TWM544504U - Appearance inspection device for integrated circuit - Google Patents

Description

Appearance detecting device for integrated circuit

This creation is related to the detection device, and particularly refers to an appearance detection device of an integrated circuit.

With the development of silicon wafer size, the current silicon wafer size has grown from the past 6 wafers to the current 12-inch wafers, and larger wafer sizes may be developed in the future. After the wafer is processed by various processes, a square die (Die) having a side length of about 5 mm (mm) is formed on the wafer.

Each die has millions of transistors (CMOS) which are then cut by mechanical or laser cutting to obtain a plurality of identical chips. The wafer is then packaged to form an integrated circuit (IC).

The packaging material not only can achieve the waterproof and dustproof effect of the wafer, but also protect the wafer to avoid damage to the wafer. The outer casing of the wafer is made of plastic material, ceramic material, metal material, etc., and the materials are different for the purpose. As is well known, it will not be described here. However, the same is true, since the wafer is covered by the outer casing material, the volume of the integrated circuit is obviously larger than the volume of the wafer.

The integrated circuit is usually subjected to visual inspection before and after leaving the factory to ensure the integrity of the integrated circuit. At present, there are two ways to detect the appearance, as shown in Figures 1 and 2, respectively. Figure 1 is a first conventional detecting device 70, which uses three image sensors 71, 73 to capture the suction by the nozzle 75. The appearance of the integrated circuit 50, the three image sensors 71, 73 respectively capture the bottom surface and the opposite sides of the integrated circuit 50, wherein the images of the opposite sides are two image sensors that are taken obliquely 71, but since the height of the side of the integrated circuit 50 is higher than the height of the side of the wafer, the imaging by the two image sensors 71 obliquely photographed is likely to cause an error.

Fig. 2 is a second conventional detecting device 90 which utilizes only one integrated circuit 50 at a time so that there is sufficient space around the integrated circuit 50 sucked by the suction nozzle 95 to configure three The image sensors 91 and 93 are vertically imaged by the image sensors 91 on the opposite sides of the integrated circuit 50. Therefore, the imaging is more accurate than oblique imaging.

The second conventional detecting device, for example, the patent application No. 104101116 discloses a die picking device having a multi-face detecting capability and a method thereof, wherein the rotating module drives the pick and place module to rotate, so that the pick and place module The extracted crystal grains rotate with the edge detection module to capture a plurality of side images of the crystal grains. However, in this way, the pick-and-place module draws only one die at a time, and therefore, it takes a lot of detection time.

In view of the above-mentioned deficiencies, the object of the present invention is to provide an appearance detecting device capable of simultaneously picking up and transporting a plurality of integrated circuits and simultaneously detecting the appearance of a plurality of integrated circuits.

In order to achieve the above object, the appearance detecting device of the present invention is for detecting a plurality of integrated circuits of a tray, and comprises a linear moving system, a take-up and rotating device, and a photographing system. The take-up and rotation system is connected to the linear movement system and sucks at least two integrated circuits on the tray. Among them, the linear movement system drives the take-up and rotation system to make a linear movement, and the collected integrated circuits are horizontally rotated according to the linear movement of the take-up and rotation system. The shooting system takes a picture of the appearance of the integrated circuit.

In this way, the appearance detecting device of the present invention utilizes at least two integrated circuits at the same time, and then linearly transports and horizontally rotates the integrated circuit, so that the appearance detecting device can vertically and substantially vertically capture the appearance image of the integrated circuit to achieve rapid detection and Take accurate images.

The detailed construction, features, assembly or use of the appearance detecting device of the integrated circuit provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those of ordinary skill in the art should understand that the detailed description and specific embodiments of the present invention are merely used to illustrate the present invention and are not intended to limit the scope of the patent application.

10, 30‧‧‧ Appearance testing device

11‧‧‧Linear mobile system

13, 33‧‧‧Receiving and rotating system

131‧‧‧ driven gear set

133, 337‧‧ ‧ nozzle

135‧‧‧ Straight rack

15‧‧‧Photography system

151, 153, 351, 353‧‧ ‧ image sensor

331‧‧‧Motor

333‧‧‧Drive gear set

335‧‧‧ driven gear set

40‧‧‧Tray

50‧‧‧Integrated circuit

Figures 1 and 2 are schematic views of a conventional appearance detecting device.

Figure 3 is a schematic view of the tray of the integrated circuit.

Fig. 4 is a schematic view showing the appearance detecting device of the first embodiment of the present invention.

Fig. 5 is a front side view of the appearance detecting device in Fig. 4.

Fig. 6 is a schematic view showing the appearance detecting device of the second embodiment of the present invention.

Fig. 7 is a plan view showing the appearance detecting device of the second embodiment of the present invention.

Hereinafter, the components of the appearance detecting device of the integrated circuit of the present invention and the achievement of the effect will be described with reference to the preferred embodiments of the drawings. However, the components, dimensions, and appearance of the appearance detecting device of the integrated circuit in each drawing are only used to illustrate the technical features of the present invention, and are not intended to limit the present creation.

As shown in Fig. 3, the figure is a schematic view of a tray. A tray 40 is used to carry a plurality of integrated circuits (ICs) 50. Generally, the integrated circuits 50 are matrix-arranged on the tray 40 and spaced apart from each other by about 3-15 mm (mm). Tray 40 generally refers to a variety of appliances for carrying integrated circuits. The appearance of tray 40 is generally rectangular, such as square or rectangular.

As shown in Figs. 4 and 5, Fig. 4 is a schematic view showing a first embodiment of the appearance detecting device of the present invention, and Fig. 5 is a front side view of Fig. 4. The appearance detecting device 10 of the first embodiment of the present invention includes a linear movement system 11, a take-up and rotation system 13, and a photographing system 15. The take-up and rotation system 13 is coupled to the direct-moving system 11 and synchronously draws three integrated circuits 50 on the tray (as shown in Figure 3). Since the spacing between adjacent two integrated circuits 50 on the tray is small, and this space is insufficient to configure the image sensor, the conventional synchronous detection of multiple integrated circuits is performed by oblique imaging, or only at a time. Draw an integrated circuit for testing.

The linear movement system 11 drives the take-up and rotation system 13 to move linearly, and the collected integrated circuits 50 are horizontally rotated as the take-up and rotation system 13 linearly moves.

Among other things, the linear motion system 11 can be a linear slide, a ball screw or various components that provide linear movement to provide linear reciprocating movement of the take-up and rotation system 13. In the case of a linear slide rail, the take-up and rotation system 13 can be coupled to the slider of the linear slide rail. In the case of a ball screw, the take-up and rotation system 13 can be coupled to the nut of the ball screw.

In this embodiment, the take-up and rotation system 13 includes a plurality of driven gear sets 131. A plurality of nozzles 133 and a continuous rack 135. The driven gear sets 131 are connected to the linear motion system 11. The suction nozzles 133 are connected to the driven gear sets 131 one-to-one, and suck the integrated circuits 50 and rotate horizontally with the driven gear set 131. The driven gear sets 131 mesh with the straight racks 135.

The photographing system 15 captures the appearance images of the integrated circuits 50 and includes a plurality of image sensors 151 and 153. The image sensors 151 and 153 are arranged along the moving circuit 50 along the moving path, and the side and bottom images of the integrated circuits 50 are vertically captured.

In this embodiment, the image sensors 151 that vertically capture the side images of the integrated circuits 50 are located on the same side, and the image sensors 153 that vertically capture the bottom images of the integrated circuits 50 are located at the same position. Bottom surface. The pitch of the nozzles 133 is the same as the pitch of the integrated circuits 50 of the trays so as to simultaneously pick up the plurality of integrated circuits 50.

Thus, when the suction nozzle 133 of the take-up and rotation system 13 draws three integrated circuits 50 from the tray, since the driven gear set 131 meshes with the straight rack 135, the linear movement system 11 drives the take-up and The rotating system 13 reciprocates linearly (in the direction indicated by the arrow in the figure), and at the same time, drives the driven gear set 131 to rotate horizontally, that is, when the take-up and rotating system 13 moves linearly, the three suction nozzles 133 and the integrated circuit that is sucked The horizontal rotation is 50 so that the image sensors 151, 153 of the photographing system 15 can vertically capture the side and bottom images of the integrated circuits 50.

As shown in FIGS. 6 and 7, FIG. 6 is a schematic view of the appearance detecting device of the second embodiment of the present creation, and FIG. 7 is a plan view of the second embodiment of the present creation, in which only part of FIG. 6 is illustrated Image sensor, Figure 7 shows the number and configuration of the complete image sensor, but the number of image sensors is not limited to the one shown in the figure.

The main difference between the second embodiment and the first embodiment is the reclaiming and rotating system 33 of the appearance detecting device 30. The reclaiming and rotating system 33 of the second embodiment has no straight rack, and the driven wheel set is driven by the motor. Drive the drive gear set. The reclaimed and rotating system 33 of the present invention includes a motor 331, a drive gear set 333, a plurality of driven gear sets 335, and a plurality of suction nozzles 337. The motor 331 is coupled to the linear motion system 31 and drives the driving gear set 333 to rotate. The driven gear sets 335 are respectively connected to the linear movement system 31, and the phases The adjacent driven gear sets 335 are in mesh with each other. The suction nozzles 337 are connected to the driven gear sets 335 one by one, and the integrated circuits 50 are sucked. The drive gear set 333 is engaged with one of the driven gear sets 335.

In this embodiment, the linear motion system 31 can transport the take-up and rotation system 33 to the tray to draw the corresponding integrated circuit 50, and deliver the take-up and rotation system 33 to the image sensors 351, 353 for detection. The reclaiming and rotating system 33 drives the driving gear set 333 to rotate horizontally by the motor 331 and drives the driven gear sets 335 by the driving gear set 333 to rotate the sucked integrated circuit 50.

In this embodiment, the image sensors 351 that vertically capture the side images of the integrated circuits 50 are located on opposite sides of the integrated circuit 50 to capture a side image of the integrated circuit. The image sensor 353 that vertically captures the image of the bottom surface of the integrated circuit 50 is positioned on the bottom surface.

In this way, the image sensor of the photographing system is disposed along the moving path along the integrated circuit, and vertically images the side and bottom surfaces of the integrated circuit. The configuration of the image sensor may be installed in other positions that can be vertically photographed with the integrated circuit, in addition to the positions described in the above two embodiments. Therefore, the configuration of the image sensor is not described in the present application. limit.

Since the appearance detecting device of the present invention can simultaneously suck at least two integrated circuits and quickly detect the collected integrated circuit, the present invention can provide faster detection than the conventional one by taking only one object to be tested at a time. Furthermore, the appearance detecting device of the present invention captures images perpendicular or substantially perpendicular to the object to be tested, and therefore, the present invention provides a more accurate image than the prior art oblique shooting.

Finally, it is emphasized that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The substitution or variation of other equivalent elements should also be the scope of the patent application of the present application. Covered.

10‧‧‧ Appearance detection device

11‧‧‧Linear mobile system

13‧‧‧Receiving and rotating system

131‧‧‧ driven gear set

133‧‧ ‧ nozzle

135‧‧‧ Straight rack

15‧‧‧Photography system

151, 153‧ ‧ image sensor

50‧‧‧Integrated circuit

Claims (5)

An appearance detecting device for detecting a plurality of integrated circuits of a tray, comprising: a linear moving system; a take-up and rotating system, connecting the linear moving system, and sucking at least two integrated circuits on the tray, Wherein, the linear movement system drives the reclaiming and rotating system to move linearly, and the collected integrated circuits generate horizontal rotation as the reclaiming and rotating system linearly moves; and a photographing system captures the appearance of the integrated circuits image. The appearance detecting device according to claim 1, wherein the reclaiming and rotating system comprises a plurality of driven gear sets, a plurality of suction nozzles, and a continuous rack, wherein the driven gear sets are respectively connected to the linear movement In the system, the nozzles are connected to the driven gear sets one-to-one, and the integrated circuits are sucked, and the driven gear sets mesh with the straight racks. The appearance detecting device according to claim 1, wherein the reclaiming and rotating system comprises a motor, a driving gear set, a plurality of driven gear sets and a plurality of suction nozzles, the motor connecting the linear movement system, And driving the driving gear set to rotate, the driven gear sets are respectively connected to the linear moving system, and the adjacent driven gear sets are meshed with each other, and the suction nozzles are connected to the driven gear sets one-to-one, and sucked In the integrated circuit, the driving gear set meshes with one of the driven gear sets. The appearance detecting device according to claim 2, wherein the pitch of the nozzles is the same as the pitch of the integrated circuits of the tray. The appearance detecting device of claim 1, wherein the reclaiming and rotating system absorbs top surfaces of the integrated circuits, the photographing system includes a plurality of image sensors, and the image sensors are along The integrated circuits are arranged by the moving path, and the side and bottom images of the integrated circuits are vertically captured.