TWI647739B - Pattern forming apparatus and pattern forming method - Google Patents

Abstract

The present invention provides a technique capable of improving the amount of processing in an alignment process.

In the alignment process, first, the alignment marks Ma0 and Ma1 of the first group are imaged by the alignment camera 60, and the first position information is acquired. The control unit 70 predicts the second position information by calculation based on the first position information. Thereafter, the alignment camera 60 captures the alignment marks Ma11 to Ma14 of the second group with reference to the predicted value of the second position information, and acquires the actual measurement value of the second position information. Since the alignment mark of the first group which is easily included in the imaging field of view 65 is first photographed, the actual measurement value of the first position information is obtained in a shorter time. Further, since the alignment mark of the second group which is hard to be included in the imaging field 65 is imaged with reference to the predicted value of the second position information, the actual measurement value of the second position information is acquired in a shorter time.

Description

Pattern forming device and pattern forming method

The present invention relates to a pattern forming apparatus and a pattern forming method for forming a pattern on the main surface based on position information of a plurality of alignment marks formed on a main surface on one side of a substrate.

As a pattern forming technique, a technique of forming a pattern by exposure with respect to a main surface of a substrate to be processed, or a pattern of a charged particle beam such as an electron beam by irradiating a main surface of a substrate to be processed is known. technology.

For example, there is known a direct drawing technique in which a desired exposure pattern is drawn on the main surface by irradiating light for exposure while scanning a main surface of a substrate to be drawn (Patent Documents 1 and 2) ). Further, as another example, a mask exposure technique is known in which a mask is formed by exposing a mask that selectively irradiates planar light to a main surface of a substrate.

For example, in the direct drawing device, the pattern forming process is usually performed by controlling each part of the drawing data converted from the design data including the specific pattern. The design data is prepared on the premise that the undeformed substrate is held at a desired position on the substrate holding portion. However, the substrate to be processed is not necessarily placed at an ideal position of the substrate holding portion. Further, there is a case where warpage, skew, deformation, or the like is generated in the substrate to be processed. Therefore, there are cases where even self-design data conversion is directly used. The depiction of the resulting data is not able to obtain sufficient quality of depiction.

Therefore, in such a device, the alignment process is generally performed before the pattern forming process. In the alignment process, information on the positional shift of the substrate held by the substrate holding portion or the deformation of the substrate is obtained, and the positional shift or deformation is corrected.

In the alignment process, first, the imaging unit captures the main surface of the substrate, thereby acquiring position information of a plurality of alignment marks formed on the main surface. Thereby, the position information or the shape information of the substrate is obtained.

Next, considering the position information or the shape information, the positional displacement of the substrate or the deformation of the substrate is corrected. As such an aspect, there is known an aspect in which data processing is performed in consideration of the above positional information or shape information, thereby performing the above-described correction; and the substrate is moved or masked in consideration of the positional information or the shape information. Selecting an institutional process to perform the above-described correction; or combining the data processing with the institutional processing in consideration of the above position information or shape information, thereby performing the above-described correction.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5,594,041

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-249958

However, when the position of the substrate held by the substrate holding portion is largely shifted or the deformation of the substrate is large, the displacement amount of the alignment mark on the main surface of the substrate is also increased, and the following situation occurs: The specific alignment mark is photographed, and the alignment mark is not included in the photographing field of the photographing unit.

In this case, if the substrate is moved relative to the imaging unit without any clue, until the alignment mark is included in the imaging field of view, the processing amount of the device is lowered.

The present invention has been accomplished in order to solve the above problems, and an object thereof is to provide an energy A pattern forming device and a pattern forming method capable of increasing the amount of processing in the alignment process.

In order to solve the problem, the pattern forming apparatus according to the first aspect of the present invention is characterized in that the pattern is formed on the main surface based on position information of a plurality of alignment marks formed on one side of the main surface of the substrate. And a holding unit that holds the substrate; and an imaging unit that captures at least a part of the plurality of alignment marks formed on the main surface of the substrate held by the holding unit; and the calculation unit according to the plurality of Aligning the first position information of the alignment marks of the first group captured by the imaging unit in the mark, and calculating and predicting the second group located on the peripheral side of the main surface from the alignment mark of the first group a second position information of the alignment mark; and a pattern forming portion that forms a pattern on the main surface; and the second image information is obtained by the imaging unit referring to a predicted value of the second position information predicted by the calculation unit After the actual measurement value, the pattern forming unit forms a pattern on the main surface based on the actual measurement value of the second position information.

According to a second aspect of the present invention, in the pattern forming apparatus of the first aspect of the present invention, the alignment mark of the first group includes a center alignment mark located at a center of the main surface, And an alignment mark adjacent to the central alignment mark.

According to a third aspect of the present invention, in the pattern forming apparatus of the first aspect of the present invention, the substrate is reverse-transferred by laminating a functional layer formed on a transfer substrate. It is formed on the main surface of the one side of the base layer of the substrate for products.

A pattern forming apparatus according to a fourth aspect of the present invention is the pattern forming apparatus according to the first aspect of the present invention, characterized in that the number of the alignment marks of the second group is larger than the alignment marks of the first group. Quantity.

A pattern forming apparatus according to a fifth aspect of the present invention, characterized in that the pattern forming apparatus according to any one of the first aspect to the fourth aspect of the present invention is characterized in that the pattern is formed toward the main body of the substrate Forming an exposure pattern on the surface, wherein the exposure pattern is formed by irradiating light that is spatially modulated based on the drawing material from the optical head to the main surface from above. The optical head is moved relative to the main surface of the substrate.

A pattern forming apparatus according to a sixth aspect of the present invention is the pattern forming apparatus according to the fifth aspect of the present invention, characterized in that the drawing data is a data corresponding to an actual measurement value of the second position information on the design data. Produced by processing.

A pattern forming apparatus according to a seventh aspect of the present invention, characterized in that the pattern forming apparatus according to any one of the first aspect to the fourth aspect of the present invention is characterized in that the pattern is formed toward the main body of the substrate The exposure pattern is formed on the surface, and the formation of the exposure pattern is performed by exposing the mask to the main surface selectively irradiating the planar light with a mask.

A pattern forming apparatus according to a ninth aspect of the present invention, characterized in that the pattern forming apparatus according to the seventh aspect of the present invention is characterized in that: the pre-prepared based on the common reference pattern is selected based on the actual measured value of the second position information. One of the plurality of masks is masked to perform the formation of the above pattern.

A pattern forming method according to a ninth aspect of the present invention is characterized in that the pattern is formed on the main surface based on position information of a plurality of alignment marks formed on a main surface of one side of the substrate, and includes: a holding step Holding the substrate; the first imaging step of capturing an alignment mark of the first group of the main surface of the substrate to be held by the imaging unit, and obtaining an actual measurement value of the first position information; a step of generating a pair of the second group located on the peripheral side of the main surface than the alignment mark of the first group based on the actual measurement value of the first position information acquired in the first imaging step a predicted value of the second position information of the quasi-mark; the second photographing step of photographing the alignment mark of the second group formed on the main surface of the held substrate by referring to the predicted value of the second position information And obtaining an actual measurement value of the second position information; and a pattern forming step of forming a pattern on the main surface based on an actual measurement value of the second position information.

According to a ninth aspect of the present invention, a pattern forming method according to the ninth aspect of the present invention is characterized in that, as a step performed before the first photographing step, a step of confirming that the imaging unit and the substrate move relative to at least one predetermined imaging position of the alignment mark of the second group, and confirm the at least the alignment mark of the second group Whether one is included in the imaging field of view of the imaging unit, and when the at least one of the alignment marks of the second group is not included in the imaging field in the confirmation step, the first imaging step is performed via the first imaging step Performing the pattern forming step after the prediction step and the second imaging step; and omitting the first imaging step and the prediction when determining that the alignment mark of the second group is included in the imaging field in the confirming step And the second imaging step of performing the pattern based on an actual measurement value of the second position information including the actual measurement value of the at least one of the alignment marks of the second group obtained in the confirming step Forming steps.

A pattern forming method according to a ninth aspect of the present invention, characterized in that the alignment mark of the first group includes a center alignment mark located at a center of the main surface, And an alignment mark adjacent to the central alignment mark.

According to a ninth aspect of the present invention, in the pattern forming method of the ninth aspect of the present invention, the substrate is formed by inverting transfer of a layer of a functional layer formed on a substrate for transfer. It is formed on the main surface of the one side of the base layer of the substrate for products.

A pattern forming method according to a ninth aspect of the present invention, characterized in that the number of the alignment marks of the second group is larger than the alignment marks of the first group Quantity.

A pattern forming method according to a fourteenth aspect of the present invention is the pattern forming method according to any one of the ninth aspect to the thirteenth aspect of the present invention, characterized in that the pattern is formed toward the main body of the substrate The surface is formed with an exposure pattern, and the pattern forming step is performed by irradiating the optical head based on the drawing material from the optical head to the main surface from the optical head while moving the optical head and the main surface of the substrate.

A pattern forming method according to a fifteenth aspect of the present invention is a diagram of the fourteenth aspect of the present invention The method for forming a case is characterized in that the drawing data is generated by performing data processing corresponding to actual measurement values of the second position information on the design data.

A pattern forming method according to a sixteenth aspect of the present invention, characterized in that the pattern forming method according to any one of the ninth aspect to the thirteenth aspect of the present invention is characterized in that the pattern is formed toward the main substrate of the substrate The surface is formed with an exposure pattern, and the pattern forming step is performed by exposing the mask to the main surface selectively irradiating the planar light with a mask.

A pattern forming method according to a sixteenth aspect of the present invention, characterized in that the pattern forming method according to the sixteenth aspect of the present invention is characterized in that: the pre-prepared based on the common reference pattern is selected based on the actual measured value of the second position information. One of the plurality of masks is masked, and the pattern forming step described above is performed.

In each aspect of the invention, first, an alignment mark of the first group among a plurality of alignment marks formed on a principal surface of the substrate is imaged. The displacement amount of the alignment mark from the ideal state due to the positional displacement of the substrate or the deformation of the substrate is generally that the alignment mark (the alignment mark of the second group) located on the peripheral side of the substrate is relatively large, and is located on the substrate. The alignment mark on the center side (the alignment mark of the first group) is relatively small. The reason is that when the substrate is rotated at an angle from the ideal rotational position and held by the substrate holding portion, the diameter of the rotation becomes larger as the diameter from the center of the substrate becomes larger, or when the substrate is twisted, the substrate is displaced from the substrate. The distance between the centers becomes larger, and the amount of distortion becomes larger. In the present invention, as described above, first, the alignment mark of the first group located on the center side of the substrate is imaged. Therefore, the alignment mark of the object is easily included in the imaging field of view, and the first position is obtained in a shorter time. The actual measured value of the information.

Next, based on the actual measured value of the first position information, the predicted value of the second position information of the alignment mark of the second group is generated. Then, the imaging unit captures the alignment mark of the second group by referring to the predicted value of the second position information, and acquires the actual measurement value of the second position information. Therefore, in various aspects of the present invention, it can be shorter than other aspects in which the above predicted values are not used. The actual measured value of the second position information is obtained.

Then, pattern forming processing is performed on the main surface of the substrate based on the actual measured value of the second position information. Therefore, in each aspect of the present invention, a pattern in which position information or shape information in consideration of the entire main surface of the substrate can be performed is compared with other aspects in which the pattern forming process is performed based on the actual measured value of the first position information. Form processing.

10‧‧‧ platform

10a‧‧‧Part 1

10b‧‧‧Part 2

20‧‧‧ platform moving mechanism

21‧‧‧Rotating mechanism

22‧‧‧Support board

23‧‧‧Sub Scanning Mechanism

23a‧‧‧Linear motor

23b‧‧‧rails

24‧‧‧Base plate

25‧‧‧Main scanning mechanism

25a‧‧‧linear motor

25b‧‧‧rail

30‧‧‧Location parameter measuring mechanism

31‧‧‧Laser light exit

32‧‧‧beam splitter

33‧‧‧bend beam

34‧‧‧1st interferometer

35‧‧‧2nd interferometer

50‧‧‧ Optical head

53‧‧‧Lighting optical system

54‧‧‧Laser oscillator

55‧‧‧Laser drive

60‧‧‧Aligning the camera

65‧‧‧Photography

70‧‧‧Control Department

100‧‧‧Drawing device

101‧‧‧ ontology framework

102‧‧‧ Cover

105‧‧‧ Body Department

106‧‧‧Processing Department

110‧‧‧Substrate storage area

120‧‧‧Transfer robot

130‧‧‧Abutment

140‧‧‧ head support

141‧‧‧foot members

142‧‧‧ foot members

143‧‧ ‧ beam components

144‧‧‧ beam members

150‧‧‧pattern design device

172‧‧‧ box

Ma‧‧ Alignment Mark

Ma0‧‧‧ alignment mark

Ma1‧‧ Alignment Mark

Ma11~Ma14‧‧‧ alignment mark

ML1‧‧‧1st branch light

ML2‧‧‧2nd branch light

ST1‧‧‧ steps

ST2‧‧‧ steps

ST21‧‧‧ steps

ST22‧‧‧ steps

ST23‧‧‧ steps

ST24‧‧‧Steps

ST25‧‧‧ steps

ST26‧‧‧ steps

W‧‧‧Substrate

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Θ‧‧‧ direction

FIG. 1 depicts a side view of device 100.

FIG. 2 depicts a top view of device 100.

FIG. 3 is a flow chart showing the flow of the overall processing in the drawing apparatus 100.

4 is a flow chart showing the flow of the alignment process in the drawing device 100.

5 is a plan view showing the upper surface of the substrate W and the imaging field 65 of the alignment camera 60.

6 is a plan view showing the upper surface of the substrate W and the imaging field 65 of the alignment camera 60.

FIG. 7 is a plan view showing the upper surface of the substrate W and the imaging field 65 of the alignment camera 60.

FIG. 8 is a plan view showing the upper surface of the substrate W and the imaging field 65 of the alignment camera 60.

FIG. 9 is a plan view showing the upper surface of the substrate W and the imaging field 65 of the alignment camera 60.

Hereinafter, embodiments of the present invention will be described based on the drawings. For the parts having the same components and functions, the same reference numerals are given in the drawings, and the repeated description is omitted. Further, in the drawings, there are cases where the size or number of each part is exaggerated or simplified for convenience of understanding. In addition, in FIGS. 1 and 2, in order to clarify the direction relationship of each part, the XYZ orthogonal coordinate system in which the Z direction is a vertical direction and the XY plane is a horizontal plane is attached.

<1 Embodiment>

<1.1 Overall Configuration of Drawing Device 100>

Fig. 1 is a side view showing an example of a configuration of the drawing device 100 as an example of the drawing device of the embodiment. FIG. 2 is a plan view showing a configuration example of the drawing device 100 of FIG. 1.

The drawing device 100 is a direct drawing device that applies a spatially modulated light to a main surface of one side of the substrate W such as a semiconductor substrate or a glass substrate having a photosensitive material on its surface to draw a pattern. Here, the substrate W includes both a single-layer substrate composed of only a base layer and a laminated substrate having a functional layer on at least one of the main layer layers of the base layer. Hereinafter, an aspect in which the drawing device 100 draws a pattern on the main surface of the circular laminated substrate W will be described as an example.

The drawing device 100 includes a main body portion 105 having a main structure of a space formed in a space in which the outer cover 102 is attached to the main body frame 101, and a substrate housing 110 disposed on the outer side of the main body portion 105 (as shown in FIG. 1). Generally, it is the right-hand side of the body portion 105; and the control unit 70.

Further, the pattern designing device 150 as an external device of the drawing device 100 is configured to be connected to the control unit 70 of the drawing device 100 by a communication line, and can perform various materials with the control unit 70 (for example, using CAD (computer) -aided design, computer-aided design) design and presentation of the design pattern of the exposure pattern.

<1.2 Composition of each department>

<1.2.1 Body portion 105>

In the main body portion 105, the processing portion 106 as an exposure processing includes a platform 10 (holding portion) that holds the substrate W in a horizontal posture, a platform moving mechanism 20 that moves the platform 10, and a position parameter measuring mechanism 30 whose measurement and platform The positional parameter corresponding to the position of 10; the optical head 50 (pattern forming portion) that irradiates the upper surface of the substrate W with pulsed light; and the camera 60 (imaging portion).

Further, the main body unit 105 includes a transfer robot 120. The transport robot 120 is arranged in the comparison The processing unit 106 is a robot that performs the transfer of the substrate W between the processing unit 106 and the substrate housing cassette 110 on the +Y side. The transport robot 120 receives the unprocessed substrate W stored in the substrate housing cassette 110 from the substrate housing cassette 110 and delivers it to the main body unit 105. Further, the transport robot 120 receives the processed substrate W subjected to the exposure processing in the processing unit 106 from the processing unit 106 and delivers it to the substrate storage cassette 110.

A base 130 supporting each of the processing units 106 is disposed in a lower portion of the processing unit 106. A substrate transfer region where the substrate W is transferred between the processing unit 106 and the transfer robot 120 is set at a position on the +Y side of the base 130. Further, a pattern drawing region for drawing a pattern onto the substrate W is set at a position on the center side of the base 130 in the Y direction. Further, an imaging region on the upper surface of the imaging substrate W is set at a position on the -Y side of the base 130.

The head support portion 140 includes two leg members 141 that are erected upward from the base 130, and two leg members 142 that are closer to the -Y side than the two leg members 141 and that are upward from the base 130 Established. Further, the head supporting portion 140 includes a beam member 143 which is provided to bridge between the tops of the two leg members 141, and a beam member 144 which is provided to bridge between the tops of the two leg members 142. . Further, an optical head 50 is attached to the +Y side of the beam member 143, and an alignment camera 60 is attached to the -Y side of the beam member 143.

The alignment camera 60 captures an imaging unit at a position below it, and the imaging is held by the platform 10 to reach the upper surface of the substrate W at a position below the alignment camera 60. On the upper surface of the substrate W, a plurality of alignment marks Ma for detecting position information of the substrate W (information such as rotation or offset of the substrate W) and shape information of the substrate W (information such as distortion of the substrate W) are formed ( Figure 5). The camera 60 is aimed at at least a portion of the plurality of alignment marks Ma and produces the photographic material thereof. The generated photographing data is transmitted to the control unit 70. The control unit 70 detects the position information and the shape information of the substrate W based on the received imaging data, and controls each part of the device while referring to the detected position information and shape information.

Furthermore, the formation pattern of the alignment mark Ma in the substrate W can be accurately specified Various aspects are used within the scope of its position. For example, the alignment mark Ma formed by machining using a through hole or the like may be used, and the alignment mark Ma patterned by a printing process or a photolithography process may be used. In the present embodiment, the alignment mark shown by the cross type in plan view is used as the alignment mark Ma (Fig. 5). Further, in the present embodiment, the number of the alignment marks Ma formed on the upper surface of the substrate W is 21, but the number may be appropriately set.

The stage 10 has a cylindrical outer shape and is used to mount and hold the holding portion of the substrate W in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the platform 10. Therefore, when the substrate W is placed on the stage 10, the substrate W is adsorbed and fixed to the upper surface of the stage 10 by the suction pressure of the plurality of suction holes.

The platform moving mechanism 20 has a rotating mechanism 21 that rotates the platform 10, a support plate 22 that rotatably supports the platform 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a base plate 24 The support plate 22 is supported via the sub-scanning mechanism 23, and the main scanning mechanism 25 moves the base plate 24 in the main scanning direction.

The rotating mechanism 21 has a motor composed of a rotor that is mounted inside the platform 10. Further, a rotary bearing mechanism is provided between the lower surface side of the central portion of the stage 10 and the support plate 22. Therefore, when the motor is operated, the rotor moves in the θ direction (the direction of rotation about the Z axis), and the stage 10 rotates around the rotation axis of the rotary bearing mechanism.

The sub-scanning mechanism 23 has a linear motor 23a that generates a propulsive force in the sub-scanning direction by a moving piece attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. Further, the sub-scanning mechanism 23 has a pair of guide rails 23b that guide the support plate 22 in the sub-scanning direction with respect to the base plate 24. Therefore, when the linear motor 23a is operated, the support plate 22 and the stage 10 move in the sub-scanning direction (X direction) along the guide rail 23b on the base plate 24.

The main scanning mechanism 25 has a linear motor 25a that generates a propulsive force in the main scanning direction by a moving piece attached to the lower surface of the base plate 24 and a stator laid on the upper surface of the head supporting portion 140. Moreover, the main scanning mechanism 25 has a main scanning direction with respect to the head supporting portion 140. One of the base plates 24 is guided to the guide rails 25b. Therefore, when the linear motor 25a is operated, the base plate 24, the support plate 22, and the stage 10 move in the main scanning direction (Y direction) along the guide rail 25b on the base 130. Further, as the platform moving mechanism 20, various X-Y-θ axis moving mechanisms can be used.

The position parameter measuring mechanism 30 is a mechanism that measures the positional parameters of the platform 10 by the interference of the laser light. The position parameter measuring unit 30 mainly includes a laser light emitting unit 31, a beam splitter 32, a beam bender 33, a first interferometer 34, and a second interferometer 35.

The laser light emitting portion 31 is a light source device for emitting laser light for measurement ML. The laser light emitting portion 31 is provided at a fixed position with respect to the base 130 or the optical head 50. The laser light ML emitted from the laser light emitting portion 31 first enters the beam splitter 32, and branches into the first branch light ML1 from the beam splitter 32 toward the beam bender 33, and the second from the beam splitter 32 toward the second interferometer 35. 2 branch light ML2.

The first branched light ML1 is reflected by the beam bender 33 and enters the first interferometer 34, and is irradiated from the first interferometer 34 to the first portion 10a on the side of the -Y side of the stage 10. Then, the first branched light ML1 reflected at the first portion 10a is again incident on the first interferometer 34. The first interferometer 34 measures the positional parameter corresponding to the position of the first portion 10a of the stage 10 based on the interference between the first branched light ML1 toward the stage 10 and the first branched light ML1 reflected from the stage 10.

On the other hand, the second branched light ML2 is incident on the second interferometer 35 and is irradiated from the second interferometer 35 to the second portion (the portion different from the first portion 10a) 10b on the side of the -Y side of the stage 10. Then, the second branched light ML2 reflected at the second portion 10b is again incident on the second interferometer 35. The second interferometer 35 measures the positional parameter corresponding to the position of the second portion 10b of the stage 10 based on the interference of the second branched light ML2 toward the stage 10 and the second branched light ML2 reflected from the stage 10.

The first interferometer 34 and the second interferometer 35 transmit the positional parameters obtained by the respective measurements to the control unit 70. The control unit 70 uses the position parameter to control the position of the platform 10 or the movement speed of the platform 10.

The optical head unit 50 is configured to illuminate the light irradiation unit for the pulse light for exposure processing toward the lower position, and to irradiate the surface of the substrate W that is held by the stage 10 and transported to the lower position of the optical head 50. section. In the present embodiment, a case where a photoresist layer which is exposed to ultraviolet light is irradiated on the upper surface of the substrate W and pulse head light (ultraviolet light) having a wavelength of 355 nm is emitted from the optical head 50 will be described. .

The optical head 50 is connected to one laser oscillator 54 via an illumination optical system 53. Further, a laser drive unit 55 that drives the laser oscillator 54 is connected to the laser oscillator 54. The laser driving unit 55, the laser oscillator 54, and the illumination optical system 53 are disposed inside the casing 172. When the laser driving unit 55 is operated, pulse light is emitted from the laser oscillator 54, and the pulse light is introduced into the optical head 50 via the illumination optical system 53.

Inside the optical head 50, a spatial light modulator that spatially modulates the irradiated light, a drawing control unit that controls the spatial light modulator, and a pulse that is introduced into the optical head 50 are mainly provided. The light is irradiated to the optical system or the like on the upper surface of the substrate W via the spatial light modulator (not shown). As the spatial light modulator, for example, GLV (registered trademark: Grating Light Valve) or the like as a diffraction grating type spatial light modulator is used. The pulse light introduced into the optical head 50 is directly irradiated onto the upper surface of the substrate W as a light beam shaped into a specific pattern shape by a spatial light modulator or the like, and is sensitized to the photoresist or the like on the substrate W. The layer is exposed. Thereby, a pattern is drawn on the upper surface of the substrate W.

The drawing device 100 shifts the substrate W in the sub-scanning direction by an amount corresponding to the exposure width of the optical head 50, and repeats the drawing of the pattern in the main scanning direction by a specific number of times, thereby forming the entire surface of the drawing region of the substrate W. pattern.

<1.2.2 Substrate storage unit 110>

The substrate housing cassette 110 has a first housing portion that houses the unprocessed substrate W that is subjected to the exposure processing, and a second housing portion that houses the processed substrate W that has been subjected to the exposure processing. Further, as described above, the transfer robot 120 can transfer the substrate W to and from the substrate housing cassette 110.

Therefore, the unprocessed substrate W accommodated in the first storage unit is transported to the processing unit 106 via the transfer robot 120, and exposure processing is performed. Then, the processed substrate W subjected to the exposure processing is stored in the second storage portion via the transfer robot 120.

<1.2.3 Control unit 70>

The control unit 70 is electrically connected to each unit included in the drawing device 100, and controls the operation of each unit of the drawing device 100 while performing various kinds of arithmetic processing.

The control unit 70 includes a general computer. Such a computer includes, for example, a CPU (Central Processing Unit), a ROM (read only memory), and a RAM (Random Access Memory). The memory device and the like are connected to each other via a bus bar. The ROM stores a basic program or the like, and the RAM is supplied as a work area when the CPU performs a specific process. The memory device is composed of a non-volatile memory device such as a flash memory or a hard disk device. The memory is stored in the memory device, and the CPU as the main control unit performs arithmetic processing in accordance with the sequence described in the program, thereby realizing various processes (for example, alignment processing or drawing processing described below). The program can be pre-stored in a memory such as a memory device, or can be recorded on a CD-ROM (compact disc read only memory) or a DVD-ROM (Digital Versatile Disc-Read Only Memory). The form (program product) of the recording medium such as the external flash memory is supplied to the memory device. Alternatively, it may be provided to the memory device by downloading from an external server via the network or the like. Further, a part or all of the functions realized by the control unit 70 can be realized by a dedicated logic circuit or the like.

Further, the control unit 70 is also connected to the input unit, the display unit, the communication unit, and the like via a bus bar (none of which is shown). The input unit is, for example, an input device composed of a keyboard and a mouse, and accepts various operation inputs from an operator. The display unit is a display device including a liquid crystal display device, a lamp, or the like, and displays various kinds of information under the control of the CPU. The communication unit has a data communication function for transmitting and receiving commands, data, and the like to and from an external device via a network.

<1.3 Action of Drawing Device 100>

<1.3.1 Overall Processing>

One of the processes for performing the series of processing on the substrate W by the drawing device 100 will be described with reference to FIG. Fig. 3 is a diagram showing the flow of the processing. The operation of one of the series described below is performed under the control of the control unit 70.

First, the transport robot 120 takes out one unprocessed substrate W from the substrate housing cassette 110 and mounts it on the stage 10 (step ST1).

At this time, the substrate W is placed in a state in which the notch portion (for example, the notch, the reference surface, and the like) formed in one of the peripheral edges of the substrate W is in a specific position so that the rotational position of the substrate W is considered. On the platform 10. Thereby, the substrate W placed on the stage 10 is positioned substantially at a predetermined rotational position. If the substrate W is placed on the stage 10, the stage 10 adsorbs and holds the substrate W (holding step).

The platform moving mechanism 20 moves the platform 10 to a position below the alignment camera 60. Then, the stage moving mechanism 20 moves the stage 10, and the alignment camera 60 captures at least a portion of the alignment mark Ma formed on the upper surface of the substrate W. The photographing data generated by the alignment camera 60 by the photographing is transmitted to the control unit 70. The control unit 70 detects position information and shape information of the substrate W based on the received imaging data. Then, the positional information and the shape information are used to correct the alignment of the positional shift and the shape change of the substrate W from the ideal state (step ST2).

In the present embodiment, an aspect in which the drawing data is generated in consideration of the positional shift and the shape change of the substrate W will be described as the alignment processing. The alignment process will be described in detail in <1.3.2 Alignment Process> below.

After the alignment process, the platform moving mechanism 20 moves the platform 10 to a position below the optical head 50. Then, spatially modulated light based on the descriptive material is irradiated from the optical head 50 to the upper surface of the substrate W, and the stage moving mechanism 20 moves the stage 10 to move the optical head 50 relative to the substrate W. Thereby, a drawing process of drawing a specific exposure pattern on the upper surface of the substrate W is performed (step ST3, pattern forming step).

In the drawing process, first, the substrate moving mechanism 20 moves the substrate W in the outward direction (for example, the +Y direction) of the main scanning. At this time, the control unit 70 reads out a part of the drawing material that describes the material to be drawn in the area to be drawn in the main scanning. Then, the control unit 70 controls the modulation unit 82 based on the read data, and causes the spatially modulated drawing light based on the data to be emitted from the optical head 50 toward the substrate W. The optical head 50 intermittently emits the drawing light toward the substrate W, and the stage moving mechanism 20 moves the substrate W once in the outward direction (+Y direction) of the main scanning, thereby being one of the upper surfaces of the substrate W. A stripe region (a region extending in the Y direction and having a width along the X direction corresponding to the width of the depicted light) depicts a specific pattern. The case where the substrate W is moved in the outward direction of the main scanning in this manner is referred to as an outgoing main scanning.

When the main scanning of the outgoing light accompanied by the illumination of the drawing light is completed, the stage moving mechanism 20 moves the stage 10 in the sub-scanning direction (for example, the -X direction) by a distance corresponding to the width of the drawing light. When the movement is observed from the substrate W, the optical head 50 moves in the +X direction by the width of the elongated region. The step of moving the substrate W in the sub-scanning direction (-X direction) in this manner is referred to as sub-scanning.

When the sub-scan ends, the return main scan accompanied by the illumination of the drawing light is executed. That is, the optical head 50 intermittently emits the drawing light toward the substrate W, and the stage moving mechanism 20 causes the substrate W to follow the return direction of the main scanning (the direction opposite to the outward direction, in the -Y direction in the present embodiment) Move once. By the return main scan, a pattern is drawn in the adjacent strip area of the strip area depicted in the previous go main scan.

When the main scanning of the returning light accompanied by the illumination of the drawing light is completed, the main scanning is performed again with the irradiation of the drawing light after the sub-scanning. By the main path scan, the pattern is drawn in the adjacent strip area of the strip area depicted in the previous return main scan. Similarly, in the same manner, the main scanning accompanied by the irradiation of the drawing light is repeated while the sub-scanning is inserted, and when the entire area of the drawing target region is exposed in a specific pattern, the drawing processing ends.

When the drawing process is completed, the transfer robot 120 receives the processed substrate W from the stage 10 and stores it in the substrate storage cassette 110 (step ST4). Thereby, the processing of one series of the substrate W is completed.

After the processed substrate W is housed in the substrate housing cassette 110, the transfer robot 120 takes out a new unprocessed substrate W from the substrate housing cassette 110. This series of processes are performed on the substrate W this time.

<1.3.2 Alignment Processing>

The rendering process is performed based on drawing data (for example, data in the form of a raster) converted from a description form that can be processed by the drawing device 100, which is converted from design data (for example, a material in a carrier form) containing a specific pattern.

The design data is created on the premise that the substrate W that has not been deformed is placed on the platform 10 at an ideal position. However, the substrate W to be processed is not necessarily placed at an ideal position on the stage 10 at an ideal rotation angle. Further, in the substrate W to be processed, deformation such as warpage, skew, or deformation may occur. Therefore, even if the drawing process is directly performed using the drawing material converted from the design data, the drawing quality cannot be obtained.

Therefore, before the drawing process, the position information and the shape information of the substrate W as the drawing target are acquired in advance, and the design data is processed by modifying the positional deviation or deformation of the substrate W based on the information to generate the drawing data ( Alignment processing).

Fig. 4 is a view showing the flow of the alignment processing (step ST2 shown in Fig. 3). 5 to 9 are plan views showing the imaging field of view 65 of the alignment camera 60 on the upper surface of the substrate W and the upper surface of the substrate W. Hereinafter, an alignment mark located at the center of the substrate W among a plurality of alignment marks Ma formed on the upper surface of the substrate W is referred to as an alignment mark Ma0 (center alignment mark). Further, an alignment mark adjacent to the alignment mark Ma0 is referred to as an alignment mark Ma1. Further, the four-point alignment marks on the peripheral side of the substrate W are referred to as alignment marks Ma11 to Ma14.

In the following step ST25, the four-point alignment marks Ma11 to Ma14 located on the peripheral side of the substrate W are sequentially photographed. This is to obtain position information and shape information of the entire substrate W by using the result of the imaging on the peripheral side of the substrate W. At this time, if the substrate W that is not deformed is ideally placed on the stage 10, the stage moving mechanism 20 is based on the marking material (including the substrate W without deformation) which is ideally placed on the platform 10 In the state of the positional information of the alignment mark Ma, the substrate W is moved, whereby the alignment mark Ma11 is included in the imaging field of view 65 of the alignment camera 60 (FIG. 5). However, when the substrate W is deformed or the substrate W is not disposed at a desired position on the stage 10, there is a case where the alignment mark Ma11 is not included in the imaging field 65 even if the substrate W is moved based on the mark data (FIG. 6). . In this case, if the substrate W is moved without any clue, until the alignment mark Ma11 is included in the imaging field 65, the processing amount of the device is lowered. Further, when the alignment marks Ma12 to Ma14 are repeatedly tested in the same manner, the decrease in the amount of processing becomes more remarkable. 5 is a plan view showing the substrate W disposed at a desired position, and FIGS. 6 to 9 are plan views showing the substrate W disposed at a certain angle from the ideal position.

Therefore, in the present embodiment, in order to increase the amount of processing, the steps ST21 to ST24 are performed before step ST25, and the positions of the four-point alignment marks Ma11 to Ma14 are predicted. Hereinafter, the alignment process of the present embodiment will be described in detail with reference to FIGS. 4 to 9.

First, if the substrate W having no deformation is ideally placed on the stage 10, the stage moving mechanism 20 moves the substrate W based on the mark data so that the alignment mark Ma0 is included in the imaging field 65. Then, the alignment mark Ma0 is photographed by the alignment camera 60 (step ST21). Fig. 7 is a plan view showing the upper surface of the substrate W and the imaging field of view 65 in this state.

The displacement amount of the alignment mark Ma from the ideal state due to the positional shift of the substrate W or the deformation of the substrate W is generally relatively large on the peripheral side of the substrate W, and relatively small on the central side of the substrate W. The reason for this is that when the substrate W is rotated at an angle from the ideal rotational position and placed on the stage 10, the amount of rotational displacement becomes larger as the diameter from the center of the substrate W becomes larger. When the substrate W is twisted, the amount of distortion becomes large as the distance from the center of the substrate W becomes larger.

Therefore, in the step ST21 of photographing the alignment mark Ma0 located at the center of the substrate W (i.e., the alignment mark Ma0 having a relatively small displacement amount), the alignment mark Ma0 is easily included in the imaging field of view 65.

Of course, there is a case where the position of the alignment mark Ma is displaced on the center side and the peripheral side of the substrate W without any difference, as in the case where the substrate W is moved (offset) in parallel from the ideal position and placed on the stage 10. In this case, in the step ST21 of photographing the alignment mark Ma0 located at the center of the substrate W, there may be a case where the alignment mark Ma0 of the subject is not included in the imaging field 65. At this time, for example, the repeated test causes the substrate W to move until the alignment mark Ma0 is included in the imaging field of view 65. However, in consideration of the positional displacement of the substrate W and the deformation of the substrate W, as described above, the displacement amount of the alignment mark Ma is relatively small as compared with the peripheral side of the substrate W. Therefore, in the aspect of the step ST21 of photographing the alignment mark Ma0 located at the center of the substrate W, the photographing can be completed in a shorter time than the photographing of the alignment marks Ma11 to Ma14 located on the peripheral side of the substrate W. .

The photographing data of the alignment mark Ma0 obtained by the alignment with the camera 60 is transmitted to the control unit 70. The control unit 70 calculates the displacement amount of the position of the alignment mark Ma0 in the substrate W which is ideally arranged without distortion, and the position of the alignment mark Ma0 in the actual substrate W based on the image data. The control unit 70 predicts the position of the alignment mark Ma1 in the actual substrate W based on the mark data and the displacement amount (step ST22).

Then, the stage moving mechanism 20 moves the substrate W based on the prediction result obtained in step ST22 so that the alignment mark Ma1 is included in the photographing field of view 65. After the movement, the alignment mark Ma1 is photographed by the alignment camera 60 (step ST23). Fig. 8 is a plan view showing the upper surface of the substrate W and the imaging field of view 65 in this state.

The alignment mark Ma1 is an alignment mark which is adjacent to the alignment mark Ma0 located at the center of the substrate W and has a relatively small displacement amount compared with the alignment marks Ma11 to Ma14. Therefore, in shooting In step ST23 of photographing the alignment mark Ma1, the alignment mark Ma1 is easily included in the imaging field of view 65 for the same reason as in the case of step ST21. Further, in step ST23, the platform 10 is moved in consideration of the prediction result obtained in step ST22. Therefore, in step ST23, the alignment mark Ma1 is easily included in the photographic field 65 as compared with other aspects in which the above-described prediction result is not considered (regardless of other aspects based on actual measurement information). Steps ST21 to 23 are steps of photographing the alignment marks Ma0 and Ma1 (the alignment marks of the first group described below), and correspond to the first imaging step of the present invention.

The photographing data of the alignment mark Ma1 obtained by the alignment with the camera 60 is transmitted to the control unit 70. The control unit 70 calculates the coordinate value of the alignment mark Ma in the substrate W which is ideally arranged and has no deformation based on the imaging data of the alignment marks Ma0 and Ma1 obtained by the alignment camera 60, and converts the coordinate value of the alignment mark Ma into the actual substrate W. The Helmert conversion matrix when the coordinate value of the mark Ma is aligned. The Helmert conversion is preferable to the following affine transformations in that the number of necessary measurement points is small and the calculation is simple. The control unit 70 predicts the position of the alignment mark Ma11 to the alignment mark Ma14 in the actual substrate W based on the mark data and the Helmert conversion matrix (step ST24, prediction step).

Then, the stage moving mechanism 20 moves the substrate W with reference to the prediction result obtained in step ST24 so that the alignment mark Ma11 is included in the photographing field of view 65. After the movement, the alignment mark Ma11 is photographed by the alignment camera 60 (step ST25, FIG. 9). Similarly, the substrate W is moved with reference to the prediction result obtained in step ST24, and the alignment marks Ma12 to Ma14 are sequentially photographed by the alignment camera 60 (step ST25). Step ST25 is a step of photographing the alignment marks Ma11 to Ma14 (the alignment marks of the second group described below), and corresponds to the second imaging step of the present invention.

In step ST25, the platform 10 is moved with reference to the prediction result obtained in step ST24. Therefore, in step ST25, the alignment marks Ma11 to Ma14 are easily included in the imaging field of view 65 as compared with other aspects in which the prediction result is not referred to.

The photographing data of the alignment marks Ma11 to Ma14 obtained by the alignment with the camera 60 is transmitted to the control unit 70. The control unit 70 is based on the alignment mark Ma11~ obtained by the self-aligning camera 60. The imaging data of Ma14 is calculated from the affine transformation matrix when the coordinate value of the alignment mark Ma in the substrate W which is ideally configured and has no distortion is converted into the coordinate value of the alignment mark Ma in the actual substrate W. Affine conversion is preferred in terms of high-precision conversion compared to the above-described Helmert conversion. The control unit 70 corrects the design data based on the mark data and the affine transformation matrix, and performs RIP (Routing Information Protocol) processing on the corrected design data to generate drawing data (step ST26). In step ST26, the drawing data is generated based on the image data of the alignment marks Ma11 to Ma14 formed on the periphery of the substrate W. Therefore, it is preferable to reflect the position information and the shape information of the entire substrate W in the drawing data. The position information and the shape information can be expressed by linear conversion (for example, the above-described affine transformation or projection normalization conversion, etc.), and can also be expressed by nonlinear conversion (for example, thin plate spline interpolation, etc.). Moreover, the position information and shape information can also be represented by a combination of a plurality of conversions (for example, a combination of linear conversion and nonlinear conversion).

<1.3.3 Effect of alignment processing>

The effect of the alignment process in the present embodiment will be described. Hereinafter, the alignment marks Ma0 and Ma1 are collectively expressed as the alignment marks of the first group, and the alignment marks Ma11 to Ma14 are collectively expressed as the alignment marks of the second group. Moreover, the position information of the alignment marks Ma0 and Ma1 in the information obtained by the shooting by the alignment camera 60 is expressed as the first position information, and the position information of the alignment marks Ma11 to Ma14 is expressed as the second position information. .

In the alignment processing of the present embodiment, first, the alignment marks of the first group are captured by the alignment camera 60, and the first position information is acquired (steps ST21 to ST23). The control unit 70 (calculation unit) predicts the second position information by calculation based on the first position information acquired by the actual measurement (step ST24). Thereafter, the alignment camera 60 captures the alignment flag of the second group with reference to the predicted value of the second position information obtained in step ST24, and acquires the actual measurement value of the second position information (step ST25). Then, based on the actual measured value of the second position information, the drawing data of the operation of each part at the time of the drawing process is generated.

As described above, in the present embodiment, the alignment mark of the first group which is easily included in the imaging field of view 65 on the center side of the substrate W is first imaged by the alignment camera 60. Therefore, the actual measured value of the first position information can be obtained in a shorter time.

Moreover, the alignment mark of the second group which is not easily included in the imaging field 65 on the peripheral side of the substrate W is referred to by the alignment camera 60 with reference to the predicted value of the second position information obtained based on the first position information. Therefore, in the aspect of the present embodiment, the actual measured value of the second position information can be obtained in a shorter time than in the other aspect in which the predicted value is not used. In the present embodiment, it is preferable to use a Helmert conversion in which the number of necessary measurement points is small and the calculation is simple in the prediction of the second position information. Since the Helmert conversion system does not consider the transformation of shear deformation, it is considered to be a conversion with lower precision than the affine transformation considering shear deformation. However, the main purpose of the above prediction is to make the alignment marks of the second group easy to be included in the imaging field of view 65. In general, the shear deformation of the substrate W is not so large as to deviate from the above purpose. Therefore, even for a relatively low-precision Helmert conversion, the above object can be sufficiently achieved.

Further, in the present embodiment, the control unit 70 generates the drawing data based on the actual measured value of the second position information. Therefore, in the aspect of the present embodiment, compared with other aspects in which the control unit 70 generates the drawing data based on the actual measured value of the first position information, the drawing information of the position information or the shape information of the entire substrate W can be generated. . In the present embodiment, it is preferable that the position information or the shape information is expressed by a higher-precision affine transformation.

Further, in the present embodiment, the number of alignment marks (four) of the second group actually measured to generate the drawing material is larger than the alignment mark of the first group actually measured for predicting the second position information. The number (2). Here, since the accuracy of the drawing data is directly related to the pattern drawing accuracy (or even the quality of the final product), it is required to be highly accurate, but the prediction of the second position information is as long as the alignment mark of the second group is included in The degree of field of view 65 is sufficient. Therefore, for the alignment mark of the second group which requires more accurate actual measurement, the number of measurement points is set to be large, and the actual measurement is allowed even for low precision. In the alignment mark of the first group, the number of measurement points is set to be small, whereby the quality of the final product can be improved and the amount of processing in the alignment process can be improved.

As a result, the amount of processing in the alignment process can be improved, and the drawing data considering the overall information of the substrate W can be generated.

<2 change example>

The embodiment of the present invention has been described above, but the present invention can be variously modified without departing from the scope of the invention.

In the above embodiment, the aspect in which the pattern is drawn on the laminated substrate W has been described, but the invention is not limited thereto. For example, it is also possible to draw a pattern on a single-layer substrate composed only of the base layer. Further, the effect of the present invention which can improve the processing amount of the alignment processing is that the substrate W which is easily changed in position of the alignment mark on the substrate W (in other words, the alignment mark is not easily included in the photographing field 65 in the previous alignment processing) Further, the substrate W) in which the amount of treatment is easily lowered is particularly effective. Therefore, the laminated body formed by the laminated body of the functional layer formed on the transfer substrate (for example, a sapphire substrate) is reverse-transferred to one side main surface of the base layer of the product substrate (for example, a germanium wafer). The substrate W in which the layers are rubbed each other during the formation of the laminated substrate and the position of the alignment mark is easily changed (for example, an LED substrate) is preferable as an application object of the present invention.

Further, in the above embodiment, the optical head 50 is irradiated from the optical head 50 to the upper surface of the substrate W while the optical head 50 and the substrate W are relatively moved on the substrate W. The aspect in which the exposure pattern is formed has been described, but is not limited thereto. The present invention is applicable to various pattern forming apparatuses that form a pattern on the main surface of the substrate W based on actual measurement values of the second position information. For example, the present invention can also be applied to a device for forming a pattern by exposing a mask that selectively irradiates planar light to the upper surface of the substrate W via a mask. In this case, a plurality of masks are prepared in advance based on the common reference pattern, and a mask is selected from the plurality of masks according to actual measurement values of the second position information, thereby performing mask exposure, thereby correcting the substrate W Position offset and deformation. So, based on In the aspect of the above-described embodiment in which the positional correction and the deformation of the substrate W are corrected, the positional correction of the substrate W can be performed by an institutional process. The various aspects, or the combination of data processing and institutional processing. Further, in addition to the above-described pattern formation by exposure, it is also possible to adopt various aspects such as pattern formation by irradiating a charged particle beam such as an electron beam onto the upper surface of the substrate W.

In the above embodiment, the alignment marks of the first group are described by two points of the alignment mark Ma0 located at the center of the main surface of the substrate W and the alignment mark Ma1 adjacent thereto, but are not limited thereto. this. It is also possible that the alignment mark of the first group is composed of alignment marks of three or more points. Further, in the case where the alignment marks of the first group include the alignment marks Ma0 and Ma1 as in the above-described embodiment, the alignment marks Ma0 and Ma1 are easily included in the imaging field of view 65, and can be efficiently performed. It is preferable to perform alignment processing. Further, in addition to the four-point aspect as in the above embodiment, the alignment mark of the second group may be three or less or five or more.

Further, in the above embodiment, the description has been made on the fact that the drawing data is generated based only on the actual measured value of the second position information, but the invention is not limited thereto. For example, the aspect of the drawing data may be generated based on the actual measured value of the first position information and the actual measured value of the second position information. In this manner, when the position information (the first position information) on the center side of the main surface of the substrate and the position information (the second position information) on the peripheral side are used to generate the drawing data, by using a nonlinear conversion (for example, a thin plate spline) Interpolation, etc.) can display the position information and shape information of the substrate W with higher precision.

In the above-described embodiment, the aspect in which the entire main surface of the substrate W is integrally aligned (in other words, the positional displacement and the deformation of the main surface of the substrate W are integrally corrected) is described, but Limited to this. It is also possible to perform an alignment process for each of the blocks by virtually dividing the main surface of the substrate W into a plurality of blocks (for example, a pattern for drawing data for each of the divided blocks).

In the above embodiment, the first imaging step (steps ST21 to ST23) is first performed on the substrate W held on the stage 10, but the invention is not limited thereto. For example, it may be a step of performing a step before the first imaging step, and a confirmation step for causing at least one of the alignment mark 60 and the substrate W to be aligned with the second group (for example, The alignment mark Ma11) is moved relative to the preset imaging position, and it is confirmed whether or not the alignment mark Ma11 is included in the imaging field 65 of the alignment camera 60. In this aspect, when it is determined in the confirmation step that the alignment mark Ma11 is not included in the imaging field of view 65, pattern formation is performed after the first imaging step, the prediction step, and the second imaging step, similarly to the above-described embodiment. step. On the other hand, when it is determined in the confirmation step that the alignment mark Ma11 is included in the imaging field 65, the first imaging step, the prediction step, and the second imaging step are omitted, based on the alignment mark Ma11 obtained in the confirmation step. The pattern forming step is performed on the actual measured value of the second position information of the actual measured value. In this way, the first imaging step, the prediction step, and the second imaging step can be appropriately omitted according to the result of the confirmation step, so that the processing amount of the device can be improved.

Further, in the above embodiment, the relative movement of the substrate W and the optical head 50 or the relative movement of the substrate W and the alignment camera 60 is described by moving the substrate W in the XY plane by the stage 10. , but not limited to this. For example, a moving mechanism that moves the optical head 50 in the XY plane or a moving mechanism that moves the alignment camera 60 in the XY plane may be provided.

Although the pattern forming apparatus and the pattern forming method of the embodiment and its modifications have been described above, the examples of the preferred embodiments of the present invention are not limited to the scope of the present invention. The present invention can be combined with any of the free combinations of the embodiments or any of the constituent elements of the respective embodiments within the scope of the invention, or any constituent elements are omitted in the respective embodiments.

Claims (22)

A pattern forming device characterized in that a pattern is formed on the main surface based on position information of a plurality of alignment marks formed on a main surface of one side of the substrate, and includes a holding portion that holds the substrate; The imaging unit captures at least a part of the plurality of alignment marks formed on the main surface of the substrate held by the holding portion, and the calculation unit captures the image by the imaging unit based on the plurality of alignment marks The first position information of the alignment mark of the first group is calculated, and the second position information of the alignment mark of the second group located on the peripheral side of the main surface is calculated and predicted from the alignment mark of the first group; and a pattern forming portion that forms a pattern on the main surface; and the image forming unit obtains an actual measurement value of the second position information by referring to a predicted value of the second position information predicted by the calculation unit; The actual measured value of the second position information is patterned on the main surface. A pattern forming apparatus according to claim 1, wherein the alignment mark of the first group includes a center alignment mark located at a center of the main surface, and an alignment mark adjacent to the center alignment mark. The pattern forming apparatus according to claim 1, wherein the substrate is formed by inverting and transferring a laminated body of a functional layer formed on a substrate for transfer onto a main surface of the one side of a base layer of the substrate for a product. The pattern forming device of claim 1, wherein the number of the alignment marks of the second group is greater than the number of the alignment marks of the first group. The pattern forming apparatus according to any one of claims 1 to 4, wherein the pattern is formed by forming an exposure pattern on the main surface of the substrate, and the forming of the exposure pattern is spatially adjusted from the optical head based on the drawing data. The light is irradiated upward from the upper surface to the main surface, and the optical head is moved relative to the main surface of the substrate. The pattern forming apparatus of claim 5, wherein the drawing data is generated by performing data processing corresponding to actual measurement values of the second position information on the design data. The pattern forming apparatus according to any one of claims 1 to 4, wherein the pattern is formed by forming an exposure pattern on the main surface of the substrate, and the forming of the exposure pattern is selective to the main surface by a spacer mask Execution is performed by exposing the mask to the surface light. The pattern forming apparatus of claim 7, wherein the one of the plurality of masks prepared in advance based on the common reference pattern is selected based on the actual measured value of the second position information to perform the formation of the pattern. The pattern forming apparatus according to any one of claims 1 to 4, further comprising: a moving mechanism for presetting at least one of the imaging unit and the substrate to at least one of the alignment marks of the second group When the at least one of the alignment marks of the second group is not included in the imaging field of the imaging unit that moves to the imaging target position, the imaging unit refers to the prediction by the computing unit. After obtaining the actual measured value of the second position information by the predicted value of the second position information, the pattern forming unit forms a pattern on the main surface based on the actual measured value of the second position information; and the pair of the second group When at least one of the above-mentioned quasi-marks is included in the photographing field of the photographing unit that moves to the photographing intended position, The pattern forming unit forms a pattern on the main surface based on an actual measurement value of the second position information including at least one of actual measurement values of the second group of alignment marks obtained from the imaging field. The pattern forming apparatus of claim 5, further comprising: a moving mechanism that relatively moves the imaging unit and the substrate toward at least one predetermined imaging position that is aligned with the alignment mark of the second group; When the at least one of the alignment marks of the second group is not included in the imaging field of the imaging unit that moves to the imaging target position, the imaging unit refers to the second position information predicted by the computing unit. After obtaining the actual measured value of the second position information by the predicted value, the pattern forming unit forms a pattern on the main surface based on the actual measured value of the second position information; and the at least one of the alignment marks of the second group In the case of the imaging field of view of the imaging unit that moves to the imaging target position, the pattern forming unit includes an actual measurement value including at least one of the alignment marks of the second group obtained from the imaging field. The actual measurement value of the second position information forms a pattern on the main surface. The pattern forming apparatus according to claim 6, further comprising: a moving mechanism that relatively moves the imaging unit and the substrate toward at least one predetermined imaging position that is aligned with the alignment mark of the second group; When the at least one of the alignment marks of the second group is not included in the imaging field of the imaging unit that moves to the imaging target position, the imaging unit refers to the second position information predicted by the computing unit. After obtaining the actual measured value of the second position information by the predicted value, the pattern forming unit forms a pattern on the main surface based on the actual measured value of the second position information; and the at least one of the alignment marks of the second group When it is included in the shooting field of the above-mentioned imaging unit that moves to the above-described shooting position, The pattern forming unit forms a pattern on the main surface based on an actual measurement value of the second position information including at least one of actual measurement values of the second group of alignment marks obtained from the imaging field. The pattern forming apparatus according to claim 7, further comprising: a moving mechanism that relatively moves the imaging unit and the substrate toward at least one predetermined imaging position that is aligned with the alignment mark of the second group; When the at least one of the alignment marks of the second group is not included in the imaging field of the imaging unit that moves to the imaging target position, the imaging unit refers to the second position information predicted by the computing unit. After obtaining the actual measured value of the second position information by the predicted value, the pattern forming unit forms a pattern on the main surface based on the actual measured value of the second position information; and the at least one of the alignment marks of the second group In the case of the imaging field of view of the imaging unit that moves to the imaging target position, the pattern forming unit includes an actual measurement value including at least one of the alignment marks of the second group obtained from the imaging field. The actual measurement value of the second position information forms a pattern on the main surface. The pattern forming apparatus of claim 8, further comprising: a moving mechanism that relatively moves the imaging unit and the substrate toward at least one predetermined imaging position that is aligned with the alignment mark of the second group; When the at least one of the alignment marks of the second group is not included in the imaging field of the imaging unit that moves to the imaging target position, the imaging unit refers to the second position information predicted by the computing unit. After obtaining the actual measured value of the second position information by the predicted value, the pattern forming unit forms a pattern on the main surface based on the actual measured value of the second position information; and the at least one of the alignment marks of the second group When it is included in the shooting field of the above-mentioned imaging unit that moves to the above-described shooting position, The pattern forming unit forms a pattern on the main surface based on an actual measurement value of the second position information including at least one of actual measurement values of the second group of alignment marks obtained from the imaging field. A pattern forming method for forming a pattern on the main surface based on position information of a plurality of alignment marks formed on a main surface of one side of a substrate, and comprising: a holding step of holding the substrate a first imaging step of capturing an actual measurement value of the first position information by capturing an alignment mark of the first group formed on the main surface of the substrate to be held by the imaging unit; the prediction step is based on The actual measurement value of the first position information acquired in the first imaging step is generated at a second position of the alignment mark of the second group on the peripheral side of the main surface than the alignment mark of the first group a second prediction step of capturing the alignment mark of the second group formed on the main surface of the substrate to be held, referring to the predicted value of the second position information, and acquiring the second The actual measured value of the position information; and a pattern forming step of forming a pattern on the main surface based on the actual measured value of the second position information. The pattern forming method of claim 14, wherein the step of performing the step before the first imaging step includes a confirming step of causing at least one of the imaging unit and the substrate to face the alignment mark of the second group The preset imaging position is relatively moved, and it is confirmed whether at least one of the alignment marks of the second group is included in the imaging field of the imaging unit; and the alignment flag of the second group is determined in the confirming step. At least 1 above When the image is not included in the imaging field, the pattern forming step is performed after the first imaging step, the prediction step, and the second imaging step; and the alignment flag of the second group is determined in the confirming step In the case of the above-described imaging field of view, the first imaging step, the prediction step, and the second imaging step are omitted, and the at least one of the alignment marks of the second group obtained in the confirmation step is included The pattern forming step described above is performed on the actual measured value of the second position information of the actual measured value. The pattern forming method of claim 14, wherein the alignment mark of the first group includes a center alignment mark located at a center of the main surface, and an alignment mark adjacent to the center alignment mark. The pattern forming method according to claim 14, wherein the substrate is formed by inverting and transferring a laminated body of a functional layer formed on a substrate for transfer onto a main surface of the one side of a base layer of the substrate for a product. The pattern forming method of claim 14, wherein the number of the alignment marks of the second group is larger than the number of the alignment marks of the first group. The pattern forming method according to any one of claims 14 to 18, wherein the pattern is formed by forming an exposure pattern on the main surface of the substrate, wherein the pattern forming step is spatially modulated from the optical head based on the drawing material. The light is irradiated upward from the upper surface to the main surface, and the optical head is moved relative to the main surface of the substrate. The pattern forming method of claim 19, wherein the drawing data is generated by performing data processing corresponding to actual measurement values of the second position information on the design data. The pattern forming method according to any one of claims 14 to 18, wherein the forming of the pattern forms an exposure pattern toward the main surface of the substrate, The pattern forming step is performed by exposing a mask that selectively irradiates the planar light to the main surface via a mask. The pattern forming method of claim 21, wherein the pattern forming step is performed by selecting one of a plurality of masks prepared in advance based on the common reference pattern based on the actual measured value of the second position information.