TW201605641A - Transparent electroconductive film - Google Patents

Transparent electroconductive film Download PDF

Info

Publication number
TW201605641A
TW201605641A TW104113706A TW104113706A TW201605641A TW 201605641 A TW201605641 A TW 201605641A TW 104113706 A TW104113706 A TW 104113706A TW 104113706 A TW104113706 A TW 104113706A TW 201605641 A TW201605641 A TW 201605641A
Authority
TW
Taiwan
Prior art keywords
layer
refractive index
transparent conductive
high refractive
oxide
Prior art date
Application number
TW104113706A
Other languages
Chinese (zh)
Other versions
TWI554410B (en
Inventor
Hironori Takahashi
Kazunari Tada
Jinichi Kasuya
Kenichiro Hirata
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of TW201605641A publication Critical patent/TW201605641A/en
Application granted granted Critical
Publication of TWI554410B publication Critical patent/TWI554410B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention addresses the problem of providing a transparent electroconductive film having good electroconductivity, uniform transparency across the entire visible light region, and high durability. This transparent electroconductive film has at least a first high refractive index layer, a transparent electroconductive layer, and a second high refractive index layer on a transparent resin support body in the stated order, wherein the transparent electroconductive film is characterized in that the transparent electroconductive layer contains silver, the first high refractive index layer and/or the second high refractive index layer contains zinc sulfide, and the proportion of the number of sulfur atoms contained in the zinc sulfide is equal to or greater than 50 and less than 100 to 100 zinc atoms.

Description

透明導電性薄膜 Transparent conductive film

本發明係關於透明導電性薄膜,更詳細而言係關於具有良好的導電性與透明性,且具有高耐久性之透明導電性薄膜。 The present invention relates to a transparent conductive film, and more particularly to a transparent conductive film which has good conductivity and transparency and has high durability.

近年來,使用透明導電膜於液晶顯示器或電漿顯示器、無機及有機EL(電致發光)顯示器、觸控面板、太陽能電池等之各種裝置。 In recent years, transparent conductive films have been used for various devices such as liquid crystal displays, plasma displays, inorganic and organic EL (electroluminescence) displays, touch panels, and solar cells.

作為構成如此之透明導電膜的材料,已知有金、銀、鉑、銅、銠、鈀、鋁、鉻等之金屬或In2O3、CdO、CdIn2O4、Cd2SnO4、TiO2、SnO2、ZnO、ITO(銦錫氧化物)等之氧化物半導體。 As a material constituting such a transparent conductive film, metals such as gold, silver, platinum, copper, rhodium, palladium, aluminum, chromium, or the like, or In 2 O 3 , CdO, CdIn 2 O 4 , Cd 2 SnO 4 , TiO are known. 2 , an oxide semiconductor such as SnO 2 , ZnO, or ITO (indium tin oxide).

在顯示器用途,於觸控面板型之顯示裝置等,在顯示元件之圖像顯示面上配置有由透明導電膜等所構成之透明導電性薄膜。據此,在透明導電膜,尋求高的光之透過性。於如此之各種顯示裝置,大多使用由光透過性高之ITO所構成之透明導電膜。 In the display application, a transparent conductive film made of a transparent conductive film or the like is disposed on the image display surface of the display element in a touch panel type display device or the like. Accordingly, in the transparent conductive film, high light transmittance is sought. In such various display devices, a transparent conductive film made of ITO having high light transmittance is often used.

近年來,在智慧型手機等之製品群,靜電容 量方式之觸控面板顯示裝置普及,正尋求進一步降低透明導電膜的表面電阻。惟,以往之ITO膜,有無法充分降低表面電阻的問題。 In recent years, in the product group of smart phones, etc., static capacitance The popularity of the touch panel display device of the quantity method is seeking to further reduce the surface resistance of the transparent conductive film. However, the conventional ITO film has a problem that the surface resistance cannot be sufficiently lowered.

因此,正研究將銀的蒸鍍膜作為透明導電膜(例如參照專利文獻1)。又,為了提高透明導電體的光透過性,亦提案有將銀的蒸鍍膜以折射率高之膜(例如由氧化鈮(Nb2O5)、IZO(銦鋅氧化物)、ICO(銦鈰氧化物)、a-GIO(包含鎵.銦及氧之非晶質氧化物)等所構成之膜)挾持(例如參照專利文獻2~4)。進而,提案有將銀的蒸鍍膜以硫化鋅之膜挾持(例如參照非專利文獻1及2)。 Therefore, a vapor deposition film of silver has been studied as a transparent conductive film (see, for example, Patent Document 1). Further, in order to improve the light transmittance of the transparent conductor, a film having a high refractive index of a vapor deposited film of silver (for example, yttrium oxide (Nb 2 O 5 ), IZO (indium zinc oxide), or ICO (indium bismuth) has been proposed. Oxide), a film composed of a-GIO (amorphous oxide containing gallium, indium, and oxygen) is held (for example, refer to Patent Documents 2 to 4). Furthermore, it is proposed to hold the deposited film of silver as a film of zinc sulfide (see, for example, Non-Patent Documents 1 and 2).

將如以上之銀薄膜設置作為透明導電膜的情況作為課題,有因為銀本身之反應性而造成信賴性不足。例如已知有銀易與大氣中之硫化物進行反應而著色。 As a problem in the case where the above silver thin film is provided as a transparent conductive film, there is a lack of reliability due to the reactivity of silver itself. For example, it is known that silver easily reacts with sulfides in the atmosphere to color.

此著色現象在大量的銀中,雖被理解為作為形成硫化銀之被膜於表面而成之現象,但如前述,將銀以蒸鍍等所得之薄膜的形態所利用之透明導電膜中,薄膜所具有之特徵成為顯著且重大之問題。 This coloring phenomenon is understood to be a phenomenon in which a silver sulfide film is formed on the surface of a large amount of silver. However, as described above, a transparent conductive film which is used in the form of a film obtained by vapor deposition or the like is used as a film. The features that are featured become significant and significant issues.

亦即,與大量固體相比較,以蒸鍍或濺鍍法所得之薄膜,係以極為微小之厚度(深度)、與極為顯著之微孔性(Microporous)作為特徵。因此,在大氣中侵入硫化物及銀之各種成分便易擴散於銀薄膜整體,不僅是銀之薄膜構造的界面而且是改質銀薄膜整體。因此,作為透明導電膜的構成構件所要求之特性即導電性、透明性、光學特性之波長均一性全部受損。 That is, the film obtained by vapor deposition or sputtering is characterized by extremely small thickness (depth) and extremely remarkable microporousity as compared with a large amount of solid. Therefore, various components that invade sulfide and silver in the atmosphere are easily diffused throughout the silver film, and are not only the interface of the silver film structure but also the modified silver film as a whole. Therefore, the characteristics required for the constituent members of the transparent conductive film, that is, the wavelength uniformity of conductivity, transparency, and optical characteristics are all impaired.

將銀薄膜作為透明導電層使用時,從確保光透過性的要求,與將鏡子或表面裝飾作為目的的情況相比較,所使用之膜厚由於被限制為更薄,因此上述大氣成分造成之改質的影響特別大。 When a silver thin film is used as the transparent conductive layer, the requirement for ensuring the light transmittance is compared with the case where the mirror or the surface decoration is intended, and the film thickness used is limited to be thinner, so that the above air composition is changed. The qualitative impact is particularly large.

如此,將銀以薄膜的形態使用時,雖說因大氣成分導致之劣化對策必須特別注意,但前述之文獻所代表之以往的方法,主要是著眼放在確保高導電性與透過率,於此,我們所著眼之用以防止如前述之銀薄膜的改質的對策並不足夠。 When silver is used in the form of a film, special measures must be taken to prevent deterioration due to atmospheric components. However, the conventional method represented by the above-mentioned literature mainly focuses on ensuring high conductivity and transmittance. The countermeasures we have taken to prevent the modification of the silver film as described above are not sufficient.

此外,在使用硫化鋅等之硫含有物於挾持銀薄膜之材料的技術中,藉由硫化鋅所包含之硫,透明導電性構件形成過程中,由於銀已硫化,有不僅增大電阻且損害透明性的問題。 Further, in the technique of using a sulfur-containing material such as zinc sulfide in a material for holding a silver thin film, by the sulfur contained in the zinc sulfide, during the formation of the transparent conductive member, since the silver has been vulcanized, there is not only an increase in electrical resistance but also damage. The issue of transparency.

另外,近年來具備觸控面板之信息裝備追求大屏幕化、輕量薄型化的同時,作為必須尋求更進一層畫質的高度、動作精度與反應速度兩者皆成立的結果,高電導率與透明性的重要性已較以往增加許多,進而如智慧型手機等,成為被廣泛使用在民生用途之傾向的結果、耐得住所有溫濕度環境或大氣環境,被強烈要求經過長期使用期間能確保上述導電性與透明性。 In addition, in recent years, the information equipment equipped with the touch panel has been designed to be large-screen, lightweight, and thin, and as a result of having to seek a higher level of image quality, motion accuracy, and reaction speed, both are high conductivity and high conductivity. The importance of transparency has increased a lot compared with the past, and as a result of the tendency to be widely used in people's livelihood, such as smart phones, it is resistant to all temperature and humidity environments or the atmospheric environment, and is strongly required to ensure long-term use. The above conductivity and transparency.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特表2011-508400號公報 [Patent Document 1] Japanese Patent Publication No. 2011-508400

[專利文獻2]日本特開2006-184849號公報 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-184849

[專利文獻3]日本特開2002-15623號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2002-15623

[專利文獻4]日本特開2008-226581號公報 [Patent Document 4] Japanese Patent Laid-Open Publication No. 2008-226581

[非專利文獻] [Non-patent literature]

[非專利文獻1]Xuanjie Liu,et al,(2003).Thin Solid Films 441,200-206 [Non-Patent Document 1] Xuanjie Liu, et al, (2003). Thin Solid Films 441, 200-206

[非專利文獻2]Optically transparent IR reflective heat mirror films of ZnS-Ag-ZnS,Bruce W.Smith,May 1989.Rochester Institute Of Technology Center For Imaging Science [Non-Patent Document 2] Optically transparent IR reflective heat mirror films of ZnS-Ag-ZnS, Bruce W. Smith, May 1989. Rochester Institute Of Technology Center For Imaging Science

本發明係鑑於上述問題、狀況而完成者,該解決課題係提供一種具有良好的導電性與通過可見光區域整體均質之透明性,且具有高耐久性之透明導電性薄膜。 The present invention has been made in view of the above problems and circumstances, and it is an object of the present invention to provide a transparent conductive film having high conductivity and uniform transparency through a visible light region and having high durability.

本發明者們為了解決上述課題,針對上述問題的原因等進行研討的過程中,發現,至少以第1高折射率層、透明導電層及第2高折射率層順序具有之透明導電性薄膜,其特徵為任一者之高折射率層含有硫化鋅,藉由將該硫化鋅所包含之硫原子數的比例減至較鋅原子數更 少,亦即除了於透明導電性薄膜的透明導電層使用銀薄膜,將此銀薄膜自使硫化物等之銀劣化之大氣成分進行保護,同時最適化透明導電性構件在可見光全區域之光透過率之外,並藉由設置適當組成之高折射率層,以解決上述課題,而完成本發明。 In order to solve the above problems, the present inventors have found that at least the first high refractive index layer, the transparent conductive layer, and the second high refractive index layer have a transparent conductive film in the course of the above-mentioned problem. It is characterized in that any of the high refractive index layers contains zinc sulfide, and the ratio of the number of sulfur atoms contained in the zinc sulfide is reduced to more than the number of zinc atoms. In other words, a silver thin film is used in addition to the transparent conductive layer of the transparent conductive film, and the silver thin film is protected from atmospheric components which deteriorate silver such as sulfide, and the transparent conductive member is optimized for light transmission in the entire visible light region. In addition to the rate, the present invention has been accomplished by providing a high refractive index layer of an appropriate composition to solve the above problems.

亦即,有關本發明之上述課題係由以下之手段解決。 That is, the above problems related to the present invention are solved by the following means.

1.一種透明導電性薄膜,其係於透明樹脂支撐體上,至少以第1高折射率層、透明導電層及第2高折射率層順序具有之透明導電性薄膜,其特徵為前述透明導電層含有銀,前述第1高折射率層或前述第2高折射率層之至少任一者為含有硫化鋅之層,相對於鋅原子數100,該硫化鋅所包含之硫原子數的比例為50以上,且未達100。 A transparent conductive film which is a transparent conductive film which is provided on a transparent resin support at least in the order of a first high refractive index layer, a transparent conductive layer and a second high refractive index layer, and is characterized in that said transparent conductive film The layer contains silver, and at least one of the first high refractive index layer or the second high refractive index layer is a layer containing zinc sulfide, and the ratio of the number of sulfur atoms contained in the zinc sulfide to the number of zinc atoms is 100. 50 or more, and less than 100.

2.如第1項之透明導電性薄膜,其中,前述含有硫化鋅之層為第1高折射率層。 2. The transparent conductive film according to Item 1, wherein the layer containing zinc sulfide is a first high refractive index layer.

3.如第1項或第2項之透明導電性薄膜,其中,於前述第1高折射率層與前述透明導電層之間具有第1硫化防止層,該第1硫化防止層係含有氧化物或氮化物。 3. The transparent conductive film according to the first or second aspect, wherein the first vulcanization preventing layer is contained between the first high refractive index layer and the transparent conductive layer, and the first vulcanization preventing layer contains an oxide Or nitride.

4.如第3項之透明導電性薄膜,其中,前述第1硫化防止層係含有氧化鋅或氧化鎵作為前述氧化物。 4. The transparent conductive film according to the third aspect, wherein the first vulcanization preventing layer contains zinc oxide or gallium oxide as the oxide.

5.如第1項之透明導電性薄膜,其中,前述第1高折射率層含有硫化鋅、與氧化物或氮化物,該氧化 物或該氮化物的含量為該第1高折射率層的總體積之5~30體積%的範圍內。 5. The transparent conductive film according to Item 1, wherein the first high refractive index layer contains zinc sulfide, an oxide or a nitride, and the oxidation The content of the substance or the nitride is in the range of 5 to 30% by volume based on the total volume of the first high refractive index layer.

6.如第1項之透明導電性薄膜,其中,前述第1高折射率層係含有硫化鋅與二氧化矽。 6. The transparent conductive film according to Item 1, wherein the first high refractive index layer contains zinc sulfide and cerium oxide.

7.如第1項之透明導電性薄膜,其中,作為高折射率材料,前述第2高折射率層含有選自硫化鋅、二氧化鈦、銦錫氧化物、氧化鋅、氧化鈮、二氧化錫、銦鋅氧化物、鋁鋅氧化物、鎵鋅氧化物、銻錫氧化物、銦鈰氧化物、銦鎵鋅氧化物、氧化鉍、三氧化鎢、氧化銦及包含鎵.銦.及氧之非晶質氧化物中之任一種。 7. The transparent conductive film according to the first aspect, wherein the second high refractive index layer is selected from the group consisting of zinc sulfide, titanium oxide, indium tin oxide, zinc oxide, antimony oxide, and tin dioxide. Indium zinc oxide, aluminum zinc oxide, gallium zinc oxide, antimony tin oxide, indium antimony oxide, indium gallium zinc oxide, antimony oxide, tungsten trioxide, indium oxide and containing gallium. indium. And any one of oxygen amorphous oxides.

8.如第1項之透明導電性薄膜,其中,作為前述高折射率材料,前述第2高折射率層係含有硫化鋅。 8. The transparent conductive film according to Item 1, wherein the second high refractive index layer contains zinc sulfide as the high refractive index material.

9.如第8項之透明導電性薄膜,其中,作為前述高折射率材料,前述第2高折射率層係進一步含有二氧化矽。 9. The transparent conductive film according to Item 8, wherein the second high refractive index layer further contains cerium oxide as the high refractive index material.

10.如第1項之透明導電性薄膜,其中,作為前述高折射率材料,前述第2高折射率層係含有鎵鋅氧化物。 10. The transparent conductive film according to Item 1, wherein the second high refractive index layer contains gallium zinc oxide as the high refractive index material.

11.如第1項之透明導電性薄膜,其中,於前述透明導電層與第2高折射率層之間具有第2硫化防止層,該第2硫化防止層含有氧化物或氮化物。 The transparent conductive film according to the first aspect, wherein the second vulcanization preventing layer is contained between the transparent conductive layer and the second high refractive index layer, and the second vulcanization preventing layer contains an oxide or a nitride.

12.如第11項之透明導電性薄膜,其中,作為前述氧化物,前述第2硫化防止層係含有氧化鋅或鎵鋅氧化物。 The transparent conductive film according to the eleventh aspect, wherein the second vulcanization preventing layer contains zinc oxide or gallium zinc oxide as the oxide.

由本發明之上述手段,可提供一種具有良好的導電性與通過可見光區域整體均質之透明性,且具有高耐久性之透明導電性薄膜。 According to the above-described means of the present invention, it is possible to provide a transparent conductive film having excellent conductivity and transparency which is uniform in the entire visible light region and having high durability.

針對本發明的效果之表現機構~作用機構,雖未臻明確,但推測係如以下般。 Although the performance mechanism to the action mechanism of the present invention has not been clarified, it is presumed to be as follows.

一般而言,以真空製程所形成之薄膜相對於大量固體呈現密度低、且微孔洞之性狀。濺鍍法雖於乾式塗佈手法當中可形成體積比較大之膜,但若與大量固體相比較,還是為低密度。所以可說易引起元素的擴散,據此,即使針對透明導電層的密封設置保護層,推測以密著性以外的觀點足夠實用之膜厚亦存在有上限,其效果受到限定。 In general, films formed by vacuum processes exhibit low density and microvoid properties relative to large amounts of solids. Although the sputtering method can form a relatively large film in the dry coating method, it is low in density compared with a large amount of solid. Therefore, it can be said that the diffusion of the element is likely to occur. Therefore, even if the protective layer is provided for the sealing of the transparent conductive layer, it is presumed that there is an upper limit to the film thickness which is sufficiently practical from the viewpoint of adhesion, and the effect is limited.

本發明者們除了鑑於如此之科學背景之外,為了發現現實上且最大限之導電層改質抑制手段而努力應對中,如以下般進行推論,作為結論,發現本發明的效果而完成本發明。 In addition to the scientific background, the present inventors have made an effort to find a realistic and maximum conductive layer modification suppressing means, and infer as follows, and as a result, the effect of the present invention was found to complete the present invention. .

亦即,大氣中所包含之元素種當中,相對於構成透明導電層之銀,給予最不良影響的是硫成分,若將硫化鋅(ZnS)以相對於化學計量的組成比(硫化鋅所包含之硫原子數的比例相對於鋅元素1相同為1)之缺硫狀態構成於導電層附近,此被暴露於大氣中所包含之含硫的成分時,從大氣成分取得硫(S),且並非從共價鍵的強度進行 再釋出,而是接近化學計量的組成比,亦即藉由作為硫捕捉膜進行作用,雖抑制對含有銀之透明導電膜層的硫成分擴散,但係本發明之效果的表現機構。 That is, among the element species contained in the atmosphere, the sulfur component is most adversely affected with respect to the silver constituting the transparent conductive layer, and if the zinc sulfide (ZnS) is contained in a stoichiometric composition ratio (containing zinc sulfide) The proportion of the number of sulfur atoms is the same as that of the zinc element 1 and the sulfur deficiency state is formed in the vicinity of the conductive layer. When exposed to the sulfur-containing component contained in the atmosphere, sulfur (S) is obtained from the atmospheric component, and Not from the strength of the covalent bond Further, it is released, but is a stoichiometric composition ratio, that is, a mechanism for expressing the effect of the present invention by suppressing the diffusion of the sulfur component to the silver-containing transparent conductive film layer by acting as a sulfur trapping film.

又,於本發明所得之含有硫化鋅之層的折射率,變成非常高之值。由此,藉由適當控制含有硫化鋅之層的膜厚,可顯著緩和藉由銀(Ag)之反射導致透過強度降低的結果。可形成視認性優異且高透明之透明導電性薄膜。 Further, the refractive index of the layer containing zinc sulfide obtained in the present invention becomes a very high value. Thus, by appropriately controlling the film thickness of the layer containing zinc sulfide, the result of a decrease in the transmission strength by reflection of silver (Ag) can be remarkably alleviated. A transparent conductive film which is excellent in visibility and high in transparency can be formed.

100‧‧‧透明導電性薄膜 100‧‧‧Transparent conductive film

1‧‧‧透明樹脂支撐體 1‧‧‧Transparent resin support

2‧‧‧第1高折射率層 2‧‧‧1st high refractive index layer

3‧‧‧透明導電層 3‧‧‧Transparent conductive layer

4‧‧‧第2高折射率層 4‧‧‧2nd high refractive index layer

5a‧‧‧第1硫化防止層 5a‧‧‧1st vulcanization prevention layer

5b‧‧‧第2硫化防止層 5b‧‧‧2nd vulcanization prevention layer

6‧‧‧抗蝕膜 6‧‧‧Resist film

6A‧‧‧去除之抗蝕膜 6A‧‧‧Removed resist film

7‧‧‧遮罩 7‧‧‧ mask

8‧‧‧曝光機 8‧‧‧Exposure machine

EU‧‧‧透明電極單元 EU‧‧‧Transparent electrode unit

a‧‧‧導通區域 A‧‧‧conductive area

b‧‧‧絕緣區域 b‧‧‧Insulated area

[圖1]表示本發明之透明導電性薄膜的層構成之一例之概略截面圖。 Fig. 1 is a schematic cross-sectional view showing an example of a layer configuration of a transparent conductive film of the present invention.

[圖2]表示由本發明之透明導電性薄膜的導通區域及絕緣區域所構成之圖型的一例之模式圖。 Fig. 2 is a schematic view showing an example of a pattern formed by a conduction region and an insulating region of the transparent conductive film of the present invention.

[圖3]表示由本發明之透明導電性薄膜的導通區域及絕緣區域所構成之電極圖型的一例之模式圖。 Fig. 3 is a schematic view showing an example of an electrode pattern composed of a conduction region and an insulating region of the transparent conductive film of the present invention.

[圖4]於本發明之透明導電體表示將電極圖型以微影蝕刻法形成之一例之步驟流程圖。 Fig. 4 is a flow chart showing the steps of forming an electrode pattern by photolithography in the transparent conductor of the present invention.

本發明之透明導電性薄膜係於透明樹脂支撐體上,至少以第1高折射率層、透明導電層及第2高折射率層順序具有之透明導電性薄膜,其特徵為前述透明導電 層含有銀,前述第1高折射率層或前述第2高折射率層之至少任一者為含有硫化鋅之層,相對於鋅原子數100,該硫化鋅所包含之硫原子數的比例為50以上,且未達100。此特徵係從請求項1至請求項12之有關請求項之發明所共通之技術性特徵。 The transparent conductive film of the present invention is a transparent conductive film which is provided on the transparent resin support at least in the order of the first high refractive index layer, the transparent conductive layer and the second high refractive index layer, and is characterized by the transparent conductive film. The layer contains silver, and at least one of the first high refractive index layer or the second high refractive index layer is a layer containing zinc sulfide, and the ratio of the number of sulfur atoms contained in the zinc sulfide to the number of zinc atoms is 100. 50 or more, and less than 100. This feature is a common feature common to the invention of claim 1 from claim 1 to claim 12.

從表現本發明效果的觀點來看,前述含有硫化鋅之層雖為第1高折射率層,但由於得到防止透明導電層之銀的硫化之高度效果故較佳。 From the viewpoint of exhibiting the effects of the present invention, the zinc sulfide-containing layer is preferably a first high refractive index layer, but is preferably obtained by a high degree of effect of preventing vulcanization of silver in the transparent conductive layer.

又,於前述第1高折射率層與前述透明導電層之間具有第1硫化防止層,該第1硫化防止層雖含有氧化物或氮化物,但氧化物或氮化物中之元素結果是以捕集(Trap)的形態來去除僅殘存於腔室內氛圍(Chamber atmosphere)之硫,接著形成含有銀之透明導電層時,由於硫的殘存未成為問題,於良好的氛圍下可形成透明導電層故較佳。 Further, the first vulcanization preventing layer is provided between the first high refractive index layer and the transparent conductive layer, and the first vulcanization preventing layer contains an oxide or a nitride, but the elemental result in the oxide or nitride is The form of trapping removes sulfur remaining only in the chamber atmosphere, and then forms a transparent conductive layer containing silver. Since the residual of sulfur is not a problem, a transparent conductive layer can be formed in a good atmosphere. Therefore, it is better.

又,前述第1硫化防止層,作為前述氧化物雖含有氧化鋅或氧化鎵,但氧化鋅或氧化鎵中之金屬結果是以捕集的形態來去除僅殘存於腔室內氛圍之硫,接著形成含有銀之透明導電層時,由於硫的殘存未成為問題,進而於良好的氛圍下可形成層故較佳。 Further, the first vulcanization preventing layer contains zinc oxide or gallium oxide as the oxide, but the metal in the zinc oxide or the gallium oxide is removed in a trapped form to remove only sulfur remaining in the atmosphere of the chamber, and then formed. In the case of a transparent conductive layer containing silver, since the residual of sulfur is not a problem, it is preferable to form a layer in a favorable atmosphere.

又,前述第1高折射率層含有硫化鋅、與氧化物或氮化物,該氧化物或該氮化物的含量雖為該第1高折射率層之總體積的5~30體積%的範圍內,但由於第1高折射率層之內部構造接近為非晶,可提高可撓性故較 佳。 Further, the first high refractive index layer contains zinc sulfide, an oxide or a nitride, and the content of the oxide or the nitride is in the range of 5 to 30% by volume based on the total volume of the first high refractive index layer. However, since the internal structure of the first high refractive index layer is nearly amorphous, the flexibility can be improved. good.

又,前述第1高折射率層雖含有硫化鋅與二氧化矽,但由於第1高折射率層之內部構造接近為非晶,進而可提高可撓性故較佳。 Further, the first high refractive index layer contains zinc sulfide and ceria. However, since the internal structure of the first high refractive index layer is nearly amorphous, the flexibility can be improved.

又,作為高折射率材料,前述第2高折射率層雖含有可選自硫化鋅(ZnS)、二氧化鈦(TiO2)、銦錫氧化物(ITO)、氧化鋅(ZnO)、氧化鈮(Nb2O5)、二氧化錫(SnO2)、銦鋅氧化物(IZO)、鋁鋅氧化物(AZO)、鎵鋅氧化物(GZO)、銻錫氧化物(ATO)、銦鈰氧化物(ICO)、銦鎵鋅氧化物(IGZO)、氧化鉍(Bi2O3)、三氧化鎢(WO3)、氧化銦(In2O3)及包含鎵.銦.及氧之非晶質氧化物(a-GIO)中之任一種,但由於除了可更加降低表面電阻之外,亦使實施圖型化時之導通更為容易故較佳。 Further, as the high refractive index material, the second high refractive index layer may be selected from the group consisting of zinc sulfide (ZnS), titanium oxide (TiO 2 ), indium tin oxide (ITO), zinc oxide (ZnO), and cerium oxide (Nb). 2 O 5 ), tin dioxide (SnO 2 ), indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), antimony tin oxide (ATO), indium antimony oxide ( ICO), indium gallium zinc oxide (IGZO), bismuth oxide (Bi 2 O 3 ), tungsten trioxide (WO 3 ), indium oxide (In 2 O 3 ), and gallium. indium. And any of the amorphous oxides of oxygen (a-GIO), but in addition to lowering the surface resistance, it is also preferable to make the conduction during patterning easier.

又,作為前述高折射率材料,前述第2高折射率層雖含有硫化鋅,但由於具有防止透明導電層之銀的硫化之高度效果故較佳。 Further, as the high refractive index material, the second high refractive index layer contains zinc sulfide, but it is preferable because it has a high effect of preventing vulcanization of silver of the transparent conductive layer.

又,作為前述高折射率材料,前述第2高折射率層雖進一步含有二氧化矽,但由於第2高折射率層之內部構造接近為非晶,進而可提高可撓性故較佳。 Further, as the high refractive index material, the second high refractive index layer further contains ceria, but the internal structure of the second high refractive index layer is nearly amorphous, and the flexibility can be improved.

又,作為前述高折射率材料,前述第2高折射率層雖含有鎵鋅氧化物,但由於適合圖型化,同時可得到銀的保護機能故較佳。 Further, as the high refractive index material, the second high refractive index layer contains gallium zinc oxide, but it is preferable because it is suitable for patterning and a silver protection function.

又,於前述透明導電層與第2高折射率層之間具有第2硫化防止層,該第2硫化防止層雖含有氧化物 或氮化物,但由於具有防止透明導電層之銀的硫化之效果故較佳。 Further, a second vulcanization preventing layer is provided between the transparent conductive layer and the second high refractive index layer, and the second vulcanization preventing layer contains an oxide Or nitride, but it is preferable because it has an effect of preventing vulcanization of silver of the transparent conductive layer.

又,作為前述氧化物,前述第2硫化防止層雖含有氧化鋅或鎵鋅氧化物,但由於具有防止透明導電層之銀的硫化之高度效果故較佳。 Further, as the oxide, the second vulcanization preventing layer contains zinc oxide or gallium zinc oxide, but it is preferable because it has a high effect of preventing vulcanization of silver in the transparent conductive layer.

以下針對本發明之構成要素、及本實施方式、態樣進行詳細說明。尚,本案中所謂「~」係以其前後所記載之數值包含作為下限值及上限值之意義使用。 Hereinafter, constituent elements of the present invention, and the present embodiment and aspects will be described in detail. In the present case, the "~" is used in the sense that the numerical values described before and after are included as the lower limit and the upper limit.

≪透明導電性薄膜≫ ≪Transparent conductive film≫

本發明之透明導電性薄膜,係於透明樹脂支撐體上,至少以第1高折射率層、透明導電層及第2高折射率層順序具有之透明導電性薄膜,其特徵為前述透明導電層含有銀,前述第1高折射率層或前述第2高折射率層之至少任一者為含有硫化鋅之層,相對於鋅原子數100,該硫化鋅所包含之硫原子數的比例為50以上,且未達100。 The transparent conductive film of the present invention is a transparent conductive film which is provided on the transparent resin support at least in the order of the first high refractive index layer, the transparent conductive layer and the second high refractive index layer, and is characterized by the transparent conductive layer. Silver is contained, and at least one of the first high refractive index layer or the second high refractive index layer is a layer containing zinc sulfide, and the ratio of the number of sulfur atoms contained in the zinc sulfide is 50 with respect to 100 zinc atoms. Above, and not up to 100.

將本發明之透明導電性薄膜的層構成之一實施態樣示於圖1及圖2。 One embodiment of the layer configuration of the transparent conductive film of the present invention is shown in Figs. 1 and 2 .

圖1中,本發明之透明導電性薄膜100中,包含透明樹脂支撐體1/第1高折射率層2/透明導電層3/第2高折射率層4。而且於本發明之透明導電性薄膜100,該第1高折射率層2或第2高折射率層4之任一者為含有硫化鋅(ZnS)之層,相對於鋅原子數100,該硫化鋅所包含之硫原子數的比例為50以上,且未達100。 In the transparent conductive film 100 of the present invention, the transparent resin support 1 / the first high refractive index layer 2 / the transparent conductive layer 3 / the second high refractive index layer 4 are included in FIG. Further, in the transparent conductive film 100 of the present invention, either of the first high refractive index layer 2 or the second high refractive index layer 4 is a layer containing zinc sulfide (ZnS), and the vulcanization is 100% with respect to the number of zinc atoms. The ratio of the number of sulfur atoms contained in zinc is 50 or more and is less than 100.

進而於該第1高折射率層2、第2高折射率層4與透明導電層3之間,較佳為具有至少任一層之硫化防止層5a或5b。又,此等之層係從薄膜所形成之層,硫化防止層較佳為含有氧化物或氮化物。 Further, between the first high refractive index layer 2, the second high refractive index layer 4, and the transparent conductive layer 3, it is preferable to have at least one of the vulcanization preventing layers 5a or 5b. Further, the layers are formed from a film, and the vulcanization preventing layer preferably contains an oxide or a nitride.

圖1中,第1高折射率層2及第2高折射率層4之任一者為含有硫化鋅之層,該第1高折射率層2或第2高折射率層4與透明導電層3之間,較佳為設置硫化防止層5(含有氧化鋅之硫化防止層5a或5b)。 In FIG. 1, one of the first high refractive index layer 2 and the second high refractive index layer 4 is a layer containing zinc sulfide, the first high refractive index layer 2 or the second high refractive index layer 4 and a transparent conductive layer. Between 3, it is preferable to provide the vulcanization preventing layer 5 (the vulcanization preventing layer 5a or 5b containing zinc oxide).

藉由前述硫化防止層的效果,可使透明導電層之透明性及導電性提昇。鄰接此透明導電層與含有硫化鋅之高折射率層而形成時,易生成金屬硫化物,會對透明導電性薄膜之光透過性帶來影響。 The transparency and conductivity of the transparent conductive layer can be improved by the effect of the vulcanization preventing layer. When the transparent conductive layer and the high refractive index layer containing zinc sulfide are formed adjacent to each other, metal sulfide is likely to be formed, which affects the light transmittance of the transparent conductive film.

此係於含有銀之透明導電層之前後形成含有硫化鋅之高折射率層時,由以下之二點理由,引起含有銀之透明導電層的部分性或者整體性硫化,推定是因為顯著使透明性與導電性降低,可將藉由將硫化防止層設定在層厚0.1~5nm的範圍,可消除此問題的技術的背景,如以下般進行說明。 When a high refractive index layer containing zinc sulfide is formed before the transparent conductive layer containing silver, the partial or integral vulcanization of the transparent conductive layer containing silver is caused by the following two reasons, which is presumed to be significantly transparent. The properties and conductivity are lowered, and the background of the technique can be eliminated by setting the vulcanization preventing layer to a layer thickness of 0.1 to 5 nm, and the following description will be made.

首先,於透明導電層之支撐體側設置高折射率層時,亦即形成含有硫化鋅之層後,形成含有銀之層時,形成含有硫化鋅之層時,於成膜機腔室內被釋放之硫成分僅以殘存之狀態,形成含有銀之層。此結果,以透明導電性構件形成時間點來看,引起透明導電層的硫化改質。不用說將此僅以裝置之排氣性能或冷阱機能來解決是 非常困難的一件事。 First, when a high refractive index layer is provided on the support side of the transparent conductive layer, that is, when a layer containing zinc is formed and a layer containing silver is formed, when a layer containing zinc sulfide is formed, it is released in the film forming chamber. The sulfur component forms a layer containing silver only in a state of remaining. As a result, vulcanization reforming of the transparent conductive layer is caused by the time point of formation of the transparent conductive member. Needless to say, this is only solved by the exhaust performance of the device or the cold trap function. Very difficult thing.

對於此問題,形成含有硫化鋅之層隨即形成含有氧化鋅或氧化鎵之層時,由於氧化鋅中之鋅或鎵結果是以捕集的形態來去除僅殘存於腔室氛圍之硫,接著形成含有銀之層時,由於硫的殘存未成為問題,於良好的氛圍下的成膜變為可能故較佳。 For this problem, when a layer containing zinc sulfide is formed to form a layer containing zinc oxide or gallium oxide, zinc or gallium in zinc oxide is removed in a trapped form to remove only sulfur remaining in the atmosphere of the chamber, and then formed. In the case of a layer containing silver, since the residual of sulfur is not a problem, film formation in a good atmosphere is likely to be preferable.

其次,形成含有銀之透明導電層後,形成含有硫化鋅之高折射率層時,由於既已和存在於支撐體上之銀層的表面與高濃度的硫成分直接接觸,於透明導電性構件形成時間點來看,依然產生透明導電層的硫化改質。 Next, when a transparent conductive layer containing silver is formed to form a high refractive index layer containing zinc sulfide, the surface of the silver layer existing on the support is in direct contact with a high concentration of sulfur component, and the transparent conductive member is formed. At the time of formation, the vulcanization of the transparent conductive layer is still produced.

此外,將透明導電性構件以濺鍍形成時,不僅對銀之硫成分的暴露,含硫之成分具有高入射能量進行入射,與硫化改質同時將銀表面稍微進行反向濺鍍,有時會粗糙化面性狀。使用銀之透明導電層為了提高透過性,雖然被提供在極為薄之膜厚,但如上述般面性狀已劣化時,導電性的網絡部分被切斷,不僅降低導電性,且經切斷部分呈現粗糙之島狀構造,由於從此形狀的特徵產生電漿子(Plasmon)吸收,進而因情況不同而產生散射,連透明性亦受損。 Further, when the transparent conductive member is formed by sputtering, not only the exposure of the sulfur component of silver, but also the component containing sulfur has a high incident energy for incidence, and the silver surface is slightly reverse-sputtered simultaneously with the vulcanization modification, sometimes Will roughen the surface traits. In order to improve the permeability, the silver transparent conductive layer is provided in an extremely thin film thickness, but when the surface properties are deteriorated as described above, the conductive network portion is cut, not only the conductivity is lowered, but also the cut portion is cut. The rough island-like structure is exhibited, and since the plasmon absorption is generated from the characteristics of the shape, scattering occurs due to the situation, and the transparency is also impaired.

對於此問題,於設置硫化鋅之前,形成含有氧化鋅或氧化鎵之層時,接著可防止形成含有硫化鋅之層時所產生之銀的硫化改質與反向濺鍍雙方,依然較佳。 In order to solve this problem, when a layer containing zinc oxide or gallium oxide is formed before the zinc sulfide is provided, it is still preferable to prevent both the vulcanization modification and the reverse sputtering of the silver generated when the layer containing zinc sulfide is formed.

於本發明之透明導電性薄膜,如圖1所示,透明導電層3可層合於透明樹脂支撐體1的全面,如圖2 所示,透明導電層3可圖型化成所期望的形狀。本發明之透明導電性薄膜中,層合透明導電層3之區域a為導通電氣之區域(以下亦稱為「導通區域」)。另外,如圖2所示,未包含透明導電層3之區域b為絕緣區域。 In the transparent conductive film of the present invention, as shown in FIG. 1, the transparent conductive layer 3 can be laminated on the entire surface of the transparent resin support 1, as shown in FIG. As shown, the transparent conductive layer 3 can be patterned into a desired shape. In the transparent conductive film of the present invention, the region a in which the transparent conductive layer 3 is laminated is an electrically conductive region (hereinafter also referred to as "conductive region"). Further, as shown in FIG. 2, the region b not including the transparent conductive layer 3 is an insulating region.

由導通區域a及絕緣區域b所構成之圖型,因應透明導電性薄膜100的用途適當選擇。例如透明導電性薄膜100適用於靜電方式之觸控面板時,如圖3所示,可包含複數之導通區域a、與和此區別之線狀的絕緣區域b之圖型等。 The pattern formed by the conduction region a and the insulating region b is appropriately selected in accordance with the use of the transparent conductive film 100. For example, when the transparent conductive film 100 is applied to an electrostatic touch panel, as shown in FIG. 3, a plurality of conductive regions a and a linear insulating region b which is different from the above may be included.

又,本發明之透明導電性薄膜100中,可包含透明樹脂支撐體1、第1高折射率層2、透明導電層3、及第2高折射率層4、及硫化防止層5以外之層。例如於透明導電層3的形成時可成為成長核之基底層,可包含於透明導電層與第1高折射率層2之間與透明導電層3鄰接。 Further, the transparent conductive film 100 of the present invention may include a transparent resin support 1, a first high refractive index layer 2, a transparent conductive layer 3, a second high refractive index layer 4, and a layer other than the vulcanization preventing layer 5. . For example, when the transparent conductive layer 3 is formed, it can be a base layer of a growth core, and can be included between the transparent conductive layer and the first high refractive index layer 2 adjacent to the transparent conductive layer 3.

≪針對透明導電性薄膜的層構成≫ ≪ Layer composition for transparent conductive film≫ <1.透明樹脂支撐體> <1. Transparent resin support>

作為透明導電性薄膜100所使用之透明樹脂支撐體1,可列舉纖維素酯樹脂(例如三乙醯基纖維素(ZeroTack(柯尼卡美能達公司製))、二乙醯基纖維素、乙醯基丙醯基纖維素等)、聚碳酸酯樹脂(例如Panlite、Multilon(皆帝人公司製))、環烯烴樹脂(例如ZEONOR(日本Zeon公司製)、Arton(JSR公司製)、Appel(三井化學公 司製))、丙烯酸樹脂(例如聚甲基丙烯酸甲酯、Acrylite(三菱麗陽公司製)、SUMIPEX(住友化學公司製)),此等之樹脂較佳為透明樹脂支撐體的50質量%以上。此等之樹脂可為二種以上。 The transparent resin support 1 used for the transparent conductive film 100 is exemplified by a cellulose ester resin (for example, triacetyl cellulose (ZeroTack), diethyl fluorenyl cellulose, and B.醯-acrylonitrile-based cellulose, etc., polycarbonate resin (for example, Panlite, Multilon (manufactured by Teijin Co., Ltd.)), and cycloolefin resin (for example, ZEONOR (manufactured by Zeon Corporation, Japan), Arton (manufactured by JSR), Appel (Mitsui) Chemical Silicone resin (for example, polymethyl methacrylate, Acrylite (manufactured by Mitsubishi Rayon Co., Ltd.), SUMIPEX (manufactured by Sumitomo Chemical Co., Ltd.)), and the resin is preferably 50% by mass or more of the transparent resin support. . These resins may be used in two or more types.

此等之樹脂當中,較佳為纖維素酯樹脂、環烯烴樹脂及聚碳酸酯樹脂。 Among these resins, preferred are cellulose ester resins, cyclic olefin resins and polycarbonate resins.

又作為可與其他混合之樹脂,可包含選自聚醯亞胺、酚樹脂、環氧樹脂、聚苯醚(PPE)樹脂、聚酯樹脂(例如聚對苯二甲酸乙二酯(PET)、萘二甲酸乙二酯)、聚醚碸、ABS/AS樹脂、MBS樹脂、聚苯乙烯、甲基丙烯酸樹脂、聚乙烯醇/EVOH(乙烯-乙烯醇(Ethylene vinyl alcohol)樹脂)及苯乙烯系嵌段共聚物樹脂等中之一種以上的樹脂。 Further, as a resin which can be mixed with others, may be selected from the group consisting of polyimine, phenol resin, epoxy resin, polyphenylene ether (PPE) resin, polyester resin (for example, polyethylene terephthalate (PET), Ethylene naphthalate, polyether oxime, ABS/AS resin, MBS resin, polystyrene, methacrylic resin, polyvinyl alcohol/EVOH (Ethylene vinyl alcohol resin), and styrene One or more resins of block copolymer resins and the like.

又,針對本發明中所使用之透明樹脂支撐體1為纖維素酯時,較佳為低級脂肪酸酯,較佳係使用纖維素乙酸酯、纖維素乙酸酯丙酸酯、纖維素乙酸酯丁酸酯或纖維素乙酸酯丙酸酯丁酸酯等。於本發明所使用之纖維素酯由於醯基之取代度為2.85~3.00,可使面配向度維持更低故較佳,尤其是以2.92~3.00更佳。 Further, when the transparent resin support 1 used in the present invention is a cellulose ester, a lower fatty acid ester is preferred, and cellulose acetate, cellulose acetate propionate, and cellulose B are preferably used. Acid ester butyrate or cellulose acetate propionate butyrate. The cellulose ester used in the present invention has a degree of substitution of the thiol group of 2.85 to 3.00, which is preferable because the surface alignment degree is kept lower, and particularly preferably 2.92 to 3.00.

醯基之取代度的測定方法可依ASTM-D817-96的規定測定。 The method for determining the degree of substitution of the thiol group can be determined in accordance with the provisions of ASTM-D817-96.

較佳係使用聚合度為250~400之纖維素酯,尤其是以使用纖維素三乙酸酯更佳。有關本發明之纖維素酯的數平均分子量Mn為70000~250000,由於機械性強 度優異,且成為適度之摻雜黏度故較佳,更佳為80000~150000。又,較佳係使用與重量平均分子量Mw的比Mw/Mn為1.0~5.0之纖維素酯。 It is preferred to use a cellulose ester having a degree of polymerization of from 250 to 400, particularly preferably using cellulose triacetate. The number average molecular weight Mn of the cellulose ester of the present invention is 70,000 to 250,000, which is mechanically strong. The degree is excellent, and it is preferably a moderate doping viscosity, and more preferably 80,000 to 150,000. Further, it is preferred to use a cellulose ester having a ratio Mw/Mn of from 1.0 to 5.0 with respect to the weight average molecular weight Mw.

透明樹脂支撐體含有至少選自纖維素酯樹脂、環烯烴樹脂及聚碳酸酯樹脂中之任一種時,在前述透明樹脂支撐體之測定波長589nm中,可將面內遲緩值Ro調整至0~150nm的範圍內,亦即,由於被經常作為用在本發明主要利用形態之顯示器用途之低相位差薄膜而獲得故較佳。 When the transparent resin support contains at least one selected from the group consisting of a cellulose ester resin, a cycloolefin resin, and a polycarbonate resin, the in-plane retardation value Ro can be adjusted to 0 at a measurement wavelength of 589 nm of the transparent resin support. In the range of 150 nm, that is, it is preferably obtained as a low retardation film which is often used for a display of the main use form of the present invention.

尚,透明樹脂支撐體的遲緩值可用樹脂材料的選擇、製膜時之拉延倍率等控制。具體而言,藉由適當選擇縱方向、橫方向的拉延倍率,可控制在任意之值,面內遲緩值Ro及厚度方向遲緩值Rt在23℃.55%RH的環境下,可藉由相位差測定裝置「KOBRA-21ADH」(王子計測機器(股)製)測定。 Further, the retardation value of the transparent resin support can be controlled by the selection of the resin material, the draw ratio at the time of film formation, and the like. Specifically, by appropriately selecting the drawing magnification in the longitudinal direction and the transverse direction, it is possible to control at any value, the in-plane retardation value Ro and the thickness direction retardation value Rt at 23 ° C. In the environment of 55% RH, it can be measured by the phase difference measuring device "KOBRA-21ADH" (manufactured by Oji Scientific Instruments Co., Ltd.).

本發明之透明樹脂支撐體1以對於可見光之透明性高較佳,波長450~800nm之光的平均透過率以70%以上較佳,更佳為80%以上,再更佳85%以上。透明樹脂支撐體1之光的平均透過率為70%以上時,易提高透明導電性薄膜100的光透過性。又,透明樹脂支撐體1的波長450~800nm之光的平均吸收率較佳為10%以下,更佳為5%以下,更佳為3%以下。 The transparent resin support 1 of the present invention preferably has high transparency to visible light, and the average transmittance of light having a wavelength of 450 to 800 nm is preferably 70% or more, more preferably 80% or more, still more preferably 85% or more. When the average transmittance of light of the transparent resin support 1 is 70% or more, the light transmittance of the transparent conductive film 100 is easily improved. Further, the average absorption ratio of light having a wavelength of 450 to 800 nm of the transparent resin support 1 is preferably 10% or less, more preferably 5% or less, still more preferably 3% or less.

上述平均透過率相對於透明樹脂支撐體1之表面的法線,從傾斜5°之角度入射光來測定。另外,平均 吸收率係從與平均透過率同樣的角度入射光,來測定透明基板1的平均反射率,作為平均吸收率=100-(平均透過率+平均反射率)(%)來算出。平均透過率及平均反射率以分光光度計測定。 The average transmittance is measured by incident light from an angle of 5° with respect to the normal line of the surface of the transparent resin support 1 . In addition, the average The absorptance was measured by inputting light at the same angle as the average transmittance, and the average reflectance of the transparent substrate 1 was measured and calculated as an average absorptivity=100-(average transmittance + average reflectance) (%). The average transmittance and the average reflectance were measured by a spectrophotometer.

又,為了將透明樹脂支撐體的透過率定為上述範圍內,在透明樹脂支撐體的兩面,透明樹脂支撐體的表面粗糙度Ra較佳為3.5nm以下,更佳為3.0nm以下。在透明樹脂支撐體的兩面,透明樹脂支撐體的表面粗糙度Ra為3.5nm以下時,可成為霧值減少且透明性優異之透明樹脂支撐體。於此,所謂表面粗糙度Ra係指在JIS B0601:2001之算術平均粗糙度。 In addition, the surface roughness Ra of the transparent resin support is preferably 3.5 nm or less, and more preferably 3.0 nm or less, on both surfaces of the transparent resin support in order to set the transmittance of the transparent resin support within the above range. When the surface roughness Ra of the transparent resin support is 3.5 nm or less on both surfaces of the transparent resin support, the transparent resin support body which has a haze value and is excellent in transparency can be obtained. Here, the surface roughness Ra means the arithmetic mean roughness in JIS B0601:2001.

本發明之透明樹脂支撐體1的霧值較佳為0.01~2.5(%),更佳為0.1~1.2(%)。支撐體的霧值為2.5(%)以下時,抑制透明導電性薄膜的霧值。 The haze value of the transparent resin support 1 of the present invention is preferably from 0.01 to 2.5 (%), more preferably from 0.1 to 1.2 (%). When the haze value of the support is 2.5 (%) or less, the haze value of the transparent conductive film is suppressed.

尚,透明樹脂支撐體的霧值係以霧度計「型式:NDH 2000」(日本電色(股)製)測定。 In addition, the haze value of the transparent resin support was measured by haze meter "type: NDH 2000" (made by Nippon Denshoku Co., Ltd.).

透明樹脂支撐體1的波長570nm之光的折射率較佳為1.40~1.95,更佳為1.45~1.75,再更佳為1.45~1.70。透明樹脂支撐體的折射率通常因支撐體的材質而異。透明樹脂支撐體的折射率係於23℃.55%RH以橢圓偏光計測定。 The refractive index of the light having a wavelength of 570 nm of the transparent resin support 1 is preferably from 1.40 to 1.95, more preferably from 1.45 to 1.75, still more preferably from 1.45 to 1.70. The refractive index of the transparent resin support generally varies depending on the material of the support. The refractive index of the transparent resin support is at 23 ° C. 55% RH was measured with an ellipsometer.

透明樹脂支撐體1的厚度較佳為1μm~ 20mm,更佳為10μm~2mm。透明樹脂支撐體的厚度為1μm以上時,提高透明樹脂支撐體1的強度,第1高折射率層2的製作時破裂、或裂開而變困難。另外,透明樹脂支撐體1的厚度若為20mm以下,透明導電性薄膜100的可撓性變足夠。進而可薄化使用透明導電性薄膜100之機器的厚度。又,亦可輕量化使用透明導電性薄膜100之機器。 The thickness of the transparent resin support 1 is preferably 1 μm~ 20mm, more preferably 10μm~2mm. When the thickness of the transparent resin support is 1 μm or more, the strength of the transparent resin support 1 is increased, and it is difficult to crack or crack the first high refractive index layer 2 during production. In addition, when the thickness of the transparent resin support 1 is 20 mm or less, the flexibility of the transparent conductive film 100 is sufficient. Further, the thickness of the machine using the transparent conductive film 100 can be reduced. Further, it is also possible to reduce the weight of the machine using the transparent conductive film 100.

<2.第1高折射率層> <2. First high refractive index layer>

於本發明所謂高折射率層,係指於含有高折射率材料之層,具有較透明樹脂支撐體1更高之折射率之層。 The term "high refractive index layer" as used in the present invention means a layer having a higher refractive index than the transparent resin support 1 in a layer containing a high refractive index material.

第1高折射率層2係調整透明導電性薄膜的導通區域a,即調整形成透明導電層3之區域的光透過性(光學導納)之層,至少形成於透明導電性薄膜100的導通區域a。第1高折射率層2由於具有將透明導電層從大氣中之水分或硫化物或含硫之成分等保護透明導電層之機能,亦形成於透明導電性薄膜100的絕緣區域b故較佳。 The first high refractive index layer 2 adjusts the conduction region a of the transparent conductive film, that is, the layer that adjusts the light transmittance (optical admittance) of the region in which the transparent conductive layer 3 is formed, and is formed at least in the conduction region of the transparent conductive film 100. a. The first high refractive index layer 2 is preferably formed in the insulating region b of the transparent conductive film 100 because it has a function of protecting the transparent conductive layer from moisture or sulfide or sulfur-containing components in the atmosphere.

在本發明,前述第1高折射率層或前述第2高折射率層之至少任一者為含有硫化鋅之層,第1高折射率層與第2高折射率層當中,第1高折射率層2為含有硫化鋅(ZnS)之較佳之層。於第1高折射率層2包含硫化鋅時,從透明樹脂支撐體1側變難以透過水分,抑制透明導電層3的腐蝕。第1高折射率層2中,可與硫化鋅一起包含其他介電性材料或氧化物半導體材料。與硫化鋅一起所 包含之介電性材料或氧化物半導體材料的波長570nm之光的折射率,較透明樹脂支撐體1的波長570nm之光的折射率大0.1~1.1故較佳,更佳為大0.4~1.0。另外,第1高折射率層2所包含之介電性材料或氧化物半導體材料的波長570nm之光具體之折射率較佳為大1.5,更佳為1.7~2.5,再更佳為1.8~2.5。介電性材料或氧化物半導體材料的折射率較1.5更大時,藉由第1高折射率層2,充分調整透明導電體100的導通區域a之光學導納。尚,第1高折射率層2的折射率以第1高折射率層2所包含之材料的折射率、或第1高折射率層2所包含之材料的密度來調整。上述折射率於23℃.55%RH的環境下以橢圓偏光計測定。 In the present invention, at least one of the first high refractive index layer or the second high refractive index layer is a layer containing zinc sulfide, and the first high refractive index and the second high refractive index layer have a first high refractive index. Rate layer 2 is a preferred layer containing zinc sulfide (ZnS). When the first high refractive index layer 2 contains zinc sulfide, it is difficult to permeate moisture from the side of the transparent resin support 1 and the corrosion of the transparent conductive layer 3 is suppressed. In the first high refractive index layer 2, another dielectric material or an oxide semiconductor material may be contained together with the zinc sulfide. Together with zinc sulfide The refractive index of light having a wavelength of 570 nm including the dielectric material or the oxide semiconductor material is preferably 0.1 to 1.1 larger than the refractive index of light having a wavelength of 570 nm of the transparent resin support 1, and more preferably 0.4 to 1.0. Further, the specific refractive index of the light having a wavelength of 570 nm of the dielectric material or the oxide semiconductor material contained in the first high refractive index layer 2 is preferably 1.5, more preferably 1.7 to 2.5, still more preferably 1.8 to 2.5. . When the refractive index of the dielectric material or the oxide semiconductor material is larger than 1.5, the optical admittance of the conduction region a of the transparent conductor 100 is sufficiently adjusted by the first high refractive index layer 2. Further, the refractive index of the first high refractive index layer 2 is adjusted by the refractive index of the material contained in the first high refractive index layer 2 or the density of the material contained in the first high refractive index layer 2. The above refractive index is at 23 ° C. It was measured by an ellipsometer in an environment of 55% RH.

在本發明,較佳係第1高折射率層為含有硫化鋅之層,相對於鋅原子數100,此時之組成比係硫原子數為50以上,且未達100。相對於鋅原子數100,較佳係硫原子數為83以上、且90以下。為此範圍內時,由於透明導電層中所含有之銀的硫化防止效果優異,具有良好的導電性與透明性,通過可見光區域整體均質之光透過率,且得到耐久性提昇的效果。 In the present invention, the first high refractive index layer is preferably a layer containing zinc sulfide, and the composition ratio of the number of sulfur atoms is 50 or more and less than 100 with respect to the number of zinc atoms. The number of sulfur atoms is preferably 83 or more and 90 or less with respect to 100 zinc atoms. In the range of this, the silver contained in the transparent conductive layer is excellent in the vulcanization preventing effect, and has excellent conductivity and transparency, and the light transmittance is uniform throughout the visible light region, and the effect of improving durability is obtained.

<硫原子數及鋅原子數的分析方法> <Analysis method of sulfur number and zinc atom number>

含有第1高折射率層之硫化鋅所包含之硫原子數與鋅原子數,可使用ICP發光分光分析裝置分析。具體而言,可藉由如以下進行來分析。 The number of sulfur atoms and the number of zinc atoms contained in the zinc sulfide containing the first high refractive index layer can be analyzed by using an ICP emission spectroscopic analyzer. Specifically, it can be analyzed by performing as follows.

鋅與硫的元素定量分析中,將特定之ZnS薄層以單層作成形成於BK7玻璃上之參照試料,對於此等試料,使用超高純度過氧化氫(關東化學股份有限公司製)使ZnS層充分溶解,對於以超純水稀釋所得之20ml溶液中所包含之各元素,使用(股)日立high-tech science製之ICP發光分光分析裝置「SPS3520UV」進行基體匹配(Matrix matching)。 In the quantitative analysis of the elements of zinc and sulfur, a specific ZnS thin layer was formed as a reference sample on a BK7 glass in a single layer. For these samples, ultra-high purity hydrogen peroxide (manufactured by Kanto Chemical Co., Ltd.) was used to make ZnS. The layer was sufficiently dissolved, and each element contained in a 20 ml solution obtained by dilution with ultrapure water was subjected to matrix matching using an ICP emission spectroscopic analyzer "SPS3520UV" manufactured by Hitachi High-tech Science.

在定量,作為參考,對鋅使用原子吸光分析用鋅標準液1000mg/l(關東化學股份有限公司製)、對硫使用硫標準液Sulfur 1000mg/l(SPEX)。測定波長,鋅為213.924nm,硫為180.734nm。 For the purpose of quantification, 1000 mg/l of zinc standard solution for atomic absorption analysis (manufactured by Kanto Chemical Co., Ltd.) and sulfur standard solution Sulfur 1000 mg/l (SPEX) were used for zinc. The wavelength was measured, zinc was 213.924 nm, and sulfur was 180.734 nm.

尚,在測定,進行對清淨之BK7玻璃進行同樣處置所得之溶液樣品的分析,確認作為妨礙本試驗之背景噪音(Background noise)的鋅、硫成分為檢出界限以下。 In the measurement, the analysis of the solution sample obtained by subjecting the cleaned BK7 glass to the same treatment was carried out, and it was confirmed that the zinc and sulfur components which are the background noise which hindered the test were below the detection limit.

<硫含量的控制方法> <Control method of sulfur content>

本發明中,第1高折射率層所含有之鋅原子數與硫原子數的比例係共蒸鍍或共濺鍍硫化鋅與鋅,可藉由調整個別的條件來控制。 In the present invention, the ratio of the number of zinc atoms to the number of sulfur atoms contained in the first high refractive index layer is co-evaporated or co-sputtered with zinc sulfide and zinc, and can be controlled by adjusting individual conditions.

又,為了得到含有大量硫之組成,亦可利用反應性濺鍍法,例如亦可藉由於真空腔室內吹入以Ar氣體稀釋之硫化氫(H2S)氣體,並且將硫化鋅(ZnS)作為靶進行濺鍍來控制。 Further, in order to obtain a composition containing a large amount of sulfur, a reactive sputtering method may be used. For example, hydrogen sulfide (H 2 S) gas diluted with Ar gas may be blown into the vacuum chamber, and zinc sulfide (ZnS) may be used. It is controlled by sputtering as a target.

層形成藉由濺鍍法而形成時,所形成之層 中,透過得到所期望的組成,作成調整成適當元素組成比,且主要作為燒結體所得之濺鍍靶,使用該濺鍍靶為簡便,同時生產步驟親和性高且優異。如此元素組成比不同之燒結體可作為市售品取得。 When the layer is formed by sputtering, the layer formed Among them, by obtaining a desired composition, a sputtering target which is adjusted to an appropriate elemental composition ratio and mainly used as a sintered body is used, and the sputtering target is used as a simple one, and the production step affinity is high and excellent. Such a sintered body having a different elemental composition ratio can be obtained as a commercial product.

對於第1高折射率層,與上述硫化鋅一起作為所使用之材料,較佳為氧化物或氮化物。作為氧化物,特佳為二氧化矽(SiO2)。作為氮化物,可列舉氮化矽(Si3N4、SiN)、氮化鋁(A1N)及氮化鈦(TiN)等。 The first high refractive index layer is preferably an oxide or a nitride as the material to be used together with the above zinc sulfide. As the oxide, it is particularly preferably cerium oxide (SiO 2 ). Examples of the nitride include tantalum nitride (Si 3 N 4 , SiN), aluminum nitride (A1N), and titanium nitride (TiN).

作為控制硫化鋅(ZnS)及二氧化矽(SiO2)組成的方法,例如可利用:使用以適當濃度含有二氧化矽(SiO2)之硫化鋅(ZnS)的靶之濺鍍法、同時使用二氧化矽(SiO2)與硫化鋅(ZnS)的靶之共濺鍍法來進行。 As a method of controlling the composition of zinc sulfide (ZnS) and cerium oxide (SiO 2 ), for example, a sputtering method using a target of zinc sulfide (ZnS) containing cerium oxide (SiO 2 ) in an appropriate concentration can be used and used simultaneously. Co-sputtering of a target of cerium oxide (SiO 2 ) and zinc sulfide (ZnS) is carried out.

含有硫化鋅(ZnS)之前述高折射率層,在5~30體積百分比以下之濃度含有二氧化矽時,層之內部構造接近為非晶,可提高可撓性。 When the high refractive index layer containing zinc sulfide (ZnS) contains cerium oxide at a concentration of 5 to 30% by volume or less, the internal structure of the layer is nearly amorphous, and flexibility can be improved.

硫化鋅(ZnS)雖為共價鍵性強之材料,將此從化學計量的組成比以偏離的狀態得到時,被認為層之內部構造成為具有大量粒界之結晶質。此時所得之層的性質變硬且脆,此外在附著強度中亦變差。 When zinc sulfide (ZnS) is a material having strong covalent bond properties, when the stoichiometric composition ratio is obtained from a state of deviation, it is considered that the internal structure of the layer is a crystal having a large number of grain boundaries. The properties of the layer obtained at this time become hard and brittle, and also deteriorate in adhesion strength.

另外,透明導電性薄膜由於經常於捲對捲之步驟間,常常重複退繞、捲繞並且進行操作,於此過程為結晶質時,由於將結晶粒界為起點而產生微細之破裂,損害透明導電層的密封性能,而給予可撓性故最佳。 In addition, since the transparent conductive film is often repeatedly unwound, wound, and operated between the steps of roll-to-roll, when the process is crystalline, fine cracking occurs due to the grain boundary as a starting point, and the transparency is impaired. The sealing property of the conductive layer is optimal for imparting flexibility.

除此之外,使其含有二氧化矽所得之柔軟 層,由於對由樹脂所構成之支撐體的熱膨脹之軌跡追蹤亦優異,故還是可以減輕微細破裂的產生,可提高溫度壓力下的信賴性,仍然較佳。 In addition, the softness obtained by containing cerium oxide Since the layer is excellent in tracking the trajectory of thermal expansion of the support made of resin, it is possible to reduce the occurrence of fine cracks and to improve the reliability under temperature and pressure, and it is still preferable.

其含量有必要維持用以調節透明導電性薄膜之光學特性的折射率,且調整至不損及前述之硫捕捉機能的程度。從此觀點來看,二氧化矽較佳為如上述以5~30體積百分比的濃度含有。 It is necessary to maintain the refractive index for adjusting the optical characteristics of the transparent conductive film, and to adjust to such an extent that the aforementioned sulfur trapping function is not impaired. From this point of view, the cerium oxide is preferably contained in a concentration of 5 to 30% by volume as described above.

第1高折射率層2的層厚較佳為15~150nm,更佳為20~80nm。第1高折射率層2的層厚為15nm以上時,藉由第1高折射率層2,充分調整透明導電性薄膜100之導通區域a的光學導納。另外,第1高折射率層2的層厚若為150nm以下,包含第1高折射率層2之區域的光透過性很難降低。第1高折射率層2的層厚以橢圓偏光計「多入射角分光橢圓偏光計VASE(註冊商標)」(J.A.Woollam公司製)測定。 The layer thickness of the first high refractive index layer 2 is preferably 15 to 150 nm, more preferably 20 to 80 nm. When the layer thickness of the first high refractive index layer 2 is 15 nm or more, the optical admittance of the conduction region a of the transparent conductive film 100 is sufficiently adjusted by the first high refractive index layer 2. In addition, when the layer thickness of the first high refractive index layer 2 is 150 nm or less, the light transmittance of the region including the first high refractive index layer 2 is hardly lowered. The layer thickness of the first high refractive index layer 2 was measured by an ellipsometer "Multi-incident angle spectroscopic ellipsometer VASE (registered trademark)" (manufactured by J.A. Woollam Co., Ltd.).

第1高折射率層2可為以真空蒸鍍法、濺鍍法、離子鍍法、電漿CVD法、熱CVD法等一般之氣相成膜法(堆積法亦稱為氣相成長法)所形成之層。從提高第1高折射率層2的折射率(密度)的觀點來看,第1高折射率層2較佳為以電子束蒸鍍法或濺鍍法所形成之層。電子束蒸鍍法時,為了提高層的密度,期待IAD(離子輔助)等之輔助。 The first high refractive index layer 2 may be a general vapor phase deposition method such as a vacuum deposition method, a sputtering method, an ion plating method, a plasma CVD method, or a thermal CVD method (the deposition method is also called a vapor phase growth method). The layer formed. From the viewpoint of increasing the refractive index (density) of the first high refractive index layer 2, the first high refractive index layer 2 is preferably a layer formed by an electron beam evaporation method or a sputtering method. In the electron beam evaporation method, in order to increase the density of the layer, assistance such as IAD (ion assist) is expected.

又,第1高折射率層2圖型化成所期望形狀之層時,圖型化方法並未特別限制。第1高折射率層2, 例如將具有所期望圖型之遮罩等配置於被成膜面,可為以氣相成膜法形成圖型狀之層,可為藉由周知之蝕刻法經圖型化之層。 Further, when the first high refractive index layer 2 is patterned into a layer having a desired shape, the patterning method is not particularly limited. First high refractive index layer 2, For example, a mask having a desired pattern or the like is disposed on the film formation surface, and a layer formed in a pattern by a vapor phase film formation method may be used, and the layer may be patterned by a well-known etching method.

<3.第1硫化防止層> <3. First vulcanization preventing layer>

前述之第1高折射率層2中由於含有硫化鋅,如圖1所示,於第1高折射率層2與透明導電層3之間,以具有含有氧化物或氮化物之第1硫化防止層5a較佳,硫化防止層5a較佳為含有氧化鋅或氧化鎵之第1硫化防止層5a。第1硫化防止層5a具有防止從第1高折射率層之硫化物或含硫之成分的擴散之機能。又,第1硫化防止層5a亦可形成於透明導電性薄膜100的絕緣區域b,此情況,較佳為由於具有將透明導電層從大氣中之水分或硫化物或含硫之成分等保護透明導電層的機能,亦可形成於絕緣區域b。 The first high refractive index layer 2 contains zinc sulfide, and as shown in FIG. 1, the first vulcanization prevention is contained between the first high refractive index layer 2 and the transparent conductive layer 3, and contains an oxide or a nitride. The layer 5a is preferably used, and the vulcanization preventing layer 5a is preferably a first vulcanization preventing layer 5a containing zinc oxide or gallium oxide. The first vulcanization preventing layer 5a has a function of preventing diffusion of sulfide or sulfur-containing components from the first high refractive index layer. Further, the first vulcanization preventing layer 5a may be formed in the insulating region b of the transparent conductive film 100. In this case, it is preferable to protect the transparent conductive layer from moisture or sulfide or sulfur-containing components in the atmosphere. The function of the conductive layer can also be formed in the insulating region b.

該第1硫化防止層5a為較佳含有氧化鋅或氧化鎵之層,其他,可包含金屬氧化物、金屬氮化物、金屬氟化物等之層。第1硫化防止層5a中,此等可僅包含一種,亦可包含二種以上。惟,連續形成第1高折射率層2、與第1硫化防止層5a、與透明導電層3時,較佳為金屬氧化物可與硫反應、或可吸附硫之化合物。金屬氧化物為與硫反應之化合物時,金屬氧化物與硫的反應物較佳為可見光的透過性高。 The first vulcanization preventing layer 5a is preferably a layer containing zinc oxide or gallium oxide, and may further include a layer of a metal oxide, a metal nitride, a metal fluoride or the like. In the first vulcanization preventing layer 5a, these may be contained alone or in combination of two or more. However, when the first high refractive index layer 2, the first vulcanization preventing layer 5a, and the transparent conductive layer 3 are continuously formed, a compound in which a metal oxide can react with sulfur or which can adsorb sulfur is preferable. When the metal oxide is a compound which reacts with sulfur, the reactant of the metal oxide and sulfur preferably has high visible light permeability.

金屬氧化物之例中,除了氧化鋅(ZnO)及氧化 鎵(Ga2O3)之外,包含有二氧化鈦(TiO2)、銦錫氧化物(ITO)、氧化鈮(Nb2O5)、氧化鋯(ZrO2)、氧化鈰(CeO2)、五氧化鉭(Ta2O5)、五氧化鈦(Ti3O5)、七氧化鈦(Ti4O7)、三氧化鈦(Ti2O3)、氧化鈦(TiO)、二氧化錫(SnO2)、鑭氧化鈦(La2Ti2O7)、銦鋅氧化物(IZO)、鋁鋅氧化物(AZO)、鎵鋅氧化物(GZO)、銻錫氧化物(ATO)、銦鈰氧化物(ICO)、氧化鉍(Bi2O3)、由鎵、銦、及氧所構成之非晶質氧化物(a-GIO)、氧化鍺(GeO2)、二氧化矽(SiO2)、氧化鋁(Al2O3)、氧化鉿(HfO2)、氧化矽(SiO)、氧化鎂(MgO)、氧化釔(Y2O3)及三氧化鎢(WO3)等。 In the example of the metal oxide, in addition to zinc oxide (ZnO) and gallium oxide (Ga 2 O 3 ), titanium oxide (TiO 2 ), indium tin oxide (ITO), niobium oxide (Nb 2 O 5 ), Zirconia (ZrO 2 ), cerium oxide (CeO 2 ), tantalum pentoxide (Ta 2 O 5 ), titanium oxide (Ti 3 O 5 ), titanium oxynitride (Ti 4 O 7 ), titanium oxide (Ti 2 ) O 3 ), titanium oxide (TiO), tin dioxide (SnO 2 ), barium oxide (La 2 Ti 2 O 7 ), indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), antimony tin oxide (ATO), indium antimony oxide (ICO), bismuth oxide (Bi 2 O 3 ), amorphous oxide (a-GIO) composed of gallium, indium, and oxygen, Cerium oxide (GeO 2 ), cerium oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), cerium oxide (HfO 2 ), cerium oxide (SiO), magnesium oxide (MgO), cerium oxide (Y 2 O 3 ) ) and tungsten trioxide (WO 3 ) and the like.

金屬氟化物之例中,包含有氟化鑭(LaF3)、氟化鋇(BaF2)、鈉氟化鋁(Na5Al3F14、Na3AlF6)、氟化鋁(AlF3)、氟化鎂(MgF2)、氟化鈣(CaF2)、氟化鋇(BaF2)、氟化鈰(CeF3)、氟化釹(NdF3)及氟化釔(YF3)等。 Examples of metal fluorides include lanthanum fluoride (LaF 3 ), barium fluoride (BaF 2 ), sodium aluminum fluoride (Na 5 Al 3 F 14 , Na 3 AlF 6 ), and aluminum fluoride (AlF 3 ). , magnesium fluoride (MgF 2), calcium fluoride (CaF 2), barium fluoride (BaF 2), cerium fluoride (CeF 3), neodymium fluoride (NdF 3) and yttrium fluoride (YF 3) and the like.

金屬氮化物之例中,可列舉氮化矽(Si3N4、SiN)、氮化鋁(AlN)及氮化鈦(TiN)等。 Examples of the metal nitride include tantalum nitride (Si 3 N 4 , SiN), aluminum nitride (AlN), and titanium nitride (TiN).

此等當中,較佳為含有氧化鋅或氧化鎵之層。將第1硫化防止層分成氧化鋅與氧化鎵或氧化鋅與氮化矽等2成分之層時,可將個別的材料以使用以期望之比例混合之靶的濺鍍法形成層。又可藉由使用同時使用個別的靶之共濺鍍法,形成層。 Among these, a layer containing zinc oxide or gallium oxide is preferred. When the first vulcanization preventing layer is divided into a layer of two components such as zinc oxide and gallium oxide or zinc oxide or tantalum nitride, an individual material can be formed into a layer by a sputtering method using a target mixed in a desired ratio. Layers can also be formed by co-sputtering using simultaneous use of individual targets.

於此,第1硫化防止層5a的層厚,較佳為由後述之透明導電層3之形成時的衝擊,將第1高折射率層2的表面成為可保護之層厚。另外,可包含在第1高折射 率層之氧化鋅或氧化鎵與透明導電層3所包含之金屬的親和性高。因此,第1硫化防止層5a的層厚非常薄,僅露出第1高折射率層2的一部分時,將該露出部分為中心成長透明導電層之透明金屬膜,透明導電層3易變緻密。即第1硫化防止層5a以比較薄為佳,較佳為0.1~5.0nm,更佳為0.5~2.0nm。 Here, the layer thickness of the first vulcanization preventing layer 5a is preferably an impact at the time of formation of the transparent conductive layer 3 to be described later, and the surface of the first high refractive index layer 2 has a layer thickness that can be protected. In addition, it can be included in the first high refraction The zinc oxide or gallium oxide of the rate layer has high affinity with the metal contained in the transparent conductive layer 3. Therefore, the first vulcanization preventing layer 5a has a very small layer thickness, and when only a part of the first high refractive index layer 2 is exposed, the exposed portion is a transparent metal film in which the transparent conductive layer is grown, and the transparent conductive layer 3 is easily densified. That is, the first vulcanization preventing layer 5a is preferably relatively thin, preferably 0.1 to 5.0 nm, more preferably 0.5 to 2.0 nm.

第1硫化防止層5a係以真空蒸鍍法、濺鍍法、離子鍍法、電漿CVD法、熱CVD法等一般之氣相成膜法所形成之層。 The first vulcanization preventing layer 5a is a layer formed by a general vapor phase deposition method such as a vacuum deposition method, a sputtering method, an ion plating method, a plasma CVD method, or a thermal CVD method.

第1硫化防止層5a圖型化成所期望形狀之層時,圖型化方法並未特別限制。第1硫化防止層5a,例如將具有所期望圖型之遮罩等配置於被成膜面,可為以氣相成膜法形成圖型狀之層,亦可為藉由周知之蝕刻法圖型化之層。 When the first vulcanization preventing layer 5a is patterned into a layer having a desired shape, the patterning method is not particularly limited. The first vulcanization preventing layer 5a may be, for example, a mask having a desired pattern or the like disposed on the film formation surface, and may be a layer formed by a vapor phase film formation method, or may be a well-known etching method. The layer of the type.

<4.透明導電層> <4. Transparent conductive layer>

透明導電層3係在透明導電性薄膜100中用以導通電氣之層。透明導電層3如前述,可形成於透明樹脂支撐體1的全面,又亦可圖型化成所期望之形狀。 The transparent conductive layer 3 is used in the transparent conductive film 100 to conduct an electrical layer. As described above, the transparent conductive layer 3 can be formed on the entire surface of the transparent resin support 1, or can be patterned into a desired shape.

透明導電層3為含有銀之層,亦可含有其他金屬。作為與銀一起使用之金屬,若為透明導電性高之金屬則並未特別限制,例如較佳為金、銅、鎳、鈀、鉑、鋅、鋁、錳、鍺、鉍、釹及鉬。 The transparent conductive layer 3 is a layer containing silver and may contain other metals. The metal to be used together with silver is not particularly limited as long as it is a metal having high transparent conductivity. For example, gold, copper, nickel, palladium, platinum, zinc, aluminum, manganese, lanthanum, cerium, lanthanum, and molybdenum are preferable.

此等當中,較佳為金、鈀、鍺、鉍、銅、 鉑、釹及鈮。透明導電層3中,此等之金屬可僅包含一種,亦可包含二種以上。從導電性的觀點來看,透明導電層中較佳為含有包含銀為90atm%以上之合金。含有銀為90atm%以上時,可得到優異之導電性與高耐久性。 Among these, gold, palladium, rhodium, iridium, copper, etc. are preferred. Platinum, rhodium and ruthenium. In the transparent conductive layer 3, these metals may be contained alone or in combination of two or more. From the viewpoint of conductivity, the transparent conductive layer preferably contains an alloy containing 90 atm or more of silver. When the silver content is 90 atm% or more, excellent electrical conductivity and high durability can be obtained.

又,將至少一種上述透明導電性高之金屬以上述範圍內含有時,即使薄層化透明導電層的層厚亦可確保特定之導電性,又提昇得到防止透明導電層所含有之銀劣化的效果之信賴性。例如組合銀與鋅時,提高透明金屬層之耐硫化性。組合銀與金時,提高耐鹽(NaCl)性。進而組合銀與銅時,提高耐氧化性。 Further, when at least one of the above-mentioned metals having high transparent conductivity is contained in the above range, even if the thickness of the thin transparent conductive layer is thin, specific conductivity can be ensured, and the deterioration of silver contained in the transparent conductive layer can be improved. The reliability of the effect. For example, when silver and zinc are combined, the sulfidation resistance of the transparent metal layer is improved. When combining silver and gold, the salt tolerance (NaCl) is improved. Further, when silver and copper are combined, oxidation resistance is improved.

本發明之透明導電層的層厚較佳為3~15nm的範圍內,更佳為5~13nm的範圍內。藉由此層厚可擔保所期望之透明性、電漿子(Plasmon)吸收率。 The layer thickness of the transparent conductive layer of the present invention is preferably in the range of 3 to 15 nm, more preferably in the range of 5 to 13 nm. By this layer thickness, the desired transparency and plasmon absorption rate can be guaranteed.

透明導電層3之電漿子吸收率通過波長400~800nm(於全範圍)較佳為10%以下,更佳為7%以下,再更佳為5%以下。 The plasmon absorption rate of the transparent conductive layer 3 is preferably 10% or less, more preferably 7% or less, still more preferably 5% or less, in the wavelength of 400 to 800 nm (in the entire range).

透明導電層3雖可為以任一種之形成方法所形成之層,但為了改變透明導電層之平均透過率,較佳為以濺鍍法所形成之層、或後述之基底層上所形成之層。 The transparent conductive layer 3 may be a layer formed by any of the forming methods. However, in order to change the average transmittance of the transparent conductive layer, it is preferably formed by a layer formed by a sputtering method or a base layer to be described later. Floor.

濺鍍法中,層之形成時由於材料於被成膜體以高速碰撞,易得到緻密且平滑之層,易提高透明導電層3的光透過性。又,透明導電層3為藉由濺鍍法所形成之層時,透明導電層3即使在高溫且低濕度之環境中亦難以腐蝕。 In the sputtering method, when the layer is formed, the material collides with the film formation body at a high speed, and a dense and smooth layer is easily obtained, and the light transmittance of the transparent conductive layer 3 is easily improved. Further, when the transparent conductive layer 3 is a layer formed by a sputtering method, the transparent conductive layer 3 is hard to corrode even in an environment of high temperature and low humidity.

濺鍍法的種類並未特別限制,可為離子束濺鍍法、或磁控管濺鍍法、反應性濺鍍法、2極濺鍍法、偏壓(Bias)濺鍍法、對向濺鍍法等。透明導電層3尤其是以對向濺鍍法所形成之層較佳。透明導電層3為以對向濺鍍法所形成之層時,透明導電層3變緻密,易提高表面平滑性。其結果,透明導電層3的表面電阻變更低、光的透過率亦易提高。 The type of sputtering method is not particularly limited, and may be ion beam sputtering, magnetron sputtering, reactive sputtering, 2-pole sputtering, bias (Bias) sputtering, or opposite sputtering. Plating method, etc. The transparent conductive layer 3 is preferably a layer formed by a counter sputtering method. When the transparent conductive layer 3 is a layer formed by the opposite sputtering method, the transparent conductive layer 3 becomes dense and the surface smoothness is easily improved. As a result, the surface resistance of the transparent conductive layer 3 is changed low, and the transmittance of light is also easily improved.

<5.第2硫化防止層> <5. Second vulcanization preventing layer>

後述之第2高折射率層為硫化鋅含有層時,如圖1所示,於透明導電層3與第2高折射率層4之間,以包含含有氧化鋅、鎵鋅氧化物或氧化鎵之第2硫化防止層5b較佳。第2硫化防止層5b雖亦可形成於透明導電性薄膜100的絕緣區域b,但從難以被識別由導通區域a及絕緣區域b所構成之圖型的觀點來看,較佳為僅形成於導通區域a。 When the second high refractive index layer to be described later is a zinc sulfide-containing layer, as shown in FIG. 1, between the transparent conductive layer 3 and the second high refractive index layer 4, zinc oxide, gallium zinc oxide or gallium oxide is contained. The second vulcanization preventing layer 5b is preferred. The second vulcanization preventing layer 5b may be formed in the insulating region b of the transparent conductive film 100. However, from the viewpoint of being difficult to recognize the pattern formed by the conductive region a and the insulating region b, it is preferable to form only the Conduction area a.

該第2硫化防止層5b為含有氧化鋅、鎵鋅氧化物或氧化鎵之層,另外亦可為包含金屬氧化物、金屬氮化物、金屬氟化物等之層。第2硫化防止層5b中,除了氧化鋅之外,此等可僅包含一種,亦可包含二種以上。金屬氧化物、金屬氮化物、金屬氟化物,可與前述之第1高折射率層2所包含之金屬氧化物、金屬氮化物、金屬氟化物相同。此等當中,較佳為含有氧化鋅之層。 The second vulcanization preventing layer 5b is a layer containing zinc oxide, gallium zinc oxide or gallium oxide, and may be a layer containing a metal oxide, a metal nitride, a metal fluoride or the like. In addition to zinc oxide, the second vulcanization preventing layer 5b may be contained alone or in combination of two or more. The metal oxide, the metal nitride, and the metal fluoride may be the same as the metal oxide, metal nitride, or metal fluoride contained in the first high refractive index layer 2 described above. Among these, a layer containing zinc oxide is preferred.

將第2硫化防止層分成氧化鋅與氧化鎵或氧 化鋅與氮化矽等2成分之層時,可將個別的材料以使用以期望之比例混合之靶的濺鍍法形成層。又可藉由使用個別的靶同時使用之共濺鍍法,形成層。 Dividing the second vulcanization preventing layer into zinc oxide and gallium oxide or oxygen When a layer of two components such as zinc and tantalum nitride is used, an individual material may be formed into a layer by a sputtering method using a target mixed in a desired ratio. Layers can also be formed by co-sputtering using a separate target simultaneously.

另外,第2硫化防止層5b的層厚,從後述之第2高折射率層4之形成時的損壞來看,較佳為將透明導電層3的表面成為可保護之厚度。另外,透明導電層3所包含之金屬、與第2高折射率層4所包含之ZnS親和性高。因此,第2硫化防止層5b的層厚非常薄,且僅露出透明導電層3之一部分時,易提高透明導電層3或第2硫化防止層5b與第2高折射率層4的密著性。據此,第2硫化防止層5b之具體層厚較佳為0.1~5.0nm,更佳為0.5~2.0nm。第2硫化防止層5b的層厚係以橢圓偏光計測定。 In addition, the thickness of the second vulcanization preventing layer 5b is preferably a thickness that protects the surface of the transparent conductive layer 3 from the viewpoint of damage at the time of formation of the second high refractive index layer 4 to be described later. Further, the metal included in the transparent conductive layer 3 has high affinity with the ZnS contained in the second high refractive index layer 4. Therefore, when the thickness of the second vulcanization preventing layer 5b is extremely thin and only one portion of the transparent conductive layer 3 is exposed, the adhesion between the transparent conductive layer 3 or the second vulcanization preventing layer 5b and the second high refractive index layer 4 is easily improved. . Accordingly, the specific layer thickness of the second vulcanization preventing layer 5b is preferably from 0.1 to 5.0 nm, more preferably from 0.5 to 2.0 nm. The layer thickness of the second vulcanization preventing layer 5b is measured by an ellipsometer.

第2硫化防止層5b可為以真空蒸鍍法、濺鍍法、離子鍍法、電漿CVD法、熱CVD法等一般之氣相成膜法所形成之層。 The second vulcanization preventing layer 5b may be a layer formed by a general vapor phase film formation method such as a vacuum deposition method, a sputtering method, an ion plating method, a plasma CVD method, or a thermal CVD method.

第2硫化防止層5b圖型化成所期望形狀之層時,圖型化方法並未特別限制。第2硫化防止層5b,例如將具有所期望圖型之遮罩等配置於被成膜面,可為以氣相成膜法形成圖型狀之層,亦可為藉由周知之蝕刻法圖型化之層。 When the second vulcanization preventing layer 5b is patterned into a layer having a desired shape, the patterning method is not particularly limited. The second vulcanization preventing layer 5b may be, for example, a mask having a desired pattern or the like disposed on the film formation surface, and may be a layer formed by a vapor phase film formation method, or may be a well-known etching method. The layer of the type.

<6.第2高折射率層> <6. Second high refractive index layer>

第2高折射率層4係調整透明導電性薄膜100的導通 區域a,即用以調整形成透明導電層3之區域的光透過性(光學導納)之層,至少形成於透明導電性薄膜100的導通區域a。第2高折射率層4雖可形成於透明導電性薄膜100的絕緣區域b,但從由導通區域a及絕緣區域b所構成之圖型難以被識別的觀點來看,較佳為僅形成於導通區域a。第2高折射率層4由於從大氣側難以透過水分子及硫化物分子,故具有抑制透明導電層3之腐蝕的效果。 The second high refractive index layer 4 adjusts the conduction of the transparent conductive film 100 The region a, that is, a layer for adjusting the light transmittance (optical admittance) of the region in which the transparent conductive layer 3 is formed, is formed at least in the conduction region a of the transparent conductive film 100. Although the second high refractive index layer 4 can be formed in the insulating region b of the transparent conductive film 100, it is preferably formed only from the viewpoint that the pattern formed by the conductive region a and the insulating region b is difficult to be recognized. Conduction area a. Since the second high refractive index layer 4 is hard to permeate water molecules and sulfide molecules from the atmosphere side, it has an effect of suppressing corrosion of the transparent conductive layer 3.

第2高折射率層4以含有高折射率材料之層,為具有較前述之透明樹脂支撐體1的折射率更高之折射率之層,第1高折射率層之任一者之層為含有硫化鋅(ZnS)之層。第2高折射率層4中,可包含硫化鋅或其他介電性材料或氧化物半導體材料。硫化鋅或其他介電性材料或氧化物半導體材料的波長570nm之光的折射率,較透明基板1的波長570nm之光的折射率大0.1~1.1故較佳,更佳為大0.4~1.0。 The second high refractive index layer 4 is a layer having a high refractive index material and is a layer having a refractive index higher than that of the transparent resin support 1 described above, and the layer of any of the first high refractive index layers is A layer containing zinc sulfide (ZnS). The second high refractive index layer 4 may contain zinc sulfide or another dielectric material or an oxide semiconductor material. The refractive index of light having a wavelength of 570 nm of zinc sulfide or other dielectric material or oxide semiconductor material is preferably 0.1 to 1.1 larger than the refractive index of light having a wavelength of 570 nm of the transparent substrate 1, and more preferably 0.4 to 1.0.

另外,第2高折射率層4所包含之介電性材料或氧化物半導體材料的波長570nm之光具體之折射率較佳為大於1.5,更佳為1.7~2.5,再更佳為1.8~2.5。介電性材料或氧化物半導體材料的折射率較1.5更大時,藉由第2高折射率層4,充分調整透明導電性薄膜100的導通區域a之光學導納。尚,第2高折射率層4的折射率以第2高折射率層4所包含之材料的折射率、或第2高折射率層4所包含之材料的密度來調整。 Further, the dielectric material or the oxide semiconductor material contained in the second high refractive index layer 4 preferably has a refractive index of more than 1.5, more preferably 1.7 to 2.5, still more preferably 1.8 to 2.5. . When the refractive index of the dielectric material or the oxide semiconductor material is larger than 1.5, the optical admittance of the conduction region a of the transparent conductive film 100 is sufficiently adjusted by the second high refractive index layer 4. Further, the refractive index of the second high refractive index layer 4 is adjusted by the refractive index of the material contained in the second high refractive index layer 4 or the density of the material included in the second high refractive index layer 4.

第2高折射率層4所包含之介電性材料或氧 化物半導體材料可為絕緣性之材料,可為導電性之材料。介電性材料或氧化物半導體材料可為金屬氧化物。作為金屬氧化物之例,包含有二氧化矽(SiO2)、二氧化鈦(TiO2)、ITO(銦錫氧化物)、氧化鋅(ZnO)、氧化鈮(Nb2O5)、氧化鋯(ZrO2)、氧化鈰(CeO2)、五氧化鉭(Ta2O5)、五氧化鈦(Ti3O5)、七氧化鈦(Ti4O7)、三氧化鈦(Ti2O3)、氧化鈦(TiO)、二氧化錫(SnO2)、鑭氧化鈦(La2Ti2O7)、銦鋅氧化物(IZO)、鋁鋅氧化物(AZO)、鎵鋅氧化物(GZO)、銻錫氧化物(ATO)、銦鈰氧化物(ICO)、銦鎵鋅氧化物(IGZO)、氧化鉍(Bi2O3)、氧化鎵(Ga2O3)、氧化鍺(GeO2)、三氧化鎢(WO3)、氧化鉿(HfO2)、由鎵.銦及氧所構成之非晶質氧化物(a-GIO)等。第2高折射率層4中,可僅包含一種該金屬氧化物,亦可包含二種以上。 The dielectric material or the oxide semiconductor material included in the second high refractive index layer 4 may be an insulating material and may be a conductive material. The dielectric material or oxide semiconductor material can be a metal oxide. Examples of the metal oxide include cerium oxide (SiO 2 ), titanium oxide (TiO 2 ), ITO (indium tin oxide), zinc oxide (ZnO), cerium oxide (Nb 2 O 5 ), and zirconium oxide (ZrO). 2 ), cerium oxide (CeO 2 ), tantalum pentoxide (Ta 2 O 5 ), titanium oxide (Ti 3 O 5 ), titanium oxynitride (Ti 4 O 7 ), titanium oxide (Ti 2 O 3 ), titanium oxide (TiO), tin dioxide (SnO 2), lanthanum oxide (La 2 Ti 2 O 7) , indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), Antimony tin oxide (ATO), indium antimony oxide (ICO), indium gallium zinc oxide (IGZO), bismuth oxide (Bi 2 O 3 ), gallium oxide (Ga 2 O 3 ), germanium oxide (GeO 2 ), Tungsten trioxide (WO 3 ), yttrium oxide (HfO 2 ), by gallium. An amorphous oxide (a-GIO) composed of indium and oxygen. The second high refractive index layer 4 may contain only one type of the metal oxide, or may contain two or more types.

本發明中,上述金屬氧化物當中,較佳為銦鋅氧化物(ITO)、銦鋅氧化物(IZO)、鎵鋅氧化物(GZO)、銦鎵鋅氧化物(IGZO)。此等之材料,除了適合圖型化,同時可得到銀之保護機能之外,藉由使用此等之寬禁帶半導體(Wide-gap semiconductor),降低透明導電性薄膜的表面電阻值,有電流的取出變容易的效果。 In the present invention, among the metal oxides, indium zinc oxide (ITO), indium zinc oxide (IZO), gallium zinc oxide (GZO), or indium gallium zinc oxide (IGZO) is preferable. In addition to being suitable for patterning and obtaining silver protection function, these materials can reduce the surface resistance value of the transparent conductive film by using such a wide-gap semiconductor. The removal becomes easy.

又進而,本發明中,作為第2高折射率層4所包含之介電性材料或氧化物半導體材料,特佳為硫化鋅(ZnS)。於第2高折射率層4包含硫化鋅(ZnS)時,從透明樹脂支撐體1側變難以透過水分子或硫化物分子,抑制透明導電層3的腐蝕。 Further, in the present invention, the dielectric material or the oxide semiconductor material contained in the second high refractive index layer 4 is particularly preferably zinc sulfide (ZnS). When the second high refractive index layer 4 contains zinc sulfide (ZnS), it is difficult to permeate water molecules or sulfide molecules from the transparent resin support 1 side, and corrosion of the transparent conductive layer 3 is suppressed.

第2高折射率層可僅包含硫化鋅(ZnS)。相對於鋅原子數100,此時之組成比係硫原子數為50以上,且未達100。相對於鋅原子數100,較佳係硫原子數為83以上、且90以下。 The second high refractive index layer may contain only zinc sulfide (ZnS). With respect to the number of zinc atoms of 100, the composition ratio of the sulfur atom at this time is 50 or more and less than 100. The number of sulfur atoms is preferably 83 or more and 90 or less with respect to 100 zinc atoms.

前述第2高折射率層4中,可與硫化鋅(ZnS)一起包含其他材料。與硫化鋅(ZnS)一起包含之材料,可為上述介電性材料或氧化物半導體材料之金屬氧化物或二氧化矽(SiO2)等,特佳為二氧化矽(SiO2)。與硫化鋅(ZnS)一起包含二氧化矽(SiO2)時,第2高折射率層易變成非晶質,易提高透明導電體的可撓性。此時之組成比僅依前述硫化鋅(ZnS)的情況下,相對於鋅原子數100,其組成比較佳係硫原子數為50以上,且未達100。相對於鋅原子數100,更佳係硫原子數為83以上,且90以下。 The second high refractive index layer 4 may contain other materials together with zinc sulfide (ZnS). The material contained together with zinc sulfide (ZnS) may be a metal oxide of the above dielectric material or oxide semiconductor material or cerium oxide (SiO 2 ), etc., particularly preferably cerium oxide (SiO 2 ). When cerium oxide (SiO 2 ) is contained together with zinc sulfide (ZnS), the second high refractive index layer tends to be amorphous, and the flexibility of the transparent conductor is easily increased. When the composition ratio at this time is only in the case of the above zinc sulfide (ZnS), the composition of the sulfur atom is preferably 50 or more and less than 100 with respect to the number of zinc atoms of 100. The number of sulfur atoms is preferably 83 or more and 90 or less with respect to 100 zinc atoms.

第2高折射率層4與硫化鋅(ZnS)一起包含其他材料時,硫化鋅(ZnS)的量,相對於第2高折射率層4的總體積,較佳為0.1~95體積%,更佳為50~90體積%以下,再更佳為60~85體積%。ZnS的比率高時,濺鍍速度變快,第2高折射率層4的成形成速度亦變快。另外,大量包含ZnS以外的成分時,提高第2高折射率層4的非晶質性,抑制第2高折射率層4的破裂。 When the second high refractive index layer 4 contains other materials together with zinc sulfide (ZnS), the amount of zinc sulfide (ZnS) is preferably 0.1 to 95% by volume based on the total volume of the second high refractive index layer 4, Preferably, it is 50 to 90% by volume, and more preferably 60 to 85% by volume. When the ratio of ZnS is high, the sputtering rate is increased, and the formation speed of the second high refractive index layer 4 is also increased. When a large amount of components other than ZnS are contained, the amorphousness of the second high refractive index layer 4 is improved, and the crack of the second high refractive index layer 4 is suppressed.

作為將硫化鋅及二氧化矽(SiO2)之組成控制在上述範圍內之方法,例如可利用:使用以適當濃度含有二氧化矽(SiO2)之硫化鋅(Zns)的靶之濺鍍法、同時使用二氧化矽(SiO2)與硫化鋅(ZnS)的靶之共濺鍍法來進行。 As a method of zinc sulfide and silicon dioxide (SiO 2) to control the composition within the above range, for example, may be utilized: sputtering using a target of silicon dioxide containing an appropriate concentration (SiO 2) of zinc sulfide (Zns) plating method It is carried out by co-sputtering using a target of cerium oxide (SiO 2 ) and zinc sulfide (ZnS).

與硫化鋅一起於上述範圍內包含二氧化矽(SiO2)時,第2高折射率層易成為非晶質,易提高透明導電性薄膜的可撓性。 When the cerium oxide (SiO 2 ) is contained in the above range together with the zinc sulfide, the second high refractive index layer tends to be amorphous, and the flexibility of the transparent conductive film is easily improved.

ZnS的比率高時,加快濺鍍速度,第2高折射率層4的形成速度變快。另外,ZnS以外的成分變多時,提高第2高折射率層4的非晶質性,抑制第2高折射率層4的破裂。 When the ratio of ZnS is high, the sputtering rate is increased, and the formation speed of the second high refractive index layer 4 is increased. When the amount of components other than ZnS is increased, the amorphous property of the second high refractive index layer 4 is improved, and the crack of the second high refractive index layer 4 is suppressed.

第2高折射率層4的層厚,較佳為15~150nm,更佳為20nm~80nm。第2高折射率層4的層厚為15nm以上時,藉由第2高折射率層4,充分調整透明導電體100之導通區域a的光學導納。另外,第2高折射率層4的層厚若為150nm以下,包含第2高折射率層4之區域的光透過性很難降低。第2高折射率層4的層厚係以橢圓偏光計測定。 The layer thickness of the second high refractive index layer 4 is preferably 15 to 150 nm, more preferably 20 nm to 80 nm. When the layer thickness of the second high refractive index layer 4 is 15 nm or more, the optical admittance of the conduction region a of the transparent conductor 100 is sufficiently adjusted by the second high refractive index layer 4. When the layer thickness of the second high refractive index layer 4 is 150 nm or less, the light transmittance of the region including the second high refractive index layer 4 is hardly lowered. The layer thickness of the second high refractive index layer 4 is measured by an ellipsometer.

第2高折射率層4的形成方法並未特別限制,可為以真空蒸鍍法、濺鍍法、離子鍍法、電漿CVD法、熱CVD法等一般之氣相成膜法所形成之層。從降低第2高折射率層4的透濕性的觀點來看,第2高折射率層4係以濺鍍法所形成之膜特佳。 The method for forming the second high refractive index layer 4 is not particularly limited, and may be formed by a general vapor phase deposition method such as a vacuum deposition method, a sputtering method, an ion plating method, a plasma CVD method, or a thermal CVD method. Floor. From the viewpoint of lowering the moisture permeability of the second high refractive index layer 4, the second high refractive index layer 4 is particularly preferably a film formed by a sputtering method.

又,第2高折射率層4圖型化成為所期望形狀之層時,圖型化方法並未特別限制。第2高折射率層4,例如將具有所期望圖型之遮罩等配置於被成膜面,可為以氣相成膜法形成圖型狀之層,可為藉由周知之蝕刻法經圖型化之層。 Further, when the second high refractive index layer 4 is patterned into a layer having a desired shape, the patterning method is not particularly limited. For example, a mask having a desired pattern or the like is disposed on the film formation surface, and the second high refractive index layer 4 may be formed into a pattern by a vapor phase film formation method, and may be formed by a well-known etching method. The layer of patterning.

<7.硬塗層> <7. Hard coating>

在透明導電性薄膜的製造時,以防止透明樹脂支撐體的表面產生傷痕為目的,以透明樹脂支撐體至少一側的面,較佳為於透明導電層側設置硬塗層為佳。 In the production of the transparent conductive film, in order to prevent the surface of the transparent resin support from being scratched, it is preferable to provide a hard coat layer on at least one side of the transparent resin support, preferably on the side of the transparent conductive layer.

藉由於透明樹脂支撐體之至少任一側的面設置硬塗層,從透明樹脂支撐體的製膜時,在本發明之透明導電性薄膜的製作過程,具有防止在薄膜之捲繞.搬送.退繞之薄膜表面間的面因壓或摩擦導致之傷痕的發生的效果。 By providing a hard coat layer on the surface of at least one side of the transparent resin support, it is possible to prevent the winding of the transparent conductive film of the present invention during film formation from the transparent resin support. Transfer. The effect of the occurrence of a flaw caused by pressure or friction on the surface between the unwound film surfaces.

硬塗層係塗佈乾燥紫外線硬化性丙烯酸酯系樹脂,然後在紫外線光源硬化而提供。 The hard coat layer is coated with a dry ultraviolet curable acrylate-based resin and then cured by an ultraviolet light source.

硬塗層的層厚較佳為0.2~5.0μm的範圍內,硬塗層的層厚為上述範圍內時,由於得到充分之耐傷效果,可防止在製造過程之傷痕的發生,作為透明導電性薄膜時可得到充分之透明性。 When the layer thickness of the hard coat layer is preferably in the range of 0.2 to 5.0 μm, and the layer thickness of the hard coat layer is within the above range, since sufficient scratch resistance is obtained, occurrence of scratches in the manufacturing process can be prevented, as transparent conductivity. Sufficient transparency is obtained when the film is used.

硬塗層除了塗佈之外,亦可將藉由CVD法、濺鍍法、蒸鍍法等之SiO2薄膜藉由層合100nm以下的層厚來製作。 In addition to coating, the hard coat layer may be formed by laminating a SiO 2 film such as a CVD method, a sputtering method, or a vapor deposition method to a layer thickness of 100 nm or less.

<8.抗結塊層> <8. Anti-caking layer>

於與設置本發明之透明導電性薄膜之透明樹脂支撐體的透明導電層的面相反側的面,較佳為設置十點平均粗糙度Rz為50nm以下之抗結塊層。所謂抗結塊層,儘管是 為了防止捲繞處理薄膜時薄膜彼此的貼附,但此係於薄膜的表面設置任意之粗糙度,藉由將此間隙埋入空氣,可防止退繞.捲繞操作時薄膜彼此的貼附。 It is preferable to provide an anti-caking layer having a ten-point average roughness Rz of 50 nm or less on the surface opposite to the surface of the transparent conductive layer on which the transparent conductive support of the transparent conductive film of the present invention is provided. The so-called anti-caking layer, although it is In order to prevent the film from sticking to each other when the film is wound, this method is provided with any roughness on the surface of the film, and the gap is buried in the air to prevent unwinding. The films are attached to each other during the winding operation.

所謂十點平均粗糙度Rz係指JIS B0601:1994所規定之Rz。 The ten-point average roughness Rz refers to Rz prescribed in JIS B0601:1994.

抗結塊層可藉由塗佈混合微粒子於丙烯酸酯系樹脂等之樹脂之塗佈液來設置。作為微粒子,除了二氧化矽等之無機微粒子之外,可使用樹脂之微粒子。作為上述微粒子的平均粒徑,較佳為使用10~300nm的範圍內者。 The anti-caking layer can be provided by applying a coating liquid in which fine particles are mixed with a resin such as an acrylate resin. As the fine particles, in addition to the inorganic fine particles such as cerium oxide, fine particles of the resin can be used. The average particle diameter of the fine particles is preferably in the range of 10 to 300 nm.

本發明之透明導電性薄膜中,透明樹脂支撐體上所設置之高折射率層、硫化防止層及透明導電層的各薄膜層,較佳為以濺鍍法或蒸鍍法所形成者。前述透明樹脂支撐體上所設置之各薄膜層為以濺鍍法或蒸鍍法所形成者時,提昇生產性得到適合大量生產的效果。惟,即使是藉由化學氣相蒸鍍法(CVD法)等其他全部薄層製造方法者,亦不損於藉由本發明所得之價值。 In the transparent conductive film of the present invention, each of the high refractive index layer, the vulcanization preventing layer, and the transparent conductive layer provided on the transparent resin support is preferably formed by a sputtering method or a vapor deposition method. When each of the thin film layers provided on the transparent resin support is formed by a sputtering method or a vapor deposition method, the productivity is improved and an effect suitable for mass production is obtained. However, even if all other thin layer manufacturing methods such as chemical vapor deposition (CVD) are used, the value obtained by the present invention is not impaired.

≪透明導電層的圖型化≫ 图Transformation of transparent conductive layer≫

使用本發明之透明導電性薄膜,例如為了製作靜電容量方式的觸控面板,如圖3所示,較佳為將透明導電層包含複數之導通區域a、與和此區別之線狀的絕緣區域b圖型化成特定之形狀。 When the transparent conductive film of the present invention is used, for example, to form a touch panel of a capacitance type, as shown in FIG. 3, it is preferable that the transparent conductive layer includes a plurality of conductive regions a and a linear insulating region different from the above. b is patterned into a specific shape.

作為含有銀之透明導電層的劣化因子,可列 舉大氣中所包含之水分或硫化物。此等崁入透明樹脂支撐體或硬塗層,又透過硬塗層到達透明導電層為止。據此,僅透明樹脂支撐體與硬塗層,透明導電層之銀的保護機能並不足夠,因此第1高折射率層,較佳為有第1硫化防止層時,亦包含硫化防止層未圖型化於透明樹脂支撐體上而殘存,從防止透明導電層劣化的觀點來看較佳。 As a deterioration factor of a transparent conductive layer containing silver, it can be listed Give water or sulfide contained in the atmosphere. These penetrate into the transparent resin support or hard coat layer and pass through the hard coat layer to reach the transparent conductive layer. Accordingly, since only the transparent resin support and the hard coat layer and the protective function of the silver of the transparent conductive layer are insufficient, the first high refractive index layer preferably contains the vulcanization preventing layer when the first vulcanization preventing layer is provided. The pattern is formed on the transparent resin support and remains, and is preferable from the viewpoint of preventing deterioration of the transparent conductive layer.

作為圖型化透明導電層之方法,可使用周知之方法,作為如此圖型化之方法,具體而言,可如以下般進行。 As a method of patterning the transparent conductive layer, a well-known method can be used, and as such a method of patterning, specifically, it can be performed as follows.

(圖型化步驟) (graphical step)

以下,針對藉由微影蝕刻法之電極圖型的形成方法進行說明。 Hereinafter, a method of forming an electrode pattern by a photolithography method will be described.

所謂本發明所適用之微影蝕刻法,係藉由經歷硬化性樹脂等之抗蝕塗佈、預備加熱、曝光、顯像(未硬化樹脂的去除)、清洗、藉由蝕刻液之蝕刻處理、抗蝕剝離的各步驟,將透明導電層如圖3所示加工成所期望之圖型的方法。 The lithography method to which the present invention is applied is subjected to resist coating such as curable resin, preliminary heating, exposure, development (removal of uncured resin), cleaning, etching treatment by an etching solution, In each step of resist stripping, the transparent conductive layer is processed into a desired pattern as shown in FIG.

於本發明,可適當利用以往周知之一般微影蝕刻法。例如作為抗蝕,正型或負型之任一種抗蝕皆可使用。又,抗蝕塗佈後如有必要可實施預備加熱或預焙。於曝光時,配置具有所期望圖型之圖型遮罩,在其上,照射適合所用之抗蝕之波長的光,一般而言為紫外線或電子束等即可。曝光後,以適合所用之抗蝕的顯像液進行顯像。 In the present invention, a conventional microlithography method known in the art can be suitably used. For example, any of the resists of the resist type, positive type or negative type can be used. Further, after the resist coating, preliminary heating or prebaking may be performed if necessary. At the time of exposure, a pattern mask having a desired pattern is disposed, and light having a wavelength suitable for the resist to be used is irradiated thereon, and generally, ultraviolet rays, electron beams, or the like may be used. After the exposure, development was carried out with a developing solution suitable for the resist used.

顯像後,藉由以水等之清洗液停止顯像,同時並進行洗淨,而形成抗蝕圖型。其次,將所形成之抗蝕圖型,如有必要實施前處理或後烘烤後,藉由包含有機溶劑之蝕刻液的蝕刻,進行於抗蝕未被保護之區域之中間層的溶解及銀薄膜電極的去除。 After the development, the development is stopped by washing with water or the like, and the pattern is formed by washing. Next, if the formed resist pattern is subjected to pre-treatment or post-baking, the etching of the etching solution containing the organic solvent is performed to dissolve the silver in the intermediate layer of the unprotected region and silver. Removal of the film electrode.

蝕刻後,藉由剝離所殘留之抗蝕,得到具有所期望圖型之透明電極。如此,本發明所適用之微影蝕刻法,係本發明領域具有通常知識者一般所認知之方法,其具體之適用態樣,若為本發明領域具有通常知識者,可因應所期望目的輕易選定。 After the etching, a transparent electrode having a desired pattern is obtained by peeling off the remaining resist. Thus, the lithography method to which the present invention is applied is a method generally recognized by those skilled in the art, and the specific application aspect thereof can be easily selected according to the desired purpose if it is a general knowledge in the field of the invention. .

其次,使用圖4,針對可適用本發明之電極圖型的形成方法進行說明。 Next, a method of forming an electrode pattern to which the present invention is applicable will be described with reference to Fig. 4 .

圖4係表示於本發明之透明導電體將電極圖型以微影蝕刻法形成之一例之步驟流程圖。 Fig. 4 is a flow chart showing the steps of forming an electrode pattern by photolithography in the transparent conductor of the present invention.

作為第1步驟,如圖4之(a)所示,於透明樹脂支撐體1上以第1高折射率層2、第1硫化防止層5a、透明導電層3、第2硫化防止層5b、第2高折射率層4的順序製作經層合之透明導電性薄膜100。 As a first step, as shown in FIG. 4( a ), the first high refractive index layer 2 , the first vulcanization preventing layer 5 a , the transparent conductive layer 3 , and the second vulcanization preventing layer 5 b are formed on the transparent resin support 1 . The laminated transparent conductive film 100 is produced in the order of the second high refractive index layer 4.

其次,於圖4之(b)所示之抗蝕膜的形成步驟,均勻塗佈由感光性樹脂組成物等所構成之抗蝕膜6於透明導電性薄膜100上。作為感光性樹脂組成物,可使用負型感光性樹脂組成物或者正型感光性樹脂組成物。 Next, in the step of forming the resist film shown in FIG. 4(b), the resist film 6 composed of a photosensitive resin composition or the like is uniformly applied onto the transparent conductive film 100. As the photosensitive resin composition, a negative photosensitive resin composition or a positive photosensitive resin composition can be used.

作為塗佈方法,藉由微型凹版塗佈、旋塗、浸塗、簾流塗、輥塗、噴塗、狹縫塗佈等之周知的方法, 塗佈於透明導電性薄膜100上,可用熱板、烤箱等之加熱裝置進行預焙。預焙,例如使用熱板等,可於50℃以上、150℃以下的範圍進行30秒~30分鐘。 As a coating method, a well-known method such as micro gravure coating, spin coating, dip coating, curtain flow coating, roll coating, spray coating, slit coating, or the like is used. It is applied to the transparent conductive film 100, and may be prebaked by a heating device such as a hot plate or an oven. The prebaking can be carried out for 30 seconds to 30 minutes in a range of 50 ° C or more and 150 ° C or less, for example, using a hot plate or the like.

其次,於圖4之(c)所示之曝光步驟,透過藉由特定之電極圖型所製作之遮罩7,使用步進器、鏡面投影遮罩定位儀(MPA)、平行光遮罩定位儀等之曝光機,將10~4000J/m2程度(波長365nm曝光量換算)之光,照射於用以下之步驟去除之抗蝕膜6A。曝光光源並未限制,可使用紫外線、電子束、或KrF(波長248nm)雷射、ArF(波長193nm)雷射等。 Next, in the exposure step shown in (c) of FIG. 4, using a mask 7 made by a specific electrode pattern, a stepper, a mirror projection mask locator (MPA), a parallel light mask positioning is used. The exposure machine of the apparatus or the like irradiates the light of 10 to 4000 J/m 2 (converted by the exposure amount of 365 nm) to the resist film 6A removed by the following procedure. The exposure light source is not limited, and ultraviolet rays, electron beams, or KrF (wavelength 248 nm) lasers, ArF (wavelength 193 nm) lasers, or the like can be used.

其次,於圖4(d)所示之顯像步驟,將已曝光完之透明導電性薄膜浸漬於顯像液,溶解經光照射之區域的抗蝕膜6A。 Next, in the developing step shown in Fig. 4 (d), the exposed transparent conductive film is immersed in a developing liquid to dissolve the resist film 6A in the region irradiated with light.

作為顯像方法,較佳為以淋浴、浸漬、槳式等之方法浸漬5秒~10分鐘於顯像液。作為顯像液,可使用周知之鹼顯像液。作為具體例,可列舉鹼金屬之氫氧化物、碳酸鹽、磷酸鹽、矽酸鹽、硼酸鹽等之無機鹼、2-二乙基胺基乙醇、單乙醇胺、二乙醇胺等之胺類、四甲基氫氧化銨、膽鹼等之包含一種或者二種以上4級銨鹽之水溶液等。顯像後,以水清洗較佳,接著可於50℃以上且150℃以下的範圍進行乾燥烘烤。 As the developing method, it is preferred to immerse for 5 seconds to 10 minutes in a developing solution by a shower, dipping, paddle or the like. As the developing liquid, a well-known alkali developing solution can be used. Specific examples thereof include an inorganic base such as an alkali metal hydroxide, a carbonate, a phosphate, a citrate or a borate; an amine such as 2-diethylaminoethanol, monoethanolamine or diethanolamine; An aqueous solution containing one or two or more kinds of a fourth-order ammonium salt such as methylammonium hydroxide or choline. After development, it is preferably washed with water, and then dried and baked at a temperature of 50 ° C or more and 150 ° C or less.

之後,為了去除第2高折射率層及第2硫化防止層,使用林純藥工業(股)製「PURE ETCH 100」作為蝕刻液。(圖4(e)) Then, in order to remove the second high refractive index layer and the second vulcanization preventing layer, "PURE ETCH 100" manufactured by Ivy Pure Chemical Industries, Ltd. was used as an etching liquid. (Fig. 4(e))

其次,為了僅溶解透明導電層、第1硫化防止層,而將關東化學(股)製「SEA-5」在短時間之蝕刻實施。(圖4(f)) Next, in order to dissolve only the transparent conductive layer and the first vulcanization preventing layer, "SEA-5" manufactured by Kanto Chemical Co., Ltd. was subjected to etching for a short period of time. (Fig. 4(f))

最後,如圖4之(g)所示,浸漬於抗蝕膜剝離液,例如浸漬於長瀨康泰斯公司製之「N-300」,去除抗蝕膜6,可製作具有殘留第1高折射率層2之電極圖型的透明導電性薄膜。 Finally, as shown in FIG. 4(g), it is immersed in a resist stripping liquid, for example, immersed in "N-300" manufactured by Nagase Contax, and the resist film 6 is removed to produce a residual first high refraction. A transparent conductive film of the electrode pattern of the layer 2.

[實施例] [Examples]

以下雖列舉實施例具體說明本發明,但本發明並非被限定於此等者。 Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto.

≪透明導電性薄膜的製作≫ ≪Preparation of transparent conductive film≫

透明導電性薄膜的製作中,使用以下之透明樹脂支撐體及導電性材料。 In the production of the transparent conductive film, the following transparent resin support and conductive material are used.

(透明樹脂支撐體的材料) (Material of transparent resin support)

於此,d為支撐體的厚度,Ro為面內遲緩,Rt為厚度方向的遲緩。Ro、Rt為在測定波長589nm之值,作為代表值。 Here, d is the thickness of the support, Ro is slow in the plane, and Rt is the retardation in the thickness direction. Ro and Rt are values at a measurement wavelength of 589 nm, and are representative values.

1.TPS1:柯尼卡美能達(股)製「ZeroTac」、d=50μm Ro=0nm Rt=0nm 1.TPS1: "KeroTac" manufactured by Konica Minolta Co., Ltd., d=50μm Ro=0nm Rt=0nm

2.TPS2:柯尼卡美能達(股)製「柯尼卡美能達Tac」、厚度50μm Ro=5nm Rt=30nm 2.TPS2: Konica Minolta Co., Ltd. "Konica Minolta Tac", thickness 50μm Ro=5nm Rt=30nm

3.PET:東洋紡製聚對苯二甲酸乙二酯薄膜「Cosmo Shine A4300」厚度50μm Ro=5000nm Rt=10000nm 3.PET: Polyethylene terephthalate film "Tosoh Shine A4300" is 50μm Ro=5000nm Rt=10000nm

4.PC:鐘淵製聚碳酸酯薄膜「Elmec R40#435薄膜」厚度40μm Ro=435nm Rt=600nm 4.PC: Zhongyuan polycarbonate film "Elmec R40#435 film" thickness 40μm Ro=435nm Rt=600nm

5.TPS3:日本Zeon製環烯烴薄膜「ZEONOR Z14(50μm)」厚度50μm Ro=1.5nm Rt=10nm 5.TPS3: Japan Zeon cycloolefin film "ZEONOR Z14 (50μm)" thickness 50μm Ro=1.5nm Rt=10nm

6.TPS4:柯尼卡美能達(股)製「VA-TAC」厚度80μm Ro=50nm Rt=130nm 6.TPS4: Konica Minolta Co., Ltd. "VA-TAC" thickness 80μm Ro=50nm Rt=130nm

(導電性材料) (conductive material)

7.APC:古谷金屬製「Ag合金」(含有Pd、Cu) 7.APC: "Ag alloy" (including Pd, Cu) made of Gu Gu metal

8.APC-TR:古谷金屬製「Ag合金」(含有Pd、Cu) 8.APC-TR: "Ag alloy" made of Gu Gu metal (containing Pd, Cu)

9.APC-SR:古谷金屬製「Ag合金」(含有Pd、Cu) 9.APC-SR: "Ag alloy" made of Gu Gu metal (containing Pd, Cu)

上述3等級之合金各別的組成不同。 The alloys of the above three grades have different compositions.

10.GB-100:神鋼科研製「Ag合金」Ag(99.0atm%)/Bi(1.0atm%) 10.GB-100: Kobelco Scientific Research "Ag Alloy" Ag (99.0atm%) / Bi (1.0atm%)

11.GBR-15:神鋼科研製「Ag合金」Ag(98.35atm%)/Bi(0.35atm%)/Ge(0.3atm%)/Au(1.0atm%) 11.GBR-15: Ag steel research and development "Ag alloy" Ag (98.35atm%) / Bi (0.35atm%) / Ge (0.3atm%) / Au (1.0atm%)

12.Ag:銀(純度99.9%以上) 12.Ag: silver (purity of 99.9% or more)

13.Cu:銅(純度99.9%以上) 13.Cu: copper (purity of 99.9% or more)

14.Au:金(純度99.9%以上) 14.Au: Gold (purity of 99.9% or more)

高折射率層、硫化防止層中係使用以下之材料。 The following materials are used in the high refractive index layer and the vulcanization preventing layer.

15.ITO:銦錫氧化物 15.ITO: Indium Tin Oxide

16.SiN:氮化矽n=2.02(n表示折射率) 16.SiN: tantalum nitride n=2.02 (n indicates refractive index)

17.Nb2O5:五氧化鈮n=2.31 17.Nb 2 O 5 : antimony pentoxide n=2.31

18.ZnO:氧化鋅n=1.95 18.ZnO: zinc oxide n=1.95

19.IZO:銦鋅氧化物 19.IZO: Indium Zinc Oxide

20.GZO:鎵鋅氧化物 20.GZO: gallium zinc oxide

21.IGZO:銦鎵鋅氧化物 21.IGZO: Indium gallium zinc oxide

22.TiN:氮化鈦 22.TiN: titanium nitride

23.Ga2O3:氧化鎵 23.Ga 2 O 3 : gallium oxide

24.Bi2O3:氧化鉍 24.Bi 2 O 3 : yttrium oxide

25.ZnS:調整Zn與S之組成的燒結體 25.ZnS: a sintered body that adjusts the composition of Zn and S

26.ZnS-SiO2:調整ZnS與SiO2之組成的混合物 26.ZnS-SiO 2 : a mixture of ZnS and SiO 2

27.ZnO-Ga2O3:調整ZnO與Ga2O3之組成的混合物 27.ZnO-Ga 2 O 3 : adjusting a mixture of the composition of ZnO and Ga 2 O 3

28.ZnO-SiN:調整ZnO與SiN之組成的混合物 28.ZnO-SiN: adjusting the mixture of the composition of ZnO and SiN

29.Ga2O3-SiN:調整Ga2O3與SiN之組成的混合物 29.Ga 2 O 3 -SiN: adjusting the mixture of the composition of Ga 2 O 3 and SiN

30.ZnS-ZnO:調整ZnS與ZnO之組成的混合物 30. ZnS-ZnO: a mixture of ZnS and ZnO

31.ZnS-SiN:調整ZnS與SiN之組成的混合物 31. ZnS-SiN: adjusting the mixture of the composition of ZnS and SiN

32.ZnS-TiN:調整ZnS與TiN之組成的混合物 32. ZnS-TiN: adjusting the mixture of the composition of ZnS and TiN

33.ZnS-Bi2O3:調整ZnS與Bi2O3之組成的混合物 33.ZnS-Bi 2 O 3 : adjusting a mixture of the composition of ZnS and Bi 2 O 3

又,上述26、30~33之ZnS與25相同係使用調整Zn與S之組成的燒結體來作為混合物。 Further, the ZnS of the above 26, 30 to 33 is the same as the 25, and a sintered body having a composition of Zn and S is used as a mixture.

<透明導電性薄膜1的製作> <Production of Transparent Conductive Film 1> (第1高折射率層) (first high refractive index layer)

作為透明樹脂支撐體,使用切出100mm平方之柯尼卡美能達(股)製「ZeroTack」(TPS1)(Ro=0nm、Rt=0nm、d=50μm)。進行使用大阪真空社之磁控管濺鍍裝置之濺 鍍,形成第1高折射率層。 As the transparent resin support, "ZeroTack" (TPS1) (Ro = 0 nm, Rt = 0 nm, d = 50 μm) manufactured by Konica Minolta Co., Ltd. having a square of 100 mm square was used. Splashing using a magnetron sputtering device from Osaka Vacuum Society Plating to form a first high refractive index layer.

配置調整組成之ZnS靶於陰極,在Ar20sccm、濺鍍壓0.2Pa、室溫下以整體之形成速度成為3.0Å/sec(0.3nm/sec)的方式,將靶側電力定為150W,形成層厚40.0nm之第1高折射率層。對陰極供給RF電力。 The ZnS target having the adjusted composition was placed at the cathode, and the target side electric power was set to 150 W at a formation rate of 3.0 Å/sec (0.3 nm/sec) at an Ar20 sccm, a sputtering pressure of 0.2 Pa, and a room temperature, and a layer was formed. The first high refractive index layer having a thickness of 40.0 nm. RF power is supplied to the cathode.

靶-基板間的距離為90mm。根據後述之組成分析試驗,此時之Zn與S的組成比,相對於Zn原子數100,S原子數為83。 The distance between the target and the substrate was 90 mm. According to the compositional analysis test described later, the composition ratio of Zn to S at this time was 83 with respect to the number of Zn atoms and the number of S atoms was 83.

(第1硫化防止層) (first vulcanization preventing layer)

其次,在Ar 20sccm、O2 0sccm、濺鍍壓0.1Pa、室溫下,將靶側電力定為150W,以形成速度1.1Å/sec(0.11nm/sec)ZnO成為層厚1.0nm的方式進行RF濺鍍。 Next, the target side electric power was set to 150 W at Ar 20 sccm, O 2 0 sccm, sputtering voltage 0.1 Pa, and room temperature, and the rate of formation of 1.1 Å/sec (0.11 nm/sec) of ZnO was 1.0 nm. RF sputtering.

(透明導電層) (transparent conductive layer)

接著,於前述第1硫化防止層上,使用大阪真空社之磁控管濺鍍裝置,在Ar 20sccm、濺鍍壓0.5Pa、室溫下,以形成速度14Å/sec(1.4nm/sec)濺鍍銀,形成層厚7.5nm之透明導電層。 Next, on the first vulcanization preventing layer, a magnetron sputtering apparatus of Osaka Vacuum Co., Ltd. was used to form a sputtering speed of 14 Å/sec (1.4 nm/sec) at Ar 20 sccm, a sputtering pressure of 0.5 Pa, and room temperature. Silver plating was performed to form a transparent conductive layer having a layer thickness of 7.5 nm.

(第2硫化防止層) (second vulcanization preventing layer)

進而接著,在Ar 20sccm、O2 0sccm、濺鍍壓0.1Pa、室溫下,以形成速度1.1Å/sec(0.11nm/sec)將ZnO成為層厚1.0nm的方式進行RF濺鍍。 Further, RF sputtering was performed so that ZnO became a layer thickness of 1.0 nm at a formation rate of 1.1 Å/sec (0.11 nm/sec) at Ar 20 sccm, O 2 0 sccm, sputtering pressure of 0.1 Pa, and room temperature.

(第2高折射率層) (second high refractive index layer)

其次,以與第1高折射率層相同之方法濺鍍ZnS,形成層厚40.0nm之第2高折射率層,製作透明導電性薄膜1。此時之Zn與S的組成比,相對於Zn原子數100,S原子數為83。 Next, ZnS was sputtered in the same manner as in the first high refractive index layer to form a second high refractive index layer having a layer thickness of 40.0 nm, thereby producing a transparent conductive film 1. The composition ratio of Zn to S at this time is 83 with respect to the number of Zn atoms and 83.

<透明導電性薄膜2~36及101~107的製作> <Production of Transparent Conductive Films 2 to 36 and 101 to 107>

除了於表1及表2之構成之外,交換適當靶材料,並且與前述透明導電性薄膜1同樣進行,製作本發明之透明導電性薄膜2~36及比較例之透明導電性薄膜101~107。 Except for the structures of Tables 1 and 2, the transparent conductive films 2 to 36 of the present invention and the transparent conductive films 101 to 107 of the comparative examples were produced in the same manner as the transparent conductive film 1 described above. .

於此,在第1高折射率層及第2項折射率層之鋅與硫之各元素組成比的調整,所形成之層中,將調整成如所期望之比例的元素組成比之燒結體作為靶使用,藉由濺鍍來進行。又,針對含有在其他各層之二種材料之層的形成,將個別的材料預先調整成如表1及表2所記載之比例之混合物作為靶使用,藉由濺鍍來形成層。 Here, in the first high refractive index layer and the second refractive index layer, the composition ratio of each element of zinc and sulfur is adjusted, and the formed layer is adjusted to have a desired composition ratio of the sintered body. It is used as a target by sputtering. Further, for the formation of the layers containing the two kinds of materials in the other layers, the individual materials were previously adjusted to have a mixture of the ratios shown in Tables 1 and 2 as a target, and the layer was formed by sputtering.

(鋅及硫原子數的組成比分析) (analysis of composition ratio of zinc and sulfur atoms)

鋅與硫的元素定量分析中,將特定之ZnS薄層以單層製作經形成之參照試料於BK7玻璃上,對於此等試料,使用超高純度過氧化氫(關東化學股份有限公司製)使其充分溶解ZnS層,對於以超純水稀釋所得之20ml溶液中所包含之各元素,使用(股)日立high-tech science製之ICP發光分光分析裝置「SPS3520UV」進行基體匹配(Matrix matching)。 In the quantitative analysis of the elements of zinc and sulfur, a specific ZnS thin layer was formed into a single layer of the reference sample formed on BK7 glass. For these samples, ultra-high purity hydrogen peroxide (manufactured by Kanto Chemical Co., Ltd.) was used. The ZnS layer was sufficiently dissolved, and each element contained in a 20 ml solution obtained by dilution with ultrapure water was subjected to matrix matching using an ICP emission spectroscopic analyzer "SPS3520UV" manufactured by Hitachi High-tech Science.

在定量,作為參考,對鋅使用原子吸光分析用鋅標準液1000mg/l(關東化學股份有限公司製)、對硫使用硫標準液Sulfur 1000mg/l(SPEX)。測定波長,鋅為213.924nm,硫為180.734nm。尚,進行對清淨之BK7玻璃進行同樣處置所得之溶液樣品的分析,確認作為妨礙本試驗之背景噪音的鋅、硫成分為檢出界限以下。 For the purpose of quantification, 1000 mg/l of zinc standard solution for atomic absorption analysis (manufactured by Kanto Chemical Co., Ltd.) and sulfur standard solution Sulfur 1000 mg/l (SPEX) were used for zinc. The wavelength was measured, zinc was 213.924 nm, and sulfur was 180.734 nm. Further, analysis of a solution sample obtained by subjecting the cleaned BK7 glass to the same treatment was carried out, and it was confirmed that the zinc and sulfur components which are the background noises which hindered the test were below the detection limit.

≪透明導電性薄膜的評價≫ Evaluation of ≪Transparent Conductive Film≫

針對如上述進行所製作之本發明之透明導電性薄膜1~36及比較例之透明導電性薄膜101~107,將以下三種的評價以後述之信賴性加速試驗的前後試驗。 The transparent conductive films 1 to 36 of the present invention produced as described above and the transparent conductive films 101 to 107 of the comparative examples were subjected to the following three evaluations of the reliability test before and after the reliability test.

<1.導電性評價(表面電阻)> <1. Conductivity evaluation (surface resistance)>

透明導電性薄膜之導電性評價係使用低電阻率計「Loresta-EP」((股)三菱化學Analy Tech製)進行。 The conductivity evaluation of the transparent conductive film was carried out using a low resistivity meter "Loresta-EP" (manufactured by Mitsubishi Chemical Corporation, manufactured by Mitsubishi Chemical Corporation).

(評價判定基準) (Evaluation criteria)

◎:未達8Ω/□ ◎: Less than 8Ω/□

○:8Ω/以上未達10Ω/□ ○: 8 Ω / or more is less than 10 Ω / □

△:10Ω/□以上未達15Ω/□ △: 10 Ω / □ or more and less than 15 Ω / □

×:15Ω/□以上 ×: 15 Ω / □ or more

<2.透明性評價> <2. Transparency evaluation>

透明導電性薄膜初期之透明性測定使用分光光度計「U4100」(日立High tech製),藉由測定測定波長400~800nm之平均透過率來進行。 The initial transparency of the transparent conductive film was measured by measuring the average transmittance of the measurement wavelength of 400 to 800 nm using a spectrophotometer "U4100" (manufactured by Hitachi High-Tech Co., Ltd.).

此測定,假設供於透過型靜電容量觸控面板,為了反映現實的系統,將由支撐體、高折射率層、硫化防止層及透明導電層所構成之透明導電性薄膜在於油浸光學系統所使用之浸潤油「型A(n=1.515)」((股)尼康製)貼附於玻璃基板,藉由測定上述之全透過率來評價。 This measurement is assumed to be applied to a transmissive electrostatic capacitance touch panel. In order to reflect a realistic system, a transparent conductive film composed of a support, a high refractive index layer, a vulcanization prevention layer, and a transparent conductive layer is used in an oil immersion optical system. The immersion oil "Type A (n = 1.515)" (manufactured by Nikon Co., Ltd.) was attached to a glass substrate and evaluated by measuring the above total transmittance.

上述平均透過率相對於透明導電性薄膜之透明樹脂支撐體側之表面的法線,從傾斜5°之角度入射光來測定。另外,平均吸收率係從與平均透過率同樣的角度入射光,來測定透明導電性薄膜的平均反射率,作為平均吸收率=100-(平均透過率+平均反射率)(%)來算出。平均透過率及平均反射率以分光光度計測定。 The average transmittance is measured by incident light from an angle of 5° with respect to a normal line of the surface of the transparent conductive film on the side of the transparent resin support. In addition, the average absorptance was measured by inputting light from the same angle as the average transmittance, and the average reflectance of the transparent conductive film was measured and calculated as an average absorptivity=100-(average transmittance + average reflectance) (%). The average transmittance and the average reflectance were measured by a spectrophotometer.

(評價判定基準) (Evaluation criteria)

◎:平均透過率為92%以上 ◎: The average transmittance is 92% or more

○:平均透過率為90%以上,且未達92% ○: The average transmittance is 90% or more, and it is less than 92%.

△:平均透過率為85%以上,且未達90% △: The average transmittance is 85% or more, and it is less than 90%.

×:平均透過率為未達85% ×: The average transmittance is less than 85%

<3.外觀評價> <3. Appearance evaluation>

透明導電性薄膜之外觀評價係使用研究用實體顯微鏡「SZX10」(奧林巴斯公司製),以倍率60倍觀察試料(透明導電性薄膜)中央之30mm平方的範圍內。 The evaluation of the appearance of the transparent conductive film was carried out by using a research solid microscope "SZX10" (manufactured by Olympus Co., Ltd.) at a magnification of 60 times in a range of 30 mm square at the center of the sample (transparent conductive film).

由此觀察方法,統計膜破裂、膜浮動等之在類型外觀不佳的觀察範圍內之發生數,由以下基準來評價。 From this observation method, the number of occurrences of film breakage, film floating, and the like in the observation range in which the type appearance was poor was counted, and was evaluated by the following criteria.

(評價判定基準) (Evaluation criteria)

◎:存在4點以下之外觀不佳 ◎: There is a poor appearance below 4 points.

○:存在5點~10點之外觀不佳 ○: There is a poor appearance from 5 to 10 o'clock.

△:存在11點~20點之外觀不佳 △: There is a poor appearance from 11 o'clock to 20 o'clock.

×:存在21點以上之外觀不佳 ×: There is a poor appearance of 21 points or more.

<4.信賴性加速試驗> <4. Reliability Accelerated Test>

信賴性加速試驗(耐久性試驗)係使用小型環境試驗機「SH-222」(ESPEC(股)製),於80℃ 85%RH的環境下留置168小時。前述之導電性評價、透明性評價及外觀評價在此信賴性加速試驗的前後個別進行。 The reliability acceleration test (durability test) was carried out for 168 hours in an environment of 80 ° C and 85% RH using a small environmental tester "SH-222" (manufactured by ESPEC Co., Ltd.). The above-described conductivity evaluation, transparency evaluation, and appearance evaluation were performed individually before and after this reliability acceleration test.

初期及信賴性加速試驗後的評價,係以與上述導電性評價、透明性評價及外觀評價相同評價判定基準來進行。 The evaluation after the initial stage and the reliability acceleration test was carried out in the same evaluation criteria as the above-described conductivity evaluation, transparency evaluation, and appearance evaluation.

將以上之評價結果記載於表3。 The above evaluation results are shown in Table 3.

從以上之結果,瞭解到本發明之透明導電性薄膜1~36係可提供一種具有良好的導電性與通過可見光區域整體均質之透明性,且耐久性高之透明導電性薄膜。 From the above results, it is understood that the transparent conductive films 1 to 36 of the present invention can provide a transparent conductive film having excellent conductivity and transparency which is uniform throughout the visible light region and high in durability.

另外,相對於本發明的效果,作為比較例所製作之透明導電性薄膜101~107,與本發明相比較,諸多特性中有初期性能不良的傾向。 Further, in comparison with the effects of the present invention, the transparent conductive films 101 to 107 produced as comparative examples tend to have poor initial performance among various characteristics as compared with the present invention.

又,比較例之透明導電性薄膜101~107,藉由實施信賴性加速試驗,導電性、透明性、外觀之三種評價中之任一種成為最低評價。此與本發明之透明導電性薄膜1~36在信賴性試驗當中亦維持高度評價是鮮明對照。 Further, in the transparent conductive films 101 to 107 of the comparative examples, by performing the reliability acceleration test, any of the three evaluations of conductivity, transparency, and appearance was the lowest evaluation. This is in sharp contrast to the fact that the transparent conductive films 1 to 36 of the present invention are also highly evaluated in the reliability test.

其主要原因推測是本發明之特徵即高折射率層之硫捕獲機能、與藉由硫化防止層之導電層的保護機能,上述之比較例非常清楚顯示由本發明所提供之透明導電性薄膜的效果及優位性。 The main reason for this is presumed to be the feature of the present invention, that is, the sulfur trapping function of the high refractive index layer and the protective function of the conductive layer by the vulcanization preventing layer, and the above comparative examples clearly show the effect of the transparent conductive film provided by the present invention. And superiority.

100‧‧‧透明導電性薄膜 100‧‧‧Transparent conductive film

1‧‧‧透明樹脂支撐體 1‧‧‧Transparent resin support

2‧‧‧第1高折射率層 2‧‧‧1st high refractive index layer

3‧‧‧透明導電層 3‧‧‧Transparent conductive layer

4‧‧‧第2高折射率層 4‧‧‧2nd high refractive index layer

5a‧‧‧第1硫化防止層 5a‧‧‧1st vulcanization prevention layer

5b‧‧‧第2硫化防止層 5b‧‧‧2nd vulcanization prevention layer

a‧‧‧導通區域 A‧‧‧conductive area

Claims (12)

一種透明導電性薄膜,其係於透明樹脂支撐體上,至少以第1高折射率層、透明導電層及第2高折射率層順序具有之透明導電性薄膜,其特徵為前述透明導電層含有銀,前述第1高折射率層或前述第2高折射率層之至少任一者為含有硫化鋅之層,相對於鋅原子數100,該硫化鋅所包含之硫原子數的比例為50以上,且未達100。 A transparent conductive film which is a transparent conductive film which is provided on a transparent resin support at least in the order of a first high refractive index layer, a transparent conductive layer and a second high refractive index layer, and is characterized in that the transparent conductive layer contains In the silver, at least one of the first high refractive index layer or the second high refractive index layer is a layer containing zinc sulfide, and the ratio of the number of sulfur atoms contained in the zinc sulfide to 50 or more is 50 or more. And not up to 100. 如請求項1之透明導電性薄膜,其中,前述含有硫化鋅之層為第1高折射率層。 The transparent conductive film of claim 1, wherein the layer containing zinc sulfide is a first high refractive index layer. 如請求項1或請求項2之透明導電性薄膜,其中,於前述第1高折射率層與前述透明導電層之間具有第1硫化防止層,該第1硫化防止層係含有氧化物或氮化物。 The transparent conductive film according to claim 1 or claim 2, wherein the first vulcanization preventing layer is contained between the first high refractive index layer and the transparent conductive layer, and the first vulcanization preventing layer contains an oxide or nitrogen Compound. 如請求項3之透明導電性薄膜,其中,前述第1硫化防止層係含有氧化鋅或氧化鎵作為前述氧化物。 The transparent conductive film of claim 3, wherein the first vulcanization preventing layer contains zinc oxide or gallium oxide as the oxide. 如請求項1之透明導電性薄膜,其中,前述第1高折射率層含有硫化鋅、與氧化物或氮化物,該氧化物或該氮化物的含量為該第1高折射率層的總體積之5~30體積%的範圍內。 The transparent conductive film of claim 1, wherein the first high refractive index layer contains zinc sulfide, an oxide or a nitride, and the content of the oxide or the nitride is a total volume of the first high refractive index layer. Within the range of 5 to 30% by volume. 如請求項1之透明導電性薄膜,其中,前述第1高折射率層係含有硫化鋅與二氧化矽。 The transparent conductive film of claim 1, wherein the first high refractive index layer contains zinc sulfide and cerium oxide. 如請求項1之透明導電性薄膜,其中,作為高折射率材料,前述第2高折射率層含有選自硫化鋅、二氧化鈦、銦錫氧化物、氧化鋅、氧化鈮、二氧化錫、銦鋅氧化 物、鋁鋅氧化物、鎵鋅氧化物、銻錫氧化物、銦鈰氧化物、銦鎵鋅氧化物、氧化鉍、三氧化鎢、氧化銦及包含鎵.銦.及氧之非晶質氧化物中之任一種。 The transparent conductive film according to claim 1, wherein the second high refractive index layer is selected from the group consisting of zinc sulfide, titanium oxide, indium tin oxide, zinc oxide, cerium oxide, tin dioxide, and indium zinc. Oxidation Matter, aluminum zinc oxide, gallium zinc oxide, antimony tin oxide, indium antimony oxide, indium gallium zinc oxide, antimony oxide, tungsten trioxide, indium oxide and containing gallium. indium. And any one of oxygen amorphous oxides. 如請求項1之透明導電性薄膜,其中,作為高折射率材料,前述第2高折射率層係含有硫化鋅。 The transparent conductive film of claim 1, wherein the second high refractive index layer contains zinc sulfide as a high refractive index material. 如請求項8之透明導電性薄膜,其中,作為前述高折射率材料,前述第2高折射率層係進一步含有二氧化矽。 The transparent conductive film of claim 8, wherein the second high refractive index layer further contains cerium oxide as the high refractive index material. 如請求項1之透明導電性薄膜,其中,作為高折射率材料,前述第2高折射率層係含有鎵鋅氧化物。 The transparent conductive film of claim 1, wherein the second high refractive index layer contains gallium zinc oxide as the high refractive index material. 如請求項1之透明導電性薄膜,其中,於前述透明導電層與第2高折射率層之間具有第2硫化防止層,該第2硫化防止層含有氧化物或氮化物。 The transparent conductive film of claim 1, wherein the second vulcanization preventing layer is provided between the transparent conductive layer and the second high refractive index layer, and the second vulcanization preventing layer contains an oxide or a nitride. 如請求項11之透明導電性薄膜,其中,作為前述氧化物,前述第2硫化防止層係含有氧化鋅或鎵鋅氧化物。 The transparent conductive film of claim 11, wherein the second vulcanization preventing layer contains zinc oxide or gallium zinc oxide as the oxide.
TW104113706A 2014-05-02 2015-04-29 Transparent conductive film TWI554410B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014094939 2014-05-02

Publications (2)

Publication Number Publication Date
TW201605641A true TW201605641A (en) 2016-02-16
TWI554410B TWI554410B (en) 2016-10-21

Family

ID=54358581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113706A TWI554410B (en) 2014-05-02 2015-04-29 Transparent conductive film

Country Status (3)

Country Link
JP (1) JPWO2015166850A1 (en)
TW (1) TWI554410B (en)
WO (1) WO2015166850A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI625740B (en) * 2016-12-28 2018-06-01 國立清華大學 Transparent conductive film and optical device having the same
TWI653643B (en) 2017-12-04 2019-03-11 富元精密科技股份有限公司 Transparent conductor structure and fabrication method thereof
CN113396464A (en) * 2019-02-07 2021-09-14 株式会社村田制作所 Thin film capacitor

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6233618B2 (en) * 2014-12-24 2017-11-22 住友金属鉱山株式会社 LAMINATE FILM, ELECTRODE SUBSTRATE FILM, AND METHOD FOR PRODUCING THE SAME
JP7230131B2 (en) * 2020-09-04 2023-02-28 デクセリアルズ株式会社 Conductive laminate, optical device using same, method for manufacturing conductive laminate
CN116018258A (en) * 2020-09-04 2023-04-25 迪睿合株式会社 Conductive laminate, optical device using same, and method for manufacturing conductive laminate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642646A (en) * 1979-09-14 1981-04-20 Teijin Ltd Selected light permeable laminate
JPH07118386B2 (en) * 1987-08-19 1995-12-18 松下電器産業株式会社 Method of manufacturing thin film EL device
JP2000106044A (en) * 1998-09-30 2000-04-11 Nitto Denko Corp Surface resistance lowering method for transparent conductive film
JP2002313140A (en) * 2001-04-13 2002-10-25 Mitsui Chemicals Inc Transparent conductive film, optical filter and its manufacturing method
JP3983092B2 (en) * 2002-04-24 2007-09-26 三井化学株式会社 Method for producing transparent conductive film
JP2006092605A (en) * 2004-09-21 2006-04-06 Ricoh Co Ltd Optical information recording medium
JP2007098933A (en) * 2005-09-08 2007-04-19 Ricoh Co Ltd Optical recording medium
JP5051328B1 (en) * 2012-01-27 2012-10-17 大日本印刷株式会社 Optical laminate, polarizing plate, and image display device
CN102677012A (en) * 2012-05-18 2012-09-19 中国科学院上海光学精密机械研究所 Preparation method of multi-layer transparent conductive film
WO2014167835A1 (en) * 2013-04-08 2014-10-16 コニカミノルタ株式会社 Translucent conductor
WO2015053371A1 (en) * 2013-10-09 2015-04-16 コニカミノルタ株式会社 Transparent conductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI625740B (en) * 2016-12-28 2018-06-01 國立清華大學 Transparent conductive film and optical device having the same
TWI653643B (en) 2017-12-04 2019-03-11 富元精密科技股份有限公司 Transparent conductor structure and fabrication method thereof
CN113396464A (en) * 2019-02-07 2021-09-14 株式会社村田制作所 Thin film capacitor
CN113396464B (en) * 2019-02-07 2023-05-09 株式会社村田制作所 Thin film capacitor

Also Published As

Publication number Publication date
TWI554410B (en) 2016-10-21
JPWO2015166850A1 (en) 2017-04-20
WO2015166850A1 (en) 2015-11-05

Similar Documents

Publication Publication Date Title
TWI554410B (en) Transparent conductive film
JP6314463B2 (en) Transparent conductor
KR102530121B1 (en) Transparent conductive film
TW201605610A (en) High-durability silver mirror
JP2016081318A (en) Transparent conductor and touch panel
JP6292225B2 (en) Transparent conductor
US20200348451A1 (en) Optical thin film, optical element, and optical system
JP6319302B2 (en) Transparent conductor and method for producing the same
JP2008260978A (en) Method for forming reflection film
WO2015068738A1 (en) Transparent conductive body
JP6536575B2 (en) Transparent conductor and touch panel
JP6344095B2 (en) Transparent conductor and touch panel
JP2015156270A (en) Method of forming transparent electrode pattern
JP6206262B2 (en) Transparent conductor, method for producing the same, and conductive paste
JP2016152182A (en) Transparent conductive film, method for producing transparent conductive film, and electronic apparatus
JP6493225B2 (en) Transparent conductive film
WO2015087895A1 (en) Transparent conductive body
WO2015107968A1 (en) Method for manufacturing transparent conductor and transparent conductor
WO2015125677A1 (en) Transparent conductor
JP2016146052A (en) Transparent conductor, and touch panel including the same
JP6586738B2 (en) Transparent conductive member and method for manufacturing transparent conductive member
JP2016160115A (en) Method for selecting transparent conductive member
WO2015151677A1 (en) Transparent conductive member and method for producing transparent conductive member
JP6256253B2 (en) Transparent conductor and touch panel
JP2016177940A (en) Method for producing transparent conductive body

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees