TW201630096A - Die picking apparatus with plurality faces inspection ability and method thereof - Google Patents

Abstract

A die picking apparatus with plurality faces inspection ability has a supply module; a receiving module adjacent to the supply module; a rotating module installed on top of the receiving module; a first pick and place module with plurality retrieval units, each retrieval unit rotatable installed at the rotating module; and a side inspection module installed on a side of the first pick and place module; wherein, the supply allows at least one die installed; each retrieval unit picks one die, each retrieval unit rotates a setting degree so that the side inspection module is able to capture plurality side images of the die; each retrieval unit places the die on the receiving module.

Description

Die picking device with multi-face detecting capability and method thereof

A chip picking device and method thereof with multi-face detecting capability, in particular, a chip picking device and method thereof capable of simultaneously capturing side images of a plurality of crystal grains to shorten inspection time and improve resolution and detection capability .

In the existing wafer provocation process, the necessity of additional visual inspection function is increasing. The visual inspection system is used to detect whether the five sides of the crystal grain have surface defects, and the surface flaw detection method of the crystal grain is simultaneously Affects the efficiency of the test and, in turn, the output of the provocator attached to this test function.

Referring to FIG. 1 , the existing visual inspection method uses a pick-and-place unit 70 to move a die 71 from a die supply module 76 to a detection station 72 . The inspection station 72 is comprised of a four-sided mirror 720 in a surrounding manner. When the pick and place unit 70 moves the die 71 above the detection station 72, the pick and place unit 70 is lowered to a specific distance so that the die 71 is positioned between the four-sided mirrors 720. A visual inspection unit 73 located below the detection station captures the image of the die 71 from the bottom up.

Since the crystal grains 71 are located between the four-sided mirrors 720, each of the mirrors 720 is opposite to one side of the die 71, and the mirror 720 has an oblique angle, the visual detecting unit 73 can be reflected by the respective mirrors 720. The image detecting unit 73 that captures the image of the four sides of the die 71 and captures the image from the bottom up can also capture the image of the bottom surface of the die 71, so when the die 71 is located at the detecting station 72, the vision The detecting unit 73 is capable of capturing an image of the five sides of the die 71 to perform surface flaw detection.

After the detection is completed, the pick-and-place unit 70 is raised by a certain distance so that the die 71 is located above the detecting station 72, and the pick-and-place unit 70 moves the die 71 to another position. For the next process. The other location is a die receiving module 77.

As described above, in the conventional visual inspection mode, when the die 71 enters and exits the detecting station 72, the position of the die 71 is lowered and recovered, which leads to prolongation of the working time of the wafer process, thereby failing to effectively reduce the wafer process. Working hours.

In addition, the image detecting unit 73 described above captures the image of the five sides of the die 71 in a single pass, and the resolution of the image is poor, which in turn causes the surface flaw to be effectively detected.

In summary, the existing visual inspection method has the disadvantages of poor resolution and long working hours.

In view of the above problems, an object of the present invention is to provide a die picking device having a multi-face detecting capability and a method thereof, which are capable of moving a die from a supply module to a receiving module. Simultaneously capturing side images of a plurality of dies, thereby shortening the inspection man-hours, and the images of the respective sides are captured by a single detection module, so that the resolution can be improved to improve the detection of the surface defects. Precision.

In order to achieve the above object, the technical means of the present invention is to provide a die picking device with multi-face detecting capability, comprising: a supply module; a receiving module adjacent to the supply module; a module, which is disposed above the receiving module; a first pick-and-place module having a plurality of pick-and-place units, each of the pick-and-place units being rotatably disposed on the rotating module; and a side detecting module The system is disposed on one side of the first pick-and-place module; wherein the supply module is provided with at least one die; each pick-and-place unit picks up a die, and each pick-and-place unit rotates by a set angle to The edge detecting module captures a plurality of side images of the die, and the die collected by each pick-and-place unit is placed in the receiving module.

The invention further provides a die picking method with multi-face detecting capability, which comprises Having: capturing a plurality of side images of a die, the die moving to a side detection module, wherein the side detection module captures images of each side of the die; and placing the die on the die A receiving module.

In combination with the above-described multi-sided detection capability of the present invention, the side detection module of the present invention has a plurality of imaging units, and each of the side detection modules captures only a single side of the die. The image, so the resolution of the single side image is improved, thereby improving the accuracy of the detection of the surface flaw.

In addition, since the rotating module performs the necessary pause movement in response to the need of the die pick and place, the capturing of the side image is performed during the pause of the die, and at the same time, the side images of the plurality of crystal grains are captured, or The need to separately capture the side image of the die, so it does not interfere with the high-speed pick-and-place process of the pick-and-place module, so it can shorten the inspection man-hours and provide a high-efficiency multi-face inspection function without affecting the high speed of the die picker. Operation.

10‧‧‧Supply module

11‧‧‧Transfer module

110‧‧‧displacement unit

12‧‧‧Second pick and place module

13‧‧‧Receiving modules

14‧‧‧Rotary Module

140‧‧‧ drive gear

15‧‧‧First pick and place module

150‧‧‧ pick and place unit

151‧‧‧passive gear

16‧‧‧First Vision Positioning Module

17‧‧‧Second Visual Positioning Detection Module

18‧‧‧ Third visual positioning detection module

19‧‧‧ bottom vision inspection module

20‧‧‧Side detection module

200‧‧‧ first photography unit

201‧‧‧Second photography unit

202‧‧‧ third photography unit

203‧‧‧Fourth photography unit

30‧‧‧ grain

40‧‧‧Supply module

41‧‧‧Transfer module

42‧‧‧Flip module

43‧‧‧Second pick and place module

44‧‧‧Accept module

45‧‧‧Rotary Module

46‧‧‧First pick and place module

460‧‧‧ pick and place unit

461‧‧‧Rotation unit

47‧‧‧First Vision Positioning Module

48‧‧‧Second Visual Positioning Detection Module

49‧‧‧ Third visual positioning detection module

50‧‧‧ bottom vision inspection module

51‧‧‧ Side detection module

510‧‧‧ first photography unit

511‧‧‧Second photography unit

512‧‧‧ third photography unit

513‧‧‧Fourth photography unit

60‧‧‧ grain

42A‧‧‧Flip module

70‧‧‧ pick and place unit

71‧‧‧ grain

72‧‧‧Checkpoint

720‧‧‧Mirror

73‧‧‧Visual inspection unit

76‧‧‧die supply module

77‧‧‧Grad receiving module

FIG. 1 is a schematic diagram of a pick-and-place unit, a detection station, and an image detecting unit of a conventional visual inspection method.

Fig. 2 is a top plan view showing a first embodiment of a die picking device having multi-face detecting capability according to the present invention.

Figure 3 is a side elevational view of a first embodiment of a die picking device having multi-faceted inspection capabilities of the present invention.

Fig. 4 is a top plan view showing a second embodiment of a die picking device having multi-face detecting capability according to the present invention.

Fig. 5 is a side elevational view showing a second embodiment of a die picking device having multi-face detecting capability according to the present invention.

Fig. 6 is a top plan view showing a third embodiment of a die picking device having multi-face detecting capability according to the present invention.

Figure 7 is a side elevational view of a third embodiment of a die picking device having multi-faceted inspection capabilities of the present invention.

Figure 8 is a view of a die picking device with multi-face detection capability of the present invention A schematic top view of the fourth embodiment.

Figure 9 is a side elevational view showing a fourth embodiment of a die picking device having multi-faceted detecting capability according to the present invention.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and advantages of the present invention.

Referring to FIG. 2 and FIG. 3, the present invention is a first embodiment of a multi-faceted detection die picking device having a supply module 10, a receiving module 13, and a rotating die. The group 14 , a first pick-and-place module 15 , a first visual positioning module 16 , a third visual positioning detecting module 18 , a bottom visual detecting module 19 and at least one side detecting module 20 .

The supply module 10 is provided for at least one die 30. As shown in FIG. 3, in the present embodiment, the supply module 10 can be moved in a lateral direction, that is, an X-axis movement or a Y-axis movement or an X-axis and a Y-axis movement simultaneously or sequentially.

The receiving module 13 is located on one side of the supply module 10, and the receiving module 13 is provided for at least one die 30. The receiving module 13 can be moved in a lateral direction, that is, an X-axis movement or a Y-axis movement or an X-axis and a Y-axis movement simultaneously or sequentially.

The rotary module 14 is disposed above the receiving module 13 . In this embodiment, the supply module 10 can reciprocate relative to the rotating module 14, or both the rotating module 14 and the supply module 10 can simultaneously reciprocate.

The first pick-and-place module 15 is disposed on the rotating module 14 . The first pick-and-place module 15 has a plurality of pick-and-place units 150 , and the plurality of pick-and-place units 150 are disposed at an equiangular distribution on the rotating module 14 . The first pick-and-place module 15 is described in detail in the second embodiment described below.

The first visual positioning module 16 is disposed above the receiving module 13 and above the rotating module 14 .

The third visual positioning detection module 18 is located above the supply module 10, and can obtain a positive top image of the die 30 for detection and positioning.

The bottom vision detecting module 19 is located in one of the pick-and-place units of the first pick-and-place module 15 Below 150.

The side detection module 20 is located on one side of the first pick-and-place module 15 . The side detection module 20 is described in detail in the second embodiment described below. The side detection module 20 has a plurality of imaging units 200, 201, 202, and 203. For ease of understanding, the aforementioned photographing units 200, 201, 202, and 203 are divided into a first photographing unit 200, a second photographing unit 201, a third photographing unit 202, and a fourth photographing unit 203. The number of the photographing units 200, 201, 202, and 203 can be increased or decreased according to actual demand, and is not limited to the embodiment.

As shown in FIG. 2 and FIG. 3, the present invention is a first embodiment of a die picking method with multi-face detecting capability, the steps comprising: picking up a die 30, and supplying a module 10 for at least one crystal. The pellets 30 are set. The third visual positioning detection module 18 captures the image of the die 30 located in the supply module 10, and the image may also be the positive top image of the die 30 for detection and positioning. The image is transmitted to the first pick-and-place module 15 for the first pick-and-place module 15 to position the die 30.

The bottom image of a die 30 is captured, and the rotating module 14 moves the die 30 above the bottom visual inspection module 19. The bottom vision detection module 19 captures the bottom image of the die 30.

The side of the die 30 is captured, and the rotating module 14 moves the die 30 that has been captured from the bottom image relative to the position of the first camera unit 200. When the rotating module 14 is rotated, the driving gear 140 drives the driven gear 151 to rotate the pick-and-place unit 150 by a set angle, and the first side of the die 30 faces the first photographing unit 200, and A camera unit 200 is capable of capturing a first side image of the die 30.

Taking the remaining side images of the die 30, the rotating module 14 sequentially moves the die 30 to the positions of the second to fourth photographic units 201, 202, 203, and the driving gear 140 cooperates with the driven gear 151 to make the crystal The second side surface, the third side surface and the fourth side surface of the grain 30 respectively face the second photographing unit 201, the third photographing unit 202 and the fourth photographing unit 203, whereby the second photographing unit 201 can capture the number of the crystal grains 30 The second side view unit 202 can capture the third side image of the die 30, and The four camera unit 203 is capable of capturing a fourth side image of the die 30.

The die 30 is placed on the receiving module 13 , and the rotating module 14 moves the die 30 to the top of the receiving module 13 . The first visual positioning module 16 can capture the image of the top end of the receiving module 13 . According to the image, the pick-and-place unit 150 places the die 30 on the receiving module 13 .

Referring to FIG. 4 and FIG. 5, the present invention is a second embodiment of a die picking device having multi-face detecting capability, which is a further derivative of the first embodiment described above, so that the component symbol is used. The first embodiment described above is specifically described first. The die picking device with multi-face detecting capability of the present invention has a supply module 10, a transfer module 11, a second pick-and-place module 12, a receiving module 13, a rotating module 14, and a first The pick-and-place module 15, a first visual positioning module 16, a second visual positioning detecting module 17, a third visual positioning detecting module 18, a bottom visual detecting module 19 and at least one side detecting module 20.

The supply module 10 is provided for at least one die 30.

The transfer module 11 is adjacent to the supply module 10, and the transfer module 11 has a displacement unit 110. The displacement unit 110 enables the rotary module 11 to perform an X-axis reciprocating motion and a Y-axis reciprocating motion. Or a Z-axis reciprocating motion.

The second pick-and-place module 12 is disposed above the supply module 10 , and the second pick-and-place module 12 is reciprocated between the supply module 10 and the transfer module 11 .

The receiving module 13 is adjacent to the relay module 11 , and the receiving module 13 is provided for at least one die 30 .

The rotary module 14 is disposed above the receiving module 13 . The rotating module 14 has a driving gear 140. The driving gear 140 is coupled to a driving module. The driving module can be a motor or a gear assembly. In one embodiment, the motor drives the rotary module 14 to rotate, and the drive gear 140 is stationary, thereby causing the passive gear 151 to rotate naturally.

The first pick-and-place module 15 is disposed on the rotating module 14 . The first pick-and-place module 15 has a plurality of pick-and-place units 150 , and the plurality of pick-and-place units 150 are disposed at an equiangular distribution on the rotating module 14 . Each of the pick and place units 150 has a driven gear 151 that meshes with the drive gear 140. When the rotary module 14 is rotated, each of the pick and place units 150 surrounds The center of the rotating module 14 revolves around the center, and the driven gear 151 simultaneously drives the pick-and-place unit 150 to perform the rotation motion.

The first visual positioning module 16 is disposed above the receiving module 13 and above the rotating module 14 .

The second visual positioning detection module 17 is located above the relay module 11 to obtain a positive top image of the die 30 for detection and positioning.

The third visual positioning detection module 18 is located above the supply module 10.

The bottom visual inspection module 19 is located below one of the pick-and-place units 150 of the first pick-and-place module 15 , and the bottom visual inspection module 19 is adjacent to the transfer module 11 .

The side detection module 20 has a plurality of imaging units 200, 201, 202, and 203. For ease of understanding, the aforementioned photographing units 200, 201, 202, and 203 are divided into a first photographing unit 200, a second photographing unit 201, a third photographing unit 202, and a fourth photographing unit 203. The number of the photographing units 200, 201, 202, and 203 can be increased or decreased according to actual demand, and is not limited to the embodiment. The photographing units 200, 201, 202, and 203 are located on one side of the pick-and-place unit 150 of one of the first pick-and-place modules 15. Since the pick-and-place unit 150 rotates by the driven gear 151, the respective camera units 200, 201, 202, and 203 can respectively view different side images of the die 30.

As shown in FIG. 4 and FIG. 5, the present invention is a second embodiment of a die picking method with multi-face detecting capability, the steps of which include: picking up a die 30, and supplying a module 10 for at least one crystal. The pellets 30 are set. The third visual positioning detection module 18 captures an image of the die 30 located in the supply module 10, and the image may also be a positive top image of the die 30 for positioning and detection. The image is transmitted to the second pick-and-place module 12 for the second pick-and-place module 12 to position the die 30.

The second pick-and-place module 12 draws the die 30 located in the supply module 10 and places the die 30 on the transfer module 11 . The revolving module 11 performs a reciprocating motion to adjust the position or angle of the die 30 at the revolving module 11.

The second visual positioning detection module 17 captures the image of the die 30 located in the relay module 11 for positioning and detection, and the image may also be the positive top image of the die 30 for positioning or Detection.

The image captured by the second visual positioning detecting module 17 is provided to the first pick-and-place device 15 located in the rotating module 14 for positioning of the first pick-and-place device 15 The die 30 of the first pick-and-place device 15 picks up the die 30 of the transfer module 11 , and the rotary module 14 moves the die 30 to the bottom visual inspection module 19 . Above. The bottom vision detection module 19 captures the bottom image of the die 30.

The side of the die 30 is captured, and the rotating module 14 moves the die 30 that has been captured from the bottom image relative to the position of the first camera unit 200. When the rotating module 14 is rotated, the driving gear 140 drives the driven gear 151 to rotate the pick-and-place unit 150 by a set angle, and the first side of the die 30 faces the first photographing unit 200, and A camera unit 200 is capable of capturing a first side image of the die 30.

Taking the remaining side images of the die 30, the rotating module 14 sequentially moves the die 30 to the positions of the second to fourth photographic units 201, 202, 203, and the driving gear 140 cooperates with the driven gear 151 to make the crystal The second side surface, the third side surface and the fourth side surface of the grain 30 respectively face the second photographing unit 201, the third photographing unit 202 and the fourth photographing unit 203, whereby the second photographing unit 201 can capture the number of the crystal grains 30 In the two side images, the third photographing unit 202 can capture the third side image of the die 30, and the fourth photographing unit 203 can capture the fourth side image of the die 30.

The die 30 is placed on the receiving module 13 , and the rotating module 14 moves the die 30 to the top of the receiving module 13 . The first visual positioning module 16 can capture the image of the top end of the receiving module 13 . According to the image, the pick-and-place unit 150 places the die 30 on the receiving module 13 .

Referring to FIG. 6 and FIG. 7 , a third embodiment of the multi-faceted detection chip picking device of the present invention includes a supply module 40 , a transfer module 41 , and a flip module . 42. A second pick-and-place module 43 , a receiving module 44 , a rotating module 45 , a first pick-and-place module 46 , a first visual positioning module 47 , and a second visual positioning detecting module 48 . a third visual positioning detecting module 49, a bottom visual detecting module 50 and at least one side detecting module 51.

As in the second embodiment described above, the supply module 40, the transfer module 41, and the second pick and place The module 43, the receiving module 44, the rotating module 45, the first pick-and-place module 46, the first visual positioning module 47, the second visual positioning detecting module 48, the third visual positioning detecting module 49, and the bottom vision The manner in which the detecting module 50 and the side detecting module 51 are arranged is the same as the first embodiment described above, and therefore will not be further described herein.

In this embodiment, the inversion module 42 is disposed between the supply module 40 and the transfer module 41.

Each of the pick-and-place units 460 of the first pick-and-place module 46 has a rotation unit 461. When the pick-and-place unit 460 moves a set distance with the rotation module 45, the rotation unit 461 rotates the pick-and-place unit 460 by a set angle. The rotation unit 461 can be a motor or a gear assembly or a scroll assembly.

As described above, the side detection module 51 also has a first photographing unit 510, a second photographing unit 511, a third photographing unit 512, and a fourth photographing unit 513.

As shown in FIG. 6 and FIG. 7, the present invention is a third embodiment of a die picking method with multi-faceted detecting capability, the steps comprising: picking up a die 60, and supplying a module 40 for at least one crystal. Grain 60 is set. The third visual positioning detection module 49 captures the image of the die 60 located in the supply module 40, and the image may also be the positive top image of the die 60 for positioning and detection.

The second pick-and-place module 43 is based on the image provided by the third visual positioning detecting module 49 to suck the die 60 located in the supply module 40 and hand over the die 60 to the flip module 42. After the die 60 is turned over by a set angle, the die 60 is placed in the transfer module 41. The transfer module 41 performs a reciprocating motion to adjust the position or angle of the die 60 at the transfer module 41.

The image of the bottom surface of a die 60 is captured. The second visual positioning detection module 48 captures the image of the die 60 located in the transfer module 41 for positioning and detection. The image may also be a die 60. The top image is for positioning or inspection.

The pick-and-place unit 460 is configured to absorb the image provided by the second visual positioning detecting module 48 to suck the die 60 located in the transfer module 41, and the rotating module 45 moves the die to the top of the bottom visual detecting module 50. The bottom vision detection module 50 captures the bottom image of the die 60.

Taking a side view of one of the dies 60, the first photographic unit 510 picks up the dies 60 The first side image. During the rotation of the rotating module 45, the rotation unit 461 rotates the pick and place unit 460 by a set angle so that the first side of the die 60 faces the first photographing unit 510.

The remaining side images of the die 60 are captured, and the rotation module 45 sequentially moves the die 60 to the positions of the second to fourth imaging units 511 to 513. The rotation unit 461 rotates the pick and place unit 460 such that the second side of the die 60 faces the second photographing unit 511, the third side of the die 60 faces the third photographing unit 512, and the fourth of the die 60 The side faces the fourth photographing unit 513. The second to fourth imaging units 511 to 513 respectively capture the second side image to the fourth side image.

The die 60 is placed on the receiving module 44, and the rotating module 45 moves the die 60 to the upper side of the receiving module 44. The first visual positioning module 47 can capture the image of the top end of the receiving module 44. According to the image, the pick and place unit 460 places the die 60 on the receiving module 44.

Referring to FIG. 8 and FIG. 9 , a fourth embodiment of the multi-sided detection capability of the die picking device of the present invention, in the embodiment, the supply module 40 , the transfer module 41 , and the second The pick-and-place module 43, the receiving module 44, the rotating module 45, the first pick-and-place module 46, the first visual positioning module 47, the second visual positioning detecting module 48, and the third visual positioning detecting module 49, The bottom visual inspection module 50 and the side detection module 51 are arranged in the same manner as the third embodiment described above, so that the component symbols follow the third embodiment described above.

The inversion module 42A is disposed between the rotation module 41 and the rotation module 45.

As shown in FIG. 8 and FIG. 9, the present invention is a fourth embodiment of a die picking method with multi-face detecting capability, the steps comprising: picking up a die 60, and supplying a module 40 for at least one crystal. Grain 60 is set. The third visual positioning detection module 49 captures the image of the die 60 located in the supply module 40, and the image may also be the positive top image of the die 60 for positioning and detection.

The second pick-and-place module 43 according to the image provided by the third visual positioning detecting module 49 absorbs the die 60 located in the supply module 40 and places the die 60 in the transfer module 41. The transfer module 41 performs a reciprocating motion to adjust the position or angle of the die 60 at the transfer module 41.

The image of the bottom surface of a die 60 is captured. The second visual positioning detection module 48 captures the image of the die 60 located in the transfer module 41 for positioning and detection. The image may also be a die 60. The top image is for positioning or inspection.

The flip module 42A absorbs the die 60 located in the transfer module 41 according to the image, and flips the die 60 by a set angle.

The second visual positioning detection module 48 captures the image of the flip module 42A, and the image can also be regarded as the positive top image of the die. The image is provided to the first pick and place device 46 for the first pick and place device 46 to position the die 60 at the flip module 42A.

The pick-and-place unit 460 absorbs the image provided by the second visual positioning detecting module 48 to suck the die 60 located in the inverting module 42A, and the rotating module 45 moves the die to the top of the bottom visual detecting module 50, so that The bottom vision detection module 50 captures the bottom image of the die 60.

A side image of one of the dies 60 is captured, and the first photographic unit 510 captures a first side image of the dies 60. During the rotation of the rotating module 45, the rotation unit 461 rotates the pick and place unit 460 by a set angle so that the first side of the die 60 faces the first photographing unit 510.

The remaining side images of the die 60 are captured, and the rotation module 45 sequentially moves the die 60 to the positions of the second to fourth imaging units 511 to 513. The rotation unit 461 rotates the pick and place unit 460 such that the second side of the die 60 faces the second photographing unit 511, the third side of the die 60 faces the third photographing unit 512, and the fourth of the die 60 The side faces the fourth photographing unit 513. The second to fourth imaging units 511 to 513 respectively capture the second side image to the fourth side image.

The die 60 is placed on the receiving module 44, and the rotating module 45 moves the die 60 to the upper side of the receiving module 44. The first visual positioning module 47 can capture the image of the top end of the receiving module 44. According to the image, the pick and place unit 460 places the die 60 on the receiving module 44.

In summary, the first visual positioning module, the second visual positioning detecting module, the third visual positioning detecting module, the bottom side detecting module and the side detecting module are a charge coupled device (Charge-coupled Device). , CCD) or a camera.

The first visual positioning module, the second visual positioning detecting module, the third visual positioning detecting module, the bottom side detecting module and the side detecting module only capture a single side image of the die, so the single The resolution of the side images is improved, which in turn improves the accuracy of surface flaw detection.

The rotating module will perform the necessary pause movement according to the need of the die pick and place. The capture of the side image is in the process of pause of the die, and at the same time, the side images of the plurality of crystal grains are captured, or each camera unit is captured. The side images of the corresponding dies are individually captured according to the requirements, or the plurality of photographic units simultaneously capture the side images of the plurality of dies, so that the high-speed pick-and-place process of the pick-and-place module is not disturbed, so the shortening can be shortened The inspection man-hours provide a high-efficiency multi-face inspection function without affecting the high-speed operation of the die cutter.

In addition, when the die is moved by the rotating module, the die is also rotated by the suction unit, and the sucking unit is plural, and each sucking unit sucks a die, so that the side detecting module can simultaneously draw more The side images of the grains can be reduced by the inspection time of the grains.

The specific embodiments described above are only used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be used without departing from the spirit and scope of the invention. Equivalent changes and modifications made to the disclosure of the invention are still covered by the scope of the following claims.

10‧‧‧Supply module

13‧‧‧Receiving modules

14‧‧‧Rotary Module

140‧‧‧ drive gear

15‧‧‧First pick and place module

150‧‧‧ pick and place unit

151‧‧‧passive gear

18‧‧‧ Third visual positioning detection module

19‧‧‧ bottom vision inspection module

20‧‧‧Side detection module

200‧‧‧ first photography unit

201‧‧‧Second photography unit

202‧‧‧ third photography unit

203‧‧‧Fourth photography unit

30‧‧‧ grain

Claims (20)

A die picking device with multi-face detecting capability includes: a supply module; a receiving module adjacent to the supply module; and a rotating module disposed above the receiving module a first pick-and-place module having a plurality of pick-and-place units, each of the pick-and-place units being rotatably disposed in the rotating module; and a side detecting module disposed on the first pick-and-place module One side; wherein the supply module is provided for at least one die; each of the pick and place units picks up a die, and each of the pick and place units is rotated by a set angle so that the edge detecting module captures the crystal A plurality of side images of the particles, and the crystal grains sucked by the pick-and-place units are placed in the receiving module. The multi-faceted detection chip removing device according to the first aspect of the patent application has a bottom visual inspection module, and the bottom visual inspection module is disposed under the first pick-and-place module, the bottom The visual inspection module captures the image of the bottom surface of the die located in each of the pick and place units. The splicing device with multi-face detection capability according to claim 1, wherein each of the pick-and-place units rotates by a set angle when the rotating module rotates. The die picking device with the multi-faceted detecting capability described in claim 1 further has a first visual positioning module, wherein the first visual positioning module is located above the receiving module, the first The visual positioning module vertically captures images of the die located in the pick-and-place unit and the top end of the receiving module. The die picking device with multi-face detecting capability as described in claim 1 further has a third visual positioning detecting module, and the third visual positioning detecting module is located above the supplying module. The die picking device with multi-face detecting capability according to claim 5, wherein the third visual detecting and positioning module captures a positive top image of the die for detecting. A die picking device having multi-faceted detecting capability as described in claim 1 further includes a transfer module, the transfer module being located between the supply module and the receiving module, the turn The bearing module performs an X-axis reciprocating motion, a Y-axis reciprocating motion or a Z-axis reciprocating motion. The die picking device with multi-face detecting capability described in claim 7 further has a second visual positioning detecting module, and the second visual positioning detecting module is located above the rotating bearing module. The multi-faceted detection chip picking device according to claim 8 , wherein the second visual positioning detecting module captures a positive top image of the die for detecting. The die picking device with multi-face detecting capability as described in claim 7 further has a flipping module, the flipping module being located between the relay module and the supply unit, or the flipping die The group is located between the transfer module and the receiving module. The multi-faceted detection chip picking device according to claim 1, wherein the side detecting module has a plurality of photographing units, and each of the photographing units is opposite to each of the pick-and-place units. The multi-sided detection capability of the die picking device of claim 1, wherein the rotating unit has a driving gear, and each of the pick-and-place units has a driven gear that meshes with the driving gear, or Each of the pick and place units has a rotation unit. A chip picking method with multi-face detection capability, the method comprises: capturing a plurality of side images of a die, the die moving to a side detection module, wherein the side detection module extracts the die Each side image; and placing the die in a receiving module. A method for picking up a multi-faceted detection die according to claim 13 is the step of extracting a bottom side image of a die, and moving a die to a top of a bottom visual inspection module, the bottom vision The detection module captures the bottom side image of the die. A wafer pick with multi-faceted detection capability as described in claim 14 The method of picking up the die sucked by one of the first pick-and-place module to the top of the bottom visual inspection module by a rotating module, so that the bottom visual inspection module captures The bottom image of the die. The method for picking up a multi-faceted detecting die according to claim 15 , wherein the pick-and-place unit is rotated by a set angle, so that the plurality of photographing units of the side detecting module capture the die Multiple side images. The method of claim 1 , wherein the plurality of photographic units simultaneously or individually capture a plurality of side images of the dies. The method of claim 1 , wherein the die is provided by a supply module, and the second pick-and-place unit picks up the die located in the supply module. The method of claim 2, wherein the second pick-and-place module places the die in a transfer module, wherein the transfer module adjusts the crystal The first pick-and-place module sucks the die located in the transfer module; or the second pick-and-place module transfers the die to a flip module, the flip module Turning the die to a set angle, and placing the die on the transfer module, the transfer module adjusts an angle or a position of the die, and the first pick-and-place module is sucked at the turn-in The die of the module; or the second pick-and-place module is to place the die in a transfer module, the transfer module adjusts the angle or position of the die, and the flip module is located in the die The die of the module is transferred and the die is flipped by a set angle, and the first pick-and-place module sucks the die located in the flip module. The method for picking up a multi-faceted inspection chip according to claim 19, further comprising the step of: capturing a positive top image of the die located in the transfer module by a second visual positioning detection module Or a third visual positioning detection module captures a positive top image of the die located in the supply module.