KR20150139431A - Method for manufacturing glass plate and apparatus for manufacturing glass plate - Google Patents

Method for manufacturing glass plate and apparatus for manufacturing glass plate Download PDF

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Publication number
KR20150139431A
KR20150139431A KR1020150067277A KR20150067277A KR20150139431A KR 20150139431 A KR20150139431 A KR 20150139431A KR 1020150067277 A KR1020150067277 A KR 1020150067277A KR 20150067277 A KR20150067277 A KR 20150067277A KR 20150139431 A KR20150139431 A KR 20150139431A
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South Korea
Prior art keywords
face
glass plate
machining
line
chamfered
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KR1020150067277A
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Korean (ko)
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KR101831487B1 (en
Inventor
다께히로 미쯔이시
겐지 코바야시
무쯔끼 스즈끼
다쯔야 요쯔모또
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아반스트레이트 가부시키가이샤
아반스트레이트코리아 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The purpose of the present invention is to provide a method and a device to manufacture a glass panel, capable of improving a processing precision of an end surface of a glass panel. The method to manufacture the glass panel comprises: an end surface processing process; an end surface measuring process; a processing line calculating process; and a processing line correcting process. The end surface processing process trims an end surface by relatively moving a trimming stone against the glass panel. The end surface measuring process measures a shape of a trimmed end surface. The processing line calculating process calculates a processing line, which is a trace of the trimming stone for the glass panel on the end surface processing process, based on the shape of the end surface. An adjustment line calculating process calculates an adjustment line based on the calculated processing line; and the end surface processing process trims the end surface such that the trace of the trimming stone for the glass panel follows the adjustment line when the adjustment line is calculated.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a glass plate,

The present invention relates to a glass plate manufacturing method and a glass plate manufacturing apparatus.

A glass plate used for manufacturing a flat panel display (FPD) such as a liquid crystal display and a plasma display is manufactured by, for example, an overflow down-draw method. In the overflow down-draw method, the molten glass that flows into the formed body and overflowed flows down (flows down) on the surface of the formed body and merges in the vicinity of the lower end of the formed body, and the glass plate is continuously formed. The formed glass plate is cooled down while being pulled downward, and is cut into a predetermined size. The cut glass plate is packed and shipped through an end face machining process, a surface cleaning process, and an inspection process.

In the step of cutting a molded glass plate to a predetermined size, a cutting method using a cutter or a laser is generally used. In the method of cutting a glass plate by a cutter, a glass plate is cut mechanically into a glass plate. As a result, a crack having a depth of about several mu m to about 100 mu m is formed on the end face of the cut glass plate. This crack causes deterioration of the mechanical strength of the glass plate. In the method of cutting a glass plate by a laser, a glass plate is cut by putting a sheath on the glass plate using thermal stress. As a result, the end face of the cut glass plate becomes sharp and fragile. In the end face of the cut glass plate, the layer in which cracks and sharp portions are formed is called a horizontal crack and a brittle fracture layer and needs to be removed by grinding and polishing the end face. That is, an end face machining step of a glass plate is performed in order to increase the mechanical strength of the glass plate, suppress the occurrence of defects in the glass plate, and facilitate handling in the subsequent process.

Japanese Patent Application Laid-Open No. 11-164648

As an example of an end face machining process of a glass plate, a method of chamfering an end face by moving a chamfer grinding wheel along an end face of a cut glass plate is disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 11-16464) Lt; / RTI > In this method, the position of the end face of the glass plate fixed to the table is measured by a laser displacement meter, and the machining start position and machining end position of the end face by the chamfer grindstone are calculated. Specifically, the coordinates of the machining start position and the machining end position of the end face are calculated by extrapolation interpolation from the measured values by the laser displacement gauge. The machining start position and the machining end position of the end face are corrected based on the difference between the calculated coordinates and the reference coordinates and the desired grinding value.

However, generally, the straightness of the end face of the glass plate is lowered by the end face machining process. That is, on the chamfered end face of the glass plate, minute irregularities are formed along the direction in which the end face extends. The minute unevenness is the curvature of the end surface. The lowering of the straightness of the end face is mainly due to the mechanical precision of the device for moving the chamfer grinding stone along the end face. Further, in order to remove the horizontal cracks and the brittle fracture layer from the end face of the glass plate in the end face machining step, a machining accuracy of +/- 10 mu m along the direction orthogonal to the end face is required. Therefore, it is important to improve the machining accuracy of the end face of the glass plate and to improve the straightness of the chamfered end face.

Further, in order to improve the bending strength of the glass plate, it is necessary to reduce the difference in the surface width of the glass plate on which the end faces are chamfered. The face width difference is the difference between the width of the area removed from one main surface by chamfering and the width of the area removed from the other main surface. However, due to the precision of the surface of the table on which the glass plate is fixed and the mechanical precision of the apparatus for moving the chamfered stone along the end face, it is difficult to reduce the difference in the face width in the end face machining process. Therefore, it is important to improve the processing accuracy of the end face of the glass plate and to reduce the difference in the face width of the glass plate in which the end face is chamfered.

It is an object of the present invention to provide a glass plate manufacturing method and a glass plate manufacturing apparatus which can improve processing accuracy of an end face of a glass plate.

A glass plate manufacturing method according to the present invention includes an end face machining step, an end face measurement step, a machining line calculating step, and a machining line correcting step. In the end surface machining step, the chamfered grindstone is brought into contact with the end face of the fixed glass plate, and the chamfered grindstone is relatively moved with respect to the glass plate, thereby chamfering the end face. The end face measurement process measures the shape of the chamfered end face in the end face machining process. The machining line calculating step calculates the machining line that is the locus of the chamfered grinding wheel relative to the glass plate in the end face machining step based on the shape of the end face measured in the end face measuring process. The adjustment line calculating step calculates an adjustment line based on the machining line calculated in the machining line calculating step. The adjustment line is used to uniformly chamfer the end face. In the end face machining step, when the adjustment line is calculated in the adjustment line calculation step, the end face is chamfered so that the locus of the chamfered grindstone with respect to the glass plate follows the adjustment line.

In this glass plate manufacturing method, initially, the end face of the glass plate for adjustment is chamfered by the chamfered chamfer. Then, the shape of the chamfered end face of the glass plate for adjustment is measured, and the processed line is calculated. The machining line shows the locus of the chamfered grindstone with respect to the glass plate at the time of chamfering the glass plate for adjustment. Then, an adjustment line is calculated based on the calculated machining line. The adjustment line shows the locus of the chamfer grindstone with respect to the glass plate so as to make the grinding amount on the end face of the glass plate uniform. Then, chamfering of the end face of the glass plate, which is different from the adjustment glass plate, is performed. At this time, by chamfering the glass plate with respect to the glass plate so as to follow the calculated adjustment line, chamfering for uniformly grinding the end face of the glass plate is performed. Therefore, this glass plate manufacturing method can improve the processing accuracy of the end face of the glass plate.

It is preferable that the end face measurement step measures the shape of the end face by setting a plurality of measurement points along the end face on the end face and measuring the shape parameter at each measurement point. In this case, the machining line correction step calculates the machining line based on the shape parameters at the respective measurement points. The adjustment line calculating step calculates adjustment lines having adjustment points corresponding to the respective measurement points.

It is also preferable that the chamfer grinding wheel is movable along a first axis from the chamfer to the end face. In this case, the end face measurement step measures the coordinates of the first axis as shape parameters at each measurement point. The adjustment line calculating step calculates an adjustment line having a smaller coordinate of the first axis of the corresponding adjustment point as the value of the shape parameter of each measurement point is larger.

It is also preferable that the chamfer grinding wheel is movable along a second axis from the first main surface of the glass plate toward the second main surface on the back side of the first main surface and perpendicular to the first main surface. In this case, in the end face measuring step, a face width difference which is a value obtained by subtracting the second chamfer width from the first chamfer width is measured as a shape parameter at each measurement point. The adjustment line calculating step calculates an adjustment line having a smaller coordinate of the second axis of the corresponding correction point as the shape parameter of each measurement point is larger. The first chamfer width is the width of the region removed from the first main surface in the end face machining step. The second chamfer width is the width of the region removed from the second main surface in the end face machining step.

A glass plate manufacturing apparatus according to the present invention comprises a table for fixing a glass plate, a chamfer grinding wheel for chamfering an end face of the glass plate, a machining control section, and a measurement control section. The machining control section chamfers the end face by bringing the chamfer grindstone into contact with the end face of the glass plate fixed to the table and relatively moving the chamfer stone relative to the glass plate. The measurement control section measures the shape of the end face. The machining control section calculates a machining line which is a locus of the chamfered grindstone with respect to the glass plate at the time of chamfering, based on the shape of the end face measured by the measurement control section. The machining control section calculates an adjustment line based on the calculated machining line. The machining control section chamfers the end face so that the trajectory of the chamfered grindstone with respect to the glass plate follows the adjustment line when the adjustment line is calculated.

The glass plate manufacturing method and the glass plate manufacturing apparatus according to the present invention can improve the processing accuracy of the end face of the glass plate.

1 is a flow chart of a glass plate manufacturing process.
2 is a plan view of the end face machining apparatus;
3 is a side view of the end face machining apparatus.
4 is a diagram showing a state in which a glass plate transporting apparatus mounts a glass plate on a suction table;
5 is a plan view of an end face measuring apparatus.
6 is a view showing measurement points set on an end face;
7 is a view showing a measurement point set on an end face;
8 is a flowchart of a process in which an end face is chamfered.
9 is a graph showing measurement results of measurement points on the end face and the calculated adjustment lines.
10 is a graph showing measurement results of measurement points on the end faces chamfered along the adjustment lines;
11 is a view for explaining a difference in surface width of an end face of a glass plate;
12 is a view for explaining the difference in surface width of the end face of the glass plate;
13 is a measurement result of the first chamfer width, the second chamfer width, and the surface width difference on the end face.
14 is a measurement result of the first chamfer width, the second chamfer width, and the surface width difference on the end face chamfered along the adjustment line.

A method of manufacturing a glass plate as an embodiment of the present invention will be described with reference to the drawings. The glass plate manufacturing method in this embodiment uses an end face machining apparatus 100 for machining the end face of the glass plate and an end face measuring apparatus 110 for measuring the shape of the end face of the glass plate .

(1) Outline of manufacturing process of glass plate

The manufacturing process of the glass plate 10 processed by the end face machining apparatus 100 used in the present embodiment will be described. The glass plate 10 is used for manufacturing a flat panel display (FPD) such as a liquid crystal display, a plasma display, and an organic EL display. The glass plate 10 has a thickness of, for example, 0.2 mm to 0.8 mm, and has a size of 680 mm to 2200 mm in length and 880 mm to 2500 mm in width.

As an example of the glass plate 10, a glass having the following composition (a) to (j) can be given.

(a) 50% by mass to 70% by mass of SiO 2 ,

(b) 10 to 25% by mass of Al 2 O 3 ,

(c) B 2 O 3 : 1 mass% to 18 mass%

(d) 0 mass% to 10 mass% of MgO,

(e) CaO: 0 mass% to 20 mass%

(f) 0 mass% to 20 mass% of SrO,

(g) 0 mass% to 10 mass% of BaO,

(h) RO: 5 mass% to 20 mass% (R is at least one selected from Mg, Ca, Sr and Ba)

(i) R ' 2 O: 0 mass% to 2.0 mass% (R' is at least one selected from Li, Na and K)

(j) at least one metal oxide selected from SnO 2 , Fe 2 O 3 and CeO 2 .

In addition, in the glass having the above composition, in the range of less than 0.1% by mass, the presence of other trace components is allowed.

Fig. 1 is an example of a flowchart showing a manufacturing process of the glass plate 10. Fig. The manufacturing process of the glass plate 10 mainly includes a forming step (step S1), a chalking step (step S2), a cutting step (step S3), a roughening step (step S4) (Step S5), a shape measuring step (step S6), a cleaning step (step S7), an inspection step (step S8), and a packing step (step S9).

In the molding step S1, the glass sheet is continuously formed from the molten glass obtained by heating the glass raw material by the down-draw method or the float method. The molded glass sheet is cooled to a temperature below the frosting temperature of the glass while being controlled so as not to cause deformation and warping.

In the panning step S2, the glass sheet formed in the forming step S1 is cut, and a glass plate having a predetermined dimension is obtained.

In the cutting step S3, the platelet-like glass obtained in the plate making step S2 is cut to obtain the glass plate 10 of the product size. The plastic glass is cut with high precision using a laser.

In the roughening step S4, roughening treatment for increasing the surface roughness of the glass plate 10 obtained in the cutting step S3 is performed. The roughening treatment of the glass plate 10 is, for example, wet etching using an etchant containing hydrogen fluoride.

In the end face machining step S5, chamfering is performed on the end face of the glass plate 10 subjected to the roughening treatment in the roughening step S4. A part of the chamfered end face has an R shape. The end face machining step S5 is performed by the end face machining device 100. [

In the shape measuring step S6, the shape of the end face chamfered in the end face machining step S5 is measured. The data concerning the shape of the measured end face is used in the end face machining step S5. The shape measuring step S6 is performed by the end surface measuring apparatus 110. [ The shape measuring step S6 may be performed on at least the first glass plate 10 of each production lot.

In the cleaning step S7, the glass plate 10 on which the end face machining is performed in the end face machining step S5 is cleaned. The glass plate 10 is adhered with a foreign substance such as a minute glass piece generated by the cutting of the glass plate and the end face machining of the glass plate 10 or an organic matter existing in the atmosphere. By the cleaning of the glass plate 10, these foreign substances are removed.

In the inspection step S8, the glass plate 10 cleaned in the cleaning step S7 is inspected. Specifically, the shape of the glass plate 10 is measured, and the defects of the glass plate 10 are optically detected. The defects of the glass plate 10 are caused by, for example, scratches and cracks present on the surface of the glass plate 10, foreign substances adhering to the surface of the glass plate 10, And air bubbles.

In the bagging step S9, the glass plate 10 passed the inspection in the inspection step S8 is stacked on pallets alternately with the paper for protecting the glass plate 10, and then packed. The packed glass plate 10 is shipped to manufacturers of FPDs and the like.

(2) Construction of end face machining device

2 is a plan view of the end face machining apparatus 100. Fig. 3 is a side view of the end face machining apparatus 100 viewed from the direction of arrow III shown in Fig. The end face machining apparatus 100 chamfers the end face of the fixed glass plate 10 in the end face machining step S5.

The end face machining apparatus 100 mainly includes a glass plate transporting apparatus 20, a suction table 30, a pair of chamfer grinding wheels 40 and 42, a pair of grinding wheel moving mechanisms 70 and 72, A grinding liquid supply device 80, a water supply device 90, and a machining control part (not shown).

The glass plate 10, in which the end face is chamfered by the end face machining apparatus 100, has a rectangular shape. The glass plate 10 has end faces 11 and 12 parallel to the long side and end faces 13 and 14 parallel to the short side.

As shown in Fig. 2, on the plane parallel to the surface of the glass plate 10, a two-dimensional orthogonal coordinate system including the X-axis and the Y-axis is set. As shown in Fig. 3, a Z-axis orthogonal to the plane including the X-axis and the Y-axis and upward in the vertical direction is set. The direction of the X axis is a direction from the end face 13 to the end face 14 as shown in Fig. The direction of the X axis is a direction in which the chamfered grinding wheels 40 and 42 move in contact with the end faces 11 and 12 in the end face machining step S5. The direction of the Y axis is the direction from the end face 11 to the end face 12 as shown in Fig.

Next, a step of chamfering the end faces 11, 12 parallel to the long sides of the glass plate 10 by the end face machining apparatus 100 will be described. However, the following description is also applicable to the step of chamfering the end faces 13, 14 parallel to the shorter sides of the glass plate 10 by the end face machining apparatus 100. [

(2-1) Glass plate conveying device

The glass plate transport apparatus 20 is a robot that transports the glass plate 10. [ The glass plate conveyance apparatus 20 conveys the glass plate 10 to place the glass plate 10 on the absorption table 30 or the glass plate 10 placed on the absorption table 30, And the glass plate 10 is transported.

4 is a view showing a state in which the glass plate transport apparatus 20 is placing the glass plate 10 on the suction table 30. Fig. The glass plate conveyance device 20 has a comb type robot hand 22 having a plurality of combs. The robot hand 22 can hold the lower surface of the glass plate 10 by suction. The glass plate transporting apparatus 20 can change the position of the robot hand 22 holding the glass plate 10 or rotate it in a plane parallel to the horizontal plane. The glass plate conveying apparatus 20 can insert the comb of the robot hand 22 between the support pins 32 of the suction table 30 as shown in Fig.

(2-2) Adsorption table

The suction table 30 has a plurality of support pins 32, as shown in Fig. The support pins 32 are provided on the upper surface of the suction table 30 at predetermined intervals along the X axis direction and the Y axis direction. On the upper surface of the suction table 30, a plurality of suction holes (not shown) for suctioning the lower surface of the glass plate 10 placed on the suction table 30 are formed. The suction table 30 fixes the placed glass plate 10 by the attraction force by suction of the suction holes. The upper surface of the suction table 30 has a rectangular shape. The longer sides of the upper surface of the suction table 30 are parallel to the X axis and the shorter sides of the upper surface of the suction table 30 are parallel to the Y axis.

A process of placing the glass plate 10 on the suction table 30 by the glass plate conveying apparatus 20 conveying the glass plate 10 will be described. First, the robot hand 22 holding the glass plate 10 is lowered so that the comb teeth of the robot hand 22 are positioned between the support pins 32. The robot hand 22 descends to a height position where the support pin 32 is in contact with the lower surface of the glass plate 10. Then, the suction of the glass plate 10 by the robot hand 22 is released. As a result, the glass plate 10 is held by the support pins 32 only. Subsequently, the robot hand 22 is moved horizontally, and the robot hand 22 is pulled out from between the support pins 32. Then, as shown in Fig. Then, the support pin 32 is lowered, and the glass plate 10 is placed on the suction table 30. Subsequently, the glass plate 10 is fixed on the suction table 30 by suction of the suction holes.

A process of taking out the glass plate 10 placed on the suction table 30 by the glass plate transportation device 20 will be described. At first, the suction of the suction hole is released, and the support pin 32 is raised so that the glass plate 10 is supported only by the support pin 32. [ Then, the robot hand 22 is moved in the horizontal direction and inserted between the support pins 32 of the suction table 30. Subsequently, the suction of the glass plate 10 by the robot hand 22 is started, and the robot hand 22 is lifted to lift the glass plate 10. Then, Then, the glass plate 10 is carried by the robot hand 22 in a subsequent process.

(2-3) Chamfer grinding wheel

The pair of chamfer grinding wheels 40 and 42 are grinding wheels for chamfering the end faces 11 and 12 of the glass plate 10, respectively. The chamfered grinding wheels 40 and 42 are provided in the grinding stone moving mechanisms 70 and 72, respectively.

The chamfer grinding wheels 40 and 42 are movable along the X axis direction, the Y axis direction, and the Z axis direction. The X-axis direction, Y-axis direction, and Z-axis direction positions of the chamfers 40 and 42 are adjusted by the grinding machine moving mechanisms 70 and 72, respectively.

The chamfer grinding wheels 40 and 42 are diamond wheels. The diamond wheel is, for example, a grinding wheel hardened with a metal-based bonding agent including diamond, copper, and the like. Diamond abrasive is, for example, a diamond abrasive having a grain size of 300 to 600. On the side surfaces of the chamfers 40 and 42, machining grooves are formed in the circumferential direction as shown in Fig. The chamfer grinding wheels 40 and 42 rotate about the rotation axis parallel to the Z axis. The end faces of the glass plate 10 are brought into contact with the inner faces of the machining grooves of the rotating chamfered wheels 40 and 42 so that the end faces 11 and 12 are chamfered. As a result, the end faces 11 and 12 to be chamfered in the cutting step S3 are shaped so as to have a round shape.

(2-4)

The pair of grindstone moving mechanisms 70 and 72 are movable units along the X-axis direction, the Y-axis direction and the Z-axis direction. The grinding wheel moving mechanism (70) is a unit provided with a chamfering stone (40). The grindstone moving mechanism 70 can adjust the relative positions of the chamfer grindstone 40 with respect to the glass plate 10 in the X axis direction, the Y axis direction, and the Z axis direction. The grindstone moving mechanism 72 is a unit provided with a chamfer grindstone 42. [ The grindstone moving mechanism 72 can adjust the relative positions of the chamfer grindstone 42 with respect to the glass plate 10 in the X axis direction, the Y axis direction, and the Z axis direction.

(2-5) Grinding fluid supply device

2, the grinding liquid supply device 80 is provided on the side of the glass plate 10 and in the vicinity of the chamfered grinding wheels 40 and 42 and is provided on the end faces 11 and 12 of the glass plate 10 The grinding liquid is sprayed toward the nozzle. The grinding liquid is, for example, water, water to which a surfactant is added, and water to which other drugs are added. Further, the liquid which may remain in the glass plate 10 after the cleaning step S6 and the liquid which may accelerate deterioration of the end face machining apparatus 100 are not used as the grinding liquid. Although not shown in FIGS. 2 and 3, a cover for preventing the grinding liquid from adhering to the surface of the glass plate 10 may be provided above the glass plate 10. Although not shown in Figs. 2 and 3, a grindstone cover covering the chamfered grinding wheels 40, 42 may be provided. By providing the grinding wheel cover, the grinding liquid can be recovered.

The surface tension of the grinding liquid to which the surfactant is added in water tends to enter the grinding point which is the contact portion between the end faces 11 and 12 of the glass plate 10 and the chamfered grinding wheels 40 and 42 because the surface tension is small. Therefore, the grinding liquid has the effect of removing foreign particles such as fine particles of glass generated by grinding of the glass plate 10 and removing it. Further, the grinding liquid has the effect of cooling the grinding point which is likely to become high temperature by friction.

(2-6) Water supply device

The water supply device 90 is a device that is installed above the glass plate 10 and emits water toward the end faces 11 and 12 of the glass plate 10 as shown in Fig. The end faces 11 and 12 of the glass plate 10 are processed by the chamfered grinding wheels 40 and 42 so that the claws of the glass are scattered from the end faces 11 and 12. The water supply device 90 ejects water from the inside of the surface of the glass plate 10 toward the end faces 11 and 12 to form a water film. Thereby, the water supply device 90 can reduce the amount of the cullet scattering toward the inside of the surface of the glass plate 10. Therefore, the water supply device 90 can suppress the amount of cullet adhering to the surface of the glass plate 10.

(2-7)

The machining control unit is a computer that controls the operation of the end face machining apparatus 100. [ The machining control unit includes a glass plate conveying device 20, a suction table 30, a pair of chamfer grinding wheels 40 and 42, a pair of grinding wheel moving mechanisms 70 and 72, a grinding fluid supplying device 80, And controls the supply device 90.

The processing control unit controls the position and posture of the robot hand 22 of the glass plate transporting device 20. [ The machining control section starts and ends the attraction of the glass plate 10 placed on the suction table 30. [ The machining control unit controls the rotation speed of the chamfers 40, 42. The machining control section controls the positions of the grindstone moving mechanisms 70 and 72 in the X axis direction, the Y axis direction and the Z axis direction. The machining control section controls the amount of grinding liquid sprayed onto the glass plate 10 by the grinding liquid supply device 80. The processing control unit controls the amount of water sprayed onto the glass plate 10 by the water supply device 90.

Further, the machining control unit is connected to the end face measuring apparatus 110. The machining control section can receive data from the end face measuring apparatus 110 and transmit the data to the end face measuring apparatus 110. [ For example, the machining control section can receive data concerning the shape of the end faces 11 and 12 of the glass plate 10 measured by the end face measuring apparatus 110. [

(3) Configuration of end surface measuring device

The end face measuring apparatus 110 measures the shape of the end faces 11 to 14 of the glass plate 10, which has been chamfered by the end face machining apparatus 100. Hereinafter, a process of measuring the shape of the end faces 11 and 12 parallel to the long side of the glass plate 10 by the end face measuring apparatus 110 will be described. However, the following description is also applicable to the process of measuring the shape of the end faces 13 and 14 parallel to the short sides of the glass plate 10 by the end face measuring apparatus 110. [

FIG. 5 is a plan view of the end face measuring apparatus 110. FIG. The end face measuring apparatus 110 mainly includes a placement table 120, a pair of position sensors 130 and 132, a pair of sensor movement mechanisms 140 and 142, and a measurement control unit (not shown) Respectively.

(3-1) Wit table

The placement table 120 is a table on which a glass plate 10 having an end face chamfered by the end face machining apparatus 100 is placed. The glass plate 10 having the chamfered end face is picked up by the glass plate conveying apparatus 20 and is conveyed to the end face measuring apparatus 110 and placed on the placement table 120.

(3-2) Position sensor

The pair of position sensors 130 and 132 are contact-type sensors that measure the shape of the end faces 11 and 12 of the glass plate 10 placed on the placement table 120, respectively. The position sensors 130 and 132 respectively acquire the positions of the contact points with the end faces 11 and 12 in contact with the end faces 11 and 12 as coordinates in the X axis direction, Y axis direction, and Z axis direction And has tip portions 130a and 132a that can be engaged with each other.

(3-3) Sensor movement mechanism

The pair of sensor moving mechanisms 140 and 142 are movable units along the X-axis direction, the Y-axis direction, and the Z-axis direction. The sensor moving mechanism 140 is a unit in which the position sensor 130 is installed. The sensor moving mechanism 140 can adjust the relative positions of the position sensor 130 with respect to the glass plate 10 in the X axis direction, the Y axis direction, and the Z axis direction. The sensor moving mechanism 142 is a unit in which the position sensor 132 is installed. The sensor moving mechanism 142 can adjust the relative positions of the position sensor 132 with respect to the glass plate 10 in the X axis direction, the Y axis direction, and the Z axis direction.

(3-4)

The measurement control unit is a computer that controls the operation of the end surface measuring apparatus 110. [ The measurement control section controls the pair of position sensors 130 and 132 and the pair of sensor movement mechanisms 140 and 142. [ The measurement control unit can control the position of the position sensors 130 and 132. [ The measurement control section can control the positions of the sensor moving mechanisms 140 and 142. [

The data representing the shapes of the end faces 11 and 12 of the glass plate 10 are constituted by the coordinates in the X axis direction and the Y axis direction of a plurality of measurement points previously set on the end faces 11 and 12. [ 6 shows six measurement points P11 to P16 set on the end face 11 and six measurement points P21 to P26 set on the end face 12 in the case of viewing along the Z axis direction. 7 is a cross-sectional view of the glass plate 10 cut in the plane including the Y-axis and the Z-axis viewed from the direction of the arrow VII shown in Fig. As shown in Fig. 7, the measurement points P16 and P26 are located at heights of the centers of the end faces 11 and 12 in the Z-axis direction. The other measurement points P11 to P15 and P21 to P25 are also at the height position of the centers of the end faces 11 and 12 in the Z-axis direction. The positions of the measurement points P11 to P16 of the end face 11 in the X-axis direction are assumed to be the same as the positions of the measurement points P21 to P26 of the end face 12 in the X-axis direction, respectively. The data representing the shape of the end face 11 is composed of the coordinates of the measurement points P11 to P16 in the X-axis direction and the Y-axis direction. The data indicating the shape of the end face 12 is composed of the coordinates of the measurement points P21 to P26 in the X-axis direction and the Y-axis direction. The number of measurement points set on the end faces 11 and 12 may be appropriately set in accordance with the dimensions of the glass plate 10. [ The measurement points may be set at predetermined intervals. For example, the measurement points may be set at intervals of 1 mm to 50 mm, preferably at intervals of 1 mm to 10 mm. For example, when the dimensions of the end faces 11 and 12 of the glass plate 10 are 2500 mm, the measurement points may be set at regular intervals at intervals of 10 mm.

Next, the process of measuring the positions of the measurement points P11 to P16 of the end face 11 by the measurement control unit using the position sensor 130 will be described. The following description is also applicable to the process of measuring the position of the measurement points P21 to P26 of the end face 12 by the measurement control section using the position sensor 132. [

The measurement control section sequentially measures the positions of the measurement points P11 to P16 along the positive direction of the X axis. Initially, the measurement control section adjusts the coordinates of the position sensor 130 in the X-axis direction to the coordinates of the measurement point P11 in the X-axis direction. Then, the measurement control unit adjusts the Z-axis coordinate of the position sensor 130 to the height position of the center of the end face 11 in the Z-axis direction. The measurement control unit adjusts the coordinate of the position sensor 130 in the Y axis direction to a position where the tip end portion 130a of the position sensor 130 makes contact with the end face 11. Then, the measurement control unit measures the position of the contact point between the tip end portion 130a and the end face 11 in the Y-axis direction. The position of the measurement point P11 is constituted by the coordinates of the contact point in the X-axis direction and the Y-axis direction. Through the above process, the measurement control unit measures the position of the measurement point P11 using the position sensor 130. [

Then, the measurement control section adjusts the coordinates of the position sensor 130 in the X-axis direction to the coordinates of the measurement point P12 in the X-axis direction. By the above-described process, the measurement control unit measures the position of the measurement point P12 using the position sensor 130. [ Similarly, the measurement control section sequentially measures the positions of the measurement points P13 to P16 using the position sensor 130. [ Further, the measurement control section sequentially measures the positions of the measurement points P21 to P26 using the position sensor 132. [

In response to a request from the machining control section of the end face machining apparatus 100, the measurement control section sends data relating to the positions of the measurement points P11 to P16 and P21 to P26 measured by the position sensors 130 and 132 to the machining control section do. As will be described later, the machining control section controls the positions of the chamfered grinding wheels 40, 42 at the time of chamfering the end faces 11, 12 by using the received data.

(4) Process of chamfering

8 is a flowchart of a process in which the end faces 11 and 12 of the glass plate 10 are chamfered. Next, the step of chamfering the end face 11 by the end face machining apparatus 100 will be described with reference to Fig. The following description is also applicable to the step of chamfering the end face 12 by the end face machining apparatus 100.

In step S11, the machining control section of the end surface machining apparatus 100 controls the glass plate transporting device 20 to transport the surface-treated glass plate 10 in the roughing step S4, . Next, the processing control unit adjusts the position and direction of the glass plate 10 placed on the suction table 30 by a position adjusting mechanism (not shown). Then, the machining control section fixes the glass plate 10 to the suction table 30. Then, In the fixed glass plate 10, the end faces 11 and 12 parallel to the longer sides of the glass plate 10 are parallel to the X-axis and parallel to the short side of the glass plate 10 13 and 14 are parallel to the Y axis. Then, step S12 is executed.

In step S12, the machining control section determines whether or not an adjustment line described later is calculated in step S16. If it is determined that the adjustment line is not calculated, step S13 is executed. If it is determined that the adjustment line is calculated, step S17 is executed.

In step S13, the machining control section brings the chamfered stone 40 into contact with the end face 11, moves the chamfered stone 40 along the shape of the end face 11, and performs chamfering of the end face 11 I do. Since the direction of the glass plate 10 is adjusted so that the end face 11 is parallel to the X axis in step S11, the machining control unit moves the chamfered stone 40 along the X axis, Chamfering can be performed. Step S13 is a step of quantifying the shape of the end face 11 into a round shape by removing a predetermined amount of glass from the end face 11. Subsequently, step S14 is executed.

Further, in step S13, it is preferable that the machining control section moves the chamfered stone 40 accurately along the X-axis in order to uniformly grind the end face 11 by chamfering. However, due to the mechanical precision of the grinding wheel moving mechanism 70 for moving the chamfered stone 40, it is difficult to accurately move the chamfered stone 40 along the X axis at the time of chamfering the end face 11 . Therefore, at the time of chamfering the end face 11, the chamfered stone 40 slightly moves in the Y-axis direction. Therefore, in actuality, in step S13, the machining control section can not uniformly grind the end face 11. Therefore, in steps S14 to S16, preparations are made for finely adjusting the movement locus of the chamfered stone 40 at the time of chamfering the end face 11 so that the end face 11 is evenly ground.

In step S14, the machining control section controls the glass plate transport apparatus 20 to transport the glass plate 10 placed on the suction table 30 to the end surface measuring apparatus 110, Wit. Then, the measurement control section of the end surface measuring apparatus 110 measures the shape of the chamfered end face 11 of the glass plate 10. [ Specifically, the measurement control section measures the coordinates of the plurality of measurement points set on the end face 11 in the X-axis direction and the Y-axis direction. The measurement points are measurement points P11 to P16 shown in Figs. 6 and 7. Then, the measurement control unit transmits coordinates in the X-axis direction and the Y-axis direction of the measured measurement points P11 to P16 to the machining control unit of the end face machining apparatus 100. [ Then, step S15 is executed.

In step S15, the machining control section calculates the machining line based on the coordinates of the measurement points P11 to P16 received from the measurement control section in the X-axis direction and the Y-axis direction. 9 is an example of the measurement results of the measurement points P11 to P16 of the end face 11. 9, the horizontal axis indicates the coordinates of the measurement points P11 through P16 in the X axis direction, and the vertical axis indicates the coordinates of the measurement points P11 through P16 in the Y axis direction. The measurement points P11 to P16 are set substantially equally to the end face 11 of the glass plate 10 in the X-axis direction. In Fig. 9, measurement points adjacent in the X-axis direction are connected by solid lines. The machining line is a line segment connecting measurement points P11 to P16 in order. The machining line shows a rough shape of the chamfered end face 11. Subsequently, step S16 is executed.

In step S16, the machining control section calculates the adjustment line based on the shape of the end face 11 before chamfering and the shape of the machining line calculated in step S15. The adjustment line is used for chamfering the end face 11 along the shape of the end face 11 before chamfering. In Fig. 9, an example of the adjustment line is indicated by a dotted line. The adjustment lines are set to adjustment points P31 to P36 corresponding to the measurement points P11 to P16 of the machining line, respectively. The coordinates in the X-axis direction of the adjustment points P31 to P36 are the same as the coordinates in the X-axis direction of the measurement points P11 to P16.

The relationship between the machining line and the adjustment line will be described. In Fig. 9, the broken line shown by the solid line shows a rough shape of the chamfered end face 11. 9, the reference line indicated by the chain line represents an ideal shape of the chamfered end face 11. In the present embodiment, the end face 11 before chamfering is parallel to the X-axis. Ideally, since the end face 11 is chamfered uniformly in the X-axis direction, the reference line is parallel to the X-axis. The adjustment line is set as a line segment in which the machining line is inverted with respect to the reference line parallel to the X-axis so that the chamfered end face 11 is parallel to the X-axis. The coordinates of the reference line in the Y-axis direction may be appropriately set in accordance with the machining value of the end face 11. As the coordinate in the Y-axis direction of the measurement points P11 to P16 is larger, the machining value of the end face 11 is larger, so that the coordinates in the Y-axis direction of the adjustment points P31 to P36 are set smaller. Then, step S11 is executed.

The chamfer grinding wheel 40 is moved so as to follow the adjustment line calculated in step S16 while finely adjusting the position of the chamfered grinding wheel 40 in step S17 so that the end face 11 of the glass plate 10 ) Is chamfered. For example, while the chamfered stone 40 is moving from the adjustment point P31 to P32 along the X-axis direction, the coordinates of the chamfered stone 40 in the Y-axis direction move from the coordinates of the adjustment point P31 to the coordinates of P32 The position of the chamfered grinding wheel 40 is controlled. 9, since the coordinate in the Y-axis direction of the measurement point P11 is approximately -0.02 mm, in order to set the grinding amount at the measurement point P11 to an ideal value (the coordinate in the Y-axis direction is 0 mm) The chamfered grinding wheel 40 is moved so that the coordinate of the chamfered grinding wheel 40 in the Y axis direction becomes about +0.02 mm. Thus, the coordinate in the Y-axis direction of the measurement point P11 of the end face 11 after chamfering becomes about 0 mm. That is, the adjustment point P31 represents the ideal coordinates of the chamfered grinding wheel 40 in the Y-axis direction. Similarly, the coordinate in the Y-axis direction of the chamfered grinding wheel 40 is also controlled for the measurement points P12 to P16. As a result, the chamfered end face 11 becomes substantially parallel to the end face 11 before chamfering. Step S17 is a step of quantitatively shaping the shape of the end face 11 into a round shape by removing a predetermined amount of glass from the end face 11 as in step S13.

The above process is repeated until all the glass plates 10 of the production lot are chamfered. Steps S13 to S16 are performed only for the first glass plate 10 of the normally manufactured lot.

After the chamfering of the end faces 11 and 12 in steps S11 to S17, the end faces 11 and 12 are polished. The polishing process is a process for reducing the surface roughness of the end faces 11 and 12 by pressing the elastic wheel against the chamfered end faces 11 and 12 at a constant pressure. In the polishing process, the round shape of the end faces 11 and 12 formed by chamfering is maintained. The elastic wheel is formed of an elastic member such as polyurethane.

(5) Features

The end face machining apparatus 100 first chamfers the end faces 11 and 12 of the glass plate 10 for adjustment by the chamfers 40 and 42. [ The glass plate for adjustment 10 is a glass plate 10 to be chamfered for calculation of an adjustment line and is usually the first glass plate 10 of the production lot. The chamfer grinding wheels 40 and 42 are moved so as to move along the shape of the end faces 11 and 12 of the glass plate 10 for adjustment, And is controlled to move along the axis. However, it is difficult to accurately move the chamfered wheels 40, 42 along the X-axis due to the mechanical precision of the grinding machine moving mechanisms 70, 72 for moving the chamfered wheels 40, 42. Thereby, while the grindstone moving mechanisms 70 and 72 move the chamfer wheels 40 and 42 along the X axis, the chamfer wheels 40 and 42 may move a little in the Y axis direction. As a result, the machining line that is the locus of movement of the chamfered wheels 40 and 42 in the case of viewing along the Z-axis direction is not parallel to the X-axis. That is, the shapes of the chamfered end faces 11 and 12 do not completely coincide with the shapes of the end faces 11 and 12 before chamfering, and there is a difference between them. As a result, in the glass plate 10 for adjustment, the chamfered end faces 11 and 12 are not uniformly grinded along the direction in which the end faces 11 and 12 extend. That is, in the adjustment glass plate 10, the chamfered end faces 11 and 12 have minute portions in a large amount of grinding and small portions in an amount of grinding, so minute irregularities are formed in the Y-axis direction. The fine irregularities are the curvatures of the end faces 11 and 12. Therefore, the straightness of the end face 11 of the glass plate 10 for adjustment is lowered by chamfering.

In the present embodiment, the end face measuring apparatus 110 measures the shape of the chamfered end faces 11 and 12 of the glass plate 10 for adjustment. The end face machining apparatus 100 calculates a machining line based on the shape of the end faces 11 and 12 measured. The machining line shows a locus where the chamfer grinding wheels 40 and 42 actually moved during chamfering of the end faces 11 and 12 of the glass plate 10 for adjustment. The machining line shows the actual shape of the chamfered end faces 11 and 12. For example, in FIG. 9, the convex portion of the machining line shown by the solid line corresponds to the convex portion of the end face 11, and the concave portion of the machining line corresponds to the concave portion of the end face 11. The convex portion of the end face 11 is a portion where the amount of grinding by the chamfered grinding wheel 40 is smaller than the circumference. The concave portion of the end face 11 is a portion where the amount of grinding by the chamfered grinding wheel 40 is larger than the circumference. The amount of grinding of the chamfered grinding wheel 40 can be increased and the amount of grinding of the chamfered grinding wheel 40 can be reduced in the concave portion of the machining line, The grinding amount can be made uniform. In Fig. 9, the adjustment line indicated by the dotted line indicates the movement locus of the chamfered grinding wheel 40 for making the grinding amount of the end face 11 uniform.

10 is an example of the measurement results of the coordinates of the measurement points P11 to P16 of the chamfered end face 11 in the X axis direction and the Y axis direction while moving the chamfered stone 40 along the adjustment line. Figs. 9 and 10 are measurement results of the same end face 11 of the same glass plate 10. Fig. 9 and 10, the end face 11 is substantially uniformly grinded along the X-axis direction. 10, the coordinates of the measurement points P11 to P16 of the chamfered end face 11 in the Y-axis direction are -10 mu m to 10 mu m (- 0.01 mm to 0.01 mm). That is, chamfering of the end face 11 of the present embodiment can achieve machining accuracy of +/- 10 mu m.

As described above, in the end face machining apparatus 100, the shape of the chamfered end faces 11 and 12 of the glass plate 10 for adjustment is measured in advance to calculate the machining line, and the adjustment line is calculated based on the calculated machining line And chamfering processing for uniformly grinding the end faces 11 and 12 can be performed by moving the chamfered grinding wheels 40 and 42 along the calculated adjustment line.

In order to remove the horizontal cracks and the brittle fracture layer from the end faces 11 and 12 of the glass plate 10, it is preferable that the end faces 11 and 12 are orthogonal to each other during chamfering of the end faces 11 and 12, A processing accuracy of +/- 10 mu m along the Y-axis direction, more preferably, a processing accuracy of 5 mu m is required. It is therefore important to improve the machining accuracy of the end faces 11 and 12 of the glass plate 10 and to improve the straightness in the X axis direction of the end faces 11 and 12 of the chamfered glass plate 10 Do. In the present embodiment, the end face machining apparatus 100 can chamfer the end faces 11 and 12 uniformly, thereby improving the machining accuracy of the end faces 11 and 12 of the glass plate 10 .

In addition, the end face machining apparatus 100 can suppress the amount of grinding of the end faces 11 and 12 of the glass plate 10 to be uniform or low over the X-axis direction. Thus, the end face machining apparatus 100 can reduce the amount of grinding of the end faces 11 and 12, thereby reducing the amount of particles of the cullet and glass that are generated at the time of grinding the end faces 11 and 12 . Also, the amount of cut of the end faces 11 and 12 by the chamfered grinding wheels 40 and 42 can be suppressed to be low, and the size of the generated cullet and particles can also be reduced. As a result, the amount of cray and particle adhering to the surface of the glass plate 10 can be reduced.

Further, the glass plate 10 manufactured using the end face machining apparatus 100 can be suitably used for a glass substrate used for manufacturing a panel for high-precision display. The quality requirement of a glass substrate for a high-definition, high-resolution display, for example, an oxide semiconductor or a glass substrate on which a low-temperature polysilicon semiconductor device is formed, in which wiring patterns with narrow line widths or pitches are formed on the surface is higher than the conventional glass substrate. In a conventional method of manufacturing a glass substrate, this high quality requirement can not be sufficiently satisfied. However, in the manufacturing of the glass substrate for a high-precision and high-resolution display in which the line width and the pitch of the wiring electrodes formed on the glass substrate are small and even a small defect is not allowed, It is possible to suppress the occurrence of the problem that the particles adhere to the surface of the glass substrate.

In addition, by reducing the amount of cray and particle adhering to the surface of the glass substrate, it is possible to increase the yield of wiring of a Cu-based electrode having low adhesiveness to glass. In other words, by using the end face machining apparatus 100 of the present embodiment, an electrode material having a low adhesiveness to glass can be used even if the line width or pitch of the wiring electrode is small. For example, a Cu-based electrode such as a Ti-Cu alloy or a Mo-Cu alloy having a low resistance can be used although the adhesion to the glass is low as compared with an Al-based electrode or a Cr or Mo-based electrode. By widening the selection width of the electrode material as described above, it is possible to solve the problem of RC delay (wiring delay) in a manufacturing process of a large-sized display panel used in a television or the like. In addition, it is possible to solve the problem of RC delay in the manufacturing process of a small display panel for a portable terminal, which is expected to further increase in precision and resolution.

In the above description, countermeasures against the problem of a glass substrate used for a TFT panel or the like provided with a semiconductor element as a device have been described. However, the end face machining apparatus 100 of the present embodiment is not limited to the color filter CF, And the like can be provided. For example, in the case of a CF panel, in recent years, thinning of a black matrix (BM) has been proceeding. However, in the manufacturing process of a CF panel for a liquid crystal display in which the BM line width is thinned to 20 占 퐉 or less, for example, 5 占 퐉 to 10 占 퐉 by using the end face machining apparatus 100 of the present embodiment, It is possible to suppress the occurrence of the problem of BM exfoliation due to the foreign matter.

(6) Modification

Although the glass plate manufacturing method according to the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications and changes may be made without departing from the gist of the present invention.

(6-1) Variation Example A

8, the measurement control section of the end face measuring apparatus 110 is provided with a plurality of measurement points P11 to P12 set on the end faces 11 and 12 of the chamfered glass plate 10, P16, and P21 to P26 are measured in the X-axis direction and the Y-axis direction, and the shapes of the end faces 11 and 12 are measured. However, instead of measuring the coordinates in the Y-axis direction of the plurality of measurement points P11 to P16 and P21 to P26 set on the end faces 11 and 12 of the chamfered glass plate 10, The shape of the end faces 11 and 12 may be measured.

In this modification, for example, when the coordinate in the Z-axis direction of the end face 11 of the glass plate 10 fixed to the suction table 30 is not constant along the X-axis direction, 11 are uniformly grinded. The following description is also applicable to the chamfering of the end face 12.

The main surface of the glass plate 10 fixed to the suction table 30 may not be completely flat due to the mechanical precision of the suction table 30. [ Thus, when the end face 11 of the glass plate 10 is viewed along the Y-axis direction, the end face 11 is provided with projections and depressions in the Z-axis direction. That is, the coordinates of the end face 11 in the Z-axis direction are not constant along the X-axis direction.

If the end face 11 is chamfered by the chamfering stone 40, the surface width difference D of the chamfered end face 11 may not be constant along the X-axis direction. Figs. 11 and 12 are diagrams for explaining the surface width difference D of the end face 11. Fig. 11 is a side view of the chamfered glass plate 10 taken along the X-axis. 12 is a sectional view of the YZ plane of the glass plate 10 which is ground by the chamfered grinding wheel 40. As shown in Fig. In Fig. 12, the hatched area is a part of the glass plate 10, and is a part that is ground by the chamfered grinding wheel 40 and removed. The surface width difference D is a value obtained by subtracting the second chamfer width W2 from the first chamfer width W1. The first chamfer width W1 is the width of the region removed from the first main surface 10a on the lower side of the glass plate 10. [ The second chamfer width W2 is the width of the region removed from the second main surface 10b on the upper side of the glass plate 10. [ 12, the end face 11 of the glass plate 10 is chamfered by being brought into contact with the inner surface of the machining groove 40a of the rotating chamfer grinding wheel 40. As shown in Fig. As shown in Fig. 12, the first chamfer width W1 differs from the second chamfer width W2 depending on the position of the glass plate 10 in the Z-axis direction.

When the surface width difference D is zero, the first major surface 10a and the second major surface 10b of the glass plate 10 are evenly ground. When the surface width difference D is a positive value, the larger the surface width difference D, the more the first major surface 10a is ground than the second major surface 10b. When the surface width difference D is a negative value, the smaller the surface width difference D, the more the second main surface 10b is ground than the first main surface 10a. Therefore, from the viewpoint of uniformly grinding the first main surface 10a and the second major surface 10b, the absolute value of the surface width difference D is preferably as small as possible, more preferably zero. When the first chamfer width W1 and the second chamfer width W2 are different from each other, the entire end faces 11 and 12 are not uniformly polished in the process after the chamfered end faces 11 and 12 are polished, The strength of the plate 10 may be lowered. Therefore, in the step of chamfering the glass plate 10 by using the chamfered grinding wheel 40, the absolute value of the surface width difference D is made close to zero so that the entire end faces 11, 12 of the glass plate 10 are uniformly It is necessary to perform grinding processing.

When the coordinates of the chamfered grindstone 40 in the Z axis direction and the coordinates of the end face 11 of the glass plate 10 in the Z axis direction are appropriate, the surface width difference D of the chamfered end face 11 is zero . Specifically, when the center in the Z-axis direction of the machining groove of the chamfered grinding wheel 40 is at the same position as the center in the Z-axis direction of the end face 11, the difference in the surface width of the chamfered end face 11 D becomes zero. When the coordinate of the end face 11 in the Z-axis direction is too small with respect to the chamfered stone 40, the lower portion of the end face 11 is more chamfered than the upper portion. Therefore, the first chamfer width W1 is larger than the second chamfer width W2 And the surface width difference D becomes larger than zero. On the contrary, when the coordinate of the end face 11 in the Z-axis direction is too large with respect to the chamfered grinding wheel 40, the upper portion of the end face 11 is chamfered more than the lower portion, so that the first chamfer width W1 is larger than the second chamfer width W2 And the surface width difference D becomes smaller than zero.

The measurement control section of the end face measuring apparatus 110 measures the face width difference D of the end face 11 of the chamfered glass plate 10 at a plurality of measurement points, The coordinate in the Z-axis direction of the end face 11 at each measurement point can be calculated based on the measurement data of D. That is, the measurement control section can measure the shape of the end face 11 viewed along the Y-axis direction based on the face width difference D at a plurality of measurement points. 13 is an example of measurement results of the first chamfer width W1, the second chamfer width W2, and the surface width difference D of the chamfered end face 11. 13, the abscissa indicates the coordinates in the X-axis direction of the measurement points P11 to P16 which are the same as in the embodiment, and the ordinate indicates the absolute value of the first chamfer width W1, the second chamfer width W2, The first chamfer width W1 is represented by a solid line connected by rhombic points. The second chamfer width W2 is represented by a dotted line connected by a quadrangular point. The absolute value of the surface width difference D is indicated by a dashed line connected to the original point. The first chamfer width W1 and the second chamfer width W2 are represented by the value of the scale on the left vertical axis. The absolute value of the surface width difference D is represented by the value of the scale on the right vertical axis.

The measurement control section reduces the coordinate in the Z axis direction of the chamfered grinding wheel 40 at the measurement point where the surface width difference D is larger than zero and sets the Z coordinate of the chamfered grinding wheel 40 at the measurement point at which the surface width difference D is smaller than zero The coordinate in the Z-axis direction of the chamfered stone 40 can be appropriately adjusted in accordance with the shape of the end face 11 by increasing the coordinate in the axial direction. Specifically, in the same manner as in the embodiment, the machining line is calculated based on the measurement data of the surface width difference D at each of the measurement points P11 to P16, the adjustment line is calculated based on the calculated machining line, By moving the grinding wheels 40 and 42, it is possible to perform chamfering for uniformly grinding the end faces 11 and 12. Thereby, the measurement control section can reduce the absolute value of the surface width difference D of the chamfered end face 11.

14 is a graph showing the relationship between the first chamfer width W1, the second chamfer width W2, and the surface width difference D of the chamfered end face 11 while adjusting the position of the chamfered stone 40 along the calculated adjustment line in the Z- This is an example of a measurement result of an absolute value. Figs. 13 and 14 are measurement results of the same end face 11 of the same glass plate 10. Fig. In Figs. 13 and 14, the same legend is used. As can be seen by comparing Figs. 13 and 14, chamfering is performed while adjusting the position of the chamfered stone 40 along the adjustment line in the Z-axis direction, so that the difference of the surface width difference D of the chamfered end face 11 The absolute value is reduced. Therefore, the end face machining apparatus 100 can improve chamfering accuracy of the end face 11 of the glass plate 10 and can chamfer the end face 11 uniformly. Further, the smaller the absolute value of the surface width difference D of the glass plate 10 is, the larger the bending strength of the glass plate 10 is. As a result, the end face machining apparatus 100 can perform chamfering processing that suppresses a decrease in the bending strength of the glass plate 10. Further, the full value of the surface width difference D of the chamfered glass plate 10 is preferably 150 占 퐉 or less, more preferably 80 占 퐉 or less, and further preferably 50 占 퐉 or less.

Further, after the chamfering process for reducing the absolute value of the surface width difference D of the glass plate 10, the end faces 11 and 12 are polished. The polishing process is a process for reducing the surface roughness of the end faces 11 and 12 by pressing the elastic wheel against the chamfered end faces 11 and 12 at a constant pressure. In the polishing process, the round shape of the end faces 11 and 12 formed by chamfering is maintained. The elastic wheel is formed of an elastic member such as polyurethane.

In addition, in the manufacturing process of the FPD, the greater the absolute value of the surface width difference D of the glass plate 10, the lower the detection accuracy of the main surface of the glass plate 10 is. The reason is that when the surface width difference D of the glass plate 10 is not zero, the area of one main surface of the glass plate 10 differs from the area of the other main surface of the glass plate 10, In the case where the glass plate 10 is viewed along a direction perpendicular to the main surface of the glass substrate 10, there are two main surfaces having different regions. If the detection accuracy of the main surface of the glass plate 10 is lowered, the productivity in the FPD manufacturing process may be lowered. Therefore, in the end face machining apparatus 100 of the present modification, the absolute value of the surface width difference D of the glass plate 10 is reduced, preferably to zero, so that the distance between the glass plate 10 and the glass plate 10 in the manufacturing process of the FPD Deterioration of the detection accuracy of the main surface can be suppressed.

(6-2) Variation B

In the embodiment, the measurement control unit of the end face measuring apparatus 110 measures the coordinates in the Y-axis direction of a plurality of measurement points set on the end face 11 of the chamfered glass plate 10. In Modification A, the measurement control section calculates coordinates in the Z-axis direction of a plurality of measurement points set on the end face 11 of the chamfered glass plate 10 based on the measurement result of the face width difference .

However, the measurement control section measures the coordinates in the Y-axis direction of a plurality of measurement points set on the end face 11 of the chamfered glass plate 10, calculates the coordinates in the Z-axis direction, ) May be measured. In this case, the machining control section of the end face machining apparatus 100 calculates the machining line and the adjustment line from the measurement data of the shape of the end face 11, calculates the machining line and the adjustment line along the adjustment line in the Y- The end face 11 can be chamfered while adjusting the coordinates of the direction. In this modification, the end face machining apparatus 100 can improve the machining accuracy of the end face 11 of the glass plate 10.

(6-3) Variation example C

In the embodiment, the machining control unit of the end face machining apparatus 100 calculates the adjustment line on the basis of the shape of the end face 11 before chamfering and the shape of the machining line calculated in step S15 in step S16 . Before the glass plate 10 is fixed to the suction table 30, the position and orientation of the glass plate 10 are adjusted, and the shape of the end face 11 before chamfering is always parallel to the X axis . Therefore, in the embodiment, the machining control section can calculate the adjustment line based on only the shape of the machining line calculated in step S15 without measuring the shape of the end face 11 before chamfering.

However, the machining control section may further measure the shape of the end face 11 before chamfering, before calculating the adjustment line in step S16. In this case, the machining control section can calculate the adjustment line on the basis of the shape of the end face 11 before chamfering and the shape of the machining line calculated in step S15 in step S16. Therefore, in this modified example, when the position and orientation of the glass plate 10 before chamfering are not adjusted and when the glass plate 10 before chamfering is not cut with high accuracy in the cutting step S3 The processing control section can appropriately calculate the adjustment line.

(6-4) Variation example D

In the embodiment, the end face machining apparatus 100 is provided with chamfer grinding wheels 40 and 42 for grinding the end faces 11 and 12 of the glass plate 10. These chamfer grinding wheels 40 and 42 are diamond wheels, but may be resin-bonded wheels. The resin-bonded wheel is, for example, a grinding wheel hardened with a resin-based coupling agent having flexibility and elasticity, which are commonly used abrasives. The grain size of abrasive grains is, for example, about # 300 to # 500 specified in JIS R6001-1987. The end face machining apparatus 100 can uniformly grind the end faces 11 and 12 of the glass plate 10 to uniformly grind the horizontal cracks of the glass plate 10 and the brittle fracture layer Can be removed.

The end face machining apparatus 100 may further comprise chamfering chambers for chamfering the end faces 11 and 12 of the glass plate 10 by using chamfered grinding wheels 40 and 42 as diamond wheels, The end faces 11 and 12 may be ground further.

(6-5) Modification Example E

In the embodiment, the end face machining apparatus 100 has a pair of chamfer grinding wheels 40 and 42 for grinding the end faces 11 and 12 of the glass plate 10. These chamfer grinding wheels 40 and 42 are diamond wheels. However, the end face machining apparatus 100 may further include a pair of chamfer grinders, which are the resin coupling wheels of Modification D. In this case, the end faces 11 and 12 of the glass plate 10 are chamfered by the chamfered grinding wheels 40 and 42, which are diamond wheels, and further chamfered by the chamfered grinding wheel, which is a resin coupling wheel.

In this modification, the end faces 11 and 12 of the glass plate 10 may be chamfered by the diamond wheel and the resin coupling wheel, and then further polished by the pair of polishing wheels. By grinding the end faces 11 and 12 by the grinding wheel, the surface roughness of the end faces 11 and 12 can be reduced. In addition, the arithmetic average roughness Ra of the end faces 11 and 12 polished by the grinding wheel is preferably 100 nm or less, more preferably 80 nm.

In this modified example, in the step of machining the end face by each of the pair of diamond wheels, the pair of resin-bonded wheels and the pair of polishing wheels, the adjustment line is calculated on the basis of the machining line as in the embodiment, Control is performed to move the wheel along the adjusted line. Thereby, the end faces 11 and 12 of the glass plate 10 can be uniformly ground or polished in the respective end face machining steps. As a result, the end face machining apparatus 100 can prevent the arithmetic mean roughness Ra of the end faces 11 and 12 of the glass plate 10 from falling within a range of 100 nm or less Can be made to be 80 nm or less.

(6-6) Variation Example F

In the embodiment, the end face machining apparatus 100 measures the shape of the chamfered end faces 11 and 12 of the glass plate 10 for adjustment in advance, calculates the machining line, and calculates the machining line based on the calculated machining line, And chamfering processing for uniformly grinding the end faces 11 and 12 can be performed by moving the chamfered grinding wheels 40 and 42 along the calculated adjustment line. However, in the end face machining apparatus 100, the shape of the end faces 11 and 12 is measured in advance in the polishing process using the polishing wheel, which is performed after chamfering of the end faces 11 and 12, The end face 11, 12 may be uniformly polished by calculating an adjustment line based on the calculated machining line, and moving the polishing wheel along the calculated adjustment line. This makes it possible to uniformly polish the entire end faces 11 and 12 without changing the pressing pressure of the polishing wheel in the polishing process.

The end faces 11 and 12 are uniformly polished so that even if the glass plate 10 is large in size with one side exceeding 2200 mm, A polishing process can be performed. As a result, the surface roughness Ra of the end faces 11 and 12 of the glass plate 10 can be reduced, and the amount of cray and particles generated from the end faces 11 and 12 can be reduced. Therefore, this modified example can be particularly suitably used for manufacturing a glass plate for a high-precision, high-resolution display panel.

(6-7) Variation example G

In the embodiment, the end face machining apparatus 100 measures the shape of the chamfered end faces 11 and 12 of the glass plate 10 for adjustment in advance, calculates the machining line, and calculates the machining line based on the calculated machining line, . The end face machining apparatus 100 can process a plurality of glass plates 10 by repeatedly using the calculated adjustment lines once.

However, by measuring the shape of the glass plate at the time of transporting the glass plate processed by the end face machining apparatus 100 by the end face machining apparatus 100 and feeding the measurement data to the end face machining apparatus 100, The shape of the chamfered end faces 11 and 12 may be measured in advance to calculate the machined line. Thus, the end face machining apparatus 100 is formed by bending the end faces 11 and 12 and by repeatedly machining the glass plate 10 due to factors other than mechanical accuracy and machining accuracy of the end face machining apparatus 100 It is possible to cope with changes in the machine precision and machining accuracy of the end face machining apparatus 100 over time.

10: Glass plate
11: end face
12: end face
30: Adsorption table (table)
40: Chamfer grinding wheel
42: Chamfer grinding wheel

Claims (5)

An end face machining step of chamfering the end face by bringing the chamfer grinding stone into contact with the end face of the fixed glass plate and relatively moving the chamfer stone relative to the glass plate,
An end face measuring step of measuring a shape of the end face chamfered in the end face machining step;
A machining line calculating step of calculating a machining line that is the locus of the chamfered grinding wheel relative to the glass plate in the end face machining step based on the shape of the end face measured in the end face measuring step;
And an adjustment line calculating step of calculating an adjustment line used for uniformly chamfering the end face based on the machining line calculated in the machining line calculating step,
Wherein the end face machining step is a step of cutting the end face of the glass plate so that the trajectory of the chamfered grindstone with respect to the glass plate follows the adjustment line in the case where the adjustment line is calculated in the adjustment line calculating step, Plate manufacturing method. The method according to claim 1,
The end face measurement step may include measuring a shape of the end face by setting a plurality of measurement points on the end face along the end face and measuring shape parameters at each of the measurement points,
Wherein the machining line calculating step calculates the machining line based on the shape parameters at each of the measurement points,
Wherein the adjustment line calculating step calculates the adjustment line having an adjustment point corresponding to each of the measurement points. 3. The method of claim 2,
Wherein the chamfer grinding wheel is movable along a first axis from the chamfer stone toward the end face,
Wherein the step of measuring the end face measures the coordinates of the first axis as the shape parameter at each of the measurement points,
Wherein the adjustment line calculating step calculates the adjustment line having a smaller coordinate of the first axis of the corresponding adjustment point as the value of the shape parameter of each of the measurement points is larger. The method according to claim 2 or 3,
Wherein the chamfer grinding wheel is movable along a second axis from a first main surface of the glass plate toward a second main surface on a back side of the first main surface and orthogonal to the first main surface,
Wherein the step of measuring the end face measures a face width difference that is a value obtained by subtracting the second chamfer width from the first chamfer width at each of the measurement points as the shape parameter,
The adjustment line calculating step calculates the adjustment line having a smaller coordinate of the second axis of the corresponding correction point as the value of the shape parameter of each of the measurement points is larger,
The first chamfer width is a width of a region removed from the first main surface in the end face machining step,
Wherein the second chamfer width is a width of a region removed from the second main surface in the end face machining step. A table for fixing the glass plate,
A chamfer grinding wheel for chamfering the end face of the glass plate,
A machining control section for chamfering the end face by bringing the chamfer grinding stone into contact with the end face of the glass plate fixed to the table and relatively moving the chamfer stone relative to the glass plate;
And a measurement control unit for measuring the shape of the end face,
Wherein the machining control unit comprises:
Calculating a machining line that is a locus of the chamfered grindstone with respect to the glass plate at the time of chamfering based on the shape of the end face measured by the measurement control unit,
Based on the calculated machining line, an adjustment line is calculated,
Wherein the chamfering is performed so that the trajectory of the chamfered grindstone with respect to the glass plate follows the adjustment line when the adjustment line is calculated.
KR1020150067277A 2014-06-03 2015-05-14 Method for manufacturing glass plate and apparatus for manufacturing glass plate KR101831487B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111186704A (en) * 2019-11-25 2020-05-22 中国建材国际工程集团有限公司 Deep processing glass production line

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6913295B2 (en) * 2016-12-27 2021-08-04 日本電気硝子株式会社 Glass plate and manufacturing method of glass plate
CN107971869A (en) * 2017-11-20 2018-05-01 常州索高机械有限公司 Bilateral R angles edging device
JP2022044159A (en) * 2020-09-07 2022-03-17 株式会社ディスコ Processing method for primitive wafer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950011673B1 (en) * 1991-04-24 1995-10-07 박경 Chamfering width main taining and glass plate shape sensing apparatus for use in a glass plate chamfering machine
JPH0569318A (en) * 1991-09-09 1993-03-23 Asahi Glass Co Ltd Method and device for chamfering plate material
JPH1128641A (en) * 1997-07-08 1999-02-02 Asahi Glass Co Ltd Plate machining device
JP3628538B2 (en) * 1999-01-12 2005-03-16 シャープ株式会社 Substrate chamfering device
JP2003311612A (en) * 2002-02-19 2003-11-05 Nippon Sheet Glass Co Ltd Grinding method and grinding device of peripheral edge of plate-like body
JP5051613B2 (en) * 2007-03-02 2012-10-17 旭硝子株式会社 Glass plate end grinding machine
JP5301818B2 (en) * 2007-11-26 2013-09-25 中村留精密工業株式会社 Method for registering correction value in side processing apparatus for glass substrate
TWI541020B (en) * 2008-04-17 2016-07-11 巴克斯歐塔公司 Biologically active peptides
KR101389377B1 (en) * 2012-09-05 2014-04-25 삼성코닝정밀소재 주식회사 Apparatus and method for grinding glass substrate
JP6050086B2 (en) * 2012-10-30 2016-12-21 ＡｖａｎＳｔｒａｔｅ株式会社 Manufacturing method of glass substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111186704A (en) * 2019-11-25 2020-05-22 中国建材国际工程集团有限公司 Deep processing glass production line

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