TW201623499A - 提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法 - Google Patents

提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法 Download PDF

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Publication number
TW201623499A
TW201623499A TW104128051A TW104128051A TW201623499A TW 201623499 A TW201623499 A TW 201623499A TW 104128051 A TW104128051 A TW 104128051A TW 104128051 A TW104128051 A TW 104128051A TW 201623499 A TW201623499 A TW 201623499A
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Taiwan
Prior art keywords
laminator
strip
slit
plasma
strip material
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TW104128051A
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English (en)
Inventor
Arne Koops
Thomas Schubert
Klaus Keite-Telgenbuescher
Marco Kupsky
Stephan Zoellner
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Tesa Se
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Publication of TW201623499A publication Critical patent/TW201623499A/zh

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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

本發明係關於一種提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法，其中將該第一帶狀材料與該第二帶狀材料連續並以相同前進方向地輸送進積層機狹縫，於該積層機狹縫將該第一帶狀材料與該第二帶狀材料分別以其第一表面積層在一起，以電漿處理該第一帶狀材料與該第二帶狀材料之兩個第一表面之整個面的方式，使該電漿從在該積層機狹縫前開始連續對兩個第一表面作用直到進入該積層機狹縫，該積層機狹縫係由一加壓滾輪與一承壓滾輪形成，且至少一個滾輪表面或是兩個滾輪表面配備有介電質，該電漿或電暈係產生自一噴嘴，其中該第一帶狀材料具有一黏著劑層，該黏著劑層係以形成第一帶狀材料之第一表面之方式設置於該第一帶狀材料。

Description

提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法
本發明係關於一種提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法。
於工業生產領域需要用來提升黏附體的黏著性質之簡單的預處理技術。
●典型上使用昂貴的加工，如濕式化學清潔與在黏附體表面塗布底漆，以便與自黏性膠帶達成高強度黏著。
●現今較佳特別會使用在大氣壓下的簡單物理預處理技術(電暈、電漿、火焰)來用於黏附體的表面處理，以便與自黏性膠帶達到更高的錨固力。
為了改善黏附體表面與壓敏性膠帶的附著性質，可進行表面預處理。此預處理能夠例如增強黏附組件的分子間力。預處理還有不同的可能性，包括藉由塗布底漆之化學預處理或藉由電漿處理或電暈處理之物理預處理。
G.Habenicht的著作「Kleben-Grundlagen,Technologien,Anwendungen」2009，Springer出版社，柏林/海德堡，中簡要介紹了表面處理。
黏著結合的強度或表面對壓敏性膠帶之黏結能藉由化學鍵結來強化。此化學鍵結的基礎為矽有機化合物(矽烷)。其除了能夠提高強度外，對於潮濕環境還能有改善的老化行為。為此，會在使用壓敏性膠帶前將化學底漆施加於表面上。此時重要的是部分單分子底漆層要盡可能的薄，因為矽烷分子間的分子間力是弱的。雙官能助黏劑在接下來與黏附體表面(聚縮合反應)及壓敏性膠帶的黏著劑分子(聚加成反應或聚合反應)反應。
反應機構示意繪於附圖中(參見第13圖)。
電漿被稱為是物質的第四態。其係部分或完全離子化之氣體。藉由輸入能量產生正離子與負離子、電子、其他激發態、自由基、電磁輻射與化學反應產物。這些物種中許多能導致欲處理之表面改變。總括而言，這些處理會促使黏附體表面活化，具體上會導致較高的反應性。
此處理不僅能用於黏附體表面，也能用於黏著劑。兩種處理的組合也是可能的。此種處理也可以使用來提高第一帶狀材料(例如黏著劑)之第一表面與第二帶狀材料(例如載體材料)之第一表面之間的黏著力。
電暈處理，也稱為電暈放電，係以高壓放電的形式藉由直接接觸黏附體表面來進行。藉由放電，環境空氣之氮氣轉變為反應形式。在黏附體表面上由於電子碰撞的衝擊而產生了分子分裂。由此產生的自由價能使電暈放電的反應產物堆積。此堆積能使黏附體表面的附著性質提升。
此處理(相當於電漿)能使用在黏附體表面、壓敏性膠帶的黏著劑與組合兩個表面上。
若要將二層以上的層彼此積層，典型上會在積層前對其中之一者或兩者之界面作物理預處理。
已知藉由電暈與電漿的預處理在邊界層的活化上具有有限的使用期限，因此會在接近或大多是在積層加工當前進行處理。
電漿預處理與電暈預處理例如在DE 2005 027 391 A1與DE 103 47 025 A1中已有記述或提及。
DE 10 2007 063 021 A1中敘述藉由絲狀電暈處理來活化黏著劑。其中揭示，前述電漿/電暈預處理對於黏著的抗剪時間與流動行為有正面效果。其中未提到該方法有能發揮提高黏著力的效果。
如DE 10 2007 063 021 A1，DE 10 2011 075 470 A1中敘述黏著劑與載體/基材之物理預處理。該預處理係在接合步驟前分開進行，並能設計為相同方式與不同方式。藉由雙面預處理，達到比起僅在基材側預處理更高的黏著力與錨固力。
於DE 24 60 432 A欲藉由引入塑性塑料膜(其供作為助黏劑)來將二個帶材接合為積層體。電漿係生成於兩個積層機滾輪間，該等滾輪係接地並形成同時具有助黏劑用之缺口的高電壓電極。流動於滾輪周圍的空氣應受電漿影響，成為使助黏劑不會太早冷卻，且在積層體中沒有氣室的形式。
DE 27 54 425 A中參照DE 24 60 432 A。其為相同的課題提出了新的設置。其中依據第1圖，電漿係形成於二個積層滾輪間，該等滾輪之一覆蓋著介電質。其也如DE 24 60 432 A，僅敘述藉由熱塑性塑料熔體來積層平坦的薄膜帶材。
DE 198 46 814 A1中敘述不同的設置，該設置係為了改善帶材在積層在一起前的電暈處理之課題。其僅有大致提到帶材，且薄膜一詞僅在與DE 198 02 662 A1相連時提到。其未提及黏著劑。
這裡的電漿依據請求項2也是在二個積層滾輪間產生。介電質係由至少一個旋轉帶所構成。
DE 41 27 723 A1敘述塑料膜帶材與塑料片材的多層積層體之製造，其中在接合步驟當前以氣溶膠處理至少一個接合側。依據第1圖，此液壓驅動電暈也可直接朝向積層機狹縫。作為氣溶膠，其考慮單體、分散液、膠體系統、乳液或溶液。
現行技術的特徵為預處理係大多針對載體材料或黏附體，以對黏著劑或自黏性膠帶建立更高的錨固力。
雖然藉由對應的電漿處理/電暈處理，相對於未處理的接合組件，能明顯使錨固力上升，但在許多不會發生內聚破壞之系統，會遇到以現今的電暈系統與電漿系統無法克服之限制。
如本發明上下文中所述，這件事係基於黏著劑的特性與其和基材的相互作用。這裡的交互影響大多是透過電荷或官能基來作用。此官能基係藉由電漿預處理在表面上生成，且在其種類上為各式各樣的。其實質上係緊接著在電漿與表面接觸結束後，藉由與空氣中的氧氣反應而生成。這些基的控制可部分進行並可藉由所使用的加工氣體與加工模式在窄範圍內進行。若在接合組件間可生成共價鍵，相應地顯著升高是唯一可能。
由此產生了議題：是否能藉由適當的程序產生此共價鍵，而沒有先前的自由基在處理的表面上與氣體成分反應的情形。
本發明之課題為：在壓敏性黏著劑與載體材料之物理表面修飾時追尋所述正面效果，以達到高強度鍵結。課題的核心為實現壓敏黏著性層與載體材料間的高錨固力。
此課題係藉由一種如申請專利範圍獨立項所述之方法得解。其中附屬項之客體為本發明客體之較佳改良方案。
11‧‧‧加壓滾輪
12‧‧‧承壓滾輪
21‧‧‧第一帶狀材料
22‧‧‧第二帶狀材料
23‧‧‧積層體
31‧‧‧電漿
32‧‧‧電壓
33‧‧‧線型噴嘴(第2圖)
33‧‧‧線型電極(第3、4圖)
33‧‧‧可流通加工氣體之噴嘴(第5圖)
111‧‧‧介電質
121‧‧‧介電質
第1圖中顯示非本發明之方法的範例。
第2圖為本發明之方法一較佳實施形態。
第3圖為本發明之方法一較佳實施形態。
第4圖為本發明之方法一較佳實施形態。
第5圖為本發明之方法一較佳實施形態。
第6圖中顯示鐘擺式噴嘴的範例。
第7圖中顯示各式噴嘴。
第8圖中顯示二種旋轉式噴嘴。
第9圖中顯示電漿淋幕。
第10圖中顯示Tantec公司之SpotTEC電漿淋幕。
第11圖中顯示Tigres公司提供之噴嘴。
第12圖中顯示Tantec公司使用電暈-弓形電極之噴嘴。
第13圖中顯示助黏劑與黏附體表面及壓敏性膠帶的黏著劑分子反應之反應機構的示意圖。
因此，本發明係關於一種提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法，其中●將該第一帶狀材料與該第二帶狀材料連續並以相同前進方向地輸送至一積層機狹縫，於該積層機狹縫將該第一帶狀材料與該第二帶狀材料分別以其第一表面積層在一起，●以電漿處理該第一帶狀材料與該第二帶狀材料之兩個第一表面之整個面的方式，使該電漿從在該積層機狹縫前開始連續對兩個第一表面作用直到進入該積層機狹縫，●該積層機狹縫係由一加壓滾輪與一承壓滾輪形成，其產生一背壓， ●至少一個滾輪的側面或是兩個滾輪的側面上配備有介電質，●該電漿或電暈係產生自噴嘴。
該第一帶狀材料具有一黏著劑層，該黏著劑層以形成第一帶狀材料之第一表面之方式設置於該第一帶狀材料。
特佳為該電漿或電暈係延伸至將兩個帶狀材料積層在一起的線上。
若在下文中提到電漿處理，也是指電漿處理，反之亦然。
電漿與電暈與處理的原理上係基於：使氣流(空氣、氣體、氣體混合物)流經放電處，再使放電本身或只有經活化的氣流被帶到處理處。因此兩個表面之活化係同時藉由積層來進行。因此產生的化學基能在產生後立即於複合體中產生錨固，而沒有因為短時間在空氣中存放影響發生表面分解或變化。
此外，預處理不需要兩個處理單元。
預處理設備的製造者提供適合的能處理積層機狹縫之電暈與噴嘴幾何結構，但原則上僅用於一特定界面(縫隙、平面、立體的)。
Plasmatreat公司的合適的噴嘴幾何結構之範例包括孔式噴嘴、狹縫式噴嘴、旋轉式噴嘴。
於第7圖中可看到下列噴嘴：
1 孔式噴嘴：點狀電漿，具合適的處理寬度流，但處理集中
2 環狀排放式噴嘴：固定的環狀電漿流
3 旋轉式噴嘴：旋轉式點狀電漿流，具寬處理寬度(亦參見WO 01/43512 A1)
4 旋轉式噴嘴：旋轉式點狀電漿流，具較窄的處理寬度，取決於旋轉噴嘴中同心設置的排放孔的排放角度。
5 狹縫式噴嘴：排放孔為狹縫狀，並可具有各種幅寬。
旋轉噴嘴的排放角度會影響到處理寬度。
第8圖中顯示二種旋轉式噴嘴，其對於同心設置的孔式噴嘴具有不同的排放角度。因此噴嘴能適用在特定積層角度(縫隙、平面)。
此外鐘擺式噴嘴也為已知且合適的。
於此種噴嘴類型，噴嘴體藉由高頻率的鐘擺移動來偏轉。藉此能實現更高的處理寬度。藉由鐘擺移動，能在膠帶與基材的合併點處理兩個界面。鐘擺式噴嘴的範例可在DE 20 2008 013 560 U1找到，並示於第6圖中。
已知且合適的還有其他噴嘴類型，例如電漿淋幕(參見第9圖)。
此為線型噴嘴或孔式噴嘴的多重設置，藉由電漿簾幕的電流幾何帶至處理面上。其能以湍流或層流來施加，藉此集中預處理積層機狹縫。
Tantec公司的SpotTEC看起來如下(參見第10圖)。
集中的原理為：兩個弓形電極之間的絲狀放電透過壓縮空氣或其他氣體/氣體混合物吹送方向帶至基材。透過氣體適當的流動，確保預處理深入預處理轄縫中。
最後，大多數的預處理系統皆適用於積層機狹縫。若預處理元件設置有多個單元，則處理寬積層機狹縫為可能的。
Tigres公司為此提供了解答，其對於較大的處理寬度使用兩個孔式噴嘴(參見第11圖)，或是於Tantec公司(參見第12圖)係使用電暈-弓形電極。
第一與第二帶狀材料較佳以相同的前進方向移動至積層機狹縫。
因為電漿較佳為生成直到積層機狹縫，第一帶狀材料與第二帶狀材料分別以其第一表面於電漿中被積層在一起。
依據本發明第一較佳實施形態，第一帶狀材料及/或第二帶狀材料的以電漿處理過的表面上之任意點，移動經過從開始電漿處理至進入積層機狹縫的路徑之時間跨度係小於2.0s，較佳為小於1.0s，更佳為小於0.5s。也就是說，小於0.5s，較佳小於0.3s，更佳小於0.1s之時間在本發明都是可行的。
依據本發明一實施例，係將一第三帶狀材料輸送進積層機狹縫，其方式係使第二帶狀材料位在第一與第三帶狀材料之間。
第三帶狀材料的前進方向係和第一與第二帶狀材料的前進方向相同。
於本發明另一實施例，除了第一與第二帶狀材料以外還將多種其他帶狀材料輸送至該積層機狹縫，其中輸送係如下進行：使該各種帶狀材料在第一與第二帶狀材料之間進入積層機狹縫。該各種其他帶狀材料的選擇，係使一非黏性載體層與第二非黏性載體層絕不會在積層機狹縫被直接重疊積層在一起。
積層機狹縫係由一加壓滾輪與一承壓滾輪所構成，該等滾輪產生積層所期望之背壓。較佳為滾輪係相反地運轉，更佳係以相同的圓周速度運轉。
於積層機狹縫，滾輪的圓周速度與旋轉方向係與第一和第二帶狀材料的前進速度與前進方向相同。任選存在的其他帶材更佳也具有相同的前進速度與前進方向。
該等滾輪較佳具有相同直徑，更佳為直徑介於50至500mm。較佳為滾輪的側面為光滑的，即特別為打磨過的。
滾輪表面較佳的Ra係小於50μm，較佳為小於10μm。「Ra」為用於表示表面光潔度的品質之工業標準單位，並表示粗度的平均高度，特別是離評估範圍內的粗度輪廓之中心線的平均絕對距離。
未覆蓋介電質之滾輪的滾輪表面可由鋼、不銹鋼或鍍鉻鋼構成。該表面也可鍍鎳或鍍金。其應該僅導電，並在電漿作用下仍然保留。該表面在電漿作用下應表現出沒有腐蝕。
更進一步能以油、水、蒸氣、電或其他溫度介質於-40℃至200℃之較佳範圍來冷卻或加熱一個或兩個滾輪。較佳為兩個滾輪都未加熱。
覆蓋一個或兩個滾輪的整個側面(也簡稱為表面)，也就是跨滾輪整個圓周之介電質層，較佳為選擇：陶瓷、玻璃、塑膠、橡膠(如苯乙烯-丁二烯橡膠、氯丁二烯橡膠、丁二烯橡膠(BR)、丙烯腈-丁二烯橡膠(NBR)、丁基橡膠(IIR)、乙烯-丙烯-二烯橡膠(EPDM)與聚異戊二烯橡膠(IR))或聚矽氧。
介電質緊緊包住滾輪，但可拆卸，例如以兩個半殼的形式。
滾輪上介電質層的厚度較佳介於1至5mm。
本發明設計的介電質不是僅一段一段的覆蓋滾輪的側面之旋轉帶(或是二個旋轉帶，僅一段一段的覆蓋兩個滾輪的側面)。
依據一較佳實施例，構成積層機狹縫的滾輪對中僅有一個滾輪覆蓋了介電質。
依據一較佳實施例，構成積層機狹縫的滾輪對的兩個滾輪都覆蓋了介電質。
電漿較佳係在一個以上噴嘴與滾輪間產生，較佳為以壓縮空氣或N2作業產生。
電漿處理係在接近大氣壓力(+/-0.05bar)或在大氣壓力下進行。
電漿處理可在各種大氣中進行，其中大氣也包括空氣。處理大氣可為各種氣體之混合物，自包括N2、O2、 H2、CO2、Ar、He、氨、合成氣體、O2及H2的氣體混合物等所選出，其中可額外混入水蒸氣或其他組成成分。此例示性清單不用來作任何限縮。
依據本發明一較佳實施形態，處理大氣係由下列純氣體或加工氣體的混合物所構成：N2、壓縮空氣O2、H2、CO2、Ar、He、氨、乙烯、矽氧烷、丙烯酸及/或溶劑，其中可額外添加水蒸氣或其他揮發性組成成分。較佳為N2與壓縮空氣。
大氣壓電漿能由加工氣體所構成之混合物生成，其中該混合物較佳包含至少90體積%的氮氣與至少一種惰氣(較佳為氬氣)。
依據本發明一較佳實施形態，該混合物係由氮氣與至少一種惰氣所構成，更佳為該混合物係由氮氣與氬氣所構成。
基本上大氣中也能以氣體(例如乙烯)或液體(霧化為氣溶膠)來混入積層組成成分或聚合組成成分。可使用的氣溶膠幾乎沒有限制。間接加工的電漿技術特別適合使用氣溶膠，因為此時沒有汙染電極的威脅。
但其比例不應超過5體積%。
為了將絲或自放電分離出的活化電漿(餘暉)帶至積層機狹縫，常用的氣體流量為10至500l/min。
只要電漿連續作用直到進入積層機狹縫，基本上所有上述噴嘴類型都適合用來產生電漿並對帶狀材料作用。
電漿處理的可行實施例之一者係使用固定電漿噴流。
一同樣可行的電漿處理係使用多噴嘴(在需要時偏移)之設置，於充分的寬度下用於無縫、部分重疊之處理。此處可使用旋轉或不旋轉之圓管噴嘴。
具氣體排放口之線型電極為特別合適的，其較佳延伸於積層機狹縫的整個長度。
更佳為其在積層機狹縫的整個長度上對積層機狹縫具有固定的距離。
依據本發明另一較佳實施形態，電漿產生器至積層機狹縫的處理距離為1至100mm，較佳為3至50mm，特佳為4至20mm。
更佳為電漿產生器垂直於一平面(該平面另外又垂直於跨滾輪輪軸之平面)，並可在高度上移動，較佳為可同時在高度及離積層機狹縫的距離上移動。
更佳為帶材輸送進積層機狹縫之速度係介於0.5至200m/min，較佳介於1至50m/min，特佳介於2至20m/min(均包括所給之範圍的邊界值)。
依據本發明一較佳實施形態，第一、第二、第三或其他帶材的前進速度全都是相同的。
第一帶狀材料具有一黏著劑層，該黏著劑層係以形成第一帶狀材料之第一表面之方式設置於該第一帶狀材料。
第一帶狀材料可為雙面膠帶，由一第一黏著劑層、一載體材料與一第二黏著劑層(其視需要也以所謂的裱紙加以覆蓋來保護)構成。
裱紙(離型紙、離型膜)不是膠帶或標籤的組件，而僅是用於其製造、堆疊或藉由沖壓之進一步加工的輔具。此外相對於膠帶載體，裱紙並不與黏著劑層緊密連結。
較佳為第一帶狀材料係「轉移膠帶」，即無載體的膠帶。單層雙面自黏性膠帶，所謂的轉移膠帶，係由不含載體的形成單一層之壓敏性黏著層所構成，並僅以合適的離型材料來覆蓋，例如矽氧化之離型紙或離型膜。
特佳為第一帶狀材料係包含壓敏性黏著劑，或係由壓敏性黏著劑所構成，壓敏性黏著劑係一種黏著劑，其在相對低的觸壓力下就已經能與幾乎所有的黏附基底持久連結，並在使用後能實質上無殘膠地從黏附基底上再被移除。壓敏性黏著劑於室溫發揮永久性的壓敏黏著性，具有足夠低的黏度與高觸黏性，使其在低觸壓力下就已經濕潤各黏著基底的表面。黏著劑的黏著性取決於其附著性質，而再分離性則取決於其內聚性質。
壓敏性黏著劑層較佳基於天然橡膠、合成橡膠或聚胺基甲酸酯，其中壓敏性黏著劑層較佳係由純丙烯酸酯所構成或是大部份由丙烯酸酯所構成。
壓敏性黏著劑為了提升黏著性質能混入增黏劑。
作為增黏劑(也稱為增黏樹脂)，原則上所有已知的增黏劑種類都適合。增黏劑例如有：烴樹脂(例如基於不飽和C5單體或C9單體之聚合物)、萜烯苯酚樹脂、基於 例如α-蒎烯或β-蒎烯等原料之聚萜烯樹脂、如苯并呋喃-茚樹脂之芳族樹脂、或基於苯乙烯或α-甲基苯乙烯之樹脂如松香與其衍生物(例如歧化、二聚化、酯化松香，例如與乙二醇、丙三醇或新戊四醇之反應產物)以上僅列舉出一些。較佳為沒有易氧化雙鍵的樹脂，如萜烯苯酚樹脂、芳族樹脂，特佳為樹脂係藉由氫化製造之樹脂，例如氫化芳族樹脂、氫化聚環戊二烯樹脂、氫化松香衍生物或氫化聚萜烯樹脂。
較佳為樹脂係基於萜烯苯酚與松香酯。同樣較佳為增黏樹脂所具有的軟化點高於80℃(依據ASTM E28-99(2009))。特佳為樹脂係基於萜烯苯酚與松香酯且所具有的軟化點高於90℃(依據ASTM E28-99(2009))。典型上的使用量，基於黏著劑的聚合物，係10至100重量份。
要進一步改善纜線相容性，黏著劑配方可選擇性的混入耐光劑或一級及/或二級抗氧化劑。
要改善加工性質，黏著劑配方可進一步混入常見的加工助劑如消泡劑、除氣劑、交聯劑或調平劑。合適的濃度，基於固體，係在0.1至5重量份之範圍。
更佳為第二帶狀材料係載體材料。
作為載體材料目前較佳使用聚合物膜或薄膜複合體。此種薄膜/薄膜複合體可由所有常見使用於薄膜製造之塑料構成，例如但不限於：聚乙烯、聚丙烯(特別是藉由單軸或雙軸拉伸產生之有向聚丙烯(OPP))、環烯烴共聚物(COC)、聚氯乙烯 (PVC)、聚酯(特別是聚對苯二甲酸乙二酯(PET)與聚萘二甲酸乙二酯(PEN))、乙烯乙烯醇(EVOH)、聚偏二氯乙烯(PVDC)、聚偏二氟乙烯(PVDF)、聚丙烯腈(PAN)、聚碳酸酯(PC)、聚醯胺(PA)、聚醚碸(PES)或聚醯亞胺(PI)。
只要在第一帶狀材料中有載體材料，則這些材料同樣較佳地使用作為第一帶狀材料中的載體層。
於本發明中載體材料包括特別是所有平面構造物，例如在二維上延伸之薄膜或薄膜片、具延伸長度與有限寬度之條帶。
依據本發明另一較佳變化實施例，第二帶狀材料為黏彈性的。
黏彈性聚合物層可被視為極高黏度的液體，其在壓力負荷下顯示出流動行為(也稱為「潛變」)。此種黏彈性聚合物或此種聚合物層在一定程度內，具有在緩慢的力作用下鬆弛作用於其上之力的能力。其能夠在振動及/或變形(特別是能(至少部分)可逆的變形)中將力消散掉，藉此「緩衝」作用的力，並較佳避免因作用的力而機械破壞，較佳為至少減少，或者至少延緩破壞發生的時間點。在力的作用極快之情形，黏彈性聚合物通常顯現彈性行為，即完全可逆變形之行為，其中透過聚合物的彈性變型釋放的力可能導致破壞。相對於此，彈性材料在緩慢的力作用下即顯示上述彈性行為。藉由摻合料、填料、發泡劑或類似物，此種黏彈性物質的性質還能被大幅改變。
基於黏彈性聚合物層的彈性比例(其轉而對具有此種黏彈性載體層之膠帶的黏著技術性質作出顯著貢獻)，使例如拉應力或剪應力之應力不能完全釋放。這件事係以鬆弛率來表示，鬆弛率係定義為：((應力(t=0)-應力(t)/應力(t=0))*100%。典型上黏彈性載體層顯示大於50%之鬆弛率。
特佳以膨脹微氣球來用於發泡。
微氣球係指具有熱塑性聚合物外殼之彈性空心球。這些球填入了低沸點液體或液化氣體。作為外殼材料特別可使用聚丙烯腈、PVDC、PVC或聚丙烯酸酯。作為低沸點液體，特別適合為低級烷的烴類，例如異丁烷或異戊烷，其係作為液化氣體於壓力下封入聚合物外殼中。
第二帶狀材料也可為黏著劑或含有黏著劑。
更佳為第三帶狀材料具有黏著劑層或係由黏著劑層所構成，更佳為黏著劑係壓敏性黏著劑。
作為(壓敏性)黏著劑可使用所有黏著劑，如上所述者。
依據本發明一特佳實施形態，將一三層產物積層在一起。於一丙烯酸酯系黏性或非黏性發泡載體(第二帶狀材料)兩側上，積層上壓敏性黏著劑(第一與第三帶狀材料)。
本發明不排除參與本發明之方法的部分或整個表面已經接受過第一物理預處理(視需要也是電漿處理)。
最後，本發明不排除若在第一帶狀材料的第二表面及/或第二帶狀材料的第二表面及/或第三第二材料的第二表面以及一或兩個滾輪的圓柱面之間送進一或兩個其他帶材，該帶材視需要可回收。其係供用來減少第一及/或第二及/或第三帶狀材料上的損傷。
依據較佳地實施例，電漿處理與積層係同時進行。為此電漿係於積層狹縫生成。藉由載體表面以及黏著劑表面上的電漿產生的自由基不能與空氣中的氧氣反應，並能藉此不與對應組件相互作用，因為產生與積層間的時間接近零。藉此得到先前未預期之大幅的黏著力提升，該提升無法以另外的預處理得到。
本發明之方法可透過廣範圍的壓敏性黏著劑與載體材料來達到層間的黏著力提升。
本發明之方法為健全的，且不依靠對各黏著劑之最佳化處理及/或對各載體材料之最佳化處理。
本發明所教示方法之效果為加成的，即大於載體材料或黏著劑之處理的單一效果之總和。
藉由本發明，可於膠帶中加入以下期望之特性：
○高剝離強度
○高初始黏著力
○高抗剪力
○高耐溫性
○適用於具低表面能(LSE)之載體材料
多個圖式顯示本發明之方法的較佳實施例，但無意以此對本發明做任何形式的限制。
第1圖中顯示非本發明之方法，其中不存在噴嘴。第一圖其餘部分反映出本發明之方法。其顯示一積層機狹縫，其係由一加壓滾輪11與一承壓滾輪12所形成，該等滾輪產生積層所期望之背壓。相同大小的滾輪11、12相反地並以相同的圓周速度運轉。
於加壓滾輪11上存在一層介電質111。
基於滾輪11、12間的電壓32於積層機狹縫產生電漿31。本發明上述之噴嘴不存在。
於積層機狹縫連續並以相同前進方向地送入第一帶狀材料21與第二帶狀材料22。於此狹縫第一帶狀材料21與第二帶狀材料22被分別以其第一表面積層在一起，而形成積層體23。
第一帶狀材料21為由黏著劑所構成之層，而第二帶狀材料22為載體。
以電漿31處理第一帶狀材料21與第二帶狀材料22之兩個第一表面之整個面的方式，使該電漿31從在該積層機狹縫前開始連續對兩個第一表面作用直到進入該積層機狹縫。
第2圖顯示第1圖之簡化截圖，其中滾輪11、12僅繪出四分之一。兩個滾輪表面上分別配備有介電質111、121。
電漿31係基於滾輪11、12與噴嘴33間的電壓32，從本發明上述線型噴嘴33產生。
依據本發明之方法一實施例，本發明係一種提高帶狀材料的自黏性表面及基材表面之間的黏著力之方法，於該帶狀材料上應施加有自黏性表面，其中●將帶狀材料連續輸送至一積層機狹縫，於該積層機狹縫將該帶狀材料以其自黏性表面積層於該基材表面上，●以電漿處理該帶狀材料的自黏性表面與該基材表面之整個面的方式，使該電漿從在該積層機狹縫前開始連續對兩個表面作用直到進入該積層機狹縫，●該積層機狹縫係由一觸壓元件與該基材形成，●該觸壓元件的表面係配備有介電質，及●該電漿或電暈係產生自一噴嘴。
該第一帶狀材料具有一黏著劑層，該黏著劑層係以形成直接與基底接觸並直接積層於基底上之方式設置於該第一帶狀材料。
特佳為該電漿或電暈係延伸至將帶狀材料積層於基底上的線上。
因為電漿或電暈係於積層機狹縫生成，帶狀材料較佳於電漿或電暈中積層在基底上。
依據本發明第一較佳實施形態，第一帶狀材料及/或基底的以電漿處理過的表面上之任意點，移動經過從開始電漿處理至進入積層機狹縫的路徑之時間跨度係小於2.0s，較佳為小於1.0s，更佳為小於0.5s。也就是說，小於0.5s，較佳小於0.3s，更佳小於0.1s之時間在本發明都是可行的。
依據本發明一實施例，係將一第二帶狀材料輸送進積層機狹縫，其方式係使第二帶狀材料位在(第一)帶狀材料與基底之間。
第二帶狀材料的前進方向係和(第一)帶狀材料的前進方向相同。
於本發明另一實施例，除了(第一)帶狀材料與基底以外還將多種其他帶狀材料輸送至該積層機狹縫，其中輸送係如下進行：使該各種帶狀材料在(第一)帶狀材料與基底之間進入積層機狹縫。該各種其他帶狀材料的選擇，係使一非黏性載體層與第二非黏性載體層絕不會在積層機狹縫被直接重疊積層在一起。
積層機狹縫係由一觸壓元件與該基材所構成。該觸壓元件產生積層所期望之背壓。
該觸壓元件較佳為一滾輪(更佳為具有介於50至500mm之直徑)、一刮刀或一觸壓板。
該刮刀或觸壓板可具有例如一成形為半圓柱體之積層面。
滾輪的直徑或成形為半圓柱體之積層面的直徑較佳介於50至500mm。較佳為滾輪的側面或觸壓元件大致上的表面為光滑的，即特別為打磨過的。
表面粗度較佳的Ra係小於50μm，較佳為小於10μm。「Ra」為用於表示表面光潔度的品質之工業標準單位，並表示粗度的平均高度，特別是離評估範圍內的粗度輪廓之中心線的平均絕對距離。
更進一步能以油、水、蒸氣、電或其他溫度介質於-40℃至200℃之較佳範圍來冷卻或加熱觸壓元件。較佳為觸壓元件未加熱。
觸壓元件上的介電質層的厚度較佳介於1至5mm。
本發明設計的介電質不是僅一段一段的覆蓋觸壓元件(特別是滾輪)的側面之旋轉帶。
該帶狀材料具有壓敏性黏著劑層，其係以形成直接與基底接觸並直接積層於基底上之方式設置於該帶狀材料。
該帶狀材料可為雙面膠帶，由一第一黏著劑層、一載體層與一第二黏著劑層(其視需要以所謂的裱紙覆蓋來保護)所構成。
帶狀材料的黏著塗層可施加於載體材料上。
作為載體材料，此處較佳使用上述聚合物膜或薄膜複合體。
依據本發明另一實施例，該帶狀材料為黏彈性的。
於基底上可施加黏著劑，更佳為壓敏性黏著劑。作為(壓敏性)黏著劑可使用所有如上所述之黏著劑。
依據本發明一特佳實施形態，係將一三層產物積層在一基材上，較佳為一由黏性或非黏性的丙烯酸酯系發泡載體所構成之三層產物，於其兩側施加有壓敏性黏著劑。
最後，本發明不排除若在帶狀材料的背對基材之表面以及觸壓元件的側面之間送進其他帶材，該帶材視需要可回收。其係供用來減少帶狀材料上的損傷。
第3圖中顯示一積層機狹縫，其係由一加壓滾輪11與基底12所構成，該加壓滾輪係用於產生積層所期望之背壓。於加壓滾輪11上存在一層介電質111。
基於滾輪11與線型電極33之間的電壓32，於積層機狹縫中產生電漿31。
於該積層機狹縫中將帶狀材料21(其係由黏著劑所構成之層)積層於基底12上。
帶狀材料21與基底12之兩個表面的整個面被電將處理過，且電漿31從在該積層機狹縫前開始，連續對該等表面作用，直到進入該積層機狹縫。
承壓滾輪11與線型電極33一起以連續速度在箭頭所指的方向上移動。
第4圖與第1圖不同之處，在於使用具有成形為半圓柱體之積層面的觸壓板11形式之觸壓元件來取代承壓滾輪11。
第5圖與第3圖不同之處，在於使用可流通加工氣體之噴嘴33來取代線型電極33。
11‧‧‧加壓滾輪
12‧‧‧承壓滾輪
21‧‧‧第一帶狀材料
22‧‧‧第二帶狀材料
23‧‧‧積層體
31‧‧‧電漿
32‧‧‧電壓

Claims (20)

  1. 一種提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法，其中將該第一帶狀材料與該第二帶狀材料連續並以相同前進方向地輸送至一積層機狹縫，於該積層機狹縫將該第一帶狀材料與該第二帶狀材料分別以其第一表面積層在一起，以電漿處理該第一帶狀材料與該第二帶狀材料之兩個第一表面之整個面的方式，使該電漿從在該積層機狹縫前開始，連續對兩個第一表面作用，直到進入該積層機狹縫，該積層機狹縫係由一加壓滾輪與一承壓滾輪形成，且至少一個滾輪表面或是兩個滾輪表面配備有介電質，該電漿或電暈係產生自一噴嘴，其中該第一帶狀材料具有一黏著劑層，該黏著劑層係以形成第一帶狀材料之第一表面之方式設置於該第一帶狀材料。
  2. 如請求項1之方法，其中該第一帶狀材料及/或該第二帶狀材料以電漿處理過的表面上之任意點，移動經過從開始電漿處理至進入該積層機狹縫的路徑之時間跨度係小於2.0s，較佳為小於1.0s，更佳為小於0.5s。
  3. 如請求項1或2之方法，其係將一第三帶狀材料輸送進該積層機狹縫，其方式係使該第二帶狀材料位在該第一帶狀材料與該第三帶狀材料之間。
  4. 如請求項1至3中任一項之方法，其中除了第一與第二帶狀材料以外還將多種其他帶狀材料輸送至該積層機狹縫，其中輸送係如下進行：使該各種帶狀材料在第一與第二帶狀材料之間進入積層機狹縫；而該各種其他帶狀材料的選擇，係使一非黏性載體層與第二非黏性載體層絕不會在積層機狹縫被直接重疊積層在一起。
  5. 如請求項1至4中任一項之方法，其中該滾輪具有介於50至500mm之直徑。
  6. 如請求項1至5中任一項之方法，其中作為介電質係選擇由陶瓷、玻璃、塑膠、橡膠或聚矽氧所構成之層。
  7. 如請求項1至6中任一項之方法，其中在滾輪上的介電質層的厚度係介於1至5mm。
  8. 如請求項1至7中任一項之方法，其中該電漿係在一個以上噴嘴與該等滾輪間產生，較佳為以壓縮空氣或N2作業產生。
  9. 如請求項1至8中任一項之方法，其中該電漿係藉由帶氣體排放孔之線性電極產生，較佳為該線性電極延伸跨積層機狹縫的全長，更佳為該線性電極在延伸跨積層機狹縫的全長上距離積層機狹縫有一致的距離。
  10. 如請求項1至9中任一項之方法，其中該電漿產生器至積層機狹縫的處理距離係1至100mm，較佳為3至50mm，特佳為4至20mm。
  11. 如請求項1至10中任一項之方法，其中該電漿產生器係垂直於一平面(該平面另外又垂直於跨滾輪輪軸之 平面)，並可在高度上移動，較佳為可同時在高度及離積層機狹縫的距離上移動。
  12. 如請求項1至11中任一項之方法，其中帶材輸送進積層機狹縫之速度係介於0.5至200m/min，較佳介於1至50m/min，特佳介於2至20m/min。
  13. 如請求項1至12中任一項之方法，其中該第二帶狀材料為一載體材料。
  14. 如請求項1至13中任一項之方法，其中該第三帶狀材料具有一黏著劑層，該黏著劑層係以形成第三帶狀材料的外側表面並以該外側表面與第二帶狀材料積層在一起的方式設置於第三帶狀材料。
  15. 如請求項1至14中任一項之方法，其中該第一帶狀材料為一基於天然橡膠、合成橡膠或聚胺基甲酸酯之壓敏性黏著劑層，其中較佳為該壓敏性黏著劑層係由純丙烯酸酯所構成或大部分由丙烯酸酯所構成(帶有熱交聯系統及/或熱熔膠及/或UV交聯劑及/或UV聚合劑)。
  16. 如請求項1至15中任一項之方法，其中該壓敏性黏著劑層形成一無載體、單層之雙面膠帶。
  17. 如請求項1至16中任一項之方法，其中該壓敏性黏著劑層係施加於一載體上，較佳為施加於薄膜、泡棉、絲絨及/或梭織物上，更佳為施加於黏彈性載體上。
  18. 如請求項1至17中任一項之方法，其中該壓敏性黏著劑層或以其形成的膠帶之厚度係≧20μm，較佳為≧100μm，更特佳為≧300μm，及/或最多≦2500μm，較佳為≦1500μm，更佳為≦1000μm。
  19. 一種提高帶狀材料的自黏性表面及基材表面之間的黏著力之方法，於該帶狀材料上應施加有自黏性表面，其中將帶狀材料連續輸送至一積層機狹縫，於該積層機狹縫將該帶狀材料以其自黏性表面積層於該基材表面上，以電漿處理該帶狀材料的自黏性表面與該基材表面之整個面的方式，使該電漿從在該積層機狹縫前開始連續對兩個表面作用直到進入該積層機狹縫，該積層機狹縫係由一觸壓元件與該基材形成，且該觸壓元件的表面係配備有介電質，及該電漿或電暈係產生自一噴嘴。
  20. 如請求項19之方法，其中該觸壓元件為較佳具有介於50至500mm之直徑的一滾輪、一刮刀或一觸壓板。
TW104128051A 2014-09-05 2015-08-27 提高第一帶狀材料之第一表面及第二帶狀材料之第一表面之間的黏著力之方法 TW201623499A (zh)

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