JP2016072434A - Pattern formation device and pattern formation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology capable of improving throughput in alignment processing.SOLUTION: In an alignment processing, first of all, imaging is performed on a first group of alignment marks Ma0 and Ma1 by an alignment camera 60, and first positional information is acquired. A control part 70 predicts second positional information from the first positional information by calculation. The alignment camera 60 then images a second group of alignment marks Ma11-Ma14 while referring to a prediction value of the second positional information and acquires a measurement of the second positional information. Since the first group of alignment marks which are easy to be included in a field 65 of view of imaging are imaged, the measurement of the first positional information is acquired in a shorter time. Since the second group of alignment marks which are unlikely to be included in the field 65 of view of imaging are imaged while referring to the prediction value of the second positional information, the measurement of the second positional information is acquired in a shorter time.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a pattern forming apparatus and a pattern forming method for forming a pattern on a main surface based on positional information of a plurality of alignment marks formed on one main surface of a substrate.

  As a pattern forming technique, a pattern is formed by irradiating a main surface of a substrate to be processed by exposure, or by irradiating a main surface of the substrate to be processed with a charged particle beam such as an electron beam. Technology is known.

  For example, a direct drawing technique for drawing a desired exposure pattern on the main surface by irradiating the main surface of the substrate to be drawn while scanning with exposure light is known (Patent Documents 1 and 2). As another example, a mask exposure technique is known in which a pattern is formed by mask exposure in which a main surface of a substrate is selectively irradiated with planar light through a mask.

  For example, in a direct drawing apparatus, each part of the apparatus is normally controlled in accordance with drawing data converted from design data including a specific pattern, and a pattern forming process is executed. The design data is created on the assumption that a substrate without deformation is held at an ideal position of the substrate holding unit. However, the substrate to be processed is not necessarily arranged at the ideal position of the substrate holding unit. Further, the substrate to be processed may be deformed such as warpage, distortion, or distortion. For this reason, even if drawing processing is executed using drawing data converted from design data as it is, sufficient drawing quality may not be obtained.

  Therefore, in this type of apparatus, in general, the alignment process is executed prior to the pattern forming process. In the alignment process, information on the positional deviation of the substrate held by the substrate holding unit and the deformation of the substrate is acquired, and the positional deviation and the deformation are corrected.

  In the alignment process, first, the imaging unit images the main surface of the substrate, whereby position information of a plurality of alignment marks formed on the main surface is acquired. Thereby, the position information and shape information of the substrate are acquired.

  Next, the positional deviation of the substrate and the deformation of the substrate are corrected in consideration of the position information and the shape information. This mode includes a mode in which the correction is performed by performing data processing in consideration of the position information and shape information, and mechanical processing such as substrate movement and mask selection in consideration of the position information and shape information. There are known a mode in which the correction is performed by performing, or a mode in which the correction is performed by combining data processing and mechanical processing in consideration of the position information and shape information.

Japanese Patent No. 5496041 JP 2008-249958 A

  However, if the displacement of the substrate held by the substrate holder is large, or if the substrate is greatly deformed, the amount of displacement of the alignment mark on the substrate main surface also increases, and an attempt is made to image a specific alignment mark. However, a situation occurs in which the alignment mark is not included in the imaging field of the imaging unit.

  In this case, if the substrate and the imaging unit are moved relative to each other by trial and error until the alignment mark is included in the imaging field of view, the throughput of the apparatus decreases.

  SUMMARY An advantage of some aspects of the invention is that it provides a pattern forming apparatus and a pattern forming method capable of improving the throughput in alignment processing.

  In order to solve the above-described problem, a pattern forming apparatus according to a first aspect of the present invention provides a pattern on the main surface based on position information of a plurality of alignment marks formed on one main surface of a substrate. A pattern forming apparatus for forming a substrate, wherein a holding unit that holds the substrate, and an imaging unit that images at least a part of the plurality of alignment marks formed on the main surface of the substrate held by the holding unit And, from the first position information of the first group of alignment marks imaged by the imaging unit among the plurality of alignment marks, the second group located closer to the peripheral side of the main surface than the first group of alignment marks A calculation unit that calculates and predicts the second position information of the alignment mark, and a pattern formation unit that forms a pattern on the main surface, and is predicted by the calculation unit. After the imaging unit acquires the actual measurement value of the second position information with reference to the predicted value of the second position information, the pattern forming unit applies a pattern to the main surface according to the actual measurement value of the second position information. It is characterized by forming.

  A pattern forming apparatus according to a second aspect of the present invention is the pattern forming apparatus according to the first aspect of the present invention, wherein the first group of alignment marks is a central alignment mark located at the center of the main surface. And an alignment mark adjacent to the central alignment mark.

  A pattern forming apparatus according to a third aspect of the present invention is the pattern forming apparatus according to the first or second aspect of the present invention, wherein the substrate is a functional layer formed on a transfer substrate. The laminate is formed by being reversely transferred onto the main surface on the one side of the base layer of the product substrate.

  A pattern forming apparatus according to a fourth aspect of the present invention is the pattern forming apparatus according to any one of the first to third aspects of the present invention, wherein the number of alignment marks of the second group is More than the number of alignment marks in the first group.

  A pattern forming apparatus according to a fifth aspect of the present invention is the pattern forming apparatus according to any one of the first to fourth aspects of the present invention, wherein the pattern is formed on the main surface of the substrate. The exposure pattern is formed on the main surface of the optical head and the substrate while irradiating the main surface with light that is spatially modulated based on drawing data from the optical head. And are moved relative to each other.

  A pattern forming apparatus according to a sixth aspect of the present invention is the pattern forming apparatus according to the fifth aspect of the present invention, wherein the drawing data corresponds to a measured value of the second position information with respect to design data. It is generated by performing the data processing.

  A pattern forming apparatus according to a seventh aspect of the present invention is the pattern forming apparatus according to any one of the first to fourth aspects of the present invention, wherein the pattern is formed on the main surface of the substrate. The exposure pattern is formed by mask exposure in which the main surface is selectively irradiated with planar light through a mask.

  A pattern forming apparatus according to an eighth aspect of the present invention is the pattern forming apparatus according to the seventh aspect of the present invention, wherein one mask among a plurality of masks prepared in advance based on a common reference pattern is provided. The pattern is formed by selecting according to the measured value of the second position information.

  A pattern forming method according to a ninth aspect of the present invention is a pattern forming method for forming a pattern on the main surface based on positional information of a plurality of alignment marks formed on one main surface of the substrate. A holding step for holding the substrate, and a first image pickup for picking up an image of the first group of alignment marks formed on the main surface of the substrate to be held by an image pickup unit to obtain an actual measurement value of the first position information. And a second group of alignment marks positioned on the peripheral side of the main surface with respect to the first group of alignment marks based on the measured value of the first position information acquired in the first imaging step. Imaging the second group of alignment marks formed on the main surface of the substrate to be held with reference to a prediction step of generating a predicted value of the second position information and the predicted value of the second position information And said A second imaging step of obtaining the measured value of the position information, characterized in that it and a pattern forming step of forming a pattern on the main surface based on the measured value of the second position information.

  A pattern forming method according to a tenth aspect of the present invention is the pattern forming method according to the ninth aspect of the present invention, wherein the second group of alignment marks is performed as a step performed prior to the first imaging step. Whether or not the at least one of the second group of alignment marks is included in the imaging field of view of the imaging unit by relatively moving the imaging unit and the substrate to a predicted imaging position set in advance for at least one of A confirmation step for confirming, and when it is determined in the confirmation step that the at least one of the second group of alignment marks is not included in the imaging field of view, the first imaging step, the prediction step, and After passing through the second imaging process, the pattern forming process is executed, and the second group of alignment marks is captured in the imaging process. If it is determined that it is included in the field, the first imaging step, the prediction step, and the second imaging step are omitted, and at least the second group of alignment marks obtained in the confirmation step The pattern forming step is performed based on an actual measurement value of the second position information including one actual measurement value.

  A pattern forming method according to an eleventh aspect of the present invention is the pattern forming method according to the ninth aspect or the tenth aspect of the present invention, wherein the first group of alignment marks is at the center of the main surface. It includes a center alignment mark that is positioned, and an alignment mark adjacent to the center alignment mark.

  A pattern forming method according to a twelfth aspect of the present invention is the pattern forming method according to any of the ninth to eleventh aspects of the present invention, wherein the substrate is formed on a transfer substrate. A laminate of functional layers is formed by being reversely transferred onto the main surface on the one side of the base layer of the product substrate.

  A pattern forming method according to a thirteenth aspect of the present invention is the pattern forming method according to any of the ninth to twelfth aspects of the present invention, wherein the number of alignment marks in the second group is More than the number of alignment marks in the first group.

  A pattern forming method according to a fourteenth aspect of the present invention is the pattern forming method according to any of the ninth to thirteenth aspects of the present invention, wherein the pattern is formed on the main surface of the substrate. The pattern forming step irradiates the main surface with light modulated spatially based on drawing data from the optical head to the main surface of the substrate. It is characterized by being moved relative to each other.

  A pattern formation method according to a fifteenth aspect of the present invention is the pattern formation method according to the fourteenth aspect of the present invention, wherein the drawing data corresponds to an actual measurement value of the second position information with respect to design data. It is generated by performing the data processing.

  A pattern forming method according to a sixteenth aspect of the present invention is the pattern forming method according to any one of the ninth to thirteenth aspects of the present invention, wherein the pattern is formed on the main surface of the substrate. The pattern forming step is performed by mask exposure in which the main surface is selectively irradiated with planar light through a mask.

  A pattern forming method according to a seventeenth aspect of the present invention is the pattern forming method according to the sixteenth aspect of the present invention, wherein one mask among a plurality of masks prepared in advance based on a common reference pattern is provided. The pattern forming step is executed by selecting according to an actual measurement value of the second position information.

  In each aspect of the present invention, first, imaging is performed on a first group of alignment marks among a plurality of alignment marks formed on the main surface of the substrate. The amount of displacement of the alignment mark from the ideal state due to the displacement of the substrate or the deformation of the substrate is generally relatively large at the alignment mark (second group alignment mark) located on the peripheral side of the substrate and toward the center of the substrate. A relatively small alignment mark (first group alignment mark). This is because when the substrate is rotated by a certain angle from the ideal rotation position and held by the substrate holder, the amount of rotational displacement increases as the diameter from the center of the substrate increases, or the substrate is distorted This is because the amount of strain increases as the distance from the center of the substrate increases. In the present invention, since the first group of alignment marks positioned on the center side of the substrate is first imaged as described above, the alignment mark to be imaged is easily included in the imaging field of view, and the first position information is measured in a shorter time. The value is obtained.

  Next, a predicted value of the second position information of the second group of alignment marks is generated based on the actually measured value of the first position information. Then, with reference to the predicted value of the second position information, the imaging unit images the second group of alignment marks, and an actual measurement value of the second position information is acquired. For this reason, in each aspect of the present invention, an actual measurement value of the second position information is acquired in a shorter time than other aspects that do not use the predicted value.

  Then, pattern formation processing is performed on the main surface of the substrate in accordance with the actual measurement value of the second position information. For this reason, in each aspect of the present invention, pattern formation processing that takes into account position information and shape information on the entire main surface of the substrate, compared to other aspects in which pattern formation processing is performed according to the actual measurement value of the first position information. Can be executed.

2 is a side view of the drawing apparatus 100. FIG. 2 is a top view of the drawing apparatus 100. FIG. 2 is a flowchart showing the flow of overall processing in the drawing apparatus 100. FIG. 6 is a flowchart showing a flow of alignment processing in the drawing apparatus 100. FIG. 4 is a top view showing an upper surface of a substrate W and an imaging field 65 of the alignment camera 60. FIG. 4 is a top view showing an upper surface of a substrate W and an imaging field 65 of the alignment camera 60. FIG. 4 is a top view showing an upper surface of a substrate W and an imaging field 65 of the alignment camera 60. FIG. 4 is a top view showing an upper surface of a substrate W and an imaging field 65 of the alignment camera 60. FIG. 4 is a top view showing an upper surface of a substrate W and an imaging field 65 of the alignment camera 60. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Parts having similar configurations and functions are denoted by the same reference numerals in the drawings, and redundant description is omitted. In the drawings, the size and number of each part may be exaggerated or simplified for easy understanding. 1 and 2 are attached with an XYZ orthogonal coordinate system in which the Z direction is the vertical direction and the XY plane is the horizontal plane in order to clarify the directional relationship of each part.

<1 embodiment>
<1.1 Overall Configuration of Drawing Apparatus 100>
FIG. 1 is a side view illustrating a configuration example of a drawing apparatus 100 as an example of a drawing apparatus according to an embodiment. FIG. 2 is a top view showing a configuration example of the drawing apparatus 100 of FIG.

  The drawing apparatus 100 is a direct drawing apparatus that draws a pattern by irradiating spatially modulated light onto one main surface of a substrate W such as a semiconductor substrate or a glass substrate to which a photosensitive material is applied. Here, the substrate W is a concept including both a single-layer substrate composed of only a base layer and a multilayer substrate in which a functional layer is laminated on at least one main surface of the base layer. Hereinafter, as an example, a mode in which the drawing apparatus 100 draws a pattern on the main surface of the circular laminated substrate W will be described.

  The drawing apparatus 100 includes a main body 105 having a main configuration of the apparatus inside a space formed by attaching a cover 102 to the main body frame 101, and an outer side of the main body 105 (as shown in FIG. A substrate storage cassette 110 disposed on the right hand side of 105 and a control unit 70.

  The pattern design apparatus 150, which is an external apparatus of the drawing apparatus 100, is connected to the control unit 70 of the drawing apparatus 100 via a communication line, and various data (for example, exposure patterns for CAD are used with the control unit 70). Design data can be exchanged in a format.

<1.2 Configuration of each part>
<1.2.1 Main Body 105>
The main body 105 serves as a processing unit 106 related to the exposure process, a stage 10 (holding unit) that holds the substrate W in a horizontal posture, a stage moving mechanism 20 that moves the stage 10, and a position parameter corresponding to the position of the stage 10. A position parameter measuring mechanism 30 that measures the above, an optical head unit 50 (pattern forming unit) that irradiates the upper surface of the substrate W with pulsed light, and an alignment camera 60 (imaging unit).

  Further, the main body unit 105 includes a transfer robot 120. The transfer robot 120 is a robot that is arranged on the + Y side with respect to the processing unit 106 and transfers the substrate W between the processing unit 106 and the substrate storage cassette 110. The transfer robot 120 receives an unprocessed substrate W stored in the substrate storage cassette 110 from the substrate storage cassette 110 and passes it to the main body unit 105. Further, the transfer robot 120 receives the processed substrate W that has been subjected to the exposure processing in the processing unit 106 from the processing unit 106 and transfers it to the substrate storage cassette 110.

  A base 130 for supporting each part of the processing unit 106 is disposed in a lower part of the processing unit 106. A substrate delivery area for delivering the substrate W between the processing unit 106 and the transfer robot 120 is set at a position on the base 130 on the + Y side. In addition, a pattern drawing area for drawing a pattern on the substrate W is set at a position on the base 130 in the center in the Y direction. In addition, an imaging region for imaging the upper surface of the substrate W is set at a position on the −Y side on the base 130.

  The head support unit 140 includes two leg members 141 erected upward from the base 130, and two legs erected upward from the base 130 on the −Y side of the two leg members 141. Leg member 142. Further, the head support portion 140 includes a beam member 143 provided so as to bridge between the top portions of the two leg members 141 and a beam provided so as to bridge between the top portions of the two leg members 142. Member 144. The optical head unit 50 is attached to the + Y side of the beam member 143, and the alignment camera 60 is attached to the −Y side of the beam member 143.

  The alignment camera 60 is an image pickup unit that picks up an image of the lower position of the alignment camera 60, and picks up an image of the upper surface of the substrate W that is held and conveyed by the stage 10 and comes to the lower position of the alignment camera 60. On the upper surface of the substrate W, a plurality of alignment marks Ma used for detecting position information of the substrate W (information such as rotation and offset of the substrate W) and shape information of the substrate W (information such as strain of the substrate W). Is formed (FIG. 5). The alignment camera 60 images at least a part of the plurality of alignment marks Ma and generates image data. The generated imaging data is transmitted to the control unit 70. The control unit 70 detects position information and shape information of the substrate W based on the received imaging data, and controls each part of the apparatus while referring to the detected position information and shape information.

  In addition, as long as the position of the alignment mark Ma on the substrate W can be accurately specified, various forms can be adopted. For example, an aspect using an alignment mark Ma formed by mechanical processing such as a through-hole may be used, or an aspect using an alignment mark Ma patterned by a printing process, a photolithography process, or the like. In the present embodiment, the alignment mark Ma shown in a cross shape in the top view is used as the alignment mark Ma (FIG. 5). In this embodiment, the number of alignment marks Ma formed on the upper surface of the substrate W is 21, but this number can also be set as appropriate.

  The stage 10 has a cylindrical outer shape, and is a holding unit for placing and holding the substrate W in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. For this reason, when the substrate W is placed on the stage 10, the substrate W is attracted and fixed to the upper surface of the stage 10 by the suction pressure of the plurality of suction holes.

  The stage moving mechanism 20 includes a rotation mechanism 21 that rotates the stage 10, a support plate 22 that rotatably supports the stage 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a sub-scanning mechanism 23. And a main scanning mechanism 25 for moving the base plate 24 in the main scanning direction.

  The rotation mechanism 21 has a motor constituted by a rotor attached inside the stage 10. A rotary bearing mechanism is provided between the lower surface side of the center portion of the stage 10 and the support plate 22. For this reason, when the motor is operated, the rotor moves in the θ direction (the rotation direction around the Z axis), and the stage 10 rotates around the rotation axis of the rotary bearing mechanism.

  The sub-scanning mechanism 23 has a linear motor 23 a that generates a propulsive force in the sub-scanning direction by a mover attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. The sub-scanning mechanism 23 has a pair of guide rails 23 b that guide the support plate 22 along the sub-scanning direction with respect to the base plate 24. Therefore, when the linear motor 23a is operated, the support plate 22 and the stage 10 move in the sub-scanning direction (X direction) along the guide rail 23b on the base plate 24.

  The main scanning mechanism 25 has a linear motor 25 a that generates a propulsive force in the main scanning direction by a moving element attached to the lower surface of the base plate 24 and a stator laid on the upper surface of the head support portion 140. The main scanning mechanism 25 has a pair of guide rails 25b for guiding the base plate 24 along the main scanning direction with respect to the head support portion 140. For this reason, when the linear motor 25a is operated, the base plate 24, the support plate 22, and the stage 10 move in the main scanning direction (Y direction) along the guide rail 25b on the base 130. As such a stage moving mechanism 20, various XY-θ axis moving mechanisms can be used.

  The position parameter measurement mechanism 30 is a mechanism that measures the position parameter of the stage 10 using the interference of laser light. The position parameter measurement mechanism 30 mainly includes a laser beam emitting unit 31, a beam splitter 32, a beam bender 33, a first interferometer 34, and a second interferometer 35.

  The laser beam emitting unit 31 is a light source device for emitting a measurement laser beam ML. The laser beam emitting unit 31 is provided at a position fixed with respect to the base 130 and the optical head unit 50. The laser light ML emitted from the laser light emitting unit 31 first enters the beam splitter 32, and the first branched light ML1 that travels from the beam splitter 32 to the beam bender 33, and the second interferometer 35 from the beam splitter 32. The light is branched to the second branched light ML2 that travels toward.

  The first branched light ML1 is reflected by the beam bender 33, enters the first interferometer 34, and is irradiated from the first interferometer 34 to the first part 10a on the −Y side end of the stage 10. Is done. Then, the first branched light ML1 reflected by the first part 10a is incident on the first interferometer 34 again. The first interferometer 34 is a position corresponding to the position of the first part 10a of the stage 10 based on the interference between the first branched light ML1 directed to the stage 10 and the first branched light ML1 reflected from the stage 10. Measure parameters.

  On the other hand, the second branched light ML2 is incident on the second interferometer 35, and the second part (the first part 10a is the second side of the -Y side end of the stage 10 from the second interferometer 35. Different parts) 10b are irradiated. Then, the second branched light ML2 reflected by the second part 10b is incident on the second interferometer 35 again. The second interferometer 35 is a position corresponding to the position of the second part 10b of the stage 10 based on the interference between the second branched light ML2 directed to the stage 10 and the second branched light ML2 reflected from the stage 10. Measure parameters.

  The first interferometer 34 and the second interferometer 35 transmit the position parameters acquired by the respective measurements to the control unit 70. The controller 70 controls the position of the stage 10 and the moving speed of the stage 10 using the position parameter.

  The optical head unit 50 is a light irradiating unit that irradiates pulse light for exposure processing toward the lower position thereof, and is pulsed onto the upper surface of the substrate W that is held and conveyed by the stage 10 and is positioned below the optical head unit 50. It is a part to irradiate. In the present embodiment, a case will be described in which a resist layer that is exposed to ultraviolet rays is formed in advance on the upper surface of the substrate W, and the optical head unit 50 emits pulsed light (ultraviolet rays) having a wavelength of 355 nm.

  The optical head unit 50 is connected to one laser oscillator 54 via the illumination optical system 53. The laser oscillator 54 is connected to a laser driving unit 55 that drives the laser oscillator 54. The laser driving unit 55, the laser oscillator 54, and the illumination optical system 53 are provided inside the box 172. When the laser driving unit 55 is operated, pulsed light is emitted from the laser oscillator 54, and the pulsed light is introduced into the optical head unit 50 through the illumination optical system 53.

  In the optical head unit 50, a spatial light modulator that spatially modulates the irradiated light, a drawing control unit that controls the spatial light modulator, and pulse light introduced into the optical head unit 50 is spatial light. An optical system for irradiating the upper surface of the substrate W via the modulator, etc. (not shown) is mainly provided. As the spatial light modulator, for example, GLV (registered trademark: Grading Light Valve) which is a diffraction grating type spatial light modulator is adopted. The pulsed light introduced into the optical head unit 50 is directly irradiated onto the upper surface of the substrate W as a light beam shaped into a predetermined pattern shape by a spatial light modulator or the like, and exposes a photosensitive layer such as a resist on the substrate W. To do. Thereby, a pattern is drawn on the upper surface of the substrate W.

  The drawing apparatus 100 forms a pattern on the entire drawing region of the substrate W by repeating the drawing of the pattern in the main scanning direction a predetermined number of times while shifting the substrate W in the sub-scanning direction by the exposure width by the optical head unit 50. .

<1.2.2 Substrate storage cassette 110>
The substrate storage cassette 110 includes a first storage unit that stores an unprocessed substrate W to be subjected to an exposure process, and a second storage unit that stores a processed substrate W that has been subjected to an exposure process. Further, as described above, the transfer robot 120 can transfer the substrate W to and from the substrate storage cassette 110.

  For this reason, the unprocessed substrate W stored in the first storage unit is transported to the processing unit 106 via the transport robot 120, and exposure processing is executed. Then, the processed substrate W that has been subjected to the exposure process is stored in the second storage unit via the transfer robot 120.

<1.2.3 Control Unit 70>
The control unit 70 is electrically connected to each unit included in the drawing apparatus 100, and controls the operation of each unit of the drawing apparatus 100 while executing various arithmetic processes.

  The control unit 70 includes, for example, a general computer in which a CPU, a ROM, a RAM, a storage device, and the like are interconnected via a bus line. The ROM stores basic programs and the like, and the RAM is used as a work area when the CPU performs predetermined processing. The storage device is configured by a non-volatile storage device such as a flash memory or a hard disk device. A program is stored in the storage device, and various processing (for example, alignment processing and drawing processing described later) is realized by the CPU as the main control unit performing arithmetic processing according to the procedure described in the program. The The program may be stored in a memory such as a storage device in advance, or provided to the storage device in a form (program product) recorded on a recording medium such as a CD-ROM or DVD-ROM or an external flash memory. It doesn't matter. Further, it may be provided to the storage device by downloading from an external server via a network. Note that some or all of the functions realized in the control unit 70 may be realized in hardware by a dedicated logic circuit or the like.

  The control unit 70 is also connected to an input unit, a display unit, a communication unit, etc. (all not shown) via a bus line. The input unit is an input device including, for example, a keyboard and a mouse, and accepts various operation inputs from an operator. The display unit is a display device including a liquid crystal display device, a lamp, and the like, and displays various types of information under the control of the CPU. The communication unit has a data communication function for transmitting and receiving commands and data to and from an external device via a network.

<1.3 Operation of Drawing Apparatus 100>
<1.3.1 Overall processing>
A series of processes executed by the drawing apparatus 100 on the substrate W will be described with reference to FIG. FIG. 3 is a diagram showing the flow of the processing. A series of operations described below is performed under the control of the control unit 70.

  First, the transfer robot 120 takes out one unprocessed substrate W from the substrate storage cassette 110 and places it on the stage 10 (step ST1).

  At this time, the substrate W is placed on the stage 10 in consideration of the rotation position of the substrate W so that a notch (notch, orientation flat, etc.) (not shown) formed in a part of the periphery of the substrate W is in a predetermined position. Placed on top. As a result, the substrate W placed on the stage 10 is roughly aligned with the determined rotational position. When the substrate W is placed on the stage 10, the stage 10 sucks and holds the substrate W (holding process).

  The stage moving mechanism 20 moves the stage 10 to a position below the alignment camera 60. Then, while the stage moving mechanism 20 moves the stage 10, the alignment camera 60 images at least a part of the alignment mark Ma formed on the upper surface of the substrate W. Imaging data generated by the alignment camera 60 by this imaging is transmitted to the control unit 70. The control unit 70 detects position information and shape information of the substrate W based on the received imaging data. Then, using this position information and shape information, alignment processing is performed to correct the positional deviation and shape change of the substrate W as seen from the ideal state (step ST2).

  In the present embodiment, an aspect in which drawing data is generated in consideration of positional deviation and shape change of the substrate W as alignment processing will be described. The alignment process will be described in detail in <1.3.2 Alignment process> described later.

  After the alignment process, the stage moving mechanism 20 moves the stage 10 to a position below the optical head unit 50. Then, the stage moving mechanism 20 moves the stage 10 to move the optical head unit 50 and the substrate W relative to each other while irradiating the upper surface of the substrate W with the light spatially modulated based on the drawing data. . Thereby, the drawing process which draws a specific exposure pattern on the upper surface of the substrate W is executed (step ST3, pattern formation step).

  In the drawing process, first, the substrate W is moved by the stage moving mechanism 20 along the forward direction of main scanning (for example, the + Y direction). At this time, the control unit 70 reads out the portion of the drawing data that describes the data to be drawn in the drawing target area in the main scanning. Then, the control unit 70 controls the modulation unit 82 according to the read data, and emits drawing light spatially modulated according to the data from the optical head unit 50 toward the substrate W. While the optical head unit 50 intermittently emits drawing light toward the substrate W, the stage moving mechanism 20 moves the substrate W once along the forward direction (+ Y direction) of the main scanning, so that the substrate W A specific pattern is drawn in one long region (region extending along the Y direction and having a width along the X direction corresponding to the width of the drawing light) on the upper surface. This movement of the substrate W along the forward direction of main scanning is referred to as forward main scanning.

  When the forward main scanning with the drawing light irradiation ends, the stage moving mechanism 20 moves the stage 10 in the sub-scanning direction (for example, the −X direction) by a distance corresponding to the width of the drawing light. When viewed from the substrate W, the optical head unit 50 moves in the + X direction by the width of the long region. Such movement of the substrate W in the sub-scanning direction (−X direction) is called sub-scanning.

  When the sub-scanning is completed, a return main scanning with irradiation of drawing light is executed. That is, while the optical head unit 50 intermittently emits drawing light toward the substrate W, the stage moving mechanism 20 moves the substrate W in the backward direction of the main scanning (the direction opposite to the forward direction). (-Y direction) is moved once along. By this backward pass main scan, a pattern is drawn in the long region adjacent to the long region drawn in the previous forward main scan.

  When the backward main scanning with the drawing light irradiation ends, the sub-scanning is performed, and then the forward main scanning with the drawing light irradiation is performed again. By the forward main scanning, a pattern is drawn in the long area adjacent to the long area drawn in the previous backward main scanning. Thereafter, similarly, the main scanning with the irradiation of the drawing light is repeatedly performed with the sub-scan interposed therebetween, and the drawing process ends when the entire drawing target area is exposed with a specific pattern.

  When the drawing process ends, the transfer robot 120 receives the processed substrate W from the stage 10 and stores it in the substrate storage cassette 110 (step ST4). Thus, a series of processes for the substrate W is completed.

  After the processed substrate W is stored in the substrate storage cassette 110, the transfer robot 120 takes out a new unprocessed substrate W from the substrate storage cassette 110. This time, the above-described series of processing is performed on the substrate W.

<1.3.2 Alignment process>
The drawing process is performed in accordance with drawing data (for example, raster format data) having a description format that can be processed by the drawing apparatus 100, converted from design data (for example, vector format data) including a specific pattern.

  The design data is created on the assumption that the substrate W that has not been deformed is arranged at an ideal position on the stage 10. However, the substrate W to be processed is not necessarily arranged at the ideal position on the stage 10 at the ideal rotation angle. Further, the substrate W to be processed may be deformed such as warpage, distortion, or distortion. For this reason, even if drawing processing is executed using drawing data converted from design data as it is, sufficient drawing quality may not be obtained.

  Therefore, prior to the drawing process, the position information and shape information of the substrate W to be drawn are acquired, and the data processing is performed on the design data so as to correct the positional deviation and deformation of the substrate W based on these information. Drawing data is generated (alignment processing).

  FIG. 4 is a diagram showing the flow of the alignment process (step ST2 shown in FIG. 3). 5 to 9 are top views showing the upper surface of the substrate W and the imaging field 65 of the alignment camera 60 on the upper surface of the substrate W. FIG. Hereinafter, among the plurality of alignment marks Ma formed on the upper surface of the substrate W, the alignment mark positioned at the center of the substrate W is referred to as an alignment mark Ma0 (central alignment mark). One alignment mark adjacent to the alignment mark Ma0 is referred to as an alignment mark Ma1. Further, the four alignment marks positioned on the peripheral side of the substrate W are referred to as alignment marks Ma11 to Ma14.

  In step ST25 to be described later, four alignment marks Ma11 to Ma14 located on the peripheral side of the substrate W are sequentially imaged. This is because the overall position information and shape information of the substrate W are acquired by using the imaging result on the peripheral side of the substrate W. At this time, if the substrate W without deformation is ideally placed on the stage 10, the mark data of the control unit 70 (the substrate W without deformation is ideally placed on the stage 10). The stage moving mechanism 20 moves the substrate W based on the data including the position information of the alignment mark Ma in the state), so that the alignment mark Ma11 is included in the imaging field 65 of the alignment camera 60 (FIG. 5). However, when the substrate W is deformed or when the substrate W is not arranged at an ideal position on the stage 10, even if the substrate W is moved based on the mark data, the alignment mark Ma11 is displayed in the imaging field of view. 65 may not be included (FIG. 6). In such a case, if the substrate W is moved by trial and error until the alignment mark Ma11 is included in the imaging visual field 65, the throughput of the apparatus is reduced. In addition, if the alignment marks Ma12 to Ma14 are similarly subjected to trial and error, the decrease in throughput becomes more significant. FIG. 5 is a top view showing the substrate W arranged at the ideal position, and FIGS. 6 to 9 are top views showing the substrate W arranged rotated by a certain angle from the ideal position.

  Therefore, in this embodiment, in order to improve the throughput, steps ST21 to ST24 are performed prior to step ST25 to predict the positions of the four alignment marks Ma11 to Ma14. Hereinafter, the alignment process of the present embodiment will be described in detail with reference to FIGS.

  First, if the undeformed substrate W is in an ideally arranged state on the stage 10, the stage moving mechanism 20 moves the substrate W based on the mark data so that the imaging field 65 includes the alignment mark Ma0. Then, the alignment mark Ma0 is imaged by the alignment camera 60 (step ST21). FIG. 7 is a top view showing the top surface of the substrate W and the imaging field 65 in this state.

  The amount of displacement of the alignment mark Ma from the ideal state due to the displacement of the substrate W or deformation of the substrate W is generally relatively large on the peripheral side of the substrate W and relatively small on the central side of the substrate W. This is because the amount of rotational displacement increases as the diameter from the center of the substrate W increases when the substrate W is rotated by a certain angle from the ideal rotation position and placed on the stage 10. This is because the amount of strain increases as the distance from the center of the substrate W increases when it is distorted.

  Accordingly, the alignment mark Ma0 is likely to be included in the imaging field 65 in step ST21 for imaging the alignment mark Ma0 located at the center of the substrate W (that is, the alignment mark Ma0 having a relatively small displacement).

  Of course, as in the case where the substrate W is translated (offset) from the ideal position and placed on the stage 10, the position of the alignment mark Ma is displaced between the center side and the peripheral side of the substrate W. In some cases. In this case, in step ST <b> 21 for imaging the alignment mark Ma <b> 0 located at the center of the substrate W, the imaging target alignment mark Ma <b> 0 may not be included in the imaging field 65. In that case, for example, the substrate W is moved by trial and error until the alignment mark Ma0 is included in the imaging field 65. However, when the positional displacement of the substrate W and the deformation of the substrate W are comprehensively considered, the displacement amount of the alignment mark Ma is relatively larger on the center side of the substrate W than on the peripheral side as described above. small. For this reason, in the aspect of step ST21 which images the alignment mark Ma0 located in the center of the board | substrate W, imaging can be completed in a shorter time compared with the aspect which images the alignment marks Ma11-Ma14 located in the peripheral side of the board | substrate W. Can do.

  Imaging data of the alignment mark Ma0 acquired by the alignment camera 60 is transmitted to the control unit 70. Based on this imaging data, the control unit 70 calculates a displacement amount between the position of the alignment mark Ma0 on the ideal substrate W that is ideally arranged and without deformation and the position of the alignment mark Ma0 on the actual substrate W. The controller 70 predicts the position of the alignment mark Ma1 on the actual substrate W based on the mark data and the displacement amount (step ST22).

  Then, the stage moving mechanism 20 moves the substrate W based on the prediction result obtained in step ST22 so that the imaging visual field 65 includes the alignment mark Ma1. After the movement, the alignment camera Ma1 is imaged by the alignment camera 60 (step ST23). FIG. 8 is a top view showing the upper surface of the substrate W and the imaging field 65 in this state.

  The alignment mark Ma1 is adjacent to the alignment mark Ma0 located at the center of the substrate W, and is an alignment mark having a relatively small displacement amount compared to the alignment marks Ma11 to Ma14. For this reason, in step ST23 for imaging the alignment mark Ma1, the alignment mark Ma1 is likely to be included in the imaging field 65 for the same reason as in step ST21. In step ST23, the stage 10 is moved in consideration of the prediction result obtained in step ST22. For this reason, in step ST23, the alignment field Ma1 is more likely to be included in the imaging field 65 as compared to other modes that do not consider the prediction result (other modes that do not consider information based on actual measurement). Steps ST21 to ST23 are steps for imaging the alignment marks Ma0 and Ma1 (first group alignment marks to be described later), and correspond to the first imaging step of the present invention.

  Imaging data of the alignment mark Ma1 acquired by the alignment camera 60 is transmitted to the control unit 70. Based on the imaging data of the alignment marks Ma0 and Ma1 acquired from the alignment camera 60, the control unit 70 determines the alignment mark Ma on the actual substrate W from the coordinate value of the ideal alignment mark Ma on the ideal substrate W without deformation. A Helmat transform matrix is calculated when converting to the coordinate value of. The Helmert transformation is desirable in that it requires fewer measurement points than the affine transformation described later and is easy to calculate. The control unit 70 predicts the positions of the alignment marks Ma11 to Ma14 on the actual substrate W based on the mark data and the Helmart transformation matrix (step ST24, prediction process).

  Then, the stage moving mechanism 20 moves the substrate W with reference to the prediction result obtained in step ST24 so that the imaging visual field 65 includes the alignment mark Ma11. After the movement, the alignment camera Ma11 is imaged by the alignment camera 60 (step ST25, FIG. 9). Similarly, the substrate W is moved with reference to the prediction result obtained in step ST24, and the alignment marks Ma12 to Ma14 are sequentially imaged by the alignment camera 60 (step ST25). Step ST25 is a step of imaging the alignment marks Ma11 to Ma14 (second group alignment marks described later), and corresponds to the second imaging step of the present invention.

  In step ST25, the stage 10 is moved with reference to the prediction result obtained in step ST24. For this reason, in step ST25, the alignment marks Ma11 to Ma14 are more likely to be included in the imaging field of view 65 as compared to other modes that do not refer to the prediction result.

  Imaging data of the alignment marks Ma11 to Ma14 acquired by the alignment camera 60 is transmitted to the control unit 70. Based on the imaging data of the alignment marks Ma11 to Ma14 acquired from the alignment camera 60, the control unit 70 calculates the alignment mark Ma on the actual substrate W from the coordinate value of the ideal alignment mark Ma on the ideal substrate W without deformation. An affine transformation matrix for transformation into the coordinate value of is calculated. The affine transformation is desirable in that it is a highly accurate transformation compared to the above-described Helmart transformation. The control unit 70 corrects the design data based on the mark data and the affine transformation matrix, performs RIP processing on the corrected design data, and generates drawing data (step ST26). In step ST26, the drawing data is generated based on the imaging data of the alignment marks Ma11 to Ma14 formed on the peripheral edge of the substrate W. Therefore, the overall position information and shape information of the substrate W are reflected in the drawing data. Is desirable. The position information and shape information may be expressed by linear transformation (for example, the affine transformation or projective normalization transformation), or may be represented by nonlinear transformation (for example, thin plate spline interpolation). Further, the position information and the shape information may be expressed by a combination of a plurality of transformations (for example, a combination of linear transformation and nonlinear transformation).

<1.3.3 Effect of alignment processing>
The effect of the alignment process in this embodiment will be described. Hereinafter, the alignment marks Ma0 and Ma1 are collectively expressed as a first group of alignment marks, and the alignment marks Ma11 to Ma14 are collectively expressed as a second group of alignment marks. Of the information acquired by imaging with the alignment camera 60, the position information of the alignment marks Ma0 and Ma1 is expressed as first position information, and the position information of the alignment marks Ma11 to Ma14 is expressed as second position information.

  In the alignment process of this embodiment, first, the first group of alignment marks is imaged by the alignment camera 60 to obtain first position information (steps ST21 to ST23). The control unit 70 (calculation unit) predicts the second position information by calculation from the first position information acquired by actual measurement (step ST24). Thereafter, the alignment camera 60 images the second group of alignment marks with reference to the predicted value of the second position information obtained in step ST24, and acquires the measured value of the second position information (step ST25). Then, drawing data that defines the operation of each unit during the drawing process is generated according to the actually measured value of the second position information.

  As described above, in the present embodiment, the first group of alignment marks that are located on the center side of the substrate W and are likely to be included in the imaging field 65 are first imaged by the alignment camera 60. For this reason, the actual measurement value of the first position information can be acquired in a shorter time.

  For the second group of alignment marks that are located on the peripheral side of the substrate W and are not easily included in the imaging visual field 65, the alignment camera is referred to the predicted value of the second position information obtained based on the first position information. 60 is performed. For this reason, in the aspect of this embodiment, the measured value of 2nd positional information can be acquired in a shorter time compared with the other aspect which does not use the said predicted value. In the present embodiment, it is desirable in that Helmert transformation is used, which requires a small number of measurement points when predicting the second position information and is easy to calculate. Since the Helmart transform is a transform that does not consider shear deformation, it is considered to be a transformation with lower accuracy than the affine transform that considers shear deformation. However, the main purpose of the prediction is to make the second group of alignment marks easy to be included in the imaging field 65, and in general, the shear deformation of the substrate W is not so large as to miss the purpose. For this reason, even if it is relatively low-accuracy Helmat transform, the above object is sufficiently achieved.

  In the present embodiment, the control unit 70 generates drawing data according to the actually measured value of the second position information. For this reason, in the aspect of this embodiment, the drawing which considered the positional information and shape information in the whole board | substrate W compared with the other aspect in which the control part 70 produces | generates drawing data according to the measured value of 1st position information. Data can be generated. In the present embodiment, this position information and shape information are desirable in that they are expressed by affine transformation with higher accuracy.

  In the present embodiment, the number (four) of the second group of alignment marks actually measured for generating the drawing data is equal to the number of the first group of alignment marks actually measured for predicting the second position information. More than the number (2). Here, the generation accuracy of the drawing data is directly related to the pattern drawing accuracy (and consequently the quality of the final product), and thus high accuracy is required. However, as described above, the second position information is predicted by the second group of alignment marks. Is included in the imaging field of view 65. For this reason, the number of measurement points is increased for the second group of alignment marks for which higher-accuracy actual measurement is required, and the number of measurement points for the first group of alignment marks that are allowed even for low-accuracy actual measurement is reduced, so that the final product As a result, the throughput in the alignment process can be improved.

  As a result, it is possible to generate drawing data considering the entire information of the substrate W while improving the throughput in the alignment process.

<2 Modification>
Although the embodiment of the present invention has been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention.

  In the above embodiment, the mode of drawing a pattern on the laminated substrate W has been described, but the present invention is not limited to this. For example, a mode in which a pattern is drawn on a single-layer substrate composed only of a base layer may be used. Note that the effect of the present invention that the throughput of the alignment process can be improved is that the position of the alignment mark on the substrate W is easily changed (in other words, the conventional alignment process is difficult to include the alignment mark in the imaging field of view 65). This is particularly effective for a substrate W) that tends to decrease. For this reason, the laminated substrate W is formed by reversing and transferring the functional layer laminate formed on the transfer substrate (eg, sapphire substrate) to one main surface of the base layer of the product substrate (eg, silicon wafer). A substrate W such as (for example, an LED substrate) in which the layers are rubbed and the position of the alignment mark is easily changed in the formation process of the laminated substrate is preferable as an application target of the present invention.

  In the above embodiment, the optical head unit 50 and the substrate W are moved relative to each other while irradiating the spatially modulated light based on the drawing data from the optical head unit 50 to the upper surface of the substrate W. Although the aspect which forms is described, it is not restricted to this. The present invention is applicable to various pattern forming apparatuses that form a pattern on the main surface of the substrate W based on the actually measured value of the second position information. For example, the present invention can also be applied to an apparatus that forms a pattern by mask exposure in which surface light is selectively irradiated onto the upper surface of the substrate W through a mask. In this case, a plurality of masks are prepared in advance based on a common reference pattern, and mask exposure is performed by selecting one of the plurality of masks according to the actual measurement value of the second position information. Thus, the positional deviation and deformation of the substrate W can be corrected. As described above, the mode of alignment processing for correcting the positional deviation and deformation of the substrate W based on the position information of the alignment mark is the same as the mode of the present embodiment performed by mechanical processing in addition to the mode of the above-described embodiment performed by data processing. Various modes such as a mode and a mode in which data processing and mechanical processing are performed in combination can be adopted. In addition to the pattern formation by exposure described above, various aspects such as pattern formation by irradiating the upper surface of the substrate W with a charged particle beam such as an electron beam can be adopted as the pattern formation.

  In the above-described embodiment, the first group of alignment marks has been described as having two points, that is, the alignment mark Ma0 located at the center of the main surface of the substrate W and the alignment mark Ma1 adjacent thereto. It is not limited. The first group of alignment marks may be composed of three or more alignment marks. If the first group of alignment marks includes the alignment marks Ma0 and Ma1 as in the above embodiment, the alignment mark Ma0 and Ma1 are easily included in the imaging field 65, so that the alignment process is efficiently performed. This is desirable. In addition, the second group of alignment marks may adopt a mode of 3 points or less or 5 points or more in addition to the mode of 4 points as in the above embodiment.

  Moreover, although the said embodiment demonstrated the aspect in which drawing data were produced | generated only according to the measured value of 2nd position information, it is not restricted to this. For example, the drawing data may be generated according to the actual measurement value of the first position information and the actual measurement value of the second position information. When drawing data is generated using position information (first position information) on the center side of the substrate main surface and position information (second position information) on the peripheral side in this way, nonlinear transformation (for example, thin plate spline interpolation) Etc.) can be used to express the position information and shape information of the substrate W with higher accuracy.

  In the above-described embodiment, an aspect in which the alignment process is integrally performed on the entire main surface of the substrate W (in other words, an aspect in which misalignment and deformation are corrected integrally with respect to the entire main surface of the substrate W) has been described. However, it is not limited to this. An aspect in which the main surface of the substrate W is virtually divided into a plurality of sections and alignment processing is performed for each section (for example, an aspect in which drawing data is generated for each divided section) may be used.

  In the above embodiment, the mode in which the first imaging process (steps ST21 to ST23) is first performed on the substrate W held on the stage 10 has been described, but the present invention is not limited to this. For example, as a process performed prior to the first imaging process, the alignment camera 60 and the substrate W are relatively moved to an expected imaging position preset for at least one of the second group of alignment marks (for example, the alignment mark Ma11). And a confirmation step of confirming whether or not the alignment mark Ma11 is included in the imaging field 65 of the alignment camera 60. In this aspect, when it is determined in the confirmation process that the alignment mark Ma11 is not included in the imaging visual field 65, the first imaging process, the prediction process, and the second imaging process are performed as in the above embodiment. Then, a pattern forming process is executed. On the other hand, when it is determined in the confirmation step that the alignment mark Ma11 is included in the imaging field 65, the first imaging step, the prediction step, and the second imaging step are omitted, and the alignment mark Ma11 obtained in the confirmation step. The pattern forming step is executed based on the actual measurement value of the second position information including the actual measurement value. As described above, the first imaging process, the prediction process, and the second imaging process can be appropriately omitted according to the result of the confirmation process, so that the throughput of the apparatus can be improved.

  In the above embodiment, the stage 10 moves the substrate W in the XY plane so that the relative movement between the substrate W and the optical head unit 50 and the relative movement between the substrate W and the alignment camera 60 are described. However, it is not limited to this. For example, a moving mechanism that moves the optical head unit 50 in the XY plane and a moving mechanism that moves the alignment camera 60 in the XY plane may be provided.

  The pattern forming apparatus and the pattern forming method according to the embodiment and the modifications thereof have been described above, but these are examples of the preferred embodiment of the present invention, and do not limit the scope of implementation of the present invention. Within the scope of the invention, the present invention can be freely combined with each embodiment, modified with any component in each embodiment, or omitted with any component in each embodiment.

DESCRIPTION OF SYMBOLS 10 Stage 20 Stage moving mechanism 30 Position parameter measurement mechanism 50 Optical head part 60 Alignment camera 65 Imaging visual field 70 Control part 100 Drawing apparatus 110 Substrate storage cassette 120 Transfer robot Ma, Ma0, Ma1, Ma11-Ma14 Alignment mark W Substrate

Claims (17)

A pattern forming apparatus for forming a pattern on the main surface based on positional information of a plurality of alignment marks formed on the main surface on one side of the substrate,
A holding unit for holding the substrate;
An imaging unit that images at least a part of the plurality of alignment marks formed on the main surface of the substrate held by the holding unit;
From the first position information of the first group of alignment marks imaged by the imaging unit among the plurality of alignment marks, the second group of alignments located closer to the periphery of the main surface than the first group of alignment marks. A calculation unit that calculates and predicts the second position information of the mark;
A pattern forming portion for forming a pattern on the main surface;
With
After the imaging unit acquires the actual measurement value of the second position information with reference to the predicted value of the second position information predicted by the calculation unit,
The pattern forming apparatus, wherein the pattern forming unit forms a pattern on the main surface according to an actual measurement value of the second position information. The pattern forming apparatus according to claim 1,
The pattern forming apparatus, wherein the first group of alignment marks includes a center alignment mark located at the center of the main surface and an alignment mark adjacent to the center alignment mark. It is a pattern formation apparatus of Claim 1 or Claim 2, Comprising:
The pattern forming apparatus, wherein the substrate is formed by reversing and transferring a laminate of functional layers formed on a transfer substrate onto the main surface on the one side of the base layer of the product substrate. The pattern forming apparatus according to any one of claims 1 to 3,
The pattern forming apparatus, wherein the number of alignment marks in the second group is greater than the number of alignment marks in the first group. The pattern forming apparatus according to any one of claims 1 to 4,
The formation of the pattern is the formation of an exposure pattern on the main surface of the substrate,
The exposure pattern is formed by relatively moving the optical head and the main surface of the substrate while irradiating the main surface with light modulated spatially based on drawing data from the optical head. A pattern forming apparatus. The pattern forming apparatus according to claim 5,
The pattern forming apparatus, wherein the drawing data is generated by performing data processing on design data according to an actual measurement value of the second position information. The pattern forming apparatus according to any one of claims 1 to 4,
The formation of the pattern is the formation of an exposure pattern on the main surface of the substrate,
The pattern forming apparatus is characterized in that the exposure pattern is formed by mask exposure that selectively irradiates the main surface with planar light through a mask. It is a pattern formation apparatus of Claim 7, Comprising:
Pattern formation characterized in that one of a plurality of masks prepared in advance based on a common reference pattern is selected according to an actual measurement value of the second position information, and the formation of the pattern is executed. apparatus. A pattern forming method for forming a pattern on the main surface based on positional information of a plurality of alignment marks formed on the main surface on one side of the substrate,
Holding step for holding the substrate;
A first imaging step of capturing an image of a first group of alignment marks formed on the main surface of the substrate to be held by an imaging unit and obtaining an actual measurement value of the first position information;
Based on the actual measurement value of the first position information acquired in the first imaging step, the second position of the second group of alignment marks located on the peripheral side of the main surface with respect to the first group of alignment marks. A prediction process for generating a predicted value of the information;
Referring to the predicted value of the second position information, the second group of alignment marks formed on the main surface of the substrate to be held is imaged, and an actual value of the second position information is acquired. Two imaging steps;
A pattern forming step of forming a pattern on the main surface based on the measured value of the second position information;
A pattern forming method comprising: It is a pattern formation method of Claim 9, Comprising:
As a step performed prior to the first imaging step, the imaging unit and the substrate are relatively moved to a predicted imaging position preset for at least one of the second group of alignment marks, and the second group A confirmation step for confirming whether or not the at least one of the alignment marks is included in an imaging field of view of the imaging unit;
With
If it is determined in the confirmation step that the at least one of the second group of alignment marks is not included in the imaging field of view, the first imaging step, the prediction step, and the second imaging step are performed. Then, execute the pattern forming step,
If it is determined in the confirmation step that the second group of alignment marks is included in the imaging field, the first imaging step, the prediction step, and the second imaging step are omitted, and the confirmation step A pattern forming method, wherein the pattern forming step is executed based on an actual measurement value of the second position information including the at least one actual measurement value of the second group of alignment marks obtained therein. The pattern forming method according to claim 9 or 10, wherein:
The pattern forming method, wherein the first group of alignment marks includes a center alignment mark located at the center of the main surface and an alignment mark adjacent to the center alignment mark. A pattern forming method according to any one of claims 9 to 11,
The pattern forming method, wherein the substrate is formed by reversing and transferring a laminate of functional layers formed on a transfer substrate onto the main surface on the one side of a base layer of a product substrate. A pattern forming method according to any one of claims 9 to 12,
The number of said 2nd group alignment marks is larger than the number of said 1st group alignment marks, The pattern formation method characterized by the above-mentioned. A pattern forming method according to any one of claims 9 to 13,
The formation of the pattern is the formation of an exposure pattern on the main surface of the substrate,
The pattern forming step is performed by relatively moving the optical head and the main surface of the substrate while irradiating the main surface with light modulated spatially based on drawing data from the optical head. A characteristic pattern forming method. It is a pattern formation method of Claim 14, Comprising:
The pattern forming method, wherein the drawing data is generated by performing data processing on design data according to an actual measurement value of the second position information. A pattern forming method according to any one of claims 9 to 13,
The formation of the pattern is the formation of an exposure pattern on the main surface of the substrate,
The pattern forming method is characterized in that the pattern forming step is performed by mask exposure in which the main surface is selectively irradiated with planar light through a mask. It is a pattern formation method of Claim 16, Comprising:
Pattern formation characterized in that one of a plurality of masks prepared in advance based on a common reference pattern is selected according to an actual measurement value of the second position information, and the pattern formation step is executed. Method.

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