TW201519719A - 配線基板及其製造方法 - Google Patents

配線基板及其製造方法 Download PDF

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Publication number
TW201519719A
TW201519719A TW103129456A TW103129456A TW201519719A TW 201519719 A TW201519719 A TW 201519719A TW 103129456 A TW103129456 A TW 103129456A TW 103129456 A TW103129456 A TW 103129456A TW 201519719 A TW201519719 A TW 201519719A
Authority
TW
Taiwan
Prior art keywords
layer
wiring
resin insulating
insulating layer
wiring board
Prior art date
Application number
TW103129456A
Other languages
English (en)
Chinese (zh)
Inventor
Erina Miyamoto
Hironori Sato
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201519719A publication Critical patent/TW201519719A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW103129456A 2013-08-29 2014-08-27 配線基板及其製造方法 TW201519719A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013177748A JP2015046530A (ja) 2013-08-29 2013-08-29 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
TW201519719A true TW201519719A (zh) 2015-05-16

Family

ID=52585919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103129456A TW201519719A (zh) 2013-08-29 2014-08-27 配線基板及其製造方法

Country Status (3)

Country Link
JP (1) JP2015046530A (ja)
TW (1) TW201519719A (ja)
WO (1) WO2015029319A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105792519A (zh) * 2016-03-22 2016-07-20 深圳崇达多层线路板有限公司 一种防止含树脂塞孔板电镀铜起泡的方法
CN106231816A (zh) * 2016-09-06 2016-12-14 深圳崇达多层线路板有限公司 一种无引线金手指板的制作方法
JP7211322B2 (ja) * 2019-10-08 2023-01-24 株式会社村田製作所 インダクタ部品
CN114615811A (zh) * 2020-12-07 2022-06-10 深南电路股份有限公司 一种高精密线路的加工方法及高精密线路板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103652A (ja) * 2002-09-05 2004-04-02 Toray Ind Inc ３層型メッキプリント回路基板
JP2004237517A (ja) * 2003-02-05 2004-08-26 Toray Ind Inc プリント回路用基板及びそれを用いたプリント回路基板
JP4797407B2 (ja) * 2005-02-07 2011-10-19 日立化成工業株式会社 配線基板の製造方法、半導体チップ搭載基板の製造方法及び半導体パッケージの製造方法
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法

Also Published As

Publication number Publication date
JP2015046530A (ja) 2015-03-12
WO2015029319A1 (ja) 2015-03-05

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