TW201547364A - Heat dissipation module and electronic device with the same - Google Patents
Heat dissipation module and electronic device with the same Download PDFInfo
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- TW201547364A TW201547364A TW103119823A TW103119823A TW201547364A TW 201547364 A TW201547364 A TW 201547364A TW 103119823 A TW103119823 A TW 103119823A TW 103119823 A TW103119823 A TW 103119823A TW 201547364 A TW201547364 A TW 201547364A
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Abstract
Description
本發明係關於一種散熱模組及其具有散熱模組之電子裝置，特別是一種可以利用不同熱膨脹係數之金屬以達到散熱效果之散熱模組及其具有散熱模組之電子裝置。The invention relates to a heat dissipation module and an electronic device having the same, particularly a heat dissipation module capable of utilizing different thermal expansion coefficients to achieve a heat dissipation effect and an electronic device having the heat dissipation module.
隨著科技的發展，現在的電子裝置一方面要求功能的強大，一方面也朝著輕薄短小的目標去實現。然而若是要求電子裝置的功能強大，其必定會產生較大的熱能。也因此要如何有效地散去熱能已經成為設計電子裝置時的重要課題。若以平板電腦為例，由於平板電腦較為輕薄，其內部空間較小，所以無法裝設風扇等散熱模組。因此於先前技術中通常是利用貼附於殼體內側的金屬片，以利用傳導方式進行散熱。此種金屬片可以為銅鋁箔。然而由於平板電腦內部的氣體無法對流，所以先前技術中的金屬片的散熱方式不佳，容易導致電子裝置過熱。With the development of science and technology, the current electronic devices require powerful functions on the one hand, and on the other hand, they are also implemented toward light, thin and short targets. However, if the electronic device is required to be powerful, it must generate a large amount of heat. Therefore, how to effectively dissipate thermal energy has become an important issue in the design of electronic devices. In the case of a tablet computer, since the tablet computer is relatively thin and light, and its internal space is small, it is impossible to install a heat dissipation module such as a fan. Therefore, in the prior art, a metal piece attached to the inner side of the casing is usually used to dissipate heat by conduction. Such a metal piece may be a copper aluminum foil. However, since the gas inside the tablet cannot be convected, the heat dissipation method of the metal piece in the prior art is not good, and it is easy to cause the electronic device to overheat.
有鑑於此，有必要發明一種新的散熱模組及其具有散熱模組之電子裝置，以解決先前技術之缺失。In view of this, it is necessary to invent a new heat dissipation module and an electronic device having the same, to solve the problem of the prior art.
本發明之主要目的係在提供一種散熱模組，其具有可以利用不同熱膨脹係數之金屬以達到散熱之效果。The main object of the present invention is to provide a heat dissipation module having a metal that can utilize different thermal expansion coefficients to achieve heat dissipation.
本發明之另一主要目的係在提供一種具有上述散熱模組之電子裝置。Another main object of the present invention is to provide an electronic device having the above heat dissipation module.
為達成上述之目的，本發明之散熱模組係設置於電子裝置之殼體內，該散熱模組包括第一金屬片、第二金屬片及固定結構。第一金屬片具有第一熱膨脹係數。第二金屬片係貼合於第一金屬片，第二金屬片具有第二熱膨脹係數，其中第一熱膨脹係數係大於第二熱膨脹係數。固定結構用以同時固定第一金屬片及第二金屬片之其中一部分，並使得第一金屬片及第二金屬片僅藉由固定結構固定於電子裝置之殼體上。To achieve the above objective, the heat dissipation module of the present invention is disposed in a casing of an electronic device, and the heat dissipation module includes a first metal piece, a second metal piece, and a fixing structure. The first metal sheet has a first coefficient of thermal expansion. The second metal sheet is attached to the first metal sheet, and the second metal sheet has a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion. The fixing structure is configured to simultaneously fix a part of the first metal piece and the second metal piece, and the first metal piece and the second metal piece are fixed to the casing of the electronic device only by the fixing structure.
本發明之電子裝置包括殼體、發熱單元及散熱模組。發熱單元係設置於殼體內部。散熱模組係設置於殼體上且靠近於發熱單元。散熱模組包括第一金屬片、第二金屬片及固定結構。第一金屬片具有第一熱膨脹係數。第二金屬片係貼合於第一金屬片，第二金屬片具有第二熱膨脹係數，其中第一熱膨脹係數係大於第二熱膨脹係數。固定結構用以同時固定第一金屬片及第二金屬片之其中一部分，並使得第一金屬片及第二金屬片僅藉由固定結構固定於電子裝置之該殼體上。The electronic device of the present invention comprises a housing, a heat generating unit and a heat dissipation module. The heat generating unit is disposed inside the casing. The heat dissipation module is disposed on the housing and adjacent to the heat generating unit. The heat dissipation module includes a first metal piece, a second metal piece, and a fixing structure. The first metal sheet has a first coefficient of thermal expansion. The second metal sheet is attached to the first metal sheet, and the second metal sheet has a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion. The fixing structure is configured to simultaneously fix a part of the first metal piece and the second metal piece, and the first metal piece and the second metal piece are fixed to the housing of the electronic device only by the fixing structure.
為能讓 貴審查委員能更瞭解本發明之技術內容，特舉較佳具體實施例說明如下。In order to enable the reviewing committee to better understand the technical contents of the present invention, the preferred embodiments are described below.
首先請一併參考圖1係本發明之散熱模組10用於電子裝置1之立體示意圖及圖2係本發明之散熱模組10用於電子裝置1之側面剖視圖。First, referring to FIG. 1 , a schematic diagram of a heat dissipation module 10 of the present invention for an electronic device 1 and FIG. 2 are a side cross-sectional view of the heat dissipation module 10 of the present invention for an electronic device 1 .
本發明之電子裝置1可為智慧型手機、平板電腦等裝置，但本發明並不限於此。由於電子裝置1的主要作用方式並非本案所要改進的重點所在，故在此不再贅述電子裝置1之作用原理，圖1及2中的示意圖也僅顯示電子裝置1的部分模組。電子裝置1包括散熱模組10、發熱單元20及殼體30。散熱模組10及發熱單元20皆設置於殼體30內部。發熱單元20可以為電子裝置1內部的微處理器或是記憶模組等會發熱之模組，係設置於電路板20a等元件上。殼體30可利用金屬或是塑膠材質製成，用以保護電子裝置1內部之散熱模組10、發熱單元20及其他之模組。The electronic device 1 of the present invention may be a smart phone, a tablet computer or the like, but the present invention is not limited thereto. Since the main mode of operation of the electronic device 1 is not the focus of the improvement of the present invention, the operation principle of the electronic device 1 will not be described herein. The schematic diagrams in FIGS. 1 and 2 only show some modules of the electronic device 1. The electronic device 1 includes a heat dissipation module 10, a heat generating unit 20, and a housing 30. The heat dissipation module 10 and the heat generating unit 20 are all disposed inside the casing 30. The heat generating unit 20 may be a microprocessor inside the electronic device 1 or a module that generates heat, such as a memory module, and is disposed on a component such as the circuit board 20a. The housing 30 can be made of metal or plastic material to protect the heat dissipation module 10, the heat generating unit 20 and other modules inside the electronic device 1.
散熱模組10係設置於該殼體30上且靠近於該發熱單元20，如此一來即可幫助發熱單元20進行散熱。散熱模組10包括第一金屬片11、第二金屬片12及固定結構13。第一金屬片11及第二金屬片12之大小係互相配合且緊密貼合。於本發明之一實施例中，第一金屬片11及第二金屬片12可為一矩形，但本發明並不限於此，第一金屬片11及第二金屬片12也可以為圓形、多邊形或是其他不規則之形狀。而第一金屬片11具有第一熱膨脹係數，第二金屬片12則具有第二熱膨脹係數，當中第一熱膨脹係數係大於第二熱膨脹係數。例如第一金屬片11可為一鋁製材質，其第一熱膨脹係數為23.1 µm·m−1 ·K−1 ，第二金屬片12可為一錫製材質，其第二熱膨脹係數為22.0 µm·m−1 ·K−1 ，但本發明並不限於此。藉此第一金屬片11及第二金屬片12受熱時的膨脹程度就會不同。固定結構13用以將該第一金屬片11及該第二金屬片12之其中一部分固定，使得第一金屬片11及第二金屬片12僅藉由一部分固定於該電子裝置1之該殼體30上，而第一金屬片11及第二金屬片12的其他區域則不固定。如此一來，第一金屬片11及第二金屬片12受熱時會自然彎曲，而讓殼體30內部的空氣產生流動。The heat dissipation module 10 is disposed on the housing 30 and adjacent to the heat generating unit 20, thereby helping the heat generating unit 20 to dissipate heat. The heat dissipation module 10 includes a first metal piece 11 , a second metal piece 12 , and a fixing structure 13 . The first metal piece 11 and the second metal piece 12 are sized to fit together and closely fit. In one embodiment of the present invention, the first metal piece 11 and the second metal piece 12 may be a rectangle, but the invention is not limited thereto, and the first metal piece 11 and the second metal piece 12 may also be circular, Polygon or other irregular shape. The first metal piece 11 has a first coefficient of thermal expansion, and the second metal piece 12 has a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion. For example, the first metal piece 11 may be made of aluminum, and the first coefficient of thermal expansion is 23.1 μm·m −1 ·K −1 , and the second metal piece 12 may be made of tin material, and the second coefficient of thermal expansion is 22.0 μm. m −1 ·K −1 , but the present invention is not limited to this. Thereby, the degree of expansion of the first metal piece 11 and the second metal piece 12 when heated is different. The fixing structure 13 is configured to fix a part of the first metal piece 11 and the second metal piece 12 such that the first metal piece 11 and the second metal piece 12 are fixed to the housing of the electronic device 1 only by a part thereof. 30, while the other areas of the first metal piece 11 and the second metal piece 12 are not fixed. As a result, the first metal piece 11 and the second metal piece 12 naturally bend when heated, and the air inside the casing 30 flows.
且於本發明之一實施例中，該第二金屬片12係設置於鄰近該殼體30之側，該第一金屬片11係設置於鄰近該發熱單元20之側，但第一金屬片11並不直接接觸於發熱單元20。藉此當第一金屬片11及第二金屬片12受熱時，會朝向發熱單元20之設置位置彎曲。且散熱模組10更包括限位結構14，係設置於該電子裝置1之該殼體30上，並鄰近於該第一金屬片11及該第二金屬片12之其中一未固定區域。如此一來，可以限制第一金屬片11及第二金屬片12的彎曲程度，使得第一金屬片11及第二金屬片12不會接觸到發熱單元20或電子裝置1內部的其他模組。In an embodiment of the present invention, the second metal piece 12 is disposed on a side adjacent to the housing 30, and the first metal piece 11 is disposed on a side adjacent to the heat generating unit 20, but the first metal piece 11 is It is not in direct contact with the heat generating unit 20. Thereby, when the first metal piece 11 and the second metal piece 12 are heated, they are bent toward the installation position of the heat generating unit 20. The heat dissipation module 10 further includes a limiting structure 14 disposed on the housing 30 of the electronic device 1 and adjacent to one of the first metal sheet 11 and the second metal sheet 12 . In this way, the degree of bending of the first metal piece 11 and the second metal piece 12 can be restricted, so that the first metal piece 11 and the second metal piece 12 do not contact the heat generating unit 20 or other modules inside the electronic device 1.
藉由本發明之散熱模組10，可使電子裝置1內部增加氣流的流動，提高散熱的效率，以改善先前技術不足之處。With the heat dissipation module 10 of the present invention, the flow of the airflow can be increased inside the electronic device 1, and the heat dissipation efficiency can be improved to improve the prior art deficiencies.
綜上所陳，本發明無論就目的、手段及功效，在在均顯示其迥異於習知技術之特徵，懇請 貴審查委員明察，早日賜准專利，俾嘉惠社會，實感德便。惟應注意的是，上述諸多實施例僅係為了便於說明而舉例而已，本發明所主張之權利範圍自應以申請專利範圍所述為準，而非僅限於上述實施例。To sum up, the present invention, regardless of its purpose, means and efficacy, shows its distinctive features of the prior art. You are requested to review the examination and express the patent as soon as possible. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the invention is intended to be limited by the scope of the claims.
1‧‧‧電子裝置
10‧‧‧散熱模組
11‧‧‧第一金屬片
12‧‧‧第二金屬片
13‧‧‧固定結構
14‧‧‧限位結構
20‧‧‧發熱單元
20a‧‧‧電路板
30‧‧‧殼體1‧‧‧Electronic device
10‧‧‧ Thermal Module
11‧‧‧First metal sheet
12‧‧‧Second metal piece
13‧‧‧Fixed structure
14‧‧‧Limited structure
20‧‧‧Fever unit
20a‧‧‧Board
30‧‧‧Shell
圖1係本發明之散熱模組用於電子裝置之立體示意圖。 圖2係本發明之散熱模組用於電子裝置之側面剖視圖。1 is a perspective view of a heat dissipation module of the present invention for use in an electronic device. 2 is a side cross-sectional view of the heat dissipation module of the present invention for use in an electronic device.
1‧‧‧電子裝置 1‧‧‧Electronic device
10‧‧‧散熱模組 10‧‧‧ Thermal Module
11‧‧‧第一金屬片 11‧‧‧First metal sheet
12‧‧‧第二金屬片 12‧‧‧Second metal piece
13‧‧‧固定結構 13‧‧‧Fixed structure
14‧‧‧限位結構 14‧‧‧Limited structure
20‧‧‧發熱單元 20‧‧‧Fever unit
20a‧‧‧電路板 20a‧‧‧Board
30‧‧‧殼體 30‧‧‧Shell
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103119823A TWI516198B (en) | 2014-06-06 | 2014-06-06 | Heat dissipation module and electronic device with the same |
| CN201410280992.8A CN105307451B (en) | 2014-06-06 | 2014-06-20 | Heat radiation module and electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103119823A TWI516198B (en) | 2014-06-06 | 2014-06-06 | Heat dissipation module and electronic device with the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201547364A true TW201547364A (en) | 2015-12-16 |
| TWI516198B TWI516198B (en) | 2016-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103119823A TWI516198B (en) | 2014-06-06 | 2014-06-06 | Heat dissipation module and electronic device with the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105307451B (en) |
| TW (1) | TWI516198B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966618B (en) * | 2017-05-26 | 2020-04-24 | 南宁富桂精密工业有限公司 | Shielding case and electronic device using same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1936468A1 (en) * | 2006-12-22 | 2008-06-25 | Siemens Aktiengesellschaft | Bi-metallic elements for adjusting a cooling channel |
| CN102377847B (en) * | 2010-08-23 | 2014-01-08 | 中国科学院理化技术研究所 | Mobile phone with liquid metal radiating module group |
| CN201966842U (en) * | 2011-01-14 | 2011-09-07 | 江西纳米克热电电子股份有限公司 | High-temperature resistant thermoelectrical semi-conductor power generation device |
| CN103872001B (en) * | 2014-02-26 | 2017-04-19 | 深圳市创成微电子有限公司 | Active chip packaging mode |
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2014
- 2014-06-06 TW TW103119823A patent/TWI516198B/en active
- 2014-06-20 CN CN201410280992.8A patent/CN105307451B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI516198B (en) | 2016-01-01 |
| CN105307451A (en) | 2016-02-03 |
| CN105307451B (en) | 2018-04-20 |
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