TW201638133A - 印刷電路板用樹脂組成物、預浸體、樹脂複合片及覆金屬箔疊層板 - Google Patents

印刷電路板用樹脂組成物、預浸體、樹脂複合片及覆金屬箔疊層板 Download PDF

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Publication number
TW201638133A
TW201638133A TW105105579A TW105105579A TW201638133A TW 201638133 A TW201638133 A TW 201638133A TW 105105579 A TW105105579 A TW 105105579A TW 105105579 A TW105105579 A TW 105105579A TW 201638133 A TW201638133 A TW 201638133A
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Taiwan
Prior art keywords
resin
resin composition
group
circuit board
printed circuit
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TW105105579A
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English (en)
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TWI669328B (zh
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小林宇志
高野健太郎
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三菱瓦斯化學股份有限公司
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    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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Abstract

目的為提供可達成不僅具有耐熱性、阻燃性，且吸濕耐熱性也優良之印刷電路板的樹脂組成物。該樹脂組成物係含有將萘酚-二羥基萘芳烷基樹脂或二羥基萘芳烷基樹脂予以氰酸酯化而得之氰酸酯化合物(A)及環氧樹脂(B)的印刷電路板用樹脂組成物。

Description

印刷電路板用樹脂組成物、預浸體、樹脂複合片及覆金屬箔疊層板
本發明係關於印刷電路板用樹脂組成物、預浸體、及使用了此等之樹脂組成物及/或預浸體之樹脂複合片、覆金屬箔疊層板及印刷電路板。
近年來，廣泛使用於電子機器或通訊器材、個人電腦等之半導體更加速地高積體化、小型化。與此伴隨著對印刷電路板使用之半導體封裝用疊層板之各種特性的要求變得越來越嚴格。作為要求的特性可舉例如低吸水性、吸濕耐熱性、阻燃性、低介電係數、低介電正切、低熱膨脹率、耐熱性、耐藥品性等特性。然而，到目前為止並非一定可滿足此等之要求特性。
以往作為耐熱性或電特性優良之印刷電路板用樹脂，已知有氰酸酯化合物，使用了雙酚A型氰酸酯化合物與其他之熱固性樹脂等的樹脂組成物廣泛地使用於印刷電路板材料等。雙酚A型氰酸酯化合物具有電特性、機械特性及耐藥品性等優良特性。然而，該氰酸酯化合物有低吸水性、吸濕耐熱性、阻燃性及耐熱性不充分的情況。故以更提高各種特性為目的，已有人進行不同結構之各種氰酸酯化合物的研究。
例如，作為與雙酚A型氰酸酯化合物結構不同之樹脂，常使用酚醛清漆(novolac)型氰酸酯化合物(參照專利文獻1)。然而，此酚醛清漆型氰酸酯化合物容易硬化不足，會有獲得之硬化物之吸水率大、吸濕耐熱性低的問題。因而有人提出了將酚醛清漆型氰酸酯化合物與雙酚A型氰酸酯化合物預聚合化作為改善此等問題之方法(參照專利文獻2)。
此外，有人提出了使用氟化氰酸酯化合物或將氰酸酯化合物與鹵素系化合物混合或預聚合化以使樹脂組成物中含有鹵素系化合物作為改善阻燃性的方法(參照專利文獻3、4)。 [先前技術文獻] [專利文獻]
專利文獻1：日本特開平11-124433號公報 專利文獻2：日本特開2000-191776號公報 專利文獻3：日本專利第3081996號公報 專利文獻4：日本特開平6-271669號公報
[發明所欲解決之課題] 然而，藉由專利文獻2記載之預聚合化雖然針對硬化性有所提高，針對低吸水性、吸濕耐熱性及耐熱性之特性的改善還不夠充分。為此，氰酸酯化合物有更提高低吸水性或吸濕耐熱性，及耐熱性的需求。此外，專利文獻3及4中記載之技術，若使用鹵素系化合物在燃燒時恐產生戴奧辛等有害物質。此處，有不含有鹵素系化合物而提升樹脂組成物之阻燃性的需求。
本發明係以上述事情為鑑而產生者，目的為提供：可達成不僅具有優良之耐熱性及阻燃性，且吸濕耐熱性也優良之印刷電路板的印刷電路板用樹脂組成物、使用了如此樹脂組成物的預浸體及樹脂複合片、及使用了該預浸體之覆金屬箔疊層板及印刷電路板。 [解決課題之手段]
本發明者們係針對上述課題深入研究之結果發現，藉由以含有將指定之樹脂予以氰酸酯化而獲得之氰酸酯化合物的樹脂組成物作為印刷電路板用樹脂組成物來使用，可達成優良之耐熱性及阻燃性，更可提高吸濕耐熱性，而完成了本發明。也就是說，本發明係如同下述。
[1] 一種印刷電路板用樹脂組成物，含有： 具有選自於由下式(1)、下式(2)及下式(8)表示之結構構成之群組中之1種以上之結構的氰酸酯化合物(A)、及環氧樹脂(B)； 【化1】(式中，k表示1以上之整數，l表示0以上之整數；也可為不同k及l之化合物之混合物；各重複單元之排列為任意。) 【化2】(式中，m及n表示0以上之整數，且至少任一者為1以上；也可為不同m及n之化合物之混合物；各重複單元之排列為任意。) 【化3】(式中，m表示0以上之整數；也可為不同m之化合物之混合物。)
[2] 一種印刷電路板用樹脂組成物，含有： 將選自於由萘酚-二羥基萘芳烷基樹脂及二羥基萘芳烷基樹脂構成之群組中之1種以上之樹脂予以氰酸酯化而得之氰酸酯化合物(A)；及環氧樹脂(B)。
[3] 如[1]之印刷電路板用樹脂組成物，其中，該氰酸酯化合物(A)係將選自於由萘酚-二羥基萘芳烷基樹脂及二羥基萘芳烷基樹脂構成之群組中之1種以上之樹脂予以氰酸酯化而得。
[4] 如[1]~[3]中任一項之印刷電路板用樹脂組成物，其中，相對於該樹脂組成物中之樹脂固體成分100質量份，該氰酸酯化合物(A)之含量為1~90質量份。
[5] 如[1]~[4]中任一項之印刷電路板用樹脂組成物，更含有填充材(C)。
[6] 如[5]之印刷電路板用樹脂組成物，其中，相對於該樹脂組成物中之樹脂固體成分100質量份，該填充材(C)之含量為50~1600質量份。
[7] 如[1]~[6]中任一項之印刷電路板用樹脂組成物，更含有選自於由該氰酸酯化合物(A)以外之氰酸酯化合物、馬來醯亞胺化合物、及苯酚樹脂構成之群組中之1種以上。
[8] 如[1]~[7]中任一項之印刷電路板用樹脂組成物，其中，該環氧樹脂(B)係選自於由聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂及萘型環氧樹脂構成之群組中之1種以上。
[9] 一種預浸體，具備： 基材；及含浸於或塗佈於該基材之如[1]~[8]中任一項之印刷電路板用樹脂組成物。
[10] 一種覆金屬箔疊層板，具有： 疊層了至少1片以上之如[9]之預浸體；及配置在該預浸體之單面或兩面之金屬箔。
[11] 一種樹脂複合片，具有： 支持體；及配置在該支持體之表面的如[1]~[8]中任一項之印刷電路板用樹脂組成物。
[12] 一種印刷電路板，具有： 絕緣層，及在該絕緣層之表面形成之導體層；該絕緣層含有如[1]~[8]中任一項之印刷電路板用樹脂組成物。 [發明之效果]
根據本發明可達成：可達成不僅具有優良之耐熱性及阻燃性且吸濕耐熱性也優良之印刷電路板的印刷電路板用樹脂組成物、使用了如此樹脂組成物的預浸體及樹脂複合片、及使用了該預浸體之覆金屬箔疊層板及印刷電路板。
以下針對本發明之為了實施的形態(以下簡稱為「本實施形態」)進行詳細地說明。其中，以下之本實施形態係為了說明本發明的示例，本發明並不僅限定於本實施形態。
本實施形態之印刷電路板用樹脂組成物(以下也簡稱為「樹脂組成物」)含有：將選自於由萘酚-二羥基萘芳烷基樹脂及二羥基萘芳烷基樹脂構成之群組中之1種以上之樹脂(以下，也將此等總稱為「萘酚-二羥基萘芳烷基樹脂等」)予以氰酸酯化而得之氰酸酯化合物(A)、及環氧樹脂(B)。
本實施形態中使用之氰酸酯化合物(A)係將萘酚-二羥基萘芳烷基樹脂等予以氰酸酯化而獲得。
於本實施形態使用之氰酸酯化合物(A)係可為具有選自於由下列式(1)、(2)及(8)表示之結構構成之群組中之1種以上之結構者，宜為具有此等結構者。 【化4】此處，式中，k表示1以上之整數、l表示0以上之整數。可為不同k及l之化合物的混合物。此外，各重複單元之排列為任意。k之上限雖然沒有特別之限制，考慮更有效且確實地發揮本發明之作用效果的觀點，宜為20以下。考慮同樣的觀點，l之上限宜為20以下。 【化5】此處，式中，m及n表示0以上之整數，且至少任一者為1以上。可為不同m及n之化合物的混合物。此外，各重複單元之排列為任意。m之上限雖然沒有特別之限制，考慮更有效且確實地發揮本發明之作用效果的觀點，宜為20以下。考慮同樣之觀點，n之上限宜為20以下。 【化6】此處，式中，m表示0以上之整數。可為不同m之化合物的混合物。m的上限雖然沒有特別之限制，考慮更有效且確實地發揮本發明之作用效果的觀點，宜為20以下。
本實施形態之氰酸酯化合物(A)之重量平均分子量Mw雖然沒有特別之限制，宜為100~5000，更宜為200~3500，進一步宜為200~3000。重量平均分子量Mw係依據實施例記載之方法測定。
使用了具有如此結構之氰酸酯化合物之樹脂組成物的硬化物達成了優良之耐熱性及阻燃性，吸濕耐熱性也更為提高。
獲得本實施形態之氰酸酯化合物(A)之方法雖然沒有特別之限制，可舉例如將具有選自於由下列式(3)、(4)及(9)表示之結構構成之群組中之1種以上之結構的萘酚-二羥基萘芳烷基樹脂等具有之羥基予以氰酸酯化之方法。 【化7】此處，式中，k表示1以上之整數，l表示0以上之整數。可為不同k及l之化合物的混合物。此外，各重複單元之排列為任意。 【化8】此處，式中，m及n為0以上之整數，至少任一者為1以上。可為不同m及n之化合物的混合物。此外，各重複單元之排列為任意。 【化9】此處，式中m表示0~20之整數。可為不同m之化合物的混合物。
將具有選自於由上述式(3)、(4)及(9)表示之結構構成之群組中之1種以上之結構之樹脂所具有之羥基予以氰酸酯化之方法雖然沒有特別之限制，可採用公知之方法。作為相關製法的例子，可列舉取得或合成具有期望之骨架之具羥基之化合物，藉由公知之方法修飾該羥基而予以氰酸酯化之方法。作為將羥基予以氰酸酯化之方法，可舉例如Ian Hamer ton，”Chemistry and technology of cyanate ester resins，”Blackie Academic & Profrssional中記載之方法。
如此獲得之氰酸酯化合物(A)於本實施形態之樹脂組成物之含量可因應期望之特性適當設定，沒有特別之限制。氰酸酯化合物(A)之含量，於樹脂組成物中之樹脂固體成分為100質量份時，宜為1~90質量份，更宜為10~80質量份，進一步宜為20~75質量份，尤其宜為30~70質量份。此處的「樹脂組成物之樹脂固體成分」，若無特別指明之情況，係指樹脂組成物中扣除溶劑及填充材(C)後的成分，樹脂固體成分100質量份係指樹脂組成物中扣除溶劑及填充材後之成分合計為100質量份者。藉由使氰酸酯化合物(A)之含量為上述之範圍內，樹脂組成物之硬化物有阻燃性、耐熱性及吸濕耐熱性更為優良之趨勢。
本實施形態之環氧樹脂(B)，只要是1分子中具有2個以上之環氧基之環氧樹脂即可，可適用公知者，其種類沒有特別之限制。作為環氧樹脂(B)具體而言可列舉雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、環氧丙基酯型環氧樹脂、三環氧丙基異氰尿酸酯、芳烷基酚醛清漆型環氧樹脂、聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、甲酚酚醛清漆型環氧樹脂、二甲苯酚醛清漆型環氧樹脂、二環戊二烯酚醛清漆型環氧樹脂、聯苯酚醛清漆型環氧樹脂、苯酚芳烷基酚醛清漆型環氧樹脂、萘酚芳烷基酚醛清漆型環氧樹脂、多官能苯酚型環氧樹脂、萘型環氧樹脂、蒽型環氧樹脂、萘骨架改性酚醛清漆型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚芳烷基型環氧樹脂、二環戊二烯型環氧樹脂、聯苯型環氧樹脂、脂環式環氧樹脂、多元醇型環氧樹脂、含磷環氧樹脂、環氧丙基胺、環氧丙基酯、使丁二烯等之雙鍵環氧化之化合物、及藉由將含有羥基之矽酮樹脂類與表氯醇反應而獲得之化合物。此等之環氧樹脂中，聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂、及萘型環氧樹脂以其阻燃性及耐熱性方面而較理想。此等之環氧樹脂，可單獨使用1種或適當組合2種以上使用。
本實施形態之環氧樹脂(B)之含量可因應期望之特性適當設定，雖然沒有特別之限制，當樹脂組成物中之樹脂固體成分為100質量份時，宜為10~99質量份，更宜為20~90質量份，進一步宜為25~80質量份，尤其宜為30~70質量份。
本實施形態之樹脂組成物可含有填充材(C)。作為填充材(C)，可適用公知者，其種類沒有特別之限制。尤其，一般使用於疊層板用途之填充材可適用作為填充材(C)。作為填充材(C)具體而言可列舉天然二氧化矽、熔融二氧化矽、合成二氧化矽、非晶二氧化矽、Aerosil、中空二氧化矽等二氧化矽類、白碳、鈦白、氧化鋅、氧化鎂、氧化鋯等之氧化物、氮化硼、凝聚氮化硼、氮化矽、氮化碳等氮化物、碳化矽等碳化物、鈦酸鍶、鈦酸鋇等鈦酸鹽、氮化鋁、硫酸鋇、硫酸鈣、亞硫酸鈣等硫酸鹽或亞硫酸鹽、氫氧化鋁、氫氧化鋁加熱處理品(氫氧化鋁經加熱處理去除一部分結晶水者)、氫氧化鎂、氫氧化鈣等金屬氫氧化物、氧化鉬或鉬酸鋅等之鉬化合物、碳酸鈣、碳酸鎂、水滑石等碳酸鹽、硼酸鋅、偏硼酸鋇、硼酸鋁、硼酸鈣、硼酸鈉等之硼酸鹽、錫酸鋅、氧化鋁、水礬土(gibbsite)、水鋁石、黏土、高嶺土、滑石、煅燒黏土、煅燒高嶺土、煅燒滑石、雲母、E-玻璃、A-玻璃、NE-玻璃、C-玻璃、L-玻璃、D-玻璃、S-玻璃、M-玻璃G20、玻璃短纖維(包含E玻璃、T玻璃、D玻璃、S玻璃、Q玻璃等玻璃微粉末類)、中空玻璃、球狀玻璃等無機系之填充材以外、還有苯乙烯型、丁二烯型、丙烯酸型等橡膠粉末、核殼(core shell)型之橡膠粉末、及矽酮樹脂粉末、矽酮橡膠粉末、矽酮複合粉末等有機系之填充材。此等填充材可單獨使用1種或適當組合2種以上使用。
本實施形態之填充材(C)的含量可因應期望之特性適當設定，雖然沒有特別之限制，樹脂組成物中之樹脂固體成分為100質量份時，宜為50~1600質量份，更宜為60~1000質量份，進一步宜為70~500質量份，尤其宜為80~200質量份。藉由使填充材(C)之含量為上述範圍內，樹脂組成物之硬化物有阻燃性、耐熱性及吸濕耐熱性更為優良之趨勢。
此處在使樹脂組成物含有無機系之填充材(C)時，宜與矽烷偶聯劑或濕潤分散劑併用。作為矽烷偶聯劑，可適用一般於無機物之表面處理所使用者，其種類沒有特別之限制。作為矽烷偶聯劑，具體而言可列舉γ-胺丙基三乙氧基矽烷、N-β-(胺乙基)-γ-胺丙基三甲氧基矽烷等胺基矽烷系、γ-環氧丙氧基丙基三甲氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等環氧矽烷系、γ-甲基丙烯醯氧丙基三甲氧基矽烷、乙烯-三(β-甲氧基乙氧基)矽烷等乙烯矽烷系、N-β-(N-乙烯苄基胺乙基)-γ-胺丙基三甲氧基矽烷鹽酸鹽等陽離子型矽烷系及苯基矽烷系。矽烷偶聯劑可單獨使用1種或適當組合2種以上使用。此外，作為濕潤分散劑，可適用一般之塗料用所使用者，其種類沒有特別之限制。作為濕潤分散劑宜使用共聚合系之濕潤分散劑，也可為市售商品。作為市售商品之具體例，可列舉BYK Japan(股)製的Disperbyk-110、111、161、180、BYK-W996、BYK-W9010、BYK-W903、BYK-W940(以上為商品名)。濕潤分散劑可單獨使用1種或適當組合2種以上使用。
此外，本實施形態之樹脂組成物可因應需求含有為了適當調節硬化速度的硬化促進劑。作為該硬化促進劑，可適當使用作為氰酸酯化合物或環氧樹脂等之硬化促進劑一般所使用者，其種類沒有特別之限制。作為硬化促進劑之具體例，可列舉辛酸鋅、環烷酸鋅、環烷酸鈷、環烷酸銅、乙醯丙酮鐵、辛酸鎳、辛酸錳等有機金屬鹽類、苯酚、茬酚、甲酚、間苯二酚、兒茶酚、辛基苯酚、壬基苯酚等苯酚化合物、1-丁醇、2-乙基己醇等醇類、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等咪唑類及此等咪唑類之羧酸或其酸酐類之加成物等衍生物、二氰基二醯胺、苄基二甲基胺、4-甲基-N,N-二甲基苄基胺等胺類、膦系化合物、氧化膦系化合物、鏻鹽系化合物、二膦系化合物等磷化合物、環氧咪唑加成物系化合物、過氧化苯醯、對氯過氧化苯醯、二(三級丁基)過氧化物、過氧化碳酸二異丙酯、過氧化碳酸二-2-乙基己酯等過氧化物、及偶氮雙異丁腈等偶氮化合物。此等硬化促進劑(聚合催化劑)可使用市面販售者，作為市售商品，可舉例如AJICURE PN-23(Ajinomoto Fine-Techno Co.,Inc.製，商品名)、Novacure HX-3721(旭化成公司製，商品名)、Fujicure FX-1000(富士化成工業公司製，商品名)等。硬化促進劑可單獨使用1種或適當組合2種以上使用。
硬化促進劑之使用量可考慮樹脂之硬化度或樹脂組成物之黏度等適當調整，沒有特別之限制。硬化促進劑之使用量相對於樹脂組成物中之樹脂固體成分100質量份，可為0.005~10質量份。
本實施形態之樹脂組成物在不損及期望之特性的範圍，可更含有選自於由氰酸酯化合物(A)以外之氰酸酯化合物(以下稱為「其他的氰酸酯化合物」。)、馬來醯亞胺化合物及苯酚樹脂構成之群組中之1種以上。
作為其他的氰酸酯化合物，只要是分子內具有至少經1個氰氧基取代之芳香族部分的樹脂即可，並沒有特別之限制。作為其他的氰酸酯化合物，可舉例如下列式(5)表示者。 【化10】此處，式中，Ar1 表示苯環、萘環或兩個苯環經單鍵鍵結而得者，有多個的情況互相可為相同也可為相異。Ra各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基、或碳數1~6之烷基與碳數6~12之芳基鍵結而得之基。於Ra之芳香環可具有取代基，於Ar1 及Ra之取代基可選擇任意的位置。p表示與Ar1 鍵結之氰氧基之數目，各自獨立為1~3之整數。q表示與Ar1 鍵結之Ra的數目，Ar1 為苯環時是4-p，為萘環時是6-p，為兩個苯環經單鍵鍵結而得者是8-p。t表示平均重複數，為0~50之整數，其他的氰酸酯化合物係可為不同t之化合物的混合物。X為多個時各自獨立表示單鍵、碳數1~50之2價之有機基(氫原子可取代為鹵素原子。)、氮數1~10之2價之有機基(例如-N-R-N-(此處R表示有機基))、羰基(-CO-)、羧基(-C(=O)O-)、二氧化羰基(-OC(=O)O-)、磺醯基(-SO2 )、2價之硫原子或2價之氧原子之任一者。
於式(5)之Ra的烷基可具有直鏈或分支之鏈狀結構、及環狀結構(例如環烷基等)之任一者。此外，式(5)之烷基及Ra之芳基中的氫原子可取代為氟原子、氯原子等鹵素原子、甲氧基、苯氧基等烷氧基、或氰基等。
作為烷基之具體例，可列舉甲基、乙基、丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、1-乙基丙基、2,2-二甲基丙基、環戊基、己基、環己基、及三氟甲基。
作為芳基之具體例，可列舉苯基、茬基、基、萘基、苯氧基苯基、乙基苯基、鄰、間或對氟苯基、二氯苯基、二氰基苯基、三氟苯基、甲氧基苯基、及鄰、間或對甲苯基。另外，作為烷氧基，可舉例如甲氧基、乙氧基、丙氧基、異丙氧基、正丁氧基、異丁氧基及三級丁氧基。 作為於式(5)之X之碳數1~50之2價之有機基的具體例，可列舉亞甲基、伸乙基、三亞甲基、伸丙基等伸烷基、伸環戊基、伸環己基、三甲基伸環己基等伸環烷基、聯苯基亞甲基、二甲基亞甲基-伸苯基-二甲基亞甲基、茀二基及酞內酯二基等具有芳香環之2價之有機基。該2價之有機基中的氫原子可取代為氟原子、氯原子等鹵素原子、甲氧基、苯氧基等烷氧基、或氰基等。
作為於式(5)之X之氮數1~10之2價之有機基，可舉例如以-N-R-N-表示之基、亞胺基、及聚醯亞胺基。
此外，作為式(5)中之X之有機基，可舉例如為下列通式(6)或下列通式(7)表示之結構者。 【化11】此處，式中Ar2 表示苯四基、萘四基或聯苯四基，u為2以上時，相互可為相同也可為相異。Rb、Rc、Rf及Rg各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、三氟甲基、或具有至少1個苯酚性羥基之芳基。Rd及Re各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、碳數1~4之烷氧基、或羥基。u表示0~5之整數。 【化12】此處，式中Ar3 表示苯四基、萘四基或聯苯四基，v為2以上時，相互可為相同也可為相異。Ri及Rj各自獨立表示氫原子、碳數1~6之烷基、碳數6~12之芳基、苄基、碳數1~4之烷氧基、羥基、三氟甲基、或經至少1個氰氧基取代之芳基。v表示0~5之整數，可為不同v之化合物的混合物。
另外，作為式(5)中之X係可列舉下列式表示之2價的基。 【化13】此處，式中，m表示4~7之整數。R各自獨立表示氫原子或碳數1~6之烷基。
作為式(6)之Ar2 及式(7)之Ar3 之具體例，可列舉表示於式(6)中的2個碳原子或表示於式(7)中的2個氧原子於1,4位置或1,3位置鍵結的苯四基、上述2個碳原子或2個氧原子於4,4’位置、2,4’位置、2,2’位置、2,3’位置、3,3’位置或3,4’位置鍵結的聯苯四基、及上述2個碳原子或2個氧原子於2,6位置、1,5位置、1,6位置、1,8位置、1,3位置、1,4位置或2,7位置鍵結的萘四基。 式(6)之Rb、Rc、Rd、Re、Rf及Rg及於式(7)之Ri及Rj之烷基及芳香基與上述式(5)中之含意相同。
作為以上述式(5)表示之分子內具有之經至少1個氰氧基取代之芳香族部分之樹脂的具體例，可列舉氰氧基苯、1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲基苯、1-氰氧基-2-、1-氰氧基-3-、或1-氰氧基-4-甲氧基苯、1-氰氧基-2,3-、1-氰氧基-2,4-、1-氰氧基-2,5-、1-氰氧基-2,6-、1-氰氧基-3,4-或1-氰氧基-3,5-二甲基苯、氰氧基乙基苯、氰氧基丁基苯、氰氧基辛基苯、氰氧基壬基苯、2-(4-氰氧基苯基)-2-苯基丙烷(4-α-基酚的氰酸酯)、1-氰氧基-4-環己基苯、1-氰氧基-4-乙烯基苯、1-氰氧基-2-或1-氰氧基-3-氯苯、1-氰氧基-2,6-二氯苯、1-氰氧基-2-甲基-3-氯苯、氰氧基硝基苯、1-氰氧基-4-硝基-2-乙基苯、1-氰氧基-2-甲氧基-4-烯丙苯(丁香酚的氰酸酯)、甲基(4-氰氧基苯基)硫醚、1-氰氧基-3-三氟甲基苯、4-氰氧基聯苯、1-氰氧基-2-或1-氰氧基-4-乙醯基苯、4-氰氧基苯甲醛、4-氰氧基苯甲酸甲酯、4-氰氧基苯甲酸苯酯、1-氰氧基-4-乙醯胺基苯、4-氰氧基二苯基酮、1-氰氧基-2,6-二(三級丁基)苯、1,2-二氰氧基苯、1,3-二氰氧基苯、1,4-二氰氧基苯、1,4-二氰氧基-2-三級丁基苯、1,4-二氰氧基-2,4-二甲基苯、1,4-二氰氧基-2,3,4-三甲基苯、1,3-二氰氧基-2,4,6-三甲基苯、1,3-二氰氧基-5-甲基苯、1-氰氧基或2-氰氧基萘、1-氰氧基-4-甲氧基萘、2-氰氧基-6-甲基萘、2-氰氧基-7-甲氧基萘、2,2-二氰氧基-1,1-聯萘、1,3-、1,4-、1,5-、1,6-、1,7-、2,3-、2,6-或2,7-二氰氧基萘、2,2-或4,4-二氰氧基聯苯、4,4-二氰氧基八氟聯苯、2,4-或4,4-二氰氧基二苯甲烷、雙(4-氰氧基-3,5-二甲基苯基)甲烷、1,1-雙(4-氰氧基苯基)乙烷、1,1-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基苯基)丙烷、2,2-雙(4-氰氧基-3-甲基苯基)丙烷、2,2-雙(2-氰氧基-5-聯苯基)丙烷、2,2-雙(4-氰氧基苯基)六氟丙烷、2,2-雙(4-氰氧基-3,5-二甲基苯基)丙烷、1,1-雙(4-氰氧基苯基)丁烷、1,1-雙(4-氰氧基苯基)異丁烷、1,1-雙(4-氰氧基苯基)戊烷、1,1-雙(4-氰氧基苯基)-3-甲基丁烷、1,1-雙(4-氰氧基苯基)-2-甲基丁烷、1,1-雙(4-氰氧基苯基)-2,2-二甲基丙烷、2,2-雙(4-氰氧基苯基)丁烷、2,2-雙(4-氰氧基苯基)戊烷、2,2-雙(4-氰氧基苯基)己烷、2,2-雙(4-氰氧基苯基)-3-甲基丁烷、2,2-雙(4-氰氧基苯基)-4-甲基戊烷、2,2-雙(4-氰氧基苯基)-3,3-二甲基丁烷、3,3-雙(4-氰氧基苯基)己烷、3,3-雙(4-氰氧基苯基)庚烷、3,3-雙(4-氰氧基苯基)辛烷、3,3-雙(4-氰氧基苯基)-2-甲基戊烷、3,3-雙(4-氰氧基苯基)-2-甲基己烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基戊烷、4,4-雙(4-氰氧基苯基)-3-甲基庚烷、3,3-雙(4-氰氧基苯基)-2-甲基庚烷、3,3-雙(4-氰氧基苯基)-2,2-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,4-二甲基己烷、3,3-雙(4-氰氧基苯基)-2,2,4-三甲基戊烷、2,2-雙(4-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷、雙(4-氰氧基苯基)苯基甲烷、1,1-雙(4-氰氧基苯基)-1-苯基乙烷、雙(4-氰氧基苯基)聯苯基甲烷、1,1-雙(4-氰氧基苯基)環戊烷、1,1-雙(4-氰氧基苯基)環己烷、2,2-雙(4-氰氧基-3-異丙基苯基)丙烷、1,1-雙(3-環己基-4-氰氧基苯基)環己烷、雙(4-氰氧基苯基)二苯基甲烷、雙(4-氰氧基苯基)-2,2-二氯乙烯、1,3-雙(2-(4-氰氧基苯基)-2-丙基)苯、1,4-雙(2-(4-氰氧基苯基)-2-丙基)苯、1,1-雙(4-氰氧基苯基)-3,3,5-三甲基環己烷、4-(雙(4-氰氧基苯基)甲基)聯苯、4,4-二氰氧基二苯基酮、1,3-雙(4-氰氧基苯基)-2-丙烷-1-酮、雙(4-氰氧基苯基)醚、雙(4-氰氧基苯基)硫醚、雙(4-氰氧基苯基)碸、4-氰氧基苯甲酸-4-氰氧基苯基酯(4-氰氧基苯基-4-氰氧基苯甲酸酯)、雙(4-氰氧基苯基)碳酸酯、1,3-雙(4-氰氧基苯基)金剛烷、1,3-雙(4-氰氧基苯基)-5,7-二甲基金剛烷、3,3-雙(4-氰氧基苯基)異苯并呋喃-1(3H)-酮(酚酞之氰酸酯)、3,3-雙(4-氰氧基-3-甲基苯基)異苯并呋喃-1(3H)-酮(鄰甲苯酚酞之氰酸酯)、9,9-雙(4-氰氧基苯基)茀、9,9-雙(4-氰氧基-3-甲基苯基)茀、9,9-雙(2-氰氧基-5-聯苯基)茀、參(4-氰氧基苯基)甲烷、1,1,1-參(4-氰氧基苯基)乙烷、1,1,3-參(4-氰氧基苯基)丙烷、α,α,α’-參(4-氰氧基苯基)-1-乙基-4-異丙基苯、1,1,2,2-肆(4-氰氧基苯基)乙烷、肆(4-氰氧基苯基)甲烷、2,4,6-參(N-甲基-4-氰氧基苯胺基)-1,3,5-三氮、2,4-雙(N-甲基-4-氰氧基苯胺基)-6-(N-甲基苯胺基)-1,3,5-三氮、雙(N-4-氰氧基-2-甲基苯基)-4,4-氧基二酞醯亞胺、雙(N-3-氰氧基-4-甲基苯基)-4,4-氧基二酞醯亞胺、雙(N-4-氰氧基苯基)-4,4-氧基二酞醯亞胺、雙(N-4-氰氧基-2-甲基苯基)-4,4-(六氟亞異丙基)二酞醯亞胺、參(3,5-二甲基-4-氰氧基苄基)異氰尿酸酯、2-苯基-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-(4-甲基苯基)-3,3-雙(4-氰氧基苯基)苄甲內醯胺、2-苯基-3,3-雙(4-氰氧基-3-甲基苯基)苄甲內醯胺、1-甲基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮、及2-苯基-3,3-雙(4-氰氧基苯基)吲哚啉-2-酮。此外，作為上述式(5)表示之化合物之其他的具體例，可列舉苯酚酚醛清漆樹脂或甲酚酚醛清漆樹脂(藉由公知之方法，將苯酚、烷基取代之苯酚或鹵素取代之苯酚與福馬林或聚甲醛等甲醛化合物於酸性溶液中使其反應而得者)、三苯酚酚醛清漆樹脂(將羥苯甲醛與苯酚在酸性催化劑之存在下使其反應而得者)、茀酚醛清漆樹脂(將茀酮化合物與9,9-雙(羥芳基)茀類在酸性催化劑之存在下使其反應而得者)、含有呋喃環之苯酚酚醛清漆樹脂(糠醛與苯酚在鹼性催化劑之存在下使其反應而得者)、苯酚芳烷基樹脂、甲酚芳烷基樹脂、萘酚芳烷基樹脂、聯萘酚芳烷基樹脂及聯苯芳烷基樹脂(藉由公知之方法，將如Ar2 -(CH2 Y)2 (Ar2 表示苯基，Y表示鹵素原子。以下於此段落皆為相同含意。)表示之雙鹵素甲基化合物與苯酚化合物在酸性催化劑或無催化劑下使其反應而得者；或如Ar2 -(CH2 OR)2 表示之雙(烷氧基甲基)化合物與苯酚化合物在酸性催化劑之存在下使其反應而得者；或如Ar2 -(CH2 OH)2 表示之雙(羥甲基)化合物與苯酚化合物在酸性催化劑之存在下使其反應而得者；或將芳香族醛類化合物、芳烷基化合物與苯酚化合物縮聚而得者)、苯酚改性二甲苯甲醛樹脂(藉由公知之方法，將二甲苯甲醛樹脂與苯酚化合物於酸性催化劑之存在下使其反應而得者)、改性萘甲醛樹脂(藉由公知之方法，將萘甲醛樹脂與羥取代芳香族化合物在酸性催化劑之存在下使其反應而得者)、苯酚改性二環戊二烯樹脂、具有聚伸萘基醚結構之苯酚樹脂(藉由公知之方法，將1分子中具有2個以上之苯酚性羥基的多價羥萘化合物在鹼性催化劑之存在下使其脫水縮合而得者)等將苯酚樹脂藉由與上述同樣之方法予以氰酸酯化者以及此等之預聚合物。此等之其他的氰酸酯化合物並沒有特別之限制。此等之其他的氰酸酯化合物係可使用單獨1種或適當組合2種以上使用。
作為馬來醯亞胺化合物，只要是1分子中具有1個以上之馬來醯亞胺基之化合物即可，可使用一般公知者。可舉例如4,4-二苯基甲烷雙馬來醯亞胺、雙(3,5-二甲基-4-馬來醯亞胺苯基)甲烷、雙(3-乙基-5-甲基-4-馬來醯亞胺苯基)甲烷、雙(3,5-二乙基-4-馬來醯亞胺苯基)甲烷、苯基甲烷馬來醯亞胺、鄰伸苯基雙馬來醯亞胺、間伸苯基雙馬來醯亞胺、對伸苯基雙馬來醯亞胺、鄰伸苯基雙檸康醯亞胺、間伸苯基雙檸康醯亞胺、對伸苯基雙檸康醯亞胺、2,2-雙(4-(4-馬來醯亞胺苯氧基)-苯基)丙烷、3,3-二甲基-5,5-二乙基-4,4-二苯基甲烷雙馬來醯亞胺、4-甲基-1,3-伸苯基雙馬來醯亞胺、1,6-雙馬來醯亞胺-(2,2,4-三甲基)己烷、4,4-二苯基醚雙馬來醯亞胺、4,4-二苯基碸雙馬來醯亞胺、1,3-雙(3-馬來醯亞胺苯氧基)苯、1,3-雙(4-馬來醯亞胺苯氧基)苯、4,4-二苯基甲烷雙檸康醯亞胺、2,2-雙(4-(4-檸康醯亞胺苯氧基)苯基)丙烷、雙(3,5-二甲基-4-檸康醯亞胺苯基)甲烷、雙(3-乙基-5-甲基-4-檸康醯亞胺苯基)甲烷、雙(3,5-二乙基-4-檸康醯亞胺苯基)甲烷、聚苯基甲烷馬來醯亞胺、及此等馬來醯亞胺化合物之預聚合物、或馬來醯亞胺化合物與胺化合物之預聚合物等，並沒有特別之限制。此等之馬來醯亞胺化合物可單獨使用1種或適當組合2種以上使用。
作為苯酚樹脂，只要是1分子中具有2個以上之羥基之苯酚樹脂即可，可使用一般公知者。可舉例如雙酚A型苯酚樹脂、雙酚E型苯酚樹脂、雙酚F型苯酚樹脂、雙酚S型苯酚樹脂、苯酚酚醛清漆樹脂、雙酚A酚醛清漆型苯酚樹脂、環氧丙基酯型苯酚樹脂、芳烷基酚醛清漆型苯酚樹脂、聯苯芳烷基型苯酚樹脂、甲酚酚醛清漆型苯酚樹脂、多官能苯酚樹脂、萘酚樹脂、萘酚酚醛清漆樹脂、多官能萘酚樹脂、蒽型苯酚樹脂、萘骨架改性酚醛清漆型苯酚樹脂、苯酚芳烷基型苯酚樹脂、萘酚芳烷基型苯酚樹脂、二環戊二烯型苯酚樹脂、聯苯型苯酚樹脂、脂環式苯酚樹脂、多元醇型苯酚樹脂、含磷苯酚樹脂、含聚合性不飽和烴基之苯酚樹脂及含羥基之矽酮樹脂，並沒有特別之限制。此等之苯酚樹脂，可單獨使用1種或適當組合2種以上使用。
另外，本實施形態之樹脂組成物於不損及期望之特性的範圍，可含有氧雜環丁烷樹脂、苯并 化合物及具可聚合之不飽和基之化合物構成之群組中任一者之1種以上。
作為氧雜環丁烷樹脂，可使用一般公知者。可舉例如氧雜環丁烷、2-甲基氧雜環丁烷、2,2-二甲基氧雜環丁烷、3-甲基氧雜環丁烷、3,3-二甲基氧雜環丁烷等烷基氧雜環丁烷、3-甲基-3-甲氧基甲基氧雜環丁烷、3,3-二(三氟甲基)全氟氧雜環丁烷、2-氯甲基氧雜環丁烷、3,3-雙(氯甲基)氧雜環丁烷、聯苯型氧雜環丁烷、OXT-101(東亞合成製，商品名)、OXT-121(東亞合成製，商品名)等，沒有特別之限制。此等之氧雜環丁烷樹脂可單獨使用1種或適當組合2種以上使用。
作為苯并 化合物，只要是1分子中具有2個以上之二氫苯并 環之化合物即可，可使用一般公知者。可舉例如雙酚A型苯并 BA-BXZ(小西化學製，商品名)、雙酚F型苯并 BF-BXZ(小西化學製，商品名)、雙酚S型苯并 BS-BXZ(小西化學製，商品名)及酚酞型苯并 ，沒有特別之限制。此等之苯并 化合物可單獨使用1種或適當組合2種以上使用。
作為具有可聚合之不飽和基之化合物，可使用一般之公知者。可舉例如乙烯、丙烯、苯乙烯、二乙烯苯、二乙烯聯苯等乙烯化合物、(甲基)丙烯酸甲酯、(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、二(甲基)丙烯酸聚丙二醇酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四(甲基)丙烯酸新戊四醇酯、六(甲基)丙烯酸二新戊四醇酯等1元或多元醇之(甲基)丙烯酸酯類、雙酚A型環氧(甲基)丙烯酸酯、雙酚F型環氧(甲基)丙烯酸酯等環氧(甲基)丙烯酸酯類、及苯并環丁烯樹脂，並沒有特別之限制。此等之具有不飽和基之化合物可單獨使用1種或適當組合2種以上使用。其中，上述之「(甲基)丙烯酸酯」其含意包括丙烯酸酯及其對應之甲基丙烯酸酯。
另外，本實施形態之樹脂組成物於不損及期望之特性的範圍，可與其他之熱固性樹脂、熱塑性樹脂及其寡聚物、彈性體類等各種高分子化合物、阻燃性化合物及各種添加劑等併用。只要是此等物質之一般所使用者，並沒有特別之限制。例如，作為阻燃性化合物之具體例，可列舉4,4-二溴聯苯等溴化合物、磷酸酯、磷酸三聚氰胺、含磷環氧樹脂、三聚氰胺及苯胍胺等氮化合物、含 環化合物、及矽酮系化合物。此外，作為各種添加劑，可舉例如紫外線吸收劑、抗氧化劑、光聚合起始劑、螢光增白劑、光敏劑、染料、顏料、增黏劑、流動調整劑、潤滑劑、消泡劑、分散劑、塗平劑、光澤劑、及聚合抑制劑等。此等物質可因應期望單獨使用1種或適當組合2種以上使用。
其中，本實施形態之樹脂組成物因應需求可含有有機溶劑。此時，本實施形態之樹脂組成物係可作為將上述之各種樹脂成分至少一部份，宜為全部，溶解於有機溶劑或相溶於有機溶劑之態樣(溶液或清漆)來使用。作為有機溶劑，只要是可將上述之各種樹脂成分之至少一部分，宜為全部，溶解或可相溶者即可，可適用公知者，其種類沒有特別之限制。作為有機溶劑，具體而言，可列舉丙酮、甲乙酮、甲基異丁酮等酮類、丙二醇一甲基醚、丙二醇一甲醚醋酸酯等賽珞蘇(cellosolve)系溶劑、乳酸乙酯、乙酸甲酯、乙酸乙酯、乙酸丁酯、乙酸異戊酯、甲氧基丙酸甲酯、羥基異丁酸甲酯等酯系溶劑、二甲基乙醯胺、二甲基甲醯胺等醯胺類等極性溶劑類、甲苯、二甲苯等芳香族烴等無極性溶劑。此等有機溶劑可單獨使用1種或適當組合2種以上使用。
本實施形態之樹脂組成物之製備方法只要是製備含有氰酸酯化合物(A)及環氧樹脂(B)之樹脂組成物的方法即可，並沒有特別之限制。可舉例如以均質機(Homomixer)等使填充材(C)分散於環氧樹脂(B)中，於此摻合氰酸酯化合物(A)之方法。另外，為了在使黏度下降、處理性提高的同時提高對玻璃布之含浸性，宜於樹脂組成物中添加有機溶劑。
本實施形態之樹脂組成物係可使用作為預浸體、覆金屬箔疊層板、印刷電路板、及半導體封裝體之構成材料。例如，藉由將本實施形態之樹脂組成物溶解於溶劑而獲得之溶液含浸或塗布於基材並乾燥，可獲得預浸體。
此外，使用可剝離之塑膠薄膜作為基材，藉由將本實施形態之樹脂組成物溶解於溶劑而獲得之溶液塗布於該塑膠薄膜並乾燥，可獲得增建用之薄膜或乾膜阻焊膜。此處，溶劑可於20℃~150℃之溫度下加熱1~90分鐘而乾燥。此外，樹脂組成物可於僅乾燥溶劑之未硬化之狀態使用，也可因應需求使成為半硬化(B階段化)之狀態後使用。
以下，針對本實施形態之預浸體進行詳細描述。本實施形態之預浸體係具有：基材；及含浸或塗布於該基材之上述樹脂組成物。本實施形態之預浸體的製造方法只要是製造組合本實施形態之樹脂組成物及基材之預浸體的方法即可，並沒有特別之限制。具體而言，將本實施形態之樹脂組成物含浸或塗布於基材後，藉由於120~220℃之乾燥機中乾燥2~15分鐘左右之方法等使其半硬化，可製造本實施形態之預浸體。此時樹脂組成物對於基材之附著量，也就是樹脂組成物之含量(包含填充材(C))相對於半硬化後之預浸體之總量宜為20~99質量%之範圍。
作為製造本實施形態之預浸體時所使用之基材，可為使用於各種印刷電路板材料之公知者。作為如此之基材，可舉例如E玻璃、D玻璃、L玻璃、S玻璃、T玻璃、Q玻璃、UN玻璃、NE玻璃、球狀玻璃等玻璃纖維、石英等玻璃以外之無機纖維、聚醯亞胺、聚醯胺、聚酯等有機纖維、液晶聚酯等織布，但並非僅限定於以上示例。作為基材之形狀，已知有織布、不織布、粗紗、切股氈(chopped strand mat)、表面氈(surfacing mat)等，可為此等中之任一者。基材可單獨使用1種或適當組合2種以上使用。於織布中，考慮尺寸安定性之觀點，尤其適宜為經施以超開纖處理或孔目堵塞處理之織布。另外，考慮吸濕耐熱性之觀點，以經環氧矽烷處理或胺基矽烷處理等矽烷偶聯劑等表面處理之玻璃織布較為理想。此外，考慮電特性之方面，液晶聚酯織布較為理想。另外，基材之厚度雖然沒有特別之限制，若是作為疊層板用途，宜為0.01~0.2mm之範圍。
本實施形態之覆金屬箔疊層板具有：疊層了至少1片以上之上述之預浸體；及配置在該預浸體之單面或兩面之金屬箔。具體而言，對於上述之預浸體1片，或對於重疊數片預浸體者，可藉由於其單面或兩面配置銅或鋁等金屬箔並疊層成形來製作。此處使用之金屬箔，只要是可使用於印刷電路板材料者即可，並沒有特別之限制，宜為壓延銅箔或電解銅箔等銅箔。此外，金屬箔之厚度係雖然沒有特別之限制，宜為2~70μm、更宜為3~35μm。作為成形條件，可採用通常之印刷電路板用疊層板及多層板之製作時所使用之方法。例如，藉由使用多段壓合機、多段真空壓合機、連續成形機、或高壓釜成形機等，於溫度180~350℃、加熱時間100~300分鐘、表面壓力20~100kg/cm2 之條件下進行疊層成形，而可製造本實施形態之覆金屬箔疊層板。此外，藉由將上述預浸體及另外製作之內層用之電路板組合並疊層成形，也可製作多層板。作為多層板之製造方法，例如於上述之預浸體1片的兩面配置35μm之銅箔，以上述條件疊層成形。之後形成內層電路，於該電路實施黑化處理形成內層電路板。接著，將該內層電路板與上述預浸體1片片地交替配置，更於最外層配置銅箔，以上述條件，宜為於真空下進行疊層成形。以如此方式可製作多層板。
本實施形態之覆金屬箔疊層板係，更可藉由形成指定之佈線圖案而適用作為印刷電路板。印刷電路板係，可依循通常方法製造，其製造方法沒有特別之限制。以下展示印刷電路板之製造方法的一例。首先，準備上述之覆金屬箔疊層板。接著，藉由於覆金屬箔疊層板之表面施以蝕刻處理形成內層電路來製作內層基板。於該內層基板之內層電路表面，因應需求施以為了提高密合強度之表面處理，接著於該內層電路表面重疊所需之上述之預浸體片數。進一步於其外側疊層外層電路用之金屬箔，加熱加壓使其一體成形。藉由如此方式，製造於內層電路與外層電路用之金屬箔之間形成基材及由熱固性樹脂組成物之硬化物構成之絕緣層的多層之疊層板。接著，於該多層之疊層板施以通孔(through hole)或介層孔(via hole)用之穿孔加工後，於此孔之壁面形成使內層電路與外層電路用之金屬箔導通之鍍敷金屬皮膜。更藉由於外層電路用之金屬箔施以蝕刻處理形成外層電路來製造印刷電路板。
於上述之製造例獲得之印刷電路板具有：絕緣層；及於該絕緣層之表面形成之導體層，絕緣層為含有上述本實施形態之樹脂組成物之構成。也就是說，上述之本實施形態之預浸體(基材及含浸或塗布於該基材之本實施形態之樹脂組成物)，上述之本實施形態之覆金屬箔疊層板之樹脂組成物的層(由本實施形態之樹脂組成物構成之層)為由含有本實施形態之樹脂組成物之絕緣層所構成而成。
本實施形態之樹脂複合片係具有：支持體；及配置在該支持體之表面的上述樹脂組成物。此樹脂複合片可將上述樹脂組成物溶解於溶劑而得之溶液塗布於支持體上並乾燥而獲得。作為此處使用之支持體，可舉例如聚乙烯薄膜、聚丙烯薄膜、聚碳酸酯薄膜、聚對苯二甲酸乙二醇酯薄膜、乙烯四氟乙烯共聚合物薄膜、及於此等之薄膜的表面塗布了離型劑之離型薄膜、聚醯亞胺薄膜等有機系薄膜基材、銅箔、鋁箔等導體箔、玻璃板、SUS板、FRP等板狀者，並沒有特別之限制。作為塗布方法，可舉例如將本實施形態之樹脂組成物溶解或相溶於溶劑而獲得之溶液，以桿塗布機、模塗布機、刮刀片、BAKER式塗膜器等塗布於支持體上之方法。此外，塗布後，進一步從乾燥而獲得之樹脂複合片上剝離或蝕刻支持體，也可獲得單層片(樹脂片)。其中，藉由將上述之本實施形態之樹脂組成物溶解或相溶於溶劑而得之溶液供給至具有片狀之模槽的模具內並乾燥等成形為片狀，也可不使用支持體而獲得單層片(樹脂片)。
其中，本實施形態之樹脂複合片或單層片之製作中，去除溶劑時之乾燥條件，雖然沒有特別之限制，宜於20℃~200℃之溫度下乾燥1~90分鐘。若為20℃以上可更防止樹脂組成物中之溶劑的殘留，若為200℃以下可更抑制樹脂組成物之硬化的進行。此外，於本實施形態之樹脂複合片或單層片之樹脂層之厚度，可藉由本實施形態之樹脂組成物之溶液的濃度與塗布厚度來調整，並沒有特別之限制。然而，其厚度宜為0.1~500μm。樹脂層之厚度若為500μm以下，乾燥時更不容易有溶劑殘留。 [實施例]
以下將展示合成例、實施例及比較例來更詳細地說明本發明，但本發明並非僅限定於以下示例。
(具羥基之芳香族化合物之羥基(以下表示為「OH基」。)(g/eq.)當量之測定) 依循JIS-K0070，藉由吡啶乙醯氯法求得具羥基之芳香族化合物之OH基當量(g/eq.)。
(氰酸酯化合物之重量平均分子量Mw之測定) 將氰酸酯化合物1g溶解於100g之四氫呋喃(溶劑)而得之溶液10μL，注入高效液相層析儀(Hitachi High-Technologies Corporation.製高效液相層析儀，製品名「LachromElite」)進行分析。管柱使用2支東曹(股)公司製之製品名「TSKgel GMHHR -M」(長度30cm×內徑7.8mm)，流動相使用四氫呋喃。管柱內之試料之流速設定為1mL/min.，使用RI(折射率)檢測器作為檢測器。重量平均分子量Mw係藉由GPC法以聚苯乙烯作為標準物質來求得。
(合成例1)萘酚-二羥基萘芳烷基樹脂之氰酸酯化合物1(以下簡稱為「MF27S-3-CN」)之合成 下列式(1)及/或下列式(2)表示之M27S-3-CN以如後述之方法來合成 【化14】此處，式中，k表示1~20之整數，l表示0~20之整數。可為不同k及l之化合物的混合物。各重複單元之排列為任意。 【化15】此處，式中m及n表示0~20之整數，至少任一者為1以上。可為不同m及n之化合物的混合物。各重複單元之排列為任意。
＜萘酚-二羥基萘芳烷基樹脂1(以下簡稱為「MF27S-3-OH」)之合成＞ 首先，合成下列式(3)及/或下列式(4)表示之MF27S-3-OH。 【化16】此處，式中，k表示1~20之整數，l表示0~20之整數。可為不同k及l之化合物之混合物。各重複單元之排列為任意。 【化17】此處，式中，m及n表示0~20之整數，至少任一者為1以上。可為不同m及n之化合物的混合物。各重複單元之排列為任意。
具體而言，將1-萘酚372.0g(2.58mol)、及2,7-二羥基萘177.4g(1.11mol)加至反應器內，於150℃攪拌溶解。接著，於該反應器內加入對甲苯磺酸0.17g，花費1小時升溫至170℃的同時，滴加1,4-雙(甲氧基甲基)苯299.2g(1.80mol)。之後，從反應器中去除甲醇及生成之水的同時，保持此狀態於170℃下使其反應3小時。反應結束後，將反應混合物以混合溶劑(間二甲苯/MIBK=1/1(體積比))1000g稀釋，藉由水洗從反應混合物中去除催化劑。另外，藉由水蒸氣蒸餾、減壓蒸餾，從反應混合物中去除未反應原料及混合溶劑，而獲得MF27S-3-OH 599g。獲得之MF27S-3-OH之OH基當量為174g/eq.。
＜MF27S-3-CN之合成＞ 接著，將以上述方法獲得之MF27S-3-OH 500g(OH基當量174g/eq.，換算OH基為2.87mol，重量平均分子量Mw760)、三乙胺436.2g(4.31mol，相對於MF27S-3-OH之OH基1莫耳為1.5莫耳)溶解於二氯甲烷3000g，命其為溶液1。
於反應器中混合氯化氰300.3g(4.89mol，相對於MF27S-3-OH之OH基1莫耳為1.7莫耳)、二氯甲烷700.7g、36%鹽酸465.6g(4.60mol，相對於MF27S-3-OH之OH基1莫耳為1.6莫耳)及水2887g，於攪拌下保持液溫為-2~-0.5℃的同時，花費70分鐘於該反應器中滴加溶液1。溶液1滴加結束後，反應器內以同溫度攪拌30分鐘後，花費25分鐘於反應器中滴加將三乙胺174.5g(1.72mol，相對於MF27S-3-OH之OH基1莫耳為0.6莫耳)溶解於二氯甲烷14.6g而得之溶液(以下表示為「溶液2」。)。溶液2滴加完成後，反應器內以同溫度攪拌30分鐘而完成反應。
之後，將反應器內之反應液靜置，使有機相與水相分離。獲得之有機相以0.1N鹽酸2L清洗之後，以水2000g清洗6次。水洗第6次之廢水的電導度為20μS/cm，確認藉由水之清洗已充分地去除可能去除之離子性化合物。
水洗後之有機相於減壓下濃縮，最後於90℃濃縮1小時使其乾燥硬化，獲得目的之氰酸酯化合物MF27S-3-CN(黑紫色黏性物)570g。獲得之MF27S-3-CN之重量平均分子量Mw為980。此外，MF27S-3-CN之紅外線吸收顯示有2264cm-1 之氰氧基之吸收，且未顯示羥基之吸收。
(實施例1) 混合藉由合成例1獲得之MF27S-3-CN 50質量份、聯苯芳烷基型環氧樹脂(商品名「NC-3000-FH」，日本化藥(股)製)50質量份、及熔融二氧化矽(商品名「SC2050MB」，Admatechs.製)100質量份而獲得清漆。該清漆以甲乙酮稀釋後，含浸塗布於厚度0.1mm之E玻璃織布，更於150℃加熱乾燥5分鐘，獲得樹脂含量50質量%之預浸體。
重疊獲得之預浸體4片或8片並於其疊層方向之兩側配置12μm厚之電解銅箔(商品名「3EC-M3-VLP」，三井金屬礦業(股)製)，於壓力30kgf/cm2 、溫度220℃進行120分鐘之疊層成形，獲得絕緣層厚度0.4mm或0.8mm之覆銅疊層板(覆金屬箔疊層板)。使用獲得之覆銅疊層板，進行玻璃轉化溫度、阻燃性、及吸濕耐熱性之評價。結果如表1所示。
(測定方法及評價方法) 1) 玻璃轉化溫度(Tg) 針對獲得之覆銅疊層板(使用8片之預浸體者)，依循JISC6481，藉由使用動態黏彈性分析裝置(TA Instruments.製)之DMA法測定玻璃轉化溫度。 2) 阻燃性 針對獲得之覆銅疊層板(使用4片之預浸體者)，藉由蝕刻除去覆銅疊層板之銅箔後，依循UL94垂直燃燒試驗法，評價其阻燃性。 3) 吸濕耐熱性 將獲得之覆銅疊層板(使用4片之預浸體者)切割為50mm×50mm，以蝕刻除去其單面之一半以外的全部銅箔而獲得試驗片。獲得之試驗片，以加壓蒸煮器(平山製作所製，PC-3型)於121℃、2大氣壓處理5小時後，於260℃之焊料中浸漬60秒，以目視觀察後續之外觀變化。藉由有發生起泡之試驗片之數量相對於試驗之全部試驗片之數量的比來評價吸濕耐熱性。
(比較例1) 使用雙酚A型氰酸酯化合物(商品名「CA210」，三菱瓦斯化學(股)製)50質量份替代MF27S-3-CN 50質量份以外，以與實施例1之相同方法獲得厚度0.4mm或0.8mm之覆銅疊層板。獲得之覆銅疊層板的評價結果表示於表1中。
(比較例2) 使用苯酚酚醛清漆型氰酸酯化合物(商品名「Primaset PT-30」，LONZA. Japan.(股)製)50質量份替代MF27S-3-CN 50質量份以外，以與實施例1之相同方法獲得厚度0.4mm或0.8mm之覆銅疊層板。獲得之覆銅疊層板的評價結果表示於表1中。
【表1】
從表1可明顯地確認到，藉由使用本發明之樹脂組成物可達成能夠獲得不僅具有優良耐熱性、阻燃性，且吸濕耐熱性也優良之印刷電路板的預浸體等。
本申請案係基於2015年3月31日提申之日本專利申請案(日本特願2015-072691)，其內容納入於此作為參考。 [產業上利用性]
本發明之樹脂組成物，於電氣電子材料、機具材料、航空材料等之各種用途，可廣泛且有效地利用作為例如電絕緣材料、半導體塑膠封裝體、密封材料、黏著劑、疊層材料、阻劑(resist)、增建疊層板材料等。特別是，本發明之樹脂組成物，尤其可有效利用作為近年之資訊終端設備或通信設備等之因應高積體、高密度化之印刷電路板材料。此外，本發明之覆金屬箔疊層板等，不僅具有耐熱性及阻燃性，也具有吸濕耐熱性優良之性能，故為工業方面之實用性極高者。
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Claims (12)

  1. 一種印刷電路板用樹脂組成物，含有： 具有選自於由下式(1)、下式(2)及下式(8)表示之結構構成之群組中之1種以上之結構的氰酸酯化合物(A)、及環氧樹脂(B)； 【化1】式中，k表示1以上之整數，l表示0以上之整數；也可為不同k及l之化合物之混合物；各重複單元之排列為任意； 【化2】式中，m及n表示0以上之整數，且至少任一者為1以上；也可為不同m及n之化合物之混合物；各重複單元之排列為任意； 【化3】式中，m表示0以上之整數；也可為不同m之化合物之混合物。
  2. 一種印刷電路板用樹脂組成物，含有： 將選自於由萘酚-二羥基萘芳烷基樹脂及二羥基萘芳烷基樹脂構成之群組中之1種以上之樹脂予以氰酸酯化而得之氰酸酯化合物(A)；及 環氧樹脂(B)。
  3. 如申請專利範圍第1項之印刷電路板用樹脂組成物，其中，該氰酸酯化合物(A)係將選自於由萘酚-二羥基萘芳烷基樹脂及二羥基萘芳烷基樹脂構成之群組中之1種以上之樹脂予以氰酸酯化而得。
  4. 如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物，其中，相對於該樹脂組成物中之樹脂固體成分100質量份，該氰酸酯化合物(A)之含量為1~90質量份。
  5. 如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物，更含有填充材(C)。
  6. 如申請專利範圍第5項之印刷電路板用樹脂組成物，其中，相對於該樹脂組成物中之樹脂固體成分100質量份，該填充材(C)之含量為50~1600質量份。
  7. 如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物，更含有選自於由該氰酸酯化合物(A)以外之氰酸酯化合物、馬來醯亞胺化合物、及苯酚樹脂構成之群組中之1種以上。
  8. 如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物，其中，該環氧樹脂(B)係選自於由聯苯芳烷基型環氧樹脂、伸萘基醚型環氧樹脂、多官能苯酚型環氧樹脂及萘型環氧樹脂構成之群組中之1種以上。
  9. 一種預浸體，具備： 基材；及 含浸於或塗佈於該基材之如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物。
  10. 一種覆金屬箔疊層板，具有： 疊層了至少1片以上之如申請專利範圍第9項之預浸體；及 配置在該預浸體之單面或兩面之金屬箔。
  11. 一種樹脂複合片，具有： 支持體；及 配置在該支持體之表面的如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物。
  12. 一種印刷電路板，具有： 絕緣層，及在該絕緣層之表面形成之導體層； 該絕緣層含有如申請專利範圍第1至3項中任一項之印刷電路板用樹脂組成物。
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