TW201630493A - Process to electrically contact a component and component composite - Google Patents

Process to electrically contact a component and component composite Download PDF

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Publication number
TW201630493A
TW201630493A TW104142928A TW104142928A TW201630493A TW 201630493 A TW201630493 A TW 201630493A TW 104142928 A TW104142928 A TW 104142928A TW 104142928 A TW104142928 A TW 104142928A TW 201630493 A TW201630493 A TW 201630493A
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Taiwan
Prior art keywords
component
circuit carrier
compensating element
conductive layer
connection
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TW104142928A
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Chinese (zh)
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烏爾立希 沙夫
克里斯提娜 貝爾蕭
魯本 法爾
安德亞斯 庫格勒
恩諾 羅倫斯
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羅伯特博斯奇股份有限公司
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Publication of TW201630493A publication Critical patent/TW201630493A/en

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a method for electrical contact-connection of a component (1), wherein the component (1) is arranged on a circuit carrier (10) that has a first connection area (11), and wherein the first connection area (11) is connected to a second connection area (3), associated with the component (1), by means of an electrically conductive layer (25). The invention provides for the component (1) to be covered by a, in particular film-like, equalization element (20) at least in the transition region between the component (1) and the circuit carrier (10) in order to bridge different levels of height between the circuit carrier (10) and the component (1), and for the electrically conductive layer (25) to be produced after the equalization element (20) has been arranged.

Description

將一構件作電接觸的方法及構件複合體 Method for making electrical contact with a component and component composite

本發明係有關於一種如申請專利範圍第1項之前言的將一構件作電接觸的方法。本發明亦有關於一種如獨立裝置項之前言的構件複合體。 The present invention is directed to a method of electrically contacting a member as previously described in claim 1. The invention also relates to a component composite as previously described in the stand-alone device.

申請人的DE 10 2013 201 926 A1揭露了如兩個獨立項之前言的一種將一構件作電接觸的方法及一種構件複合體。根據該案所揭露的方法，在電路載體上鍍覆非導電黏合劑，其用於將電子構件固定於該電路載體上。在該電路載體上佈置有特別是形式為導電通路或類似物的第一連接區域，而在該構件上則佈置有第二連接區域。藉由用噴射法鍍覆的導電層將此二相對電路載體處於不同高度水平上的連接區域電相連。該案之實質之處在於，透過鍍覆於電路載體與該構件間的黏合劑，來避免該二元件間否則會出現的階梯狀過渡。特別是透過相應的佈置方案及黏合劑的量，來在電路載體的高度水平與構件在其頂面的高度水平間，形成至少基本持續或連續或傾斜的過渡。如此便能在必須克服不連貫或階梯狀的高度差時，用噴射法簡化導電層的鍍覆。藉由用噴射法鍍覆的導電層相對較難克 服此類不連貫或階梯狀的高度差，因為在該區域中要求極大的層厚，以便特別是在相應構件複合體的整個使用壽命中實現充分可靠的電連接。但是在實踐中就工藝技術而言，正是對厚度差較大的導電層進行控制或構建是相對較難克服或保證的。此外若要黏合劑層的精確配量或佈置能實現電路載體與構件間儘可能連續的過渡，則相對較難。且實踐表明，厚度例如約為25μm之形式為晶片的超薄構件，具有相對尖銳的邊緣，藉由用噴射法鍍覆的導電層很難與其接觸。 The applicant's DE 10 2013 201 926 A1 discloses a method of electrically contacting a component and a component composite as previously described in two separate items. According to the method disclosed in the present invention, a non-conductive adhesive is plated on the circuit carrier for fixing the electronic component to the circuit carrier. A first connection region, in particular in the form of a conductive path or the like, is arranged on the circuit carrier, and a second connection region is arranged on the component. The two connection regions which are at different height levels with respect to the circuit carrier are electrically connected by a conductive layer plated by a spray method. The essence of the case is that the stepped transition that would otherwise occur between the two components is avoided by the adhesive applied between the circuit carrier and the component. In particular, at least a substantially continuous or continuous or inclined transition is formed between the height level of the circuit carrier and the height level of the component at its top surface, by means of a corresponding arrangement and the amount of adhesive. In this way, the plating of the conductive layer can be simplified by the spraying method when it is necessary to overcome the discontinuous or stepped height difference. The conductive layer plated by the spray method is relatively difficult Such a discontinuous or stepped height difference is required, since an extremely large layer thickness is required in this region in order to achieve a sufficiently reliable electrical connection, in particular over the entire service life of the respective component composite. However, in practice, in terms of process technology, it is relatively difficult to overcome or guarantee the control or construction of a conductive layer having a large difference in thickness. Furthermore, it is relatively difficult to achieve a continuous transition between the circuit carrier and the component if the precise dosing or arrangement of the adhesive layer is to be achieved. And practice has shown that a thickness of, for example, about 25 μm is an ultra-thin member of a wafer having relatively sharp edges which are difficult to contact by a conductive layer plated by a spray method.

基於上述先前技術，本發明之目的在於進一步改良如申請專利範圍第1項之前言的將一構件作電接觸的方法以及如獨立的裝置項之前言的構件複合體，使得藉由導電層實現電路載體與構件間極可靠的連接。 Based on the above prior art, it is an object of the present invention to further improve a method of electrically contacting a member as in the first aspect of the patent application and a component composite as in the prior art device, such that the circuit is realized by a conductive layer. Extremely reliable connection between the carrier and the component.

在具有申請專利範圍第1項之區別特徵的一種將一構件作電接觸的方法方面，本發明用以達成上述目的之解決方案為，至少在該構件與電路載體的過渡區域內，用特別是膜狀的補償元件覆蓋該構件，從而克服該電路載體與該構件間不同的高度水平，以及，在佈置該補償元件後構建該導電層。 In a method of electrically contacting a component with the distinguishing feature of claim 1 of the patent application, the solution of the invention for achieving the above object is, at least in the transition region of the component and the circuit carrier, in particular A film-like compensating element covers the member to overcome a different level of height between the circuit carrier and the member, and the conductive layer is constructed after the compensating element is disposed.

此種本發明的方法特別具有以下優勢：毋需使用先前技術的用於高度補償的黏合劑。此外，本發明的方法亦具以下優勢：透過膜狀的補償元件(其為了補償不同的高度水平必須具有某種撓度)可保護由補償元件覆蓋的電路載體或構件的區域不受外部影響。 Such a method of the invention has the particular advantage that it is not necessary to use prior art adhesives for height compensation. Furthermore, the method according to the invention has the advantage that the area of the circuit carrier or component covered by the compensating element can be protected from external influences by means of a film-like compensating element which must have some deflection in order to compensate for different height levels.

在構件複合體方面，本發明用以達成上述目的之解決方案為，在該電路載體與該構件的過渡區域內佈置有膜狀的補償元件，其形成 該電路載體與該構件間的連續過渡。 In terms of component composites, the solution of the invention to achieve the above object is that a film-like compensation element is arranged in the transition region of the circuit carrier and the component, which forms A continuous transition between the circuit carrier and the component.

本發明之將一構件作電接觸的方法及構件複合體的有利改良方案參閱附屬項。由申請專利範圍、說明書及/或附圖所揭露之特徵中的至少兩項所構成的所有組合皆納入本發明之範圍。 The method of making electrical contact of a component and the advantageous improvement of the component composite of the present invention are referred to the attached items. All combinations of at least two of the features disclosed in the claims, the description and/or the drawings are included in the scope of the invention.

在本發明之方法的一種極佳設計方案中，為藉由黏合劑層將該構件佈置於該電路載體上，該黏合劑的層厚較佳小於10μm。該設計方案之優點在於，透過該黏合劑層僅相對較小地提高該二連接區域間的高度差，從而使得需要由該膜狀的補償元件覆蓋的高度差，不會因該黏合劑層而不必要地額外增大。此外需要提及，與本文開篇所述之先前技術不同，本發明毋需使得黏合劑物質超出構件之區域以外，從而使得黏合劑的消耗極低。 In an excellent design of the method of the present invention, the member is disposed on the circuit carrier by an adhesive layer, and the layer thickness of the adhesive is preferably less than 10 μm. The advantage of this design is that the height difference between the two connection regions is only relatively small through the adhesive layer, so that the height difference covered by the film-like compensation element is not required due to the adhesive layer. Unnecessarily extra increases. In addition, it should be mentioned that, unlike the prior art described at the outset, the present invention requires that the binder material be outside the area of the component such that the binder consumption is extremely low.

為將該膜狀補償元件與該構件及與該電路載體連接在一起，以使得該補償元件儘可能整面地佈置於相應的區域上，根據尤佳設計方案，透過層壓將該膜狀的補償元件與該構件及該電路載體連接在一起。 In order to connect the film-like compensating element to the component and to the circuit carrier such that the compensating element is arranged over the entire area as far as possible, according to a preferred embodiment, the film is formed by lamination. A compensating element is coupled to the member and the circuit carrier.

此外根據該方法的一種極佳設計方案，在用該膜狀補償元件覆蓋該第一及/或第二連接區域時，在構建該導電層之前，將該第一及/或第二連接區域曝露。換言之，該膜狀補償元件至少突起至該第一或第二連接區域的範圍中，但是特別是亦可覆蓋至少一連接區域。如此便能特別是透過補償元件克服或補償本文開篇所述之位於構件上的相對尖銳的過渡或邊緣。此外透過佈置該補償元件，其中將該第一及/或第二連接區域曝露，使得該構件複合體之未曝露區域不受外部因素的影響。 In addition, according to an excellent design of the method, when the first and/or second connection regions are covered by the film-like compensation component, the first and/or second connection regions are exposed before the conductive layer is constructed. . In other words, the film-like compensating element protrudes at least into the region of the first or second connecting region, but in particular can also cover at least one connecting region. In this way, it is possible to overcome or compensate for the relatively sharp transitions or edges of the component described in the opening paragraph, in particular by means of the compensating element. Furthermore, by arranging the compensating element, the first and/or second connecting region is exposed such that the unexposed area of the component composite is unaffected by external factors.

在該曝露的較佳設計方案中，透過雷射束實現曝露。使用雷 射束的主要優點在於，能夠在該等連接區域的範圍中以下文將予討論的尺寸高精度地將該等連接區域曝露。 In a preferred embodiment of the exposure, exposure is achieved by a laser beam. Use mine The main advantage of the beam is that the connection areas can be exposed with high precision in the dimensions of the connection areas as will be discussed below.

根據另一較佳設計方案，用噴射法鍍覆該導電層。其中要麼例如使用所謂的氣溶膠噴射法，要麼使用導電黏合劑或類似物。此外當然亦可採用先前技術所公開的其他方法(如噴墨法)來構建該層，或者將其鍍覆至電路載體及構件。 According to another preferred embodiment, the electrically conductive layer is plated by spraying. Therein, for example, a so-called aerosol spray method or a conductive adhesive or the like is used. It is of course also possible to construct the layer by other methods disclosed in the prior art, such as an ink jet method, or to plate it to circuit carriers and components.

在該構件複合體的較佳設計方案中，該補償元件由聚合物材料(如丙烯酸酯、EVA或類似物)構成且具有10μm至100μm，較佳為10μm至50μm的厚度。 In a preferred embodiment of the component composite, the compensating element is composed of a polymeric material (such as acrylate, EVA or the like) and has a thickness of from 10 μm to 100 μm, preferably from 10 μm to 50 μm.

特定言之，該導電層及/或該補償元件構建為，使得該導電層附著在該補償元件上。 In particular, the electrically conductive layer and/or the compensating element are constructed such that the electrically conductive layer is attached to the compensating element.

本發明的更多優點、特徵及細節參閱下文對較佳實施例的說明以及附圖。 Further advantages, features and details of the invention are described in the following description of the preferred embodiments and the accompanying drawings.

1‧‧‧構件 1‧‧‧ components

2‧‧‧頂面 2‧‧‧ top surface

3‧‧‧第二連接區域 3‧‧‧Second connection area

5‧‧‧雷射束 5‧‧‧Ray beam

10‧‧‧電路載體 10‧‧‧Circuit carrier

11‧‧‧第一連接區域 11‧‧‧First connection area

12‧‧‧頂面 12‧‧‧ top surface

15‧‧‧裝置 15‧‧‧ device

16‧‧‧黏合劑層，固定層 16‧‧‧Binder layer, fixed layer

20‧‧‧補償元件 20‧‧‧Compensation components

21‧‧‧薄膜 21‧‧‧ Film

25‧‧‧導電層 25‧‧‧ Conductive layer

26‧‧‧噴霧裝置 26‧‧‧Spray device

27‧‧‧保護層 27‧‧‧Protective layer

100‧‧‧構件複合體 100‧‧‧Component complex

圖1至7分別為在將一構件作本發明的電接觸時的不同階段內，電子構件與構建為印刷電路板的電路載體間的連接區域的剖面圖。 1 to 7 are cross-sectional views, respectively, of a connection region between an electronic component and a circuit carrier constructed as a printed circuit board at different stages in the electrical contact of a component.

相同或功能相同的元件在附圖中用同一元件符號表示。 The same or functionally identical elements are denoted by the same reference numerals in the drawings.

附圖示出一例如形式為印刷電路板的電路載體10，其用作電子構件1的構件載體。該構件1較佳(但非限制性地)係指具有電子電路的形式為IC、ASIC為類似物的構件1。尤指相對較薄的構件1，例如為具有約10μm至50μm厚度的構件1。此外需要提及，除將印刷電路板用 作電路載體10外，亦可用所有常用的基板材料來構建相應的電路載體10。電路載體10在與構件1的連接區域中具有至少一第一連接區域11，但在實踐中具有多個第一連接區域11，其例如可構建為導電通路、焊盤或類似物。如圖3至7所示，該構件1在其頂面2具有數目與第一連接區域11一致且分配給其的第二連接區域3，其例如可構建為局部塗層或類似物。 The drawing shows a circuit carrier 10, for example in the form of a printed circuit board, which serves as a component carrier for the electronic component 1. The member 1 preferably, but not exclusively, refers to a member 1 having an electronic circuit in the form of an IC, an ASIC or the like. In particular, the relatively thin member 1 is, for example, a member 1 having a thickness of about 10 μm to 50 μm. Also need to mention, in addition to the use of printed circuit boards In addition to the circuit carrier 10, the corresponding circuit carrier 10 can also be constructed from all common substrate materials. The circuit carrier 10 has at least one first connection region 11 in the connection region with the component 1, but in practice has a plurality of first connection regions 11, which can be embodied, for example, as conductive paths, pads or the like. As shown in FIGS. 3 to 7, the component 1 has on its top surface 2 a number of second connection regions 3 which are identical to the first connection region 11 and assigned thereto, which can be embodied, for example, as a partial coating or the like.

如圖2所示，在將構件1作接觸的第一處理步驟中，藉由適宜的裝置15在構件1與電路載體10間的連接區域中鍍覆特別是形式為黏合劑層的非導電固定層16。需要提及，必須將該固定層16僅鍍覆於構件1之位於電路載體10上之基面的分區中。亦即，在圖3所示的位於電路載體3上之構件1的接合狀態下，該固定層16毋需突出至該構件1的外周。此外值得期望的是，形成儘可能薄的固定層16，其例如(但非限制性地)具有2μm至20μm的厚度。 As shown in Fig. 2, in a first processing step of contacting the component 1, a non-conductive fixation, in particular in the form of an adhesive layer, is applied in the connection region between the component 1 and the circuit carrier 10 by means of a suitable device 15. Layer 16. It should be mentioned that the fixing layer 16 must be plated only in the section of the component 1 on the base surface of the circuit carrier 10. That is, in the joined state of the member 1 on the circuit carrier 3 shown in FIG. 3, the fixed layer 16 does not need to protrude to the outer periphery of the member 1. It is furthermore desirable to form a support layer 16 which is as thin as possible, which has, for example, but not limited to, a thickness of from 2 μm to 20 μm.

隨後，在圖3所示的處理步驟中，將構件1定位於固定層16上。其中為固化該固定層16，可在隨後未示出的處理步驟中，例如透過熱處理或類此方式將固定層16固化或乾燥。 Subsequently, in the processing step shown in Figure 3, the component 1 is positioned on the fixed layer 16. Where the fixing layer 16 is cured, the fixing layer 16 may be cured or dried in a processing step not shown later, for example by heat treatment or the like.

發明實質之處在於隨後佈置一用作補償元件20的薄膜21。該撓性薄膜21特別是被構建為聚合物薄膜且具有10μm至100μm，較佳為10μm至25μm的厚度。在圖4a所示實施方案中，該補償元件20或薄膜21整面地覆蓋構件1且在佈置於構件1與電路載體10間的中間區域中與電路載體10的頂面12連接在一起，但止於第一連接區域11前。而在圖4b所示實施方式中，該補償元件20或薄膜21既覆蓋構件1又覆蓋第一連接區域11，使得該補償元件20或薄膜21額外地在第一連接區域11之背離構件 1的一側上與電路載體10的頂面12連接在一起。 The essence of the invention is that a film 21 serving as the compensating element 20 is subsequently arranged. The flexible film 21 is in particular constructed as a polymer film and has a thickness of from 10 μm to 100 μm, preferably from 10 μm to 25 μm. In the embodiment shown in FIG. 4a, the compensating element 20 or the film 21 covers the component 1 over its entire surface and is connected to the top surface 12 of the circuit carrier 10 in an intermediate region arranged between the component 1 and the circuit carrier 10, but It ends in front of the first connection area 11. In the embodiment shown in FIG. 4 b , the compensating element 20 or the film 21 covers both the component 1 and the first connecting region 11 such that the compensating element 20 or the film 21 additionally faces away from the component in the first connecting region 11 . One side of 1 is connected to the top surface 12 of the circuit carrier 10.

在兩種情況下，較佳地透過層壓處理或層壓來佈置或安裝補償元件20或薄膜21。 In either case, the compensating element 20 or film 21 is preferably arranged or mounted by lamination or lamination.

如圖5所示，隨後(視情況以採用未示出之處理步驟的方式)，透過雷射束5至少將構件1上之第二連接區域3曝露。此外需要提及，在圖4b所示之第二實施方案中，透過雷射束5不僅將構件1上的第二連接區域3曝露，亦以相同的方式將電路載體10上的第一連接區域11曝露。 As shown in Fig. 5, at least the second connection region 3 on the member 1 is exposed through the laser beam 5, as appropriate (in the manner of a processing step not shown). Furthermore, it should be mentioned that in the second embodiment shown in FIG. 4b, not only the second connection region 3 on the component 1 is exposed through the laser beam 5, but also the first connection region on the circuit carrier 10 in the same manner. 11 exposure.

在構件1或電路載體10上佈置補償元件20或薄膜21時，重要之處在於，透過該補償元件20在該電路載體的頂面12與構件1的頂面2間的過渡區域中形成連續的過渡，從而避免階梯狀的區域或過渡。 When the compensation element 20 or the film 21 is arranged on the component 1 or the circuit carrier 10, it is important that a continuous continuation is formed in the transition region between the top surface 12 of the circuit carrier and the top surface 2 of the component 1 through the compensation element 20 Transition to avoid stepped areas or transitions.

如圖6所示，隨後在第一連接區域11與第二連接區域3間鍍覆導電層25，特別是藉由噴霧裝置26來鍍覆。 As shown in FIG. 6, the conductive layer 25 is subsequently plated between the first connection region 11 and the second connection region 3, in particular by means of a spray device 26.

最後可如圖7所示，藉由保護層27覆蓋由構件1與電路載體10構成的構件複合體100。特別是透過較佳由聚合物或類似物構成的保護層27將至少在構件1以及連接區域3、11與導電層25的區域覆蓋。 Finally, as shown in FIG. 7, the component composite 100 composed of the member 1 and the circuit carrier 10 is covered by a protective layer 27. In particular, the protective layer 27, preferably composed of a polymer or the like, is covered at least in the region of the component 1 and the connecting regions 3, 11 and the conductive layer 25.

在未脫離發明理念的情況下，可以各種方式改變或修改本文所描述的方法。舉例而言，可在構建保護層27之前或之後，透過相應的檢查裝置對電連接進行檢查。亦可在構建保護層27之前或之後對構件複合體100進行變溫測試，以便對該二連接區域3、11間的連接進行熱機械負荷，從而減少未來發生中斷的可能性。 The methods described herein can be changed or modified in various ways without departing from the inventive concept. For example, the electrical connections can be inspected through a corresponding inspection device before or after the protective layer 27 is constructed. The component composite 100 may also be subjected to a temperature change test before or after the construction of the protective layer 27 to thermally mechanically load the connection between the two connection regions 3, 11, thereby reducing the possibility of future interruptions.

1‧‧‧構件 1‧‧‧ components

3‧‧‧第二連接區域 3‧‧‧Second connection area

5‧‧‧雷射束 5‧‧‧Ray beam

10‧‧‧電路載體 10‧‧‧Circuit carrier

11‧‧‧第一連接區域 11‧‧‧First connection area

16‧‧‧黏合劑層，固定層 16‧‧‧Binder layer, fixed layer

20‧‧‧補償元件 20‧‧‧Compensation components

21‧‧‧薄膜 21‧‧‧ Film

Claims (10)

一種將一構件(1)作電接觸的方法，其中將該構件(1)佈置於具有第一連接區域(11)的電路載體(10)上，且其中藉由導電層(25)將該第一連接區域(11)與分配給該構件(1)的第二連接區域(3)連接在一起，其特徵在於，至少在該構件(1)與該電路載體(10)的過渡區域內，用特別是膜狀的補償元件(20)覆蓋該構件(1)，從而克服該電路載體(10)與該構件(1)間的不同高度水平，以及，在佈置該補償元件(20)後構建該導電層(25)。 A method of electrically contacting a member (1), wherein the member (1) is disposed on a circuit carrier (10) having a first connection region (11), and wherein the first layer (1) is provided by a conductive layer (25) A connection region (11) is connected to the second connection region (3) assigned to the component (1), characterized in that at least in the transition region of the component (1) and the circuit carrier (10) In particular, a film-like compensating element (20) covers the component (1), thereby overcoming different height levels between the circuit carrier (10) and the component (1), and constructing the compensating element (20) after the arrangement Conductive layer (25). 如申請專利範圍第1項之方法，其特徵在於，藉由層厚較佳小於10μm的黏合劑層(16)來將該構件(1)佈置於該電路載體(10)上。 The method of claim 1, wherein the member (1) is disposed on the circuit carrier (10) by a layer of adhesive (16) having a layer thickness of preferably less than 10 μm. 如申請專利範圍第1或2項之方法，其特徵在於，透過層壓將該補償元件(20)與該構件(1)及該電路載體(10)連接在一起。 The method of claim 1 or 2, wherein the compensating element (20) is joined to the member (1) and the circuit carrier (10) by lamination. 如申請專利範圍第1或2項之方法，其特徵在於，在用該補償元件(20)覆蓋該第一及/或第二連接區域(3，11)時，在 構建該導電層(20)之前，將該第一及/或第二連接區域(3，11)曝露。 The method of claim 1 or 2, characterized in that, when the first and/or second connection regions (3, 11) are covered by the compensating element (20), The first and/or second connection regions (3, 11) are exposed before the conductive layer (20) is constructed. 如申請專利範圍第4項之方法，其特徵在於，透過雷射束(5)將該第一及/或第二連接區域(3，11)曝露。 The method of claim 4, characterized in that the first and/or second connection regions (3, 11) are exposed through the laser beam (5). 如申請專利範圍第1或2項之方法，其特徵在於，採用噴射法鍍覆該導電層(25)。 The method of claim 1 or 2, wherein the conductive layer (25) is plated by a spray method. 一種構件複合體(100)，由具有第一連接區域(11)的電路載體(10)與具有第二連接區域(3)的構件(1)構成，其中該二連接區域(3，11)藉由導電層(25)相連，且其中該二連接區域(3，11)相對該電路載體(10)的平面處於不同的高度且以水平地彼此間隔一定距離的方式佈置，其特徵在於，在該電路載體(10)與該構件(1)間的過渡區域內佈置有特別是膜狀的補償元件(20)，其形成該電路載體(10)與該構件(1)間的連續過渡。 A component composite (100) consisting of a circuit carrier (10) having a first connection region (11) and a component (1) having a second connection region (3), wherein the two connection regions (3, 11) Connected by a conductive layer (25), and wherein the two connection regions (3, 11) are at different heights relative to the plane of the circuit carrier (10) and are arranged horizontally at a distance from one another, characterized in that Disposed in the transition region between the circuit carrier (10) and the component (1) is a film-like compensating element (20) which forms a continuous transition between the circuit carrier (10) and the component (1). 如申請專利範圍第7項之構件複合體，其特徵在於，該補償元件(20)由聚合物材料構成且具有10μm至100μm的厚度。 The component composite according to claim 7 is characterized in that the compensating element (20) is composed of a polymer material and has a thickness of from 10 μm to 100 μm. 如申請專利範圍第7或8項之構件複合體，其特徵在於，該補償元件(20)在該第一及/或第二連接區域(20)的範圍內具有用於 該導電層(25)的通孔。 A component composite according to claim 7 or 8, characterized in that the compensating element (20) has a scope for the first and/or second connection region (20) a through hole of the conductive layer (25). 如申請專利範圍第7或8項之構件複合體，其特徵在於，該導電層(25)及/或該補償元件(20)構建為，使得該導電層(25)附著在該補償元件(20)上。 The component composite according to claim 7 or 8, wherein the conductive layer (25) and/or the compensating element (20) are constructed such that the conductive layer (25) is attached to the compensating element (20) )on.
TW104142928A 2014-12-22 2015-12-21 Process to electrically contact a component and component composite TW201630493A (en)

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DE4228274C2 (en) * 1992-08-26 1996-02-29 Siemens Ag Method for contacting electronic or optoelectronic components arranged on a carrier
US5637922A (en) * 1994-02-07 1997-06-10 General Electric Company Wireless radio frequency power semiconductor devices using high density interconnect
FR2818801B1 (en) * 2000-12-21 2003-04-04 Gemplus Card Int INTERCONNECTION BY CUT-OUT INSULATION DEVICE AND CONDUCTION CORD
AT503191B1 (en) * 2006-02-02 2008-07-15 Austria Tech & System Tech PCB LAYER ELEMENT WITH AT LEAST ONE EMBEDDED COMPONENT AND METHOD FOR BEDDING AT LEAST ONE COMPONENT IN A LADDER PLATE ELEMENT
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