TW201527455A - 導電膜形成用組成物、導電膜、有機薄膜電晶體、電子紙、顯示元件、配線板 - Google Patents

導電膜形成用組成物、導電膜、有機薄膜電晶體、電子紙、顯示元件、配線板 Download PDF

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Publication number
TW201527455A
TW201527455A TW103145109A TW103145109A TW201527455A TW 201527455 A TW201527455 A TW 201527455A TW 103145109 A TW103145109 A TW 103145109A TW 103145109 A TW103145109 A TW 103145109A TW 201527455 A TW201527455 A TW 201527455A
Authority
TW
Taiwan
Prior art keywords
group
composition
formula
conductive film
forming
Prior art date
Application number
TW103145109A
Other languages
English (en)
Chinese (zh)
Inventor
Yasuaki Matsushita
Tokihiko Matsumura
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201527455A publication Critical patent/TW201527455A/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00Coating compositions based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80Constructional details
    • H10K10/82Electrodes
    • H10K10/84Ohmic electrodes, e.g. source or drain electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/466Lateral bottom-gate IGFETs comprising only a single gate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Paints Or Removers (AREA)
  • Electrodes Of Semiconductors (AREA)
TW103145109A 2014-01-06 2014-12-24 導電膜形成用組成物、導電膜、有機薄膜電晶體、電子紙、顯示元件、配線板 TW201527455A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014000192 2014-01-06

Publications (1)

Publication Number Publication Date
TW201527455A true TW201527455A (zh) 2015-07-16

Family

ID=53493419

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103145109A TW201527455A (zh) 2014-01-06 2014-12-24 導電膜形成用組成物、導電膜、有機薄膜電晶體、電子紙、顯示元件、配線板

Country Status (3)

Country Link
JP (1) JP6100924B2 (ja)
TW (1) TW201527455A (ja)
WO (1) WO2015102075A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752117B (zh) * 2016-11-21 2022-01-11 日商東洋紡股份有限公司 導電性糊劑、導電性膜、導電性膜之製造方法、導電性微細配線及導電性微細配線之製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230400A (ja) * 1992-02-20 1993-09-07 Kao Corp 導電性ペーストおよび導電性塗膜
JP4880138B2 (ja) * 2001-07-13 2012-02-22 石原薬品株式会社 スズメッキ浴、スズメッキ方法及び当該メッキ浴を用いてスズメッキを施した電子部品
GB0400394D0 (en) * 2004-01-09 2004-02-11 Hypoguard Ltd Biosensor and method of manufacture
JP4400366B2 (ja) * 2004-08-06 2010-01-20 富士ゼロックス株式会社 電子写真感光体及びその製造方法、電子写真装置、並びにプロセスカートリッジ
JP4987239B2 (ja) * 2004-08-30 2012-07-25 信越ポリマー株式会社 導電性組成物
JP4754273B2 (ja) * 2005-06-06 2011-08-24 日立マクセル株式会社 インクジェット用導電性インク、導電性パターンおよび導電体
JP5323302B2 (ja) * 2005-08-10 2013-10-23 信越ポリマー株式会社 導電性高分子塗料の製造方法および導電性塗膜の製造方法
JP2009292909A (ja) * 2008-06-04 2009-12-17 Sanyo Chem Ind Ltd 導電性コーティング組成物
DE102010011269B4 (de) * 2009-11-10 2014-02-13 Ami Doduco Gmbh Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren
JP2013011885A (ja) * 2011-06-02 2013-01-17 Canon Inc 電子写真感光体、プロセスカートリッジ、電子写真装置および積層膜
JP2013026089A (ja) * 2011-07-22 2013-02-04 Fujikura Ltd 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法
JP2014015550A (ja) * 2012-07-10 2014-01-30 Mitsubishi Rayon Co Ltd 導電性組成物及び前記導電性組成物を用いた導電体
CN105340023B (zh) * 2013-06-27 2017-06-13 东丽株式会社 导电糊剂、导电图案的制造方法及触摸面板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752117B (zh) * 2016-11-21 2022-01-11 日商東洋紡股份有限公司 導電性糊劑、導電性膜、導電性膜之製造方法、導電性微細配線及導電性微細配線之製造方法

Also Published As

Publication number Publication date
JPWO2015102075A1 (ja) 2017-03-23
JP6100924B2 (ja) 2017-03-22
WO2015102075A1 (ja) 2015-07-09

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