TWI466629B - Electronic device and casing thereof - Google Patents

Description

Electronic device and its casing

The present invention relates to an electronic device and a casing thereof, and more particularly to an electronic device and a casing having the same.

With the rapid advancement of electronic technology, various electronic products have become increasingly popular in our work and life. Thermal energy is generated when electronic components inside an electronic product operate. In order to ensure the normal operation of the electronic components, a heat dissipation hole is generally formed in the casing of the electronic product, so that the heat generated by the operation of the electronic component is adapted to be carried away by the heat dissipation airflow through the heat dissipation hole. Take Notebook Computer and Tablet PC as an example. The internal Central Processing Unit (CPU) generates a lot of heat during operation, so it needs to be on a notebook or tablet. The housing forms a vent to dissipate heat from the central processing unit.

In order to maintain the aesthetic appearance of the electronic product, the heat dissipation holes on the casing need to be formed at a position that does not affect the appearance, and the heat dissipation design of the electronic product is also limited, so that the heat dissipation efficiency cannot be further improved.

The present invention provides an electronic device in which the size of the heat dissipation holes of the casing is small without affecting the appearance.

The present invention provides a casing having a small size of the heat dissipation holes without affecting the appearance.

The invention provides an electronic device comprising a casing and a main body. The casing includes a first portion and a second portion. The first portion has a plurality of first heat dissipation holes. The second portion has a plurality of second heat dissipation holes. The apertures of each of the first heat dissipation holes and the second heat dissipation holes are between 0.08 mm and 0.2 mm. The main body is disposed in the casing. The heat dissipation airflow is adapted to flow through the main body through the first heat dissipation hole and flow through the main body, and is adapted to be discharged from the casing through the second heat dissipation hole.

The invention provides a casing suitable for use in an electronic device. The electronic device includes a body. The main body is disposed in the casing. The casing includes a first portion and a second portion. The first portion has a plurality of first heat dissipation holes. The second portion has a plurality of second heat dissipation holes. The apertures of each of the first heat dissipation holes and the second heat dissipation holes are between 0.08 mm and 0.2 mm. The heat dissipation airflow is adapted to flow through the main body through the first heat dissipation hole and flow through the main body, and is adapted to be discharged from the casing through the second heat dissipation hole.

In an embodiment of the invention, the first portion has a thickness between 0.5 mm and 2 mm.

In an embodiment of the invention, the second portion has a thickness between 0.5 mm and 2 mm.

In an embodiment of the invention, the distance between each of the first heat dissipation holes and the adjacent first heat dissipation hole is between 0.2 mm and 0.24 mm.

In an embodiment of the invention, the distance between each of the second heat dissipation holes and the adjacent second heat dissipation hole is between 0.2 mm and 0.24 mm.

In an embodiment of the invention, the body described above includes a heat dissipating component. The first heat dissipation hole or the second heat dissipation hole pair is located at the heat dissipation element.

In an embodiment of the invention, the heat dissipating component is a heat dissipating fan.

In an embodiment of the invention, the body comprises a heating element. The first heat dissipation hole or the second heat dissipation hole pair is located on the heat generating component.

In an embodiment of the invention, the heat generating component is a central processing unit.

Based on the above, the heat dissipation holes on the casing of the present invention have a small aperture, so that the user cannot visually observe the heat dissipation holes. Thereby, the heat dissipation hole can be located at any position on the casing without affecting the appearance of the electronic device, so that the heat dissipation design of the electronic device is less restricted, thereby improving the heat dissipation efficiency and improving the aesthetic appearance of the electronic device.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a rear elevational view of an electronic device in accordance with an embodiment of the present invention. 2 is a partial cross-sectional view of the electronic device of FIG. 1. Referring to FIG. 1 and FIG. 2 , the electronic device 100 of the embodiment includes a casing 110 and a main body 120 . The main body 120 is disposed in the casing 110. The casing 110 includes a first portion 112 having a plurality of first heat dissipation holes 112a and a second portion 124 having a plurality of second heat dissipation holes 114a. The aperture D1 of each of the first heat dissipation holes 112a and the aperture D2 of each of the second heat dissipation holes 114a are between 0.08 mm and 0.2 mm. The heat dissipation airflow F1 is adapted to enter the casing 110 through the first heat dissipation hole 112a and flow through the main body 120, and is adapted to be discharged from the casing 110 through the second heat dissipation hole 114a, so that the heat energy of the main body 120 is carried away by the heat dissipation airflow F1.

In this configuration, the first heat dissipation hole 112a and the second heat dissipation hole 114a of the casing 110 have a small aperture, so that the first heat dissipation hole 112a and the second heat dissipation hole 114a cannot be visually observed by the user. Therefore, the first heat dissipation hole 112a and the second heat dissipation hole 114a can be located at any position on the casing 110 without affecting the appearance of the electronic device 100, so that the heat dissipation design of the electronic device 100 is less restricted, thereby improving heat dissipation efficiency. The appearance of the electronic device 100 is enhanced. In addition, since the first heat dissipation hole 112a and the second heat dissipation hole 114a have a small aperture, the external liquid is more difficult to enter the inside of the casing 110 through the first heat dissipation hole 112a and the second heat dissipation hole 114a, thereby improving the waterproof effect.

Further, the thickness of the first portion 112 and the second portion 114 of the casing 110 can be designed to be thin, so that the heat dissipation airflow F1 can easily pass through the first heat dissipation hole 112a and the second heat dissipation hole 114a through the casing 110. In detail, the thickness W1 of the first portion 112 and the thickness W2 of the second portion 114 are, for example, between 0.5 mm and 2 mm, and other portions of the casing 110 may have a thicker thickness to maintain the structure of the casing 110. strength. In addition, the distance L1 between each of the first heat dissipation holes 112a and the adjacent first heat dissipation hole 112a is, for example, between 0.2 mm and 0.24 mm, and each of the second heat dissipation holes 114a and the adjacent second heat dissipation hole 114a The distance L2 between the heat dissipation holes 114a is, for example, between 0.2 mm and 0.24 mm, so that the distribution of the first heat dissipation holes 112a is dense, and the distribution of the second heat dissipation holes 114a is dense, and the heat dissipation airflow F1 can be improved. Circulation efficiency.

In other embodiments, the first portion 112 can be located at other locations on the housing 110 and can have other shapes and sizes of extensions such that the first louvers 112a have different ranges of distribution. The second portion 114 can be located elsewhere on the housing 110 and can have other shapes and sizes of extensions such that the second louvers 114a have different distribution ranges.

The electronic device 100 of this embodiment is, for example, a tablet computer. In other embodiments, the electronic device 100 can also be a notebook computer, a smart phone, or other electronic device, which is not limited by the present invention. In addition, as shown in FIG. 2, the main body 120 of the present embodiment includes a main board 122 and a heating element 124. The heating element 124 is, for example, a central processing unit and is disposed on the main board 122, and is disposed on the first heat dissipation hole 112a to dissipate heat. After the airflow F1 enters the casing 110 through the first heat dissipation hole 112a, it flows directly to the heating element 124 to carry away the heat energy generated when the heating element 124 operates. In other embodiments, the heat generating component 124 can also be disposed in the second heat dissipation hole 114a so that the heat dissipation airflow F1 receives the heat energy of the heat generating component 124 and is directly discharged from the casing 110 through the second heat dissipation hole 114a. The present invention does not limit the heat generating component. 124. A relative position of the first heat dissipation hole 112a and the second heat dissipation hole 114a.

3 is a partial cross-sectional view of an electronic device according to another embodiment of the present invention. Referring to FIG. 3, the main body 220 of the electronic device 200 of the present embodiment includes a heat dissipating component 224. The heat dissipating component 224 is, for example, a heat dissipating fan and is disposed on the first heat dissipating hole 212a of the casing 210, and is configured to generate a heat dissipating airflow F2. The heat dissipation airflow F2 enters the casing 210 through the first heat dissipation hole 212a to dissipate the heat generating component (not shown) in the casing 210, and is discharged from the casing 210 through the second heat dissipation hole 214a. In other embodiments, the heat dissipating component 224 can also be disposed in the second heat dissipation hole 214a so that the heat dissipation airflow F2 can receive the thermal energy of the heat generating component and then directly discharged from the casing 210 through the second heat dissipation hole 214a. The relative positions of the first heat dissipation holes 212a and the second heat dissipation holes 214a.

In summary, the heat dissipation holes on the casing of the present invention have a small aperture, so that the user cannot visually observe the heat dissipation holes. Thereby, the heat dissipation hole can be located at any position on the casing without affecting the appearance of the electronic device, so that the heat dissipation design of the electronic device is less restricted, thereby improving the heat dissipation efficiency and improving the aesthetic appearance of the electronic device. In addition, since the heat dissipation hole has a small aperture, the external liquid is difficult to enter the inside of the casing through the heat dissipation hole, and the waterproof effect can be improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 200. . . Electronic device

110, 210. . . cabinet

112. . . first part

112a, 212a. . . First cooling hole

114. . . the second part

114a, 214a. . . Second cooling hole

120, 220. . . main body

122. . . motherboard

124. . . CPU

224. . . Cooling fan

D1, D2. . . Aperture

F1, F2. . . Cooling airflow

L1, L2. . . distance

W1, W2. . . thickness

1 is a rear elevational view of an electronic device in accordance with an embodiment of the present invention.

2 is a partial cross-sectional view of the electronic device of FIG. 1.

3 is a partial cross-sectional view of an electronic device according to another embodiment of the present invention.

100. . . Electronic device

110. . . cabinet

112. . . first part

112a. . . First cooling hole

114. . . the second part

114a. . . Second cooling hole

Claims (18)

An electronic device includes: a casing, comprising: a first portion having a plurality of first heat dissipation holes; and a second portion having a plurality of second heat dissipation holes, wherein each of the first heat dissipation holes and each of the second heat dissipation holes The heat dissipation hole has a diameter of between 0.08 mm and 0.2 mm; and a main body disposed in the casing, wherein a heat dissipation airflow is adapted to enter the casing through the first heat dissipation holes and flow through the main body, and Discharged from the casing through the second heat dissipation holes. The electronic device of claim 1, wherein the first portion has a thickness of between 0.5 mm and 2 mm. The electronic device of claim 1, wherein the second portion has a thickness of between 0.5 mm and 2 mm. The electronic device of claim 1, wherein a distance between each of the first heat dissipation holes and the adjacent one of the first heat dissipation holes is between 0.2 mm and 0.24 mm. The electronic device of claim 1, wherein a distance between each of the second heat dissipation holes and the adjacent one of the second heat dissipation holes is between 0.2 mm and 0.24 mm. The electronic device of claim 1, wherein the main body comprises a heat dissipating component, and the first heat dissipating holes or the pair of second heat dissipating holes are located in the heat dissipating component. The electronic device of claim 6, wherein the heat dissipating component is a heat dissipating fan. The electronic device of claim 1, wherein the body comprises a heat generating component, and the first heat dissipation holes or the pair of second heat dissipation holes are located in the heat generating component. The electronic device of claim 8, wherein the heating element is a central processing unit. A casing suitable for an electronic device, the electronic device comprising a main body, the main body being disposed in the casing, the casing comprising: a first portion having a plurality of first heat dissipation holes; and a second portion having a plurality of second heat dissipation holes, wherein each of the first heat dissipation holes and each of the second heat dissipation holes has a diameter of between 0.08 mm and 0.2 mm, and a heat dissipation airflow is adapted to enter the casing through the first heat dissipation holes. Flowing through the body and adapted to be discharged from the housing through the second heat dissipation holes. The casing of claim 10, wherein the first portion has a thickness of between 0.5 mm and 2 mm. The casing of claim 10, wherein the second portion has a thickness of between 0.5 mm and 2 mm. The casing of claim 10, wherein a distance between each of the first heat dissipation holes and the adjacent one of the first heat dissipation holes is between 0.2 mm and 0.24 mm. The casing of claim 10, wherein a distance between each of the second heat dissipation holes and the adjacent one of the second heat dissipation holes is between 0.2 mm and 0.24 mm. The casing of claim 10, wherein the body comprises a heat dissipating component, and the first heat dissipating holes or the pair of second heat dissipating holes are located in the heat dissipating component. The casing of claim 15, wherein the heat dissipating component is a heat dissipating fan. The casing of claim 10, wherein the body comprises a heat generating component, and the first heat dissipation holes or the pair of second heat dissipation holes are located in the heat generating component. The casing of claim 17, wherein the heating element is a central processing unit.