JP2020076899A - Inspection method of exposure device and exposure device - Google Patents

Abstract

To provide an inspection method of an exposure device which can accurately inspect exposure position accuracy of an exposure device with a comparatively simple method, and an exposure device.SOLUTION: An inspection method of an exposure device that is an inspection method of an exposure device which changes a relative position of an exposure head 10 and a stage 11, performs main scanning and sub scanning and thereby exposes an exposed material 12 includes: an arrangement step of arranging the exposed material 12 for inspection on the stage 11; an exposure step of making the relative position of the exposure head 10 and the stage 11 different and separately exposing a first scale pattern 30 and a second scale pattern 31; a development step of developing a latent image when the image formed on the exposed material 12 is the latent image; and a confirmation step of confirming position correlation of the first scale pattern 30 and the second scale pattern 31.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an exposure apparatus inspection method and an exposure apparatus for inspecting the exposure position accuracy of an exposure apparatus.

  In recent years, spatial modulation elements such as digital micromirror devices (DMDs) have become popular as image forming elements because of their high resolution and the ability to form fine patterns, and one example is as follows. An exposure apparatus having a spatial modulation element mounted on an exposure engine has already been put to practical use in the field of photolithography. This type of exposure apparatus is called a maskless exposure apparatus because it can directly form a circuit pattern of a semiconductor element, a liquid crystal display panel, a plasma display panel or the like on a photoresist without using a photomask. Further, in the photomask manufacturing process, pattern exposure is also performed by an exposure device.

  An exposure apparatus of this type is described in, for example, Japanese Patent Application Laid-Open No. 2004-284, and as shown in FIG. , A stage 11 onto which the output from the exposure head 10 is projected. The stage 11 is an xy table that is movable in x and y directions orthogonal to each other, and a substrate 12 as a material to be exposed having a photoresist layer laminated on the surface thereof is placed on the stage 11.

  The substrate 12 is driven by the stage 11 to repeat the main scanning (scan) in the y direction and the sub scanning (step) in the x direction, so that the entire surface is exposed and a predetermined pattern is formed. The exposure head 10 includes a single exposure head having one spatial modulation element (FIG. 14A) and a multiple exposure head having a plurality of spatial modulation elements arranged in the x direction (FIG. 14B). The two are the same in that the exposure area per scan is different, and both of them expose the entire surface of the substrate 12 by repeating main scanning (scanning) and sub-scanning (steps).

JP, 2007-73916, A

  The drive mechanism of the stage 11 is configured by using a ball screw, a guide rail, a motor and the like. Therefore, the exposure apparatus 1 inevitably contains mechanical errors of these elements. If this mechanical error exceeds an allowable value, the exposure position accuracy of the exposure device becomes poor, which causes a problem in product quality. Therefore, it is important for product quality control to regularly inspect the exposure position accuracy of the exposure apparatus.

  As one of the inspection methods, as shown in FIG. 15A, after a pattern of a predetermined shape is output so as to straddle the adjacent main scanning lines and exposed, the pattern is visualized by developing the substrate. There is a way to check. If the exposure position accuracy in the x direction (pitch accuracy in the sub-scanning direction) is poor, the pattern may be divided and formed (FIG. 6B), or a part of the pattern may be overlapped and narrowed. It Further, if the exposure position accuracy in the y direction (main scanning direction pitch accuracy or main scanning direction feed accuracy) is poor, the pattern is formed shifted in the y direction ((c) in the figure).

  However, these image distortions cannot be confirmed unless the location is specified and magnified and observed, but when magnified and observed, it becomes difficult to specify the location in the whole. On the contrary, if the enlargement ratio is lowered so as to make it easier to identify the whole part, the image distortion cannot be confirmed. Therefore, such an inspection method is time-consuming and inaccurate.

  Therefore, the present invention has been made in view of such circumstances, and it is an object of the present invention to provide an exposure apparatus inspection method and an exposure apparatus capable of accurately inspecting the exposure position accuracy of an exposure apparatus with a relatively simple method. And

An inspection method for an exposure apparatus according to the present invention is
A method for inspecting an exposure apparatus for exposing a material to be exposed by performing a main scan and a sub scan by changing a relative position of an exposure head and a stage,
An arranging step of arranging the exposed material for inspection on the stage,
An exposure step including exposing the first scale pattern and the second scale pattern separately, with different relative positions of the exposure head and the stage;
A visualizing step of visualizing the latent image when the image formed on the exposed material is a latent image,
And a confirmation step including confirmation of the positional correlation between the first scale pattern and the second scale pattern.

  According to this configuration, when the first scale pattern and the second scale pattern show the positional correlation that should be present in the confirmation step, the exposure position is changed in the two positional relations in which the relative positions of the exposure head and the stage are made different. If it is judged that the accuracy is good, and on the other hand, both scale patterns do not show the positional correlation that should be, the exposure position accuracy may not be good in the positional relationship before and after the relative positions of the exposure head and stage are made different. Judge that there is a property. Then, the exposure step accuracy of the exposure apparatus is inspected by performing the exposure step and the confirmation step at least on the entire exposed surface of the exposed material.

Here, as a first aspect of the inspection method of the exposure apparatus according to the present invention,
In the exposure step, the second scale pattern and the third scale pattern are exposed at the same time, and the first scale pattern and the fourth scale pattern are different from each other in the relative position of the exposure head and the stage in the sub-scanning direction. And exposing separately,
The confirmation step includes confirming each of the positional correlation between the first scale pattern and the second scale pattern, and the positional correlation between the third scale pattern and the fourth scale pattern,
A configuration for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus can be adopted.

Further, as a second aspect of the inspection method of the exposure apparatus according to the present invention,
In the exposure step, the first scale pattern and the second scale pattern are made to have different relative positions in the main scanning direction with respect to the exposure head and the stage, and then have different relative positions in the sub scanning direction with respect to the exposure head and the stage. Including exposing separately,
A configuration for inspecting the pitch accuracy in the main scanning direction of the exposure apparatus can be adopted.

Further, as a third aspect of the inspection method of the exposure apparatus according to the present invention,
In the exposure step, the second scale pattern and the third scale pattern are exposed at the same time, and the first scale pattern and the fourth scale pattern are different from each other when the relative position of the exposure head and the stage is different in the main scanning direction. And exposing separately,
The confirmation step includes confirming each of the positional correlation between the first scale pattern and the second scale pattern, and the positional correlation between the third scale pattern and the fourth scale pattern,
A configuration for inspecting the pitch accuracy in the main scanning direction of the exposure apparatus can be adopted.

As a fourth aspect of the inspection method of the exposure apparatus according to the present invention,
The exposing step includes exposing the first scale pattern while performing main scanning,
A configuration for inspecting the main scanning direction feed accuracy of the exposure apparatus can be adopted.

In these aspects,
The positional correlation may be based on the relationship between the main scale and the vernier scale.

  According to such a configuration, not only can the quality of the exposure position accuracy be confirmed, but also if the defect is defective, it can be quantitatively confirmed how bad the exposure position accuracy is. Can be inspected with high accuracy.

Further, the exposure apparatus according to the present invention,
Each scale pattern of the above inspection method is exposed.

  As described above, according to the inspection method of the exposure apparatus and the exposure apparatus of the present invention, the exposure position accuracy of the exposure apparatus can be accurately inspected by the relatively simple method of exposing the scale pattern.

FIG. 1 is an explanatory diagram of an exposure process of an inspection method A for inspecting the pitch accuracy in the sub-scanning direction of an exposure apparatus having a single exposure head. FIG. 2 is an explanatory diagram of a confirmation step of the inspection method A. FIG. 3 is an explanatory diagram of a confirmation process of the inspection method B for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus of the single exposure head. FIG. 4 is an explanatory diagram of the exposure process of the inspection method C for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus of the multi-exposure head. FIG. 5 is an explanatory diagram of a confirmation step of the inspection method C. FIG. 6 is an explanatory diagram of a confirmation step of the inspection method D for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus of the multi-exposure head. FIG. 7 is an explanatory diagram of the exposure step of the inspection method E for inspecting the pitch accuracy in the main scanning direction of each exposure apparatus of the single exposure head and the multiple exposure head. FIG. 8: is explanatory drawing of the confirmation process of the inspection method E. FIG. 9 is an explanatory diagram of the exposure process of the inspection method F for inspecting the pitch accuracy in the main scanning direction of each exposure device of the single exposure head and the multiple exposure head. FIG. 10 is an explanatory diagram of the exposure step of the inspection method G for inspecting the main-scanning direction feed accuracy of each exposure apparatus of the single exposure head and the multiple exposure head. FIG. 11: is explanatory drawing of the confirmation process of the inspection method G. FIG. 12A is an explanatory diagram of a confirmation step of an inspection method H for inspecting the pitch accuracy in the sub-scanning direction of each exposure apparatus of a single exposure head and a multi-exposure head, and FIG. It is explanatory drawing of the confirmation process of the inspection method I which inspects the main scanning direction pitch precision of each exposure apparatus of a multi exposure head. FIG. 13A is an explanatory diagram of a confirmation step of the inspection method J for inspecting the pitch accuracy in the sub-scanning direction of each exposure apparatus of the single exposure head and the multiple exposure head, and FIG. It is explanatory drawing of the confirmation process of the inspection method K which inspects the main scanning direction pitch precision of each exposure apparatus of a multi exposure head. FIG. 14A is a schematic diagram of an exposure apparatus having a general single exposure head, and FIG. 14B is a schematic diagram of an exposure apparatus having a general multi-exposure head. FIG. 15 is an explanatory diagram of an example of an inspection method for inspecting the exposure position accuracy of the exposure apparatus.

  Hereinafter, an embodiment of an inspection method for an exposure apparatus and an exposure apparatus according to the present invention will be described with reference to the drawings. The basic configuration of the exposure apparatus according to the present embodiment is the same as that of the conventional exposure apparatus (see FIG. 15), and the description thereof will be omitted.

  The inspection method of the exposure apparatus according to the present embodiment, that is, the inspection of the exposure position accuracy of the exposure apparatus that exposes the exposed material 12 by changing the relative position of the exposure head 10 and the stage 11 to perform main scanning and sub-scanning. There are four main methods.

<First inspection method>
The first inspection method is
An arranging step of arranging the exposed material 12 for inspection on the stage 11,
Exposing the first scale pattern and the second scale pattern separately by making the relative positions of the exposure head 10 and the stage 11 different, and simultaneously exposing the second scale pattern and the third scale pattern And an exposure step including exposing the first scale pattern and the fourth scale pattern separately by changing the relative position of the exposure head 10 and the stage 11 in the sub-scanning direction,
A developing step of developing the exposed material 12 to visualize the first pattern to the fourth pattern;
And a confirmation step including confirming each of the positional correlation of the first scale pattern and the second scale pattern, and the positional correlation of the third scale pattern and the fourth scale pattern,
This is a method of inspecting the pitch accuracy of the exposure apparatus in the sub-scanning direction.

<Second inspection method>
The second inspection method is
An arranging step of arranging the exposed material 12 for inspection on the stage 11,
After changing the relative positions of the exposure head 10 and the stage 11 in the main scanning direction for the first scale pattern and the second scale pattern, the relative positions of the exposure head 10 and the stage 11 are changed in the sub-scanning direction, An exposure step that includes exposing separately,
A developing step of developing the exposed material 12 to visualize the first pattern and the second pattern;
And a confirmation step including confirming the positional correlation between the first scale pattern and the second scale pattern,
This is a method of inspecting the pitch accuracy of the exposure apparatus in the main scanning direction.

<Third inspection method>
The third inspection method is
An arranging step of arranging the exposed material 12 for inspection on the stage 11,
Exposing the first scale pattern and the second scale pattern separately by making the relative positions of the exposure head 10 and the stage 11 different, and simultaneously exposing the second scale pattern and the third scale pattern And an exposure step including exposing the first scale pattern and the fourth scale pattern separately by changing the relative position of the exposure head 10 and the stage 11 in the main scanning direction,
A developing step of developing the exposed material 12 to visualize the first pattern to the fourth pattern;
And a confirmation step including confirming each of the positional correlation of the first scale pattern and the second scale pattern, and the positional correlation of the third scale pattern and the fourth scale pattern,
This is a method of inspecting the pitch accuracy of the exposure apparatus in the main scanning direction.

<Fourth inspection method>
The fourth inspection method is
An arranging step of arranging the exposed material 12 for inspection on the stage 11,
The first scale pattern and the second scale pattern are separately exposed by changing the relative positions of the exposure head 10 and the stage 11, and the first scale pattern is exposed while performing main scanning. An exposure step including
A developing step of developing the exposed material 12 to visualize the first pattern and the second pattern;
And a confirmation step including confirming the positional correlation between the first scale pattern and the second scale pattern,
This is a method of inspecting the feeding accuracy of the exposure apparatus in the main scanning direction.

<Inspection method A>
The inspection method A shown in FIGS. 1 and 2 is for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus having a single exposure head, and corresponds to the first inspection method.

  In the exposure process, the operation of the stage 11 is stopped at a predetermined position of the first main scanning line, and surface exposure (shot exposure) is performed at that position (first exposure, FIG. 1A). In FIG. 1, the surface exposure is performed at the head position of the main scanning line, but it may be at an intermediate position of the main scanning line. Next, the stage 11 is moved in the + y direction to perform the same main scanning operation as the normal exposure process, and then the stage 11 is moved in the + x direction to return to the origin in the −y direction and perform the normal exposure process. The same sub-scanning operation is performed, the operation of the stage 11 is stopped at a position shifted by one pitch from the first exposure position in the sub-scanning direction, and surface exposure (shot exposure) is performed at that position (second exposure). , FIG. 1 (b)). Then, finally, the stage 11 is returned by a half pitch in the −x direction and is moved by one pitch in the + y direction so as to move from the first exposure position and the second exposure position by one pitch in the main scanning direction and half in the sub scanning direction. The operation of the stage 11 is stopped at the position where the pitch is deviated, and surface exposure (shot exposure) is performed at the position (third exposure, FIG. 1C). As a result, the second exposure area 21 is adjacent to the first exposure area 20 in the sub-scanning direction, the third exposure area 22 extends over the first exposure area 20 and the second exposure area 21, and It is adjacent to the first exposure area 20 and the second exposure area 21 in the main scanning direction.

  As shown in FIG. 2A, in the first exposure, the scale pattern 30 having the main scale is exposed, and in the second exposure, the scale pattern 30 having the same main scale is exposed and the third exposure is performed. Then, a pair of scale patterns 31, 31 formed of a vernier scale is exposed corresponding to each scale pattern 30 of the first exposure area 20 and the second exposure area 21. The lower right scale pattern 30 of the second exposure region 21 corresponds to the first scale pattern of the first inspection method, and the lower left scale pattern 30 of the first exposure region 20 corresponds to the first inspection method. The scale pattern 31 on the upper left of the third exposure region 22 corresponds to the fourth scale pattern, corresponds to the second scale pattern of the first inspection method, and the scale pattern 31 on the upper right of the third exposure region 22. Corresponds to the third scale pattern of the first inspection method.

  The scale patterns 30 and 31 are in conformity with JIS B7507: 2016 (ISO13385-1: 2011), and the vernier scale is a scale obtained by dividing the main scale scale 19 mm into 20 equal parts, and the minimum reading value is 0.05 mm. . Further, the vernier scale values are “→”, “1”, “2”, “3”, “4”, “5”, “6”, “7”, “8”, “9” in the upper row. , “10” in ascending order, and the lower rows “←”, “9”, “8”, “7”, “6”, “5”, “4”, “3”, “2”, There is a descending scale value of "1" and "0". The meanings of "→" and "←" are that if the reference scale 31a of the vernier scale pattern 31 is displaced to the right of the 0 (zero) scale of the main scale pattern 30, the scale value of the "→" stage is set. On the contrary, if the reference scale 31a of the vernier scale pattern 31 is displaced to the left of the 0 (zero) scale of the main scale scale pattern 30, it means that the scale value of the "←" stage is used. is there.

  For example, in the example of FIG. 2B, in the right scale patterns 30 and 31, the reference scale 31a of the vernier scale pattern 31 matches the 0 scale of the main scale pattern 30, so the read value is On the other hand, in the scale patterns 30 and 31 on the left side, since the reference scale 31a of the vernier scale pattern 31 is displaced to the left side of the scale 0 of the main scale pattern 30, the scale value of the upper stage is used. Since the 0.5 scale of the vernier scale pattern 31 matches the scale of the main scale pattern 30, the read value is 0.05. Therefore, the main scanning line for the first exposure and the main scanning line for the second exposure (adjacent main scanning lines) have a pitch error of −0.05 mm in the sub-scanning direction pitch.

  In the example of FIG. 2C, in the scale patterns 30 and 31 on the right side, the reference scale 31a of the vernier scale pattern 31 is displaced to the left of the scale 0 of the main scale scale pattern 30, so that the lower stage is shown. Is used, and since the 0.5 scale of the vernier scale pattern 31 matches the scale of the main scale pattern 30, the read value is 0.05, while the scale pattern on the left side is In 30 and 31, since the reference scale 31a of the vernier scale pattern 31 is displaced to the left of the scale 0 of the main scale pattern 30, the scale value of the upper stage is used, and the scale scale 31 of the vernier scale pattern 31 is used. Since the scale of 1 corresponds to the scale of the main scale pattern 30, the read value is 0.10. Therefore, the main scanning line for the first exposure and the main scanning line for the second exposure (adjacent It means that the matching main scanning line) has a pitch error of −0.05 mm in the sub scanning direction pitch.

  The scale pattern 30 is also exposed on the upper right of the first exposure area 20 and the upper left of the second exposure area 21, which confirms the sub-scanning direction pitch with the adjacent main scanning line. It is for. This is performed on at least all main scanning lines for exposing the exposed material 12 to the entire surface, preferably all main scanning lines of the exposure apparatus, so that the required range of the exposure apparatus or the entire pitch accuracy in the sub-scanning direction is improved. Can be inspected.

  As described above, according to the inspection method A, the main-scale scale pattern 30 and the vernier scale pattern 31 are exposed, and visualized and read, so that the pitch in the sub-scanning direction of the exposure apparatus is relatively simple. The accuracy can be inspected accurately.

  It is also possible to inspect the pitch accuracy in the sub-scanning direction by using only the scale patterns 30 and 31 on the left side without exposing the scale patterns 30 and 31 on the right side or using the scale patterns on exposure.

<Inspection method B>
The inspection method B shown in FIG. 3 is, like the inspection method A, for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus of the single exposure head, and corresponds to the first inspection method.

  The procedure of the exposure process is the same as that of the inspection method A, except that the inspection method B exposes the scale patterns 30 and 31 of the inspection method A in reverse.

  As shown in FIG. 3A, the vernier scale pattern 31 is exposed in the first exposure, the vernier scale pattern 31 is also exposed in the second exposure, and the pair of main scales is exposed in the third exposure. The scale patterns 30 and 30 are exposed corresponding to the scale patterns 31 of the first exposure area 20 and the second exposure area 21, respectively. The lower right scale pattern 31 of the second exposure area 21 corresponds to the first scale pattern of the first inspection method, and the lower left scale pattern 31 of the first exposure area 20 of the first inspection method 20. The scale pattern 30 at the upper left of the third exposure region 22 corresponds to the fourth scale pattern, corresponds to the second scale pattern of the first inspection method, and the scale pattern 30 at the upper right of the third exposure region 22. Corresponds to the third scale pattern of the first inspection method.

  For example, in the example of FIG. 3B, in the scale patterns 30 and 31 on the right side, the reference scale 31a of the vernier scale pattern 31 matches the scale of 0 of the main scale pattern 30, so the read value is On the other hand, in the scale patterns 30 and 31 on the left side, since the reference scale 31a of the vernier scale pattern 31 is displaced to the right of the scale 0 of the main scale pattern 30, the scale value of the upper stage is used. Then, since the 0.5 scale of the vernier scale pattern 31 matches the scale of the main scale pattern 30, the read value is 0.05. Therefore, the main scanning line for the first exposure and the main scanning line for the second exposure (adjacent main scanning lines) have a pitch error of −0.05 mm in the sub-scanning direction pitch.

  Further, in the example of FIG. 3C, in the scale patterns 30 and 31 on the right side, the reference scale 31a of the vernier scale pattern 31 is displaced to the right side from the scale 0 of the main scale scale pattern 30, so the lower stage Is used, and since the 0.5 scale of the vernier scale pattern 31 matches the scale of the main scale pattern 30, the read value is 0.05, while the scale pattern on the left side is In 30 and 31, the reference scale 31a of the vernier scale pattern 31 is displaced to the right of the 0 scale of the main scale pattern 30, so the upper scale value is used, and the vernier scale pattern 31 Since the scale of 1 corresponds to the scale of the main scale pattern 30, the read value is 0.10. Therefore, the main scanning line for the first exposure and the main scanning line for the second exposure (adjacent main scanning lines) have a pitch error of −0.05 mm in the sub-scanning direction pitch.

  As described above, according to the inspection method B as well, the main scale pattern 30 and the vernier scale pattern 31 are exposed, visualized and read, so that the pitch accuracy in the sub-scanning direction of the exposure apparatus is relatively simple. Can be inspected with high accuracy.

  It is also possible to inspect the pitch accuracy in the sub-scanning direction by using only the scale patterns 30 and 31 on the left side without exposing the scale patterns 30 and 31 on the right side or using the scale patterns on exposure.

  Further, the pair of scale patterns 30, 30 in the third exposure area 22 may be a continuous and integral scale pattern. In this case, the scale pattern of the third exposure area 22 corresponds to the second scale pattern and the third scale pattern of the first inspection method.

  The right scale patterns 30 and 31 are exposure patterns according to the inspection method B, the left scale patterns 30 and 31 are exposure patterns according to the inspection method A, and vice versa. The exposure pattern according to the inspection method A and the scale patterns 30 and 31 on the left side may be the exposure pattern according to the inspection method B.

<Inspection method C>
The inspection method C shown in FIGS. 4 and 5 is for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus of the multi-exposure head, and corresponds to the first inspection method. The inspection method C is basically the same as the inspection method A, except that it is for a multiple exposure head or for a single exposure head.

  In the exposure step, first, the operation of the stage 11 is stopped at a predetermined position on the first main scanning line, and surface exposure (shot exposure) is performed at that position (first exposure, FIG. 4A). In FIG. 4, the surface exposure is performed at the head position of the main scanning line, but it may be at an intermediate position of the main scanning line. Next, the stage 11 is moved in the + y direction to perform the same main scanning operation as the normal exposure process, and then the stage 11 is moved in the + x direction to return to the origin in the −y direction and perform the normal exposure process. The same sub-scanning operation is performed, the operation of the stage 11 is stopped at a position shifted by one pitch from the first exposure position in the sub-scanning direction, and surface exposure (shot exposure) is performed at that position (second exposure). , FIG. 4 (b)). Then, finally, the stage 11 is returned by a half pitch in the −x direction and is moved by one pitch in the + y direction so as to move from the first exposure position and the second exposure position by one pitch in the main scanning direction and half in the sub scanning direction. The operation of the stage 11 is stopped at the position deviated from the pitch, and surface exposure (shot exposure) is performed at the position (third exposure, FIG. 4C). As a result, the second exposure area 21 is adjacent to the first exposure area 20 in the sub-scanning direction, the third exposure area 22 extends over the first exposure area 20 and the second exposure area 21, and It is adjacent to the first exposure area 20 and the second exposure area 21 in the main scanning direction.

  As shown in FIG. 5, the main scale pattern 30 is exposed in the first exposure, the main scale pattern 30 is similarly exposed in the second exposure, and the subscale scale patterns 31, 31 are exposed in the third exposure. Are exposed corresponding to each scale pattern 30 in the first exposure area 20 and the second exposure area 21. The lower right scale pattern 30 of the second exposure region 21 corresponds to the first scale pattern of the first inspection method, and the lower left scale pattern 30 of the first exposure region 20 corresponds to the first inspection method. The scale pattern 31 on the upper left of the third exposure region 22 corresponds to the fourth scale pattern, corresponds to the second scale pattern of the first inspection method, and the scale pattern 31 on the upper right of the third exposure region 22. Corresponds to the third scale pattern of the first inspection method.

  The scale patterns 30 and 31 are based on JIS B7507: 2016 (ISO13385-1: 2011), and the vernier scale is a scale obtained by dividing the main scale scale 49 mm into 50 equal parts and the minimum reading value is 0.02 mm. .. The way to read the scale is the same as the inspection method A.

  As described above, according to the inspection method C as well, the main scale pattern 30 and the vernier scale pattern 31 are exposed, and visualized and read, so that the pitch accuracy in the sub-scanning direction of the exposure apparatus is relatively simple. Can be inspected with high accuracy.

  It is also possible to inspect the pitch accuracy in the sub-scanning direction by using only the scale patterns 30 and 31 on the left side without exposing the scale patterns 30 and 31 on the right side or using the scale patterns on exposure.

<Inspection method D>
The inspection method D shown in FIG. 6 is, like the inspection method C, for inspecting the pitch accuracy in the sub-scanning direction of the exposure apparatus of the multi-exposure head, and corresponds to the first inspection method. The inspection method D is basically the same as the inspection method B, except that it is for a multi-exposure head or for a single exposure head.

  The procedure of the exposure process is the same as that of the inspection method C, except that the inspection method D exposes the scale patterns 30 and 31 of the inspection method C in reverse.

  In the first exposure, the vernier scale pattern 31 is exposed, in the second exposure, the vernier scale pattern 31 is similarly exposed, and in the third exposure, the pair of main scale scale patterns 30, 30 is first exposed. Are exposed corresponding to each scale pattern 31 in the exposure area 20 and the second exposure area 21. The lower right scale pattern 31 of the second exposure area 21 corresponds to the first scale pattern of the first inspection method, and the lower left scale pattern 31 of the first exposure area 20 of the first inspection method 20. The scale pattern 30 at the upper left of the third exposure region 22 corresponds to the fourth scale pattern, corresponds to the second scale pattern of the first inspection method, and the scale pattern 30 at the upper right of the third exposure region 22. Corresponds to the third scale pattern of the first inspection method.

  As described above, according to the inspection method D, the main scale pattern 30 and the vernier scale pattern 31 are exposed, and then visualized and read, so that the pitch accuracy in the sub-scanning direction of the exposure apparatus is relatively simple. Can be inspected with high accuracy.

  It is also possible to inspect the pitch accuracy in the sub-scanning direction by using only the scale patterns 30 and 31 on the left side without exposing the scale patterns 30 and 31 on the right side or using the scale patterns on exposure.

  Further, the pair of scale patterns 30, 30 in the third exposure area 22 may be a continuous and integral scale pattern. In this case, the scale pattern of the third exposure area 22 corresponds to the second scale pattern and the third scale pattern of the first inspection method.

  The right scale patterns 30 and 31 are exposure patterns according to the inspection method D, the left scale patterns 30 and 31 are exposure patterns according to the inspection method C, and vice versa. The exposure pattern according to the inspection method C may be used, and the scale patterns 30 and 31 on the left side may be the exposure pattern according to the inspection method D.

<Inspection method E>
The inspection method E shown in FIGS. 7 and 8 is for inspecting the pitch accuracy in the main scanning direction of each of the exposure devices of the single exposure head and the multiple exposure head, and corresponds to the second inspection method.

  In the exposure process, the operation of the stage 11 is stopped at a predetermined position of the first main scanning line, and surface exposure (shot exposure) is performed at that position (first exposure, FIG. 7A). In FIG. 7, the surface exposure is performed at the head position of the main scanning line, but it may be at the middle position of the main scanning line. Next, the stage 11 is moved in the + y direction to perform the same main scanning operation as the normal exposure process, and then the stage 11 is moved in the + x direction to return to the origin in the −y direction and perform the normal exposure process. The same sub-scanning operation is performed, the operation of the stage 11 is stopped at a position shifted by one pitch from the first exposure position in the sub-scanning direction, and surface exposure (shot exposure) is performed at that position (second exposure). , FIG. 7B). As a result, the second exposure area 21 is adjacent to the first exposure area 20 in the sub scanning direction.

  As shown in FIG. 8A, in the first exposure, the vernier scale pattern 31 is exposed, and in the second exposure, the main scale pattern 30 corresponds to the scale pattern 31 of the first exposure area 20. Exposed. The scale pattern 31 of the first exposure area 20 corresponds to the first scale pattern of the second inspection method, and the scale pattern 30 of the second exposure area 23 is the second scale pattern of the second inspection method. Corresponds to.

  For example, in the example of FIG. 8B, since the reference scale 31a of the vernier scale pattern 31 is displaced below the 0 scale of the main scale pattern 30, the scale values in the right column are used, and Since the 0.5 scale of the vernier scale pattern 31 matches the scale of the main scale pattern 30, the read value is 0.05. Therefore, the main scanning line for the first exposure or the main scanning line for the second exposure has a pitch error of 0.05 mm in the main scanning direction pitch.

  Further, in the example of FIG. 8C, since the reference scale 31a of the vernier scale pattern 31 is displaced to the upper side of the scale 0 of the main scale pattern 30, the scale value in the left column is used, and Since the 0.5 scale of the vernier scale pattern 31 matches the scale of the main scale pattern 30, the read value is 0.05. Therefore, the main scanning line for the first exposure or the main scanning line for the second exposure has a pitch error of 0.05 mm in the main scanning direction pitch.

  As described above, according to the inspection method E, the main-scale scale pattern 30 and the sub-scale scale pattern 31 are exposed, and the main-scale scale pattern 30 and the sub-scale scale pattern 31 are visualized and read. The accuracy can be inspected accurately.

<Inspection method F>
The inspection method F shown in FIG. 9 is for inspecting the pitch accuracy in the main scanning direction of each exposure apparatus of a single exposure head and a multi-exposure head, and corresponds to the third inspection method. The inspection method F is basically the same as the inspection methods A to D except that there is a difference between the inspection in the main scanning direction pitch accuracy and the inspection in the sub scanning direction pitch accuracy.

  In the exposure step, the operation of the stage 11 is stopped at a predetermined position of the first main scanning line, and surface exposure (shot exposure) is performed at that position (first exposure, FIG. 9A). In FIG. 9, the surface exposure is performed at the head position of the main scanning line, but it may be at the middle position of the main scanning line. Next, the stage 11 is moved by one pitch in the + y direction, the operation of the stage 11 is stopped at a position displaced by one pitch from the first exposure position in the main scanning direction, and surface exposure (shot exposure) is performed at that position. Perform (second exposure, FIG. 9B). Then, finally, after moving the stage 11 in the + y direction and performing the same main scanning operation as the normal exposure processing, the stage 11 is moved in the + x direction to return to the origin in the -y direction, and the normal operation is performed. The same sub-scanning operation as in the exposure process is performed, and the stage 11 is moved in the + y direction by a half pitch, and is displaced by one pitch in the sub-scanning direction and half a pitch in the main scanning direction from the first exposure position and the second exposure position. The operation of the stage 11 is stopped at the position, and surface exposure (shot exposure) is performed at the position (third exposure, FIG. 9C). Thereby, the second exposure region 21 is adjacent to the first exposure region 20 in the main scanning direction, the third exposure region 22 straddles the first exposure region 20 and the second exposure region 21, and It is adjacent to the first exposure area 20 and the second exposure area 21 in the sub-scanning direction.

  Although not shown, the scale pattern is exposed in the same manner as described in the inspection method A and the inspection method B. The scale pattern 30 or 31 of the second exposure area 24 corresponds to the first scale pattern of the third inspection method, and the scale pattern 30 or 31 of the first exposure area 20 corresponds to the first scale pattern of the third inspection method. Of the pair of scale patterns 30, 30 or 31, 31 of the third exposure area 25, the scale pattern 30 or 31 corresponding to the scale pattern 30 or 31 of the second exposure area 24 is , The scale pattern 30 or 31 corresponding to the second scale pattern of the third inspection method and corresponding to the scale pattern 30 or 31 of the first exposure region 20 becomes the third scale pattern of the third inspection method. Applicable

  As described above, according to the inspection method F as well, the main-scale scale pattern 30 and the sub-scale scale pattern 31 are exposed, visualized and read, so that the pitch accuracy in the main scanning direction of the exposure apparatus is relatively simple. Can be inspected with high accuracy.

  In addition, the scale pattern 30 or 31 of the first exposure area 20 and the scale pattern 30 or 31 of the third exposure area 25 corresponding to the scale pattern 30 or 31 are not exposed or are not used even if exposed to the second exposure area. It is also possible to inspect the pitch accuracy in the main scanning direction using only the 24 scale patterns 30 or 31 and the corresponding scale patterns 30 or 31 of the third exposure area 25.

<Inspection method G>
The inspection method G shown in FIGS. 10 and 11 is for inspecting the feeding accuracy in the main scanning direction of each exposure apparatus of the single exposure head and the multiple exposure head, and corresponds to the fourth inspection method.

  In the exposure step, first, exposure (scan exposure) is performed while moving the stage 11 by 2 pitches in the + y direction from a predetermined position of the first main scanning line (first exposure, FIG. 10A). In FIG. 10, the exposure is performed from the head position of the main scanning line, but the exposure may be performed from the middle position of the main scanning line. Next, the stage 11 is moved in the + y direction to perform the same main scanning operation as the normal exposure process, and then the stage 11 is moved in the + x direction to return to the origin in the −y direction and perform the normal exposure process. The same sub-scanning operation as the above is performed, the operation of the stage 11 is stopped at a position shifted by one pitch in the sub-scanning direction from the first one pitch of the first exposure position, and surface exposure (shot exposure) is performed at that position. (Second exposure, FIG. 10B). Then, finally, the stage 11 is moved by one pitch in the + y direction, the operation of the stage 11 is stopped at a position displaced by one pitch from the second exposure position in the main scanning direction, and the surface exposure (shot exposure) is performed at that position. ) Is performed (third exposure, FIG. 10C). As a result, the second exposure region 27 and the third exposure region 28 are adjacent to the first exposure region 26 in the sub scanning direction.

  As shown in FIG. 11A, in the first exposure, the normal scale pattern 32 is exposed, and in the second exposure, the normal scale pattern 33 is half the scale pattern of the first exposure area 26. Correspondingly, in the third exposure, the normal scale pattern 33 is also exposed corresponding to the other half of the scale pattern 30 in the first exposure area 26. The scale pattern 32 of the first exposure area 26 corresponds to the first scale pattern of the fourth inspection method, and the scale pattern 33 of the second exposure area 27 and the scale pattern 33 of the third exposure area 28 are It corresponds to the second scale pattern of the fourth inspection method.

  For example, in the example of FIG. 11B, the scale pattern 32 of the first exposure area 26 has a graduation interval larger than that of the scale pattern 33 of the second exposure area 27 and the scale pattern 33 of the third exposure area 28. It is getting narrower. Further, in the example of FIG. 11C, the scale pattern 32 of the first exposure area 26 has a graduation interval larger than that of the scale pattern 33 of the second exposure area 27 and the scale pattern 33 of the third exposure area 28. It is getting wider. Therefore, in any of these cases, it means that the main scanning line related to the first exposure has a defect in the main scanning direction feed accuracy.

  As described above, according to the inspection method G, the scale pattern 32 and the scale pattern 33 are exposed, and the scale pattern 32 and the scale pattern 33 are visualized and read. Can be inspected.

  It should be noted that the main-scanning direction feed accuracy is inspected using only the scale pattern 33 of the third exposure area 28 without exposing the scale pattern 33 of the second exposure area 27 or using it even after exposure. You can also On the contrary, the scale accuracy of the main scanning direction can be improved by using only the scale pattern 33 of the second exposure area 27 without exposing the scale pattern 33 of the third exposure area 28, or without using the scale pattern 33. You can also inspect.

  The scale pattern 32 of the first exposure area 26 may be divided into a pair of scale patterns corresponding to the scale pattern 33 of the second exposure area 27 and the scale pattern 33 of the third exposure area 28. Good. In this case, any scale pattern 32 corresponds to the first scale pattern of the fourth inspection method.

<Inspection method H>
The inspection method H shown in FIG. 12A is for inspecting the pitch accuracy in the sub-scanning direction of each exposure apparatus of a single exposure head and a multi-exposure head, and corresponds to the first inspection method.

  The procedure of the exposure process is the same as that of the inspection methods A to D, except that the inspection method H does not use the vernier scale pattern but uses the normal scale patterns 34 and 35.

  As described above, also by the inspection method H, the scale pattern 34 and the scale pattern 35 are exposed, and the scale pattern 34 and the scale pattern 35 are visualized and read, so that the sub-scanning direction pitch accuracy of the exposure apparatus is accurately inspected by a relatively simple method. can do.

<Inspection method I>
The inspection method H shown in FIG. 12B is for inspecting the pitch accuracy in the main-scanning direction of each exposure apparatus of the single exposure head and the multi-exposure head, and corresponds to the second inspection method.

  The procedure of the exposure process is the same as that of the inspection method E, except that the inspection method I does not use the vernier scale pattern but uses the normal scale patterns 34 and 35.

  As described above, according to the inspection method I as well, the scale pattern 34 and the scale pattern 35 are exposed, and the scale pattern 34 and the scale pattern 35 are visualized and read, thereby accurately inspecting the main scanning direction pitch accuracy of the exposure apparatus by a relatively simple method. can do.

<Inspection method J>
The inspection method J shown in FIG. 13A is for inspecting the pitch accuracy in the sub-scanning direction of each exposure apparatus of a single exposure head and a multi-exposure head, and corresponds to the first inspection method.

  The procedure of the exposure process is the same as that of the inspection methods A to D, except that the inspection method J is a combination of a normal scale pattern 35 and a mark 36 arranged at a predetermined scale of the scale pattern 35. To use.

  As described above, also by the inspection method J, the scale pattern 35 and the mark 36 are exposed, and the scale pattern 35 and the mark 36 are visualized and read, thereby accurately inspecting the sub-scanning direction pitch accuracy of the exposure apparatus by a relatively simple method. be able to.

<Inspection method K>
The inspection method H shown in FIG. 13B is for inspecting the pitch accuracy in the main scanning direction of each of the exposure apparatuses of the single exposure head and the multiple exposure head, and corresponds to the second inspection method.

  The procedure of the exposure process is the same as that of the inspection method E, except that the inspection method K uses a combination of a normal scale pattern 34 and a mark 36 arranged at a predetermined scale of the scale pattern 34. ..

  As described above, also by the inspection method K, the scale pattern 34 and the mark 36 are exposed, and the scale pattern 34 and the mark 36 are visualized and read, thereby accurately inspecting the main scanning direction pitch accuracy of the exposure apparatus by a relatively simple method. be able to.

  The exposure apparatus inspection method and exposure apparatus according to the present invention are not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

  For example, in the above embodiment, the DMD type exposure apparatus, which is a MEMS (Micro Electro Mechanical Systems) type spatial modulation element, is used as the spatial modulation element. However, in the present invention, the exposure apparatus may use a spatial modulation element other than the MEMS type, such as an optical element (PLZT element) that modulates transmitted light by an electro-optical effect, a liquid crystal optical shutter (FLC), or the like. The exposure apparatus may be a MEMS type or a reflection diffraction grating type (GLV) or interference type exposure apparatus other than the DMD.

  In addition, in the above-described embodiment, the main scan and the sub-scan are performed by moving the stage 11. However, the present invention is not limited to this, and may be a type in which an exposure head moves, an exposure head moves in main scanning, a stage moves in sub-scanning, a stage moves in main scanning, and an exposure head moves in sub-scanning. ..

  Further, in the above embodiment, when the exposure head moves to the next main scanning, the origin is returned and the main scanning is performed in the same direction. However, the present invention is not limited to this, and for example, the main scanning direction may be alternately switched.

  Further, in the above-described embodiment, the substrate on which the photoresist layer is laminated is used as the exposed material. However, the present invention is not limited to this, and for example, a photosensitive material may be used.

  As described above, in the present invention, the exposure apparatus and the material to be exposed are not limited to those disclosed so far, but all of the known configurations are applicable.

  In addition, in the above-described embodiment, the scales of the main scale pattern and the sub-scale scale pattern are based on JIS (ISO). However, the present invention is not limited to this, and the scale and the minimum reading value can be freely set.

  DESCRIPTION OF SYMBOLS 1 ... Exposure device, 10 ... Exposure head, 11 ... Exposure stage, 12 ... Substrate (material to be exposed), 20 ... First exposure area, 21 ... Second exposure area, 22 ... Third exposure area, 23 ... 2nd exposure area, 24 ... 2nd exposure area, 25 ... 3rd exposure area, 26 ... 1st exposure area, 27 ... 2nd exposure area, 28 ... 3rd exposure area, 30 ... Main scale Scale pattern, 31 ... Vernier scale pattern, 31a ... Standard scale, 32-35 ... Scale pattern, 36 ... Mark

Claims (7)

A method for inspecting an exposure apparatus for exposing a material to be exposed by performing a main scan and a sub scan by changing a relative position of an exposure head and a stage,
An arranging step of arranging an exposed material for inspection on the stage,
An exposure step including exposing the first scale pattern and the second scale pattern separately by changing the relative positions of the exposure head and the stage;
A visualizing step of visualizing the latent image when the image formed on the exposed material is a latent image,
An inspection method for an exposure apparatus, comprising: a confirmation step including confirmation of positional correlation between the first scale pattern and the second scale pattern. In the exposure step, the second scale pattern and the third scale pattern are exposed at the same time, and the first scale pattern and the fourth scale pattern are exposed at the relative positions of the exposure head and the stage. Including different exposure in the sub-scanning direction,
The confirmation step includes confirming the positional correlation between the first scale pattern and the second scale pattern, and the positional correlation between the third scale pattern and the fourth scale pattern. ,
The inspection method for an exposure apparatus according to claim 1, wherein the pitch accuracy in the sub-scanning direction of the exposure apparatus is inspected. In the exposure step, the relative positions of the exposure head and the stage in the first scale pattern and the second scale pattern are different from each other in the main scanning direction, and then the relative position of the exposure head and the stage is subordinated. Including different exposure in the scanning direction,
The inspection method for an exposure apparatus according to claim 1, wherein the pitch accuracy in the main scanning direction of the exposure apparatus is inspected. In the exposure step, the second scale pattern and the third scale pattern are exposed at the same time, and the first scale pattern and the fourth scale pattern are exposed at the relative positions of the exposure head and the stage. Including different exposure in the main scanning direction,
The confirming step includes confirming the positional correlation between the first scale pattern and the second scale pattern, and the positional correlation between the third scale pattern and the fourth scale pattern. ,
The inspection method for an exposure apparatus according to claim 1, wherein the pitch accuracy in the main scanning direction of the exposure apparatus is inspected. The exposing step includes exposing the first scale pattern while performing main scanning,
The inspection method for the exposure apparatus according to claim 1, wherein the main-scanning direction feed accuracy of the exposure apparatus is inspected. The inspection method according to any one of claims 1 to 5, wherein the positional correlation is based on a relationship between a main scale and a vernier scale. An exposure apparatus that exposes each scale pattern of the inspection method according to claim 1.

Images