provided in the upper surface of the lead frame 10 is demonstrated. FIG. 6A is an enlarged cross-sectional view showing details of the resin sealing step, and FIG. 6B is a plan view showing the lead frame 10 after the completion of this step. Further, FIG. 6C is a cross-sectional view showing the lead frame 10 after this process is completed.

  Referring to FIG. 6A, in this drawing, the flow of the sealing resin 36 injected into the cavity 56 is indicated by a thick arrow. As described above, in this step, the sealing resin 36 is injected so that the cavity 56 is completely filled and the air vent 60 is also filled. Accordingly, a part of the sealing resin 36 flows from the cavity 56 to the air vent 60 as indicated by a thick arrow in this drawing.

  Here, in the portion where the air vent 60 and the cavity 56 are continuous, the gap between the lower surface of the upper mold 52 and the upper surface of the lead frame 10 is narrow, and the width L10 of this portion is, for example, about 100 μm or more and 500 μm or less. In this portion of the air vent 60, the lower surface of the upper mold 52 has a flat surface parallel to the upper surface of the lead frame 10. Therefore, as described above, the liquid or semi-solid resin is blocked at this portion, so that the air inside the cavity 56 does not escape to the outside via the air vent 60 and is sufficiently sealed inside the cavity 56. There is a possibility that voids are generated without being filled with the resin 36. Further, since the sealing resin 36 flows inside the cavity 56 while being heated and cured by a high-temperature mold, the sealing resin 36 reaching the air vent 60 may be semi-solid. In this case, the possibility that the sealing resin 36 is blocked by the air vent 60 increases.

  In order to solve such a problem, in this embodiment, the concave portion 22 is arranged on the upper surface of the lead frame 10 in a region overlapping with the air vent 60. By doing in this way, the recessed part 22 which depressed the lead frame 10 functions as a part of air vent. In other words, the cross-sectional area of the air vent 60, which is the path through which the air inside the cavity 56 and the sealing resin 36 pass, is increased. For example, if the distance L10 between the lower surface of the upper mold 52 and the upper surface of the lead frame 10 is 500 μm and the depth of the concave portion 22 is 500 μm or more in the region of the air vent 60, the portion of the air vent 60 provided in the concave portion 22 is provided. The length in the vertical direction will be twice or more. Accordingly, the sealing resin 36 can be well circulated through the air vent 60 and the sealing of the sealing resin 36 in the air vent 60 is suppressed, so that the sealing resin 36 is filled throughout the cavity 56.

  FIG. 6B shows the lead frame 10 taken out of the mold after the resin sealing in this step is completed. Here, the sealing resin 36 is in close contact with the upper surface of the lead frame 10 so as to cover the block 12 disposed on the lead frame 10. Further, the sealing resin 36 </ b> A filled in the air vent 60 in the above process is also in close contact with the upper surface of the lead frame 10 together with the sealing resin 36 covering the block 12. Further, each sealing resin 36 </ b> A is in close contact with the upper surface of the lead frame 10 in the portion where the concave portion 22 is formed.

  Referring to FIG. 6C, the sealing resin 36 </ b> A formed by filling the air vent 60 is not only closely attached to the upper surface of the lead frame 10, but also filled and fitted into the concave portion 22. is doing. As a result, an anchor effect is generated in the sealing resin 36A filled in the concave portion 22, so that the separation of the sealing resin 36A from the lead frame 10 is suppressed.

  Here, since the sealing resin 36 </ b> A filled in the air vent is not in close contact with leads, islands, or the like included in the lead frame 10, the adhesion strength with the lead frame 10 is not strong. Moreover, although each sealing resin 36A and the sealing resin 36 which coat | covers the block 12 are formed integrally, the intensity | strength of the connection location of both is weak. For this reason, if no measures are taken, the sealing resin 36A may easily be detached from the lead frame 10 and the working environment may be contaminated. In this embodiment, the sealing resin 36A is prevented from being detached by fitting a part of the sealing resin 36A into the concave portion 22 provided by recessing the upper surface of the lead frame 10.

  Note that the sealing resin 36A filled in the air vent and the sealing resin 36B filled in the runner may be separated from the lead frame 10 by a mechanical method after this step is completed. Furthermore, the adhesive sheet 48 may be removed from the lower surface of the lead frame 10 after this process is completed.

  Next, referring to FIG. 7, the units of each block 12 described above are individually separated.

  Referring to FIG. 7, first, in this step, the lead frame 10 that has been sealed with resin is stuck to the dicing sheet 42. The dicing sheet 42 is a resin sheet having an adhesive layer formed on the upper surface, and the periphery thereof is supported by a metal frame 38 in which a metal such as stainless steel is formed in an annular shape.

  The lead frame 10 is adhered to the upper surface of the dicing sheet 42 having such a configuration. Here, the lead frame 10 may have a surface on which the sealing resin 36 is formed, or a surface opposite to the surface on which the sealing resin 36 is formed.

  After the lead frame 10 is attached to the dicing sheet 42, the blocks 12 formed on the lead frame 10 are diced together using a dicing blade 40 that rotates at high speed. In this step, the sealing resin 36 of each block 12 is diced, and the outer frame (supporting portion) of the lead frame 10 made of metal is also divided by dicing. The dicing in this step is performed at a depth at which the sealing resin 36 and the lead frame 10 of each block 12 are completely separated. Specifically, dicing in this step is performed so that the units 26 are separated along the dividing lines 18 and 20 shown in FIG.

  Here, in the above description, the lead frame 10 is attached to the dicing sheet 42 together with the sealing resin 36 of each block, but only the sealing resin 36 of each block 12 may be attached to the dicing sheet 42. In this case, first, the sealing resin 36 of each block 12 is separated from the lead frame 10. And after sticking the main surface of the sealing resin 36 of each block 12 to the dicing sheet 42, each block 12 is separated into units by the dicing blade 40, and an individual semiconductor device is obtained.

  Through the above steps, a circuit device in which a semiconductor element is packaged with a resin is manufactured.

  Next, the configuration of the circuit device 62 manufactured by the above process will be described with reference to FIG. FIG. 8A is a perspective view of the circuit device 62 in a mounted state as viewed from above, and FIG. 8B is a perspective view of the circuit device 62 in that state as viewed from below.

  Referring to FIG. 8A, the outer shape of the circuit device 62 is a thin hexahedron, and an example of a specific size is about vertical × horizontal × thickness = 5 mm × 5 mm × 0.4 mm. . Most of the outer surface of the circuit device 62 is composed of the sealing resin 36. The end portion of the lead 30 is exposed on the side surface of the sealing resin 36, and the side surface of the sealing resin 36 and the exposed surface of the lead 30 are located on the same plane.

  Referring to FIG. 8B, the island 28 is exposed at the center of the upper surface (mounting surface) of the circuit device 62, and a plurality of leads 30 are exposed at positions surrounding the four sides of the island 28. ing. As described above in the description of the manufacturing method, the island 28 is a portion where the semiconductor element is mounted, and the lead 30 is electrically connected to the electrode of the semiconductor element via a thin metal wire.

  Furthermore, when the circuit device 62 having the above configuration is surface-mounted on a mounting surface such as a substrate, it is mounted by a reflow process. Specifically, referring to FIG. 8B, after solder cream is attached to lead 30 exposed on the lower surface of sealing resin 36, circuit device 62 is placed on the mounting surface, and the solder cream is heated. And melt. As a result, the exposed surface of the lead 30 is fixed and electrically connected to the conductive path on the mounting surface via the solder.

DESCRIPTION OF SYMBOLS 10 Lead frame 12 Block 14 1st support part 16 2nd support part 18 Dividing line 20 Dividing line 22 Recessed part 26 Unit 28 Island 30 Lead 32 Tie bar 36, 36A, 36B Sealing resin 38 Metal frame 40 Dicing blade 42 Dicing sheet 44 Semiconductor element 46 Fine metal wire 48 Adhesive sheet 50 Mold 52 Upper mold 54 Lower mold 56 Cavity 58 Gate 60 Air vent 62 Circuit device 64 Pod 66 Runner

Claims (4)

A block composed of islands and a plurality of leads arranged in a matrix, and a support that surrounds the block. A concave portion is formed on the main surface of the support along one side of the block. Preparing a prepared lead frame;
Fixing the circuit element to the island of each unit, and electrically connecting the circuit element and the lead;
By storing the block in the cavity of the mold, injecting sealing resin from the gate into the cavity, and releasing the air inside the cavity to the outside via the air vent as the sealing resin is injected, A step of resin-sealing each unit included in the block;
Cutting and separating the sealing resin at the boundary of the unit, and
In the resin sealing step, a main surface of the lead frame in a region where the concave portion is provided faces an air vent of the mold die.   The method for manufacturing a circuit device according to claim 1, wherein a part of the sealing resin moved from the cavity to the air vent is filled in the concave portion. A plurality of the air vents are provided along one side of the cavity,
3. The method of manufacturing a circuit device according to claim 2, wherein the concave portion is provided on a main surface of the lead frame corresponding to each of the plurality of air vents. 4. The method of manufacturing a circuit device according to claim 3, wherein a plurality of the concave portions are provided in a groove shape on the main surface of the lead frame so as to correspond to one air vent.

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