TW201615319A - 接合構造體以及接合構造體的製造方法 - Google Patents
接合構造體以及接合構造體的製造方法 Download PDFInfo
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- TW201615319A TW201615319A TW104126776A TW104126776A TW201615319A TW 201615319 A TW201615319 A TW 201615319A TW 104126776 A TW104126776 A TW 104126776A TW 104126776 A TW104126776 A TW 104126776A TW 201615319 A TW201615319 A TW 201615319A
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- Prior art keywords
- perforated
- laser
- perforated portion
- joined
- joined structure
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract
本發明的接合構造體是接合有第一構件與第二構件的接合構造體,在第一構件的表面形成有具有開口的穿孔部,且在第一構件的穿孔部中填充有第二構件。並且,穿孔部具有在深度方向上開口徑自表面側朝向底部變大的擴徑部、及在深度方向上開口徑自表面側朝向底部變小的第一縮徑部,且在表面側形成有擴徑部,在底部側形成有第一縮徑部。
Description
本發明是有關於一種接合構造體以及接合構造體的製造方法。
先前,已知有接合有包含不同材料的第一構件及第二構件的接合構造體(例如,參照專利文獻1)。
在專利文獻1中,揭示有一種使金屬材料與樹脂等異種材料接合的技術。具體而言,藉由以十字狀對金屬材料的表面實施雷射掃描加工,而在該表面形成大量突起(凹凸部)。並且,在將異種材料接合於形成有該突起的金屬材料的情形時,藉由異種材料進入凹狀部,而發揮錨定效應,因此提高金屬材料與異種材料的接合強度。 [現有技術文獻] [專利文獻]
[專利文獻1]日本專利第4020957號公報
[發明所欲解決之課題]
此處,如上所述般,若在金屬材料的表面形成突起,則藉由異種材料進入凹狀部,而可提高相對於剪切方向(沿接合界面錯開的方向)的接合強度,但在剝離方向(相對於接合界面的垂直方向)上難以實現接合強度的提高。
本發明是為了解決所述課題而完成者,本發明的目的在於提供一種除了剪切方向以外剝離方向上亦可實現接合強度的提高的接合構造體以及接合構造體的製造方法。 [解決課題之手段]
本發明的接合構造體是接合有第一構件與第二構件的接合構造體,其在第一構件的表面形成有具有開口的穿孔部,且在第一構件的穿孔部中填充有第二構件。並且,穿孔部具有在深度方向上開口徑自表面側朝向底部變大的擴徑部、及在深度方向上開口徑自表面側朝向底部變小的第一縮徑部,且在表面側形成有擴徑部,在底部側形成有第一縮徑部。
藉由以所述方式構成,擴徑部在穿孔部內向內側突出,因此在剝離方向上將擴徑部與填充於穿孔部中的第二構件契合,藉此可實現剝離方向的接合強度的提高。藉此,除了剪切方向以外剝離方向上亦可實現接合強度的提高。
在所述接合構造體中,可具有在深度方向上開口徑自表面側朝向底部變小的第二縮徑部,且將第二縮徑部形成於較擴徑部更靠表面側。
在所述接合構造體中,可在第一構件的表面形成多個穿孔部,且鄰接的穿孔部的間隔(中心間距離)為200 μm以下。
在所述接合構造體中,穿孔部的表面的開口徑可為30 μm~100 μm。
在所述接合構造體中,穿孔部的深度可為30 μm~300 μm。
在所述接合構造體中,第一構件可為金屬、熱塑性樹脂、或熱固性樹脂。
在所述接合構造體中,第二構件可為熱塑性樹脂、或熱固性樹脂。
在所述接合構造體中,可在穿孔部的開口的周圍設置有自表面向上方隆起的隆起部。
在所述接合構造體中,可以軸心相對於表面傾斜的方式形成有穿孔部。
在所述接合構造體中,擴徑部及第一縮徑部可以相連的方式形成,且在深度方向上形成有多組。
本發明的接合構造體的製造方法是接合有第一構件與第二構件的接合構造體的製造方法,其包括:在第一構件的表面形成具有開口的穿孔部的步驟;及在第一構件的穿孔部中填充第二構件並使其固化的步驟。穿孔部具有在深度方向上開口徑自表面側朝向底部變大的擴徑部、及在深度方向上開口徑自表面側朝向底部變小的第一縮徑部,且在表面側形成有擴徑部,在底部側形成有第一縮徑部。
藉由以所述方式構成,擴徑部在穿孔部內向內側突出,因此在剝離方向上將擴徑部與填充於穿孔部中的第二構件契合,藉此可實現剝離方向的接合強度的提高。藉此,除了剪切方向以外剝離方向上亦可實現接合強度的提高。
在所述接合構造體的製造方法中,可設為如下:第一構件為金屬,藉由在惰性氣體環境下或減壓氣體環境下對第一構件的表面照射雷射而形成穿孔部。
在所述接合構造體的製造方法中,亦可設為如下:第一構件為金屬,第二構件為熱塑性樹脂或熱固性樹脂,且在惰性氣體環境下或減壓氣體環境下在第一構件的穿孔部中填充第二構件並使其固化。再者,減壓氣體環境包括由大氣形成減壓氣體環境的情形、及導入惰性氣體後形成減壓氣體環境的情形。 [發明的效果]
根據本發明的接合構造體以及接合構造體的製造方法,除了剪切方向以外剝離方向上亦可實現接合強度的提高。
以下,參照圖式對本發明的實施方式進行說明。
(第一實施方式)
首先,參照圖1對本發明的第一實施方式的接合構造體100進行說明。
接合構造體100如圖1所示,是接合有包含不同材料的第一構件10及第二構件20者。在第一構件10的表面13形成有具有開口的穿孔部11,且在該穿孔部11的內周面形成有向內側突出的突出部12。並且,在第一構件10的穿孔部11中填充並固化有第二構件20。再者,圖1是將第一構件10及第二構件20的接合界面放大進行示意性表示的圖,實際上設置有多個穿孔部11,但在圖1中僅示出一個。
第一構件10的材料為金屬、熱塑性樹脂、或熱固性樹脂,第二構件20的材料為熱塑性樹脂、或熱固性樹脂。
作為所述金屬的一例,可列舉:鐵系金屬、不鏽鋼系金屬、銅系金屬、鋁系金屬、鎂系金屬、及該些金屬的合金。另外,可為金屬成型體,亦可為鋅壓鑄、鋁壓鑄、粉末冶金等。
作為所述熱塑性樹脂的一例,可列舉:聚氯乙烯(Polyvinyl chloride,PVC)、聚苯乙烯(Polystyrene,PS)、丙烯腈-苯乙烯(Acrylonitrile-styrene,AS)、丙烯腈-丁二烯-苯乙烯(Acrylonitrile-butadiene-styrene,ABS)、聚甲基丙烯酸甲酯(Polymethyl methacrylate,PMMA)、聚乙烯(Polyethylene,PE)、聚丙烯(Polypropylene,PP)、聚碳酸酯(Polycarbonate,PC)、改質聚苯醚(modified-Polyphenyleneether,m-PPE)、聚醯胺6(Polyamide 6,PA6)、聚醯胺66(PA66)、聚縮醛(Polyacetal,POM)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚對苯二甲酸丁二酯(Polybutylene terephthalate,PBT)、聚碸(Polysulfone,PSF)、聚芳酯(Polyarylate,PAR)、聚醚醯亞胺(Polyetherimide,PEI)、聚苯硫醚(Polyphenylenesulfide,PPS)、聚醚碸(Polyether sulfone,PES)、聚醚醚酮(Polyetheretherketone,PEEK)、聚醯胺醯亞胺(Polyamideimide,PAI)、液晶聚合物(Liquid crystal polymer,LCP)、聚偏二氯乙烯(Polyvinylidene chloride,PVDC)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚氯三氟乙烯(Polychlorotrifluoroethylene,PCTFE)、及聚偏二氟乙烯(Polyvinylidene fluoride,PVDF)。另外,亦可為熱塑性彈性體(Thermoplastic elastomer,TPE),作為TPE的一例,可列舉熱塑性烯烴(Thermoplastic olefin,TPO)(烯烴系)、熱塑性苯乙烯(Thermoplastic styrene,TPS)(苯乙烯系)、熱塑性酯(Thermoplastic polyester elastomer,TPEE)(酯系)、熱塑性胺基甲酸酯(Thermoplastic urethane,TPU)(胺基甲酸酯系)、熱塑性尼龍(Thermoplastic polyamide,TPA)(尼龍系)、及熱塑性氯乙烯(Polyvinyl chloride based thermoplastic,TPVC)(氯乙烯系)。
作為所述熱固性樹脂的一例,可列舉:環氧(Epoxy,EP)樹脂、聚胺基甲酸酯(Polyurethane,PUR)樹脂、脲甲醛(Urea-formaldehyde,UF)樹脂、三聚氰胺甲醛(Melamine formaldehyde,MF)樹脂、酚甲醛(Phenol formaldehyde,PF)樹脂、不飽和聚酯(Unsaturated polyester,UP)樹脂、及矽(Silicone,SI)樹脂。另外,亦可為纖維強化塑膠(Fiber reinforced plastics,FRP)。
再者,亦可在所述的熱塑性樹脂及熱固性樹脂中添加填充劑。作為填充劑的一例,可列舉無機系填充劑(玻璃纖維、無機鹽類等)、金屬系填充劑、有機系填充劑、及碳纖維等。
穿孔部11在俯視下為大致圓形的非貫通孔,在第一構件10的表面13形成有多個。穿孔部11的表面13的開口徑R1較佳為30 μm~100 μm。其原因在於:若開口徑R1小於30 μm,則存在第二構件20的填充性變差而錨定效應降低的情形。另一方面,原因在於:若開口徑R1大於100 μm,則存在每單位面積的穿孔部11的個數減少而錨定效應降低的情形,另外,變得難以形成突出部12。
另外,穿孔部11的深度較佳為30 μm~300 μm。其原因在於:若穿孔部11的深度小於30 μm,則變得難以形成突出部12。另一方面,原因在於:若穿孔部11的深度大於300 μm,則由於開口徑R1容易變小,因此第二構件20的填充性變差。再者,在穿孔部11中,深度相對於開口徑R1的比率(深度/開口徑R1)較佳為0.3~10,更佳為0.6~3.7。
另外,穿孔部11的間隔(既定的穿孔部11的中心與鄰接於既定的穿孔部11的穿孔部11的中心的距離)較佳為200 μm以下。其原因在於:若穿孔部11的間隔大於200 μm,則存在每單位面積的穿孔部11的個數減少而錨定效應降低的情形。再者,作為穿孔部11的間隔的下限的一例,為穿孔部11重疊而不崩壞的距離。即,鄰接的穿孔部11的間隔(中心間距離)較佳為穿孔部11的開口徑R1以上。另外,較佳為穿孔部11的間隔相同。其原因在於:若穿孔部11間隔相等,則剪切方向的接合強度變得等向。
此處,第一實施方式的穿孔部11是以在深度方向(Z方向)上開口徑自表面13側朝向底部113變大的擴徑部111與在深度方向上開口徑自表面13側朝向底部113變小的縮徑部112相連的方式而形成。擴徑部111是以曲線狀擴徑的方式而形成,縮徑部112是以曲線狀縮徑的方式而形成。再者,縮徑部112為本發明的「第一縮徑部」的一例。
此外,擴徑部111是配置於表面13側,並且縮徑部112是配置於底部113側。因此,在穿孔部11中,擴徑部111與縮徑部112的邊界部分的開口徑(內徑)R2變得最大,且開口徑R1變得小於開口徑R2。即,穿孔部11的深度方向上的擴徑部111的部分以突出部12的形式而形成。即,是由擴徑部111形成突出部12。藉此,突出部12的頂點是配置於第一構件10的表面13側。該突出部12例如是跨周方向上的全長而形成,且形成為環狀。
如上所述,藉由在穿孔部11的內周面形成向內側突出的突出部12(擴徑部111),而將突出部12與填充於穿孔部11中的第二構件20在剝離方向(Z方向)上契合,藉此可實現剝離方向的接合強度的提高。藉此,除了剪切方向以外剝離方向上亦可實現接合強度的提高。進而,在熱循環環境下,即便產生由第一構件10及第二構件20的線膨脹係數差引起的剝離應力,亦可維持接合強度。即,可實現在熱循環環境下的耐久性的提高。
該穿孔部11例如是藉由照射雷射而形成。作為雷射的種類,就可進行脈衝振盪的觀點而言,可選擇光纖雷射、釔鋁石榴石(yttrium aluminum garnet,YAG)雷射、釩酸釔(yttrium orthovanadate,YVO4
)雷射、半導體雷射、二氧化碳雷射、準分子雷射,若考慮雷射的波長,則較佳為光纖雷射、YAG雷射、YAG雷射的二次諧波、YVO4
雷射、半導體雷射。再者,雷射的輸出是考慮雷射的照射直徑、第一構件10的材料的種類、第一構件10的形狀(例如厚度)等而設定。例如,雷射的輸出上限較佳為40 W。其原因在於:若雷射的輸出超過40 W,則能量變大,難以形成具有突出部12的穿孔部11。
作為形成穿孔部11的裝置的一例,可列舉歐姆龍(OMRON)製造的光纖雷射雕刻機MX-Z2000或MX-Z2050。關於該光纖雷射雕刻機,可照射一個脈衝包含多個次脈衝的雷射。因此,容易使雷射的能量集中於深度方向,故而適宜於形成穿孔部11。具體而言,若對第一構件10照射雷射,則藉由將第一構件10局部熔融而進行穿孔部11的形成。此時,由於雷射包含多個次脈衝,因此經熔融的第一構件10不易飛散,而容易堆積於穿孔部11的附近。並且,若進行穿孔部11的形成,則藉由將經熔融的第一構件10堆積於穿孔部11的內部而形成突出部12。再者,雷射的照射方向例如是垂直於表面13的方向,穿孔部11的軸心相對於表面13而垂直。
再者,作為利用所述光纖雷射雕刻機的加工條件,較佳為次脈衝的一個週期為15 ns以下。其原因在於:若次脈衝的一個週期超過15 ns,則因導熱導致能量變得容易擴散,而變得難以形成具有突出部12的穿孔部11。再者,次脈衝的一個週期是照射一次次脈衝的時間與該次脈衝的照射結束起至開始下一次次脈衝的照射為止的間隔的合計時間。
另外,作為利用所述光纖雷射雕刻機的加工條件,較佳為一個脈衝的次脈衝數為2個以上且為50個以下。其原因在於:若次脈衝數超過50個,則次脈衝每單位的輸出變小,而變得難以形成具有突出部12的穿孔部11。
此外,第二構件20是接合於形成有穿孔部11的第一構件10的表面13。該第二構件20例如藉由射出成形、熱板熔著、雷射熔著、澆鑄硬化、超音波熔著、或振動熔著而接合於第一構件10。藉此,在將第二構件20填充於穿孔部11中的狀態下進行固化。
此種接合構造體100例如可應用於將樹脂外殼(省略圖示)接合於光電感應器的金屬件(省略圖示)的情形。在該情形時,金屬件相當於第一構件10,樹脂外殼相當於第二構件20。
-接合構造體的製造方法-
繼而,參照圖1及圖2,對第一實施方式的接合構造體100的製造方法進行說明。
首先,在第一構件10的表面13形成穿孔部11,並且在該穿孔部11的內周面形成突出部12。該穿孔部11及突出部12例如是如圖2所示,藉由照射一個脈衝包含多個次脈衝的雷射而形成。作為具體例,使用所述的光纖雷射雕刻機MX-Z2000或MX-Z2050而形成。
其後,將第二構件20填充於第一構件10的穿孔部11中,並使該第二構件20固化。藉此,將第一構件10及第二構件20接合,而形成接合構造體100(參照圖1)。再者,第二構件20例如是藉由射出成形、熱板熔著、雷射熔著、澆鑄硬化、超音波熔著、或振動熔著而接合。
-第一構件的變化例-
繼而,參照圖3~圖6,對第一構件10的變化例進行說明。
圖3是表示第一實施方式的第一變化例的第一構件10a的示意圖。如圖3所示的第一構件10a般,亦可在穿孔部11的開口的周圍形成有自表面13向上方隆起的隆起部14。隆起部14是以包圍穿孔部11的周圍的方式形成,在俯視下形成為大致圓形。該隆起部14例如在照射一個脈衝包含多個次脈衝的雷射時,藉由堆積經熔融的第一構件10a而形成。若以此種方式構成,則藉由隆起部14亦會產生錨定效應,因此可進一步提高接合強度。
圖4是表示第一實施方式的第二變化例的第一構件10b的示意圖。如圖4所示的第一構件10b般,亦可以穿孔部11b的軸心相對於表面13傾斜的方式而形成。在穿孔部11b的內周面形成有向內側突出的突出部12b。該穿孔部11b例如是藉由使雷射的照射方向相對於表面13傾斜(45°以上且小於90°)的方式而形成。藉此,即便在形成穿孔部11b的區域的上方存在照射雷射時的障礙物的情形時,亦可形成穿孔部11b。
圖5是表示第一實施方式的第三變化例的第一構件10c的示意圖。如圖5所示的第一構件10c般,亦可在穿孔部11c形成有多個突出部121c及突出部122c。即,亦可使擴徑部及縮徑部以相連的方式形成,並且在深度方向上形成多組該擴徑部及縮徑部。該穿孔部11c例如可變更雷射的輸出條件,藉由對相同部位照射雷射而形成。若以此種方式構成,則穿孔部11c的表面積變大,並且形成多個突出部121c及突出部122c,藉此可進一步提高接合強度。再者,在圖5中,突出部是121c及122c的兩個部位,但亦可形成三個部位以上。
圖6是表示第一實施方式的第四變化例的第一構件10d的示意圖。如圖6所示的第一構件10d般,亦可藉由位置錯開的多次雷射照射而形成一個穿孔部11d。即,亦可使藉由雷射照射而形成的穿孔部的一部分重疊,藉此形成一個穿孔部11d。在穿孔部11d的內周面形成有向內側突出的突出部12d。
再者,亦可適當組合所述的第一變化例~第四變化例。
-實驗例-
繼而,參照圖7及圖8,對為了確認所述的第一實施方式的效果而進行的實驗例1及實驗例2進行說明。
[實驗例1]
在該實驗例1中,製作對應於第一實施方式的實施例1的接合構造體500(參照圖8)與比較例1的接合構造體,並對各接合構造體進行接合評價。再者,作為接合評價,對未進行熱衝擊試驗的接合構造體測定接合強度,並且對熱衝擊試驗後的接合構造體測定接合強度,基於該測定結果判定合格與否。將其結果示於表1。
[表1]
首先,對實施例1的接合構造體500的製作方法進行說明。
在實施例1的接合構造體500中,使用Al(A5052)作為第一構件501的材料。該第一構件501如圖7所示,是形成為板狀,長度為100 mm,寬度為29 mm,厚度為3 mm。
然後,對第一構件501的表面的既定區域R照射雷射。該既定區域R是接合接合構造體500的面積,設為12.5 mm×20 mm。另外,該雷射的照射是使用OMRON製造的光纖雷射雕刻機MX-Z2000進行。雷射的照射條件如以下所述。
<雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:3.0 W 掃描速度:650 mm/sec 掃描次數:20次 照射間隔:65 μm 次脈衝數:20
再者,頻率是包含多個(該例中為20個)次脈衝的脈衝的頻率。即,在該照射條件中,1秒內移動650 mm,並且以65 μm的間隔照射1萬次雷射(脈衝),該脈衝包含20個次脈衝。再者,掃描次數是對相同部位重複照射雷射的次數。
如上所述,藉由照射一個脈衝包含多個次脈衝的雷射,而在第一構件501的表面的既定區域R形成穿孔部,並且在該穿孔部的表面側形成突出部。即,如表1所示,可獲得擴徑部與縮徑部的邊界部分的開口徑R2(參照圖1)大於表面的開口徑R1(參照圖1)的穿孔部。
然後,藉由插入成形,將第二構件502接合於第一構件501的表面。在實施例1的接合構造體500中,使用PBT(溫泰克聚合物(WinTech Polymer)製造的DURANEX(註冊商標)3316)作為第二構件502的材料。另外,成形機是使用日本製鋼所製造的J35EL3。成形條件如以下所述。
<成形條件> 預乾燥:120℃×5小時 模具溫度:120℃ 氣缸溫度:270℃ 保壓:100 MPa
以所述方式製作實施例1的接合構造體500。再者,第二構件502是形成為板狀,長度為100 mm,寬度為25 mm,厚度為3 mm。
繼而,對比較例1的接合構造體的製作方法進行說明。
在比較例1的接合構造體中,作為第一構件及第二構件的材料,使用與實施例1相同者,並且成形條件亦設為相同的設定。此外,在比較例1的接合構造體中,使用無脈衝控制功能的光纖雷射形成穿孔部。即,藉由照射一個脈衝不包含多個次脈衝的雷射形成穿孔部。因此,在比較例1的第一構件中形成研缽狀(圓錐狀)的穿孔部。即,如表1所示,在比較例1的第一構件中未形成自內周面向內側突出的突出部,未形成對應於實施例1的開口徑R2的形狀。
然後,對實施例1的接合構造體500及比較例1的接合構造體進行接合評價。
再者,接合強度是使用英斯特朗(Instron)製造的機電式萬能試驗機5900進行測定。具體而言,關於剪切方向是以拉伸速度5 mm/min進行試驗,關於剝離方向(垂直方向)是以三點彎曲試驗方式的擠壓速度2 mm/min進行試驗,以第二構件的斷裂或接合界面的斷裂結束試驗。並且採用該試驗中的最大強度作為接合強度。
另外,熱衝擊試驗是使用愛斯佩克(ESPEC)製造的冷熱衝擊裝置TSD-100進行。具體而言,重複進行100次-40℃下30分鐘的低溫曝露與85℃下30分鐘的高溫曝露。
此外,為了判斷在熱循環環境下的可靠性,而按照以下的基準進行合格與否的判斷。
合格(○):「熱衝擊試驗後的接合強度」/「熱衝擊試驗前的接合強度」≧90%
不合格(×):「熱衝擊試驗後的接合強度」/「熱衝擊試驗前的接合強度」<90%
如所述的表1所示,在熱衝擊試驗前,實施例1的接合構造體500的剪切方向及剝離方向的接合強度高於比較例1的接合構造體。藉此,判明如實施例1的接合構造體500般,藉由在穿孔部的內周面形成突出部,而提高接合強度。再者,在熱衝擊試驗後,實施例1的接合構造體500的剪切方向及剝離方向的接合強度亦高於比較例1的接合構造體。
進而,判明在實施例1的接合構造體500中,在熱衝擊試驗後亦可將熱衝擊試驗前的接合強度維持90%以上。相對於此,在比較例1的接合構造體中,在熱衝擊試驗後接合強度大幅降低。因此,如實施例1的接合構造體500般,藉由在穿孔部的內周面形成突出部,可實現在熱循環環境下的耐久性的提高。
[實驗例2]
在該實驗例2中,製作對應於第一實施方式的實施例2的接合構造體與比較例2的接合構造體,並對各接合構造體進行接合評價。再者,接合評價是以與實驗例1相同的方式進行。將其結果示於表2。
[表2]
在該實驗例2中,變更第一構件的材料與雷射照射條件而區別於實驗例1。具體而言,在實施例2的接合構造體中,使用PPS(聚塑膠(Polyplastics)製造的FORTRON(註冊商標)1140)作為第一構件的材料。另外,將雷射照射條件設為如以下所述。
<雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:1.1 W 掃描速度:650 mm/sec 掃描次數:3次 照射間隔:65 μm 次脈衝數:3
如所述的表2所示,在熱衝擊試驗前,實施例2的接合構造體的剪切方向及剝離方向的接合強度高於比較例2的接合構造體。進而,判明在實施例2的接合構造體中,在熱衝擊試驗後亦可將熱衝擊試驗前的接合強度維持90%以上。即,判明在實驗例2中,可獲得與實驗例1同樣的結果。即,即便在使用作為樹脂的PPS作為第一構件的材料的情形時,藉由形成具有突出部的穿孔部,亦可實現接合強度的提高,並且可實現在熱循環環境下的耐久性的提高。
(第二實施方式)
繼而,參照圖9,對本發明的第二實施方式的接合構造體200進行說明。
接合構造體200如圖9所示,是接合有包含不同材料的第一構件30及第二構件20者。在第一構件30的表面33形成有具有開口的穿孔部31,且在該穿孔部31的內周面形成有向內側突出的突出部32。並且,在第一構件30的穿孔部31中填充並固化有第二構件20。
第二實施方式的穿孔部31是以在深度方向(Z方向)上開口徑自表面33側朝向底部314變小的縮徑部311、在深度方向上開口徑自表面33側朝向底部314變大的擴徑部312、及在深度方向上開口徑自表面33側朝向底部314變小的縮徑部313相連的方式而形成。縮徑部311是以直線狀縮徑的方式而形成,擴徑部312是以曲線狀擴徑的方式而形成,縮徑部313是以曲線狀縮徑的方式而形成。再者,縮徑部311為本發明的「第二縮徑部」的一例,縮徑部313為本發明的「第一縮徑部」的一例。
此外,自表面33側朝向底部314側依序配置有縮徑部311、擴徑部312及縮徑部313。即,將縮徑部311配置於較擴徑部312更靠表面33側。因此,在穿孔部31中,縮徑部311與擴徑部312的邊界部分的開口徑(內徑)R4變得小於表面33的開口徑R3、及擴徑部312與縮徑部313的邊界部分的開口徑R5。即,穿孔部31的深度方向上的縮徑部311及擴徑部312的部分以突出部32的形式而形成。即,是由縮徑部311及擴徑部312形成突出部32。藉此,將突出部32的頂點配置於進入底部314側的位置。該突出部32例如是跨周方向上的全長而形成,且形成為環狀。
再者,第一構件30的其他構成與所述的第一構件10相同。
如上所述,藉由在穿孔部31的內周面形成向內側突出的突出部32(擴徑部312),而將突出部32與填充於穿孔部31中的第二構件20在剝離方向(Z方向)上契合,藉此可實現剝離方向的接合強度的提高。藉此,除了剪切方向以外剝離方向上亦可實現接合強度的提高。進而,在熱循環環境下,即便產生由第一構件30及第二構件20的線膨脹係數差引起的剝離應力,亦可維持接合強度。即,可實現在熱循環環境下的耐久性的提高。
-接合構造體的製造方法-
繼而,參照圖9及圖10,對第二實施方式的接合構造體200的製造方法進行說明。
首先,在第一構件30的表面33形成穿孔部31,並且在該穿孔部31的內周面形成突出部32。該穿孔部31及突出部32例如是如圖10所示,藉由照射一個脈衝包含多個次脈衝的雷射而形成。作為具體例,使用所述的光纖雷射雕刻機MX-Z2000或MX-Z2050而形成。再者,在第二實施方式中,與第一實施方式不同,將突出部32配置於進入底部314側的位置,此種不同例如是由第一構件30的材料或雷射照射條件等的不同所引起。
其後,將第二構件20填充於第一構件30的穿孔部31中,並使該第二構件20固化。藉此,將第一構件30及第二構件20接合,而形成接合構造體200(參照圖9)。再者,第二構件20例如是藉由射出成形、熱板熔著、雷射熔著、澆鑄硬化、超音波熔著、或振動熔著而接合。
-第一構件的變化例-
繼而,參照圖11~圖14,對第一構件30的變化例進行說明。
圖11是表示第二實施方式的第一變化例的第一構件30a的示意圖。如圖11所示的第一構件30a般,亦可在穿孔部31的開口的周圍形成有自表面33向上方隆起的隆起部34。隆起部34是以包圍穿孔部31的周圍的方式而形成,在俯視下形成為大致圓形。該隆起部34例如在照射一個脈衝包含多個次脈衝的雷射時,藉由堆積經熔融的第一構件30a而形成。若以此種方式構成,則藉由隆起部34亦會產生錨定效應,因此可進一步提高接合強度。
圖12是表示第二實施方式的第二變化例的第一構件30b的示意圖。如圖12所示的第一構件30b般,亦可以穿孔部31b的軸心相對於表面33傾斜的方式而形成。在穿孔部31b的內周面形成有向內側突出的突出部32b。該穿孔部31b例如是藉由使雷射的照射方向相對於表面33傾斜(45°以上且小於90°)的方式而形成。藉此,即便在形成穿孔部31b的區域的上方存在照射雷射時的障礙物的情形時,亦可形成穿孔部31b。
圖13是表示第二實施方式的第三變化例的第一構件30c的示意圖。如圖13所示的第一構件30c般,亦可在穿孔部31c形成多個突出部321c及突出部322c。即,亦可使擴徑部及縮徑部以相連的方式形成,並且在深度方向上形成多組該擴徑部及縮徑部。該穿孔部31c例如可變更雷射的輸出條件,藉由對相同部位照射雷射而形成。若以此種方式構成,則穿孔部31c的表面積變大,並且形成多個突出部321c及突出部322c,藉此可進一步提高接合強度。再者,在圖13中,突出部是321c及322c的兩個部位,但亦可形成三個部位以上。
圖14是表示第二實施方式的第四變化例的第一構件30d的示意圖。如圖14所示的第一構件30d般,亦可藉由位置錯開的多次雷射照射而形成一個穿孔部31d。即,亦可使藉由雷射照射而形成的穿孔部的一部分重疊,藉此形成一個穿孔部31d。在穿孔部31d的內周面形成有向內側突出的突出部32d。
再者,亦可適當組合所述的第一變化例~第四變化例。
-實驗例-
繼而,對為了確認所述的第二實施方式的效果而進行的實驗例3進行說明。
在該實驗例3中,製作對應於第二實施方式的實施例3的接合構造體與比較例3的接合構造體,並對各接合構造體進行接合評價。再者,接合評價是以與實驗例1相同的方式進行。將其結果示於表3。
[表3]
在該實驗例3中,變更第一構件的材料與雷射照射條件而區別於實驗例1。具體而言,在實施例3的接合構造體中,使用SUS304作為第一構件的材料。另外,將雷射照射條件設為如以下所述。
<雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:3.8 W 掃描速度:650 mm/sec 掃描次數:20次 照射間隔:65 μm 次脈衝數:20
在實施例3的接合構造體中,藉由照射一個脈衝包含多個次脈衝的雷射,在第一構件的表面形成穿孔部,並且在自該穿孔部的表面進入的位置形成突出部。即,如表3所示,開口徑R4(參照圖9)小於表面的開口徑R3(參照圖9)及開口徑R5(參照圖9)。再者,在比較例3的第一構件中形成研缽狀(圓錐狀)的穿孔部,而未形成對應於實施例3的開口徑R4及開口徑R5的形狀。
如所述的表3所示,在熱衝擊試驗前,實施例3的接合構造體的剪切方向及剝離方向的接合強度高於比較例3的接合構造體。進而,判明在實施例3的接合構造體中,在熱衝擊試驗後亦可將熱衝擊試驗前的接合強度維持90%以上。即,判明在實驗例3中,可獲得與實驗例1同樣的結果。即,即便將突出部配置於進入底部側的位置,亦可實現接合強度的提高,並且可實現在熱循環環境下的耐久性的提高。
-關於穿孔部的間隔-
繼而,對為了確認鄰接的穿孔部的間隔(中心間距離)的較佳的範圍而進行的實驗例3-1進行說明。
在該實驗例3-1中,製作實施例3-1~實施例3-3的接合構造體與參考例3-1及參考例3-2的接合構造體,並對各接合構造體進行接合評價。再者,接合評價是以與實驗例1相同的方式進行。將其結果示於表4。
[表4]
在該實驗例3-1中,在將頻率設為恆定(10 kHz)的狀態下,藉由變更掃描速度,而變更各接合構造體中的雷射的照射間隔。再者,在實施例3-1~實施例3-3及參考例3-2中,雷射的照射間隔為穿孔部的間隔(中心間距離),但在參考例3-1中,雷射的照射間隔短,穿孔部被重疊而成為溝狀。如表4所示,實施例3-1的穿孔部間隔為54 μm,實施例3-2的穿孔部間隔為65 μm,實施例3-3的穿孔部間隔為200 μm,參考例3-2的穿孔部間隔為250 μm。另外,在各接合構造體中共通的雷射照射條件如以下所述。
<雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:3.8 W 掃描次數:20次 次脈衝數:20
如所述的表4所示,在實施例3-1~實施例3-3的接合構造體中,在熱衝擊試驗後亦可將熱衝擊試驗前的接合強度維持90%以上。相對於此,在參考例3-1及參考例3-2中,熱衝擊試驗後的接合強度保持率低於90%。因此,鄰接的穿孔部的間隔較佳為重疊而不崩壞的距離,且為200 μm以下。再者,在實施例3-3的接合構造體中,由於穿孔部個數少於實施例3-1及實施例3-2,因此接合強度本身變低,但可確保在熱循環環境下的耐久性。
-關於穿孔部的表面的開口徑-
繼而,對為了確認穿孔部的表面的開口徑R3的較佳的範圍而進行的實驗例3-2進行說明。
在該實驗例3-2中,製作實施例3-4~實施例3-6的接合構造體與參考例3-3及參考例3-4的接合構造體,並對各接合構造體進行接合評價。再者,接合評價是以與實驗例1相同的方式進行。將其結果示於表5。
[表5]
在該實驗例3-2中,藉由變更雷射的照射條件,而變更各接合構造體中的穿孔部的表面的開口徑R3。再者,在參考例3-4中形成有研缽狀的穿孔部。如表5所示,實施例3-4的開口徑R3為30 μm,實施例3-5的開口徑R3為58 μm,實施例3-6的開口徑R3為100 μm。另一方面,參考例3-3的開口徑R3為28 μm,參考例3-4的開口徑R3為120 μm。另外,在各接合構造體中共通的雷射照射條件如以下所述。
<雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:3.8 W 掃描速度:1200 mm/sec 照射間隔:120 μm
如所述的表5所示,在實施例3-4~實施例3-6的接合構造體中,在熱衝擊試驗後亦可將熱衝擊試驗前的接合強度維持90%以上。相對於此,在參考例3-3及參考例3-4中,熱衝擊試驗後的接合強度保持率低於90%。因此,穿孔部的表面的開口徑R3較佳為30 μm~100 μm。再者,在實施例3-4~實施例3-6的接合構造體中,由於穿孔部個數少於所述的實施例3-1及實施例3-2,因此接合強度本身變低,但可確保在熱循環環境下的耐久性。
-關於穿孔部的深度-
繼而,對為了確認穿孔部的深度的較佳的範圍而進行的實驗例3-3進行說明。
在該實驗例3-3中,製作實施例3-7~實施例3-9的接合構造體與參考例3-5及參考例3-6的接合構造體,並對各接合構造體進行接合評價。再者,接合評價是以與實驗例1相同的方式進行。將其結果示於表6。
[表6]
在該實驗例3-3中,藉由變更雷射的照射條件,而變更各接合構造體中的穿孔部的深度。再者,在參考例3-5中形成有研缽狀的穿孔部。如表6所示,實施例3-7的深度為30 μm,實施例3-8的深度為60 μm,實施例3-9的深度為300 μm。另一方面,參考例3-5的深度為24 μm,參考例3-6的深度為340 μm。另外,在各接合構造體中共通的雷射照射條件如以下所述。
<雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:3.8 W 掃描速度:650 mm/sec 照射間隔:65 μm
如所述的表6所示,在實施例3-7~實施例3-9的接合構造體中,在熱衝擊試驗後亦可將熱衝擊試驗前的接合強度維持90%以上。相對於此,在參考例3-5及參考例3-6中,熱衝擊試驗後的接合強度保持率低於90%。因此,穿孔部11的深度較佳為30 μm~300 μm。
(第三實施方式)
繼而,對本發明的第三實施方式的接合構造體進行說明。在該第三實施方式中,在進行形成穿孔部時與將第一構件及第二構件接合時的至少任一者時,設為惰性氣體環境或減壓氣體環境。
在第三實施方式的接合構造體中,第一構件為金屬,第二構件為對雷射具有透過性的熱塑性樹脂或熱固性樹脂。再者,第三實施方式的接合構造體的其他構成與所述的第一實施方式或第二實施方式相同。
-接合構造體的製造方法-
繼而,參照圖15~圖18,對第三實施方式的接合構造體的製造方法進行說明。
在第三實施方式中,是在惰性氣體環境下或減壓氣體環境下進行藉由對含有金屬的第一構件的表面照射雷射而在第一構件的表面形成穿孔部的步驟。若以此種方式構成,則由於可抑制由雷射的照射引起的第一構件表面上的過度的氧化膜的形成,因此可進一步提高在熱循環環境下的耐久性。
例如,如圖15所示,在自雷射雕刻機的雷射頭50對金屬製的第一構件40的穿孔部形成區域Ra照射雷射L1時,藉由自噴嘴51向該穿孔部形成區域Ra噴射惰性氣體G,而在惰性氣體環境下在第一構件40形成穿孔部(省略圖示)。作為惰性氣體G的一例,可列舉氮氣、二氧化碳氣體(CO2
)、氬氣、氦氣等。再者,惰性氣體G的噴射量例如為2 L/分鐘。
另外,亦可以可調節自噴嘴51噴射的惰性氣體G的溫度的方式而構成。其原因在於:在惰性氣體G的噴射量多(例如,50 L/分鐘)時,存在第一構件40的表面被冷卻,而利用雷射L1的加工特性降低之虞,但藉由調整惰性氣體G的溫度來抑制噴射量多的情形時的加工特性的降低。
另外,亦可如圖16所示,將金屬製的第一構件40配置於腔室52內,將該腔室52內設為惰性氣體環境,而自雷射雕刻機的雷射頭50對第一構件40的穿孔部形成區域Ra照射雷射L1。再者,腔室52例如是透明的丙烯酸製的密封容器,設置有惰性氣體的導入口(省略圖示)及排出口(省略圖示)。在該情形時,由於惰性氣體不會噴附在第一構件40的表面,因此不會發生由冷卻引起的加工特性的降低。
另外,亦可如圖17所示,將金屬製的第一構件40及雷射雕刻機的雷射頭50配置於腔室53內,藉由真空泵54將該腔室53內設為減壓氣體環境,而自雷射頭50對第一構件40的穿孔部形成區域Ra照射雷射L1。減壓條件例如為500 mm/Hg(666.6 hPa)以下。再者,可由大氣形成減壓氣體環境,亦可在腔室53內填充惰性氣體後形成減壓氣體環境。在填充惰性氣體後進行減壓的情形時,可進一步抑制第一構件40的氧化。另外,腔室53例如是具有耐壓性的密封容器。
再者,雷射L1是一個脈衝包含多個次脈衝,例如使用所述的光纖雷射雕刻機MX-Z2000或MX-Z2050而照射。因此,與所述第一實施方式及第二實施方式同樣地,在第一構件40上形成穿孔部,並且在該穿孔部的內周面形成突出部(省略圖示)。
另外,在第三實施方式中,藉由將第一構件與第二構件積層,並自第二構件側向第一構件的表面照射雷射,而在惰性氣體環境下或減壓氣體環境下進行將第一構件與第二構件接合的步驟。若以此種方式構成,則由於可抑制由雷射的照射引起的第一構件表面上的過度的氧化膜的形成,因此可進一步提高在熱循環環境下的耐久性。
例如,如圖18所示,在自第二構件41側向第一構件40的表面照射接合用的雷射L2時,藉由自噴嘴55向第一構件40與第二構件41的接觸界面F噴射惰性氣體G,而在惰性氣體環境下將第一構件40與第二構件41接合。具體而言,將第二構件41填充於第一構件40的穿孔部中,其後將第二構件41固化。再者,在圖18中,是將形成於第一構件40與第二構件41的接觸界面F的微小的間隙示意性放大而表示。
再者,接合用的雷射L2例如為半導體雷射。另外,亦可不向第一構件40與第二構件41的接觸界面F噴附惰性氣體G,而是在惰性氣體環境下或減壓氣體環境下的腔室內藉由雷射L2將第一構件40與第二構件41接合。
此處,如上所述般,可在形成穿孔部時與將第一構件及第二構件接合時的兩種情形時設為惰性氣體環境或減壓氣體環境,亦可在形成穿孔部時與將第一構件及第二構件接合時的任一情形時設為惰性氣體環境或減壓氣體環境。再者,在形成穿孔部時,第一構件的溫度高於將第一構件及第二構件接合時的溫度。因此,在形成穿孔部時,由設為惰性氣體環境或減壓氣體環境獲得的氧化膜的抑制效果大於將第一構件及第二構件接合時的抑制效果。
-實驗例-
繼而,對為了確認所述的第三實施方式的效果而進行的實驗例4進行說明。
在該實驗例4中,製作基準例的接合構造體與實施例4~實施例11的接合構造體,並對該些接合構造體測定熱衝擊試驗耐性。然後,將其結果示於表7。再者,實施例4~實施例11的接合構造體是對應於第三實施方式者,相對於此,基準例的接合構造體並不與第三實施方式相對應。另外,實施例4~實施例11及基準例是對應於第一實施方式或第二實施方式者,如下文所述般,在第一構件形成有穿孔部,並且在該穿孔部的內周面形成有突出部。
[表7]
首先,對基準例的接合構造體的製作方法進行說明。
在基準例的接合構造體中,使用精銅(C1100)作為第一構件的材料。該第一構件是形成為板狀,長度為100 mm,寬度為29 mm,厚度為0.5 mm。
然後,向第一構件的表面的既定區域照射加工用的雷射。該既定區域是接合接合構造體的面積,設為12.5 mm×20 mm。另外,該雷射的照射是使用OMRON製造的光纖雷射雕刻機MX-Z2000進行。加工用的雷射的照射條件如以下所述。此處,在基準例中,在大氣環境下進行加工用的雷射照射。即,在不進行惰性氣體的噴附或減壓的狀態下進行雷射的照射。
<加工用的雷射照射條件> 雷射:光纖雷射(波長1062 nm) 頻率:10 kHz 輸出:3.8 W 掃描速度:650 mm/sec 掃描次數:40次 照射間隔:65 μm 次脈衝數:20
如上所述,藉由照射一個脈衝包含多個次脈衝的雷射,在第一構件的表面的既定區域形成穿孔部,並且在該穿孔部的內周面形成突出部。
其後,將第二構件積層於第一構件的既定區域。使用PMMA(三菱麗陽(Mitsubishi Rayon)製造的ACRYLITE(註冊商標))作為該第二構件的材料。第二構件是形成為板狀,長度為100 mm,寬度為25 mm,厚度為3 mm。
然後,自第二構件側向第一構件的既定區域照射接合用的雷射。接合用的雷射的照射條件如以下所述。此處,在基準例中,是在大氣環境下進行接合用的雷射照射。
<接合用的雷射照射條件> 雷射:半導體雷射(波長808 nm) 振盪模式:連續振盪 輸出:30 W 焦點直徑:4 mm 掃描速度:1 mm/sec 密合壓力:0.6 MPa
藉由該雷射的照射,對第一構件進行加熱,藉由該熱將第二構件熔融。然後,將經熔融的第二構件填充於穿孔部中後,將第二構件固化。藉此,將第一構件與第二構件接合。
以所述方式製作基準例的接合構造體。
繼而,對實施例4~實施例11的接合構造體的製作方法進行說明。
在實施例4中,如所述的表7所示,在照射加工用的雷射時,向第一構件的既定區域噴射惰性氣體。使用氮氣作為惰性氣體,並將其流量設為2 L/分鐘。即,在惰性氣體環境下在第一構件上形成穿孔部。再者,實施例4的其他方面與基準例相同。
在實施例5中,在減壓氣體環境下照射加工用的雷射。即,在減壓氣體環境下在第一構件上形成穿孔部。再者,實施例5的其他方面與基準例相同。
在實施例6中,在照射接合用的雷射時,向第一構件及第二構件的接觸界面噴射惰性氣體(氮氣)。即,在惰性氣體環境下將第一構件及第二構件接合。再者,實施例6的其他方面與基準例相同。
在實施例7中,在減壓氣體環境下照射接合用的雷射。即,在減壓氣體環境下將第一構件及第二構件接合。再者,實施例7的其他方面與基準例相同。
在實施例8中,在惰性氣體環境下在第一構件上形成穿孔部,並且在惰性氣體環境下將第一構件及第二構件接合。再者,實施例8的其他方面與基準例相同。
在實施例9中,在惰性氣體環境下在第一構件上形成穿孔部,並且在減壓氣體環境下將第一構件及第二構件接合。再者,實施例9的其他方面與基準例相同。
在實施例10中,在減壓氣體環境下在第一構件上形成穿孔部,並且在惰性氣體環境下將第一構件及第二構件接合。再者,實施例10的其他方面與基準例相同。
在實施例11中,在減壓氣體環境下在第一構件上形成穿孔部,並且在減壓氣體環境下將第一構件及第二構件接合。再者,實施例11的其他方面與基準例相同。
然後,對實施例4~實施例11及基準例的接合構造體對熱衝擊試驗的耐久性進行評價。該熱衝擊試驗是使用愛斯佩克(ESPEC)製造的冷熱衝擊裝置TSD-100進行。具體而言,以-40℃下30分鐘的低溫曝露與85℃下30分鐘的高溫曝露作為一個循環,將該循環重複進行。然後,在100、250、500、750、1000及1500個循環的時點確認在各接合構造體中接合界面是否剝離。
如所述的表7所示,在基準例的接合構造體中,在500個循環的時點接合界面剝離,且在250個循環前未產生剝離。即,在基準例中,至少在250個循環前具有對熱衝擊試驗的耐性。
相對於此,在實施例5~實施例7及實施例11中,至少在500個循環前具有對熱衝擊試驗的耐性。另外,在實施例4、實施例9及實施例10中,至少在750個循環前具有對熱衝擊試驗的耐性。另外,在實施例8中,至少在1000個循環前具有對熱衝擊試驗的耐性。
因此,在實施例4~實施例11中,與基準例相比,可提高對熱衝擊試驗的耐性。認為其原因在於:藉由在加工時及接合時的至少一種情形時設為惰性氣體環境或減壓氣體環境,可抑制形成於第一構件的表面的氧化膜。
再者,根據實施例4及實施例6的結果,在將加工時或接合時的任一者設為惰性氣體環境的情形時,在加工時設為惰性氣體環境的情形對熱衝擊試驗的耐性變高。另外,根據實施例4及實施例5的結果、與實施例8及實施例11的結果,相較於減壓氣體環境,設為惰性氣體環境的情形對熱衝擊試驗的耐性變高。
(其他實施方式)
再者,此次揭示的實施方式在所有方面均為例示,並非成為限定性解釋的根據。因此,本發明的技術範圍並不僅由所述的實施方式解釋,而是基於申請專利範圍的記載而劃定。另外,在本發明的技術範圍中,包括與申請專利範圍相同的含義及範圍內的全部變更。
例如,在第一實施方式中,表面13可平坦,亦可彎曲。再者,第二實施方式亦為同樣。
另外,在第一實施方式中,示出了以擴徑部111與縮徑部112相連的方式形成的例,但並不限於此,亦可在擴徑部與縮徑部之間形成沿深度方向筆直延伸的部分。再者,第二實施方式亦為同樣。
另外,在第三實施方式中,示出了藉由照射接合用的雷射L2將第一構件40與第二構件41接合的例,但並不限於此,亦可藉由熱壓成形將第一構件與第二構件接合。在該情形時,可在熱壓成形時自噴嘴向第一構件與第二構件的接合界面噴附惰性氣體,亦可在惰性氣體環境下或減壓氣體環境下的腔室內進行熱壓成形。另外,亦可藉由插入成形將第一構件與第二構件接合。在該情形時,亦可在將第一構件配置於模具上後,在合模(mold closing)為止期間噴附惰性氣體。再者,在進行熱壓成形及插入成形的情形時,第二構件對於雷射可不具有透過性。 [產業上之可利用性]
本發明可用於接合有包含不同材料的第一構件及第二構件的接合構造體及其製造方法。
10、10a、10b、10c、10d、30、30a、30b、30c、30d、40、501‧‧‧第一構件
11、11b、11c、11d、31、31b、31c、31d‧‧‧穿孔部
12、12b、12d、32、32b、32d、121c、122c、321c、322c‧‧‧突出部
13、33‧‧‧表面
14、34‧‧‧隆起部
20、41、502‧‧‧第二構件
50‧‧‧雷射頭
51、55‧‧‧噴嘴
52、53‧‧‧腔室
54‧‧‧真空泵
100、200、500‧‧‧接合構造體
111、312‧‧‧擴徑部
112、313‧‧‧縮徑部(第一縮徑部)
113、314‧‧‧底部
311‧‧‧縮徑部(第二縮徑部)
F‧‧‧接觸界面
G‧‧‧惰性氣體
L1、L2‧‧‧雷射
R1、R2、R3、R4、R5‧‧‧開口徑
Ra‧‧‧穿孔部形成區域
圖1是本發明的第一實施方式的接合構造體的剖面的示意圖。 圖2是表示圖1的接合構造體的在第一構件上形成有穿孔部的狀態的示意圖。 圖3是表示第一實施方式的第一變化例的第一構件的示意圖。 圖4是表示第一實施方式的第二變化例的第一構件的示意圖。 圖5是表示第一實施方式的第三變化例的第一構件的示意圖。 圖6是表示第一實施方式的第四變化例的第一構件的示意圖。 圖7是表示實施例的接合構造體的第一構件的立體圖。 圖8是表示實施例的接合構造體的立體圖。 圖9是本發明的第二實施方式的接合構造體的剖面的示意圖。 圖10是表示圖9的接合構造體的在第一構件上形成有穿孔部的狀態的示意圖。 圖11是表示第二實施方式的第一變化例的第一構件的示意圖。 圖12是表示第二實施方式的第二變化例的第一構件的示意圖。 圖13是表示第二實施方式的第三變化例的第一構件的示意圖。 圖14是表示第二實施方式的第四變化例的第一構件的示意圖。 圖15是用來說明本發明的第三實施方式的接合構造體的製造方法的圖,為表示於在第一構件上形成穿孔部時自噴嘴噴射惰性氣體的例的概略圖。 圖16是用來說明本發明的第三實施方式的接合構造體的製造方法的圖,為表示於在第一構件上形成穿孔部時將第一構件配置於腔室內並使該腔室成為惰性氣體環境的例的概略圖。 圖17是用來說明本發明的第三實施方式的接合構造體的製造方法的圖,為表示於在第一構件上形成穿孔部時將第一構件配置於腔室內並使該腔室成為減壓氣體環境的例的概略圖。 圖18是用來說明本發明的第三實施方式的接合構造體的製造方法的圖,為表示在將第一構件與第二構件接合時自噴嘴噴射惰性氣體的例的概略圖。
10‧‧‧第一構件
11‧‧‧穿孔部
12‧‧‧突出部
13‧‧‧表面
20‧‧‧第二構件
100‧‧‧接合構造體
111‧‧‧擴徑部
112‧‧‧縮徑部(第一縮徑部)
113‧‧‧底部
R1、R2‧‧‧開口徑
Claims (13)
- 一種接合構造體,其是接合有第一構件與第二構件的接合構造體,其特徵在於: 在所述第一構件的表面形成有具有開口的穿孔部,並且在所述第一構件的穿孔部中填充有所述第二構件, 所述穿孔部具有在深度方向上開口徑自表面側朝向底部變大的擴徑部、及在深度方向上開口徑自表面側朝向底部變小的第一縮徑部,且 在表面側形成有所述擴徑部,在底部側形成有所述第一縮徑部。
- 如申請專利範圍第1項所述的接合構造體,其中, 所述穿孔部具有在深度方向上開口徑自表面側朝向底部變小的第二縮徑部, 所述第二縮徑部是形成於較所述擴徑部更靠表面側。
- 如申請專利範圍第1項或第2項所述的接合構造體,其中, 所述穿孔部在所述第一構件的表面形成有多個,且 鄰接的穿孔部的間隔為200 μm以下。
- 如申請專利範圍第1項至第3項中任一項所述的接合構造體,其中, 所述穿孔部的表面的開口徑為30 μm~100 μm。
- 如申請專利範圍第1項至第4項中任一項所述的接合構造體,其中, 所述穿孔部的深度為30 μm~300 μm。
- 如申請專利範圍第1項至第5項中任一項所述的接合構造體,其中, 所述第一構件為金屬、熱塑性樹脂、或熱固性樹脂。
- 如申請專利範圍第1項至第6項中任一項所述的接合構造體,其中, 所述第二構件為熱塑性樹脂、或熱固性樹脂。
- 如申請專利範圍第1項至第7項中任一項所述的接合構造體,其中, 在所述穿孔部的開口的周圍設置有自表面向上方隆起的隆起部。
- 如申請專利範圍第1項至第8項中任一項所述的接合構造體,其中, 所述穿孔部是以軸心相對於表面傾斜的方式而形成。
- 如申請專利範圍第1項至第9項中任一項所述的接合構造體,其中, 所述擴徑部及所述第一縮徑部是以相連的方式形成,且在深度方向上形成有多組。
- 一種接合構造體的製造方法,其是接合有第一構件與第二構件的接合構造體的製造方法,其特徵在於包括: 在所述第一構件的表面形成具有開口的穿孔部的步驟;及 在所述第一構件的穿孔部中填充所述第二構件並使其固化的步驟,且 所述穿孔部具有在深度方向上開口徑自表面側朝向底部變大的擴徑部、及在深度方向上開口徑自表面側朝向底部變小的第一縮徑部, 在表面側形成有所述擴徑部,在底部側形成有所述第一縮徑部。
- 如申請專利範圍第11項所述的接合構造體的製造方法,其中, 所述第一構件為金屬,且 藉由在惰性氣體環境下或減壓氣體環境下向所述第一構件的表面照射雷射,而形成所述穿孔部。
- 如申請專利範圍第11項或第12項所述的接合構造體的製造方法,其中, 所述第一構件為金屬,所述第二構件為熱塑性樹脂或熱固性樹脂,且 在惰性氣體環境下或減壓氣體環境下將所述第二構件填充於所述第一構件的穿孔部中並使其固化。
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US10449698B2 (en) | 2019-10-22 |
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