TW201514636A - GUI device for exposure device, exposure system, method for setting exposure condition and recording medium - Google Patents

Abstract

An object of the present invention is to provide a graphic user interface (GUI) device for an exposure device, which allows for selecting blocks that are arranged in a matrix form on a circular substrate with better operability, and an exposure system, a method for setting an exposure condition, and a recording medium. When an operator inputs desired information on a selection input area 210 of a GUI device through an operation section, on an initial screen that includes a substrate outline 202 and a plurality of blocks 203, a selected circle 204 is shown in a manner of being concentric with the substrate outline 202 and selection areas 205 included in a plurality of selection blocks 206 for setting an exposure condition are displayed in a highlighted manner.

Description

Graphic user interface device for exposure device, exposure system, exposure condition setting method, and recording medium

The present invention relates to a graphical user interface device (GUI device) for exposing a wiring pattern or the like to an exposure device of a substrate on which a photoresist film is formed.

Since the various substrates such as a semiconductor substrate, a printed wiring board, and a glass substrate have been irradiated with light passing through the photomask, the pattern has been formed. In recent years, in order to cope with the formation of various patterns, a technique of performing exposure processing by directly irradiating spatially modulated light onto a substrate without using a photomask and drawing a pattern is employed.

The exposure apparatus that performs the exposure processing as described above is called a direct drawing device. For example, Patent Document 1 describes a GUI device used in a direct drawing device. The GUI device is used when an exposure condition such as a drawing parameter is set in a plurality of block units set on a substrate. The block is rectangular in shape and arranged in the column direction and the row direction on the substrate. In other words, a plurality of blocks are arranged in a matrix on the substrate.

The exposure apparatus that performs exposure processing in units of blocks is not limited to the above-described direct drawing apparatus, and may be, for example, a stepping motor (reduced projection type exposure apparatus) that reduces a projection pattern formed on a reticle (reticle). Perform exposure processing.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2013-77718 (for example, paragraph 0054, FIG. 3)

The photoresist film formed on the circular substrate is generally formed by a so-called spin coating method (rotary coating method): after the photoresist is supplied to the center of the substrate, the substrate is rotated at a high speed around the center thereof. The surface of the substrate is coated with a photoresist by centrifugal force. The film thickness of the photoresist film formed on the substrate by the spin coating method may vary in the radial direction of the substrate, for example, from the center of the substrate to the periphery. When the photoresist film having the film thickness variation as described above is subjected to exposure processing for each of the plurality of blocks by the same exposure conditions, the following problems occur. That is, in a block having a thick film thickness of, for example, a photoresist film, there is a problem that the width of the resist pattern obtained by the development process after the exposure processing is thinner or thicker than the desired size.

In order to solve the above problem, in the case where the width of the resist pattern after development is thinner than the required size, it is made thicker, and the manner in which it is made thinner when the required size is thick is used. The GUI device changes exposure conditions for thinning and thickening for each block unit. When the exposure condition is changed, in order to change the thickness of the photoresist film in the radial direction of the substrate, it is necessary to select a plurality of blocks concentrically with the circular substrate shape.

Further, there is a case where a block exposure test pattern or the like disposed around the substrate is different from a standard pattern for manufacturing a semiconductor wafer. In this case, it is necessary to select a plurality of blocks (a plurality of blocks arranged concentrically with the outer shape of the substrate) set on the outer periphery of the substrate having a circular shape, and change the exposure conditions of the selected block. The exposure conditions used for the test pattern.

As the GUI device, for example, a device for displaying a rectangular area on an operation screen by causing an operator to drag a pointer of a mouse is known. In the device, the display is displayed on the operation screen. At least one of the blocks included in the rectangular area in the plurality of blocks is changed as an exposure condition. However, when the device is used to select a plurality of blocks arranged concentrically with the outer shape of the substrate, the desired block cannot be selected in one selection operation, and must be divided into a plurality of operations to select, resulting in poor operability. problem.

In view of the above, it is an object of the present invention to provide a GUI device and an exposure system for an exposure apparatus which can preferably select a block which is arranged in a matrix on a circular substrate and which can set an exposure condition. , exposure condition setting method, and recording medium.

According to a first aspect of the invention, a GUI device for an exposure apparatus is characterized in that a photoresist film formed on a surface of a circular substrate is subjected to exposure processing in units of blocks, and includes a display portion. The display unit has a screen, the display unit controls the screen display of the display unit, and the display control unit includes an initial screen display unit that includes the outer shape of the substrate and the inner region of the substrate. The selection display area of the plurality of blocks and the initial screen for inputting the selection input area for selecting the selection information of the selection circle are displayed on the display unit; and the circular display portion is selected to be concentric with the substrate shape based on the selection information. Circularly displaying a selection circle on a screen of the display unit; selecting a block display unit for highlighting a selection block selected based on the selection information on a display unit; and an exposure condition input display unit An exposure condition input area for inputting an exposure condition for performing exposure processing on the selected block is displayed on the screen of the display unit.

According to a second aspect of the invention, in the first aspect of the invention, the selection input region has information for inputting information about the size of the selection circle as an input region for selection information about the selection circle, and for inputting the inner side or the outer side with respect to the selection circle. The information is used as an input area for selecting information about the selection of the circle.

According to a third aspect of the invention, in the second aspect of the invention, the selection input region has an input region for inputting information on a selection width from the selection circle as selection information on the selection circle.

According to a fourth aspect of the invention, in the first aspect of the invention, the selection input area has an input area for inputting information on whether or not to select a block on the selection circle as the selection information on the selection circle.

According to a fifth aspect of the invention, in the first aspect of the invention, the exposure condition input region is an input region for inputting an exposure condition in which the size of the exposure pattern is changed.

According to a sixth aspect of the invention, in the first aspect of the invention, the exposure condition input region is configured to input an input region for selecting an exposure condition for a standard exposure operation or a test exposure operation.

According to a seventh aspect of the present invention, in the exposure apparatus of the invention, the exposure apparatus of the invention, wherein the exposure apparatus is configured to light the surface of the circular substrate The resist film is subjected to exposure processing in units of blocks.

According to a seventh aspect of the invention, the exposure apparatus is characterized in that the exposure device is a direct drawing device that scans a spatially modulated light beam by the photoresist film to draw an exposure pattern.

A ninth invention (exposure condition setting method) according to claim 9 is characterized in that the initial screen display step is performed on a screen of the display unit of the GUI device, and has a plurality of blocks including the outer shape of the substrate and the inner portion of the substrate. Selecting a display area, and an initial screen for inputting a selection input area for selecting a selection information of the selection circle is displayed on the display unit; and selecting an information input step by using an operation unit of the GUI device to select an input area of the initial screen Entering selection information about the selection circle; selecting a circle display step for displaying a selection circle on the display unit concentrically with the substrate shape by selecting the selection information input by the information input step; selecting the block display step The selection block selected based on the selection information is highlighted on the screen of the display unit; the exposure condition input display step is an exposure condition input area for inputting an exposure condition when performing exposure processing on the selected block. a screen displayed on the display unit; and an exposure condition input step by the operation unit in the exposure condition Enter the exposure conditions in the input area.

The tenth invention of claim 10 is the ninth invention, wherein the selecting information input step includes inputting information about the size of the selection circle as a step of selecting information about the selection circle. And the step of inputting information about the inner side or the outer side of the selection circle as a step of selecting information about the selection circle.

The eleventh invention of the eleventh invention is the tenth invention, wherein the selecting the information input step further comprises the step of inputting information about the selected width from the selection circle as the selection information about the selection circle.

According to a twelfth aspect of the invention, in the ninth aspect, the selection information input step further includes the step of inputting information on whether or not to select the block on the selection circle as the selection information on the selection circle.

According to a thirteenth aspect of the invention, the exposure condition input in the exposure condition input step is an exposure condition in which the size of the exposure pattern is changed.

According to a ninth aspect of the invention, the exposure condition input in the exposure condition input step is an exposure condition for selecting a standard exposure operation or a test exposure operation.

According to a fifteenth aspect of the invention, the recording medium is a computer readable by a GUI device for exposing a photoresist film formed on a surface of a circular substrate and exposing the film to a block unit, and recording A program for causing a computer to function as an initial screen display function, which is a screen of a display unit provided in a GUI device, and has a selection display area including a substrate shape and a plurality of blocks in which the substrate is divided, and for inputting about The initial screen of the selection input area of the selection information of the circle is displayed on the screen of the display unit, and the circular display function is selected, which is displayed on the screen of the display unit of the GUI device, and is selected concentrically with the shape of the substrate based on the selection information. The circle is displayed on the screen of the display unit; the block display function is selected on the screen of the display unit provided in the GUI device, and the selected block selected based on the selection information is highlighted on the display unit; and the exposure condition input display The function is a screen of the display unit provided in the GUI device, and is used to input an exposure bar when performing exposure processing on the selected block. The exposure condition input area of the device is displayed on the screen of the display unit.

According to a sixteenth aspect of the present invention, in the fifteenth aspect of the invention, the computer is configured to perform an initial screen display function of: displaying an input area for inputting information on a size of the selection circle as an input area for selecting information of the selection circle; The display is used to input information about the inside or the outside of the selection circle as an input area for selecting information about the selection circle.

According to a seventeenth aspect of the invention, in the sixteenth aspect of the invention, the computer is configured to display, in the selection input area, information for inputting a selection width with respect to the selection circle as an input area for selecting information of the selection circle.

According to a fifteenth aspect of the invention, in the fifteenth aspect of the invention, the computer is configured to: display the input area to display information about whether to select the block on the selection circle as the input area for the selection information of the selection circle; .

According to a fifteenth aspect of the invention, in the fifteenth aspect of the invention, the computer is configured to display an input region for inputting an exposure condition for changing the size of the exposure pattern in the exposure condition input region.

According to a twentieth aspect of the invention, the computer of the invention is characterized in that the computer is configured to display an input area for inputting an exposure condition for selecting a standard exposure operation or a test exposure operation in an exposure condition input area.

According to the invention of any one of claims 1 to 20, it is possible to provide a GUI device for an exposure apparatus which can preferably select a block which is arranged in a matrix on a circular substrate, and which can set an exposure condition, Exposure system, exposure condition setting method, and recording medium.

1‧‧‧Design data production device

2‧‧‧GUI device

3‧‧‧Image processing device

4‧‧‧Exposure system

5‧‧‧ computer

10‧‧‧stage

10a‧‧‧Part 1

10b‧‧‧Part 2

20‧‧‧stage moving mechanism

21‧‧‧Rotating mechanism

22‧‧‧Support board

23‧‧‧Sub Scanning Mechanism

23a‧‧‧Linear motor

23b‧‧‧rails

24‧‧‧floor

25‧‧‧Main scanning mechanism

25a‧‧‧linear motor

25b‧‧‧rail

30‧‧‧ position parameter measuring mechanism

31‧‧‧Laser light exit

32‧‧‧ Beam splitter

33‧‧‧beam bending machine

34‧‧‧1st interferometer

35‧‧‧2nd interferometer

50‧‧‧ Optical head

53‧‧‧Lighting optical system

54‧‧‧Laser oscillator

55‧‧‧Laser drive

60‧‧‧Aligning camera

70‧‧‧Control Department

71‧‧‧ computer

72‧‧‧ memory

73‧‧‧Raster Processing Department

75‧‧‧Data Generation Department

76‧‧‧Wiring pattern information

77‧‧‧Grating data

100‧‧‧Direct drawing device (exposure device)

101‧‧‧ ontology framework

102‧‧‧ Cover

110‧‧‧Substrate storage box

120‧‧‧Transfer robot

130‧‧‧Abutment

140‧‧‧ head support

141‧‧‧foot members

142‧‧‧ foot members

143‧‧ ‧ beam components

172‧‧‧ box

200‧‧‧Display Department

201‧‧‧Select display area

202‧‧‧Substrate shape

203‧‧‧ Block

204‧‧‧Selection circle

205‧‧‧Selection area

206‧‧‧Select block

210‧‧‧Select input area

211‧‧‧Radius input area

212‧‧‧Width selection check box

213‧‧‧Width input area

214‧‧‧Inside radio button

215‧‧‧Outside radio button

216‧‧‧Select check box on the circle

217‧‧‧Select button

220‧‧‧Exposure condition input area

220a‧‧‧Exposure condition input area

220b‧‧‧Exposure condition input area

221‧‧‧x size input area

222‧‧‧y size input area

223‧‧‧ radio button for standard pattern selection

224‧‧‧ Radio button for test pattern selection

230‧‧‧CPU

231‧‧‧ROM

232‧‧‧ memory

233‧‧‧Media Drive

234‧‧‧Operation Department

235‧‧‧ bus line

240‧‧‧Display Control Department

241‧‧‧Initial screen display

242‧‧‧Select the circular display

243‧‧‧Select block display

244‧‧‧Exposure condition input display section

400‧‧‧Graphic drawing system

511‧‧‧Space light modulator

512‧‧‧Light modulation unit

513‧‧‧Drawing Signal Processing Department

514‧‧‧Exposure Control Department

515‧‧‧Drawing Control Department

516‧‧‧Mirror

517‧‧‧Projection optical system

518‧‧‧ lens

519‧‧‧ lens

520‧‧‧ lens

521‧‧‧shading board

522‧‧‧ lens

523‧‧‧ zoom lens

524‧‧‧focus lens

530a‧‧‧ movable belt

531b‧‧‧Fixed tape

535‧‧‧ symbol

536‧‧‧Drive circuit unit

540‧‧ ‧ Telescope

541‧‧‧ Concentrating lens

542‧‧‧Attenuator

543‧‧ ‧focus lens

D0‧‧‧Design materials

D1‧‧‧ Revised design information

M‧‧ Record Media

N‧‧‧Network

P‧‧‧ program

S1~S5‧‧‧Steps

S10~S50‧‧‧Steps

S310‧‧‧Steps

S320~S324‧‧‧Steps

S330‧‧‧Steps

S340‧‧‧Steps

S350‧‧‧ steps

S360‧‧‧Steps

W‧‧‧Substrate

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Θ‧‧‧ direction

θ1‧‧‧Maximum angle

θ2‧‧‧Maximum angle

Figure 1 is a diagram showing a rendering system including an exposure system.

2 is a block diagram showing the hardware configuration of a GUI device.

Figure 3 is a block diagram showing the functional configuration of a GUI device.

Fig. 4 is a flow chart showing the overall flow of the change of the exposure conditions.

Fig. 5 is a flow chart showing the flow of exposure condition setting.

6(a) and 6(b) are diagrams for explaining an initial screen.

7(a) and 7(b) are diagrams for explaining a first embodiment of a GUI screen.

8(a) and 8(b) are diagrams for explaining an exposure condition input area.

9(a) and 9(b) are diagrams for explaining a second embodiment of the GUI screen.

10(a) and 10(b) are diagrams for explaining a third embodiment of the GUI screen.

11(a) and 11(b) are diagrams for explaining another example of the exposure condition input region.

12(a) and 12(b) are diagrams for explaining a fourth embodiment of the GUI screen.

Figure 13 is a side elevational view of the direct depiction device.

Figure 14 is a top plan view of the device directly depicted.

Fig. 15 is a view showing an illumination optical system and a projection optical system.

Figure 16 is a diagram showing an enlarged view of a spatial light modulator.

Fig. 17 is a block diagram showing the connection structure between the respective portions of the direct drawing device and the control unit.

Fig. 18 is a block diagram showing a control unit for controlling the drawing operation.

Figure 19 is a flow chart for directly depicting the actions of the device.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

<The overall composition of the system>

1 is a view showing a graphic drawing system 400 including an exposure system 4 according to an embodiment of the present invention. The pattern drawing system 400 is a system in which a pattern corresponding to a circuit pattern is directly drawn on a photoresist film by selectively exposing, for example, a photoresist film on a circular semiconductor substrate (hereinafter simply referred to as "substrate").

The graphic drawing system 400 includes a design data creating device 1, an image processing device 3, and a direct drawing device 100 that are connected to each other via a network N such as a LAN. The image processing device 3 includes a GUI device 2.

The design data creation device 1 describes a pattern area to be drawn on the object to be drawn. Equipment for the production and compilation of domain information. Specifically, the data is produced as graphic data described by CAD in a vector format. Hereinafter, this material is referred to as design data D0. The design data D0 created by the design data creation device 1 is transmitted to the image processing device 3 and the direct drawing device 100 via the network N.

The image processing device 3 corrects the design data D0 transmitted via the network N to create the corrected design data D1. The corrected design data D1 created by the image processing device 3 is transmitted to the direct drawing device 100 via the network N.

Specifically, the image processing apparatus 3 has a function of increasing the line width size of the circuit pattern to be exposed (drawn) in accordance with the change of the exposure condition (drawing condition) on the design material D0 (thickening processing) The correction design data D1 is obtained by reducing the processing of the line width size (thinning processing). The thickening and thinning processing is performed in a plurality of block units that partition the inside of the substrate.

Further, the image processing apparatus 3 corrects the exposure conditions of the respective blocks of the design material D0. For example, when the design data D0 is a material for exposing a standard pattern to all the blocks, the function of correcting the design data D1 is obtained by correcting the data of the test pattern for the specific block exposure. Here, the "standard pattern" is a pattern for exposing a circuit pattern for forming a semiconductor element, and the "test pattern" is different from the "standard pattern" for exposing a circuit pattern for verification of, for example, a trial or a manufacturing process of a semiconductor element. The pattern.

<Configuration of GUI device>

The GUI device 2 is provided in the image processing device 3 and functions as a graphical user interface for the operator. 2 is a block diagram showing the hardware configuration of the GUI device 2.

The GUI device 2 is, for example, a computer 5, and includes a CPU 230, a ROM 231, a memory 232, a media drive 233, a display unit 200, an operation unit 234, and the like. The hard systems are electrically connected by bus bars 235, respectively.

The CPU 230 is based on a program stored in the ROM 231 (or read in by the media drive 233). The program P) controls the above hardware parts to realize the function of the computer 5 (GUI device 2). The program P can be read by the computer 5, and the computer 5 can be used for each function.

The ROM 231 is a memory device for storing a program P or a data necessary for the control of the GUI device 2 in advance.

The memory 232 is a memory device that can be read and written, and temporarily stores data generated by the arithmetic processing performed by the CPU 230. The memory 232 includes SRAM, DRAM, and the like.

The media drive 233 has a function of reading the information stored in the recording medium M. The recording medium M is a portable recording medium such as a CD-ROM, a DVD (Digital Versatile Disk), or a flexible disk. For example, when the recording medium M has the program P recorded in advance, the computer 5 reads the recording medium M through the media drive 233, thereby storing the program P in the ROM 231.

The display unit 200 includes a display such as a color LCD, and can display an image for GUI operation, various materials, an operation state, and the like on the screen.

The operation unit 234 is provided with a keyboard and a mouse input device, and accepts user operations such as input of commands or various materials. Using the operation unit 234, the operator inputs various information to the GUI operation screen displayed on the display unit 200, and operates the screen of the display unit 200.

FIG. 3 is a block diagram showing the functional configuration of the GUI device 2. FIG. 3 is a block diagram showing the hardware configuration of the GUI device 2 by the program P shown in FIG. 2, but the functional blocks can be implemented in various forms by a combination of hardware and software. .

As shown in FIG. 3, the GUI device 2 includes a display control unit 240. The display control unit 240 controls the screen display person of the display unit 200, and includes an initial screen display unit 241, a selection circle display unit 242, a selection block display unit 243, and an exposure condition input display unit 244. The display control unit 240 realizes the functions of the respective units by the operation of the operation unit 234 by the operator, and the details thereof will be described later in the description of the operation.

<Overall flow of exposure condition setting>

Fig. 4 is a flow chart showing the overall flow of the change of the exposure conditions. First, with the steps The test drawing step of S10 confirms whether or not the desired drawing process (exposure processing) can be performed based on the design material D0. In the test drawing step, the direct drawing device 100 draws a wiring pattern or the like on the resist film on the substrate based on the design data D0. The configuration and operation of the direct drawing device 100 will be described later.

Next, the resist layer remaining on the substrate after the substrate development process by the exposure process of the test drawing step is inspected in step S20, and it is confirmed whether or not the resist layer becomes a desired resist pattern. For example, if the film thickness of the photoresist film on the substrate before the exposure process is changed in the radial direction of the substrate as described above, the width of the resist pattern obtained by the development process after the exposure process is larger than the required size. Thin, or rough. If the etching step of the subsequent step is performed in this state, there is a problem that the line width of the wiring pattern on the substrate becomes thinner or thicker. In order to avoid this problem, if it is determined that the exposure condition must be changed, the process proceeds to the next step S30 (the case of Yes). When the desired resist pattern is obtained, since it is not necessary to change the exposure conditions, the process proceeds to step S50 (in the case of No).

In the exposure condition setting step of step S30, the block in the substrate on which the exposure condition must be changed is selected, and the exposure conditions of the selected block are set. The details of the exposure condition setting step will be described using FIG. 5.

Fig. 5 is a flow chart showing the flow of exposure condition setting. First, in the initial screen display step of step S310, the function of the initial screen display unit 241 (FIG. 3) of the display control unit 240 is displayed on the screen of the display unit 200 included in the GUI device 2, as shown in FIG. 6(a). The initial screen. The initial screen has a selection display area 201 and a selection input area 210. A substrate shape 202 and a plurality of blocks 203 that partition the substrate are displayed in the selection display area 201. The substrate outline 202 shows, for example, a substrate shape 202 having a circular shape corresponding to a diameter of 300 mm. The plurality of blocks 203 are displayed in a matrix shape by the row lines shown by the broken lines. The display form of the substrate and the display form of the block are not limited to the display form of FIG. 6(a), and may be other display forms that can be displayed in such a manner as to be visually recognized by the operator.

The display content in the selection input area 210 is shown in FIG. 6(b), and is saved in FIG. 6(a). slightly. The selection input area 210 has a radius input area 211, a width selection check box 212, a width input area 213, an inner radio button 214, an outer radio button 215, a round selection check box 216, and a selection button 217. Further, the display content in the selection input area 210 is not limited to the display form shown in FIG. 6(b), and may be other display forms.

The radius input area 211 is for inputting a selection information about a selection circle to be described later, for example, information on the size of the selection circle, that is, an area in which the radius size value of the circle is selected. The information about the size of the selection circle may not be a radius size value, and may be, for example, a diameter value of a circle to be selected. The width selection check box 212 is used to input whether or not to perform a self-selection circle to select a block of a specific range as an operation area for selecting information. The width input area 213 is used to input the area of the size value of the selected width when the width selection check box 212 is selected as the selection information. The inner radio button 214 is for selecting an input area of the block displayed on the inner side of the selection circle. The outer radio button 215 is for selecting an input area of the block displayed on the outer side of the selection circle. The round selection check box 216 is used to input whether or not to select the area of the block on the circle. The selection button 217 is for selecting an input portion that determines the block that is selected and emphasized to be displayed as the block for setting the exposure condition.

Returning to FIG. 5, the selection information input step of the next step S320 will be described. The selection information input step has a selection circle radius input step (step S321), a selection circle inside and outside input step (step S322), a selection width input step (step S323), and a selection step on the selection circle (step S324). Further, the step of selecting the width input step (step S323) and the input step of the selection circle (step S324) are also omitted without being executed. The selection information input step (step S320), the subsequent selection circle display step (step S330), and the selected block display step (step S340) will be described with reference to FIG.

<First Embodiment>

Fig. 7 shows a first embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. Fig. 7(b) shows the state of the selection input area 210 of the first embodiment. As shown in FIG. 7(b), in the first embodiment, the operator uses the operation unit 234 to select the information input step. (Step S320) The radius inputting step is input (step S321), and "120" is input to the radius input area 211. Further, the operator uses the operation unit 234 to select the inner radio button 214 in the input/outer selection step (step S322).

Next, the operator uses the operation unit 234 to select the width selection check box 212 in the input width selection step (step S323), and inputs "80" in the width input area 213. Further, in the first embodiment, the input step on the selection circle is not executed (step S324), and the check box 216 is not selected on the circle and is not checked.

As a result of such an operation of inputting selection information by the operator, the display state of the selection display area 201 shown in Fig. 7(a) is realized. Specifically, in the selection circle display step (step S330), the selection circle 204 having a radius corresponding to 120 mm is displayed concentrically with the substrate outer shape 202 by the function of the selection circle display portion 242 (FIG. 3) on the initial screen. Further, in the selection block display step (step S340), by selecting the function of the block display portion 243 (FIG. 3), the plurality of selection blocks 206 displayed in the range corresponding to 80 mm from the inner side of the selection circle 204 are emphasized. And it is displayed on the screen. The selection block 206 is provided with parallel oblique lines (hatched lines) in the illustration, and its overall outer frame is represented in bold, for example, in a conspicuous color such as yellow or red different from the unselected block 203. As a technique for emphasizing the display selection block 206, other techniques may be used as long as the visual difference from the unselected block 203 is displayed.

According to the first embodiment described above, since a plurality of selection blocks 206 (selection regions 205) arranged concentrically with the substrate can be selected by the one-time selection information input step S320, the operability is preferable. In the present specification, a partial region of the selection display region 201 displayed by the set of the plurality of selection blocks 206 is referred to as a selection region 205. As a technique different from that of the first embodiment, a technique may be considered in which, for example, the operator displays a rectangular area on the operation screen by dragging the pointer of the mouse, and selects a plurality of blocks 203 displayed on the operation screen. At least one block 203 included in the rectangular area is used as the selection block 206. However, when the technique selects the selection region 205 shown in FIG. 7(a), it is necessary to It is necessary to divide the selection area 205 into at least four rectangular areas and to select the complicated operation of each rectangular area by the mouse, and the operability is poor. Further, in the technique of the first embodiment, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selection block 206 is emphasized, the visibility of the operator can be improved, and the operator can easily judge whether or not the selected block is a desired block for which the exposure condition should be set.

When the operator determines that the selection block 206 is a block in which the exposure condition is to be set, the operator uses the operation unit 234 to perform the operation of pressing the selection button 217 shown in FIG. 7(b), and transitions to the map. The exposure condition shown in 5 is input to the display step (step S350). In the exposure condition input display step, the exposure condition input display unit 244 (FIG. 3) functions, for example, the exposure condition input area 220a shown in FIG. 8 is displayed on the screen of the display unit 200. Further, when the operator judges that the selection block 206 is not the desired block, the above steps S321 to S340 are repeated until the desired block is selected.

The exposure condition input area 220a is an area for inputting exposure conditions for performing exposure processing on the selection block 206, for example, an input area for inputting exposure conditions regarding the size change of the exposure pattern to be exposed. For example, the exposure condition input region 220a is for increasing the size (thickness) of the line width of the wiring pattern or the like in the x-direction and the y-direction orthogonal to each other, as shown in FIG. 8(b). There is an x size input area 221 and a y size input area 222. Further, the exposure condition input region 220a may be an area for inputting a size (thinning size) which reduces the line width of the wiring pattern or the like to be exposed. Further, the display form of the exposure condition input area 220a is not limited to the display form shown in FIG. 8(b), and may be other display forms.

Returning to FIG. 5, in the exposure condition inputting step (step S360), the operator inputs the numerical value (for example, 7) in the range of, for example, 5 to 10 in the x-size input area 221 using the operation unit 234, in the y-size input area. 222 does not enter anything. By this input operation, as the thickened dimension in the x direction, for example, 7 μm is input. Contrary to the input example, there is also a y rule The inch input area 222 inputs a value instead of the case where the value is input in the x size input area 221 or a case where the value is input in the areas 221, 222 of both. When the exposure condition input step (step S360) is completed, the exposure condition setting step (step S30) shown in Fig. 4 is completed, and the transition to the next exposure condition changing step (step S40) is made.

Returning to FIG. 4, in the exposure condition changing step (step S40), the drawing conditions (exposure conditions) of the wiring pattern or the like to be drawn in the selection block 206 are changed. Specifically, the image processing device 3 (FIG. 1) corrects the design data D0 based on, for example, the thickened size value input by the exposure condition input step (step S360), and creates the corrected design data D1.

For example, the line width data of the design material D0 corresponding to the selection block 206 is changed so as to be 7 μm thick in the x direction to create the corrected design data D1. In addition, there are cases where the data is changed in such a manner that the y direction becomes thicker or the data is changed in a thinner manner. Further, the design data D0 may not be changed, but the RIP data (serial length data) obtained by the design data RIP expansion may be subjected to a roughening or thinning change process.

The corrected design data D1 created by the image processing apparatus 3 is transmitted to the direct drawing apparatus 100 via the network N. The direct drawing device 100 executes a drawing operation based on the corrected design data D1 (step S50 of FIG. 4). In the drawing operation, a drawing operation in which, for example, the line width is increased by 7 μm in the x direction is performed in a region in the substrate corresponding to the selection block 206. As a result, it is possible to eliminate the problem that the width dimension of the resist pattern after the development process as described above is reduced in the drawing operation of the design data D0, and to form the resist pattern in the desired width dimension. Further, when the design data D1 is corrected to be the data of the thinning processing, the drawing operation by thinning the direct drawing device is performed. Further, the width of the resist pattern after the development process may be made thicker or thinner, and the width of the wiring pattern obtained by the etching process may be made thicker or thinner. Correct design data D1.

<Second embodiment>

Next, a second embodiment of the embodiment will be described with reference to Fig. 9 . Figure 9 shows the display in the display The second embodiment, which is one of the embodiments of the GUI screen of the screen of the display unit 200. Fig. 9(b) shows the state of the selection input area 210 of the second embodiment. As shown in FIG. 9(b), in the second embodiment, the operator uses the operation unit 234 to input a radius input step (step S321) in the selection information input step (step S320), in the radius input area 211. Enter "40". Further, the operator uses the operation unit 234 to select the outer radio button 215 in the input/output step (step S322).

Next, the operator uses the operation unit 234 to select the width selection check box 212 in the input width selection step (step S323), and inputs "100" in the width input area. Further, in the second embodiment, the input step on the selection circle is not executed (step S324), and the check box 216 is not selected on the circle and is not checked.

As a result of such an input operation by the operator, the display state of the selection display area 201 shown in Fig. 9(a) is realized. Specifically, in the selection circle display step (step S330), the selection circle 204 having a radius corresponding to 40 mm is displayed concentrically with the substrate outer shape 202 by the function of the selection circle display portion 242 (FIG. 3) on the initial screen. Further, in the selection block display step (step S340), by selecting the function of the block display portion 243 (Fig. 3), the plurality of selection blocks 206 displayed from the selection circle 204 to the outside within a range corresponding to 100 mm ( The selection area 205) is highlighted on the screen.

According to the second embodiment described above, since the plurality of selection blocks 206 (selection regions 205) arranged concentrically with the substrate can be selected by the one-time selection information input step S320, the operability is better. As a technique different from the second embodiment, a technique may be considered in which, for example, the operator displays a rectangular area on the operation screen by dragging the pointer of the mouse, and selects a plurality of blocks 203 displayed on the operation screen. At least one block 203 included in the rectangular area is used as the selection block 206. However, when the selection region 205 shown in FIG. 9(a) is set by the technique, it is necessary to divide the selection region 205 into at least six rectangular regions and operate by the mouse to select the complicated operation of each rectangular region. Poor sex. Further, in the technique of the second embodiment, the selection of the concentric shape of the substrate shape 202 is used. Since the circle 204 is provided, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selection block 206 is emphasized, the visibility of the operator can be improved, and the operator can easily judge whether the selected block is a desired block for which the exposure condition should be set.

<Third embodiment>

Next, a third embodiment of the embodiment will be described with reference to Figs. 10 and 11 . Fig. 10 shows a third embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. Fig. 10 (b) shows the state of the selection input area 210 of the third embodiment. As shown in FIG. 10(b), in the third embodiment, the operator uses the operation unit 234 to select a radius input step (step S321) in the selection information input step (step S320), in the radius input area 211. Enter "150". Further, the operator uses the operation unit 234 to select the inner radio button 214 in the input/outer selection step (step S322).

In the third embodiment, the input width selection step (step S323) is not performed, the width selection check box 212 is not checked, and no content is input in the width input area 213. Further, the input step on the selection circle is not executed (step S324), and the check box 216 on the circle is not checked.

As a result of such an input operation by the operator, the display state of the selection display area 201 shown in Fig. 10(a) is realized. Specifically, in the selection circle display step (step S330), the selection circle 204 having a radius corresponding to 150 mm is displayed concentrically with the substrate outer shape 202 by the function of the selection circle display portion 242 (FIG. 3) on the initial screen. In the third embodiment, since the size of the substrate outer shape 202 is the same as the size of the selection circle 204, the substrate outer shape 202 and the selection circle 204 are superimposed and displayed. Further, in the selection block display step (step S340), the function of the selected block display unit 243 (FIG. 3) emphasizes the plurality of selection blocks 206 (selection regions 205) located on the inner side of the selection circle 204 and is displayed on Picture.

In the third embodiment, the block 203 completely inside the substrate outer shape 202 is used as the selection block 206, and the block 203 located on the line of the substrate outer shape 202 is not located at the base. A block 203 on the outer side of the board profile 202 serves as the selection block 206.

According to the third embodiment described above, since the plurality of selection blocks 206 (selection regions 205) arranged concentrically with the substrate can be selected by the one-time selection information input step S320, the operability is better. As a technique different from the third embodiment, a technique may be considered in which, for example, the operator displays a rectangular area on the operation screen by dragging the pointer of the mouse, and selects a plurality of blocks 203 displayed on the operation screen. At least one block 203 included in the rectangular area is used as the selection block 206. However, when the selection region 205 shown in FIG. 10(a) is set by the technique, it is necessary to divide the selection region 205 into at least five rectangular regions and operate by the mouse to select the complicated operation of each rectangular region. Poor sex. Further, in the technique of the third embodiment, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selection block 206 is emphasized, the visibility of the operator can be improved, and the operator can easily judge whether the selected block is a desired block for which the exposure condition should be set.

In the third embodiment, since the block 203 completely included in the inner side of the substrate outer shape 202 can be selected as the selection block 206, it can be preferably used in the case of setting exposure conditions for the blocks completely contained in the substrate.

Next, when the operator performs the operation of pressing the selection button 217 shown in FIG. 10(b) using the operation unit 234, the operation transitions to the exposure condition input display step shown in FIG. 5 (step S350). In the exposure condition input display step, the exposure condition input display unit 244 (FIG. 3) functions, for example, the exposure condition input region 220b shown in FIG. 11 is displayed on the display unit 200. Further, it is set in advance by the setting unit (not shown) whether the content displayed by pressing the selection button 217 is the exposure condition input region 220a shown in FIG. 8 as in the first embodiment, or is the third embodiment. The exposure condition input area 220b is generally set.

The exposure condition input area 220b shown in FIG. 11 is used to select an area in which the standard exposure operation or the test exposure operation is performed on the selection block 206, as shown in FIG. 11(b). There are a radio button 223 for standard pattern selection and a radio button 224 for test pattern selection. The state of the radio button 223 for selecting the standard pattern selection is displayed in Fig. 11 (b). Here, the "standard pattern" is an original wiring pattern or the like of a semiconductor wafer to be manufactured. Further, the "test pattern" is a wiring pattern used for an exposure operation or a verification of a test wafer. The display form of the exposure condition input area 220b is not limited to the display form shown in FIG. 11(b), and may be other display forms.

In the third embodiment, in the exposure condition input step (step S360) shown in FIG. 5, the operator selects the radio button 223 for standard pattern selection shown in FIG. 11(b) using the operation unit 234. Then, in the exposure condition changing step (step S40) of FIG. 4, the drawing conditions (exposure conditions) of the wiring pattern or the like to be drawn in the selection block 206 are changed. Specifically, since the exposure operation by the standard pattern is selected in the exposure condition input step (step S360), in the exposure condition changing step (step S40), by the image processing device 3 (FIG. 1), The selection block 206 performs the standard exposure operation by the standard pattern to change the design material D0 to create the corrected design data D1.

The corrected design data D1 created by the image processing apparatus 3 is transmitted to the direct drawing apparatus 100 via the network N. The direct drawing device 100 performs a drawing operation based on the corrected design data D1 (step 50 of FIG. 4). In the drawing operation, a standard exposure operation for drawing a standard pattern is performed in a region in the substrate corresponding to the selection block 206.

<Fourth embodiment>

Next, a fourth embodiment of the embodiment will be described with reference to Fig. 12 . Fig. 12 shows a fourth embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. Fig. 12 (b) shows the state of the selection input area 210 of the fourth embodiment. As shown in FIG. 12(b), in the fourth embodiment, the operator uses the operation unit 234 to input a radius input step (step S321) in the selection information input step (step S320), in the radius input area 211. Enter "150". Further, the operator uses the operation unit 234 to select the outer radio button 215 in the input/output step (step S322).

Further, the operator uses the operation unit 234 to input the selection on the circle (step S324), and selects the round selection check box 216 to perform the check. In the third embodiment, the input width selection step (step S323) is not performed, the width selection check box 212 is not checked, and nothing is input in the width input area 213.

As a result of such an input operation by the operator, the display state of the selection display area 201 shown in Fig. 12(a) is realized. Specifically, in the selection circle display step (step S330), the selection circle 204 having a radius corresponding to 150 mm is displayed concentrically with the substrate outer shape 202 by the function of the selection circle display portion 242 (FIG. 3) on the initial screen. In the third embodiment, since the size of the substrate outer shape 202 is the same as the size of the selection circle 204, the substrate outer shape 202 and the selection circle 204 are superimposed and displayed. Moreover, in the selecting block display step (step S340), by the function of 243 (FIG. 3), a plurality of selection blocks 206 on the selection circle 204 and a plurality of selection areas on the outer side of the selection circle 204 are included. The selection area 205 of block 206 is highlighted on the screen.

In the fourth embodiment, the block 203 completely inside the substrate outer shape 202 is not used as the selection block 206, and the block 203 is separated by the substrate outer shape 202 (ie, located on the outer periphery of the substrate). The block 203 and the block 203 located further outside than the substrate profile 202 serve as the selection block 206.

According to the fourth embodiment described above, a plurality of selection blocks 206 arranged concentrically with the substrate can be selected by one selection information input step S320 (in other words, a plurality of selection blocks 206 disposed on the outer periphery of the substrate) And the plurality of selection blocks 206 (selection regions 205) disposed on the outer side of the substrate outer shape 202 are better, and therefore the operability is better. As a technique different from the fourth embodiment, a technique may be considered in which, for example, the operator displays a rectangular area on the operation screen by dragging the pointer of the mouse, and selects a plurality of blocks 203 displayed on the operation screen. At least one block 203 included in the rectangular area is used as the selection block 206. However, when the selection region 205 shown in FIG. 12(a) is set by the technique, it is necessary to divide the selection region 205 into at least eight rectangular regions and select each by the mouse. The complicated operation of the rectangular area, and the operability is not good. Further, in the technique of the fourth embodiment, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selection block 206 is emphasized, the visibility of the operator can be improved, and the operator can easily judge whether the selected block is a desired block for which the exposure condition should be set.

In the fourth embodiment, since the plurality of blocks 203 disposed on the outer periphery of the substrate are selected as the selection block 206 instead of the block 203 completely included in the inner side of the substrate outer shape 202, the plurality of blocks 203 may be selected as the selection block 206. Preferably, it is used in the case where exposure conditions are set for a portion of the periphery of the substrate partially contained in the substrate.

Next, when the operator performs the operation of pressing the selection button 217 shown in FIG. 12(b) using the operation unit 234, the operation transitions to the exposure condition input display step shown in FIG. 5 (step S350). In the exposure condition input display step, the exposure condition input display unit 244 (FIG. 3) functions, for example, the exposure condition input region 220b shown in FIG. 11 is displayed on the display unit 200.

In the fourth embodiment, in the exposure condition input step (step S360) shown in FIG. 5, the operator selects the radio button 224 for test pattern selection shown in FIG. 11(b) using the operation unit 234. Then, in the exposure condition changing step (step S40) of FIG. 4, the drawing conditions (exposure conditions) of the wiring pattern or the like to be drawn in the selection block 206 are changed. Specifically, since the exposure operation by the test pattern is selected in the exposure condition input step (step S360), in the exposure condition changing step (step S40), by the image processing device 3 (FIG. 1), The selection block 206 performs the test exposure operation by the test pattern to change the design data D0 to create the corrected design data D1.

The corrected design data D1 created by the image processing apparatus 3 is transmitted to the direct drawing apparatus 100 via the network N. The direct drawing device 100 performs a drawing operation based on the corrected design data D1 (step 50 of FIG. 4). In the drawing operation, a test exposure operation of drawing a test pattern is performed in a region in the substrate corresponding to the selection block 206. Selected block outside the substrate The test exposure operation is also performed without causing a particular problem. It is better to say that the exposure operation performed from outside the substrate has an effect of stabilizing the exposure operation in the substrate.

The first embodiment and the second embodiment are executed after the test drawing step (step S10) shown in FIG. 4, but the third embodiment is executed after the test drawing step (step S10) shown in FIG. The case of the fourth embodiment. For example, the third embodiment or the fourth embodiment can be executed in the initial setting operation of the exposure operation of the direct drawing device 100.

Further, after the exposure condition setting steps (step S30 of FIG. 4) of the third embodiment and the fourth embodiment are executed, the exposure condition changing steps (step S40) of the third embodiment and the fourth embodiment can be executed. In this case, in the drawing execution step (step S50), a standard exposure operation is performed on the block completely contained in the substrate, and a test exposure operation is performed on the block located on the outer edge of the substrate and partially contained in the substrate.

<Composition of direct drawing device>

Next, the configuration of the direct drawing device 100 will be described with reference to FIGS. 13 and 14. Figure 13 is a side view of the direct drawing device 100 according to an embodiment of the present invention, and Figure 14 is a plan view of the direct drawing device 100 shown in Figure 13.

The direct drawing device 100 is a device that scans a spatially modulated light beam on a surface of a substrate W such as a semiconductor substrate or a glass substrate to which a photoresist film (photosensitive material) is applied, and draws an exposure pattern. Specifically, it is a device for forming a wiring pattern having a photosensitive resist film formed on the surface of a support substrate (hereinafter simply referred to as "substrate") W which is an exposure target substrate in the manufacturing process of the multi-wafer module. . The substrate W has a circular shape, and a notch called a groove is formed in one of the outer peripheral edges thereof. There is also a case where an orientation flat is provided instead of the groove at one of the outer circumferences of the substrate W. Further, the direct drawing device 100 is an exposure device that performs exposure processing on a block unit in which the substrate W is divided.

As shown in FIGS. 13 and 14, the direct drawing device 100 mainly includes a stage 10 that holds the substrate W, a stage moving mechanism 20 that moves the stage 10, and a position parameter measuring mechanism 30 that measures Positional parameter corresponding to the position of the stage 10; the optical head 50, It is irradiated with pulsed light on the surface of the substrate W; one alignment camera 60; and a control unit 70.

Further, in the direct drawing device 100, the main body portion is configured by arranging the respective portions of the device inside the main body formed by attaching the cover 102 to the main body frame 101, and is outside the main body portion (in the present embodiment, as shown in FIG. The substrate storage case 110 is disposed on the right hand side of the main body portion. In the substrate storage case 110, an unprocessed substrate W to be subjected to exposure processing is housed, and is loaded onto the main body portion by a transfer robot 120 disposed inside the main body. After the exposure processing (pattern drawing processing) is performed on the unprocessed substrate W, the substrate W is unloaded from the main body portion by the transfer robot 120 and returned to the substrate storage case 110. In this way, the transport robot 120 functions as a transport unit.

In the main body portion, as shown in FIG. 14, a transfer robot 120 is disposed at a right-hand end portion of the inside of the main body surrounded by the outer cover 102. Further, a base 130 is disposed on the left-hand side of the transport robot 120. One end side region (the right-hand side region of FIGS. 13 and 14) of the base 130 serves as a substrate transfer region for transferring the substrate W to and from the transfer robot 120, and the other end side region (FIG. 13 and FIG. 14). The left-hand side region is a pattern drawing region for patterning the substrate W. A head supporting portion 140 is provided on the base 130 at a boundary position between the substrate transfer region and the pattern drawing region. In the head supporting portion 140, as shown in FIG. 13, two leg members 141, 142 are erected upward from the base 130, and a beam member is horizontally disposed so as to bridge the top of the leg members 141, 142. 143. Further, as shown in FIG. 13, an alignment camera (image pickup unit) 60 is fixed to the side opposite to the pattern drawing region side of the beam member 143, and can be image-held and held on the surface of the substrate W of the stage 10 as described later (depicted) a plurality of alignment marks or lower patterns on the surface, the exposed surface).

The stage 10, which is a support portion for supporting the substrate W, is moved on the base 130 by the stage moving mechanism 20 in the X direction, the Y direction, and the θ direction. In other words, the stage moving mechanism 20 positions the stage 10 in two dimensions in the horizontal plane, and rotates around the θ axis (vertical axis) to adjust the relative angle with respect to the optical head 50 to be described later.

Further, the head support portion 140 configured as described above is freely movable in the vertical direction An optical head 50 is mounted. As described above, the alignment camera 60 and the optical head 50 are attached to the head supporting portion 140, and the positional relationship between the two is fixed in the XY plane. Further, the optical head unit 50 is formed by patterning the substrate W, and is moved in the vertical direction by a head moving mechanism (not shown). Further, by operating the head moving mechanism, the optical head 50 is moved in the vertical direction, whereby the distance between the optical head 50 and the substrate W held by the stage 10 can be adjusted with high precision. In this manner, the optical head 50 functions as a drawing head.

Further, at the end portion of the base 130 on the opposite side to the substrate (the left-hand end portion of FIGS. 13 and 14), two leg members 141 and 142 are erected. Further, a case 172 in which the optical member of the optical head 50 is housed is provided so that the beam member 143 and the two leg members 141 and 142 are bridged at the top, and the pattern drawing region of the base 130 is covered from above.

The stage 10 has a cylindrical outer shape and is a holding portion for holding the substrate W on the upper surface thereof in a horizontal posture. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. Therefore, when the substrate W is placed on the stage 10, the substrate W is adsorbed and fixed to the upper surface of the stage 10 by the suction pressure of the plurality of suction holes. In the present embodiment, a photoresist (photosensitive material) film is formed in advance by a spin coating method (rotary coating method) or the like on the surface (main surface) of the substrate W to be subjected to the drawing process.

The stage moving mechanism 20 is for positioning the stage 10 with respect to the base 130 of the direct drawing device 100 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (around the Z-axis). The direction of rotation) the mechanism of movement. The stage moving mechanism 20 has a rotating mechanism 21 that rotates the stage 10, a support plate 22 that supports the stage 10 to be rotatable, and a sub-scanning mechanism 23 that supports the support plate 22 The scanning direction is moved; the bottom plate 24 supports the support plate 22 via the sub-scanning mechanism 23; and the main scanning mechanism 25 moves the bottom plate 24 in the main scanning direction.

The rotation mechanism 21 has a motor which is constituted by a rotor attached to the inside of the stage 10. Further, a rotary bearing mechanism is provided between the lower surface side of the central portion of the stage 10 and the support plate 22. Therefore, when the motor is operated, the rotor moves in the θ direction, and the stage 10 The rotating shaft of the rotary bearing mechanism rotates centering on a specific angle.

The sub-scanning mechanism 23 has a linear motor 23a which generates a thrust force in the sub-scanning direction by a mover attached to the lower surface of the support plate 22 and a stator attached to the upper surface of the bottom plate 24. Further, the sub-scanning mechanism 23 has a pair of guide rails 23b that guide the support plate 22 in the sub-scanning direction with respect to the bottom plate 24. Therefore, when the linear motor 23a is operated, the support plate 22 and the stage 10 move in the sub-scanning direction along the guide rail 23b on the bottom plate 24.

The main scanning mechanism 25 has a linear motor 25a which generates a thrust force in the main scanning direction by a mover attached to the lower surface of the bottom plate 24 and a stator attached to the upper surface of the head support portion 140. Further, the main scanning mechanism 25 has a pair of guide rails 25b that guide the bottom plate 24 in the main scanning direction with respect to the head support portion 140. Therefore, when the linear motor 25a is operated, the bottom plate 24, the support plate 22, and the stage 10 are moved in the main scanning direction along the guide rail 25b on the base 130. Further, as such a stage moving mechanism 20, an X-Y-θ axis moving mechanism which has been used in a large amount since the prior art can be used.

The position parameter measuring mechanism 30 is a mechanism for measuring the positional parameter of the stage 10 by the interference of the laser light. The position parameter measuring mechanism 30 mainly includes a laser light emitting unit 31, a beam splitter 32, a beam bending machine 33, a first interferometer 34, and a second interferometer 35.

The laser light emitting portion 31 is a light source device for emitting laser light for measurement. The laser light emitting portion 31 is provided at a fixed position, that is, a position fixed to the base 130 or the optical head 50 of the device. The laser light emitted from the laser light exiting portion 31 is first incident on the beam splitter 32, and branched into the first branched light from the beam splitter 32 toward the beam bending machine 33, and from the beam splitter 32 toward the second interferometer 35. The second branch light.

The first branched light system is reflected by the beam bending machine 33 and enters the first interferometer 34, and is irradiated from the first interferometer 34 to the first portion of the end side of the -Y side of the stage 10 (here - The central portion of the end side of the Y side) 10a. Then, the first branched light system reflected in the first portion 10a is incident on the first interferometer 34 again. The first interferometer 34 measures the first portion of the stage 10 based on the interference between the first branched light that is directed toward the stage 10 and the first branched light that is reflected from the stage 10 . The position parameter corresponding to the position of 10a.

On the other hand, the second branch light is incident on the second interferometer 35, and is irradiated from the second interferometer 35 to the second portion (the portion different from the first portion 10a) on the side of the -Y side of the stage 10. ) 10b. Further, the second branched light system reflected in the second portion 10b is again incident on the second interferometer 35. The second interferometer 35 measures the positional parameter corresponding to the position of the second portion 10b of the stage 10 based on the interference between the second branched light that is directed toward the stage 10 and the second branched light that is reflected from the stage 10. The first interferometer 34 and the second interferometer 35 transmit the positional parameters obtained by the respective measurements to the control unit 70.

The optical head 50 is a light irradiation unit that irradiates the surface of the substrate W held on the stage 10 with pulsed light. The optical head 50 has a beam member 143 that is mounted on the base 130 so as to straddle the stage 10 and the stage moving mechanism 20, and an optical head 50 that is disposed on the beam member 143. In the approximate center of the sub-scanning direction. The optical head 50 is connected to one laser oscillator 54 via an illumination optical system 53. Further, a laser drive unit 55 that drives the laser oscillator 54 is connected to the laser oscillator 54, which is a light source. When the laser driving unit 55 is operated, pulsed light is emitted from the laser oscillator 54, and the pulsed light is introduced into the optical head 50 via the illumination optical system 53.

Inside the optical head 50, pulse light is introduced from the illumination optical system 53 to the inside of the optical head 50 by the introduction portion, and the introduced pulse light is irradiated to the substrate W as a light beam shaped into a specific pattern shape. On the surface, the photoresist film (photosensitive layer) on the substrate W is exposed, whereby a pattern is drawn on the surface of the substrate W.

In the direct drawing device 100 of FIG. 13, a laser oscillator 54, which is a light source, is placed in the cartridge 172, and light from the laser oscillator 54 is introduced into the optical head 50 via the illumination optical system 53. On the main surface of the substrate W of the present embodiment, a photoresist (photosensitive material) film which is exposed by ultraviolet light is formed in advance, and the laser oscillator 54 emits ultraviolet rays (i-line) having a wavelength λ of about 365 nm. Laser source. Of course, the laser oscillator 54 may also be light of other wavelengths included in the wavelength band of the photosensitive material that emits the substrate W.

FIG. 15 is a view showing the illumination optical system 53 and the projection optical system 517 of the direct drawing device 100. The light from the laser oscillator 54 shown in FIG. 13 is irradiated to the spatial light modulator 511 of the light modulation unit 512 via the illumination optical system 53 and the mirror surface 516 shown in FIG. The light spatially modulated by the spatial light modulator 511 is irradiated onto the substrate W supported by the stage 10 via the projection optical system 517.

The illumination optical system 53 includes a telescope 540, a condensing lens 541, an attenuator 542, and a focus lens 543. The telescope 540 has a function of expanding the beam diameter (cross-sectional shape) of the light (laser beam) in the X and Z directions, and includes three lenses. The condenser lens 541 has a function of expanding the laser beam in the X direction. The attenuator 542 adjusts the energy (transmittance) of the laser beam passing therethrough. The focus lens 543 has a function of reducing the cross-sectional size of the laser beam in the Z direction. The light (laser beam) emitted from the self-focusing lens 543 is irradiated to the spatial light modulator 511 as illumination light that extends in the X direction and is reduced in the Y direction via the mirror surface 516. Further, the illumination optical system 53 does not have to be configured as shown in FIG. 15, and other optical elements may be added.

The light emitted from the illumination optical system 53 to the spatial light modulator 511 is such that the regular reflection light (zero-order light) reflected from the spatial light modulator 511 passes through the opening of the shielding plate 521 of the projection optical system to be described later, and The shielding plate 521 shields (±1) times of diffracted light generated from the spatial light modulator 511, preferably close to parallel light. Therefore, the number of openings NA1 of the illumination optical system 53 is set to be larger than 0 (zero), and 0.06 or less. Further, the number of openings NA1 is such that when the maximum angle of the YZ plane with respect to the optical axis of the illumination light is θ1, the linear illumination light extending in the X direction is passed through, and NA1=n. Sin θ1 is obtained. Here, n is the refractive index of the medium. In the case of the present embodiment, since the medium is air, the refractive index n is 1.

The projection optical system 517 includes four lenses 518, 519, 520, and 522, a shielding plate (aperture member) 521, a zoom lens 523, and a focus lens 524. The lenses 518, 519, 520, 522 and the shielding plate 521 of the projection optical system 517 are constructed as a schrieren optical system with discrete modulation conversion functions on both sides, and the light passing through the lens 520 is directed to the shielding plate having the opening. In 521, a part of the light (normal reflection light (zero-order light)) is introduced into the lens 522 through the opening, and the remaining light ((±1) times of the diffracted light) is shielded by the shielding plate 521. The light passing through the lens 522 is introduced into the zoom lens 523, and introduced into the photoresist film (photosensitive material) on the substrate W at a specific magnification via the focus lens 524. Further, the projection optical system 517 does not have to be configured as shown in FIG. 3, and other optical elements may be added.

In order to reduce the variation in the diameter (width) of the light irradiated onto the substrate W corresponding to the focus position (focal length position), the depth of the projection of the projection optical system 517 must be set to be long (deep). Therefore, the number of openings NA2 of the projection optical system 517 is preferably small, and is set to, for example, 0.1. Further, the number of openings NA2 is such that when the linear projection light extending in the X direction passes through and the maximum angle of the YZ plane with respect to the optical axis of the projection light is θ2, NA2=n. Sin θ2 is obtained. Here, n is the refractive index of the medium. In the case of the present embodiment, since the medium is air, the refractive index n is 1.

The value (σ value) obtained by dividing the aperture number NA1 of the illumination optical system 53 by the aperture number NA2 of the projection optical system 517 is as described above, in order to convert the regular reflection light reflected by the spatial light modulator 511 into a desired shape. The irradiation onto the substrate W is preferably close to 0, and is set to be, for example, greater than 0 and 0.6 or less.

A rendering control unit 515 that performs modulation control of the optical modulation unit 512 is electrically connected to the spatial light modulator 511. The drawing control unit 515 and the projection optical system 517 are built in the optical head unit 50. The drawing control unit 515 is electrically connected to the exposure control unit 514 and the drawing signal processing unit 513, respectively. The drawing control unit 514 is electrically connected to the drawing signal processing unit 513 and the stage moving mechanism 20. The exposure control unit 514 and the rendering signal processing unit 513 are provided in the control unit 70 of Fig. 13 .

Fig. 16 is a view showing an enlarged view of the spatial light modulator 511. The spatial light modulator 511 shown in Fig. 16 is manufactured by a semiconductor device manufacturing technique, and employs a diffraction lattice in which the depth of the crystal lattice can be changed. The plurality of movable belts 530a and the fixed belt 531b are alternately arranged in parallel with the spatial light modulator 511. As will be described later, the movable belt 530a can be aligned with respect to the reference plane on the back side. The lifting belt is moved up and down, and the fixing belt 531b is fixed with respect to the reference surface. As a spatial lattice modulator of a diffraction lattice type, for example, a GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, Calif.)) is known.

A fixed reflecting surface is provided on the upper surface of the fixing belt 531b, and a movable reflecting surface is provided on the upper surface of the movable belt 530a. The plurality of movable belts 530a and the fixed belt 531b are irradiated with light having a linear cross section in the arrangement direction. In the spatial light modulator 511, when one pair of strips is used as a lattice element, each of the adjacent movable strips 530a and 531b is drawn with a pattern of three or more lattice elements adjacent to each other. One pixel corresponds. In the present embodiment, the set of four lattice elements adjacent to each other is a modulation element corresponding to one pixel, and in FIG. 16, the set of the pair of modulation elements constituting one modulation element is marked with a symbol. The rectangle of 535 is surrounded by a rectangle.

The driver circuit unit 536 bends the movable belt 530a toward the reference surface side by applying a voltage (potential difference) between the movable belt 530a and the reference surface. As a result, the movable belt 530a moves up and down between the initial position separated from the reference surface and the position in contact with the reference surface, and sets the height position of the movable belt 530a.

The control unit 70 shown in FIG. 13 is an information processing unit that controls the operation of each unit in the direct drawing device 100 while performing various kinds of arithmetic processing. Fig. 17 is a block diagram showing the connection between the above-described respective units of the direct drawing device 100 and the control unit 70. As shown in FIG. 17, the control unit 70 is connected to the above-described rotating mechanism 21, linear motors 23a and 25a, laser light emitting unit 31, first interferometer 34, second interferometer 35, illumination optical system 53, and laser drive unit. 55. The projection optical system 517 and the alignment camera 60 are electrically connected. The control unit 70 is configured by, for example, a computer having a CPU or a memory, and causes the computer to operate in accordance with a program installed on the computer, thereby performing operation control of each of the above units.

Further, the control unit 70 configured as described above is configured to control the drawing operation. As shown in FIG. 18, the computer 71 as the control unit 70 includes a CPU, a memory 72, and the like, and is disposed in the electric device together with the exposure control unit 514. Inside the bracket (not shown). Figure 18 shows the control depiction action A block diagram of the control unit. The CPU in the computer 71 performs arithmetic processing in accordance with a specific program, thereby realizing the raster processing unit 73 and the data generating unit 75.

The data corresponding to the pattern of one semiconductor package is prepared in advance as the wiring pattern data 76 by the pattern data generated by the external CAD or the like, and is based on the wiring pattern data 76 and the data generating unit 75 as will be described later. The drawing pattern of the semiconductor package is generally drawn on the substrate W. Here, the computer 71 is responsible for the function of the drawing signal processing unit 513 shown in FIG. Further, the wiring pattern data 76 corresponds to the above-described design data D0 or corrected design data D1.

The raster processing unit 73 performs raster processing by dividing the unit area of the drawing data display generated by the data generating unit 75, and generates raster data 77 and stores it in the memory 72. The unprocessed substrate W is depicted after the preparation of the raster data 77 or in parallel with the preparation of the raster data 77.

On the other hand, the data generating unit 75 acquires the image data from the alignment camera 60, and generates the electrode connection data corresponding to the arrangement shift based on, for example, the detection result of the electrode pads already formed on the substrate W. On the other hand, when the data generation of one divided area is completed, the generated raster data 77 is sent to the exposure control unit 514.

The drawing data thus generated is transmitted from the data generating unit 75 to the exposure control unit 514, and the exposure control unit 514 controls each of the optical modulation unit 512 and the stage moving mechanism 20 to perform one-dimensional drawing. The control of the optical modulation unit 512 by the exposure control unit 514 is executed via the drawing control unit 515 as shown in FIG. 15 . Further, when the exposure recording for one strip is completed, the same processing is performed on the next divided region, and each is repeatedly drawn. In the present embodiment, the control unit of the present invention is realized by the control unit 70, the drawing control unit 515, the exposure control unit 514, the driver circuit unit 536, and the like.

Further, when the direct drawing device 100 is in the drawing operation for each piece, the light modulation unit 512 by the exposure control unit 514 is executed by the drawing control unit 515 shown in FIG. The control performs an exposure operation in units of blocks based on the exposure conditions set for each of the plurality of blocks 203 (FIG. 6(a)) of the partition substrate W. The exposure conditions are set by, for example, the first embodiment, the second embodiment, the third embodiment, or the fourth embodiment described above.

In the present embodiment, the computer 71 shown in Fig. 18 is provided in the direct drawing device 100. However, the computer 71 may be provided in the image processing device 3 shown in Fig. 1.

<Location control of the stage>

The direct drawing device 100 has a function of controlling the position of the stage 10 based on the respective measurement results of the first interferometer 34 and the second interferometer 35 described above. Hereinafter, the position control of the stage 10 will be described.

As described above, the first interferometer 34 and the second interferometer 35 measure positional parameters corresponding to the positions of the first portion 10a and the second portion 10b of the stage 10, respectively. The first interferometer 34 and the second interferometer 35 transmit the positional parameters obtained by the respective measurements to the control unit 70. As shown in FIG. 6, the control unit 70 has a computer 71 as a calculation unit. The function of the computer 71 is realized, for example, by causing the CPU of the computer 71 to operate according to a specific program.

On the other hand, the control unit 70 calculates the position (the position in the Y-axis direction and the rotation angle around the Z-axis) of the stage 10 based on the positional parameters transmitted from the first interferometer 34 and the second interferometer 35. Next, the control unit 70 operates the stage moving mechanism 20 with reference to the calculated position of the stage 10, thereby accurately controlling the position of the stage 10 or the moving speed of the stage 10. Here, the control unit 70 also corrects the inclination of the stage 10 (deviation of the rotation angle around the Z axis) accompanying the movement in the main scanning direction by rotating the stage 10 about the Z axis. Moreover, the control unit 70 operates the laser drive unit 55 while referring to the calculated position of the stage 10, thereby accurately controlling the irradiation position of the pulse light on the surface of the substrate W.

<Action of direct drawing device>

Next, an example of the operation of the above-described direct drawing device 100 will be described with reference to a flowchart of FIG.

When the processing of the substrate W is performed in the direct drawing device 100, first, adjustment is performed from The calibration of the position or amount of the pulsed light irradiated by the optical head 50 (step S1). In the calibration process, first, a CCD camera (not shown) is placed below the optical head 50 by moving the bottom plate 24. Then, while the CCD camera is moved in the sub-scanning direction, the pulsed light is irradiated from the optical head 50, and the pulsed light is irradiated by the CCD camera. The control unit 70 operates the illumination optical system 53 of the optical head 50 based on the acquired image data, thereby adjusting the position or amount of the pulsed light irradiated from the optical head 50.

When the calibration process is completed, the operator or the transfer robot 120 carries the substrate W and is placed on the upper surface of the stage 10 (step S2).

Next, the direct drawing device 100 performs an alignment process of adjusting the relative positions of the substrate W placed on the stage 10 and the optical head 50 (step S3). In the above-described step S2, the substrate W is placed at a substantially specific position on the stage 10, but it is often insufficient as a positional accuracy for drawing a fine pattern. Therefore, the position or inclination of the substrate W is finely adjusted by performing the alignment process, thereby improving the accuracy of the subsequent drawing process.

In the alignment process, first, the alignment marks formed at the four corners of the upper surface of the substrate W are respectively photographed by the alignment camera 60. The control unit 70 calculates the offset amount of the substrate W from the ideal position based on the position of each alignment mark in the image obtained by the alignment camera 60 (the positional shift amount in the X-axis direction and the Y-axis direction). The positional offset and the amount of tilt around the Z axis). Then, the position of the substrate W is corrected by causing the stage moving mechanism 20 to move in the direction of lowering the calculated offset amount.

Next, the direct drawing device 100 performs drawing processing on the substrate W after the alignment processing (step S4). In other words, the direct drawing device 100 irradiates the upper surface of the substrate W with the pulse light from the optical head 50 while moving the stage 10 in the main scanning direction and the sub-scanning direction, whereby the substrate W is applied to the upper surface of the substrate W. Each of the plurality of blocks within the inner section depicts a regular pattern.

When the drawing process is completed, the direct drawing device 100 causes the stage moving mechanism 20 to operate The stage 10 and the substrate W are moved to the carry-out position. Then, the operator or the transfer robot 120 carries out the substrate W from the upper surface of the stage 10 (step S5).

<Change implementation>

In the direct drawing device 100 of the above-described embodiment, the substrate W is moved relative to the optical head 50 or the like. However, the optical head 50 or the like can be moved relative to the solid-supported substrate W to achieve relative movement.

The exposure apparatus is not limited to the above-described direct drawing apparatus 100, and the present invention can be applied as long as it is an exposure apparatus that sets exposure conditions in a block unit in which the substrate W is divided. For example, it is also possible to reduce the projection to form a pattern on the reticle. Stepper motor (reduced projection type exposure device).

200‧‧‧Display Department

201‧‧‧Select display area

202‧‧‧Substrate shape

203‧‧‧ Block

204‧‧‧Selection circle

205‧‧‧Selection area

206‧‧‧Select block

210‧‧‧Select input area

211‧‧‧Radius input area

212‧‧‧Width selection check box

213‧‧‧Width input area

214‧‧‧Inside radio button

215‧‧‧Outside radio button

216‧‧‧Select check box on the circle

217‧‧‧Select button

Claims (20)

A GUI device for an exposure apparatus, which is characterized in that a photoresist film formed on a surface of a circular substrate is exposed to a block unit, and includes a display portion having a screen and an operation portion. a screen for operating the display unit; and a display control unit for controlling display of the screen of the display unit; and the display control unit includes: an initial screen display unit for selectively displaying a plurality of blocks including the outer shape of the substrate and the inner region of the substrate The area and the initial screen for inputting the selection input area for selecting the selection information of the selection circle are displayed on the display unit; and the selection circle display unit displays the selection circle concentrically with the substrate shape based on the selection information. a screen of the display unit; a selection block display unit for highlighting the selection block selected based on the selection information on the display unit; and an exposure condition input display unit for inputting the selection block The exposure condition input area of the exposure condition at the time of exposure processing is displayed on the screen of the display unit. A GUI device for an exposure apparatus according to claim 1, wherein the selection input area includes information for inputting the size of the selection circle as an input area for selecting information about the selection circle, and for inputting the inner side or the outer side of the selection circle. Information is used as an input area for selecting information about the selection of the circle. A GUI apparatus for an exposure apparatus of claim 2, wherein the selection input area includes information for inputting information about a selected width from the selection circle as an input area regarding selection information of the selection circle. A GUI device for an exposure apparatus of claim 1, wherein the selection input area includes a parameter for inputting whether to select a block on the selection circle. Information is used as an input area for selecting information about the selection of the circle. A GUI device for an exposure apparatus according to claim 1, wherein the exposure condition input area is for inputting an input area regarding exposure conditions of the size change of the exposure pattern. The GUI device for the exposure apparatus of claim 1, wherein the exposure condition input area is for inputting an input area for selecting a standard exposure action or an exposure condition for testing the exposure action. An exposure system comprising: a GUI device for an exposure apparatus according to any one of claims 1 to 6; and an exposure device for exposing the photoresist film formed on a surface of the circular substrate in block units deal with. An exposure system according to claim 7, wherein the exposure means is a direct drawing means for drawing an exposure pattern by scanning the spatially modulated light beam by the photoresist film. An exposure condition setting method includes: an initial screen display step of a display portion of a display portion of a GUI device, a selection display region having a plurality of blocks including an outer shape of the substrate and a region within the substrate; and The initial screen for inputting the selection input area for selecting the selection information of the circle is displayed on the screen of the display unit; and the information input step is selected by the operation unit of the GUI device, and the selection information about the selection circle is input in the selection input area of the initial screen. Selecting a circle display step for displaying a selection circle on the display portion concentrically with the substrate shape by selecting selection information input by the information input step; selecting a block display step, which is based on the above selection The selection block selected by the information emphasizes the screen displayed on the display unit; The exposure condition input display step is a screen for displaying an exposure condition input area for inputting an exposure condition for performing exposure processing on the selected block on the display portion; and an exposure condition input step of the exposure portion by the operation portion Enter the exposure conditions in the condition input area. The exposure condition setting method of claim 9, wherein the selecting the information input step includes the step of inputting information about the size of the selection circle as the selection information about the selection circle, and the information for inputting the inner side or the outer side of the selection circle as Steps to select the selection information for the circle. The exposure condition setting method of claim 10, wherein the selecting the information input step further comprises the step of inputting information about the selected width from the selection circle as the selection information about the selection circle. The exposure condition setting method of claim 9, wherein the selecting the information input step further comprises the step of inputting information about whether to select the block on the selection circle as the selection information about the selection circle. The exposure condition setting method of claim 9, wherein the exposure condition input in the exposure condition input step is an exposure condition in which the size of the exposure pattern is changed. The exposure condition setting method of claim 9, wherein the exposure condition input in the exposure condition input step is an exposure condition for selecting a standard exposure action or a test exposure action. A recording medium which is a computer readable person included in a GUI device for an exposure device which is formed by exposing a photoresist film formed on a surface of a circular substrate to a block unit, and which has a function of causing the computer to perform the following functions. Program: an initial screen display function, which is a screen of a display portion included in the GUI device, and has a selection display area including a plurality of blocks including the outer shape of the substrate and the inner portion of the substrate. The initial screen of the selection input area for inputting the selection information about the selection circle is displayed on the screen of the display unit; the circular display function is selected to be displayed on the screen of the display unit included in the GUI device, and the substrate is based on the selection information. The shape is concentrically displayed on the screen of the display unit in a concentric manner; the block display function is selected on the screen of the display unit included in the GUI device, and the selected block selected based on the selection information is highlighted on the display unit. The screen and the exposure condition input display function are displayed on the screen of the display unit included in the GUI device, and the exposure condition input area for inputting the exposure condition for performing the exposure processing on the selected block is displayed on the display unit. The recording medium of claim 15, wherein the program for causing the computer to perform the following functions is recorded: as the initial screen display function, in the selection input area, the information for inputting the size of the selection circle is input as the input of the selection information about the selection circle. The area, and the display are used to input information about the inside or the outside of the selection circle as an input area for the selection information about the selection circle. The recording medium of claim 16, wherein the program for causing the computer to perform the function of inputting information regarding the selected width from the selection circle as the input area regarding the selection information of the selection circle is recorded in the selection input area. The recording medium of claim 15 is characterized in that a program for causing the computer to perform the function of inputting information on whether to select a block on the selection circle as the input area regarding the selection information of the selection circle is displayed in the selection input area. The recording medium of claim 15 wherein A program for causing the computer to perform the function of inputting an input area for inputting an exposure condition regarding a change in the size of the exposure pattern is displayed in the exposure condition input area. The recording medium of claim 15, wherein the program for causing the computer to perform the function of inputting an input area for inputting an exposure condition for selecting a standard exposure action or a test exposure action is displayed in the exposure condition input area.