TW201604153A - Method for manufacturing glass plate and apparatus for manufacturing glass plate - Google Patents

Method for manufacturing glass plate and apparatus for manufacturing glass plate Download PDF

Info

Publication number
TW201604153A
TW201604153A TW104118006A TW104118006A TW201604153A TW 201604153 A TW201604153 A TW 201604153A TW 104118006 A TW104118006 A TW 104118006A TW 104118006 A TW104118006 A TW 104118006A TW 201604153 A TW201604153 A TW 201604153A
Authority
TW
Taiwan
Prior art keywords
chamfering
end surface
glass sheet
processing
line
Prior art date
Application number
TW104118006A
Other languages
Chinese (zh)
Other versions
TWI648232B (en
Inventor
Takehiro Mitsuishi
Kenji Kobayashi
Mutsuki Suzuki
Tatsuya Yotsumoto
Original Assignee
Avanstrate Inc
Avanstrate Korea Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avanstrate Inc, Avanstrate Korea Inc filed Critical Avanstrate Inc
Publication of TW201604153A publication Critical patent/TW201604153A/en
Application granted granted Critical
Publication of TWI648232B publication Critical patent/TWI648232B/en

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The purpose of the present invention is to provide a method for manufacturing a glass plate and an apparatus for manufacturing a glass plate capable of increasing the processing precision of an end face of the glass plate. The method for manufacturing a glass plate comprises an end face processing step, an end face measurement step, a processing line calculation step, and a processing line correction step. The end face processing step is to use a chamfering grindstone which moves relative to the glass plate to perform chamfering processing on the end face. The end face measurement step is to measure the shape of the end face after being chamfering processing. The processing line calculation step is to calculate, according to the measured end face shape, the trajectory of the chamfering grindstone in the end face processing step relative to the glass plate, i.e. The processing line. The adjustment line calculation step is to calculate the adjustment line, according to the calculated processing line. The end face processing step is to perform chamfering processing on the end glass plate trajectory and along the adjustment line by using the chamfering grindstone, when the adjustment line has been calculated.

Description

玻璃板製造方法及玻璃板製造裝置 Glass plate manufacturing method and glass plate manufacturing device

本發明係關於一種玻璃板製造方法及玻璃板製造裝置。 The present invention relates to a glass sheet manufacturing method and a glass sheet manufacturing apparatus.

用於製造液晶顯示器及電漿顯示器等平板顯示器(FPD,Flat Panel Display)之玻璃板例如利用溢流下拉法而製造。於溢流下拉法中,流入至成形體並溢出之熔融玻璃沿著成形體之表面流下,並於成形體之下端附近合流而連續地成形玻璃板。所成形之玻璃板一面朝下方被拉長一面被冷卻,並被切斷成特定大小。被切斷之玻璃板經過端面加工步驟、表面清洗步驟及檢查步驟等後被包裝並出貨。 A glass plate for manufacturing a flat panel display (FPD) such as a liquid crystal display or a plasma display is manufactured by, for example, an overflow down-draw method. In the overflow down-draw method, the molten glass which flows into the molded body and overflows flows down the surface of the formed body, and merges in the vicinity of the lower end of the formed body to continuously form the glass sheet. The formed glass sheet is cooled while being stretched downward, and is cut to a specific size. The cut glass sheet is packaged and shipped after the end surface processing step, the surface cleaning step, and the inspection step.

於將所成形之玻璃板切斷成特定大小之步驟中,一般而言,使用利用切割機或雷射之切斷方法。於利用切割機之玻璃板之切斷方法中,於玻璃板機械地形成切縫而切斷。因此,於被切斷之玻璃板之端面形成數μm~100μm左右之深度之裂紋。該裂紋導致玻璃板之機械強度劣化。又,於利用雷射之玻璃板之切斷方法中,利用熱應力於玻璃板形成切縫而切斷玻璃板。因此,被切斷之玻璃板之端面成為鋒利且容易缺損之狀態。於被切斷之玻璃板之端面形成有裂紋及鋒利部分之層被稱為水平裂紋及脆性破壞層,必須藉由對端面進行磨削及研磨而去除。即,為了提高玻璃板之機械強度,抑制玻璃板之缺陷之產生,使後續步驟中之處理容易,而進行玻璃板之端面加工步驟。 In the step of cutting the formed glass sheet into a specific size, generally, a cutting method using a cutter or a laser is used. In the cutting method using the glass plate of a cutting machine, a slit is mechanically formed in a glass plate, and it cuts. Therefore, cracks having a depth of about several μm to 100 μm are formed on the end faces of the cut glass sheets. This crack causes the mechanical strength of the glass sheet to deteriorate. Further, in the cutting method of the glass plate using the laser, the glass plate is cut by forming a slit by the thermal stress on the glass plate. Therefore, the end faces of the cut glass sheets are sharp and easily damaged. A layer in which cracks and sharp portions are formed on the end faces of the cut glass sheets is called a horizontal crack and a brittle fracture layer, and must be removed by grinding and grinding the end faces. That is, in order to increase the mechanical strength of the glass sheet, suppress the occurrence of defects of the glass sheet, and facilitate the treatment in the subsequent step, the end surface processing step of the glass sheet is performed.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2011-110648號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-110648

作為玻璃板之端面加工步驟之例子,於專利文獻1(日本專利特開2011-110648號公報)中揭示有如下方法:使倒角磨石沿著被切斷之玻璃板之端面移動,對端面進行倒角加工。於該方法中,固定於平台之玻璃板之端面之位置由雷射位移計測定,計算倒角磨石對端面之加工開始位置及加工結束位置。具體而言,根據利用雷射位移計所獲得之測定值,藉由外插插補計算端面之加工開始位置及加工結束位置之座標。根據已計算出之座標與成為基準之座標之差異、及所期望之磨削餘量,對端面之加工開始位置及加工結束位置進行修正。 As an example of the end surface processing step of the glass sheet, a method of moving the chamfering grindstone along the end surface of the cut glass sheet, the end surface, is disclosed in Patent Document 1 (Japanese Laid-Open Patent Publication No. 2011-110648). Perform chamfering. In the method, the position of the end face of the glass plate fixed to the platform is measured by a laser displacement meter, and the machining start position and the machining end position of the chamfered grindstone on the end face are calculated. Specifically, the coordinates of the machining start position and the machining end position of the end face are calculated by extrapolation interpolation based on the measured value obtained by the laser displacement meter. The machining start position and the machining end position of the end face are corrected based on the difference between the calculated coordinates and the coordinate to be the reference, and the desired grinding allowance.

但是,一般而言,玻璃板之端面之直線性因端面加工步驟而降低。即,於玻璃板之倒角加工後之端面,沿著端面延伸之方向形成有微小之凹凸。微小之凹凸為端面之起伏。端面之直線性降低主要因用於使倒角磨石沿著端面移動之裝置之機械精度而引起。又,為了於端面加工步驟中自玻璃板之端面去除水平裂紋及脆性破壞層,必須沿著與端面正交之方向具有±10μm之加工精度。因此,提高玻璃板之端面之加工精度而提高倒角加工後之端面之直線性較為重要。 However, in general, the linearity of the end faces of the glass sheets is lowered by the end face processing steps. That is, on the end surface after chamfering of the glass sheet, minute irregularities are formed along the direction in which the end surface extends. The tiny bumps are the undulations of the end faces. The decrease in the linearity of the end faces is mainly caused by the mechanical precision of the means for moving the chamfering grindstone along the end faces. Further, in order to remove the horizontal crack and the brittle fracture layer from the end surface of the glass sheet in the end surface processing step, it is necessary to have a processing accuracy of ±10 μm in the direction orthogonal to the end surface. Therefore, it is important to improve the processing accuracy of the end faces of the glass sheets and to improve the linearity of the end faces after chamfering.

又,為了提高玻璃板之彎曲強度,必須縮小端面已被實施倒角加工之玻璃板之面寬差。面寬差係指藉由倒角加工自一主表面去除之區域之寬度與自另一主表面去除之區域之寬度之差。但是,因固定玻璃板之平台之表面之精度、及用於使倒角磨石沿著端面移動之裝置之機械精度而導致難以於端面加工步驟中縮小面寬差。因此,提高玻璃板之端面之加工精度而縮小端面已被實施倒角加工之玻璃板之面寬差較為重要。 Further, in order to increase the bending strength of the glass sheet, it is necessary to reduce the surface width difference of the glass sheet on which the end surface has been chamfered. The difference in face width refers to the difference between the width of the region removed from one major surface by chamfering and the width of the region removed from the other major surface. However, it is difficult to reduce the surface width difference in the end face processing step due to the accuracy of the surface of the platform on which the glass plate is fixed and the mechanical precision of the device for moving the chamfered grindstone along the end face. Therefore, it is important to increase the processing accuracy of the end faces of the glass sheets and to reduce the surface width difference of the glass sheets on which the end faces have been chamfered.

本發明之目的在於提供一種可提高玻璃板之端面之加工精度之 玻璃板製造方法及玻璃板製造裝置。 The object of the present invention is to provide an improvement in the processing precision of the end face of a glass plate. Glass plate manufacturing method and glass plate manufacturing device.

本發明之玻璃板製造方法包括端面加工步驟、端面測定步驟、加工線計算步驟、及加工線修正步驟。端面加工步驟係藉由使倒角磨石接觸於被固定之玻璃板之端面並使倒角磨石相對於玻璃板相對移動而對端面進行倒角加工。端面測定步驟係對於端面加工步驟中被實施倒角加工後之端面之形狀進行測定。加工線計算步驟係根據端面測定步驟中所測定出之端面之形狀,計算端面加工步驟中之倒角磨石相對於玻璃板之軌跡即加工線。調整線計算步驟係根據藉由加工線計算步驟而計算出之加工線來計算調整線。調整線用於對端面均勻地進行倒角加工。端面加工步驟係於已於調整線計算步驟中計算出調整線之情形時,以倒角磨石相對於玻璃板之軌跡沿著調整線之方式對端面進行倒角加工。 The glass sheet manufacturing method of the present invention includes an end surface processing step, an end surface measurement step, a processing line calculation step, and a processing line correction step. The end face processing step chamfers the end face by contacting the chamfered grindstone with the end face of the fixed glass plate and moving the chamfer grindstone relative to the glass plate. The end face measuring step measures the shape of the end face subjected to the chamfering process in the end face processing step. The processing line calculation step calculates the trajectory of the chamfered grindstone relative to the glass sheet, that is, the processing line, according to the shape of the end surface measured in the end surface measuring step. The adjustment line calculation step calculates the adjustment line based on the processing line calculated by the processing line calculation step. The adjustment line is used to evenly chamfer the end face. The end face processing step is performed by chamfering the end face along the alignment line of the chamfered grindstone relative to the trajectory of the glass plate when the adjustment line is calculated in the adjustment line calculation step.

於該玻璃板製造方法中,首先,利用倒角磨石對調整用玻璃板之端面進行倒角加工。接著,測定調整用玻璃板之倒角加工後之端面之形狀,並計算加工線。加工線表示調整用玻璃板之倒角加工時之倒角磨石相對於玻璃板之軌跡。接著,根據已計算出之加工線而計算調整線。調整線表示用於使玻璃板之端面之磨削量均勻之倒角磨石相對於玻璃板之軌跡。接著,進行與調整用玻璃板不同之玻璃板之端面之倒角加工。此時,以沿著已計算出之調整線之方式使倒角磨石相對於玻璃板移動,由此進行對玻璃板之端面均勻地磨削之倒角加工。因此,該玻璃板製造方法可提高玻璃板之端面之加工精度。 In the method for producing a glass sheet, first, the end surface of the glass sheet for adjustment is chamfered by a chamfering grindstone. Next, the shape of the end surface after chamfering of the glass plate for adjustment was measured, and the processing line was computed. The processing line indicates the trajectory of the chamfered grindstone relative to the glass sheet when the chamfering of the glass sheet for adjustment is performed. Next, the adjustment line is calculated based on the calculated processing line. The adjustment line indicates the trajectory of the chamfered grindstone for making the amount of grinding of the end faces of the glass sheets uniform with respect to the glass sheets. Next, chamfering processing of the end surface of the glass plate different from the glass plate for adjustment is performed. At this time, the chamfering grindstone is moved relative to the glass sheet so as to follow the calculated adjustment line, thereby performing chamfering processing for uniformly grinding the end surface of the glass sheet. Therefore, the glass sheet manufacturing method can improve the processing precision of the end surface of the glass sheet.

又,端面測定步驟較佳為沿著端面於端面設定複數個測定點,並於各測定點測定形狀參數,由此測定端面之形狀。於該情形時,加工線修正步驟係根據各測定點之形狀參數計算加工線。調整線計算步驟計算具有與各測定點對應之調整點之調整線。 Further, in the end surface measuring step, it is preferable to set a plurality of measurement points along the end surface on the end surface, and to measure the shape parameters at each measurement point, thereby measuring the shape of the end surface. In this case, the processing line correction step calculates the processing line based on the shape parameters of the respective measurement points. The adjustment line calculation step calculates an adjustment line having an adjustment point corresponding to each measurement point.

又,倒角磨石較佳為可沿著自倒角磨石朝向端面之第1軸而移動。於該情形時,端面測定步驟係於各測定點測定第1軸之座標作為形狀參數。調整線計算步驟計算各測定點之形狀參數之值越大則對應之調整點之第1軸之座標越小之調整線。 Further, the chamfering grindstone is preferably movable along the first axis from the chamfering grindstone toward the end surface. In this case, the end surface measurement step measures the coordinates of the first axis as shape parameters at each measurement point. The adjustment line calculation step calculates an adjustment line whose coordinate value of the first axis of the adjustment point is smaller as the value of the shape parameter of each measurement point is larger.

又,倒角磨石較佳為可沿著自玻璃板之第1主表面朝向第1主表面之背側之第2主表面且與第1主表面正交之第2軸而移動。於該情形時,端面測定步驟係於各測定點測定自第1倒角寬度減去第2倒角寬度所得之值即面寬差作為形狀參數。調整線計算步驟計算各測定點之形狀參數之值越大則對應之修正點之第2軸之座標越小之調整線。第1倒角寬度係於端面加工步驟中自第1主表面去除之區域之寬度。第2倒角寬度係於端面加工步驟中自第2主表面去除之區域之寬度。 Further, it is preferable that the chamfering grindstone is movable along a second main axis that is perpendicular to the first main surface from the first main surface of the glass sheet toward the second main surface on the back side of the first main surface. In this case, the end surface measuring step is a shape parameter obtained by measuring the value obtained by subtracting the second chamfering width from the first chamfering width, that is, the surface width difference, at each measurement point. The adjustment line calculation step calculates an adjustment line in which the value of the shape parameter of each measurement point is larger as the coordinate of the second axis corresponding to the correction point is smaller. The first chamfer width is the width of the region removed from the first main surface in the end surface processing step. The second chamfer width is the width of the area removed from the second main surface in the end surface processing step.

本發明之玻璃板製造裝置包括用於固定玻璃板之平台、用於對玻璃板之端面進行倒角加工之倒角磨石、加工控制部、及測定控制部。加工控制部係藉由使倒角磨石接觸於固定於平台之玻璃板之端面並使倒角磨石相對於玻璃板相對移動而對端面進行倒角加工。測定控制部測定端面之形狀。加工控制部係根據由測定控制部所測定出之端面之形狀,計算倒角加工時之倒角磨石相對於玻璃板之軌跡即加工線。加工控制部根據已計算出之加工線而計算調整線。加工控制部係於已計算出調整線之情形時,以倒角磨石相對於玻璃板之軌跡沿著調整線之方式對端面進行倒角加工。 The glass sheet manufacturing apparatus of the present invention includes a platform for fixing a glass sheet, a chamfering grindstone for chamfering the end surface of the glass sheet, a processing control unit, and a measurement control unit. The machining control unit chamfers the end surface by contacting the chamfering grindstone with the end surface of the glass plate fixed to the platform and moving the chamfering grindstone relative to the glass plate. The measurement control unit measures the shape of the end surface. The machining control unit calculates a machining line which is a trajectory of the chamfering grindstone with respect to the glass sheet at the time of chamfering processing based on the shape of the end surface measured by the measurement control unit. The machining control unit calculates the adjustment line based on the calculated machining line. The machining control unit chamfers the end face along the alignment line with respect to the trajectory of the chamfering grindstone relative to the glass plate when the adjustment line has been calculated.

本發明之玻璃板製造方法及玻璃板製造裝置可提高玻璃板之端面之加工精度。 The glass sheet manufacturing method and the glass sheet manufacturing apparatus of the present invention can improve the processing precision of the end surface of the glass sheet.

10‧‧‧玻璃板 10‧‧‧ glass plate

10a‧‧‧第1主表面 10a‧‧‧1st main surface

10b‧‧‧第2主表面 10b‧‧‧2nd main surface

11‧‧‧端面 11‧‧‧ end face

12‧‧‧端面 12‧‧‧ end face

13‧‧‧端面 13‧‧‧ end face

14‧‧‧端面 14‧‧‧ end face

20‧‧‧玻璃板搬送裝置 20‧‧‧Glass plate conveying device

22‧‧‧機械手 22‧‧‧ Robot

30‧‧‧吸附平台(平台) 30‧‧‧Adsorption platform (platform)

32‧‧‧支撐銷 32‧‧‧Support pins

40‧‧‧倒角磨石 40‧‧‧Chamfering grindstone

40a‧‧‧加工槽 40a‧‧‧ machining slot

42‧‧‧倒角磨石 42‧‧‧Chamfering grindstone

70‧‧‧磨石移動機構 70‧‧‧Minestone mobile agency

72‧‧‧磨石移動機構 72‧‧‧Mortar mobile agency

80‧‧‧磨削液供給裝置 80‧‧‧grinding fluid supply device

90‧‧‧水供給裝置 90‧‧‧Water supply device

100‧‧‧端面加工裝置 100‧‧‧End face processing device

110‧‧‧端面測定裝置 110‧‧‧End face measuring device

120‧‧‧載置平台 120‧‧‧Loading platform

130‧‧‧位置感測器 130‧‧‧ position sensor

130a、132a‧‧‧前端部 130a, 132a‧‧‧ front end

132‧‧‧位置感測器 132‧‧‧ position sensor

140‧‧‧感測器移動機構 140‧‧‧Sensor moving mechanism

142‧‧‧感測器移動機構 142‧‧‧Sensor moving mechanism

D‧‧‧面寬差 D‧‧‧ face width difference

P11~P16‧‧‧測定點 P11~P16‧‧‧ measuring point

P21~P26‧‧‧測定點 P21~P26‧‧‧Measurement point

P31~P36‧‧‧調整點 P31~P36‧‧‧ adjustment point

S1~S9‧‧‧步驟 S1~S9‧‧‧Steps

S11~S17‧‧‧步驟 S11~S17‧‧‧Steps

W1‧‧‧第1倒角寬度 W1‧‧‧1st chamfer width

W2‧‧‧第2倒角寬度 W2‧‧‧2nd chamfer width

圖1係玻璃板製造步驟之流程圖。 Figure 1 is a flow chart showing the steps of manufacturing a glass sheet.

圖2係端面加工裝置之俯視圖。 Figure 2 is a plan view of the end face processing apparatus.

圖3係端面加工裝置之側視圖。 Figure 3 is a side view of the end face processing apparatus.

圖4係表示玻璃板搬送裝置將玻璃板載置於吸附平台上之狀態之圖。 Fig. 4 is a view showing a state in which the glass sheet conveying device mounts the glass sheet on the adsorption platform.

圖5係端面測定裝置之俯視圖。 Figure 5 is a plan view of the end face measuring device.

圖6係表示端面上所設定之測定點之圖。 Fig. 6 is a view showing measurement points set on the end faces.

圖7係表示端面上所設定之測定點之圖。 Fig. 7 is a view showing measurement points set on the end faces.

圖8係對端面進行倒角加工之步驟之流程圖。 Figure 8 is a flow chart showing the steps of chamfering the end face.

圖9係表示端面之測定點之測定結果與已計算出之調整線之曲線圖。 Fig. 9 is a graph showing the measurement result of the measurement point of the end face and the calculated adjustment line.

圖10係表示沿著調整線被實施倒角加工後之端面之測定點之測定結果之曲線圖。 Fig. 10 is a graph showing the measurement results of the measurement points of the end faces which are chamfered along the adjustment line.

圖11係用於說明玻璃板之端面之面寬差之圖。 Fig. 11 is a view for explaining the difference in the surface width of the end faces of the glass sheets.

圖12係用於說明玻璃板之端面之面寬差之圖。 Fig. 12 is a view for explaining the difference in the surface width of the end faces of the glass sheets.

圖13係端面之第1倒角寬度、第2倒角寬度及面寬差之測定結果。 Fig. 13 shows the measurement results of the first chamfered width, the second chamfered width, and the surface width difference of the end faces.

圖14係沿著調整線被實施倒角加工後之端面之第1倒角寬度、第2倒角寬度及面寬差之測定結果。 Fig. 14 shows the measurement results of the first chamfering width, the second chamfering width, and the surface width difference of the end surface after chamfering along the adjustment line.

一面參照附圖一面對作為本發明之實施形態之玻璃板製造方法進行說明。本實施形態中之玻璃板製造方法使用用於對玻璃板之端面進行加工之端面加工裝置100、及用於測定玻璃板之端面之形狀之端面測定裝置110。 A method of manufacturing a glass sheet as an embodiment of the present invention will be described with reference to the accompanying drawings. In the method for producing a glass sheet according to the present embodiment, the end surface processing apparatus 100 for processing the end surface of the glass sheet and the end surface measuring apparatus 110 for measuring the shape of the end surface of the glass sheet are used.

(1)玻璃板之製造步驟之概要 (1) Outline of the manufacturing steps of the glass plate

對利用本實施形態中所使用之端面加工裝置100加工之玻璃板10之製造步驟進行說明。玻璃板10用於製造液晶顯示器、電漿顯示器及有機EL(Electroluminescence,電致發光)顯示器等平板顯示器(FPD)。 玻璃板10例如具有0.2mm~0.8mm之厚度,且具有縱680mm~2200mm及橫880mm~2500mm之尺寸。 The manufacturing procedure of the glass sheet 10 processed by the end surface processing apparatus 100 used in this embodiment is demonstrated. The glass plate 10 is used to manufacture a flat panel display (FPD) such as a liquid crystal display, a plasma display, and an organic EL (Electroluminescence) display. The glass plate 10 has a thickness of, for example, 0.2 mm to 0.8 mm, and has a size of 680 mm to 2200 mm in length and 880 mm to 2500 mm in width.

作為玻璃板10之一例,列舉具有以下之(a)~(j)之組成之玻璃。 As an example of the glass plate 10, the glass which has the composition of the following (a) - (j) is mentioned.

(a)SiO2:50質量%~70質量%、(b)Al2O3:10質量%~25質量%、(c)B2O3:1質量%~18質量%、(d)MgO:0質量%~10質量%、(e)CaO:0質量%~20質量%、(f)SrO:0質量%~20質量%、(g)BaO:0質量%~10質量%、(h)RO:5質量%~20質量%(R係選自Mg、Ca、Sr及Ba之至少1種)、(i)R'2O:0質量%~2.0質量%(R'係選自Li、Na及K之至少1種)、(j)選自SnO2、Fe2O3及CeO2之至少1種金屬氧化物。 (a) SiO 2 : 50% by mass to 70% by mass, (b) Al 2 O 3 : 10% by mass to 25% by mass, (c) B 2 O 3 : 1% by mass to 18% by mass, (d) MgO : 0% by mass to 10% by mass, (e) CaO: 0% by mass to 20% by mass, (f) SrO: 0% by mass to 20% by mass, (g) BaO: 0% by mass to 10% by mass, (h) RO: 5 mass% to 20 mass% (R is at least one selected from the group consisting of Mg, Ca, Sr, and Ba), and (i) R' 2 O: 0% by mass to 2.0% by mass (R' is selected from Li At least one of Na and K) and (j) at least one metal oxide selected from the group consisting of SnO 2 , Fe 2 O 3 and CeO 2 .

再者,具有上述組成之玻璃容許以小於0.1質量%之範圍存在其他微量成分。 Further, the glass having the above composition is allowed to have other trace components in a range of less than 0.1% by mass.

圖1係表示玻璃板10之製造步驟之流程圖之一例。玻璃板10之製造步驟主要包括成形步驟(步驟S1)、板獲取步驟(步驟S2)、切斷步驟(步驟S3)、粗面化步驟(步驟S4)、端面加工步驟(步驟S5)、形狀測定步驟(步驟S6)、清洗步驟(步驟S7)、檢查步驟(步驟S8)、及包裝步驟(步驟S9)。 Fig. 1 is a view showing an example of a flow chart of a manufacturing step of the glass sheet 10. The manufacturing steps of the glass sheet 10 mainly include a forming step (step S1), a board obtaining step (step S2), a cutting step (step S3), a roughening step (step S4), an end surface processing step (step S5), and a shape determination. Step (step S6), washing step (step S7), inspection step (step S8), and packaging step (step S9).

於成形步驟S1中,利用加熱玻璃原料所獲得之熔融玻璃,藉由下拉法或浮式法而連續地成形玻璃片。所成形之玻璃片一面以不產生變形及翹曲之方式控制溫度一面冷卻至玻璃徐冷點以下。 In the forming step S1, the glass piece is continuously formed by a down-draw method or a floating method using the molten glass obtained by heating the glass raw material. The formed glass piece is cooled to a temperature below the glass by controlling the temperature without causing deformation or warpage.

於板獲取步驟S2中,將成形步驟S1中所成形之玻璃片切斷,而獲得具有特定尺寸之素板玻璃。 In the board obtaining step S2, the glass piece formed in the forming step S1 is cut to obtain a plain glass having a specific size.

於切斷步驟S3中,將板獲取步驟S2中所獲得之素板玻璃切斷,而獲得成品尺寸之玻璃板10。素板玻璃係使用雷射以較高之加工精度切斷。 In the cutting step S3, the sheet glass obtained in the board acquisition step S2 is cut to obtain a finished glass sheet 10. The plain glass is cut with a high precision using a laser.

於粗面化步驟S4中,進行使切斷步驟S3中所獲得之玻璃板10之表面粗糙度增加之粗面化處理。玻璃板10之粗面化處理係例如使用包含氟化氫之蝕刻劑之濕式蝕刻。 In the roughening step S4, the roughening treatment for increasing the surface roughness of the glass sheet 10 obtained in the cutting step S3 is performed. The roughening treatment of the glass plate 10 is, for example, wet etching using an etchant containing hydrogen fluoride.

於端面加工步驟S5中,進行於粗面化步驟S4中進行粗面化處理後之玻璃板10之端面之倒角加工。倒角加工後之端面之一部分具有R形狀。端面加工步驟S5由端面加工裝置100進行。 In the end surface processing step S5, the chamfering of the end surface of the glass sheet 10 after the roughening treatment in the roughening step S4 is performed. One of the end faces after chamfering has an R shape. The end surface processing step S5 is performed by the end surface processing apparatus 100.

形狀測定步驟S6對於端面加工步驟S5中被實施倒角加工後之端面之形狀進行測定。與所測定出之端面之形狀相關之資料於端面加工步驟S5中被利用。形狀測定步驟S6由端面測定裝置110進行。再者,形狀測定步驟S6至少對各製造批次之第一塊玻璃板10進行即可。 The shape measuring step S6 measures the shape of the end surface after the chamfering process in the end surface processing step S5. The data relating to the shape of the measured end face is utilized in the end face processing step S5. The shape measuring step S6 is performed by the end surface measuring device 110. Further, the shape measuring step S6 may be performed on at least the first glass sheet 10 of each manufacturing lot.

於清洗步驟S7中,對於端面加工步驟S5中進行端面加工處理後之玻璃板10進行清洗。於玻璃板10附著有因素板玻璃之切斷、及玻璃板10之端面加工而產生之微小之玻璃片、或環境中所存在之有機物等異物。藉由玻璃板10之清洗而將該等異物去除。 In the cleaning step S7, the glass sheet 10 subjected to the end surface processing in the end surface processing step S5 is cleaned. Foreign matter such as the cutting of the factor plate glass, the minute glass piece produced by the end surface processing of the glass plate 10, or the organic matter existing in the environment adheres to the glass plate 10. These foreign matters are removed by washing of the glass plate 10.

於檢查步驟S8中,對於清洗步驟S7中清洗後之玻璃板10進行檢查。具體而言,測定玻璃板10之形狀,光學性地偵測玻璃板10之缺陷。玻璃板10之缺陷係例如存在於玻璃板10之表面之劃痕及裂紋、附著於玻璃板10之表面之異物、以及存在於玻璃板10之內部之微小之泡等。 In the inspection step S8, the glass plate 10 after the cleaning in the cleaning step S7 is inspected. Specifically, the shape of the glass plate 10 is measured to optically detect the defects of the glass plate 10. The defects of the glass plate 10 are, for example, scratches and cracks on the surface of the glass plate 10, foreign matter adhering to the surface of the glass plate 10, and minute bubbles existing inside the glass plate 10.

於包裝步驟S9中,藉由檢查步驟S8中之檢查之玻璃板10與用於保護玻璃板10之紙墊板交替地層疊於托板上而被包裝。包裝後之玻璃板10被出貨給FPD之製造業者等。 In the packaging step S9, the glass sheet 10 inspected in the step S8 and the paper mat for protecting the glass sheet 10 are alternately laminated on the pallet to be packaged. The packaged glass sheet 10 is shipped to a manufacturer of the FPD or the like.

(2)端面加工裝置之構成 (2) The composition of the end face processing device

圖2係端面加工裝置100之俯視圖。圖3係自圖2所示之箭頭III之方向觀察所得之端面加工裝置100之側視圖。端面加工裝置100於端面加工步驟S5中對被固定之玻璃板10之端面進行倒角加工。 2 is a plan view of the end face processing apparatus 100. Fig. 3 is a side view of the end face processing apparatus 100 as seen from the direction of the arrow III shown in Fig. 2. The end surface processing apparatus 100 chamfers the end surface of the glass sheet 10 to be fixed in the end surface processing step S5.

端面加工裝置100主要包括玻璃板搬送裝置20、吸附平台30、一對倒角磨石40、42、一對磨石移動機構70、72、磨削液供給裝置80、水供給裝置90、及加工控制部(未圖示)。 The end surface processing apparatus 100 mainly includes a glass sheet conveying device 20, an adsorption platform 30, a pair of chamfering grindstones 40, 42, a pair of grindstone moving mechanisms 70, 72, a grinding fluid supply device 80, a water supply device 90, and processing. Control unit (not shown).

利用端面加工裝置100對端面進行倒角加工之玻璃板10具有長方形之形狀。玻璃板10具有與其長邊平行之端面11、12、及與其短邊平行之端面13、14。 The glass sheet 10 which is chamfered by the end surface processing apparatus 100 has a rectangular shape. The glass plate 10 has end faces 11, 12 parallel to its long sides, and end faces 13, 14 parallel to its short sides.

如圖2所示,於與玻璃板10之表面平行之平面上設定由X軸及Y軸構成之二維正交座標系。如圖3所示,設定與包含X軸及Y軸之平面正交且於鉛垂方向朝上之Z軸。如圖2所示,X軸之方向係自端面13朝向端面14之方向。X軸之方向係於端面加工步驟S5中倒角磨石40、42一面與端面11、12接觸一面移動之方向。如圖2所示,Y軸之方向係自端面11朝向端面12之方向。 As shown in FIG. 2, a two-dimensional orthogonal coordinate system composed of an X-axis and a Y-axis is set on a plane parallel to the surface of the glass sheet 10. As shown in FIG. 3, the Z axis orthogonal to the plane including the X-axis and the Y-axis and facing upward in the vertical direction is set. As shown in FIG. 2, the direction of the X-axis is from the end face 13 toward the end face 14. The direction of the X-axis is the direction in which the chamfering grindstones 40, 42 are moved in contact with the end faces 11, 12 in the end surface processing step S5. As shown in FIG. 2, the direction of the Y-axis is from the end face 11 toward the end face 12.

接著,針對端面加工裝置100對玻璃板10之與長邊平行之端面11、12進行倒角加工之步驟進行說明。但是,以下之說明亦可應用於端面加工裝置100對玻璃板10之與短邊平行之端面13、14進行倒角加工之步驟。 Next, a step of chamfering the end faces 11 and 12 of the glass sheet 10 parallel to the long sides will be described with respect to the end surface processing apparatus 100. However, the following description can also be applied to the step of chamfering the end faces 13, 14 of the glass sheet 10 parallel to the short sides by the end surface processing apparatus 100.

(2-1)玻璃板搬送裝置 (2-1) Glass plate conveying device

玻璃板搬送裝置20係搬送玻璃板10之機器人。玻璃板搬送裝置20搬送玻璃板10並將玻璃板10載置於吸附平台30上,或者舉起載置於吸附平台30上之玻璃板10並搬送玻璃板10。 The glass plate conveying device 20 is a robot that conveys the glass plate 10. The glass sheet conveying device 20 conveys the glass sheet 10 and mounts the glass sheet 10 on the adsorption stage 30, or lifts the glass sheet 10 placed on the adsorption stage 30 and conveys the glass sheet 10.

圖4係表示玻璃板搬送裝置20將玻璃板10載置於吸附平台30上之狀態之圖。玻璃板搬送裝置20包含具有複數個齒之梳狀之機械手22。機械手22可吸附並保持玻璃板10之下表面。玻璃板搬送裝置20可變更 保持著玻璃板10之機械手22之位置或者使機械手22於與水平面平行之面內旋轉。玻璃板搬送裝置20可如圖4所示般將機械手22之齒插入至吸附平台30之支撐銷32之間。 4 is a view showing a state in which the glass sheet conveying device 20 mounts the glass sheet 10 on the adsorption stage 30. The glass sheet conveying device 20 includes a comb-shaped robot 22 having a plurality of teeth. The robot 22 can adsorb and hold the lower surface of the glass sheet 10. The glass plate conveying device 20 can be changed The position of the robot 22 of the glass sheet 10 is maintained or the robot 22 is rotated in a plane parallel to the horizontal plane. The glass sheet conveying device 20 can insert the teeth of the robot 22 between the support pins 32 of the adsorption platform 30 as shown in FIG.

(2-2)吸附平台 (2-2) adsorption platform

如圖4所示,吸附平台30具有複數個支撐銷32。支撐銷32係沿著X軸方向及Y軸方向隔開特定之間隔安裝於吸附平台30之上表面。於吸附平台30之上表面形成有用於吸附載置於吸附平台30上之玻璃板10之下表面之複數個抽吸孔(未圖示)。吸附平台30利用藉由抽吸孔之抽吸所產生之吸附力而固定所載置之玻璃板10。吸附平台30之上表面具有長方形之形狀。吸附平台30之上表面之長邊與X軸平行,吸附平台30之上表面之短邊與Y軸平行。 As shown in FIG. 4, the adsorption platform 30 has a plurality of support pins 32. The support pins 32 are attached to the upper surface of the adsorption stage 30 at a predetermined interval along the X-axis direction and the Y-axis direction. A plurality of suction holes (not shown) for adsorbing the lower surface of the glass plate 10 placed on the adsorption stage 30 are formed on the upper surface of the adsorption stage 30. The adsorption stage 30 fixes the mounted glass sheet 10 by the suction force generated by the suction of the suction holes. The upper surface of the adsorption platform 30 has a rectangular shape. The long side of the upper surface of the adsorption platform 30 is parallel to the X axis, and the short side of the upper surface of the adsorption platform 30 is parallel to the Y axis.

針對搬送玻璃板10之玻璃板搬送裝置20將玻璃板10載置於吸附平台30上之過程進行說明。首先,以機械手22之齒位於支撐銷32之間之方式,使保持玻璃板10之機械手22下降。機械手22下降至支撐銷32與玻璃板10之下表面接觸之高度位置為止。接著,解除機械手22對玻璃板10之吸附。藉此,玻璃板10成為僅由支撐銷32支撐之狀態。接著,使機械手22水平移動,將機械手22自支撐銷32之間拔出。接著,使支撐銷32下降,而將玻璃板10載置於吸附平台30上。接著,藉由抽吸孔之抽吸,將玻璃板10固定於吸附平台30上。 The process of placing the glass sheet 10 on the adsorption stage 30 with respect to the glass sheet conveying apparatus 20 which conveys the glass plate 10 is demonstrated. First, the robot 22 holding the glass sheet 10 is lowered in such a manner that the teeth of the robot 22 are positioned between the support pins 32. The robot 22 is lowered to a position where the support pin 32 is in contact with the lower surface of the glass sheet 10. Next, the adsorption of the glass plate 10 by the robot 22 is released. Thereby, the glass plate 10 is in a state of being supported only by the support pin 32. Next, the robot 22 is horizontally moved, and the robot 22 is pulled out from between the support pins 32. Next, the support pin 32 is lowered, and the glass plate 10 is placed on the adsorption stage 30. Next, the glass plate 10 is fixed to the adsorption stage 30 by suction of the suction holes.

針對玻璃板搬送裝置20取出載置於吸附平台30上之玻璃板10之過程進行說明。首先,解除抽吸孔之抽吸,使支撐銷32上升,而僅利用支撐銷32支撐玻璃板10。接著,使機械手22沿水平方向移動,並插入至吸附平台30之支撐銷32之間。接著,開始機械手22對玻璃板10之吸附,並使機械手22上升,而舉起玻璃板10。接著,利用機械手22將玻璃板10搬送至後續步驟。 The process of taking out the glass sheet 10 placed on the adsorption stage 30 by the glass sheet conveying apparatus 20 will be described. First, the suction of the suction hole is released, the support pin 32 is raised, and the glass plate 10 is supported only by the support pin 32. Next, the robot 22 is moved in the horizontal direction and inserted between the support pins 32 of the suction platform 30. Next, the adsorption of the glass plate 10 by the robot 22 is started, and the robot 22 is raised to lift the glass plate 10. Next, the glass plate 10 is carried by the robot 22 to the subsequent step.

(2-3)倒角磨石 (2-3) chamfering grindstone

一對倒角磨石40、42分別係用於對玻璃板10之端面11、12進行倒角加工之磨削砂輪。倒角磨石40、42分別安裝於磨石移動機構70、72。 A pair of chamfering grindstones 40, 42 are respectively used for grinding the grinding wheels for chamfering the end faces 11, 12 of the glass sheet 10. The chamfering grindstones 40, 42 are attached to the grindstone moving mechanisms 70, 72, respectively.

倒角磨石40、42可沿著X軸方向、Y軸方向及Z軸方向而移動。倒角磨石40、42之X軸方向、Y軸方向及Z軸方向之位置分別由磨石移動機構70、72調節。 The chamfering grindstones 40 and 42 are movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The positions of the chamfering grindstones 40 and 42 in the X-axis direction, the Y-axis direction, and the Z-axis direction are adjusted by the grindstone moving mechanisms 70 and 72, respectively.

倒角磨石40、42係金剛石砂輪。金剛石砂輪係例如利用包含鐵及銅等之金屬系之結合劑使金剛石研磨粒凝固而成之磨削砂輪。金剛石研磨粒係例如粒度為#300~600之金剛石研磨粒。如圖3所示,於倒角磨石40、42之側面,沿周向形成有加工槽。倒角磨石40、42繞與Z軸平行之旋轉軸旋轉。藉由玻璃板10之端部接觸於旋轉著之倒角磨石40、42之加工槽之內側之面,而對端面11、12進行倒角加工。藉此,於切斷步驟S3中被實施倒角加工之端面11、12係以成為圓形形狀之方式進行形狀加工。 Chamfering grindstone 40, 42 series diamond grinding wheel. The diamond grinding wheel is a grinding wheel in which diamond abrasive grains are solidified by, for example, a metal-based bonding agent containing iron or copper. The diamond abrasive grains are, for example, diamond abrasive grains having a particle size of #300 to 600. As shown in FIG. 3, machining grooves are formed in the circumferential direction on the side faces of the chamfering grindstones 40, 42. The chamfering grindstones 40, 42 rotate about a rotational axis parallel to the Z axis. The end faces 11, 12 are chamfered by the end portions of the glass sheets 10 contacting the inner faces of the grooves of the rotating chamfering grindstones 40, 42. Thereby, the end faces 11 and 12 subjected to the chamfering in the cutting step S3 are subjected to shape processing so as to have a circular shape.

(2-4)磨石移動機構 (2-4) Grinding stone moving mechanism

一對磨石移動機構70、72係可沿著X軸方向、Y軸方向及Z軸方向而移動之單元。磨石移動機構70係安裝有倒角磨石40之單元。磨石移動機構70可對倒角磨石40相對於玻璃板10之X軸方向、Y軸方向及Z軸方向之相對位置進行調節。磨石移動機構72係安裝有倒角磨石42之單元。磨石移動機構72可對倒角磨石42相對於玻璃板10之X軸方向、Y軸方向及Z軸方向之相對位置進行調節。 The pair of grindstone moving mechanisms 70 and 72 are units that are movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The grindstone moving mechanism 70 is a unit in which a chamfering grindstone 40 is mounted. The grindstone moving mechanism 70 can adjust the relative position of the chamfer grindstone 40 with respect to the X-axis direction, the Y-axis direction, and the Z-axis direction of the glass plate 10. The grindstone moving mechanism 72 is a unit in which a chamfering grindstone 42 is mounted. The grindstone moving mechanism 72 can adjust the relative position of the chamfering grindstone 42 with respect to the X-axis direction, the Y-axis direction, and the Z-axis direction of the glass plate 10.

(2-5)磨削液供給裝置 (2-5) Grinding fluid supply device

如圖2所示,磨削液供給裝置80係設置於玻璃板10之側方且倒角磨石40、42之附近且朝向玻璃板10之端面11、12噴射磨削液之裝置。磨削液係例如水、添加有界面活性劑之水、添加有其他藥劑之水。又,有可能於清洗步驟S6之後殘留於玻璃板10之液體、及有可能促進 端面加工裝置100之劣化之液體不用作磨削液。雖然未於圖2及圖3中表示,但亦可於玻璃板10之上方設置用於防止磨削液附著於玻璃板10之表面之蓋。又,雖然未於圖2及圖3中表示,但亦可設置覆蓋倒角磨石40、42之磨石蓋。藉由設置磨石蓋,可回收磨削液。 As shown in FIG. 2, the grinding fluid supply device 80 is provided on the side of the glass plate 10 and in the vicinity of the chamfering grindstones 40, 42 and sprays the grinding fluid toward the end faces 11, 12 of the glass plate 10. The grinding fluid is, for example, water, water to which a surfactant is added, or water to which another pharmaceutical agent is added. Moreover, there is a possibility that the liquid remaining in the glass sheet 10 after the cleaning step S6 may be promoted. The deteriorated liquid of the end face processing apparatus 100 is not used as the grinding fluid. Although not shown in FIGS. 2 and 3, a cover for preventing the grinding fluid from adhering to the surface of the glass sheet 10 may be provided above the glass sheet 10. Further, although not shown in Figs. 2 and 3, a grindstone cover covering the chamfering grindstones 40, 42 may be provided. The grinding fluid can be recovered by providing a grindstone cover.

於水中添加有界面活性劑之磨削液因表面張力較小而容易進入至玻璃板10之端面11、12與倒角磨石40、42之接觸部即磨削點。因此,磨削液具有將因玻璃板10之磨削所產生之玻璃微粒子等異物沖走而去除之效果。又,磨削液具有使容易因摩擦而成為高溫之磨削點冷卻之效果。 The grinding fluid to which the surfactant is added in water easily enters the contact point of the end faces 11, 12 of the glass sheet 10 and the chamfering grindstones 40, 42, that is, the grinding point, due to the small surface tension. Therefore, the grinding liquid has an effect of removing foreign matter such as glass fine particles generated by grinding of the glass plate 10 and removing it. Further, the grinding fluid has an effect of cooling the grinding point which is likely to be heated by friction.

(2-6)水供給裝置 (2-6) Water supply device

如圖3所示,水供給裝置90係設置於玻璃板10之上方且朝向玻璃板10之端面11、12噴射水之裝置。因利用倒角磨石40、42對玻璃板10之端面11、12進行加工而導致作為玻璃之微小片之玻璃屑自端面11、12飛散。水供給裝置90自玻璃板10之表面之內側朝向端面11、12噴出水而形成水膜。藉此,水供給裝置90可減少朝向玻璃板10之表面之內側飛散之玻璃屑之量。因此,水供給裝置90可抑制附著於玻璃板10之表面之玻璃屑之量。 As shown in FIG. 3, the water supply device 90 is provided above the glass sheet 10 and sprays water toward the end faces 11, 12 of the glass sheet 10. When the end faces 11 and 12 of the glass sheet 10 are processed by the chamfering grindstones 40 and 42, the glass flakes which are fine pieces of the glass are scattered from the end faces 11 and 12. The water supply device 90 ejects water from the inner side of the surface of the glass sheet 10 toward the end faces 11 and 12 to form a water film. Thereby, the water supply device 90 can reduce the amount of glass swarf scattered toward the inner side of the surface of the glass sheet 10. Therefore, the water supply device 90 can suppress the amount of glass swarf attached to the surface of the glass sheet 10.

(2-7)加工控制部 (2-7) Processing Control Department

加工控制部係對端面加工裝置100之動作進行控制之電腦。加工控制部對玻璃板搬送裝置20、吸附平台30、一對倒角磨石40、42、一對磨石移動機構70、72、磨削液供給裝置80及水供給裝置90進行控制。 The machining control unit is a computer that controls the operation of the end surface processing apparatus 100. The processing control unit controls the glass sheet conveying device 20, the adsorption stage 30, the pair of chamfering grindstones 40 and 42, the pair of grindstone moving mechanisms 70 and 72, the grinding fluid supply device 80, and the water supply device 90.

加工控制部對玻璃板搬送裝置20之機械手22之位置及姿勢進行控制。加工控制部使載置於吸附平台30之玻璃板10之吸附開始及結束。加工控制部對倒角磨石40、42之旋轉速度進行控制。加工控制部對磨石移動機構70、72之X軸方向、Y軸方向及Z軸方向之位置進行控 制。加工控制部對磨削液供給裝置80向玻璃板10噴射之磨削液之量進行控制。加工控制部對水供給裝置90向玻璃板10噴射之水之量進行控制。 The machining control unit controls the position and posture of the robot 22 of the glass sheet conveying device 20. The processing control unit starts and ends the adsorption of the glass sheet 10 placed on the adsorption stage 30. The machining control unit controls the rotational speed of the chamfering grindstones 40 and 42. The machining control unit controls the positions of the grinding stone moving mechanisms 70 and 72 in the X-axis direction, the Y-axis direction, and the Z-axis direction. system. The machining control unit controls the amount of the grinding fluid sprayed onto the glass sheet 10 by the grinding fluid supply device 80. The machining control unit controls the amount of water that the water supply device 90 sprays onto the glass sheet 10.

又,加工控制部連接於端面測定裝置110。加工控制部可自端面測定裝置110接收資料並將資料發送至端面測定裝置110。例如,加工控制部可接收端面測定裝置110所測定出之與玻璃板10之端面11、12之形狀相關之資料。 Further, the machining control unit is connected to the end surface measuring device 110. The processing control unit can receive the data from the end surface measuring device 110 and transmit the data to the end surface measuring device 110. For example, the processing control unit can receive information on the shape of the end faces 11, 12 of the glass sheet 10 measured by the end surface measuring device 110.

(3)端面測定裝置之構成 (3) The composition of the end face measuring device

端面測定裝置110對藉由端面加工裝置100被實施倒角加工後之玻璃板10之端面11~14之形狀進行測定。以下,對端面測定裝置110測定玻璃板10之與長邊平行之端面11、12之形狀之步驟進行說明。但是,以下之說明亦可應用於端面測定裝置110測定玻璃板10之與短邊平行之端面13、14之形狀之步驟。 The end surface measuring device 110 measures the shape of the end faces 11 to 14 of the glass sheet 10 subjected to chamfering by the end surface processing apparatus 100. Hereinafter, a procedure of measuring the shape of the end faces 11 and 12 of the glass sheet 10 parallel to the long sides will be described with respect to the end surface measuring device 110. However, the following description can also be applied to the step of measuring the shape of the end faces 13, 14 of the glass sheet 10 parallel to the short sides by the end surface measuring device 110.

圖5係端面測定裝置110之俯視圖。端面測定裝置110主要包括載置平台120、一對位置感測器130、132、一對感測器移動機構140、142、及測定控制部(未圖示)。 FIG. 5 is a plan view of the end surface measuring device 110. The end surface measuring device 110 mainly includes a mounting platform 120, a pair of position sensors 130 and 132, a pair of sensor moving mechanisms 140 and 142, and a measurement control unit (not shown).

(3-1)載置平台 (3-1) Mounting platform

載置平台120係載置已藉由端面加工裝置100對端面實施倒角加工之玻璃板10之平台。端面已被實施倒角加工之玻璃板10被玻璃板搬送裝置20舉起,並搬送至端面測定裝置110,載置於載置平台120。 The mounting platform 120 mounts a platform on which the glass sheet 10 having been chamfered by the end surface processing apparatus 100 is subjected to chamfering. The glass sheet 10 on which the end surface has been chamfered is lifted by the glass sheet conveying device 20, transported to the end surface measuring device 110, and placed on the mounting platform 120.

(3-2)位置感測器 (3-2) position sensor

一對位置感測器130、132分別係對載置於載置平台120之玻璃板10之端面11、12之形狀進行測定之接觸型感測器。位置感測器130、132分別具有可與端面11、12接觸並以X軸方向、Y軸方向及Z軸方向之座標之形式獲取與端面11、12之接觸點之位置之前端部130a、132a。 The pair of position sensors 130 and 132 are contact type sensors for measuring the shapes of the end faces 11 and 12 of the glass plate 10 placed on the mounting platform 120, respectively. The position sensors 130, 132 respectively have end portions 130a, 132a which are in contact with the end faces 11, 12 and which acquire the contact points with the end faces 11, 12 in the form of coordinates in the X-axis direction, the Y-axis direction and the Z-axis direction. .

(3-3)感測器移動機構 (3-3) Sensor moving mechanism

一對感測器移動機構140、142係可沿著X軸方向、Y軸方向及Z軸方向移動之單元。感測器移動機構140係安裝有位置感測器130之單元。感測器移動機構140可對位置感測器130相對於玻璃板10之X軸方向、Y軸方向及Z軸方向之相對位置進行調節。感測器移動機構142係安裝有位置感測器132之單元。感測器移動機構142可對位置感測器132相對於玻璃板10之X軸方向、Y軸方向及Z軸方向之相對位置進行調節。 The pair of sensor moving mechanisms 140, 142 are units that are movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The sensor moving mechanism 140 is a unit in which the position sensor 130 is mounted. The sensor moving mechanism 140 can adjust the relative position of the position sensor 130 with respect to the X-axis direction, the Y-axis direction, and the Z-axis direction of the glass sheet 10. The sensor moving mechanism 142 is a unit in which the position sensor 132 is mounted. The sensor moving mechanism 142 can adjust the relative position of the position sensor 132 with respect to the X-axis direction, the Y-axis direction, and the Z-axis direction of the glass sheet 10.

(3-4)測定控制部 (3-4) Measurement Control Department

測定控制部係對端面測定裝置110之動作進行控制之電腦。測定控制部對一對位置感測器130、132、及一對感測器移動機構140、142進行控制。測定控制部可對位置感測器130、132之位置進行控制。測定控制部可對感測器移動機構140、142之位置進行控制。 The measurement control unit is a computer that controls the operation of the end surface measuring device 110. The measurement control unit controls the pair of position sensors 130 and 132 and the pair of sensor moving mechanisms 140 and 142. The measurement control unit can control the position of the position sensors 130 and 132. The measurement control unit can control the positions of the sensor moving mechanisms 140 and 142.

表示玻璃板10之端面11、12之形狀之資料係由端面11、12上預先所設定之複數個測定點之X軸方向及Y軸方向之座標構成。圖6表示沿著Z軸方向觀察時之端面11上所設定之6個測定點P11~P16、及端面12上所設定之6個測定點P21~P26。圖7係自圖6所示之箭頭VII之方向觀察所得之於包含Y軸及Z軸之平面切斷後之玻璃板10之剖視圖。如圖7所示,測定點P16、P26位於端面11、12之Z軸方向之中心之高度位置。其他測定點P11~P15、P21~P25亦位於端面11、12之Z軸方向之中心之高度位置。以下,設為端面11之測定點P11~P16之X軸方向之位置分別與端面12之測定點P21~P26之X軸方向之位置相同。表示端面11之形狀之資料係由測定點P11~P16之X軸方向及Y軸方向之座標構成。表示端面12之形狀之資料係由測定點P21~P26之X軸方向及Y軸方向之座標構成。再者,對端面11、12設定之測定點之數量亦可根據玻璃板10之尺寸適當地進行設定。測定點亦能以特定之間隔設 定。例如,測定點亦能以1mm~50mm之間隔設定,較佳為以1mm~10mm之間隔設定。例如,於玻璃板10之端面11、12之尺寸為2500mm之情形時,測定點亦能以10mm之間隔等間隔地設定。 The data indicating the shape of the end faces 11 and 12 of the glass sheet 10 is composed of coordinates of the X-axis direction and the Y-axis direction of a plurality of measurement points set in advance on the end faces 11 and 12. 6 shows six measurement points P11 to P16 set on the end surface 11 when viewed in the Z-axis direction, and six measurement points P21 to P26 set on the end surface 12. Fig. 7 is a cross-sectional view of the glass sheet 10 taken along the plane including the Y-axis and the Z-axis as seen from the direction of the arrow VII shown in Fig. 6. As shown in FIG. 7, the measurement points P16 and P26 are located at the height position of the center of the end faces 11, 12 in the Z-axis direction. The other measurement points P11 to P15 and P21 to P25 are also located at the height of the center of the end faces 11 and 12 in the Z-axis direction. Hereinafter, the positions of the measurement points P11 to P16 of the end surface 11 in the X-axis direction are the same as the positions of the measurement points P21 to P26 of the end surface 12 in the X-axis direction. The data indicating the shape of the end face 11 is composed of coordinates of the X-axis direction and the Y-axis direction of the measurement points P11 to P16. The data indicating the shape of the end face 12 is composed of coordinates of the X-axis direction and the Y-axis direction of the measurement points P21 to P26. Further, the number of measurement points set for the end faces 11 and 12 can be appropriately set according to the size of the glass plate 10. The measurement points can also be set at specific intervals set. For example, the measurement points can also be set at intervals of 1 mm to 50 mm, preferably at intervals of 1 mm to 10 mm. For example, when the size of the end faces 11 and 12 of the glass sheet 10 is 2500 mm, the measurement points can be set at equal intervals of 10 mm.

其次,對測定控制部使用位置感測器130測定端面11之測定點P11~P16之位置之步驟進行說明。以下之說明亦可應用於測定控制部使用位置感測器132測定端面12之測定點P21~P26之位置之步驟。 Next, a procedure in which the measurement control unit measures the position of the measurement points P11 to P16 of the end surface 11 using the position sensor 130 will be described. The following description can also be applied to the step of the measurement control unit using the position sensor 132 to measure the positions of the measurement points P21 to P26 of the end surface 12.

測定控制部係沿著X軸之正方向對測定點P11~P16之位置依次進行測定。首先,測定控制部將位置感測器130之X軸方向之座標調節為測定點P11之X軸方向之座標。接著,測定控制部將位置感測器130之Z軸方向之座標調節到端面11之Z軸方向之中心之高度位置。接著,測定控制部將位置感測器130之Y軸方向之座標調節到位置感測器130之前端部130a與端面11接觸之位置。接著,測定控制部對前端部130a與端面11之接觸點之Y軸方向之位置進行測定。測定點P11之位置係由該接觸點之X軸方向及Y軸方向之座標構成。藉由以上步驟,測定控制部使用位置感測器130對測定點P11之位置進行測定。 The measurement control unit sequentially measures the positions of the measurement points P11 to P16 along the positive direction of the X-axis. First, the measurement control unit adjusts the coordinates of the position sensor 130 in the X-axis direction to the coordinates of the X-axis direction of the measurement point P11. Next, the measurement control unit adjusts the coordinate of the position sensor 130 in the Z-axis direction to the height position of the center of the end surface 11 in the Z-axis direction. Next, the measurement control unit adjusts the coordinate of the position sensor 130 in the Y-axis direction to a position where the end portion 130a of the position sensor 130 is in contact with the end surface 11. Next, the measurement control unit measures the position of the contact point of the distal end portion 130a and the end surface 11 in the Y-axis direction. The position of the measurement point P11 is composed of coordinates of the contact point in the X-axis direction and the Y-axis direction. Through the above steps, the measurement control unit measures the position of the measurement point P11 using the position sensor 130.

其次,測定控制部將位置感測器130之X軸方向之座標調節為測定點P12之X軸方向之座標。藉由上述步驟,測定控制部使用位置感測器130對測定點P12之位置進行測定。同樣地,測定控制部使用位置感測器130對測定點P13~P16之位置依次進行測定。又,測定控制部使用位置感測器132對測定點P21~P26之位置依次進行測定。 Next, the measurement control unit adjusts the coordinates of the position sensor 130 in the X-axis direction to the coordinates of the X-axis direction of the measurement point P12. Through the above steps, the measurement control unit measures the position of the measurement point P12 using the position sensor 130. Similarly, the measurement control unit sequentially measures the positions of the measurement points P13 to P16 using the position sensor 130. Further, the measurement control unit sequentially measures the positions of the measurement points P21 to P26 using the position sensor 132.

測定控制部係響應來自端面加工裝置100之加工控制部之要求,將位置感測器130、132所測定出之與測定點P11~P16、P21~P26之位置相關之資料發送至加工控制部。如下所述,加工控制部係利用所接收到之資料,於端面11、12之倒角加工時對倒角磨石40、42之位置進行控制。 The measurement control unit transmits the data related to the positions of the measurement points P11 to P16 and P21 to P26 measured by the position sensors 130 and 132 to the machining control unit in response to the request from the machining control unit of the end surface processing apparatus 100. As described below, the machining control unit controls the position of the chamfering grindstones 40, 42 at the chamfering of the end faces 11, 12 by using the received data.

(4)倒角加工之步驟 (4) Steps of chamfering

圖8係對玻璃板10之端面11、12進行倒角加工之步驟之流程圖。其次,一面參照圖8,一面對端面加工裝置100對端面11進行倒角加工之步驟進行說明。以下之說明亦可應用於端面加工裝置100對端面12進行倒角加工之步驟。 Figure 8 is a flow chart showing the steps of chamfering the end faces 11, 12 of the glass sheet 10. Next, a step of chamfering the end surface 11 facing the end surface processing apparatus 100 will be described with reference to Fig. 8 . The following description can also be applied to the step of chamfering the end face 12 of the end surface processing apparatus 100.

於步驟S11中,端面加工裝置100之加工控制部係對玻璃板搬送裝置20進行控制,搬送已於粗面化步驟S4中被實施表面處理之玻璃板10,並載置於吸附平台30。接著,加工控制部利用位置調整機構(未圖示),對載置於吸附平台30之玻璃板10之位置及方向進行調整。接著,加工控制部將玻璃板10固定於吸附平台30。於被固定之玻璃板10中,與玻璃板10之長邊平行之端面11、12平行於X軸,與玻璃板10之短邊平行之端面13、14平行於Y軸。接著,執行步驟S12。 In step S11, the processing control unit of the end surface processing apparatus 100 controls the glass sheet conveying apparatus 20, and conveys the glass sheet 10 subjected to the surface treatment in the roughening step S4, and places it on the adsorption stage 30. Next, the machining control unit adjusts the position and direction of the glass sheet 10 placed on the adsorption stage 30 by a position adjustment mechanism (not shown). Next, the processing control unit fixes the glass plate 10 to the adsorption stage 30. In the glass plate 10 to be fixed, the end faces 11, 12 parallel to the long sides of the glass plate 10 are parallel to the X-axis, and the end faces 13, 14 parallel to the short sides of the glass plate 10 are parallel to the Y-axis. Next, step S12 is performed.

於步驟S12中,加工控制部判定是否已於步驟S16中計算出下述調整線。於判定為尚未計算出調整線之情形時,執行步驟S13。於判定為已計算出調整線之情形時,執行步驟S17。 In step S12, the machining control unit determines whether or not the following adjustment line has been calculated in step S16. When it is determined that the adjustment line has not been calculated, step S13 is performed. When it is determined that the adjustment line has been calculated, step S17 is performed.

於步驟S13中,加工控制部係使倒角磨石40接觸於端面11,按照端面11之形狀使倒角磨石40移動,進行端面11之倒角加工。由於於步驟S11中以端面11與X軸平行之方式對玻璃板10之方向進行了調整,故而,加工控制部可使倒角磨石40沿著X軸移動而進行端面11之倒角加工。步驟S13係藉由自端面11去除特定量之玻璃而將端面11之形狀定量加工為圓形形狀之步驟。接著,執行步驟S14。 In step S13, the machining control unit causes the chamfering grindstone 40 to contact the end surface 11, and moves the chamfering grindstone 40 in accordance with the shape of the end surface 11, and performs chamfering processing of the end surface 11. Since the direction of the glass sheet 10 is adjusted so that the end surface 11 and the X-axis are parallel in step S11, the machining control unit can move the chamfering grindstone 40 along the X-axis to chamfer the end surface 11. Step S13 is a step of quantitatively processing the shape of the end face 11 into a circular shape by removing a specific amount of glass from the end face 11. Next, step S14 is performed.

再者,於步驟S13中,為了藉由倒角加工對端面11均勻地進行磨削,加工控制部較佳為使倒角磨石40沿著X軸正確地移動。但是,因用於使倒角磨石40移動之磨石移動機構70之機械精度而導致難以於端面11之倒角加工時使倒角磨石40正確地沿著X軸移動。因此,於端面11之倒角加工時,倒角磨石40會稍微沿Y軸方向而移動。因此,實際上,於步驟S13中,加工控制部無法對端面11均勻地進行磨削。因 此,於步驟S14~S16中,進行用於於端面11之倒角加工時對倒角磨石40之移動軌跡進行微調整之準備,以對端面11均勻地進行磨削。 Further, in step S13, in order to uniformly grind the end surface 11 by chamfering, the machining control unit preferably moves the chamfering grindstone 40 correctly along the X-axis. However, it is difficult to accurately move the chamfering grindstone 40 along the X-axis when the chamfering of the end face 11 is difficult due to the mechanical precision of the grindstone moving mechanism 70 for moving the chamfering grindstone 40. Therefore, at the chamfering process of the end face 11, the chamfering grindstone 40 moves slightly in the Y-axis direction. Therefore, actually, in step S13, the machining control unit cannot uniformly grind the end surface 11. because In the steps S14 to S16, the preparation for fine adjustment of the movement trajectory of the chamfering grindstone 40 during the chamfering of the end surface 11 is performed to uniformly grind the end surface 11.

於步驟S14中,加工控制部係對玻璃板搬送裝置20進行控制,將載置於吸附平台30之玻璃板10搬送至端面測定裝置110,並載置於載置平台120。接著,端面測定裝置110之測定控制部對玻璃板10之倒角加工後之端面11之形狀進行測定。具體而言,測定控制部對端面11上所設定之複數個測定點之X軸方向及Y軸方向之座標進行測定。測定點係圖6及圖7所示之測定點P11~P16。接著,測定控制部將所測定出之測定點P11~P16之X軸方向及Y軸方向之座標發送至端面加工裝置100之加工控制部。接著,執行步驟S15。 In step S14, the processing control unit controls the glass sheet conveying device 20, and conveys the glass sheet 10 placed on the adsorption stage 30 to the end surface measuring device 110, and mounts it on the mounting platform 120. Next, the measurement control unit of the end surface measuring device 110 measures the shape of the end surface 11 after chamfering of the glass sheet 10. Specifically, the measurement control unit measures the coordinates of the plurality of measurement points set on the end surface 11 in the X-axis direction and the Y-axis direction. The measurement points are the measurement points P11 to P16 shown in FIGS. 6 and 7. Next, the measurement control unit transmits the coordinates of the measured measurement points P11 to P16 in the X-axis direction and the Y-axis direction to the machining control unit of the end surface processing apparatus 100. Next, step S15 is performed.

於步驟S15中,加工控制部根據自測定控制部接收到之測定點P11~P16之X軸方向及Y軸方向之座標,計算加工線。圖9係端面11之測定點P11~P16之測定結果之一例。於圖9中,橫軸表示測定點P11~P16之X軸方向之座標,縱軸表示測定點P11~P16之Y軸方向之座標。測定點P11~P16係於X軸方向上,大致均等地設定於玻璃板10之端面11。於圖9中,於X軸方向相鄰之測定點以實線連結。加工線係將測定點P11~P16依次連結所得之線段。加工線表示倒角加工後之端面11之大概之形狀。接著,執行步驟S16。 In step S15, the machining control unit calculates the machining line based on the coordinates of the X-axis direction and the Y-axis direction of the measurement points P11 to P16 received from the measurement control unit. Fig. 9 is an example of measurement results of the measurement points P11 to P16 of the end surface 11. In FIG. 9, the horizontal axis represents the coordinates of the measurement points P11 to P16 in the X-axis direction, and the vertical axis represents the coordinates of the measurement points P11 to P16 in the Y-axis direction. The measurement points P11 to P16 are set in the X-axis direction, and are set substantially uniformly on the end surface 11 of the glass sheet 10. In FIG. 9, the measurement points adjacent to each other in the X-axis direction are connected by a solid line. The processing line connects the measurement points P11 to P16 in sequence. The processing line indicates the approximate shape of the end face 11 after chamfering. Next, step S16 is performed.

於步驟S16中,加工控制部係根據倒角加工前之端面11之形狀、及步驟S15中所計算出之加工線之形狀,計算調整線。調整線用於按照倒角加工前之端面11之形狀對端面11進行倒角加工。圖9中,以虛線表示調整線之一例。調整線上設定有與加工線之測定點P11~P16分別對應之調整點P31~P36。調整點P31~P36之X軸方向之座標與測定點P11~P16之X軸方向之座標相同。 In step S16, the machining control unit calculates the adjustment line based on the shape of the end face 11 before the chamfering process and the shape of the machining line calculated in step S15. The adjustment line is used to chamfer the end face 11 in accordance with the shape of the end face 11 before chamfering. In Fig. 9, an example of an adjustment line is indicated by a broken line. Adjustment points P31 to P36 corresponding to the measurement points P11 to P16 of the processing line are set on the adjustment line. The coordinates of the X-axis direction of the adjustment points P31 to P36 are the same as the coordinates of the X-axis directions of the measurement points P11 to P16.

對加工線與調整線之關係進行說明。於圖9中,以實線表示之加工線表示倒角加工後之端面11之大概之形狀。又,於圖9中,以鏈線 表示之基準線表示倒角加工後之端面11之理想之形狀。於本實施形態中,倒角加工前之端面11與X軸平行。較理想的是端面11於X軸方向均勻地被實施倒角加工,故而,基準線與X軸平行。而且,調整線設定為相對於與X軸平行之基準線使加工線反轉後所得之線段,以使倒角加工後之端面11平行於X軸。再者,基準線之Y軸方向之座標亦可根據端面11之加工餘量適當地進行設定。測定點P11~P16之Y軸方向之座標越大,端面11之加工餘量越大,故而,調整點P31~P36之Y軸方向之座標設定得較小。接著,執行步驟S11。 The relationship between the processing line and the adjustment line will be described. In Fig. 9, the processing line indicated by the solid line indicates the approximate shape of the end face 11 after chamfering. Also, in Figure 9, the chain line The reference line indicated indicates the ideal shape of the end face 11 after chamfering. In the present embodiment, the end surface 11 before chamfering is parallel to the X-axis. It is preferable that the end surface 11 is uniformly chamfered in the X-axis direction, and therefore, the reference line is parallel to the X-axis. Further, the adjustment line is set to a line segment obtained by inverting the processing line with respect to the reference line parallel to the X-axis, so that the end surface 11 after chamfering is parallel to the X-axis. Further, the coordinates of the reference line in the Y-axis direction may be appropriately set according to the machining allowance of the end surface 11. The larger the coordinate of the Y-axis direction of the measurement points P11 to P16 is, the larger the machining allowance of the end surface 11 is. Therefore, the coordinates of the adjustment points P31 to P36 in the Y-axis direction are set to be small. Next, step S11 is performed.

於步驟S17中,加工控制部一面對倒角磨石40之位置進行微調整,一面以沿著步驟S16中所計算出之調整線之方式使倒角磨石40移動而對玻璃板10之端面11進行倒角加工。例如,於倒角磨石40沿著X軸方向自調整點P31移動至P32之期間,以於Y軸方向倒角磨石40之座標自調整點P31之座標移動至P32之座標之方式控制倒角磨石40之位置。於圖9中,測定點P11之Y軸方向之座標為約-0.02mm,故而,為了使測定點P11處之磨削量為理想值(Y軸方向之座標為0mm之狀態),於倒角加工時,以倒角磨石40之Y軸方向之座標成為約+0.02mm之方式使倒角磨石40移動。藉此,倒角加工後之端面11之測定點P11之Y軸方向之座標成為約0mm。即,調整點P31表示Y軸方向上之倒角磨石40之理想之座標。關於測定點P12~P16,亦同樣地控制倒角磨石40之Y軸方向之座標。藉此,倒角加工後之端面11與倒角加工前之端面11大致平行。步驟S17係與步驟S13同樣地藉由自端面11去除特定量之玻璃而將端面11之形狀定量加工為圓形形狀之步驟。 In step S17, the machining control unit slightly adjusts the position of the chamfering grindstone 40, and moves the chamfering grindstone 40 to the glass sheet 10 along the adjustment line calculated in step S16. The end face 11 is chamfered. For example, during the movement of the chamfering grindstone 40 from the adjustment point P31 to P32 along the X-axis direction, the coordinates of the chamfering grindstone 40 in the Y-axis direction are controlled from the coordinates of the adjustment point P31 to the coordinates of P32. The position of the angle grindstone 40. In FIG. 9, the coordinate of the measurement point P11 in the Y-axis direction is about -0.02 mm, so that the chamfering is performed in order to make the grinding amount at the measurement point P11 an ideal value (a state in which the coordinate in the Y-axis direction is 0 mm). At the time of machining, the chamfering grindstone 40 is moved so that the coordinates of the chamfering grindstone 40 in the Y-axis direction become about +0.02 mm. Thereby, the coordinate of the measurement point P11 of the end surface 11 after the chamfering process in the Y-axis direction becomes about 0 mm. That is, the adjustment point P31 represents an ideal coordinate of the chamfered grindstone 40 in the Y-axis direction. Similarly to the measurement points P12 to P16, the coordinates of the chamfering grindstone 40 in the Y-axis direction are controlled. Thereby, the end surface 11 after chamfering is substantially parallel to the end surface 11 before chamfering. Step S17 is a step of quantitatively processing the shape of the end surface 11 into a circular shape by removing a specific amount of glass from the end surface 11 in the same manner as in step S13.

以上步驟重複進行至製造批次之所有玻璃板10被實施倒角加工為止。再者,步驟S13~S16通常僅對製造批次之第一塊玻璃板10進行。 The above steps are repeated until all of the glass sheets 10 of the manufacturing lot are subjected to chamfering. Furthermore, steps S13 to S16 are generally performed only on the first glass sheet 10 of the manufacturing lot.

再者,於步驟S11~S17之端面11、12之倒角加工之後,進行端 面11、12之研磨加工。研磨加工係藉由將彈性砂輪以固定壓力抵壓於倒角加工後之端面11、12而降低端面11、12之表面粗糙度之步驟。研磨加工時維持藉由倒角加工所形成之端面11、12之圓形形狀。彈性砂輪利用聚胺基甲酸酯等彈性構件成形。 Furthermore, after the chamfering of the end faces 11, 12 of steps S11 to S17, the end is performed. Grinding of the faces 11, 12 The polishing process is a step of reducing the surface roughness of the end faces 11, 12 by pressing the elastic grinding wheel against the chamfered end faces 11, 12 with a fixed pressure. The circular shape of the end faces 11, 12 formed by chamfering is maintained during the grinding process. The elastic grinding wheel is formed by an elastic member such as polyurethane.

(5)特徵 (5) Features

端面加工裝置100首先利用倒角磨石40、42對調整用玻璃板10之端面11、12進行倒角加工。調整用玻璃板10係為了計算調整線而被實施倒角加工之玻璃板10,通常為製造批次之第一塊玻璃板10。於調整用玻璃板10之倒角加工步驟中,倒角磨石40、42分別以按照調整用玻璃板10之端面11、12之形狀移動之方式、即以沿著X軸而移動之方式進行控制。但是,因用於使倒角磨石40、42移動之磨石移動機構70、72之機械精度而導致難以使倒角磨石40、42沿著X軸正確地移動。因此,於磨石移動機構70、72使倒角磨石40、42沿著X軸移動之期間,倒角磨石40、42有時會稍微沿Y軸方向移動。因此,沿著Z軸方向觀察時之倒角磨石40、42之移動軌跡即加工線不與X軸平行。即,倒角加工後之端面11、12之形狀分別與倒角加工前之端面11、12之形狀不完全一致,兩者之間存在差異。因此,於調整用玻璃板10,倒角加工後之端面11、12並未沿著端面11、12延伸之方向均勻地被磨削。即,於調整用玻璃板10,倒角加工後之端面11、12具有磨削量較多之部分與磨削量較少之部分,故而,於Y軸方向形成有微小之凹凸。微小之凹凸為端面11、12之起伏。因此,調整用玻璃板10之端面11之直線性因倒角加工而降低。 The end surface processing apparatus 100 first chamfers the end faces 11 and 12 of the glass sheet 10 for adjustment by the chamfering grindstones 40 and 42. The glass plate for adjustment 10 is a glass plate 10 subjected to chamfering in order to calculate an adjustment line, and is usually the first glass plate 10 of the manufacturing lot. In the chamfering processing step of the adjustment glass plate 10, the chamfering grindstones 40 and 42 are moved in such a manner as to move along the X-axis in accordance with the shape of the end faces 11 and 12 of the glass sheet 10 for adjustment. control. However, it is difficult to accurately move the chamfering grindstones 40, 42 along the X-axis due to the mechanical precision of the grindstone moving mechanisms 70, 72 for moving the chamfering grindstones 40, 42. Therefore, while the grindstone moving mechanisms 70 and 72 move the chamfering grindstones 40 and 42 along the X-axis, the chamfering grindstones 40 and 42 may slightly move in the Y-axis direction. Therefore, the moving trajectory of the chamfering grindstones 40, 42 when viewed in the Z-axis direction, that is, the processing line is not parallel to the X-axis. That is, the shapes of the end faces 11 and 12 after the chamfering process are not completely identical to the shapes of the end faces 11 and 12 before the chamfering process, and there is a difference therebetween. Therefore, in the glass plate 10 for adjustment, the end faces 11, 12 after chamfering are not uniformly ground in the direction in which the end faces 11, 12 extend. In other words, in the glass plate 10 for adjustment, the end faces 11 and 12 after chamfering have a portion having a large amount of grinding and a portion having a small amount of grinding, so that minute irregularities are formed in the Y-axis direction. The minute irregularities are the undulations of the end faces 11, 12. Therefore, the linearity of the end surface 11 of the glass sheet 10 for adjustment is lowered by chamfering.

於本實施形態中,端面測定裝置110對調整用玻璃板10之倒角加工後之端面11、12之形狀進行測定。端面加工裝置100根據所測定出之端面11、12之形狀,計算加工線。加工線表示於調整用玻璃板10之端面11、12之倒角加工時倒角磨石40、42實際移動之軌跡。又,加工 線表示倒角加工後之端面11、12之實際形狀。例如,於圖9中,以實線表示之加工線之凸部相當於端面11之凸部,加工線之凹部相當於端面11之凹部。端面11之凸部係倒角磨石40之磨削量較周圍少之部分。端面11之凹部係倒角磨石40之磨削量較周圍多之部分。因此,藉由於加工線之凸部增加倒角磨石40之磨削量並於加工線之凹部減少倒角磨石40之磨削量,可使倒角加工後之端面11之磨削量均勻。於圖9中,以虛線表示之調整線表示用於使端面11之磨削量均勻之倒角磨石40之移動軌跡。 In the present embodiment, the end surface measuring device 110 measures the shape of the end faces 11 and 12 after chamfering of the glass sheet 10 for adjustment. The end surface processing apparatus 100 calculates a processing line based on the measured shapes of the end faces 11 and 12. The processing line indicates the trajectory of the actual movement of the chamfering grindstones 40, 42 when the chamfering of the end faces 11, 12 of the glass sheet 10 for adjustment is performed. Processing The line indicates the actual shape of the end faces 11, 12 after chamfering. For example, in FIG. 9, the convex portion of the processing line indicated by the solid line corresponds to the convex portion of the end surface 11, and the concave portion of the processing line corresponds to the concave portion of the end surface 11. The convex portion of the end face 11 is a portion in which the chamfering grindstone 40 is ground less than the surrounding portion. The recess of the end face 11 is a portion of the chamfered grindstone 40 that is more abrasive than the surrounding portion. Therefore, by increasing the amount of grinding of the chamfering grindstone 40 by the convex portion of the processing line and reducing the grinding amount of the chamfering grindstone 40 in the concave portion of the processing line, the grinding amount of the end surface 11 after chamfering can be made uniform . In Fig. 9, the adjustment line indicated by a broken line indicates the movement locus of the chamfering grindstone 40 for making the grinding amount of the end surface 11 uniform.

圖10係一面使倒角磨石40沿著調整線移動一面被實施倒角加工之端面11之測定點P11~P16之X軸方向及Y軸方向之座標之測定結果之一例。圖9及圖10係相同之玻璃板10之相同之端面11之測定結果。比較圖9與圖10可知,端面11沿著X軸方向大致均勻地被磨削。又,如圖10所示,倒角加工後之端面11之測定點P11~P16之Y軸方向之座標處於以理想座標即0mm為基準之-10μm~10μm(-0.01mm~0.01mm)之範圍內。即,本實施形態之端面11之倒角加工可達到±10μm之加工精度。 FIG. 10 is an example of measurement results of coordinates in the X-axis direction and the Y-axis direction of the measurement points P11 to P16 of the end surface 11 on which the chamfering grindstone 40 is moved along the adjustment line. 9 and 10 show the measurement results of the same end faces 11 of the same glass plate 10. Comparing Fig. 9 with Fig. 10, the end surface 11 is substantially uniformly ground along the X-axis direction. Further, as shown in Fig. 10, the coordinates of the measurement points P11 to P16 of the end surface 11 after the chamfering process are in the range of -10 μm to 10 μm (-0.01 mm to 0.01 mm) based on the ideal coordinate, that is, 0 mm. Inside. That is, the chamfering of the end face 11 of the present embodiment can achieve a machining accuracy of ±10 μm.

根據以上說明,端面加工裝置100藉由預先測定調整用玻璃板10之倒角加工後之端面11、12之形狀而計算加工線,並根據已計算出之加工線計算調整線,使倒角磨石40、42沿著已計算出之調整線移動,而可進行將端面11、12均勻地磨削之倒角加工。 According to the above description, the end surface processing apparatus 100 calculates the processing line by measuring the shape of the end faces 11 and 12 after the chamfering processing of the glass sheet 10 for adjustment, and calculates the adjustment line based on the calculated processing line to make the chamfer grinding The stones 40, 42 are moved along the calculated adjustment line, and the chamfering process for uniformly grinding the end faces 11, 12 can be performed.

又,為了自玻璃板10之端面11、12去除水平裂紋及脆性破壞層,於端面11、12之倒角加工時,必須沿著與端面11、12正交之Y軸方向具有±10μm之加工精度、更佳為5μm之加工精度。因此,提高玻璃板10之端面11、12之加工精度而提高倒角加工後之玻璃板10之端面11、12之X軸方向之直線性較為重要。於本實施形態中,端面加工裝置100可進行將端面11、12均勻地磨削之倒角加工,故而可提高玻璃 板10之端面11、12之加工精度。 Further, in order to remove the horizontal crack and the brittle fracture layer from the end faces 11 and 12 of the glass sheet 10, it is necessary to process the end faces 11 and 12 at a chamfer angle of ±10 μm along the Y-axis direction orthogonal to the end faces 11 and 12. Accuracy, better processing accuracy of 5μm. Therefore, it is important to improve the processing accuracy of the end faces 11 and 12 of the glass sheet 10 and to improve the linearity of the end faces 11 and 12 of the glass sheet 10 after chamfering in the X-axis direction. In the present embodiment, the end surface processing apparatus 100 can perform chamfering processing for uniformly grinding the end faces 11 and 12, thereby improving the glass. The machining accuracy of the end faces 11, 12 of the plate 10.

又,端面加工裝置100可使玻璃板10之端面11、12之磨削量遍及X軸方向均勻且可將磨削量抑制得較低。藉此,端面加工裝置100可減少端面11、12之磨削量,從而可減少於端面11、12之磨削時產生之玻璃屑及玻璃顆粒之量。又,倒角磨石40、42對端面11、12之切入量亦可抑制得較低,產生之玻璃屑及顆粒之尺寸亦可縮小。其結果為,可減少附著於玻璃板10之表面之玻璃屑及顆粒之量。 Further, the end surface processing apparatus 100 can make the grinding amount of the end faces 11 and 12 of the glass sheet 10 uniform in the X-axis direction and can suppress the grinding amount to be low. Thereby, the end surface processing apparatus 100 can reduce the amount of grinding of the end faces 11, 12, thereby reducing the amount of glass swarf and glass granules generated during the grinding of the end faces 11, 12. Moreover, the cutting amount of the end faces 11, 12 of the chamfering grindstones 40, 42 can also be suppressed to be low, and the size of the generated glass chips and particles can also be reduced. As a result, the amount of glass swarf and particles adhering to the surface of the glass sheet 10 can be reduced.

又,使用端面加工裝置100所製造之玻璃板10可較佳地用作用於製造高清顯示器用面板之玻璃基板。於表面形成線寬或間距較窄之配線圖案之高清‧高分辨率顯示器用玻璃基板、例如形成有氧化物半導體或低溫多晶矽半導體元件之玻璃基板之品質要求比先前之玻璃基板高。先前之玻璃基板之製造方法無法充分滿足該高品質要求。但是,本實施形態之端面加工裝置100可於形成於玻璃基板之配線電極之線寬或間距較窄且不容許微小之缺陷之高清‧高分辨率顯示器用玻璃基板之製造中抑制玻璃屑及顆粒附著於玻璃基板表面之問題之產生。 Further, the glass sheet 10 manufactured by using the end surface processing apparatus 100 can be preferably used as a glass substrate for manufacturing a panel for a high definition display. A high-definition ‧ high-resolution display glass substrate having a wiring pattern having a narrow line width or a narrow pitch on the surface, for example, a glass substrate on which an oxide semiconductor or a low-temperature polysilicon semiconductor element is formed is required to have higher quality than the conventional glass substrate. The previous method of manufacturing a glass substrate cannot sufficiently satisfy the high quality requirement. However, the end surface processing apparatus 100 of the present embodiment can suppress glass chips and particles in the manufacture of a glass substrate for a high-definition ‧ high-resolution display which is formed on a glass substrate and has a narrow line width or a narrow pitch and which does not allow minute defects. The problem of adhesion to the surface of the glass substrate.

又,藉由減少玻璃屑及顆粒於玻璃基板表面之附著量,可提高與玻璃之密接性較低之Cu系電極之配線之良率。即,藉由使用本實施形態之端面加工裝置100,即使配線電極之線寬或間距較窄,亦可使用與玻璃之密接性較低之電極材料。例如,與Al系電極或Cr、Mo系電極等相比,雖然相對於玻璃之密接性較低,但亦可使用低電阻之Ti-Cu合金或Mo-Cu合金等之Cu系電極。由於如此電極材料之選擇範圍較廣,故而可消除用於電視等之大型顯示器面板之製造步驟中之RC延遲(配線延遲)之問題。又,亦可消除估計今後高清‧高分辨率化會進一步發展之面向移動終端之小型顯示器面板之製造步驟中之RC延遲之問題。 Moreover, by reducing the amount of adhesion of the glass swarf and the particles on the surface of the glass substrate, the yield of the wiring of the Cu-based electrode having low adhesion to the glass can be improved. In other words, by using the end surface processing apparatus 100 of the present embodiment, even if the line width or pitch of the wiring electrode is narrow, an electrode material having low adhesion to glass can be used. For example, compared with an Al-based electrode, a Cr, a Mo-based electrode, or the like, the adhesion to the glass is low, but a Cu-based electrode such as a low-resistance Ti-Cu alloy or a Mo-Cu alloy can be used. Since the selection range of the electrode material is wide, the problem of RC delay (wiring delay) in the manufacturing steps of a large display panel such as a television can be eliminated. In addition, it is possible to eliminate the problem of RC delay in the manufacturing steps of small display panels for mobile terminals that are expected to be further developed in the future.

又,於上述說明中,對設置半導體元件作為器件之用於 TFT(Thin Film Transistor,薄膜電晶體)面板等之玻璃基板之問題之對策進行了說明,但本實施形態之端面加工裝置100對設置彩色濾光片(CF,Color Filter)等作為器件之顯示器用玻璃基板之問題之對策亦有效。例如,於CF面板之情形時,近年來,黑矩陣(BM,Black Matrix)之細線化得到發展。但是,藉由使用本實施形態之端面加工裝置100,可於BM線寬細線化為20μm以下、例如5μm~10μm之液晶顯示器用CF面板之製造步驟中抑制因附著於表面之異物所引起之BM剝落之問題之產生。 Further, in the above description, a semiconductor element is provided for use as a device. A countermeasure against a problem of a glass substrate such as a TFT (Thin Film Transistor) panel has been described. However, the end surface processing apparatus 100 of the present embodiment is provided as a display for providing a color filter (CF, Color Filter) or the like as a device. The countermeasure against the problem of the glass substrate is also effective. For example, in the case of a CF panel, in recent years, the thinning of a black matrix (BM, Black Matrix) has been developed. However, by using the end surface processing apparatus 100 of the present embodiment, it is possible to suppress the BM caused by the foreign matter adhering to the surface in the manufacturing process of the CF panel for liquid crystal display having a BM line width of 20 μm or less, for example, 5 μm to 10 μm. The problem of spalling.

(6)變化例 (6) Variations

以上,對本發明之玻璃板製造方法進行了說明,但本發明並不限定於上述實施形態,亦可於不脫離本發明之主旨之範圍內實施各種改良及變更。 The method of producing the glass sheet of the present invention has been described above, but the present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

(6-1)變化例A (6-1) Change A

於實施形態中,於圖8所示之步驟S14中,端面測定裝置110之測定控制部係對倒角加工後之玻璃板10之端面11、12上所設定之複數個測定點P11~P16、P21~P26之X軸方向及Y軸方向之座標進行測定,而測定端面11、12之形狀。但是,測定控制部亦可測定Z軸方向之座標代替測定倒角加工後之玻璃板10之端面11、12上所設定之複數個測定點P11~P16、P21~P26之Y軸方向之座標,而測定端面11、12之形狀。 In the embodiment, in the step S14 shown in FIG. 8, the measurement control unit of the end surface measuring device 110 is a plurality of measurement points P11 to P16 set on the end faces 11 and 12 of the glass plate 10 after the chamfering process. The coordinates of the X-axis direction and the Y-axis direction of P21 to P26 were measured, and the shapes of the end faces 11 and 12 were measured. However, the measurement control unit may measure the coordinates in the Z-axis direction instead of the coordinates of the Y-axis directions of the plurality of measurement points P11 to P16 and P21 to P26 set on the end faces 11 and 12 of the glass plate 10 after the chamfering process. The shapes of the end faces 11, 12 were measured.

本變化例與於例如固定於吸附平台30之玻璃板10之端面11之Z軸方向之座標沿著X軸方向不固定之情形時對端面11均勻地磨削之倒角加工相關。以下之說明亦可應用於端面12之倒角加工。 This modification is related to the chamfering process of uniformly grinding the end surface 11 when the coordinates of the Z-axis direction of the end surface 11 of the glass sheet 10 fixed to the adsorption stage 30 are not fixed in the X-axis direction. The following description can also be applied to the chamfering of the end face 12.

有時因吸附平台30之機械精度而導致固定於吸附平台30之玻璃板10之主表面不完全平坦。藉此,沿著Y軸方向觀察玻璃板10之端面11時,端面11於Z軸方向形成有凹凸。即,端面11之Z軸方向之座標沿 著X軸方向不固定。 The main surface of the glass sheet 10 fixed to the adsorption stage 30 is sometimes not completely flat due to the mechanical precision of the adsorption platform 30. Thereby, when the end surface 11 of the glass plate 10 is observed along the Y-axis direction, the end surface 11 is formed with irregularities in the Z-axis direction. That is, the coordinate edge of the end face 11 in the Z-axis direction The X-axis direction is not fixed.

若利用倒角磨石40對此種端面11進行倒角加工,則有時倒角加工後之端面11之面寬差D沿著X軸方向不固定。圖11及圖12係用於說明端面11之面寬差D之圖。圖11係沿著X軸觀察倒角加工後之玻璃板10所得之側視圖。圖12係利用倒角磨石40磨削之玻璃板10之YZ平面之剖視圖。於圖12中,標有虛線之影線之區域為玻璃板10之一部分且為利用倒角磨石40磨削而去除之部分。面寬差D係自第1倒角寬度W1減去第2倒角寬度W2所得之值。第1倒角寬度W1係自玻璃板10之下側之第1主表面10a去除之區域之寬度。第2倒角寬度W2係自玻璃板10之上側之第2主表面10b去除之區域之寬度。於圖12中,玻璃板10之端面11藉由與旋轉之倒角磨石40之加工槽40a之內側之面接觸而被實施倒角加工。如圖12所示,根據玻璃板10之Z軸方向之位置,第1倒角寬度W1成為與第2倒角寬度W2不同之值。 When the end face 11 is chamfered by the chamfering grindstone 40, the surface width difference D of the end surface 11 after chamfering may not be fixed along the X-axis direction. 11 and 12 are views for explaining the surface width difference D of the end surface 11. Figure 11 is a side view of the glass sheet 10 after chamfering is observed along the X-axis. Figure 12 is a cross-sectional view of the YZ plane of the glass sheet 10 ground by the chamfering grindstone 40. In Fig. 12, the area marked with the dotted hatching is a portion of the glass sheet 10 and is removed by grinding with the chamfering grindstone 40. The surface width difference D is a value obtained by subtracting the second chamfer width W2 from the first chamfering width W1. The first chamfered width W1 is the width of a region removed from the first main surface 10a on the lower side of the glass sheet 10. The second chamfering width W2 is the width of a region removed from the second main surface 10b on the upper side of the glass sheet 10. In Fig. 12, the end surface 11 of the glass sheet 10 is chamfered by being brought into contact with the inner surface of the processing groove 40a of the rotating chamfering grindstone 40. As shown in FIG. 12, the first chamfering width W1 is different from the second chamfering width W2 in accordance with the position of the glass plate 10 in the Z-axis direction.

於面寬差D為零之情形時,玻璃板10之第1主表面10a及第2主表面10b被均等地磨削。於面寬差D為正值之情形時,面寬差D越大,則第1主表面10a與第2主表面10b相比被磨削得越多。於面寬差D為負值之情形時,面寬差D越小,則第2主表面10b與第1主表面10a相比被磨削得越多。因此,自對第1主表面10a及第2主表面10b均勻地磨削之觀點來看,面寬差D之絕對值越小越佳,更佳為零。於第1倒角寬度W1與第2倒角寬度W2不同之情形時,有可能於對倒角加工後之端面11、12進行研磨之之後之步驟中,端面11、12整體未均勻地被研磨,而導致玻璃板10之強度降低。因此,於使用倒角磨石40對玻璃板10進行倒角之步驟中,必須使面寬差D之絕對值接近零而對玻璃板10之端面11、12整體均勻地進行磨削加工。 When the surface width difference D is zero, the first main surface 10a and the second main surface 10b of the glass sheet 10 are equally ground. When the surface width difference D is a positive value, the larger the surface width difference D is, the more the first main surface 10a is ground than the second main surface 10b. When the surface width difference D is a negative value, the smaller the surface width difference D is, the more the second main surface 10b is ground than the first main surface 10a. Therefore, from the viewpoint of uniformly grinding the first main surface 10a and the second main surface 10b, the absolute value of the surface width difference D is preferably as small as possible, and more preferably zero. When the first chamfering width W1 is different from the second chamfering width W2, there is a possibility that the entire end faces 11 and 12 are not uniformly polished in the step after the chamfering processed end faces 11 and 12 are polished. This causes the strength of the glass sheet 10 to decrease. Therefore, in the step of chamfering the glass sheet 10 by using the chamfering grindstone 40, it is necessary to uniformly grind the entire end faces 11 and 12 of the glass sheet 10 so that the absolute value of the surface width difference D is close to zero.

於倒角磨石40之Z軸方向之座標與玻璃板10之端面11之Z軸方向之座標恰當之情形時,倒角加工後之端面11之面寬差D變為零。具體 而言,於倒角磨石40之加工槽之Z軸方向之中心位於與端面11之Z軸方向之中心相同之位置之情形時,倒角加工後之端面11之面寬差D變為零。但是,於端面11之Z軸方向之座標相對於倒角磨石40過小之情形時,端面11之下部與上部相比被倒角得多,因此,第1倒角寬度W1大於第2倒角寬度W2,而面寬差D大於零。相反地,於端面11之Z軸方向之座標相對於倒角磨石40過大之情形時,端面11之上部與下部相比被倒角得多,因此,第1倒角寬度W1小於第2倒角寬度W2,而面寬差D小於零。 When the coordinates of the Z-axis direction of the chamfering grindstone 40 and the coordinate of the end surface 11 of the glass sheet 10 in the Z-axis direction are appropriate, the surface width difference D of the end surface 11 after the chamfering process becomes zero. specific In the case where the center of the machining groove of the chamfering grindstone 40 is located at the same position as the center of the end surface 11 in the Z-axis direction, the surface width difference D of the end surface 11 after the chamfering process becomes zero. . However, when the coordinates of the end face 11 in the Z-axis direction are too small with respect to the chamfering grindstone 40, the lower portion of the end face 11 is chamfered much more than the upper portion, and therefore, the first chamfering width W1 is larger than the second chamfering angle. The width W2 and the surface width difference D are greater than zero. Conversely, when the coordinates of the end face 11 in the Z-axis direction are too large with respect to the chamfering grindstone 40, the upper portion of the end face 11 is chamfered more than the lower portion, and therefore, the first chamfering width W1 is smaller than the second pour. The angular width is W2, and the surface width difference D is less than zero.

於本變化例中,端面測定裝置110之測定控制部可於複數個測定點測定倒角加工後之玻璃板10之端面11之面寬差D,並根據面寬差D之測定資料而計算各測定點之端面11之Z軸方向之座標。即,測定控制部可根據複數個測定點之面寬差D而測定沿著Y軸方向觀察時之端面11之形狀。圖13係倒角加工後之端面11之第1倒角寬度W1、第2倒角寬度W2及面寬差D之測定結果之一例。於圖13中,橫軸表示與實施形態相同之測定點P11~P16之X軸方向之座標,縱軸表示第1倒角寬度W1、第2倒角寬度W2及面寬差D之絕對值。第1倒角寬度W1由以菱形之點連結之實線表示。第2倒角寬度W2由以四方形之點連結之虛線表示。面寬差D之絕對值由以圓點連結之鏈線表示。第1倒角寬度W1及第2倒角寬度W2由左側之縱軸之刻度值表示。面寬差D之絕對值由右側之縱軸之刻度值表示。 In the present modification, the measurement control unit of the end surface measuring device 110 can measure the surface width difference D of the end surface 11 of the glass sheet 10 after the chamfering processing at a plurality of measurement points, and calculate the data based on the measurement data of the surface width difference D. The coordinates of the end face 11 of the point in the Z-axis direction are measured. In other words, the measurement control unit can measure the shape of the end surface 11 when viewed in the Y-axis direction based on the surface width difference D of the plurality of measurement points. Fig. 13 is an example of measurement results of the first chamfer width W1, the second chamfer width W2, and the surface width difference D of the end surface 11 after chamfering. In FIG. 13, the horizontal axis represents the coordinates of the measurement points P11 to P16 in the X-axis direction, and the vertical axis represents the absolute values of the first chamfer width W1, the second chamfer width W2, and the surface width difference D. The first chamfered width W1 is represented by a solid line connected by a diamond dot. The second chamfering width W2 is indicated by a broken line connecting the square points. The absolute value of the surface width difference D is represented by a chain line connected by dots. The first chamfering width W1 and the second chamfering width W2 are represented by scale values of the vertical axis on the left side. The absolute value of the surface width difference D is represented by the scale value of the vertical axis on the right side.

測定控制部藉由於面寬差D大於零之測定點減小倒角磨石40之Z軸方向之座標,並於面寬差D小於零之測定點增大倒角磨石40之Z軸方向之座標,可結合端面11之形狀恰當地調整倒角磨石40之Z軸方向之座標。具體而言,與實施形態同樣地,根據各測定點P11~P16之面寬差D之測定資料計算加工線,並根據已計算出之加工線而計算調整線,使倒角磨石40、42沿著已計算出之調整線移動,由此可進行對端 面11、12均勻地磨削之倒角加工。藉此,測定控制部可減小倒角加工後之端面11之面寬差D之絕對值。 The measurement control unit reduces the coordinate of the chamfer grindstone 40 in the Z-axis direction by the measurement point whose surface width difference D is greater than zero, and increases the Z-axis direction of the chamfer grindstone 40 at the measurement point where the surface width difference D is less than zero. The coordinates of the Z-axis direction of the chamfering grindstone 40 can be appropriately adjusted in conjunction with the shape of the end face 11. Specifically, similarly to the embodiment, the processing line is calculated based on the measurement data of the surface width difference D of each of the measurement points P11 to P16, and the adjustment line is calculated based on the calculated processing line to make the chamfering grindstone 40, 42 Move along the calculated adjustment line, thereby making the opposite end The chamfering of the faces 11, 12 is evenly ground. Thereby, the measurement control unit can reduce the absolute value of the surface width difference D of the end surface 11 after the chamfering process.

圖14係一面沿著已計算出之調整線調整倒角磨石40之Z軸方向之位置一面進行倒角加工後之端面11之第1倒角寬度W1、第2倒角寬度W2及面寬差D之絕對值之測定結果之一例。圖13及圖14係相同之玻璃板10之相同之端面11之測定結果。於圖13及圖14中,使用相同之範例。比較圖13與圖14可知,藉由一面沿著調整線調整倒角磨石40之Z軸方向之位置一面進行倒角加工,倒角加工後之端面11之面寬差D之絕對值減小。因此,端面加工裝置100可提高玻璃板10之端面11之加工精度而進行對端面11均勻地磨削之倒角加工。又,玻璃板10之面寬差D之絕對值越小,則玻璃板10之彎曲強度越大。因此,端面加工裝置100可進行抑制玻璃板10之彎曲強度降低之倒角加工。再者,倒角加工後之玻璃板10之面寬差D之絕對值較佳為為150μm以下,更佳為80μm以下,進而較佳為50μm以下。 Fig. 14 is a first chamfering width W1, a second chamfering width W2, and a surface width of the end surface 11 which is chamfered while adjusting the position of the chamfering grindstone 40 in the Z-axis direction along the calculated adjustment line. An example of the measurement result of the absolute value of the difference D. 13 and 14 show the measurement results of the same end faces 11 of the same glass plate 10. In Figures 13 and 14, the same example is used. Comparing Fig. 13 with Fig. 14, it can be seen that the chamfering is performed while adjusting the position of the chamfering grindstone 40 in the Z-axis direction along the adjustment line, and the absolute value of the surface width difference D of the end surface 11 after chamfering is reduced. . Therefore, the end surface processing apparatus 100 can improve the machining accuracy of the end surface 11 of the glass sheet 10 and perform chamfering processing for uniformly grinding the end surface 11. Further, the smaller the absolute value of the surface width difference D of the glass sheet 10, the greater the bending strength of the glass sheet 10. Therefore, the end surface processing apparatus 100 can perform chamfering processing which suppresses the reduction of the bending strength of the glass plate 10. Further, the absolute value of the surface width difference D of the glass sheet 10 after chamfering is preferably 150 μm or less, more preferably 80 μm or less, still more preferably 50 μm or less.

再者,於減小玻璃板10之面寬差D之絕對值之倒角加工後進行端面11、12之研磨加工。研磨加工係藉由將彈性砂輪以固定壓力抵壓於倒角加工後之端面11、12而降低端面11、12之表面粗糙度之步驟。於研磨加工時維持藉由倒角加工所形成之端面11、12之圓形形狀。彈性砂輪利用聚胺基甲酸酯等彈性構件成形。 Further, after the chamfering process for reducing the absolute value of the surface difference D of the glass sheet 10 is performed, the end faces 11 and 12 are polished. The polishing process is a step of reducing the surface roughness of the end faces 11, 12 by pressing the elastic grinding wheel against the chamfered end faces 11, 12 with a fixed pressure. The circular shape of the end faces 11, 12 formed by chamfering is maintained during the grinding process. The elastic grinding wheel is formed by an elastic member such as polyurethane.

又,於FPD之製造步驟中,玻璃板10之面寬差D之絕對值越大,則玻璃板10之主表面之檢測精度越低。其原因在於:於玻璃板10之面寬差D不為零之情形時,玻璃板10之一主表面之區域與另一主表面之區域互不相同,因此,沿著與玻璃板10之主表面垂直之方向觀察玻璃板10之情形時,具有不同區域之主表面存在2個。若玻璃板10之主表面之檢測精度降低,則FPD之製造步驟中之生產率有可能降低。因此,本變化例之端面加工裝置100減小玻璃板10之面寬差D之絕對 值,較佳為使其為零,從而可抑制FPD之製造步驟中之玻璃板10之主表面之檢測精度降低。 Further, in the manufacturing step of the FPD, the greater the absolute value of the surface width difference D of the glass sheet 10, the lower the detection accuracy of the main surface of the glass sheet 10. The reason is that when the width difference D of the glass sheet 10 is not zero, the area of one main surface of the glass sheet 10 is different from the area of the other main surface, and therefore, along the main body of the glass sheet 10. When the glass plate 10 is viewed in the direction perpendicular to the surface, there are two main surfaces having different regions. If the detection accuracy of the main surface of the glass sheet 10 is lowered, the productivity in the manufacturing process of the FPD may be lowered. Therefore, the end surface processing apparatus 100 of the present modification reduces the absolute width D of the glass sheet 10 The value is preferably made zero, so that the detection accuracy of the main surface of the glass sheet 10 in the manufacturing step of the FPD can be suppressed from being lowered.

(6-2)變化例B (6-2) Change B

於實施形態中,端面測定裝置110之測定控制部係對倒角加工後之玻璃板10之端面11上所設定之複數個測定點之Y軸方向之座標進行測定。又,於變化例A中,測定控制部係根據面寬差之測定結果計算倒角加工後之玻璃板10之端面11上所設定之複數個測定點之Z軸方向之座標。 In the embodiment, the measurement control unit of the end surface measuring device 110 measures the coordinates of the Y-axis direction of the plurality of measurement points set on the end surface 11 of the glass sheet 10 after chamfering. Further, in the modification A, the measurement control unit calculates the coordinates in the Z-axis direction of the plurality of measurement points set on the end surface 11 of the glass sheet 10 after the chamfering processing based on the measurement result of the surface width difference.

但是,測定控制部亦可對倒角加工後之玻璃板10之端面11上所設定之複數個測定點之Y軸方向之座標進行測定,並且計算Z軸方向之座標,而測定端面11之形狀。於該情形時,端面加工裝置100之加工控制部可根據端面11之形狀之測定資料計算加工線及調整線,一面沿著調整線調整倒角磨石40之Y軸方向及Z軸方向之座標,一面對端面11進行倒角加工。於本變化例中,端面加工裝置100可進一步提高玻璃板10之端面11之加工精度。 However, the measurement control unit may measure the coordinates of the Y-axis direction of the plurality of measurement points set on the end surface 11 of the glass plate 10 after chamfering, and calculate the coordinates in the Z-axis direction, and determine the shape of the end surface 11. . In this case, the machining control unit of the end surface processing apparatus 100 can calculate the machining line and the adjustment line based on the measurement data of the shape of the end surface 11, and adjust the coordinates of the Y-axis direction and the Z-axis direction of the chamfer grindstone 40 along the adjustment line. A chamfering process is performed on the end face 11. In the present modification, the end surface processing apparatus 100 can further improve the processing accuracy of the end surface 11 of the glass sheet 10.

(6-3)變化例C (6-3) Change C

於實施形態中,端面加工裝置100之加工控制部係於步驟S16中,根據倒角加工前之端面11之形狀、及步驟S15中所計算之加工線之形狀,計算調整線。又,將玻璃板10固定於吸附平台30之前,調整玻璃板10之位置及方向,從而倒角加工前之端面11之形狀始終平行於X軸。因此,於實施形態中,加工控制部可不測定倒角加工前之端面11之形狀,而僅根據步驟S15中所計算之加工線之形狀計算調整線。 In the embodiment, the machining control unit of the end surface processing apparatus 100 calculates the adjustment line based on the shape of the end surface 11 before chamfering and the shape of the processing line calculated in step S15 in step S16. Further, before the glass plate 10 is fixed to the adsorption stage 30, the position and direction of the glass plate 10 are adjusted so that the shape of the end face 11 before the chamfering process is always parallel to the X-axis. Therefore, in the embodiment, the machining control unit may calculate the adjustment line based only on the shape of the machining line calculated in step S15 without measuring the shape of the end surface 11 before the chamfering.

但是,加工控制部亦可於於步驟S16中計算調整線之前進一步測定倒角加工前之端面11之形狀。於該情形時,加工控制部可於步驟S16中根據倒角加工前之端面11之形狀、及步驟S15中所計算之加工線之形狀而計算調整線。因此,於本變化例中,於未對倒角加工前之玻 璃板10之位置及方向進行調整之情形時及於切斷步驟S3中未精度良好地將倒角加工前之玻璃板10切斷之情形時等,加工控制部亦可恰當地計算調整線。 However, the machining control unit may further measure the shape of the end surface 11 before the chamfering process before calculating the adjustment line in step S16. In this case, the machining control unit may calculate the adjustment line based on the shape of the end face 11 before the chamfering process and the shape of the machining line calculated in step S15 in step S16. Therefore, in this variation, the glass before the chamfering is processed When the position and the direction of the glass sheet 10 are adjusted and the glass sheet 10 before the chamfering is cut off in the cutting step S3 without precision, the processing control unit can appropriately calculate the adjustment line.

(6-4)變化例D (6-4) Variation D

於實施形態中,端面加工裝置100包括用於對玻璃板10之端面11、12進行磨削之倒角磨石40、42。該等倒角磨石40、42為金剛石砂輪,但亦可係樹脂結合劑砂輪。樹脂結合劑砂輪係例如利用具有柔軟性及彈性之樹脂系結合劑使通常所使用之研磨粒凝固而成之磨削砂輪。研磨粒之粒度例如為由JIS R6001-1987規定之#300~#500左右。於使用樹脂結合劑砂輪之情形時,端面加工裝置100亦可對玻璃板10之端面11、12均勻地磨削,並去除玻璃板10之水平裂紋及脆性破壞層。 In the embodiment, the end face processing apparatus 100 includes chamfering grindstones 40, 42 for grinding the end faces 11, 12 of the glass sheet 10. The chamfering grindstones 40, 42 are diamond grinding wheels, but may also be resin bonded grinding wheels. The resin bond grinding wheel is a grinding wheel in which a generally used abrasive grain is solidified by a resin-based bonding agent having flexibility and elasticity. The particle size of the abrasive grains is, for example, about #300 to #500 prescribed by JIS R6001-1987. In the case of using a resin bond grinding wheel, the end surface processing apparatus 100 can also uniformly grind the end faces 11, 12 of the glass sheet 10, and remove horizontal cracks and brittle fracture layers of the glass sheet 10.

又,端面加工裝置100亦可視需要於使用作為金剛石砂輪之倒角磨石40、42對玻璃板10之端面11、12進行倒角加工之後,使用作為樹脂結合劑砂輪之倒角磨石進一步對端面11、12進行磨削。 Further, the end surface processing apparatus 100 may further perform chamfering on the end faces 11 and 12 of the glass sheet 10 by using the chamfering grindstones 40 and 42 as diamond grinding wheels, and further use a chamfering grindstone as a resin bond grinding wheel. The end faces 11, 12 are ground.

(6-5)變化例E (6-5) Change E

於實施形態中,端面加工裝置100包括用於對玻璃板10之端面11、12進行磨削之一對倒角磨石40、42。該等倒角磨石40、42為金剛石砂輪。但是,端面加工裝置100亦可進而包括變化例D之作為樹脂結合劑砂輪之一對倒角磨石。於該情形時,玻璃板10之端面11、12係於藉由作為金剛石砂輪之倒角磨石40、42被實施倒角加工之後,藉由作為樹脂結合劑砂輪之倒角磨石被進一步實施倒角加工。 In the embodiment, the end face processing apparatus 100 includes a pair of chamfering grindstones 40, 42 for grinding the end faces 11, 12 of the glass sheet 10. The chamfering grindstones 40, 42 are diamond grinding wheels. However, the end face processing apparatus 100 may further include the chamfering grindstone as one of the resin bond grinding wheels of the modification D. In this case, the end faces 11, 12 of the glass sheet 10 are further subjected to chamfering by the chamfering grindstones 40, 42 as diamond grinding wheels, and further implemented by chamfering grindstone as a resin bond grinding wheel. Chamfer processing.

又,於本變化例中,玻璃板10之端面11、12亦可於藉由金剛石砂輪及樹脂結合劑砂輪被實施倒角加工之後,藉由一對研磨砂輪進一步被研磨。藉由利用研磨砂輪對端面11、12進行研磨,可降低端面11、12之表面粗糙度。再者,被研磨砂輪研磨後之端面11、12之算術平均 粗糙度Ra較佳為100nm以下,更佳為80nm。 Further, in the present modification, the end faces 11, 12 of the glass sheet 10 may be further subjected to chamfering by a diamond grinding wheel and a resin bond grinding wheel, and then further polished by a pair of grinding wheels. By grinding the end faces 11, 12 with a grinding wheel, the surface roughness of the end faces 11, 12 can be reduced. Furthermore, the arithmetic mean of the end faces 11, 12 after being ground by the grinding wheel The roughness Ra is preferably 100 nm or less, more preferably 80 nm.

於本變化例中,於利用一對金剛石砂輪、一對樹脂結合劑砂輪及一對研磨砂輪之各者進行之端面加工步驟中,與實施形態同樣地,進行如下控制:根據加工線計算調整線,並使砂輪沿著已計算出之調整線移動。藉此,可於各端面加工步驟中對玻璃板10之端面11、12均勻地進行磨削或研磨。其結果為,端面加工裝置100可進行使玻璃板10之端面11、12之算術平均粗糙度Ra遍及端面11、12之全長為100nm以下、較佳為80nm以下之端面加工。 In the present modification, in the end surface processing step performed by each of a pair of diamond grinding wheels, a pair of resin bond grinding wheels, and a pair of grinding wheels, as in the embodiment, the following control is performed: the adjustment line is calculated based on the processing line And move the grinding wheel along the calculated adjustment line. Thereby, the end faces 11 and 12 of the glass sheet 10 can be uniformly ground or polished in each end surface processing step. As a result, the end surface processing apparatus 100 can perform the end surface processing in which the arithmetic mean roughness Ra of the end faces 11 and 12 of the glass sheet 10 is 100 nm or less, preferably 80 nm or less over the entire length of the end faces 11 and 12.

(6-6)變化例F (6-6) Variation F

於實施形態中,端面加工裝置100藉由預先測定調整用玻璃板10之倒角加工後之端面11、12之形狀而計算加工線,並根據已計算出之加工線計算調整線,使倒角磨石40、42沿著已計算出之調整線移動,而可進行對端面11、12均勻地磨削之倒角加工。但是,端面加工裝置100於於端面11、12之倒角加工後進行之使用研磨砂輪之研磨加工時,亦可預先測定端面11、12之形狀而計算加工線,並根據已計算出之加工線計算調整線,使研磨砂輪沿著已計算出之調整線移動,由此進行對端面11、12均勻地研磨之加工。藉此,於研磨加工時,不改變研磨砂輪之按壓壓力,便可對端面11、12之整體均勻地進行研磨加工。 In the embodiment, the end surface processing apparatus 100 calculates the processing line by measuring the shape of the end faces 11 and 12 after the chamfering processing of the glass sheet 10 for adjustment, and calculates the adjustment line based on the calculated processing line to chamfer. The grindstones 40, 42 are moved along the calculated adjustment line, and the chamfering process for uniformly grinding the end faces 11, 12 can be performed. However, when the end surface processing apparatus 100 performs the grinding process using the grinding wheel after the chamfering of the end faces 11 and 12, the shape of the end faces 11 and 12 may be measured in advance, and the processing line may be calculated, and according to the calculated processing line. The adjustment line is calculated so that the grinding wheel moves along the calculated adjustment line, thereby performing the processing of uniformly grinding the end faces 11, 12. Thereby, the entire end faces 11 and 12 can be uniformly polished without changing the pressing pressure of the grinding wheel during the grinding process.

於本變化例中,即使為藉由對端面11、12均勻地進行研磨加工而例如一邊之尺寸超過2200mm之大型玻璃板10,亦可沿著端面11、12進行均勻之研磨加工。藉此,可使玻璃板10之端面11、12之表面粗糙度Ra降低,可減少自端面11、12產生之玻璃屑或顆粒之量。因此,本變化例可尤佳地用於製造高清‧高分辨率顯示器面板用之玻璃板。 In the present modification, even if the large-sized glass sheets 10 having a size of more than 2,200 mm are uniformly polished by the end faces 11 and 12, uniform polishing can be performed along the end faces 11 and 12. Thereby, the surface roughness Ra of the end faces 11 and 12 of the glass sheet 10 can be lowered, and the amount of glass swarf or particles generated from the end faces 11, 12 can be reduced. Therefore, this modification can be particularly preferably used for manufacturing a glass plate for a high-definition ‧ high-resolution display panel.

(6-7)變化例G (6-7) Change G

於實施形態中,端面加工裝置100係預先測定調整用玻璃板10之 倒角加工後之端面11、12之形狀而計算加工線,並根據已計算出之加工線計算調整線。端面加工裝置100可重複使用一次計算出之調整線而對多塊玻璃板10進行加工。 In the embodiment, the end surface processing apparatus 100 measures the glass sheet for adjustment 10 in advance. The machining line is calculated by chamfering the shape of the end faces 11, 12, and the adjustment line is calculated based on the calculated machining line. The end surface processing apparatus 100 can process the plurality of glass sheets 10 by repeating the calculated adjustment line once.

但是,亦可於搬送利用端面加工裝置100對端面進行加工後之玻璃板時測定玻璃板之形狀,並將測定資料反饋給端面加工裝置100,從而端面加工裝置100預先測定倒角加工後之端面11、12之形狀而計算加工線。藉此,端面加工裝置100亦可應對因端面加工裝置100之機械精度或加工精度以外之因素導致之端面11、12之起伏、及因對玻璃板10重複進行加工而產生之端面加工裝置100之機械精度或加工精度之經時變化。 However, the shape of the glass plate may be measured when the glass sheet processed by the end surface processing apparatus 100 is processed, and the measurement data may be fed back to the end surface processing apparatus 100, so that the end surface processing apparatus 100 measures the end surface after chamfering processing in advance. Calculate the processing line by the shape of 11,12. Thereby, the end surface processing apparatus 100 can also cope with the undulation of the end faces 11 and 12 due to factors other than the mechanical precision or the machining accuracy of the end surface processing apparatus 100, and the end surface processing apparatus 100 which is produced by repeating the processing of the glass sheet 10. Time-dependent changes in mechanical precision or machining accuracy.

S11~S17‧‧‧步驟 S11~S17‧‧‧Steps

Claims (5)

一種玻璃板製造方法,其包括:端面加工步驟,其使倒角磨石接觸於被固定之玻璃板之端面,並使上述倒角磨石相對於上述玻璃板相對移動,由此對上述端面進行倒角加工;端面測定步驟,其對於上述端面加工步驟中被實施倒角加工後之上述端面之形狀進行測定;加工線計算步驟,其根據於上述端面測定步驟中所測定出之上述端面之形狀,計算上述端面加工步驟中之上述倒角磨石相對於上述玻璃板之軌跡即加工線;及調整線計算步驟,其根據於上述加工線計算步驟中計算之上述加工線,計算用於對上述端面均勻地進行倒角加工之調整線;且上述端面加工步驟係於已於上述調整線計算步驟中計算出上述調整線之情形時,以上述倒角磨石相對於上述玻璃板之軌跡沿著上述調整線之方式對上述端面進行倒角加工。 A glass sheet manufacturing method comprising: an end surface processing step of contacting a chamfered grindstone to an end surface of a fixed glass sheet, and moving the chamfer grindstone relative to the glass sheet, thereby performing the end surface a chamfering process; an end surface measuring step of measuring a shape of the end surface after chamfering in the end surface processing step; and a processing line calculating step according to the shape of the end surface measured in the end surface measuring step Calculating a trajectory of the chamfering grindstone relative to the glass plate in the end face processing step, that is, a processing line; and an adjusting line calculating step, which is calculated according to the processing line calculated in the processing line calculating step The end surface uniformly performs the adjustment line of the chamfering processing; and the end surface processing step is performed when the adjustment line is calculated in the adjustment line calculation step, along the trajectory of the chamfering grindstone relative to the glass sheet The above-mentioned end face is chamfered by the manner of the above adjustment line. 如請求項1之玻璃板製造方法,其中上述端面測定步驟係沿著上述端面於上述端面設定複數個測定點,並於各上述測定點測定形狀參數,由此測定上述端面之形狀,上述加工線計算步驟係根據各上述測定點之上述形狀參數而計算上述加工線,且上述調整線計算步驟係計算具有與各上述測定點對應之調整點之上述調整線。 The method for producing a glass sheet according to claim 1, wherein the end surface measuring step is performed by setting a plurality of measurement points on the end surface along the end surface, and measuring a shape parameter at each of the measurement points, thereby measuring a shape of the end surface, the processing line The calculation step calculates the processing line based on the shape parameter of each of the measurement points, and the adjustment line calculation step calculates the adjustment line having an adjustment point corresponding to each of the measurement points. 如請求項2之玻璃板製造方法,其中 上述倒角磨石可沿著自上述倒角磨石朝向上述端面之第1軸而移動,上述端面測定步驟係於各上述測定點測定上述第1軸之座標作為上述形狀參數,且上述調整線計算步驟係計算各上述測定點之上述形狀參數之值越大則對應之上述調整點之上述第1軸之座標越小之上述調整線。 A method of manufacturing a glass sheet according to claim 2, wherein The chamfering grindstone is movable along a first axis from the chamfering grindstone toward the end surface, and the end surface measuring step measures the coordinates of the first axis as the shape parameter at each of the measurement points, and the adjustment line The calculating step calculates the adjustment line in which the coordinate of the first axis corresponding to the adjustment point is smaller as the value of the shape parameter of each of the measurement points is larger. 如請求項2或3之玻璃板製造方法,其中上述倒角磨石可沿著自上述玻璃板之第1主表面朝向上述第1主表面之背側之第2主表面且與上述第1主表面正交之第2軸而移動,上述端面測定步驟係於各上述測定點,測定自第1倒角寬度減去第2倒角寬度所得之值即面寬差作為上述形狀參數,上述調整線計算步驟係計算各上述測定點之上述形狀參數之值越大則對應之上述修正點之上述第2軸之座標越小之上述調整線,上述第1倒角寬度係於上述端面加工步驟中自上述第1主表面去除之區域之寬度,且上述第2倒角寬度係於上述端面加工步驟中自上述第2主表面去除之區域之寬度。 The glass sheet manufacturing method according to claim 2 or 3, wherein the chamfering grindstone is along a second main surface from a first main surface of the glass sheet toward a back side of the first main surface and the first main surface The surface is moved by the second axis orthogonal to the surface, and the end surface measuring step is performed at each of the measurement points, and a surface width difference obtained by subtracting the second chamfering width from the first chamfering width is measured as the shape parameter, and the adjustment line is The calculation step is to calculate the adjustment line corresponding to the coordinate of the second axis corresponding to the correction point as the value of the shape parameter of each of the measurement points is larger, and the first chamfer width is in the end surface processing step. The width of the region where the first main surface is removed, and the second chamfer width is a width of a region removed from the second main surface in the end surface processing step. 一種玻璃板製造裝置,其包括:平台,其用於固定玻璃板;倒角磨石,其用於對上述玻璃板之端面進行倒角加工;加工控制部,其使上述倒角磨石接觸於固定於上述平台之上述玻璃板之上述端面,並使上述倒角磨石相對於上述玻璃板相對移動,由此對上述端面進行倒角加工;及 測定控制部,其測定上述端面之形狀;上述加工控制部係根據由上述測定控制部所測定出之上述端面之形狀,計算倒角加工時之上述倒角磨石相對於上述玻璃板之軌跡即加工線,根據已計算出之上述加工線而計算調整線,於已計算出上述調整線之情形時,以上述倒角磨石相對於上述玻璃板之軌跡沿著上述調整線之方式對上述端面進行倒角加工。 A glass plate manufacturing apparatus comprising: a platform for fixing a glass plate; a chamfering grindstone for chamfering an end surface of the glass plate; and a processing control portion for contacting the chamfered grindstone Fixing the end surface of the glass plate fixed to the platform, and moving the chamfering grindstone relative to the glass plate, thereby chamfering the end surface; and a measurement control unit that measures a shape of the end surface; and the processing control unit calculates a trajectory of the chamfering grindstone relative to the glass sheet during chamfering according to a shape of the end surface measured by the measurement control unit a processing line, wherein the adjustment line is calculated according to the calculated processing line, and when the adjustment line is calculated, the end surface of the chamfering grindstone relative to the glass sheet is along the adjustment line Perform chamfering.
TW104118006A 2014-06-03 2015-06-03 Glass plate manufacturing method and glass plate manufacturing device TWI648232B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014115299 2014-06-03
JP2014-115299 2014-06-03
JP2015052348A JP6484468B2 (en) 2014-06-03 2015-03-16 Glass plate manufacturing method and glass plate manufacturing apparatus
JP2015-052348 2015-03-16

Publications (2)

Publication Number Publication Date
TW201604153A true TW201604153A (en) 2016-02-01
TWI648232B TWI648232B (en) 2019-01-21

Family

ID=55227908

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104118006A TWI648232B (en) 2014-06-03 2015-06-03 Glass plate manufacturing method and glass plate manufacturing device

Country Status (3)

Country Link
JP (1) JP6484468B2 (en)
KR (1) KR101831487B1 (en)
TW (1) TWI648232B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6913295B2 (en) * 2016-12-27 2021-08-04 日本電気硝子株式会社 Glass plate and manufacturing method of glass plate
CN107971869A (en) * 2017-11-20 2018-05-01 常州索高机械有限公司 Bilateral R angles edging device
CN111186704A (en) * 2019-11-25 2020-05-22 中国建材国际工程集团有限公司 Deep processing glass production line
JP2022044159A (en) * 2020-09-07 2022-03-17 株式会社ディスコ Processing method for primitive wafer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950011673B1 (en) * 1991-04-24 1995-10-07 박경 Chamfering width main taining and glass plate shape sensing apparatus for use in a glass plate chamfering machine
JPH0569318A (en) * 1991-09-09 1993-03-23 Asahi Glass Co Ltd Method and device for chamfering plate material
JPH1128641A (en) * 1997-07-08 1999-02-02 Asahi Glass Co Ltd Plate machining device
JP3628538B2 (en) * 1999-01-12 2005-03-16 シャープ株式会社 Substrate chamfering device
JP2003311612A (en) * 2002-02-19 2003-11-05 Nippon Sheet Glass Co Ltd Grinding method and grinding device of peripheral edge of plate-like body
JP5051613B2 (en) * 2007-03-02 2012-10-17 旭硝子株式会社 Glass plate end grinding machine
JP5301818B2 (en) * 2007-11-26 2013-09-25 中村留精密工業株式会社 Method for registering correction value in side processing apparatus for glass substrate
AR071478A1 (en) * 2008-04-17 2010-06-23 Baxter Healthcare Sa PEPTIDES OF LOW MOLECULAR WEIGHT WITH PROCOAGULANT ACTIVITY FOR THE TREATMENT OF PATIENTS WITH FACTOR DEFICIENCY V (FV), FVII, FVIII, FX AND / OR FXI
KR101389377B1 (en) * 2012-09-05 2014-04-25 삼성코닝정밀소재 주식회사 Apparatus and method for grinding glass substrate
JP6050086B2 (en) * 2012-10-30 2016-12-21 AvanStrate株式会社 Manufacturing method of glass substrate

Also Published As

Publication number Publication date
JP2016010850A (en) 2016-01-21
TWI648232B (en) 2019-01-21
KR101831487B1 (en) 2018-04-04
JP6484468B2 (en) 2019-03-13
KR20150139431A (en) 2015-12-11

Similar Documents

Publication Publication Date Title
TWI586489B (en) Method for manufacturing glass substrates
TWI648232B (en) Glass plate manufacturing method and glass plate manufacturing device
TWI564948B (en) Hard and brittle materials for grinding, grinding processing systems and grinding, grinding methods
JP5454180B2 (en) Manufacturing method of glass substrate for magnetic recording medium and glass substrate for magnetic recording medium
JP5440786B2 (en) Glass substrate and manufacturing method thereof
TW201130605A (en) Method and apparatus for polishing plate-like material
TWI488822B (en) A manufacturing method of a glass plate, a method for manufacturing a glass substrate for a display, and a glass plate
KR100895830B1 (en) Method for cutting the edge of the flat display glass substrate
TWI735719B (en) Glass plate and manufacturing method of glass plate
JP6099960B2 (en) Wafer chamfering method and wafer chamfering apparatus
TWI679181B (en) Methods for strengthening edges of laminated glass articles and laminated glass articles formed therefrom
CN105290912B (en) Glass plate manufacturing method and device for producing glass sheet
TWI535533B (en) Method of measuring flatness of chamfering table
JP6978724B2 (en) How to manufacture flat glass
TW202126427A (en) Glass plate manufacturing method and glass plate
JP2013077770A (en) Manufacturing method of bonded wafer
TWI613041B (en) Method for manufacturing glass substrate
JP5473715B2 (en) Adjustment method of wafer transfer mechanism
KR20160046357A (en) Method of chamfering of glass
TWI663132B (en) Method of chamfering glass
JP2009283545A (en) Method of manufacturing semiconductor apparatus
WO2019187873A1 (en) Sheet glass production method
JP6264885B2 (en) Glass substrate and method for manufacturing glass substrate
KR100895780B1 (en) Flat display glass substrate