TW201611166A - 具有光罩之可蝕刻多種深度的雷射蝕刻系統 - Google Patents

具有光罩之可蝕刻多種深度的雷射蝕刻系統 Download PDF

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Publication number
TW201611166A
TW201611166A TW104130127A TW104130127A TW201611166A TW 201611166 A TW201611166 A TW 201611166A TW 104130127 A TW104130127 A TW 104130127A TW 104130127 A TW104130127 A TW 104130127A TW 201611166 A TW201611166 A TW 201611166A
Authority
TW
Taiwan
Prior art keywords
etching
laser
workpiece
laser pulses
flux
Prior art date
Application number
TW104130127A
Other languages
English (en)
Chinese (zh)
Inventor
馬修Ｅ 索特
布萊恩Ｍ 爾文
尼可拉斯Ａ 波羅莫夫
克里斯托弗Ｌ 泰斯勒
Original Assignee
蘇斯微科光電系統股份有限公司
國際商業機器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘇斯微科光電系統股份有限公司, 國際商業機器股份有限公司 filed Critical 蘇斯微科光電系統股份有限公司
Publication of TW201611166A publication Critical patent/TW201611166A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48—Protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Drying Of Semiconductors (AREA)
TW104130127A 2014-09-11 2015-09-11 具有光罩之可蝕刻多種深度的雷射蝕刻系統 TW201611166A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/483,321 US20160074968A1 (en) 2014-09-11 2014-09-11 Laser etching system including mask reticle for multi-depth etching

Publications (1)

Publication Number Publication Date
TW201611166A true TW201611166A (zh) 2016-03-16

Family

ID=55453886

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130127A TW201611166A (zh) 2014-09-11 2015-09-11 具有光罩之可蝕刻多種深度的雷射蝕刻系統

Country Status (7)

Country Link
US (1) US20160074968A1 (ja)
EP (1) EP3191250A4 (ja)
JP (1) JP2017528917A (ja)
KR (1) KR20170046793A (ja)
CN (1) CN107000116A (ja)
TW (1) TW201611166A (ja)
WO (1) WO2016039881A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2944413A1 (de) * 2014-05-12 2015-11-18 Boegli-Gravures S.A. Vorrichtung zur Maskenprojektion von Femtosekunden- und Pikosekunden- Laserstrahlen mit einer Blende, einer Maske und Linsensystemen
CN108747032A (zh) * 2018-06-20 2018-11-06 君泰创新（北京）科技有限公司 一种电池片除膜方法及系统
KR102217194B1 (ko) * 2018-10-16 2021-02-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN110480257B (zh) * 2019-07-12 2020-05-19 江苏长龄液压股份有限公司 一种油缸的制造工艺
KR102475755B1 (ko) * 2019-10-02 2022-12-09 에이피시스템 주식회사 칩 전사 방법 및 장치
US11646293B2 (en) * 2020-07-22 2023-05-09 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure and method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684436A (en) * 1986-10-29 1987-08-04 International Business Machines Corp. Method of simultaneously etching personality and select
JPS63136618A (ja) * 1986-11-28 1988-06-08 Sony Corp エネルギ−照射方法
JP3509129B2 (ja) * 1993-06-25 2004-03-22 松下電器産業株式会社 レーザ加工装置
JP3635701B2 (ja) * 1994-12-02 2005-04-06 松下電器産業株式会社 加工装置
JPH09207343A (ja) * 1995-11-29 1997-08-12 Matsushita Electric Ind Co Ltd レーザ加工方法
JP3395621B2 (ja) * 1997-02-03 2003-04-14 イビデン株式会社 プリント配線板及びその製造方法
CN1294788C (zh) * 1997-12-11 2007-01-10 伊比登株式会社 多层印刷电路板的制造方法
US6919162B1 (en) * 1998-08-28 2005-07-19 Agilent Technologies, Inc. Method for producing high-structure area texturing of a substrate, substrates prepared thereby and masks for use therein
JP3012926B1 (ja) * 1998-09-21 2000-02-28 工業技術院長 透明材料のレーザー微細加工法
CN1111110C (zh) * 1999-12-14 2003-06-11 中国科学院力学研究所 激光雕刻版辊的系统及雕刻方法
WO2001071791A1 (en) * 2000-03-21 2001-09-27 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
JP2005095936A (ja) * 2003-09-25 2005-04-14 Matsushita Electric Ind Co Ltd レーザ加工装置及びレーザ加工工法
WO2007062130A1 (en) * 2005-11-22 2007-05-31 J.P. Sercel Associates Inc. System and method for laser machining of three-dimensional structures
US20080047940A1 (en) * 2006-08-28 2008-02-28 Xinghua Li Article with multiple surface depressions and method for making the same
US8420978B2 (en) * 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
US8183496B2 (en) * 2008-12-30 2012-05-22 Intel Corporation Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation
US8557683B2 (en) * 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
US9059254B2 (en) * 2012-09-06 2015-06-16 International Business Machines Corporation Overlay-tolerant via mask and reactive ion etch (RIE) technique
GB2507542B (en) * 2012-11-02 2016-01-13 M Solv Ltd Apparatus and Method for forming fine scale structures in the surface of a substrate to different depths

Also Published As

Publication number Publication date
KR20170046793A (ko) 2017-05-02
CN107000116A (zh) 2017-08-01
EP3191250A4 (en) 2018-07-04
EP3191250A1 (en) 2017-07-19
WO2016039881A1 (en) 2016-03-17
US20160074968A1 (en) 2016-03-17
JP2017528917A (ja) 2017-09-28

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