TW201600617A - Copper alloy material and manufacturing method of the same, and lead frame and connector - Google Patents

Abstract

The present invention provides a copper alloy material having both high conductivity and high strength, manufacturing method of the same, lead frame and connector. The solution means of the present invention lies in that: the copper alloy material contains iron of above 0.2 mass% and below 0.6 mass%, nickel of above 0.02 mass% and below 0.06 mass%, phosphorus of above 0.07 mass% and below 0.3 mass%, and magnesium of above 0.01 mass% and below 0.2 mass%, with remainders containing Cu and inevitable impurity. The conductivity of the copper alloy material is above 75%IACS and its yielding strength at 0.2% is above 500MPa.

Description

Copper alloy material, copper alloy material manufacturing method, lead frame and connector

The present invention relates to a copper alloy material, a method of manufacturing a copper alloy material, a lead frame, and a connector.

Copper alloy materials are used for lead frames, terminals or connectors. Such copper alloy materials require high electrical conductivity and high strength. Among them, a Cu-Fe-Ni-P based copper alloy material has been developed as a copper alloy material having high conductivity and high strength (see, for example, Patent Documents 1 and 2).

Prior art literature Patent literature

Patent Document 1: Japanese Patent No. 2956696

Patent Document 2: Japanese Patent Laid-Open No. 2012-1781

In recent years, copper alloy materials having further high electrical conductivity and high strength compared to existing copper alloy materials have been sought.

An object of the present invention is to provide a copper alloy material having high conductivity and high strength, a method for producing a copper alloy material, a lead frame, and a connector.

According to an aspect of the present invention, a copper alloy material containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, and 0.07% by mass or more and 0.3% by mass or less or less is provided. Phosphorus and 0.01% by mass or more and 0.2% by mass or less of magnesium include the Cu and unavoidable impurities. The copper alloy material has a conductivity of 75% IACS or more and a 0.2% drop strength of 500 MPa or more.

According to another aspect of the present invention, a method of manufacturing a copper alloy material is provided, the method of manufacture comprising: a casting step of casting an ingot, a hot rolling step of hot rolling the ingot to form a hot rolled material, and a first cold rolling step of forming the first cold rolled material by cold rolling the hot rolled material to form a first ingot a heat treatment step of heat-treating the first cold-rolled material to form a heat-treated material, and a second cold-rolling step of cold-rolling the heat-treated material to form a second cold-rolled material; casting the ingot in the casting step, The ingot contains 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07% by mass or more and 0.3% by mass or less of phosphorus, and 0.01% by mass or more and 0.2% by mass or less of magnesium, and the rest. Cu is contained and unavoidable impurities; and in the first cold rolling step, the following operations are repeated a predetermined number of times: the cold rolling of the hot rolled material and the recrystallization occurring below the rolled material The temperature is annealed.

According to still another aspect of the present invention, a lead frame having a substrate, wherein the substrate contains 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, and 0.07 mass is provided. % or more of 0.3% by mass or less of phosphorus and 0.01% by mass or more and 0.2% by mass or less of magnesium, and the balance containing Cu and unavoidable impurities; the conductivity of the substrate is 75% IACS or more, and the 0.2% drop strength is 500 MPa or more. .

According to still another aspect of the present invention, a connector having a conductor portion containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, and 0.07 mass is provided. % or more of 0.3% by mass or less of phosphorus and 0.01% by mass or more and 0.2% by mass or less of magnesium, and the remainder contains Cu and unavoidable impurities; the conductivity of the conductor portion is 75% IACS or more, and the 0.2% drop strength is 500 MPa or more. .

According to the present invention, it is possible to provide a copper alloy material having high conductivity and high strength, a method for producing a copper alloy material, a lead frame, and a connector.

I. Insights gained by the inventors

First, the general situation of the insights obtained by the inventors and the like will be described.

The inventors of the present invention conducted intensive studies to further improve the conductivity and strength of the Cu-Fe-Ni-P-based copper alloy material, and as a result, found the following findings. Cu-Fe-Ni-P copper alloy When the content of iron (Fe) or nickel (Ni) is increased, a compound of Fe (hereinafter referred to as an Fe-P compound) or a compound of Ni and P (hereinafter referred to as a Ni-P compound) is dispersed. Precipitation, so that the strength of the copper alloy material is improved. On the other hand, if the content of Fe or Ni is increased, Fe-P compound or Ni-P compound is not formed and Fe or Ni which is dissolved in the copper alloy material is increased, so that the conductivity of the copper alloy material is lowered. possibility. Conversely, when the content of Fe or Ni is decreased, the conductivity of the copper alloy material is improved, and on the other hand, the strength of the copper alloy material may be lowered. The conductivity and strength of the Cu-Fe-Ni-P based copper alloy material have a trade-off relationship as described above. The present invention has been made based on the above findings discovered by the present inventors.

2. An embodiment of the present invention

Next, the configuration of a copper alloy material according to an embodiment of the present invention will be described.

(1) Composition of copper alloy materials

The copper alloy material according to the present embodiment contains a predetermined amount of Fe, Ni, P, and magnesium (Mg), and the remainder contains copper (Cu) and unavoidable impurities. Further, the copper alloy material according to the present embodiment has a conductivity of 75% IACS or more, and a 0.2% drop strength of the copper alloy material is 500 MPa or more.

The details will be described below.

The copper alloy material of the present embodiment further contains Mg in addition to a predetermined amount of Fe, Ni, and P to be described later. By solid-solving in the copper alloy material, Mg suppresses the decrease in the electrical conductivity of the copper alloy material and exhibits an effect of improving the strength of the copper alloy material. In the copper alloy material, by adding Mg while adding Fe, Ni, and P, it is possible to maintain high conductivity and increase the strength of the copper alloy material.

The content of Mg in the copper alloy material of the present embodiment is, for example, 0.01% by mass or more and 0.2% by mass or less. When the content of Mg is less than 0.01% by mass, Mg may be combined with oxygen (O) or sulfur (S) which are unavoidable impurities, and there is a possibility that a certain amount of Mg cannot be solid-solved in the copper alloy material. Here, MgO, MgS, etc. do not have the effect of improving the strength of a copper alloy material. Therefore, there is a possibility that the strength of the copper alloy material cannot be increased. In the present embodiment, when the content of Mg is 0.01% by mass or more, even if a part of Mg is combined with O and S which are unavoidable impurities, a certain amount of Mg can be solid-solved in the copper alloy material. Thereby, the strength of the copper alloy material can be improved. For example, the 0.2% drop strength of the copper alloy material can be 500 MPa or more. Enter Further, the content of Mg is preferably 0.03% by mass or more. Thereby, the strength of the copper alloy material can be further improved. On the other hand, although Mg is a component which has a small influence on the decrease in conductivity, when the content of Mg exceeds 0.2% by mass, Mg is largely dissolved in a copper alloy material, so that there is a copper alloy material which cannot be ignored due to Mg. The possibility of a decrease in conductivity. Therefore, there is a possibility that it is difficult to maintain high conductivity of the copper alloy material. In the present embodiment, when the content of Mg is 0.2% by mass or less, the influence of the decrease in the electrical conductivity of the copper alloy material due to Mg can be suppressed, and the high conductivity of the copper alloy material can be maintained. Further, the content of Mg is preferably 0.1% by mass or less. Thereby, it is possible to further suppress the influence of the decrease in the electrical conductivity of the copper alloy material due to Mg.

In the copper alloy material according to the present embodiment, by containing Fe, Ni, and P, not only the dispersion of the Fe-P compound but also the precipitation of the Ni-P compound occurs. The Fe-P compound formed in the copper alloy of the present embodiment is, for example, Fe ₂ P or the like, and the Ni-P compound is, for example, Ni ₅ P ₂ or Ni ₂ P. The strength of the copper alloy material is improved by dispersion of such a P compound.

In the present embodiment, the content of Ni which is greater than Fe by the effect of lowering the conductivity is, for example, less than the range described in Patent Document 1 (0.1% by mass or more and 0.5% by mass or less). Thereby, the influence of the decrease in the electrical conductivity of the copper alloy material due to Ni can be suppressed, and the conductivity of the copper alloy material can be improved (the copper alloy material is closer to pure copper as the content of Ni is reduced). On the other hand, since the precipitation amount of the Ni-P compound in the copper alloy material is small, the effect of improving the strength of the copper alloy material by the Ni-P compound is reduced. In the present embodiment, by adding a predetermined amount of Mg to the copper alloy material as described above, even when the content of Ni is less than the range described in Patent Document 1, the copper alloy material can be maintained high. Conductivity and increase the strength of the copper alloy material.

Specifically, the content of Ni in the copper alloy material of the present embodiment is, for example, 0.02% by mass or more and 0.06% by mass or less. When the content of Ni is less than 0.02% by mass, the amount of precipitation of the Ni-P compound in the copper alloy material becomes small. Therefore, there is a possibility that the desired strength of the copper alloy material cannot be obtained. In the present embodiment, the content of Ni is 0.02% by mass or more. Since the effect of improving the strength of the copper alloy material by the Ni-P compound is larger than that of the Fe-P compound, if the content of Ni is 0.02% by mass or more, a certain amount of the Ni-P compound can be formed in the copper alloy material to be expressed. The effect of improving the strength of the copper alloy material caused by the Ni-P compound. Further, the content of Ni is preferably 0.03% by mass or more. Thereby, the effect of improving the strength of the copper alloy material by the Ni-P compound can be more reliably exhibited.

On the other hand, due to Ni, the conductivity of the copper alloy material is lowered. Since the loudness is larger than Fe, when the content of Ni exceeds 0.06 mass%, there is a possibility that the influence of the decrease in the electrical conductivity of the copper alloy material caused by Ni cannot be ignored. Therefore, there is a possibility that the conductivity of the copper alloy material will be lower than a desired value (for example, 75% IACS). In the present embodiment, the content of Ni is 0.06% by mass or less, and the influence of the decrease in the electrical conductivity of the copper alloy material due to Ni can be suppressed, and the conductivity of the copper alloy material can be improved. For example, the conductivity of the copper alloy material can be 70% IACS or more. Further, the content of Ni is preferably 0.05% by mass or less. Thereby, the influence of the reduction of the electrical conductivity of the copper alloy material by Ni can be further suppressed.

Further, the content of Fe in the copper alloy material of the present embodiment is, for example, 0.2% by mass or more and 0.6% by mass or less. When the content of Fe is less than 0.2% by mass, the amount of precipitation of the Fe-P compound in the copper alloy material becomes small. Therefore, there is a possibility that the desired strength of the copper alloy material cannot be obtained. In the present embodiment, the Fe content is 0.2% by mass or more to form a certain amount of Fe-P compound in the copper alloy material. Therefore, the strength of the copper alloy material can be improved. Further, the content of Fe is preferably 0.3% by mass or more. Thereby, the strength of the copper alloy material can be further improved. On the other hand, when the content of Fe exceeds 0.6% by mass, Fe which is not dissolved in the copper alloy material is increased without generating an Fe-P compound, and there is a possibility that the conductivity of the copper alloy material is lowered. Therefore, there is a possibility that the desired conductivity of the copper alloy material cannot be obtained. In the present embodiment, by the content of Fe being 0.6% by mass or less, it is possible to suppress solid solution of Fe in the copper alloy material. As a result, it is possible to suppress a decrease in conductivity of the copper alloy material. Further, the content of Fe is preferably 0.5% by mass or less. Thereby, the fall of the electroconductivity of a copper alloy material can be suppressed further.

Further, the content of P in the copper alloy material of the present embodiment is, for example, 0.07% by mass or more and 0.3% by mass or less. When the content of P is less than 0.07 mass%, the precipitation amount of the Fe-P compound and the Ni-P compound becomes small. Therefore, there is a possibility that the desired strength of the copper alloy material cannot be obtained. In the present embodiment, a certain amount of the Fe-P compound and the Ni-P compound are formed in the copper alloy material by the content of P being 0.07% by mass or more. Therefore, the strength of the copper alloy material can be improved. Further, the content of P is preferably 0.1% by mass or more. Thereby, the strength of the copper alloy material can be further improved. On the other hand, when the content of P exceeds 0.3% by mass, it is not advantageous for the formation of the Fe-P compound or the Ni-P compound, and since the P which is solid-solved in the copper alloy material increases, there is a possibility that the conductivity of the copper alloy material is lowered. Sex. Therefore, there is a possibility that the desired conductivity of the copper alloy material cannot be obtained. In addition, when the content of P exceeds 0.3% by mass, in the casting step, the hot rolling step, and the like which will be described later, segregation of a compound of P such as an Fe-P compound or a Ni-P compound may occur, and there is a possibility that the copper alloy material may be broken. Sex. Therefore, there is a possibility that the workability of the copper alloy material is lowered. In the present embodiment, by the content of P being 0.3% by mass or less, it is possible to suppress solid solution of P in the copper alloy material. As a result, it is possible to suppress a decrease in conductivity of the copper alloy material. Further, it is possible to suppress a decrease in workability of the copper alloy material. Further, the content of P is more preferably 0.2% by mass or less. Thereby, the decrease in the electrical conductivity of the copper alloy material can be further suppressed, and the decrease in workability can be further suppressed.

Further, the mass ratio (Fe/Ni) of Fe to Ni is, for example, 5 or more and 10 or less. When the mass ratio Fe/Ni is less than 5, the content of Ni is relatively increased, and there is a possibility that the influence of Ni on the decrease in conductivity of the copper alloy material cannot be ignored. Therefore, there is a possibility that the high conductivity of the copper alloy material cannot be maintained. In the present embodiment, the mass ratio Fe/Ni is 5 or more, and the influence of the decrease in the electrical conductivity of the copper alloy material due to Ni can be suppressed. Further, the mass ratio Fe/Ni is preferably 7 or more. Thereby, the influence of the reduction of the electrical conductivity of the copper alloy material by Ni can be further suppressed. On the other hand, when the mass ratio Fe/Ni exceeds 10, the content of Ni is relatively decreased, and therefore there is a possibility that the amount of precipitation of the Ni-P compound in the copper alloy material is small. The effect of improving the strength by the Ni-P compound is larger than the effect of improving the strength by the Fe-P compound. Therefore, since the amount of precipitation of the Ni-P compound is small, the strength of the copper alloy material may not be sufficiently increased. On the other hand, in the present embodiment, by forming a certain amount of the Ni-P compound in the copper alloy material by mass ratio Fe/Ni of 10 or less, the strength of the copper alloy material can be improved.

Further, the copper alloy material of the present embodiment may contain zinc (Zn). As described later, for example, when the copper alloy material of the present embodiment is applied to a base material of a lead frame or the like, by solid-solving Zn in a copper alloy material, the weldability of the copper alloy material can be improved, and suppression can be suppressed. The copper alloy material is peeled off from the solder layer. Such reliability for soldering is one of important characteristics for lead frames and the like.

When the copper alloy material contains Zn, the content of Zn in the copper alloy material is, for example, 0.001% by mass or more and 0.005% by mass or less. When the content of Zn is less than 0.001% by mass, Zn may be combined with O and S which are unavoidable impurities, and there is a possibility that a certain amount of Zn cannot be solid-solved in the copper alloy material. Here, ZnO, ZnS, or the like does not have an effect of improving weldability. Therefore, there is a possibility that the effect of improving weldability cannot be exhibited. In the present embodiment, when the content of Zn is 0.001% by mass or more, even if a part of Zn is combined with O and S which are unavoidable impurities, a certain amount of Zn can be solid-solved in the copper alloy material. Thereby, the effect of improving weldability can be exhibited. Here, according to intensive studies by the inventors, etc., it was confirmed that if the content of Zn is 0.001 When the mass is more than %, a certain effect of improving the weldability can be obtained. On the other hand, in the prior art, the case where the content of Zn exceeds 0.005 mass% is very common. However, when the content of Zn exceeds 0.005 mass%, Zn is largely dissolved in the copper alloy material, so that there is a possibility that the influence of Zn on the decrease in conductivity of the copper alloy material cannot be ignored. In the present embodiment, the content of Zn is 0.005% by mass or less, and the weldability can be improved without lowering the conductivity of the copper alloy material.

(2) Lead frame or connector using copper alloy material

The above copper alloy material can be used, for example, in the following products.

I. lead frame

The lead frame according to the present embodiment has, for example, a substrate (substrate) having a pad on which a semiconductor element is placed and a wire electrically connected to the semiconductor element. The base material of the lead frame is formed, for example, by punching a copper alloy material of the present embodiment. In other words, the base material contains 0.2% by mass or more and 0.6% by mass or less of Fe, 0.02% by mass or more and 0.06% by mass or less of Ni, 0.07% by mass or more and 0.3% by mass or less of P, and 0.01% by mass or more and 0.2% by mass or less of Mg, and the rest. The part contains Cu and unavoidable impurities, and the mass ratio (Fe/Ni) of Fe to Ni is 5 or more and 10 or less. Thereby, the substrate of the lead frame has high conductivity and high strength. For example, the conductivity of the substrate is 75% IACS or more, and the 0.2% drop strength of the substrate is 500 MPa or more.

Further, the base material of the lead frame preferably contains 0.001% by mass or more and 0.005% by mass or less of Zn. Thereby, as described above, the weldability to the lead frame can be improved without lowering the conductivity of the lead frame.

Ii. Connector (terminal)

The connector (terminal) according to the present embodiment has, for example, a conductor portion electrically connected to a connector (terminal) on the electronic device side (opposing side) and a housing (accommodating portion) accommodating the conductor portion. The conductor portion of the connector is formed, for example, of the copper alloy material of the present embodiment. In other words, the conductor portion contains 0.2% by mass or more and 0.6% by mass or less of Fe, 0.02% by mass or more and 0.06% by mass or less of Ni, 0.07% by mass or more and 0.3% by mass or less of P, and 0.01% by mass or more and 0.2% by mass or less of Mg, and the rest. The part contains Cu and unavoidable impurities, and the mass ratio (Fe/Ni) of Fe to Ni is 5 or more and 10 or less. Thereby, the conductor portion of the connector has high conductivity and high strength. For example, the conductivity of the conductor portion is 75% IACS or more, and the 0.2% drop strength of the conductor portion is 500 MPa or more.

Further, the conductor portion of the connector preferably contains 0.001% by mass or more and 0.005% by mass or less of Zn. Thereby, as described above, it is possible to prevent the conductivity of the conductor portion of the connector from being lowered. Improve the weldability of the conductor to the connector.

(3) Method for manufacturing copper alloy material

Next, a method of producing a copper alloy material according to the present embodiment will be described.

i. casting step

First, oxygen-free copper as a base material is melted in a nitrogen atmosphere using, for example, a high-frequency (high-frequency) melting furnace to form a molten metal of copper. Next, Fe, Ni, P, and Mg are added to form a molten metal of a copper alloy. In this case, for example, the content of Fe is 0.2% by mass or more and 0.6% by mass or less, and the content of Ni is 0.02% by mass or more and 0.06% by mass or less, and the content of P is 0.07% by mass or more and 0.3% by mass or less. The content of Mg is 0.01% by mass or more and 0.2% by mass or less, and the mass ratio (Fe/Ni) of Fe to Ni is 5 or more and 10 or less. Here, the molten metal of the copper alloy at this time may further contain 0.001% by mass or more and 0.005% by mass or less of Zn. Next, the molten metal of the copper alloy is injected into a mold and cooled, and an ingot having a predetermined composition is cast.

Ii. Hot rolling step

The ingot is heated to a predetermined temperature, and the ingot is hot rolled to form a hot rolled material having a predetermined thickness. Here, the hot-rolled material referred to herein is a plate material of a copper alloy subjected to a hot rolling step. At this time, the temperature of hot rolling is set to, for example, 900 ° C or more and 1000 ° C or less. Further, the total workability of the ingot is set to, for example, 90% or more and 95% or less.

Iii. The first cold rolling step

Next, the hot-rolled material is cold-rolled to form a first cold-rolled material having a predetermined thickness. In the present embodiment, for example, cold rolling of the hot rolled material and annealing of the material to be rolled are alternately repeated a predetermined number of times. Here, the first cold-rolled material referred to herein is a plate material of a copper alloy in which all the steps (a predetermined number of cold rolling and annealing) of the first cold rolling step are performed, and the material to be rolled is subjected to the first cold rolling step. One-time cold rolled copper alloy sheet. At the end of the first cold rolling step, cold rolling is performed without annealing.

In the first cold rolling step, annealing is performed at a temperature lower than that at which recrystallization occurs in the material to be rolled. Specifically, the annealing temperature is, for example, 300 ° C or more and 600 ° C or less. The annealing time is, for example, 30 seconds or more and 5 minutes or less. Thereby, it is possible to restore the workability of cold rolling without causing recrystallization in the material to be rolled. Therefore, it is possible to suppress a decrease in the strength of the finally produced copper alloy material.

Further, in the first cold rolling step, for example, processing of 15% or more and 60% or less is performed. The final cold rolling performed after the final annealing was performed. Here, the degree of work in the cold rolling step is defined as "processing degree (%) = {1 - (thickness after cold rolling / thickness before cold rolling)} x 100". When the degree of processing of the final cold rolling is less than 15%, there is a possibility that it is difficult to introduce a lattice defect into the material to be rolled. If a lattice defect is not introduced into the material to be rolled, there is a possibility that the P compound (Fe-P compound or Ni-P compound) is difficult to precipitate. On the other hand, in the present embodiment, the degree of processing of the final cold rolling is 15% or more, whereby lattice defects can be introduced into the material to be rolled. Here, although the lattice defects can be introduced into the material to be rolled by the cold rolling before the final cold rolling, the lattice defects introduced into the material to be rolled by the cold rolling before the final cold rolling are caused by the annealing. Since a part can be recovered, a predetermined amount of lattice defects can be left in the material to be rolled by setting the degree of processing of the final cold rolling to 15% or more. Thereby, in the heat treatment step of the subsequent step, the formation of precipitates of the P compound (Fe-P compound or Ni-P compound) having a lattice defect as a core can be promoted. Therefore, the strength of the finally produced copper alloy material can be improved. On the other hand, when the degree of processing of the final cold rolling exceeds 60%, there is a possibility that excessive strain is accumulated in the material to be rolled due to the cold rolling. As a result, in the heat treatment step (aging step) of the subsequent step, recrystallization is likely to occur in the material to be rolled (first cold-rolled material), and there is a heat-treated rolled material (first cold-rolled material) even at a relatively low temperature. The possibility of recrystallization also occurs. When recrystallization occurs in the material to be rolled (the first cold-rolled material), there is a possibility that the strength of the finally produced copper alloy material is lowered. In the present embodiment, the degree of processing of the final cold rolling is 60% or less, and it is possible to suppress recrystallization in the rolled material (first cold-rolled material) in the heat treatment step (aging step) in the subsequent step, thereby suppressing the final production. The strength of the copper alloy material is reduced.

In the first cold rolling step, cold rolling and annealing are repeated so that the total workability of the first cold rolled material becomes a predetermined value. The number of repetitions of cold rolling and annealing is, for example, 1 time or more and 3 times or less. Here, as described above, at the end of the first cold rolling step, cold rolling is performed without annealing.

Iv. Heat treatment step (aging step)

Next, the first cold-rolled material is subjected to heat treatment (aging treatment) at a predetermined temperature to form a heat-treated material. Here, the heat-treated material referred to herein is a plate material of a copper alloy subjected to a heat treatment step.

In the heat treatment step, the first cold-rolled material is heated at a temperature lower than the temperature at which the recrystallization occurs in the first cold-rolled material (temperature at the start of occurrence), for example, at a temperature of 380 ° C or higher. When the temperature of the heat treatment step is lower than 380 ° C, there is no Fe-P compound or Ni-P compound. The possibility that the amount of solid solution of Fe or Ni in the heat-treated material is sufficiently dispersed is sufficiently dispersed. Therefore, there is a possibility that the conductivity of the finally produced copper alloy material is lowered. In the present embodiment, the temperature of the heat treatment step is 380 ° C or higher, and it is possible to suppress the solid solution of Fe or Ni in the heat-treated material, and to sufficiently disperse and precipitate the Fe-P compound or the Ni-P compound. Thereby, the strength of the copper alloy material can be improved while suppressing the decrease in the electrical conductivity of the finally produced copper alloy material. On the other hand, when the temperature of the heat treatment step is equal to or higher than the temperature at which recrystallization occurs in the first cold-rolled material, recrystallization occurs in the first cold-rolled material which is the target of the heat treatment step. Therefore, there is a possibility that the strength of the finally produced copper alloy material is lowered. In the present embodiment, the temperature in the heat treatment step is lower than the temperature at which recrystallization occurs in the first cold-rolled material, and recrystallization can be suppressed in the first cold-rolled material as the article in the heat treatment step. Thereby, it is possible to suppress a decrease in strength of the finally produced copper alloy material.

Specifically, in the heat treatment step, the first cold-rolled material is preferably heated at a temperature of, for example, 450 ° C or lower. Thereby, the temperature of the heat treatment step can be made lower than the temperature at which recrystallization occurs in the first cold-rolled material. Therefore, recrystallization can be suppressed in the first cold-rolled material which is an object of the heat treatment step.

Further, in the heat treatment step, it is preferred to heat the first cold-rolled material for, for example, 3 hours or longer. Thereby, a sufficient amount of the P compound (Fe-P compound or Ni-P compound) can be precipitated in the first cold-rolled material. Therefore, the strength of the finally produced copper alloy material can be improved.

v. 2nd cold rolling step

Next, the heat-treated material is cold-rolled to form a second cold-rolled material. In the present embodiment, for example, the heat-treated material is repeatedly subjected to cold rolling for a predetermined number of times. Here, the second cold-rolled material referred to herein is a plate material of a copper alloy in which all steps (cold rolling of a predetermined number of times) of the second cold rolling step are performed. Further, when the second cold rolling step is the final step, the second cold rolled material is a copper alloy material finally produced.

In the second cold rolling step, cold rolling is performed at a total working degree higher than the total working degree (about 40% or more and 60% or less) of the second cold rolling step applied in the conventional copper alloy material manufacturing method. Here, the total workability in the second cold rolling step is defined as "total workability (%) = {1 - (thickness after the second cold rolling step (after a predetermined number of cold rolling and annealing) / second cold rolling The thickness before the step)}×100”. Specifically, for example, cold rolling is performed at a total working degree of 70% or more. When the total workability is less than 70%, there is a possibility that the work hardening of the heat-treated material is insufficient, and the strength of the finally produced copper alloy material is insufficient. In the present embodiment, by setting the total degree of work in the second cold rolling step to 70% or more, the heat-treated material is cold-rolled at a high total degree of work after the heat treatment step (aging step). It is enough to harden the heat-treated material. Thereby, the strength of the finally produced copper alloy material can be improved.

In the second cold rolling step, for example, cold rolling is preferably performed at a total working degree of 85% or less. When the total workability exceeds 85%, the strain accumulated in the heat-treated material becomes excessive, and there is a possibility that the ductility of the finally produced copper alloy material is lowered, and the finally produced copper alloy material is slightly stretched or broken. In the present embodiment, the ductility of the finally produced copper alloy material can be ensured by the total workability of 85% or less.

In the second cold rolling step, the cold rolling is repeated so that the total workability of the second cold-rolled material becomes a predetermined value. The number of repetitions of cold rolling is, for example, 1 time or more and 5 times or less.

By the above operation, a copper alloy material having a predetermined thickness is formed.

(4) Effects of the present embodiment

According to the present embodiment, one or more of the effects shown below are achieved.

(a) According to the present embodiment, the copper alloy material contains 0.2% by mass or more and 0.6% by mass or less of Fe, 0.02% by mass or more and 0.06% by mass or less of Ni, 0.07% by mass or more and 0.3% by mass or less of P, and 0.01% by mass or more and 0.2. Mg below mass%, the remainder contains Cu and unavoidable impurities. By reducing the content of Ni to a level lower than that described in Patent Document 1, the influence of Ni on the conductivity of the copper alloy material is suppressed, and the conductivity of the copper alloy material can be improved. In addition, when a predetermined amount of Mg is added to the copper alloy material, even when the content of Ni is made lower than the range described in Patent Document 1, the high conductivity can be maintained and the strength of the copper alloy material can be improved. In this way, the high electrical conductivity and high strength of the copper alloy material can be achieved. For example, the conductivity of the copper alloy material can be 75% IACS or more, and the 0.2% drop strength of the copper alloy material can be 500 MPa or more. Therefore, it is possible to satisfy the requirements of high electrical conductivity and high strength in recent years.

(b) According to the present embodiment, the mass ratio (Fe/Ni) of Fe to Ni is 5 or more and 10 or less. By having a mass ratio of Fe/Ni of 5 or more, it is possible to suppress the influence of Ni on the decrease in conductivity of the copper alloy material. By forming a certain amount of Ni-P compound in the copper alloy material by mass ratio Fe/Ni of 10 or less, the strength of the copper alloy material can be improved. Therefore, it is possible to achieve both high conductivity and high strength of the copper alloy material.

(c) According to the present embodiment, the copper alloy material may contain 0.001% by mass or more and 0.005% by mass or less of Zn. Thereby, the weldability can be improved without lowering the electrical conductivity.

(d) According to the present embodiment, the ingot is cast in the casting step, and the ingot contains 0.2% by mass or more and 0.6% by mass or less of Fe, 0.02% by mass or more and 0.06% by mass or less of Ni, 0.07. The mass% or more is 0.3% by mass or less of P and 0.01% by mass or more and 0.2% by mass or less of Mg, and the remainder contains Cu and unavoidable impurities. Next, a prescribed rolling step and heat treatment step are performed to form a copper alloy material. By casting an ingot having the composition as described above, a copper alloy material having high conductivity and high strength can be obtained.

(e) According to the present embodiment, in the first cold rolling step, annealing is performed at a temperature lower than that at which recrystallization occurs in the material to be rolled. Thereby, recrystallization can be suppressed from occurring in the material to be rolled. Therefore, it is possible to suppress a decrease in the strength of the finally produced copper alloy material.

(f) According to the present embodiment, in the first cold rolling step, the final cold rolling after the final annealing is performed at a working degree of 15% or more and 60% or less. The lattice defect can be introduced into the material to be rolled by the degree of processing of the final cold rolling of 15% or more. Thereby, in the heat treatment step of the subsequent step, the formation of precipitates of the P compound (Fe-P compound or Ni-P compound) having a lattice defect as a core can be promoted. Therefore, the strength of the finally produced copper alloy material can be improved. In addition, in the heat treatment step (aging step) of the subsequent step, the occurrence of recrystallization in the material to be rolled (first cold-rolled material) can be suppressed, and the copper finally produced can be suppressed. The strength of the alloy material is reduced.

(g) According to the present embodiment, in the heat treatment step, the first cold-rolled material is heated at a temperature lower than the temperature at which 380 ° C or higher is lower than the temperature at which recrystallization occurs in the first cold-rolled material. When the temperature of the heat treatment step is 380 ° C or higher, it is possible to suppress solid solution of Fe or Ni in the heat-treated material, and to sufficiently disperse and precipitate the Fe-P compound or the Ni-P compound. Thereby, the strength of the copper alloy material can be improved while suppressing the decrease in the electrical conductivity of the finally produced copper alloy material. Further, the temperature in the heat treatment step is lower than the temperature at which recrystallization occurs in the first cold-rolled material, and recrystallization can be suppressed in the first cold-rolled material as the article of the heat treatment step. Thereby, it is possible to suppress a decrease in strength of the finally produced copper alloy material.

(h) According to the present embodiment, in the second cold rolling step, cold rolling is performed at a total working degree of 70% or more. After the heat treatment step (aging step), the heat-treated material is cold-rolled at a high degree of work, and the heat-treated material can be work-hardened. Thereby, the strength of the finally produced copper alloy material can be improved.

(i) The copper alloy material according to the present embodiment is particularly effective for application to a substrate of a lead frame. In recent years, with the increase in the versatility, miniaturization, and weight reduction of electronic devices, semiconductor packages mounted in electronic devices have been required to be thinner, smaller, and higher in density. In response to these requirements, For the lead frame used in the semiconductor package, high conductivity for ensuring heat dissipation and high strength for adapting to thinning are required. Therefore, by applying the copper alloy material according to the present embodiment to the base material of the lead frame, it is possible to satisfy the requirements of high electrical conductivity and high strength in recent years.

(j) The copper alloy material according to the present embodiment is particularly effective for application to the conductor portion of the connector. In particular, in an electric component such as a connector used in an electric system in an automobile, since the electrification of the automobile is being promoted, the current value flowing through the electric component is increasing. For such an electrical component, high electrical conductivity for suppressing the generation of Joule heat or high strength required for the elastic properties required to meet the specifications of the automobile is required. Therefore, by applying the copper alloy material according to the present embodiment to the conductor portion of the connector, it is possible to satisfy the requirements of high electrical conductivity and high strength in recent years.

Here, the existing copper alloy material will be described for reference.

In the lead frame of the conventional semiconductor package, for example, C1910 alloy containing 0.05% by mass or more and 0.15% by mass or less of Fe and 0.025% by mass or more and 0.04% by mass or less of P, and Fe containing 2.1% by mass or more and 2.6% by mass or less are used. And C15400 alloy of 0.015 mass% or more and 0.15 mass% or less of P and 0.05 mass% or more and 0.20 mass% or less of Zn. Although the conductivity of the Cu-Fe-P-based C19210 alloy is about 90% IACS, the 0.2% drop strength is 450 MPa or less. Therefore, there is a possibility that the strength of the C19210 alloy is insufficient with respect to the high strength requirement in recent years. In addition, although the C19400 alloy can adjust the properties to a 0.2% drop strength of 500 MPa or more, the conductivity of the C19400 is about 65% IACS. Therefore, there is a possibility that the conductivity of C19400 is insufficient with respect to the high conductivity requirement in recent years.

In a material which is required to have high electrical conductivity and high strength in a material used for an electric component such as a terminal or a connector, for example, it is contained in an amount of 2.2% by mass or more and 4.2% by mass or less of Ni, and 0.25 mass% or more and 1.2 mass% or less.矽 (Si) and a C70250 alloy of 0.05% by mass or more and 0.30% by mass or less of Mg. Although the Cu-Ni-Si-based C70250 alloy has a 0.2% drop strength exceeding 500 MPa, the electrical conductivity is about 45% IACS. Therefore, there is a possibility that the conductivity of the C70250 alloy is insufficient with respect to the high conductivity requirement in recent years.

Furthermore, the inventors of the present invention have developed a Cu-Fe-Ni-P-based copper alloy material having a high electrical conductivity and high strength, and the copper alloy material contains 0.1% by mass or more and 0.5% by mass or less of Fe. 0.03 mass% or more and 0.2 mass% or less of Ni and 0.03 mass% or more and 0.2 mass% or less of P, and the mass ratio of Fe and Ni to P ((Fe+Ni)/P) is 3 or more and 10 or less, Fe The mass ratio (Fe/Ni) to Ni is 0.8 or more and 1.2 or less (Patent Document 1). The Cu-Fe-Ni-P-based copper alloy material described in Patent Document 1 has high strength and a conductivity of 60% IACS or more. However, in view of the demand for high electrical conductivity in recent years, further improvement in electrical conductivity is desired.

According to the present embodiment, the copper alloy material has the above composition, and the electrical conductivity of the copper alloy material can be set to 75% IACS or more, and the 0.2% reduction strength of the copper alloy material can be set to 500 MPa or more. Therefore, it is possible to satisfy the requirements of high electrical conductivity and high strength in recent years.

Further, as the Cu-Cr-based copper alloy material, for example, a C18080 alloy is known. The conductivity of the Cu-Cr based copper alloy material exceeds 70% IACS, and the 0.2% drop strength is 500 MPa or more. However, since Cr contained in the Cu-Cr-based copper alloy material is a refractory material and has a property of easily reacting with carbon of the refractory material, it is difficult to melt and cast the Cu-Cr-based copper alloy material. Therefore, there is a tendency that the Cu-Cr-based copper alloy material has a high manufacturing cost.

On the other hand, according to the present embodiment, the copper alloy material does not contain Cr (the content of Cr in the copper alloy material is equal to or less than the content of the unavoidable impurities). Thereby, the copper alloy material can be stably melted and cast. Therefore, it is possible to suppress an increase in manufacturing cost.

Other embodiments of the invention

Although an embodiment of the present invention has been specifically described above, the present invention is not limited to the embodiment described above, and may be appropriately modified without departing from the spirit and scope of the invention.

In the above embodiment, the case where the copper alloy material having desired high conductivity and high strength is formed by the above-described manufacturing steps has been described. However, the present invention is not limited to this method, and the same copper alloy material can be formed by the above-described manufacturing method. .

Example

Next, an embodiment related to the present invention will be described.

The samples 1 to 30 were prepared as follows, and the conductivity and strength were evaluated for each sample.

1. Preparation of samples Sample 1~7

In the sample 1, a copper alloy material was formed as follows. First, 0.35 mass% of Fe, 0.040 mass% of Ni, 0.12 mass% of P, and 0.10 mass% of Mg were added using oxygen-free copper as a base material, and melted in a nitrogen atmosphere using a high-frequency melting furnace, and the thickness was 25 mm. An ingot having a width of 30 mm and a length of 150 mm (casting step). Secondly, the ingot is heated to 950 ° C to heat the ingot Rolling was carried out to form a hot rolled material having a thickness of 8 mm (hot rolling step). Next, the hot rolled material was cold rolled, and the thickness of the material to be rolled was 2 mm. Next, the material to be rolled was annealed at 550 ° C for 1 minute. Then, the annealed material which has been annealed is subjected to cold rolling at the end of the first cold rolling step at a processing degree of 50% to form a first cold-rolled material having a thickness of 1 mm (first cold rolling step). Next, the first cold-rolled material was heated at a temperature of 420 ° C for 6 hours to form a heat-treated material (heat treatment step). Next, the heat-treated material was cold-rolled at a total working degree of 75% to form a second cold-rolled material having a thickness of 0.25 mm (second cold rolling step). By the above operation, the copper alloy material of the sample 1 was formed.

Here, in the samples 2 to 7, as shown in the following Table 1, the composition of the ingot in the casting step was changed from the composition of the sample 1 within a predetermined range. The copper alloy materials of the samples 2 to 7 were formed by applying the same method as the method of manufacturing the copper alloy material of the sample 1 in the other steps.

Sample 8~10

In the samples 8 to 10, as shown in the following Table 1, the inside of the ingot in the casting step contained Zn in a predetermined range. The copper alloy materials of the samples 8 to 10 were formed by the same method as the method of producing the copper alloy material of the sample 1 in the other steps.

Sample 11~20

In the samples 11 to 20, as shown in the following Table 1, the composition of the ingot in the casting step was changed from the composition of the sample 1 to a predetermined range. The copper alloy materials of the samples 11 to 20 were formed by the same method as the method of producing the copper alloy material of the sample 1 in the other steps.

Sample 21

In the sample 21, as shown in the following Table 1, the ingot in the casting step contained Zn in a content exceeding a predetermined range. The copper alloy material of the sample 21 was formed by applying the same method as the method of manufacturing the copper alloy material of the sample 1 in another step.

Sample 22~25

In the samples 22 to 25, the composition of the ingot in the casting step was set to be the same as the composition of the sample 1. On the other hand, as shown in the following Table 3, the conditions of the first cold rolling step, the heat treatment step, and the second cold rolling step were changed within the predetermined range from the conditions of the sample 1.

Sample 26~30

In the samples 26 to 30, the composition of the ingot in the casting step was set to be the same as the composition of the sample 1. On the other hand, as shown in the following Table 3, the conditions of the first cold rolling step, the heat treatment step, and the second cold rolling step were changed from the conditions of the sample 1 to a predetermined range.

2. Evaluation

Samples 1 to 30 were evaluated as follows.

Conductivity evaluation

The electrical conductivity was measured by a conductivity measurement method based on JIS H0505. The results are shown in Tables 1 to 3.

Strength evaluation

Tensile strength and 0.2% drop strength were measured by a tensile test method based on JIS Z 2241. The results are shown in Tables 1 and 3.

Evaluation of solder adhesion

The solder heat-resistant peeling test was carried out in accordance with the following method. First, a test piece having a width of 10 mm and a length of 30 mm was taken from each sample having a thickness of 0.25 mm. Next, it was immersed in a lead-free solder (Sn-3 mass% Ag-0.5 mass% Cu) which was kept molten at 260 ° C, and a solder layer was formed on the surface of the test piece. The test piece was heated and maintained at a temperature of 180 ° C for 100 hours. Next, the test piece was bent at 180°, and the tape peeling test of the bent portion was carried out. The results are shown in Table 2.

Here, in Table 1 below, the remainder other than the elements constituting each copper alloy material described in Table 1 contains Cu and unavoidable impurities.

3. Evaluation results

As shown in Table 1, the copper alloy of the samples 1 to 7 contains 0.2% by mass or more and 0.6% by mass or less of Fe, 0.02% by mass or more and 0.06% by mass or less of Ni, 0.07% by mass or more and 0.3% by mass or less of P and 0.01. Mg having a mass% or more and 0.2 mass% or less contains Cu and unavoidable impurities, and the mass ratio (Fe/Ni) of Fe to Ni is 5 or more and 10 or less. As a result, the conductivity of the samples 1 to 7 was 75% IACS or more, the tensile strength was 550 MPa or more, and the 0.2% drop strength was 500 MPa or more. Therefore, it was confirmed that the copper alloy materials of the samples 1 to 7 can achieve both high conductivity and high strength by having the above composition.

Copper alloy of Samples 8 to 10: 0.2% by mass or more and 0.6% by mass or less of Fe, 0.02% by mass or more and 0.06% by mass or less of Ni, 0.07% by mass or more and 0.3% by mass or less of P, and 0.01% by mass or more and 0.2% by mass or less. The following Mg and 0.001% by mass or more and 0.005% by mass or less of Zn include the Cu and unavoidable impurities, and the mass ratio (Fe/Ni) of Fe to Ni is 5 or more and 10 or less. As a result, the conductivity of the samples 8 to 10 was 75% IACS or more, the tensile strength was 550 MPa or more, and the 0.2% drop strength was 500 MPa or more. Therefore, it was confirmed that the copper alloy materials of the samples 8 to 10 can achieve both high conductivity and high strength by having the above composition.

Here, regarding the content of Fe in Table 1, for samples 1 to 7, samples 11 to 13 Line comparison. In the samples 11 and 12 in which the content of Fe was set to be less than 0.2% by mass, the 0.2% drop strength was less than 500 MPa. When the content of Fe is small, the amount of precipitation of the Fe—P compound is small, and thus sufficient strength is not obtained. On the other hand, in the sample 13 in which the content of Fe was more than 0.6% by mass, the electrical conductivity was lower than 75% IACS. Therefore, it was confirmed that the content of Fe is preferably 0.2% by mass or more and 0.6% by mass or less.

Next, regarding the content of Ni in Table 1, samples 1 to 7 and samples 12 to 14 were compared. In the sample 12 in which the content of Ni was set to be less than 0.02% by mass, the 0.2% drop strength was less than 500 MPa. When the content of Ni is small, the amount of precipitation of the Ni—P compound is small, and thus sufficient strength is not obtained. On the other hand, in the samples 13 and 14 in which the content of Ni was set to exceed 0.06 mass%, the electrical conductivity was lower than 75% IACS. Therefore, it is confirmed that the content of Ni is preferably 0.02% by mass or more and 0.06% by mass or less.

Next, regarding the contents of P in Table 1, samples 1 to 7 and samples 15 and 16 were compared. In the sample 15 in which the content of P was set to be less than 0.07 mass%, the 0.2% drop strength was less than 500 MPa. When the content of P is small, the amount of precipitation of the P compound decreases as the content of Fe or Ni is small, and the strength is insufficient. On the other hand, in the sample 16 in which the content of P was more than 0.3% by mass, the electrical conductivity was lower than 75% IACS. When the content of P is large, the electrical conductivity is also lowered in the same manner as when the content of Fe or Ni is large. Therefore, it is confirmed that the content of P is preferably 0.07% by mass or more and 0.3% by mass or less.

Next, regarding the content of Mg in Table 1, samples 1 to 7, samples 17 and 18 were compared. In the sample 17 in which the content of Mg was set to be less than 0.01% by mass, the 0.2% drop strength was less than 500 MPa. This is an effect of improving the strength caused by the addition of Mg. On the other hand, in the sample 18 in which the content of Mg was more than 0.2% by mass, the electrical conductivity was less than 75% IACS. In this case, although Mg is a component which has a small influence on the decrease in conductivity, when the content of Mg is large as in Sample 18, the influence of the decrease in conductivity due to Mg cannot be ignored. Therefore, it is confirmed that the content of Mg is preferably 0.01% by mass or more and 0.2% by mass or less.

Next, regarding the mass ratio of Fe to Ni in Table 1 (Fe/Ni), samples 1 to 7 and samples 19 and 20 were compared. In the sample 19 in which the mass ratio Fe/Ni was set to be lower than 5, the electrical conductivity was lower than 75% IACS. On the other hand, in the sample 20 in which the mass ratio Fe/Ni was more than 10, the 0.2% drop strength was less than 500 MPa. Therefore, it was confirmed that the mass ratio Fe/Ni is preferably 5 or more and 10 or less.

Next, regarding the content of Zn in Table 2, samples 1, 8 to 10, and 21 were compared. In the samples 8 to 10 in which the content of Zn was 0.001% by mass or more and 0.005% by mass or less, no peeling was observed in the evaluation of the solder adhesion, and the weldability was improved. Further, the electrical conductivity was 75% IACS or more, and no decrease in electrical conductivity due to the inclusion of Zn was observed. On the other hand, in the sample 1 containing no Zn, partial peeling was observed in the evaluation of solder adhesion. On the other hand, in the sample 21 in which the content of Zn was more than 0.005 mass%, no peeling was observed in the evaluation of the solder adhesion, but the electrical conductivity was less than 75% IACS. From the above results, it is confirmed that the copper alloy material preferably contains Zn and the content of Zn is preferably 0.001% by mass or more and 0.005% by mass or less.

Next, regarding the method of producing the copper alloy material in Table 3, the samples 1, 22 to 30 were compared.

As shown in Table 3, in the samples 1 and 22 to 25, the degree of processing of the final cold rolling in the first cold rolling step was 15% or more and 60% or less, and in the heat treatment step, it was 380 ° C or more and 450 ° C or less. The temperature is heated for 3 hours or more, and the total degree of processing in the second cold rolling step is 70% or more. As a result, the conductivity of the samples 1, 22 to 25 was 75% IACS or more, and the 0.2% drop strength was 500 MPa or more. Therefore, it was confirmed that the samples 1 and 22 to 25 can achieve both high conductivity and high strength by performing the above steps.

Here, regarding the degree of processing of the final cold rolling in the first cold rolling step in Table 3, the samples 1, 22 to 25, and the samples 26 and 27 were compared. In the sample 26 in which the degree of final cold rolling in the first cold rolling step was set to less than 15%, the 0.2% drop strength was less than 500 MPa. This is considered to be because the lattice defects were not introduced into the material to be rolled, and the P compound was not analyzed. Further, in the sample 27 in which the degree of final cold rolling in the first cold rolling step was more than 60%, the 0.2% drop strength was less than 500 MPa. This is considered to be because excessive strain is accumulated in the material to be rolled, and recrystallization occurs in the material to be rolled in the subsequent heat treatment step. Therefore, it is confirmed that the degree of processing of the final cold rolling in the first cold rolling step is preferably 15% or more and 60% or less.

Next, regarding the temperatures of the heat treatment steps in Table 3, samples 1, 22 to 25, and samples 28 and 29 were compared. In the sample 28 in which the temperature of the heat treatment step was set to be lower than 380 ° C, the electrical conductivity was lower than 75% IACS. Therefore, since the temperature is low, the Fe-P compound or the Ni-P compound cannot be sufficiently dispersed and precipitated, and the amount of Fe or Ni dissolved in the heat-treated material increases. On the other hand, in the sample 29 in which the temperature of the heat treatment step was set to exceed 450 ° C, the 0.2% drop strength was less than 500 MPa. Therefore, since the temperature is high, recrystallization occurs in the first cold-rolled material which is an object of the heat treatment step. Therefore, it is confirmed that the temperature of the heat treatment step is preferably 380 ° C or more and 450 ° C or less.

Next, regarding the total degree of work in the second cold rolling step in Table 3, samples 1, 22 to 25, and sample 30 were compared. In the sample 30 in which the total workability in the second cold rolling step was set to be less than 70%, the 0.2% drop strength was less than 500 MPa. This is insufficient work hardening of the heat-treated material which is the target of the second cold rolling step. Therefore, it is confirmed that the total workability in the second cold rolling step is preferably 70% or more.

From the above results, it was confirmed that according to the present embodiment, it is possible to provide a method for producing a copper alloy material and a copper alloy material which have both high electrical conductivity and high strength.

Preferred way

Hereinafter, preferred embodiments of the present invention are listed in the Appendix.

According to one embodiment of the present invention, there is provided a copper alloy material containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, and 0.07% by mass or more and 0.3% by mass or less. The following phosphorus and 0.01% by mass or more and 0.2% by mass or less of magnesium include the copper and unavoidable impurities; the copper alloy material has a conductivity of 75% IACS or more and a 0.2% drop strength of 500 MPa or more.

2: The copper alloy material according to the above item 1, wherein the mass ratio of the iron to the nickel is preferably 5 or more and 10 or less.

3: The copper alloy material according to the above item 1 or 2, which preferably has a tensile strength of 550 MPa or more.

The copper alloy material according to any one of the items 1 to 3, further preferably contains 0.001% by mass or more and 0.005% by mass or less of zinc.

5: According to another aspect of the present invention, there is provided a method of producing a copper alloy material, the method comprising: a casting step of casting an ingot, a hot rolling step of hot rolling the ingot to form a hot rolled material, a first cold rolling step of cold rolling the hot rolled material to form a first cold rolled material, a heat treatment step of heat treating the first cold rolled material to form a heat treated material, and cold rolling the heat treated material a second cold rolling step of forming a second cold-rolled material; the ingot is cast in the casting step, and the ingot contains 0.2% by mass or more and 0.6% by mass or less of iron, and 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07 mass% or more and 0.3 mass% or less of phosphorus and 0.01% by mass or more and 0.2 mass% or less of magnesium, and the remaining portion contains Cu and unavoidable impurities; in the first cold rolling step, the predetermined number of times is alternately repeated. Said operation: said said hot rolled material The cold rolling is performed at a temperature lower than the temperature at which recrystallization occurs in the material to be rolled.

(6) The method for producing a copper alloy material according to the item 5, wherein, in the first cold rolling step, the final cold rolling after the final annealing is performed at a working degree of 15% or more and 60% or less.

(7) The method for producing a copper alloy material according to Item 5 or 6, wherein the temperature is 380 ° C or higher and lower than a temperature at which recrystallization occurs in the first cold rolled material to the first cold. The rolled material is heated.

The method for producing a copper alloy material according to any one of the items 5 to 7, wherein the first cold-rolled material is heated at a temperature of 450 ° C or lower in the heat treatment step.

The method for producing a copper alloy material according to any one of the items 5 to 8, wherein the first cold-rolled material is heated for 3 hours or more in the heat treatment step.

The method for producing a copper alloy material according to any one of the items 5 to 9, wherein the cold rolling is performed at a total working degree of 70% or more in the second cold rolling step.

The method for producing a copper alloy material according to any one of the items 5 to 10, wherein, in the second cold rolling step, the cold rolling is preferably performed at a total working degree of 85% or less.

12: According to still another aspect of the present invention, a lead frame having a substrate containing 0.2% by mass or more and 0.6% by mass or less of iron, and 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07 mass% or more and 0.3 mass% or less of phosphorus and 0.01 mass% or more and 0.2 mass% or less of magnesium, and the remainder contains Cu and unavoidable impurities; the conductivity of the substrate is 75% IACS or more, and the 0.2% drop strength is More than 500MPa.

According to still another embodiment of the present invention, a connector including a conductor portion containing 0.2% by mass or more and 0.6% by mass or less of iron, and 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07 is provided. The mass% or more and 0.3% by mass or less of phosphorus and 0.01% by mass or more and 0.2% by mass or less of magnesium, and the remainder include Cu and unavoidable impurities; the conductivity of the conductor portion is 75% IACS or more, and the 0.2% drop strength is 500 MPa. the above.

Claims (11)

A copper alloy material containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07% by mass or more and 0.3% by mass or less of phosphorus, and 0.01% by mass or more and 0.2% by mass or less of magnesium. The remaining part contains Cu and unavoidable impurities. The conductivity of the copper alloy material is 75% IACS or more, and the 0.2% drop strength is 500 MPa or more. The copper alloy material according to claim 1, wherein the mass ratio of the iron to the nickel is 5 or more and 10 or less. The copper alloy material according to the first or second aspect of the invention, further comprising 0.001% by mass or more and 0.005% by mass or less of zinc. A method for producing a copper alloy material, which is a method for producing a copper alloy material having a conductivity of 75% IACS or more and a 0.2% reduction strength of 500 MPa or more, the manufacturing method comprising: a casting step of casting an ingot, and the ingot a hot rolling step of hot rolling to form a hot rolled material, a first cold rolling step of cold rolling the hot rolled material to form a first cold rolled material, and heat treatment of the first cold rolled material to form a heat treated material a heat treatment step and a second cold rolling step of cold rolling the heat-treated material to form a second cold-rolled material; and casting the ingot in the casting step, the ingot containing 0.2% by mass or more and 0.6% by mass or less Iron, 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07% by mass or more and 0.3% by mass or less of phosphorus, and 0.01% by mass or more and 0.2% by mass or less of magnesium, and the balance containing Cu and unavoidable impurities; In the cold rolling step, the following operations are repeated alternately for a predetermined number of times: the cold rolling of the hot rolled material and the annealing at a temperature lower than the temperature at which recrystallization occurs in the material to be rolled. In the method for producing a copper alloy material according to the fourth aspect of the invention, in the first cold rolling step, the final cold rolling after the final annealing is performed at a working degree of 15% or more and 60% or less. The method for producing a copper alloy material according to the fourth or fifth aspect of the invention, wherein the temperature of 380 ° C or higher is lower than a temperature at which recrystallization occurs in the first cold rolled material. The first cold rolled material is heated. The method for producing a copper alloy material according to any one of claims 4 to 6, wherein in the second cold rolling step, the cold rolling is performed at a total working degree of 70% or more. A lead frame having a base material containing 0.2 mass or more and 0.6 mass% or less of iron, 0.02 mass% or more and 0.06 mass% or less of nickel, 0.07 mass% or more and 0.3 mass% or less of phosphorus, and 0.01 mass% or more and 0.2 or less. Magnesium or less by mass% contains Cu and unavoidable impurities. The conductivity of the substrate is 75% IACS or more, and the 0.2% drop strength is 500 MPa or more. A connector having a conductor portion containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07% by mass or more and 0.3% by mass or less of phosphorus, and 0.01% by mass or more Magnesium of 0.2% by mass or less, and the balance containing Cu and unavoidable impurities, the conductivity of the conductor portion is 75% IACS or more, and the 0.2% drop strength is 500 MPa or more. A lead frame having a base material containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07% by mass or more and 0.3% by mass or less of phosphorus, and 0.01% by mass or more. 0.2% by mass or less of magnesium and 0.001% by mass or more and 0.005% by mass or less of zinc, and the remainder contains Cu and unavoidable impurities, and the substrate has a conductivity of 75% IACS or more and a 0.2% drop strength of 500 MPa or more. A connector having a conductor portion containing 0.2% by mass or more and 0.6% by mass or less of iron, 0.02% by mass or more and 0.06% by mass or less of nickel, 0.07% by mass or more and 0.3% by mass or less of phosphorus, and 0.01% by mass or more 0.2% by mass or less of magnesium and 0.001% by mass or more and 0.005% by mass or less of zinc, and the balance containing Cu and unavoidable impurities, the conductivity of the conductor portion is 75% IACS or more, and the 0.2% drop strength is 500 MPa or more.