TW201630493A - 將一構件作電接觸的方法及構件複合體 - Google Patents

將一構件作電接觸的方法及構件複合體 Download PDF

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Publication number
TW201630493A
TW201630493A TW104142928A TW104142928A TW201630493A TW 201630493 A TW201630493 A TW 201630493A TW 104142928 A TW104142928 A TW 104142928A TW 104142928 A TW104142928 A TW 104142928A TW 201630493 A TW201630493 A TW 201630493A
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Taiwan
Prior art keywords
component
circuit carrier
compensating element
conductive layer
connection
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Application number
TW104142928A
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English (en)
Chinese (zh)
Inventor
烏爾立希 沙夫
克里斯提娜 貝爾蕭
魯本 法爾
安德亞斯 庫格勒
恩諾 羅倫斯
Original Assignee
羅伯特博斯奇股份有限公司
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Application filed by 羅伯特博斯奇股份有限公司 filed Critical 羅伯特博斯奇股份有限公司
Publication of TW201630493A publication Critical patent/TW201630493A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L2224/2402—Laminated, e.g. MCM-L type
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    • H01L2224/2405—Shape
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/35—Mechanical effects
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    • H01L2924/30—Technical effects
    • H01L2924/37—Effects of the manufacturing process
    • H01L2924/37001—Yield

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW104142928A 2014-12-22 2015-12-21 將一構件作電接觸的方法及構件複合體 TW201630493A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014226773.0A DE102014226773A1 (de) 2014-12-22 2014-12-22 Verfahren zum elektrischen Kontaktieren eines Bauteils und Bauteileverbund

Publications (1)

Publication Number Publication Date
TW201630493A true TW201630493A (zh) 2016-08-16

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ID=54780325

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Application Number Title Priority Date Filing Date
TW104142928A TW201630493A (zh) 2014-12-22 2015-12-21 將一構件作電接觸的方法及構件複合體

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DE (1) DE102014226773A1 (de)
TW (1) TW201630493A (de)
WO (1) WO2016102166A1 (de)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4228274C2 (de) * 1992-08-26 1996-02-29 Siemens Ag Verfahren zur Kontaktierung von auf einem Träger angeordneten elektronischen oder optoelektronischen Bauelementen
US5637922A (en) * 1994-02-07 1997-06-10 General Electric Company Wireless radio frequency power semiconductor devices using high density interconnect
FR2818801B1 (fr) * 2000-12-21 2003-04-04 Gemplus Card Int Interconnexion par organe d'isolation decoupe et cordon de conduction
AT503191B1 (de) * 2006-02-02 2008-07-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einem eingebetteten bauelement sowie verfahren zum einbetten zumindest eines bauelements in einem leiterplattenelement
DE102013201926A1 (de) 2013-02-06 2014-08-07 Robert Bosch Gmbh Verfahren zum elektrischen Kontaktieren eines Bauteils und Bauteilverbund

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DE102014226773A1 (de) 2016-06-23

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