TW201613458A - Electronic device and heat dissipation plate - Google Patents
Electronic device and heat dissipation plateInfo
- Publication number
- TW201613458A TW201613458A TW104130021A TW104130021A TW201613458A TW 201613458 A TW201613458 A TW 201613458A TW 104130021 A TW104130021 A TW 104130021A TW 104130021 A TW104130021 A TW 104130021A TW 201613458 A TW201613458 A TW 201613458A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic device
- dissipation plate
- heat dissipation
- frame
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462053201P | 2014-09-21 | 2014-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201613458A true TW201613458A (en) | 2016-04-01 |
TWI558306B TWI558306B (zh) | 2016-11-11 |
Family
ID=55527152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104130021A TWI558306B (zh) | 2014-09-21 | 2015-09-11 | 電子裝置與散熱板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9625215B2 (zh) |
CN (1) | CN105451513B (zh) |
TW (1) | TWI558306B (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9568255B2 (en) * | 2014-04-21 | 2017-02-14 | Htc Corporation | Electronic device |
US9836100B2 (en) * | 2014-10-15 | 2017-12-05 | Futurewei Technologies, Inc. | Support frame with integrated phase change material for thermal management |
US9468086B1 (en) * | 2015-04-03 | 2016-10-11 | Motorola Soultions, Inc. | Electronic device including an externally-mounted heat pipe |
EP3307036B1 (en) | 2015-06-04 | 2021-08-11 | Huawei Technologies Co., Ltd. | Mobile terminal and heat dissipation shielding structure |
US10694641B2 (en) | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
US11543188B2 (en) * | 2016-06-15 | 2023-01-03 | Delta Electronics, Inc. | Temperature plate device |
US11306974B2 (en) | 2016-06-15 | 2022-04-19 | Delta Electronics, Inc. | Temperature plate and heat dissipation device |
CN105932828A (zh) * | 2016-07-10 | 2016-09-07 | 襄阳华博士新能源科技有限公司 | 一种设有导热管的电机 |
CN107889422A (zh) * | 2016-09-29 | 2018-04-06 | 台达电子工业股份有限公司 | 热管结构 |
US10619941B2 (en) | 2016-09-29 | 2020-04-14 | Delta Electronics, Inc. | Heat pipe structure |
KR102660510B1 (ko) * | 2016-11-23 | 2024-04-24 | 삼성전자주식회사 | 열을 흡수하는 증기(상변화) 챔버를 포함하는 전자 장치 |
KR102617349B1 (ko) | 2016-12-02 | 2023-12-26 | 삼성전자주식회사 | 인쇄회로기판, 및 이를 가지는 솔리드 스테이트 드라이브 장치 |
EP3554054A4 (en) * | 2016-12-07 | 2020-06-17 | LG Electronics Inc. -1- | MOBILE DEVICE |
CN106802484A (zh) * | 2016-12-09 | 2017-06-06 | 华勤通讯技术有限公司 | 一种虚拟现实头盔 |
CN106887419B (zh) * | 2017-02-27 | 2019-06-11 | 华为技术有限公司 | 蒸气腔连体散热器及电子装置 |
WO2018157545A1 (zh) * | 2017-03-02 | 2018-09-07 | 华为技术有限公司 | 导热部件和移动终端 |
CN109219307B (zh) * | 2017-06-30 | 2021-08-17 | 深圳富泰宏精密工业有限公司 | 散热结构及具有该散热结构的电子装置 |
US11031312B2 (en) | 2017-07-17 | 2021-06-08 | Fractal Heatsink Technologies, LLC | Multi-fractal heatsink system and method |
CN109599375A (zh) * | 2017-09-30 | 2019-04-09 | 京东方科技集团股份有限公司 | 用于电路板的散热件以及应用其的显示面板 |
CN109697994A (zh) * | 2017-10-20 | 2019-04-30 | 神讯电脑(昆山)有限公司 | 散热外壳及具有此散热外壳的插拔式电子装置 |
US20190234691A1 (en) * | 2018-01-26 | 2019-08-01 | Taiwan Microloops Corp. | Thermal module |
CN108770292B (zh) * | 2018-06-11 | 2020-09-04 | Oppo广东移动通信有限公司 | 一种电子设备及散热组件 |
CN108770295A (zh) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | 一种电子设备及散热组件 |
US11143460B2 (en) * | 2018-07-11 | 2021-10-12 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
US10999952B1 (en) * | 2020-01-02 | 2021-05-04 | Taiwan Microloops Corp. | Vapor chamber and manufacturing method thereof |
WO2022082067A1 (en) * | 2020-10-16 | 2022-04-21 | Honeywell International Inc. | Novel heat pipe configurations |
CN112351643B (zh) * | 2020-10-21 | 2023-03-31 | 江西艾普若科技有限责任公司 | 包括散热结构的移动终端 |
CN114466557B (zh) * | 2021-08-16 | 2023-04-11 | 荣耀终端有限公司 | 电子设备的壳体、电子设备以及电子设备的壳体制造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW452642B (en) * | 1999-09-07 | 2001-09-01 | Furukawa Electric Co Ltd | Wick, plate type heat pipe and container |
US6418017B1 (en) | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6648063B1 (en) | 2000-04-12 | 2003-11-18 | Sandia Corporation | Heat pipe wick with structural enhancement |
US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
JP4458157B2 (ja) | 2007-11-29 | 2010-04-28 | ソニー株式会社 | 電子部品の放熱構造及び表示装置 |
US20090323276A1 (en) * | 2008-06-25 | 2009-12-31 | Mongia Rajiv K | High performance spreader for lid cooling applications |
US8305761B2 (en) * | 2009-11-17 | 2012-11-06 | Apple Inc. | Heat removal in compact computing systems |
US8159819B2 (en) * | 2010-05-14 | 2012-04-17 | Xfx Creation Inc. | Modular thermal management system for graphics processing units |
CN102955537B (zh) | 2011-08-24 | 2015-04-29 | 神讯电脑(昆山)有限公司 | 热传模块与电子装置的启动方法 |
TWM463971U (zh) * | 2012-11-30 | 2013-10-21 | Inhon Internat Co Ltd | 電子裝置 |
TWM459692U (zh) * | 2013-05-17 | 2013-08-11 | Chaun Choung Technology Corp | 具有散熱結構的手持通訊裝置 |
CN203327470U (zh) * | 2013-07-23 | 2013-12-04 | 奇鋐科技股份有限公司 | 手持式行动装置的散热结构 |
TWM469525U (zh) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | 手持式行動裝置之散熱結構 |
TWM469730U (zh) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | 散熱結構及具有該散熱結構之手持式電子裝置 |
-
2015
- 2015-09-11 TW TW104130021A patent/TWI558306B/zh active
- 2015-09-11 CN CN201510575793.4A patent/CN105451513B/zh active Active
- 2015-09-11 US US14/850,964 patent/US9625215B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160088769A1 (en) | 2016-03-24 |
CN105451513B (zh) | 2018-11-09 |
CN105451513A (zh) | 2016-03-30 |
TWI558306B (zh) | 2016-11-11 |
US9625215B2 (en) | 2017-04-18 |
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