TW201613999A - Resin composition and laminated product using the same - Google Patents

Resin composition and laminated product using the same

Info

Publication number
TW201613999A
TW201613999A TW104126543A TW104126543A TW201613999A TW 201613999 A TW201613999 A TW 201613999A TW 104126543 A TW104126543 A TW 104126543A TW 104126543 A TW104126543 A TW 104126543A TW 201613999 A TW201613999 A TW 201613999A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
same
laminated product
present
Prior art date
Application number
TW104126543A
Other languages
English (en)
Other versions
TWI664228B (zh
Inventor
Koji Imanishi
Yutaka Nabeshima
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Publication of TW201613999A publication Critical patent/TW201613999A/zh
Application granted granted Critical
Publication of TWI664228B publication Critical patent/TWI664228B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/19—Hydroxy compounds containing aromatic rings
    • C08G63/193—Hydroxy compounds containing aromatic rings containing two or more aromatic rings
    • C08G63/197—Hydroxy compounds containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
TW104126543A 2014-08-15 2015-08-14 樹脂組成物及使用其之積層體 TWI664228B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014165370 2014-08-15
JP2014-165370 2014-08-15

Publications (2)

Publication Number Publication Date
TW201613999A true TW201613999A (en) 2016-04-16
TWI664228B TWI664228B (zh) 2019-07-01

Family

ID=55304196

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104126543A TWI664228B (zh) 2014-08-15 2015-08-14 樹脂組成物及使用其之積層體

Country Status (5)

Country Link
JP (1) JP6676529B2 (zh)
KR (1) KR102376600B1 (zh)
CN (1) CN106661197B (zh)
TW (1) TWI664228B (zh)
WO (1) WO2016024569A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017142004A1 (ja) * 2016-02-19 2017-08-24 ユニチカ株式会社 ポリアリレート樹脂およびそれからなるフィルム
WO2017175716A1 (ja) * 2016-04-05 2017-10-12 ユニチカ株式会社 ポリアリレート樹脂およびその樹脂組成物
CN109563250A (zh) * 2016-07-28 2019-04-02 Jsr株式会社 聚合物、组合物、成形体、硬化物及层叠体
JP6928908B2 (ja) * 2017-04-07 2021-09-01 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板及びフレックスリジッドプリント配線板
TWI620763B (zh) * 2017-04-27 2018-04-11 Taiwan Union Technology Corporation 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
JP7056196B2 (ja) * 2018-02-07 2022-04-19 Dic株式会社 ポリエステル樹脂
CN110527470A (zh) * 2019-08-29 2019-12-03 苏州瀚海新材料有限公司 一种用于ffc的胶黏剂组合物
CN114616096B (zh) * 2019-10-29 2023-11-10 帝人株式会社 天线用导电薄膜和天线
JP2021155679A (ja) * 2020-03-30 2021-10-07 リンテック株式会社 フィルム状接着剤
JP7446887B2 (ja) * 2020-03-30 2024-03-11 リンテック株式会社 フィルム状接着剤
CN112745737A (zh) * 2020-12-27 2021-05-04 贵州龙科生产力促进中心 一种电子产品外壳的高效散热涂料
WO2024090396A1 (ja) * 2022-10-24 2024-05-02 太陽ホールディングス株式会社 硬化性樹脂組成物、積層構造体、硬化物および電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03139583A (ja) * 1989-10-25 1991-06-13 Nippon Steel Corp 耐熱性接着剤組成物
DE4037401A1 (de) * 1990-08-01 1992-02-06 Bayer Ag Hochmolekulare polyester auf basis von 1,1-bis-(4-hydroxyphenyl)-alkylcycloalkanen und thermoplastische legierungen daraus
JPH04325590A (ja) * 1991-04-25 1992-11-13 Nitto Denko Corp エポキシ樹脂系接着剤組成物
JP3193106B2 (ja) * 1992-03-05 2001-07-30 日東電工株式会社 エポキシ樹脂組成物の硬化方法および硬化物
JPH05263058A (ja) 1992-03-18 1993-10-12 Hitachi Chem Co Ltd フレキシブル印刷配線基板用接着剤
JPH05271637A (ja) 1992-03-26 1993-10-19 Hitachi Chem Co Ltd フレキシブル印刷配線基板用接着剤
JP4423513B2 (ja) 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
JP2002356544A (ja) * 2001-03-30 2002-12-13 Dainippon Ink & Chem Inc 低誘電性電子材料および電子材料用樹脂組成物
JP2004224890A (ja) * 2003-01-22 2004-08-12 Dainippon Ink & Chem Inc エポキシ樹脂組成物の硬化物の製造方法
JP2007051212A (ja) 2005-08-17 2007-03-01 Shin Etsu Chem Co Ltd 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
US20070155946A1 (en) * 2006-01-04 2007-07-05 Corrado Berti Polyester oligomers, methods of making, and thermosetting compositions formed therefrom
JP2011144209A (ja) * 2010-01-12 2011-07-28 Unitika Ltd 樹脂組成物およびその発泡体
JP2013189544A (ja) 2012-03-14 2013-09-26 Unitika Ltd 樹脂組成物およびそれを加熱硬化してなる熱硬化性エラストマー
JP6116960B2 (ja) * 2013-03-26 2017-04-19 ユニチカ株式会社 ポリアリレート樹脂フィルムおよびそれを用いたコンデンサ

Also Published As

Publication number Publication date
JP6676529B2 (ja) 2020-04-08
KR20170042278A (ko) 2017-04-18
WO2016024569A1 (ja) 2016-02-18
CN106661197B (zh) 2020-05-12
KR102376600B1 (ko) 2022-03-18
CN106661197A (zh) 2017-05-10
JPWO2016024569A1 (ja) 2017-06-01
TWI664228B (zh) 2019-07-01

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