TWI654046B - Cutting device - Google Patents

Abstract

An object of the present invention is to provide a cutting apparatus including an insulating base having low cost and high rigidity. The solution is a cutting device comprising: a working clamping table having a holding surface for holding a workpiece; and a cutting assembly for cutting a workpiece held by the working clamping table with a cutting cutter, the cutting assembly is opposed to the working clamp The table is moved relative to the cutting member in the cutting direction, and the cutting blade is brought into contact with the surface of the working table to transmit the electrical conduction to the setting component of the reference position in the cutting direction. The working clamp includes a body portion having conductivity of a portion that is flush with the holding surface, and an insulating base that supports the body portion. The insulating base is insulated by a ceramic coating film.

Description

Cutting device Field of invention

The present invention relates to a general cutting apparatus, and more particularly to a support structure for supporting a body portion of a work chuck when the cutter is disposed.

Background of the invention

A semiconductor wafer (hereinafter, simply referred to as a wafer) in which a large number of components such as an IC and an LSI are formed on a surface and divided into a predetermined line (street) is used as a grinding device After grinding the back surface and processing it to a predetermined thickness, it is divided into individual components by cutting a predetermined dividing line by a cutting device (cutting device), and the divided components are widely used in various electronic devices such as mobile phones and personal computers. on.

The cutting device includes a working clamping table, a cutting assembly and a cut-in feed assembly. The working clamping table is used for holding a wafer, the cutting assembly supports a spindle equipped with a cutting cutter to be rotatable, and the cutting cutter is used for cutting a wafer held by the working clamping table, and the cutting feed component can be The cutting assembly is moved relative to the working carriage in the direction of the cut.

In this type of cutting device, when a new cutter is attached to the spindle, it is necessary to perform the setting operation for detecting the origin position (reference position) of the cutter. The cutter is arranged to make the cutting blade contact the upper surface of the working clamping table (the conductive portion flush with the holding surface), and form electrical conduction to detect the height position of the upper surface of the working clamping table and the origin position of the cutting blade. .

Since the closed circuit connecting the cutter, the main shaft, and the work chuck is formed by the electrical conduction, the upper clamp must be insulated from other conductive parts during installation. Therefore, the main body portion (frame body) of the conventional work chuck is supported by an insulating base formed of alumina ceramic or the like.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-238928

Summary of invention

Since the conventional insulating base that supports the body portion of the work chuck is formed of alumina ceramics, it has a feature of sufficient insulation and little deformation due to temperature changes. However, the insulating base formed of alumina ceramics is a relatively expensive part and has a fear of being damaged by impact.

The present invention has been made in view of such problems, and an object of the invention is to provide a cutting apparatus including an insulating base having low cost and high rigidity.

A cutting apparatus according to the present invention includes: a working chuck having a holding surface for holding a workpiece, and cutting by a cutter a cutting assembly for the workpiece to be held by the clamping table, a cutting feed assembly for moving the cutting assembly relative to the working clamping frame in a cutting direction, and contacting the cutting blade with the surface of the working clamping table to conduct electrical conduction A setting component that detects the reference position of the cutting direction. The cutting device is characterized in that the working chuck includes a body portion having an electrical conductivity of a portion that is flush with the holding surface, and an insulating base that supports the body portion. The insulating base is insulated by a ceramic coating film.

Preferably, the insulating base is formed by applying a stainless steel coating to the stainless steel. Preferably, the working table is formed by a dressing table for holding the trimming plate of the dressing cutter.

The cutting device of the present invention is used as an insulating base for supporting the working clamp, and the surface of the stainless steel is ceramic coated to treat the surface into an insulating base, so that low cost and high rigidity can be obtained. The effect of the insulating base.

2‧‧‧Cutting device

4‧‧‧Operator panel

6‧‧‧Display screen

8‧‧‧ Wafer

9‧‧‧Wrape lifts

10‧‧‧ Moving in and out of the unit

11‧‧‧Semiconductor wafer (wafer)

12‧‧‧ temporary area

14‧‧‧ aligning agencies

16‧‧‧Transport unit

18‧‧‧Working table

20‧‧‧ fixture

22‧‧‧ calibration unit

24‧‧‧ camera unit

26‧‧‧Cutting unit

28‧‧‧ Spindle

30‧‧‧Cutter

32‧‧‧Transport unit

34‧‧‧Rotary cleaning unit

36‧‧‧Renovation

38‧‧‧ body part (frame)

38a‧‧‧Setting Department

40‧‧‧Attraction and Maintenance Department

42‧‧‧Base

44‧‧‧Motor

46‧‧‧Insulated base

50, 58‧‧‧ ceramic coating

52‧‧‧ pillar

54‧‧‧Insulated base

60, 70‧‧‧Set components

62‧‧‧ switch

64, 72‧‧‧ Closed circuit

66‧‧‧Power supply

68‧‧‧Ammonia

A, B‧‧‧ contacts

F‧‧‧Ring frame

T‧‧‧ cutting tape

X, Y, Z‧‧ Direction

Fig. 1 is a perspective view of a cutting device according to an embodiment of the present invention.

Figure 2 is a partial cross-sectional side view showing the arrangement of the work chuck.

Form for implementing the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to Fig. 1, there is shown a perspective view of a cutting apparatus including an insulating base according to an embodiment of the present invention. An operation panel 4 for an operator to input an instruction to the apparatus such as a processing condition is provided on the front side of the cutting device 2. On the top of the device There is a display screen 6 such as a CRT, and it is possible to display a guidance screen for the operator and an image captured by an imaging unit to be described later.

A semiconductor wafer (hereinafter sometimes simply referred to as a wafer) 11 is attached to the dicing tape T mounted on the annular frame F, and then the plurality of sheets are stored in the wafer cassette 8. The wafer cassette 8 is placed on the wafer cassette elevator 9 which can be moved up and down.

After the wafer cassette 8 is placed, the wafer 11 before the cutting is carried out from the wafer cassette 8 and the wafer after cutting is carried into the loading/unloading unit 10 of the wafer cassette 8.

A temporary region 12 is provided between the wafer cassette 8 and the loading/unloading unit 10 as a region in which the wafer 11 to be loaded and discharged is temporarily placed, and the wafer 11 is aligned and fixed in the temporary region 12. Alignment mechanism 14.

In the vicinity of the temporary area 12, a transfer unit 16 having a rotating arm that can be sucked by the wafer 11 for transport and transported to the temporary area 12 to perform the aligned wafer 11 is disposed. The conveyance unit 16 is sucked and conveyed to the work chuck 18, and is sucked and held by the work chuck 18.

The work chuck 18 is configured to be reciprocally movable in the X-axis direction by a rotary feed mechanism (not shown), and the detection wafer 11 is disposed above the movement path of the work chuck 18 in the X-axis direction. The calibration unit 22 for cutting the area is a jig for holding the annular frame F.

The calibration unit 22 is provided with an imaging unit 24 that can capture the surface of the wafer 11, and can process the area for cutting based on the image obtained by the imaging, through pattern matching or the like. Can be taken by the camera unit 24 The resulting image is displayed on the display screen 6.

On the left side of the calibration unit 22, a cutting unit 26 capable of cutting the wafer 11 held by the working chuck 18 is disposed. The cutting unit 26 is configured integrally with the calibration unit 22, and moves the two in the Y-axis direction and the Z-axis direction in conjunction with each other.

The cutting unit 26 is configured by attaching a cutter 30 having a blade on the outer circumference to the front end of the rotatable main shaft 28, and is movable in the Y-axis direction and the Z-axis direction. The cutter 30 is located on an extension line of the imaging unit 24 in the X-axis direction. The movement of the cutting unit 26 in the Y-axis direction is achieved by an indexing feed mechanism not shown.

34 is a spin cleaning unit for washing the wafer 11 that has been subjected to the cutting process, and the wafer 11 that has been subjected to the cutting process is transported to the spin cleaning unit 34 through the transport unit 32, and is rotated by the spin cleaning unit 34. Wash and spin dry.

Adjacent to the work chuck 18, a dressing table 36 is provided, which is used to attract the trimming plate holding the dressable cutter 30. The dressing table 36 is formed of a metal such as stainless steel, and has a suction groove formed on the surface thereof to attract and hold the trimming plate.

Next, the arrangement of the work chuck 18 and the dressing table 36 will be described with reference to Fig. 2 . The work chuck 18 is a main body portion (frame body) 38 formed of SUS, and a suction holding portion 40 formed of a porous member such as porous ceramic. The surface of the suction holding portion 40 is formed flush with the surface 38a of the body portion 38 as a setting portion.

The working clamp 18 is transmitted through a motor 44 mounted on the base 42. Driven by rotation. Further, the work chuck 18 is mounted on an insulating base 46 disposed on the motor 44. The insulating base 46 is made of a metal such as SUS, and the surface of the insulating base 46 is insulated by a ceramic coating film as indicated by reference numeral 50.

On the other hand, the dressing table 36 is mounted on the insulating base 54, and the insulating base 54 is fixed to the upper end portion of the stay 52 that is erected on the base 42. The insulating base 54 is made of a metal such as SUS, and the surface of the insulating base 54 is insulated by a ceramic coating film as indicated by reference numeral 58.

The ceramic coating of the insulating base 46 supporting the working chuck 18 is carried out by thermal spraying of ceramic. Similarly, the ceramic coating of the insulating pedestal 54 supporting the conditioning station 36 is also performed by thermal spraying of ceramic.

Next, the setting operation of the cutter 30 with respect to the work chuck 18 will be described. When this setting is made, the switch 62 is switched to the contact A side. Further, the cutting feed assembly for moving the cutting unit 26 in the Z-axis direction is actuated, and the rotating cutter 30 is lowered to contact the setting portion 38a of the work chuck 18.

Thereby, a closing circuit 64 that connects the cutting blade 30, the main shaft 28, and the body portion 38 of the working chuck 18 is formed. Since the power source 66 and the ammeter 68 are connected in series in the closed circuit 64, the operator can confirm that the current between the cutter 30 and the working chuck 18 has been observed by the ammeter 68 observing the current flowing through the closed circuit 64. Electrical conduction is formed. The height of the cutting blade 30 when the electrical conduction is formed is detected as the origin position (reference position) in the Z direction, and the origin position can be stored in the memory of the controller of the cutting device 2.

The setting assembly 60 of the cutter 30 is opposite to the working clamp 18 The closing circuit 64 formed by the cutting blade 30 contacting the setting portion 38a of the working chuck 18 is formed.

On the other hand, at the time of setting of the cutting blade 30 with respect to the dressing table 36, the switch 62 is switched to the contact B side. Then, the cutting feed assembly is actuated to lower the cutting unit 26, and the rotating cutter 30 is brought into contact with the surface of the dressing table 36.

Thereby, the closed circuit 72 connecting the cutting blade 30, the main shaft 28 and the dressing table 36 is formed, and the current meter 68 can be observed to detect the current flowing through the closing circuit 72, and the cutting blade 30 and the dressing table 36 can be confirmed. Electrical conduction has been established. The height position of the cutting blade 30 in the Z direction at this time can be stored in the memory of the controller as the origin position of the cutting blade 30 with respect to the dressing table 36.

The setting unit 70 of the cutter 30 opposite to the dressing table 36 is constituted by a closing circuit 72 formed by bringing the cutting blade 30 into contact with the dressing table 36.

According to the above-described embodiment, the insulating base 46 supporting the work chuck 18 and the insulating base 54 supporting the dressing table 36 can be formed of a metal such as SUS, and the surface thereof can be insulated by a ceramic coating film, thereby achieving low Insulating bases 46, 54 that are priced and highly rigid.

Claims (3)

A cutting device comprising: a working clamping table having a holding surface for holding a workpiece; and a cutting assembly for cutting a workpiece held by the working clamping table with a cutting cutter, the cutting assembly is opposite to the working clamping table a cutting-in feeding assembly moving in the cutting direction and a setting assembly for contacting the cutting blade to a surface of the working clamping table to transmit a reference position in the cutting direction through electrical conduction, the cutting device being characterized in that the working clamping frame comprises a main body portion having conductivity of the installation portion flush with the holding surface; and a first insulating base supporting the main body portion; the first insulating base is formed by insulating a surface of the metal with a ceramic coating film . The cutting device of claim 1, wherein the first insulating base is formed by applying a ceramic coating to a surface of the stainless steel. The cutting device according to claim 1 or 2, further comprising: a second insulating base disposed adjacent to the working clamping table; and a finishing station mounted on the second insulating base, wherein the second insulating base The surface of the metal is insulated by a ceramic coating film.