TW201606916A - Conveying apparatus - Google Patents

Abstract

The subject of the present invention is to provide a conveying apparatus capable of increasing operation performance. The solution means is a conveying apparatus conveying a processed object installed on a ring-like frame through a glue tape adhered to the backside. It is characterized by comprising a conveying arm, a conveying pickup installed on the conveying arm and a moving means operable to move the conveying pickup. The conveying pickup includes a supporting component installed on the conveying arm, at least a pair of first attracting pads having first attracting-holding faces for attracting and holding a first ring-like frame while the pair of first attracting pads is installed on the supporting component and separated by a distance of a first diameter of the first ring-like frame, and at least a pair of second attracting pads having second attracting-holding faces for attracting and holding a second ring-like frame while the pair of second attracting pads is installed on the supporting component and separated by a distance of a second diameter of the second ring-like frame longer than the first diameter, wherein the first attracting-holding faces are positioned above the second attracting-holding faces.

Description

Transport device Field of invention

The present invention relates to a conveying apparatus for conveying a workpiece to be attached to an annular frame through a tape.

Background of the invention

For processing devices such as cutting devices and laser processing devices, in order to be able to perform the processing for the entire purpose or to facilitate the handling, the back side of the wafer is adhered to the adhesive tape which adheres the outer peripheral portion to the annular frame. The frame unit is formed on the dicing tape, and the cassette is carried into and out of the frame unit in the form of a frame unit, or transported in the processing apparatus.

In the conventional cutting device, the transfer head of the transport device is attached to the support member so as to be capable of holding and holding the annular frame in accordance with the size of the annular frame for φ 6 inches and φ 8 inches. The position of the adsorption pad is changed.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-086543

Summary of invention

In the transport apparatus mounted on a processing apparatus such as a conventional cutting apparatus or a laser processing apparatus, the mounting position of the adsorption pad can be changed in accordance with the size of the annular frame. However, it is time-consuming and labor-intensive to change the mounting position of the adsorption pad in response to the size of the annular frame of the frame unit.

The present invention has been made in view of the above problems, and an object thereof is to provide a conveying apparatus capable of improving workability.

The conveying device according to the present invention is a conveying device for conveying a workpiece to be attached to an annular frame through an adhesive tape adhered to the back surface. It is characterized in that it includes a transfer arm, a transfer head mounted on the transfer arm, and a moving means for moving the transfer head, the transfer head including a support member attached to the transfer arm to correspond to a first diameter The first diameter of the annular frame is separated by a distance, and the at least one pair of first adsorption pads having the first adsorption holding surface that adsorbs and holds the first annular frame are mounted on the support member, and correspondingly have The second diameter of the second annular frame of the second diameter larger than the first diameter is separated by a distance, and at least one of the second adsorption holding surfaces of the second annular frame that is attached to the support member is adsorbed and held by the second annular frame For the second adsorption pad, and the first adsorption retention surface is located above the second adsorption retention surface.

According to the conveying device provided by the present invention, since it is not necessary to The work of changing the position of the adsorption pad in response to the frame size of the frame unit can improve the workability.

2‧‧‧Cutting device

4‧‧‧Operator panel

6‧‧‧Display screen

8‧‧‧wafer box

9‧‧‧Facsimile lifts

10‧‧‧ Moving in and out of the unit

11‧‧‧Semiconductor wafer

11a‧‧‧ wafer surface

12‧‧‧ temporary area

13‧‧‧ cutting road

14‧‧‧ Positioning agency

15‧‧‧ components

16‧‧‧Rolling conveyor

17‧‧‧Frame unit

18‧‧‧Working table

20‧‧‧ fixture

22‧‧‧ calibration unit

24‧‧‧ camera unit

26‧‧‧Cutting unit

28‧‧‧ Spindle

30‧‧‧Cutter

32‧‧‧Transporting device

34‧‧‧Rotary cleaning unit

36‧‧‧Transport arm

38‧‧‧Removing head

40‧‧‧ cylinder

41‧‧‧ piston rod

42‧‧‧ Block

44‧‧‧Support members

46‧‧‧First support arm

48‧‧‧second support arm

50‧‧‧First adsorption pad

50a‧‧‧First adsorption holding surface

50b, 52b‧‧‧Adsorption height

52‧‧‧Second adsorption pad

52a‧‧‧Second adsorption holding surface

54, 58‧‧‧Electromagnetic switching valve

56‧‧‧Attraction source

60‧‧‧moving means

F‧‧‧Ring frame

F1‧‧‧ first ring frame

F2‧‧‧second ring frame

T‧‧‧ cutting tape

Fig. 1 is a perspective view of a cutting device including a conveying device of the present invention.

2 is a front side perspective view of a semiconductor wafer.

3 is a perspective view of a frame unit that supports a wafer in an annular frame through a dicing tape.

Fig. 4 is a perspective view of the conveying device according to the embodiment of the present invention.

Fig. 5 is a partial cross-sectional side view of the conveying device.

Fig. 6(A) is a partial cross-sectional side view showing a frame for transporting φ 6 inches, and Fig. 6(B) is a partial cross-sectional side view showing a frame for transporting φ 8 inches.

Form for implementing the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to Fig. 1, there is shown a perspective view of a cutting apparatus including a conveying apparatus according to an embodiment of the present invention. An operation panel 4 for instructing an operator to input a processing condition or the like to the apparatus is provided on the front side of the cutting device 2. A display screen 6 such as a CRT is provided on the upper portion of the apparatus, and a guidance screen for the operator and an image captured by an imaging unit to be described later can be displayed.

As a semiconductor wafer to be cut by the cutting device 2 (hereinafter, simply referred to as a wafer) 11, as shown in FIG. 2, for example, a silicon wafer having a thickness of 700 μm is formed, and plural numbers are formed on the surface 11a. The strip cutting lane (divided line) 13 is formed in a lattice shape and is divided by a plurality of cutting lanes 13 An element 15 such as an IC or an LSI is formed in each of the areas.

As shown in FIG. 3, the wafer 11 is formed by the frame unit 17 in a state in which the back surface is adhered to the dicing tape T as an adhesive tape which is adhered to the annular frame F at the outer peripheral portion, and then the plurality of sheets are formed. The frame unit 17 is housed in the wafer cassette 8 shown in FIG. The wafer cassette 8 is placed on a wafer cassette elevator 9 that can be moved up and down.

After the wafer cassette 8 placed on the wafer cassette elevator 9, the frame unit 17 before cutting is carried out from the wafer cassette 8, and the frame unit 17 after the cutting is carried into the wafer cassette 8 is carried out. Enter unit 10.

Between the wafer cassette 8 and the carry-in/out unit 10, a temporary area 12 as a region for temporarily loading and unloading the frame unit 17 for loading and unloading is provided, and in the temporary area 12, the frame unit 17 is placed at a fixed position. Positioning mechanism 14.

In the vicinity of the temporary area 12, the bobbin type conveying device 16 that adsorbs and transports the frame unit 17 is disposed, and the frame unit 17 that is carried out and positioned to the temporary area 12 is adsorbed by the conveying device 16 to be conveyed. It is positioned on the work chuck 18 that has been positioned at the home position and is held by the work chuck 18.

The work chuck 18 is configured to be rotatable and moved back and forth in the X-axis direction by a machining feed mechanism (not shown), and is disposed above the movement path of the work chuck 18 in the X-axis direction to detect the wafer 11 The calibration unit 22. 20 for the area to be cut is a jig that clamps the annular frame F of the frame unit 17.

The calibration unit 22 is provided to take a picture of the surface of the wafer 11 Like the unit 24, the area for cutting can be detected by image processing such as pattern matching based on the image taken by the shooting. The image obtained by the camera unit 24 can be displayed on the display screen 6.

On the left side of the calibration unit 22, a cutting unit 26 that performs cutting processing on the wafer 11 held on the working chuck 18 is disposed. The cutting unit 26 is configured integrally with the calibration unit 22, and moves the two in the Y-axis direction and the Z-axis direction in conjunction with each other.

The cutting unit 26 is configured by attaching a cutting blade 30 having a cutting edge on the outer circumference to a front end portion of the main shaft 28 that is rotationally driven by a motor, and is movable in the Y-axis direction and the Z-axis direction. The cutter 30 is an extension line in the X-axis direction of the imaging unit 24. The movement of the cutting unit 26 in the Y-axis direction is achieved by an indexing feed mechanism not shown.

34 is a spin cleaning unit for washing the wafer 11 that has finished the cutting process. When the cutting process of the wafer 11 is completed, the work chuck 18 returns to the home position, and the suction of the work chuck 18 is released. After holding and the jig 20, the frame unit 17 can be conveyed to the spin cleaning unit 34 through the transport device 32, and the spin cleaning unit 34 performs spin cleaning and spin drying.

Next, a conveying device 32 according to an embodiment of the present invention will be described in detail with reference to Figs. 4 to 6 . Referring to Figure 4, a perspective view of the transport device 32 is shown. The transfer arm 36 of the transport device 32 is moved in the Y-axis direction by the moving means 60.

A transfer head 38 that is movable in the vertical direction is attached to the front end portion of the transfer arm 36. That is, as shown most clearly in Fig. 5, the cylinder 40 is mounted on the lower surface of the front end of the transfer arm 36, and the piston of the cylinder 40 is mounted. The front end of the rod 41 is coupled to a block 42 that is fixed to the support member 44, wherein the support member 44 is elongated in the Y-axis direction of the transfer head 38. When the cylinder 40 is actuated, the piston rod 41 is extended or contracted, and the support member 44 is moved in the vertical direction in response to this.

On the support member 44, a pair of support arms 46 separated by a distance corresponding to the diameter (first diameter) of the annular frame F1 for φ 6 inches are integrally joined, and further, corresponding to φ 8 A pair of support arms 48 separated by a distance of a diameter (a second diameter larger than the first diameter) of the annular frame F2 for the inch is integrally coupled. Here, the diameter of the annular frame F refers to the diameter of the central portion of the annular frame F in the width direction.

A first adsorption pad 50 having a first adsorption holding surface 50a is attached to both end portions of each support arm 46, and a second adsorption pad 52 having a second adsorption holding surface 52a is attached to both end portions of each support arm 48. .

As shown in FIG. 5, the adsorption pad 50 is placed in such a manner that the height position 50b of the adsorption holding surface 50a of the first adsorption pad 50 is located above the height position 52b of the adsorption holding surface 52a of the second adsorption pad 52. 52 are each mounted on the first support arm 46 and the second support arm 48.

As shown in FIG. 4, the four first adsorption pads 50 are connected to the suction source 56 through the electromagnetic switching valve 54, and the four second adsorption pads 52 are connected to the suction source 56 through the electromagnetic switching valve 58.

Next, a method of using the transport device 32 will be described with reference to Fig. 6 . When the first annular frame F1 for supporting the wafer 11 of φ 6 inches is transported, as shown in FIG. 6(A), the electromagnetic switching valve 54 is switched to the conductive position to connect the first adsorption pad 50 to The source 56 is attracted and the first ring is taken by the first adsorption pad 50 The frame F1 is adsorbed and held, and the φ 6 inch wafer 11 supported by the dicing tape T on the first annular frame F1 is conveyed by moving the transfer arm 36 by the moving means 60.

At this time, since the outer diameter of the first annular frame F1 is smaller than the distance between the second adsorption pads 52 and 52 which are separated in the Y-axis direction, the second adsorption pad 52 can be prevented from interfering with the first ring. In the case of the frame F1, the first annular frame F1 is sucked and held by the first adsorption pad 50.

On the other hand, when the second annular frame F2 for supporting the wafer 11 of φ 8 inches is transported, the electromagnetic switching valve 54 is switched to the off position, and the electromagnetic switching valve 58 is switched to the on position. The second adsorption pad 52 is coupled to the attraction source 56.

Thereby, as shown in FIG. 6(B), the second annular frame F2 supporting the wafer 11 of φ 8 inches can be adsorbed and held by the second adsorption pad 52. At this time, since the adsorption holding surface 50a of the first adsorption pad 50 is located above the adsorption holding surface 52a of the second adsorption pad 52, when the second annular frame F2 is adsorbed and held by the second adsorption pad 52, An adsorption pad 50 does not cause interference.

In the above description, the transfer head 38 is applied to the conveying device 32. However, the winding type conveying device 16 may have the same mechanism as the conveying head 38, and the support φ 6 may be selectively supported. The first annular frame F1 of the inch wafer 11 and the second annular frame F2 supporting the φ 8 inch wafer 11 are adsorbed and held.

In the conveying apparatus of the above-described embodiment, the annular frame F1 for φ 6 inches and the annular frame F2 of φ 8 inches are adsorbed and protected. The present invention is not limited to the case of a ring frame for supporting φ 6 inches and φ 8 inches, and selectively adsorbing and holding two annular frames having different diameters. Can be used in all.

Further, in the above-described embodiment, the case where the conveying means of the present invention is applied to the cutting device will be described. However, the present invention is not limited thereto, and the laser beam of the workpiece is supported by the annular frame through the dicing tape. The same can be applied to other processing apparatuses such as processing apparatuses.

11‧‧‧Semiconductor wafer

32‧‧‧Transporting device

36‧‧‧Transport arm

38‧‧‧Removing head

44‧‧‧Support members

50‧‧‧First adsorption pad

52‧‧‧Second adsorption pad

F1‧‧‧ first ring frame

F2‧‧‧second ring frame

T‧‧‧ cutting tape

Claims (1)

A conveying device for conveying a workpiece to be attached to an annular frame through a tape adhered to the back surface, characterized in that it includes: a transfer arm; and a transfer head mounted on the transfer arm; a moving means for moving the transfer head, the transfer head having: a support member attached to the transfer arm; and being attached to the first diameter of the first annular frame having the first diameter At least one pair of first adsorption pads on the support member having a first adsorption retention surface that adsorbs and holds the first annular frame; and the second second corresponding annular frame having a second diameter greater than the first diameter The distance between the diameters is separated, and the at least one pair of second adsorption pads having the second adsorption holding surface that adsorbs and holds the second annular frame are mounted on the support member, and the first adsorption holding surface is located at a ratio The second adsorption retains the surface above.