JP2015065360A - Gui device for exposure device, exposure system, exposure condition setting method, and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a GUI device for an exposure device, exposure system, exposure condition setting method, and program with which blocks arranged in matrix on a circular substrate can be selected with good operability, and exposure conditions can be set.SOLUTION: When an operator inputs desired information to a selection input area 210 of a GUI device through an operation unit, a selection circle 204 concentric with the contour of a substrate 202 is displayed on an initial screen including the contour of a substrate 202 and a plurality of blocks 203, and a selection area 205 consisting of a plurality of blocks 206, to which exposure conditions are to be set, is displayed in an emphasized manner.

Description

  The present invention relates to a graphical user interface (GUI) device used in an exposure apparatus that exposes a wiring pattern or the like on a substrate on which a photoresist film is formed.

  Conventionally, a pattern is formed by irradiating various substrates such as a semiconductor substrate, a printed wiring substrate, and a glass substrate with light via a mask. In recent years, in order to cope with the formation of various patterns, a technique has been used in which exposure is performed by drawing a pattern by directly irradiating a substrate with spatially modulated light without using a mask.

  An exposure apparatus that performs exposure processing as described above is referred to as a direct drawing apparatus. For example, Patent Document 1 describes a GUI apparatus used for a direct drawing apparatus. This GUI apparatus is used when setting exposure conditions such as drawing parameters in units of a plurality of blocks set on a substrate. This block has a rectangular shape and is arranged on the substrate in the row direction and the column direction. In other words, the plurality of blocks are arranged in a matrix on the substrate.

  An exposure apparatus that performs exposure processing in units of blocks is not limited to the direct drawing apparatus described above. For example, in a stepper (reduction projection type exposure apparatus) that projects a pattern formed on a mask (reticle) in a reduced scale, exposure processing in units of blocks is performed. Done.

JP2013-77718A (for example, paragraph 0054, FIG. 3)

  In general, a photoresist film formed on a circular substrate is obtained by supplying a photoresist solution to the center of the substrate and then rotating the substrate around the center at a high speed so that the photoresist solution is applied to the surface of the substrate by centrifugal force. It is formed by so-called spin coating method (rotary coating method). In some cases, the film thickness of the photoresist film formed on the substrate by this spin coating method varies in the radial direction of the substrate, for example, from the center to the periphery of the substrate. When a plurality of blocks are subjected to exposure processing under the same exposure conditions for a photoresist film having a variation in film thickness, the following problems occur. That is, for example, in a block having a thick photoresist film, there arises a problem that the width dimension of the resist pattern obtained by developing after the exposure process becomes thinner or thicker than a desired dimension.

  In order to solve the above problem, the width of the resist pattern after development becomes thicker when it becomes thinner, and when it becomes thicker, it becomes thinner for each block using a GUI device. Change the exposure conditions. When changing the exposure conditions, it is necessary to select a plurality of blocks concentrically with the circular substrate outer shape in order to cope with the film thickness variation in the radial direction of the photoresist film.

  In addition, a pattern different from a standard pattern for manufacturing a semiconductor chip, such as a test pattern, may be exposed on a block arranged around the substrate. In this case, for example, it is necessary to select a plurality of blocks set on the outer peripheral edge of the circular substrate, and to change the exposure condition of the selected block to the exposure condition for the test pattern.

  When the blocks are selected concentrically as described above, or when the blocks arranged on the outer peripheral edge of the substrate are selected, if a general GUI device is used, a plurality of selection operations are required, resulting in poor operability. Specifically, a rectangular selection area is displayed on the operation screen by dragging the mouse pointer on a plurality of blocks displayed on the operation screen. It is necessary to display a rectangular selection area so that the block to be selected is included, but when selecting a block concentric with the board outline or selecting a block on the outer periphery of the board, select once In the operation, a desired block cannot be selected, and it is necessary to select a plurality of operations separately, which causes a problem of poor operability.

  An object of the present invention is for an exposure apparatus capable of selecting blocks arranged in a matrix on a circular substrate with good operability and setting exposure conditions in view of the above points. A GUI device, an exposure system, an exposure condition setting method, and a program are provided.

  A first invention according to claim 1 is a GUI apparatus for an exposure apparatus that performs exposure processing on a photoresist film formed on the surface of a circular substrate in units of blocks, and includes a display unit having a screen; An operation unit for operating the screen of the display unit, and a display control unit for controlling the screen display of the display unit, the display control unit including a selection display area including a substrate outer shape and a plurality of blocks dividing the inside of the substrate, and An initial screen display unit for displaying an initial screen having a selection input area for inputting selection information related to the selected circle on the screen of the display unit, and the selection circle is concentrically formed with the board outline based on the selection information. A selection circle display unit to be displayed on the screen, a selection block display unit to highlight and display the selected block selected based on the selection information on the screen of the display unit, and an exposure condition when performing exposure processing on the selected block Enter An exposure condition input display unit to be displayed on the screen of the display unit exposure condition input area for characterized in that it comprises a.

  According to a second aspect of the present invention, in the first aspect, the selection input area is an input area for inputting information on the size of the selected circle as selection information on the selected circle, and information on the inside or outside of the selected circle And an input area for inputting.

  According to a third aspect of the present invention, in the second aspect of the present invention, the selection input area has an input area for inputting information regarding a selection width from the selection circle as selection information regarding the selection circle.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the selection input area inputs information regarding whether or not to select a block on the selection circle as selection information regarding the selection circle. To have an input area.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the exposure condition input area is an input area for inputting an exposure condition related to a size change of the exposure pattern.

  According to a sixth aspect of the present invention, in any one of the first to fourth aspects, the exposure condition input area is an input area for inputting an exposure condition for selecting a standard exposure operation or a test exposure operation. It is.

  A seventh invention (exposure system) according to claim 7 is a block for the GUI apparatus for an exposure apparatus according to any one of the first to sixth inventions and a photoresist film formed on the surface of a circular substrate. An exposure apparatus that performs exposure processing in units.

  An eighth invention according to an eighth aspect of the present invention is the direct writing apparatus according to the seventh invention, in which the exposure apparatus draws an exposure pattern by scanning the photoresist film with a spatially modulated light beam.

  According to a ninth aspect of the present invention (exposure condition setting method), a selection display area including a substrate outline and a plurality of blocks partitioning the inside of the substrate, and selection information relating to the selection circle are displayed on the screen of the display unit of the GUI device. An initial screen display process for displaying an initial screen having a selection input area for input on the screen of the display unit, and selection information input for inputting selection information related to the selected circle in the selection input area of the initial screen by the operation unit of the GUI device A selection circle display step of displaying a selection circle on the screen of the display unit concentrically with the outer shape of the substrate based on the selection information input in the selection information input step, and a selection block selected based on the selection information A selected block display process that is highlighted on the screen of the display unit, and an exposure condition input area for inputting exposure conditions when performing exposure processing on the selected block are displayed on the screen of the display unit. An exposure condition input display step of, by the operation unit, characterized in that it comprises a, an exposure condition input step of inputting exposure conditions in the exposure condition input area.

  According to a tenth aspect of the present invention, in the ninth aspect, the selection information input step is a step for inputting information relating to the size of the selected circle as selection information relating to the selected circle, and information relating to the inside or outside of the selected circle. For inputting.

  According to an eleventh aspect of the present invention, in the tenth aspect, the selection information input step further includes a step for inputting information relating to a selection width from the selection circle as selection information relating to the selection circle.

  According to a twelfth aspect of the present invention, in the invention according to any one of the ninth to eleventh aspects, information regarding whether or not the selection input step selects a block on the selected circle is input as selection information regarding the selected circle. The method further includes the step of:

  In a thirteenth aspect of the present invention based on any one of the ninth to twelfth aspects, the exposure condition input in the exposure condition input step is an exposure condition related to a change in size of the exposure pattern.

  According to a fourteenth aspect of the present invention, in any one of the ninth to twelfth aspects, the exposure condition for selecting the standard exposure operation or the test exposure operation as the exposure condition input in the exposure condition input step. It is.

  According to a fifteenth aspect of the present invention, there is provided a computer-readable program provided in a GUI apparatus for an exposure apparatus that performs exposure processing in block units on a photoresist film formed on a surface of a circular substrate. An initial screen having a selection display area including a board outline and a plurality of blocks partitioning the board, and a selection input area for inputting selection information regarding the selection circle is displayed on the screen of the display section included in the GUI device. An initial screen display function for displaying on the screen, a selection circle display function for displaying a selection circle on the screen of the display unit concentrically with the substrate outline based on the selection information, and a selection block selected based on the selection information The selected block display function that highlights the image on the screen of the display unit and the exposure condition input area for inputting the exposure conditions when performing exposure processing on the selected block An exposure condition input display function for displaying on the screen of the display unit, characterized in that to exert the computer.

  In a sixteenth aspect of the present invention based on the fifteenth aspect, as the initial screen display function, an input area for inputting information related to the size of the selected circle is displayed in the selected input area as selection information related to the selected circle. The computer is caused to exhibit a function and a function of displaying an input area for inputting information regarding the inside or outside of the selected circle.

  According to a seventeenth aspect of the present invention, in the sixteenth aspect, the computer has a function of displaying, in the selection input area, an input area for inputting information relating to a selection width from the selection circle as selection information relating to the selection circle. Let

  According to an eighteenth aspect of the present invention, in the invention according to any one of the fifteenth to seventeenth aspects, information regarding whether or not to select a block on the selected circle is selected as selection information regarding the selected circle in the selection input area. Let the computer perform the function of displaying the input area for input.

  According to a nineteenth aspect of the present invention, in any one of the fifteenth to eighteenth aspects of the present invention, the exposure condition input area has a function of displaying an input area for inputting an exposure condition related to a change in size of the exposure pattern. Make it work on your computer.

  According to a twentieth aspect of the invention, in the invention according to any one of the fifteenth to eighteenth aspects, an input for inputting an exposure condition for selecting a standard exposure operation or a test exposure operation in the exposure condition input area. Have the computer display the area.

  According to the invention according to any one of claims 1 to 20, the exposure allows the selection of the blocks arranged in a matrix on the circular substrate with good operability and setting the exposure conditions. A GUI apparatus, an exposure system, an exposure condition setting method, and a program for the apparatus can be provided.

It is a figure which shows the drawing system containing an exposure system. It is a block diagram which shows the hardware constitutions of a GUI apparatus. It is a block diagram which shows the function structure of a GUI apparatus. It is a flowchart which shows the whole flow of exposure condition change. It is a flowchart which shows the flow of exposure condition setting. It is a figure for demonstrating an initial screen. It is a figure for demonstrating the 1st Example of a GUI screen. It is a figure for demonstrating exposure condition input area. It is a figure for demonstrating the 2nd Example of a GUI screen. It is a figure for demonstrating the 3rd Example of a GUI screen. It is a figure for demonstrating the other example of an exposure condition input area. It is a figure for demonstrating the 4th Example of a GUI screen. It is a side view of a direct drawing apparatus. It is a top view of a direct drawing apparatus. It is a figure which shows an illumination optical system and a projection optical system. It is a figure which expands and shows a spatial light modulator. It is the block diagram which showed the connection structure of each part and control part of a direct drawing apparatus. It is a block diagram which shows the control part which controls drawing operation | movement. It is a flowchart of operation | movement of a direct drawing apparatus.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
<Overall system configuration>
FIG. 1 is a diagram showing a graphic drawing system 400 including an exposure system 4 according to an embodiment of the present invention. The figure drawing system 400 directly draws a figure corresponding to a circuit pattern on a photoresist film by selectively exposing, for example, a photoresist film on a circular semiconductor substrate (hereinafter simply referred to as “substrate”). System.

  The graphic drawing system 400 includes a design data creation device 1, an image processing device 3, and a direct drawing device 100 connected to each other via a network N such as a LAN. The image processing device 3 includes a GUI device 2.

  The design data creation device 1 is a device that creates and edits data describing a pattern area to be drawn on a drawing target. Specifically, the data is created as graphic data described in a vector format by CAD. Hereinafter, this data is referred to as design data D0. The design data D0 created by the design data creation device 1 is transmitted to the image processing device 3 and the direct drawing device 100 via the network N, respectively.

  The image processing apparatus 3 corrects the design data D0 transmitted via the network N, and creates corrected design data D1. The modified design data D1 created by the image processing apparatus 3 is directly transmitted to the drawing apparatus 100 via the network N.

  Specifically, the image processing apparatus 3 increases the line width dimension of the circuit pattern to be exposed (drawn) according to the change of the exposure condition (drawing condition) for the design data D0 (thickening process). Alternatively, it has a function of executing the process of reducing the line width dimension (thinning process) to obtain the modified design data D1. The thickening process and the thinning process are executed in units of a plurality of blocks that partition the substrate.

  Further, the image processing apparatus 3 corrects the exposure condition of each block in the design data D0. For example, when the design data D0 is data for exposing a standard pattern to all blocks, the design data D0 is corrected to data for exposing a test pattern to a specific block to obtain modified design data D1. Here, the “standard pattern” is a pattern for exposing a circuit pattern for forming a semiconductor element, and the “test pattern” is different from the “standard pattern”, for example, for trial production of a semiconductor element or verification of a manufacturing process. It is a pattern for exposing a circuit pattern.

<Configuration of GUI device>
The GUI device 2 is provided in the image processing device 3 and functions as a graphical user interface (Graphical User Interface) for the operator. FIG. 2 is a block diagram showing a hardware configuration of the GUI device 2.

  The GUI device 2 is, for example, a computer 5 and includes a CPU 230, a ROM 231, a memory 232, a media drive 233, a display unit 200, an operation unit 234, and the like. These hardwares are electrically connected to each other by a bus line 235.

  The CPU 230 controls each part of the hardware based on a program (or a program read by the media drive 233) P stored in the ROM 231 to realize the function of the computer 5 (GUI device 2). The program P can be read by the computer 5 and causes the computer 5 to perform each function.

  The ROM 231 is a read-only storage device that stores in advance a program P and data necessary for controlling the GUI device 2.

  The memory 232 is a storage device that can be read and written, and temporarily stores data generated during arithmetic processing by the CPU 230. The memory 232 is configured by SRAM, DRAM, or the like.

  The media drive 94 has a function of reading information stored in the recording medium M. Part. The recording medium M is a portable recording medium such as a CD-ROM, a DVD (Digital Versatile Disk), or a flexible disk.

  The display unit 200 includes a display such as a color LCD, and variably displays an image for GUI operation, various data, an operation state, and the like on the screen.

  The operation unit 234 is an input device having a keyboard and a mouse, and accepts user operations such as input of commands and various data. Using the operation unit 234, the operator inputs various information to the GUI operation screen displayed on the display unit 200 and operates the screen of the display unit 200.

  FIG. 3 is a block diagram showing a functional configuration of the GUI device 2. FIG. 3 is a block diagram showing the functions exhibited by the hardware configuration of the GUI device 2 by the program P shown in FIG. 2, but these functional blocks can be changed in various forms depending on the combination of hardware and software. Can be realized.

  As shown in FIG. 3, the GUI device 2 includes a display control unit 240. The display control unit 240 controls the screen display of the display unit 200 and includes an initial screen display unit 241, a selected circle display unit 242, a selected block display unit 243, and an exposure condition input display unit 244. The display control unit 2 realizes the function of each unit by the operation of the operation unit 234 by the operator, details of which will be described later in the description of the operation.

<Overall flow for setting exposure conditions>
FIG. 4 is a flowchart showing the overall flow of changing exposure conditions. First, based on the design data D0, whether or not a desired drawing process (exposure process) can be performed is confirmed by a test drawing process in step 10. In this test drawing process, a wiring pattern or the like is drawn on the photoresist film on the substrate by the direct drawing apparatus 100 based on the design data D0. The configuration and operation of the direct drawing apparatus 100 will be described later.

  Next, in step S20, the resist layer remaining on the substrate after the development processing of the substrate subjected to the exposure process in the test drawing process is inspected to check whether or not the resist layer has a desired resist pattern. For example, as described above, when the film thickness of the photoresist film on the substrate before the exposure process varies in the radial direction of the substrate, the width dimension of the resist pattern obtained by the development process after the exposure process is desired. It may be thinner or thicker than the dimensions. When the subsequent etching process is executed in this state, there arises a problem that the line width of the wiring pattern is thinned or thickened on the substrate. If it is determined that the exposure condition needs to be changed in order not to cause this problem, the process proceeds to the next step 30 (in the case of Yes). If the desired resist pattern is obtained, it is not necessary to change the exposure conditions, and the process proceeds to step S50 (in the case of No).

  In the exposure condition setting step of step S30, a block in the substrate that requires changing the exposure condition is selected, and the exposure condition of the selected block is set. Details of the exposure condition setting step will be described with reference to FIG.

  FIG. 5 is a flowchart showing the flow of setting exposure conditions. First, in the initial screen display step of step 310, the initial screen shown in FIG. 6A is displayed on the screen of the display unit 200 provided in the GUI device 2 by the function of the initial screen display unit 241 (FIG. 3) of the display control unit 240. Display the screen. The initial screen has a selection display area 201 and a selection input area 210. In the selection display area 201, a substrate outer shape 202 and a plurality of blocks 203 dividing the inside of the substrate are displayed. The substrate outer shape 202 is a circular substrate outer shape 202 having a diameter corresponding to, for example, 300 mm. The plurality of blocks 203 are displayed in a matrix by matrix lines indicated by broken lines in the figure. The display format of the board outline and the block is not limited to the display format shown in FIG. 6A, and other display formats that can be displayed so as to be visible to the operator may be used.

  The display contents in the selection input area 210 are shown in FIG. 6B and omitted in FIG. The selection input area 210 includes a radius input area 211, a width selection area 212, a width input area 213, an inner radio button 214, an outer radio button 215, a circle selection check box 216, and a select button 217. The display contents in the selection input area 210 are not limited to the display format shown in FIG. 6B, and may be other display formats.

  The radius input area 211 is an area for inputting selection information related to the selected circle, which will be described later, for example, a radius dimension value of the selected circle, which is information related to the size of the selected circle. The information regarding the size of the selected circle may not be the radius dimension value, and may be, for example, the diameter dimension value of the selected circle. The width selection check box 212 is an area for inputting whether or not to perform an operation of selecting a predetermined range of blocks from the selected circle as selection information. The width input area 213 is an area for inputting a dimension value of the selected width when the width selection check box 212 is checked as selection information. The inner radio button 214 is an input area for selecting a block displayed inside the selection circle. The outer radio button 215 is an input area for selecting a block displayed outside the selected circle. The on-circle selection check box 216 is an area for inputting whether or not to select a block on the selected circle. The select button 217 is an input unit for selecting and determining the selected and highlighted block as a block for setting exposure conditions.

  Returning to FIG. 5, the selection information input step in the next step S320 will be described. The selection information input step includes a selection circle radius input step (step S321), a selection circle inside / outside input step (step S322), a selection width input step (step S323), and an input step on the selection circle (step S324). . The selection width input step (step S323) and the selection circle input step (step S324) may be omitted without being executed. The selection information input step (step S320), the subsequent selection circle display step (step S330), and the selection block display step (step S340) will be described with reference to FIG.

<First embodiment>
FIG. 7 shows a first embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. FIG. 7B shows the state of the selection input area 210 in the first embodiment. As shown in FIG. 7B, in the first embodiment, the operator uses the operation unit 234, and in the radius input process (step S321) of the selected circle in the selection information input process (step S320), the radius input area 211 is displayed. Enter "120" in Further, the operator uses the operation unit 234 to select the inner radio button 214 in the selected circle inside / outside input step (step S322).

  Next, the operator uses the operation unit 234 to check the width selection check box 212 in the selection width input step (step S323), and inputs “80” into the width input area 213. In the first embodiment, the input process on the selected circle (step S324) is not executed, and the on-circle selection check box 216 is not selected and not checked.

  As a result of the operation of inputting selection information by such an operator, the display state of the selection display area 201 shown in FIG. 7A is realized. Specifically, in the selected circle display step (step S330), the selected circle 204 having a radius of 120 mm is displayed concentrically with the substrate outer shape 202 on the initial screen by the function of the selected circle display unit 242 (FIG. 3). Is done. Further, in the selected block display step (step S340), the plurality of selected blocks 206 displayed within a range corresponding to 80 mm inward from the selected circle 204 are emphasized by the function of the selected block display unit 243 (FIG. 3). Displayed on the screen. In the drawing, the selected block 206 is hatched in parallel, and the entire outer frame is expressed in bold. For example, the selected block 206 is highlighted in a prominent color such as yellow or red different from the unselected block 203. Is done. Another method may be used as a method for highlighting the selected block 203, and it may be displayed so that the visual difference from the unselected block 203 becomes clear.

  According to the first embodiment described above, since a plurality of selection blocks 206 (selection areas 205) arranged concentrically with the substrate can be selected by one selection information input step S320, operability is good. Instead of this method, for example, in the case of a method of setting a rectangular area by the mouse drag function and selecting the selection area 205, the selection area 205 is divided into at least four rectangular areas, and these rectangular areas are divided. Therefore, a complicated operation of selecting each rectangular area with a mouse is required, and the operability is not good. Further, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selected block 206 is highlighted and displayed, the visibility by the operator can be improved, and the operator can easily determine whether or not the selected block is a desired block for which exposure conditions should be set. Can be judged.

  When the operator determines that the selection block 206 is a desired block for which exposure conditions are to be set, the operator performs an operation of pressing the select button 217 shown in FIG. Then, the process proceeds to the exposure condition input display step (step S350) shown in FIG. In this exposure condition input display step, for example, the exposure condition input area 220a shown in FIG. 8 is displayed on the screen of the display unit 200 by the function of the exposure condition input display unit 224 (FIG. 3). If the operator determines that the selection block 206 is not a desired block, the above steps S321 to S340 are repeated until a desired block is selected.

  The exposure condition input area 220a is an area for inputting an exposure condition when performing an exposure process on the selection block 206. For example, the exposure condition input area 220a is an input area for inputting an exposure condition related to a size change of an exposure pattern to be exposed. is there. For example, the exposure condition input area 220a is an area for inputting a dimension (thickening dimension) for increasing a line width such as a wiring pattern in the x and y directions orthogonal to each other, as shown in FIG. 8B. As described above, an x-dimension input area 221 and a y-dimension input area 222 are provided. The exposure condition input area 220a may be an area for inputting a dimension (thinning dimension) for reducing the line width of a wiring pattern to be exposed. The display format of the exposure condition input area 220a is not limited to the display format shown in FIG. 8B, and may be another display format.

  Returning to FIG. 5, in the exposure condition input step (step S <b> 360), the operator inputs a numerical value (for example, 7) within the range of, for example, 5 to 10 to the x dimension input region 221 using the operation unit 234, and y Nothing is input into the dimension input area 222. By this input operation, for example, 7 μm is input as the fattening dimension in the x direction. Contrary to this input example, a numerical value may be input to the y dimension input area 222 and a numerical value may not be input to the x dimension input area 221 or may be input to both areas 221 and 222. When this exposure condition input process (step S360) is completed, the exposure condition setting process (step S30) shown in FIG. 4 is completed, and the process proceeds to the next exposure condition changing process (step S40).

  Returning to FIG. 4, in the exposure condition changing step (step S40), the drawing conditions (exposure conditions) such as the wiring pattern to be drawn in the selection block 203 are changed. Specifically, the image processing apparatus 3 (FIG. 1) corrects the design data D0 based on, for example, the thickening dimension value input in the exposure condition input step (step S360), and generates corrected design data D1. .

  For example, the modified design data D1 is created by changing the line width data in the design data D0 corresponding to the selected block 206 to be thickened by 7 μm in the x direction. In some cases, the data is changed to be fat in the y direction, or the data is changed to be thin. Further, instead of changing the design data D0, a thickening or thinning change process may be executed on RIP data (run-length data) obtained by RIP development of the design data.

  The modified design data D1 created by the image processing apparatus 3 is transmitted directly to the drawing apparatus 100 via the network N. The direct drawing apparatus 100 executes a drawing operation based on the modified design data D1 (step 50 in FIG. 4). In this drawing operation, for example, a drawing operation in which the line width is increased by 7 μm in the x direction in the region in the substrate corresponding to the selected block 203 is executed. As a result, the problem that the width dimension of the resist pattern after the development processing as described above, which has occurred in the drawing operation based on the design data D0, is solved, and the resist pattern can be formed with a desired width dimension. It becomes possible. Note that when the modified design data D1 is data that has been thinned, a drawing operation is performed so as to be thinned directly by the drawing apparatus. Further, the modified design data D1 may be created so that the width dimension of the wiring pattern obtained after the etching process is increased or decreased rather than the width dimension of the resist pattern after the development process.

<Second embodiment>
Next, a second example of the present embodiment will be described with reference to FIG. FIG. 9 shows a second embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. FIG. 9B shows the state of the selection input area 210 in the second embodiment. As shown in FIG. 9B, in the second embodiment, the operator uses the operation unit 234, and in the radius input process (step S321) of the selected circle in the selection information input process (step S320), the radius input area 211 is displayed. Enter “40” in. Also, the operator uses the operation unit 234 to select the outer radio button 215 in the selected circle inner / outer input step (step S322).

  Next, the operator uses the operation unit 234 to check the width selection check box 212 in the selection width input step (step S323), and inputs “100” in the width input area. In the second embodiment, the input process on the selected circle (step S324) is not executed, and the on-circle selection check box 216 is not selected and not checked.

  As a result of such an input operation by the operator, the display state of the selection display area 201 shown in FIG. 9A is realized. Specifically, in the selected circle display step (step S330), the selected circle 204 having a radius of 40 mm is displayed concentrically with the substrate outer shape 202 on the initial screen by the function of the selected circle display unit 242 (FIG. 3). Is done. Further, in the selection block display step (step S340), a plurality of selection blocks 206 (selection areas 205) displayed within a range corresponding to 40 mm outward from the selection circle 204 by the function of the selection block display unit 243 (FIG. 3). ) Is highlighted on the screen.

  According to the second embodiment described above, since a plurality of selection blocks 206 (selection areas 205) arranged concentrically with the substrate can be selected by one selection information input step S320, operability is good. Instead of this method, for example, in the case of a method of setting a rectangular area by the mouse drag function and selecting the selection area 205, the selection area 205 is divided into at least six rectangular areas, and each rectangular area is divided. This requires a complicated operation of selecting with the mouse, and the operability is not good. Further, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selected block 206 is highlighted and displayed, the visibility by the operator can be improved, and the operator can easily determine whether or not the selected block is a desired block for which exposure conditions should be set. Can be judged.

<Third embodiment>
Next, a third example of the present embodiment will be described with reference to FIGS. 10 and 11. FIG. 10 shows a third embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. FIG. 10B shows the state of the selection input area 210 in the third embodiment. As shown in FIG. 10B, in the third embodiment, the operator uses the operation unit 234, and in the radius input step (step S321) of the selected circle in the selection information input step (step S320), the radius input area 211 is displayed. Enter “150” in. Further, the operator uses the operation unit 234 to select the inner radio button 214 in the selected circle inside / outside input step (step S322).

  In the third embodiment, the selection width input step (step S323) is not executed, the width selection check box 212 is not checked, and nothing is input in the width input area 213. Further, the input process on the selected circle (step S324) is not executed, and the on-circle selection check box 216 is not checked.

  As a result of such an input operation by the operator, the display state of the selection display area 201 shown in FIG. 10A is realized. Specifically, in the selected circle display step (step S330), the selected circle 204 having a radius of 150 mm is displayed concentrically with the substrate outline 202 on the initial screen by the function of the selected circle display unit 242 (FIG. 3). Is done. In this third embodiment, since the size of the board outline 202 and the size of the selection circle 204 are the same, the board outline 202 and the selection circle 204 are displayed in an overlapping manner. In the selected block display step (step S340), a plurality of selected blocks 206 (selected areas 205) inside the selected circle 204 are highlighted and displayed on the screen by the function of the selected block display unit 243 (FIG. 3). The

  In the third embodiment, the block 203 completely contained inside the board outline 202 is set as the selection block 206, and the block 203 located on the line of the board outline 202 is not set as the selection block 206.

  According to the third embodiment described above, since a plurality of selection blocks 206 (selection areas 205) arranged concentrically with the substrate can be selected by a single selection information input step S320, operability is good. Instead of this method, for example, in the method of setting a rectangular area by using the mouse drag function and selecting the selection area 205, the selection area 205 is divided into at least five rectangular areas, and each rectangular area is divided. This requires a complicated operation of selecting with the mouse, and the operability is not good. Further, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selected block 206 is highlighted and displayed, the visibility by the operator can be improved, and the operator can easily determine whether or not the selected block is a desired block for which exposure conditions should be set. Can be judged.

  In the third embodiment, since the block 203 completely contained inside the substrate outer shape 202 can be selected as the selection block 206, it is suitably used when setting the exposure conditions for the block completely contained in the substrate. be able to.

  Next, when the operator performs an operation of pressing the select button 217 shown in FIG. 10B using the operation unit 234, the process proceeds to the exposure condition input display step (step S350) shown in FIG. In this exposure condition input display step, for example, the exposure condition input area 220b shown in FIG. 11 is displayed on the display unit 200 by the function of the exposure condition input display unit 224 (FIG. 3). Whether the content displayed by pressing the select button 217 is the exposure condition input area 220a shown in FIG. 8 as in the first embodiment or the exposure condition input area 220b as in the third embodiment is illustrated. It is set in advance by the setting unit that does not.

  An exposure condition input area 220b shown in FIG. 11 is an area for selecting whether to perform a standard exposure operation or a test exposure operation for the selection block 206. As shown in FIG. A radio button 223 for selecting a test pattern and a radio button 224 for selecting a test pattern. FIG. 11B shows a state in which the standard pattern selection radio button 223 is selected. Here, the “standard pattern” is an original wiring pattern such as a semiconductor chip to be manufactured. Further, the “test pattern” is a wiring pattern for verifying an exposure operation or a prototype chip. The display format of the exposure condition input area 220b is not limited to the display format shown in FIG. 11B, and may be another display format.

  In the third embodiment, in the exposure condition input step (step S360) shown in FIG. 5, the operator selects the radio button 223 for standard pattern selection shown in FIG. 11B by using the operation unit 234. . In the exposure condition changing step (step S40) in FIG. 4, the drawing conditions (exposure conditions) such as the wiring pattern to be drawn in the selection block 203 are changed. Specifically, since the exposure operation by the standard pattern is selected in the exposure condition input step (step S360), the standard exposure by the standard pattern is performed by the image processing apparatus 3 (FIG. 1) in the exposure condition change step (step S40). The modified design data D1 is created by changing the design data D0 so as to execute the operation on the selection block 203.

  The modified design data D1 created by the image processing apparatus 3 is transmitted directly to the drawing apparatus 100 via the network N. The direct drawing apparatus 100 executes a drawing operation based on the modified design data D1 (step 50 in FIG. 4). In this drawing operation, a standard exposure operation for drawing a standard pattern is executed in an area in the substrate corresponding to the selection block 203.

<Fourth embodiment>
Next, a fourth example of the present embodiment will be described with reference to FIG. FIG. 12 shows a fourth embodiment which is one of the embodiments of the GUI screen displayed on the screen of the display unit 200. FIG. 12B shows the state of the selection input area 210 in the fourth embodiment. As shown in FIG. 12B, in the fourth embodiment, the operator uses the operation unit 234, and in the radius input process (step S321) of the selected circle in the selection information input process (step S320), the radius input area 211 is displayed. Enter “150” in. Also, the operator uses the operation unit 234 to select the outer radio button 215 in the selected circle inner / outer input step (step S322).

  The operator uses the operation unit 234 to select and check the on-circle selection check box 216 in the input process on the selected circle (step S324). In the third embodiment, the selection width input step (step S323) is not executed, the width selection check box 212 is not checked, and nothing is input in the width input area 213.

  As a result of such an input operation by the operator, the display state of the selection display area 201 shown in FIG. 12A is realized. Specifically, in the selected circle display step (step S330), the selected circle 204 having a radius of 150 mm is displayed concentrically with the substrate outline 202 on the initial screen by the function of the selected circle display unit 242 (FIG. 3). Is done. In this third embodiment, since the size of the board outline 202 and the size of the selection circle 204 are the same, the board outline 202 and the selection circle 204 are displayed in an overlapping manner. Further, in the selection block display step (step S340), a selection area 205 including a plurality of selection blocks 206 on the selection circle 204 and a plurality of selection blocks 206 outside the selection circle 204 by the function of 243 (FIG. 3). Is highlighted on the screen.

  In the fourth embodiment, a block 203 that is not completely contained inside the board outline 202 and is divided by the board outline 202, that is, a block on the outer peripheral edge of the board is the selection block 206.

  According to the fourth embodiment described above, a plurality of selection blocks 206 (selection areas 205) arranged concentrically with the substrate in one selection information input step S320, in other words, arranged on the outer periphery of the substrate. The operability is good. Instead of this method, for example, in the case of a method of setting a rectangular area by the mouse drag function and selecting the selection area 205, the selection area 205 is divided into at least eight rectangular areas, and each rectangular area is divided. This requires a complicated operation of selecting with the mouse, and the operability is not good. Further, since the selection circle 204 concentric with the substrate outer shape 202 is used, the selection region 205 concentric with the substrate outer shape 202 can be easily set without using complicated thinking. Furthermore, since the selected block 206 is highlighted and displayed, the visibility by the operator can be improved, and the operator can easily determine whether or not the selected block is a desired block for which exposure conditions should be set. Can be judged.

  The fourth embodiment is not completely included inside the board outline 202, and a part 203 included in the board outline 202 can be selected as the selection block 206, so that it is partially included in the board. It can be suitably used when setting exposure conditions for blocks on the outer periphery of the substrate.

  Next, when the operator performs an operation of pressing the select button 217 shown in FIG. 12B using the operation unit 234, the process proceeds to the exposure condition input display step (step S350) shown in FIG. In this exposure condition input display step, for example, the exposure condition input area 220b shown in FIG. 11 is displayed on the display unit 200 by the function of the exposure condition input display unit 224 (FIG. 3).

  In the fourth embodiment, in the exposure condition input step (step S360) shown in FIG. 5, the operator uses the operation unit 234 to select the radio button 224 for test pattern selection shown in FIG. . In the exposure condition changing step (step S40) in FIG. 4, the drawing conditions (exposure conditions) such as the wiring pattern to be drawn in the selection block 203 are changed. Specifically, since the exposure operation by the test pattern is selected in the exposure condition input step (step S360), the test processing by the test pattern is performed by the image processing apparatus 3 (FIG. 1) in the exposure condition change step (step S40). The modified design data D1 is created by changing the design data D0 so as to execute the operation on the selection block 203.

  The modified design data D1 created by the image processing apparatus 3 is transmitted directly to the drawing apparatus 100 via the network N. The direct drawing apparatus 100 executes a drawing operation based on the modified design data D1 (step 50 in FIG. 4). In this drawing operation, a test exposure operation for drawing a test pattern is executed in an area in the substrate corresponding to the selected block 203. Although the test exposure operation is also performed on the selected block outside the substrate, there is no particular problem. Rather, if the exposure operation is performed from outside the substrate, the exposure operation inside the substrate is more stable. There is.

  The third and fourth embodiments described above may not be executed after the test drawing process (step S10) shown in FIG. 4 as in the first and second embodiments. For example, the third embodiment or the fourth embodiment may be executed in the initial setting operation of the exposure operation of the direct drawing apparatus 100.

  Further, after performing the exposure condition setting step (step S30 in FIG. 4) of the third and fourth embodiments, the exposure condition changing step (step S40) of the third and fourth embodiments is performed. Also good. In this case, in the drawing execution step (step S50), the standard exposure operation is executed for the block that is completely included in the substrate, and the block that is located on the outer edge of the substrate and partially included in the substrate is used. A test exposure operation is performed.

<Configuration of direct drawing apparatus>
Next, the configuration of the direct drawing apparatus 100 will be described with reference to FIGS. 13 and 14. 13 is a side view of the direct drawing apparatus 100 according to an embodiment of the present invention, and FIG. 14 is a plan view of the direct drawing apparatus 100 shown in FIG.

  The direct drawing apparatus 100 is an apparatus for drawing an exposure pattern by scanning a spatially modulated light beam on the surface of a substrate W such as a semiconductor substrate or a glass substrate provided with a photoresist film (photosensitive material). is there. Specifically, in the manufacturing process of the multichip module, a wiring pattern is drawn on a photosensitive photoresist film formed on the surface of a support substrate (hereinafter simply referred to as “substrate”) W that is an exposure target substrate. It is a device for doing. The substrate W has a circular shape, and a notch called a notch is formed in a part of the outer peripheral edge thereof. An orientation flat may be provided on a part of the outer peripheral edge of the substrate W instead of the notch. The direct drawing apparatus 100 is an exposure apparatus that performs exposure processing in units of blocks that divide the substrate W.

  As shown in FIGS. 13 and 14, the direct drawing apparatus 100 mainly measures the stage 10 that holds the substrate W, the stage moving mechanism 20 that moves the stage 10, and the position parameter corresponding to the position of the stage 10. A position parameter measuring mechanism 30, an optical head unit 50 that irradiates the surface of the substrate W with pulsed light, one alignment camera 60, and a control unit 70.

  Further, in the direct drawing apparatus 100, each part of the apparatus is arranged inside the main body formed by attaching the cover 102 to the main body frame 101 to form the main body, and outside the main body (in this embodiment, As shown in FIG. 1, a substrate storage cassette 110 is disposed on the right hand side of the main body. The substrate storage cassette 110 stores an unprocessed substrate W to be subjected to exposure processing, and is loaded into the main body by a transfer robot 120 disposed inside the main body. Further, after the exposure process (pattern drawing process) is performed on the unprocessed substrate W, the substrate W is unloaded from the main body by the transfer robot 120 and returned to the substrate storage cassette 110. Thus, the transfer robot 120 functions as a transfer unit.

  In this main body, as shown in FIG. 14, the transfer robot 120 is disposed at the right hand end inside the main body surrounded by the cover 102. A base 130 is disposed on the left hand side of the transfer robot 120. One end side region (the right-hand side region in FIGS. 13 and 14) of the base 130 is a substrate delivery region for delivering the substrate W to and from the transfer robot 120, whereas the other end side region (Left-hand side region in FIGS. 13 and 14) is a pattern drawing region for pattern drawing on the substrate W. On the base 130, a head support 140 is provided at the boundary position between the substrate delivery area and the pattern drawing area. In the head support portion 140, as shown in FIG. 2, two leg members 141 and 142 are erected upward from the base 130, and the beam is formed so as to bridge the top portions of the leg members 141 and 142. A member 143 is provided horizontally. Then, as shown in FIG. 13, an alignment camera (imaging unit) 60 is fixed to the beam member 143 on the opposite side of the pattern drawing region side, and the surface of the substrate W held on the stage 10 (to be drawn) as will be described later. A plurality of alignment marks and lower layer patterns on the surface and the exposed surface).

  The stage 10, which is a support unit that supports the substrate W, is moved in the X direction, the Y direction, and the θ direction by the stage moving mechanism 20 on the base 130. That is, the stage moving mechanism 20 positions the stage 10 by moving it two-dimensionally in the horizontal plane and adjusting the relative angle with respect to the optical head unit 50 described later by rotating it around the θ axis (vertical axis). To do.

  Further, the optical head unit 50 is attached to the head support unit 140 configured in this manner so as to be movable in the vertical direction. As described above, the alignment camera 60 and the optical head unit 50 are attached to the head support unit 140, and the positional relationship between the two in the XY plane is fixed. The optical head unit 50 performs pattern drawing on the substrate W, and is moved in the vertical direction by a head moving mechanism (not shown). When the head moving mechanism operates, the optical head unit 50 moves in the vertical direction, and the distance between the optical head unit 50 and the substrate W held on the stage 10 can be adjusted with high accuracy. Thus, the optical head unit 50 functions as a drawing head.

  Two leg members 141 and 142 are also erected at the end of the base 130 opposite to the board delivery side (the left hand side end in FIGS. 13 and 14). And the box 172 which accommodated the optical system of the optical head part 50 is provided so that the beam member 143 and the top part of the two leg members 141 and 142 may be bridged, and the pattern drawing area | region of the base 130 is provided from upper direction. Covering.

  The stage 10 has a cylindrical outer shape, and is a holding unit for placing and holding the substrate W in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. For this reason, when the substrate W is placed on the stage 10, the substrate W is attracted and fixed to the upper surface of the stage 10 by the suction pressure of the plurality of suction holes. In the present embodiment, a photoresist (photosensitive material) film is formed in advance on the surface (main surface) of the substrate W to be subjected to the drawing process by a spin coating method (rotary coating method) or the like.

  The stage moving mechanism 20 moves the stage 10 in the main scanning direction (Y-axis direction), sub-scanning direction (X-axis direction), and rotation direction (rotation direction around the Z-axis) with respect to the base 130 of the direct drawing apparatus 100. It is a mechanism for moving. The stage moving mechanism 20 includes a rotation mechanism 21 that rotates the stage 10, a support plate 22 that rotatably supports the stage 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a sub-scanning mechanism 23. And a main scanning mechanism 25 for moving the base plate 24 in the main scanning direction.

  The rotation mechanism 21 has a motor constituted by a rotor attached inside the stage 10. A rotary bearing mechanism is provided between the lower surface side of the center portion of the stage 10 and the support plate 22. For this reason, when the motor is operated, the rotor moves in the θ direction, and the stage 10 rotates within a predetermined angle range around the rotation axis of the rotary bearing mechanism.

  The sub-scanning mechanism 23 has a linear motor 23 a that generates a propulsive force in the sub-scanning direction by a mover attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. The sub-scanning mechanism 23 has a pair of guide rails 23 b that guide the support plate 22 along the sub-scanning direction with respect to the base plate 24. For this reason, when the linear motor 23a is operated, the support plate 22 and the stage 10 move in the sub-scanning direction along the guide rail 23b on the base plate 24.

  The main scanning mechanism 25 has a linear motor 25 a that generates a propulsive force in the main scanning direction by a moving element attached to the lower surface of the base plate 24 and a stator laid on the upper surface of the head support portion 140. The main scanning mechanism 25 has a pair of guide rails 25b for guiding the base plate 24 along the main scanning direction with respect to the head support portion 140. For this reason, when the linear motor 25a is operated, the base plate 24, the support plate 22, and the stage 10 move in the main scanning direction along the guide rail 25b on the base 130. As such a stage moving mechanism 20, a conventionally used XY-θ axis moving mechanism can be used.

  The position parameter measuring mechanism 30 is a mechanism for measuring a position parameter of the stage 10 using laser beam interference. The position parameter measurement mechanism 30 mainly includes a laser beam emitting unit 31, a beam splitter 32, a beam bender 33, a first interferometer 34, and a second interferometer 35.

  The laser beam emitting unit 31 is a light source device for emitting a measurement laser beam. The laser beam emitting unit 31 is installed at a fixed position, that is, a position fixed to the base 130 and the optical head unit 50 of the present apparatus. The laser light emitted from the laser light emitting unit 31 first enters the beam splitter 32 and travels from the beam splitter 32 to the beam bender 33 and from the beam splitter 32 to the second interferometer 35. The light is branched to the second branched light.

  The first branched light is reflected by the beam bender 33 and is incident on the first interferometer 34, and at the same time, a first part (here, the −Y side end of the stage 10 from the first interferometer 34). Irradiated to the central portion 10a of the end on the -Y side. Then, the first branched light reflected by the first part 10a is incident on the first interferometer 34 again. The first interferometer 34 determines a positional parameter corresponding to the position of the first portion 10a of the stage 10 based on the interference between the first branched light traveling toward the stage 10 and the first branched light reflected from the stage 10. measure.

  On the other hand, the second branched light is incident on the second interferometer 35, and the second part (different from the first part 10a) on the −Y side end of the stage 10 from the second interferometer 35. Part) 10b is irradiated. Then, the second branched light reflected at the second portion 10 b is incident on the second interferometer 35 again. The second interferometer 35 sets a positional parameter corresponding to the position of the second portion 10b of the stage 10 based on the interference between the second branched light traveling toward the stage 10 and the second branched light reflected from the stage 10. measure. The first interferometer 34 and the second interferometer 35 transmit the position parameters acquired by the respective measurements to the control unit 70.

  The optical head unit 50 is a light irradiation unit that emits pulsed light toward the surface of the substrate W held on the stage 10. The optical head unit 50 includes a beam member 143 laid on the base 130 so as to straddle the stage 10 and the stage moving mechanism 20, and one optical head provided on the beam member 143 substantially at the center in the sub-scanning direction. Part 50. The optical head unit 50 is connected to one laser oscillator 54 via the illumination optical system 53. Further, a laser drive unit 55 that drives the laser oscillator 54 is connected to the laser oscillator 54 that is a light source. When the laser driving unit 55 is operated, pulsed light is emitted from the laser oscillator 54, and the pulsed light is introduced into the optical head unit 50 through the illumination optical system 53.

  In the optical head unit 50, pulse light is introduced from the illumination optical system 53 into the optical head unit 50 from the introduction unit, and the introduced pulse light is converted into a light beam shaped into a predetermined pattern shape. A pattern is drawn on the surface of the substrate W by irradiating the surface of the substrate W and exposing the photoresist film (photosensitive layer) on the substrate W.

  In the direct drawing apparatus 100 of FIG. 13, a laser oscillator 54 that is a light source is provided in the box 172, and light from the laser oscillator 54 is introduced into the optical head unit 50 through the illumination optical system 53. In this embodiment, a photoresist (photosensitive material) film that is exposed to ultraviolet rays is formed in advance on the main surface of the substrate W, and the laser oscillator 54 uses ultraviolet rays (i-line) having a wavelength λ of about 365 nm. It is a laser light source which radiates | emits. Of course, the laser oscillator 54 may emit light of other wavelengths included in the wavelength band in which the photosensitive material of the substrate W is exposed.

  FIG. 15 is a diagram showing the illumination optical system 53 and the projection optical system 517 of the direct drawing apparatus 100. Light from the laser oscillator 54 shown in FIG. 13 is applied to the spatial light modulator 511 of the light modulation unit 512 via the illumination optical system 53 and the mirror 516 shown in FIG. The light spatially modulated by the spatial light modulator 511 is irradiated onto the substrate W supported by the stage 10 via the projection optical system 517.

  The illumination optical system 53 includes a telescope 540, a condenser lens 541, an attenuator 542, and a focusing lens 543. The telescope 540 has a function of expanding the beam diameter (cross-sectional shape) of light (laser beam) in the X and Z directions, and is composed of three lenses. The condenser lens 541 has a function of expanding the laser beam in the X direction. The attenuator 542 adjusts the energy amount (transmission amount) of the laser beam that passes therethrough. The focusing lens 543 has a function of reducing the cross-sectional dimension of the laser beam in the Z direction. Light (laser beam) emitted from the focusing lens 543 is applied to the spatial light modulator 511 as linear illumination light that extends in the X direction and is reduced in the Y direction via the mirror 516. The illumination optical system 53 does not necessarily have to be configured as shown in FIG. 15, and other optical elements may be added.

  The light irradiated from the illumination optical system 53 to the spatial modulator 511 passes through the opening of the shielding plate 521 of the projection optical system, which will be described later, from the specularly reflected light (zeroth-order light) reflected from the spatial light modulator 511. Since the (± 1) -order diffracted light generated from the modulator 511 is shielded by the shielding plate 521, it is preferably closer to parallel light. For this reason, the numerical aperture NA1 of the illumination optical system 53 is set to be larger than 0 (zero) and 0.06 or less. The numerical aperture NA1 is obtained by NA1 = n · sin θ1, where θ1 is the maximum angle with respect to the optical axis of the illumination light in the YZ plane through which linear illumination light extending in the X direction passes. However, n is the refractive index of the medium. In the present embodiment, the medium is air, so the refractive index n is 1.

  The projection optical system 517 includes four lenses 518, 519, 520, and 522, a shielding plate (aperture member) 521, a zoom lens 523, and a focusing lens 524. The lenses 518, 519, 520, 522 and the shielding plate 521 of the projection optical system 517 constitute a schlieren optical system that is telecentric on both sides, and the light that has passed through the lens 520 is guided to the shielding plate 521 having an aperture. In addition, a part of the light (regular reflection light (0th order light)) is guided to the lens 522 through the opening, and the remaining light ((± 1) order diffracted light) is shielded by the shielding plate 521. The light that has passed through the lens 522 is guided to the zoom lens 523, and is guided to the photoresist film (photosensitive material) on the substrate W at a predetermined magnification via the focusing lens 524. Note that the projection optical system 517 is not necessarily configured as shown in FIG. 3, and other optical elements may be added.

  In order to reduce the change in the diameter (width) of light irradiated onto the substrate W according to the focal position (focus position), it is necessary to set the depth of field of the projection optical system 517 to be long (deep). For this reason, the numerical aperture NA2 of the projection optical system 517 is preferably small, and is set to 0.1, for example. The numerical aperture NA2 is obtained by NA2 = n · sin θ2, where θ2 is the maximum angle with respect to the optical axis of the projection light on the YZ plane through which linear projection light extending in the X direction passes. However, n is the refractive index of the medium. In the present embodiment, the medium is air, so the refractive index n is 1.

  The value (σ value) obtained by dividing the numerical aperture NA1 of the illumination optical system 53 by the numerical aperture NA2 of the projection optical system 517 is a substrate in which the specularly reflected light reflected by the spatial light modulator 511 is formed in a desired shape as described above. In order to irradiate on W, it is preferable to be close to 0, for example, larger than 0 and set to 0.6 or less.

  A drawing controller 515 that performs modulation control of the light modulation unit 512 is electrically connected to the spatial light modulator 511. The drawing control unit 515 and the projection optical system 517 are built in the optical head unit 50. An exposure control unit 514 and a drawing signal processing unit 513 are electrically connected to the drawing control unit 515, respectively. A drawing signal processing unit 513 and the stage moving mechanism 20 are electrically connected to the exposure control unit 514. The exposure control unit 514 and the drawing signal processing unit 513 are provided in the control unit 70 of FIG.

  FIG. 16 is an enlarged view showing the spatial light modulator 511. The spatial light modulator 511 shown in FIG. 16 is manufactured using a semiconductor device manufacturing technique, and is a diffraction grating capable of changing the depth of the grating. In the spatial light modulator 511, a plurality of movable ribbons 530a and fixed ribbons 531b are alternately arranged in parallel. As will be described later, the movable ribbon 530a can be moved up and down individually with respect to the reference plane behind, and fixed. The ribbon 531b is fixed with respect to the reference plane. For example, GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, Calif.)) Is known as a diffraction grating type spatial light modulator.

  A fixed reflection surface is provided on the upper surface of the fixed ribbon 531b, and a movable reflection surface is provided on the upper surface of the movable ribbon 530a. A plurality of movable ribbons 530a and fixed ribbons 531b are irradiated with linear light whose light beam cross section is long in the arrangement direction. In the spatial light modulator 511, if each of the adjacent movable ribbon 530a and fixed ribbon 531b has a single ribbon pair as a lattice element, three or more adjacent lattice elements are drawn in one pixel of a pattern to be drawn. Correspond. In the present embodiment, a set of four lattice elements adjacent to each other is a modulation element corresponding to one pixel, and in FIG. 16, a set of ribbon pairs constituting one modulation element is denoted by reference numeral 535. Surrounded by a thick rectangle.

  The driver circuit unit 536 deflects the movable ribbon 530a toward the reference plane side by applying a voltage (potential difference) between the movable ribbon 530a and the reference plane. As a result, the movable ribbon 530a moves up and down between an initial position separated from the reference plane and a position in contact with the reference plane, and the height position of the movable ribbon 530a is set.

  A control unit 70 shown in FIG. 13 is an information processing unit for directly controlling the operation of each unit in the drawing apparatus 100 while executing various arithmetic processes. FIG. 17 is a block diagram illustrating a connection configuration between the above-described units of the direct drawing apparatus 100 and the control unit 70. As shown in FIG. 17, the control unit 70 includes the rotation mechanism 21, linear motors 23 a and 25 a, the laser beam emitting unit 31, the first interferometer 34, the second interferometer 35, the illumination optical system 53, The laser drive unit 55, the projection optical system 517, and the alignment camera 60 are electrically connected. The control unit 70 is configured by, for example, a computer having a CPU and a memory, and performs operation control of the above-described units when the computer operates according to a program installed in the computer.

  Further, the control unit 70 configured as described above has a CPU 71, a memory 72, and the like as shown in FIG. Arranged in an electrical rack (not shown). FIG. 18 is a block diagram illustrating a control unit that controls the drawing operation. The rasterization unit 73 and the data generation unit 75 are realized by the CPU in the computer 71 performing arithmetic processing according to a predetermined program.

  For example, pattern data corresponding to one semiconductor package is pattern data generated by an external CAD or the like, which is prepared in advance in the memory 72 as wiring pattern data 76, and is stored in the wiring pattern data 76 and the data generation unit 75. The drawing pattern of the semiconductor package is drawn on the substrate W as described later. Here, the computer 71 plays a role of the drawing signal processing unit 513 shown in FIG. The wiring pattern data 76 corresponds to the design data D0 or the modified design data D1 described above.

  The rasterizing unit 73 divides and rasterizes the unit area indicated by the drawing data generated by the data generating unit 75, generates raster data 77, and stores it in the memory 72. In this way, the unprocessed substrate W is drawn after the preparation of the raster data 77 or in parallel with the preparation of the raster data 77.

  On the other hand, the data generation unit 75 acquires image data from the alignment camera 60 and generates, for example, electrode connection data corresponding to the displacement from the detection result of the electrode pads already formed on the substrate W. As for this data generation, when the data generation for one divided region is completed, the generated raster data 77 is sent to the exposure control unit 514.

  The drawing data generated in this way is sent from the data generation unit 75 to the exposure control unit 514, and the exposure control unit 514 controls each part of the light modulation unit 512 and the stage moving mechanism 20, thereby drawing one stripe. Is called. Control of the light modulation unit 512 by the exposure control unit 514 is executed via the drawing control unit 515 as shown in FIG. When the exposure recording for one stripe is completed, the same processing is performed for the next divided region, and drawing is repeated for each stripe. In the present embodiment, the control unit of the present invention is realized by the control unit 70, the drawing control unit 515, the exposure control unit 514, the driver circuit unit 536, and the like.

  Further, the direct drawing apparatus 100 divides the substrate W by controlling the light modulation unit 512 by the exposure control unit 514 executed via the drawing control unit 515 shown in FIG. 15 during the drawing operation for each stripe. The exposure operation is executed in units of blocks based on the exposure conditions set for each block 203 (FIG. 6A). This exposure condition is set, for example, according to the first embodiment, the second embodiment, the third embodiment, or the fourth embodiment described above.

  In this embodiment, the computer 71 shown in FIG. 18 is directly provided in the drawing apparatus 100. However, the computer 71 may be provided in the image processing apparatus 3 shown in FIG.

<Stage position control>
The direct drawing apparatus 100 has a function of controlling the position of the stage 10 based on the measurement results of the first interferometer 34 and the second interferometer 35. Hereinafter, such position control of the stage 10 will be described.

  As described above, the first interferometer 34 and the second interferometer 35 measure position parameters corresponding to the positions of the first part 10a and the second part 10b of the stage 10, respectively. The first interferometer 34 and the second interferometer 35 transmit the position parameters P1 and P2 acquired by the respective measurements to the control unit 70. As illustrated in FIG. 6, the control unit 70 includes a computer 71 as a calculation unit. The function of the computer 71 is realized by the CPU of the computer 71 operating according to a predetermined program, for example.

  On the other hand, the control unit 70 calculates the position of the stage 10 (the position in the Y-axis direction and the rotation angle around the Z-axis) based on the position parameters transmitted from the first interferometer 34 and the second interferometer 35. . Next, the control unit 70 accurately controls the position of the stage 10 and the moving speed of the stage 10 by operating the stage moving mechanism 20 while referring to the calculated position of the stage 10. Here, the control unit 70 also corrects the tilt of the stage 10 (shift in the rotation angle around the Z axis) accompanying the movement in the main scanning direction by rotating the stage 10 around the Z axis. Further, the control unit 70 accurately controls the irradiation position of the pulsed light on the surface of the substrate W by operating the laser driving unit 55 while referring to the calculated position of the stage 10.

<Operation of direct drawing device>
Next, an example of the operation of the direct drawing apparatus 100 will be described with reference to the flowchart of FIG.

  When processing the substrate W in the direct drawing apparatus 100, first, calibration processing for adjusting the position and light amount of the pulsed light emitted from the optical head unit 50 is performed (step S1). In the calibration process, first, the CCD camera (not shown) is arranged below the optical head unit 50 by moving the base plate 24. Then, while moving the CCD camera in the sub-scanning direction, the optical head unit 50 emits pulsed light, and the emitted pulsed light is photographed by the CCD camera. The control unit 70 operates the illumination optical system 53 of the optical head unit 50 based on the acquired image data, and thereby adjusts the position and amount of pulsed light emitted from the optical head unit 50.

  When the calibration process is completed, the operator or the transfer robot 120 next carries the substrate W and places it on the upper surface of the stage 10 (step S2).

  Subsequently, the direct drawing apparatus 100 performs an alignment process for adjusting the relative position between the substrate W placed on the stage 10 and the optical head unit 50 (step S3). In step S2, the substrate W is placed at a substantially predetermined position on the stage 10, but the positional accuracy for drawing a fine pattern is often not sufficient. For this reason, by performing the alignment process, the position and inclination of the substrate W are finely adjusted to improve the accuracy of the subsequent drawing process.

  In the alignment process, first, alignment marks formed at the four corners of the upper surface of the substrate W are photographed by the alignment camera 60, respectively. Based on the position of each alignment mark in the image acquired by the alignment camera 60, the control unit 70 shifts the substrate W from the ideal position (a positional shift amount in the X-axis direction, a positional shift amount in the Y-axis direction, And the amount of inclination around the Z axis). And the position of the board | substrate W is correct | amended by operating the stage moving mechanism 20 in the direction which reduces the calculated deviation | shift amount.

  Subsequently, the direct drawing apparatus 100 performs a drawing process on the substrate W after the alignment process (step S4). That is, the direct drawing apparatus 100 irradiates the upper surface of the substrate W with the pulsed light from the optical head unit 50 toward the upper surface of the substrate W while moving the stage 10 in the main scanning direction and the sub-scanning direction. A pattern is drawn for each of a plurality of blocks that partition the substrate W.

  When the drawing process is completed, the direct drawing apparatus 100 operates the stage moving mechanism 20 to move the stage 10 and the substrate W to the carry-out position. Then, the worker or the transfer robot 120 unloads the substrate W from the upper surface of the stage 10 (step S5).

<Deformation implementation>
In the direct drawing apparatus 100 of the above embodiment, the substrate W is moved with respect to the optical head unit 50 and the like, but the relative movement is realized by moving the optical head unit 50 and the like with respect to the solid-supported substrate W. You may let them.

  The exposure apparatus is not limited to the direct drawing apparatus 100, and the present invention can be applied to any exposure apparatus in which exposure conditions are set in units of blocks that divide the substrate W. For example, a pattern formed on a reticle can be applied. A stepper (reduction projection type exposure apparatus) that performs reduction projection may be used.

2 GUI device 4 Exposure system 5 Computer 100 Direct drawing device (exposure device)
200 Display Unit 201 Selection Display Area 202 Substrate Outline 203 Block 204 Selection Circle 206 Selection Block 210 Selection Input Area 211 Radius Input Area 220 Exposure Condition Input Area 240 Display Control Part 241 Initial Screen Display Part 242 Selection Circle Display Part 243 Selection Block Display Part 244 Exposure condition input display W substrate P program

Claims (20)

A GUI apparatus for an exposure apparatus that performs exposure processing in block units on a photoresist film formed on a surface of a circular substrate,
A display unit having a screen;
An operation unit for operating the screen of the display unit;
A display control unit for controlling the screen display of the display unit;
With
The display control unit
An initial screen display section for displaying an initial screen having a selection display area including a plurality of blocks that divide the board outline and the inside of the board and a selection circle for selecting selection information about the selection circle;
A selection circle display unit that displays a selection circle on the screen of the display unit concentrically with the substrate outer shape based on the selection information;
A selected block display unit that highlights and displays the selected block selected based on the selection information on the screen of the display unit;
An exposure condition input display unit for displaying an exposure condition input area for inputting an exposure condition when performing exposure processing on the selected block on the screen of the display unit;
A GUI apparatus for an exposure apparatus, comprising: The GUI apparatus for an exposure apparatus according to claim 1,
For an exposure apparatus in which a selection input area has, as selection information related to a selected circle, an input area for inputting information related to the size of the selected circle and an input area for inputting information related to the inside or outside of the selected circle GUI device. The GUI apparatus for an exposure apparatus according to claim 2,
A GUI apparatus for an exposure apparatus, wherein the selection input area has an input area for inputting information relating to a selection width from the selection circle as selection information relating to the selection circle. The GUI apparatus for an exposure apparatus according to any one of claims 1 to 3,
A GUI apparatus for an exposure apparatus having an input area for inputting whether or not the selection input area selects a block on the selected circle as selection information regarding the selected circle. The GUI apparatus for an exposure apparatus according to any one of claims 1 to 4,
A GUI apparatus for an exposure apparatus, wherein the exposure condition input area is an input area for inputting an exposure condition related to a change in size of an exposure pattern. The GUI apparatus for an exposure apparatus according to any one of claims 1 to 4,
A GUI apparatus for an exposure apparatus, wherein the exposure condition input area is an input area for inputting an exposure condition for selecting a standard exposure operation or a test exposure operation. A GUI apparatus for an exposure apparatus according to any one of claims 1 to 6,
An exposure apparatus that performs exposure processing in block units on a photoresist film formed on the surface of a circular substrate;
An exposure system comprising: The exposure system according to claim 7, wherein
An exposure system, wherein the exposure apparatus is a direct drawing apparatus that draws an exposure pattern by scanning a spatially modulated light beam on the photoresist film. An initial screen having a selection display area including a plurality of blocks defining the board outline and the inside of the board and a selection input area for inputting selection information regarding the selection circle is displayed on the screen of the display section of the GUI device. Initial screen display process to be displayed on,
A selection information input step of inputting selection information related to the selection circle in the selection input area of the initial screen by the operation unit of the GUI device;
A selection circle display step of displaying the selection circle on the screen of the display unit concentrically with the substrate outer shape based on the selection information input by the selection information input step;
A selected block display step of highlighting and displaying the selected block selected based on the selection information on the screen of the display unit;
An exposure condition input display step for displaying an exposure condition input area for inputting an exposure condition when performing exposure processing on the selected block on the screen of the display unit;
An exposure condition input step for inputting an exposure condition in an exposure condition input area by an operation unit;
An exposure condition setting method comprising: In the exposure condition setting method according to claim 9,
An exposure condition setting method comprising: a selection information input step including, as selection information related to a selected circle, a step for inputting information related to the size of the selected circle, and a step for inputting information related to the inside or outside of the selected circle. In the exposure condition setting method according to claim 10,
An exposure condition setting method further comprising a step of inputting information relating to a selection width from the selection circle as selection information relating to the selection circle in the selection information input step. In the exposure condition setting method according to any one of claims 9 to 11,
An exposure condition setting method further comprising a step for inputting information on whether or not a block on the selected circle is selected as selection information on the selected circle in the selection input step. In the exposure condition setting method according to any one of claims 9 to 12,
An exposure condition setting method in which the exposure condition input in the exposure condition input step is an exposure condition related to a size change of the exposure pattern. In the exposure condition setting method according to any one of claims 9 to 12,
An exposure condition setting method in which the exposure condition input in the exposure condition input step is an exposure condition for selecting a standard exposure operation or a test exposure operation. A computer-readable program provided in a GUI apparatus for an exposure apparatus that performs exposure processing in block units on a photoresist film formed on the surface of a circular substrate,
On the screen of the display unit provided in the GUI device,
An initial screen display function for displaying an initial screen having a selection input area for inputting selection information related to a selection circle and a selection display area including a plurality of blocks partitioning the board outline and the board;
A selection circle display function for displaying a selection circle on the screen of the display unit concentrically with the substrate outer shape based on the selection information;
A selected block display function for highlighting and displaying the selected block selected based on the selection information on the screen of the display unit;
An exposure condition input display function for displaying an exposure condition input area for inputting an exposure condition when performing exposure processing on the selected block on the screen of the display unit;
A program characterized by causing a computer to demonstrate. In the program according to claim 15,
As an initial screen display function, a function for displaying an input area for inputting information related to the size of the selected circle as selection information relating to the selected circle, and information relating to the inside or outside of the selected circle are input to the selected input area. A program that causes a computer to display the input area of the computer. The program according to claim 16, wherein
A program that causes a computer to exhibit a function of displaying an input area for inputting information about a selection width from a selected circle as selection information about the selected circle in the selection input area. In the program according to any one of claims 15 to 17,
A program for causing a computer to exhibit a function of displaying an input area for inputting information on whether or not to select a block on a selected circle as selection information on the selected circle in the selected input area. In the program according to any one of claims 15 to 18,
A program that causes a computer to exhibit a function of displaying an input area for inputting an exposure condition related to a change in size of an exposure pattern in the exposure condition input area. The GUI apparatus for an exposure apparatus according to any one of claims 15 to 18,
A program that causes a computer to function to display an input area for inputting an exposure condition for selecting a standard exposure operation or a test exposure operation in the exposure condition input area.

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