JP2022129897A - Drawing device, drawing method, and program - Google Patents

Abstract

To prevent an abnormality in autofocus operation from affecting drawing in a drawing area.SOLUTION: An autofocus mechanism 5 of a drawing device measures a separation distance between a reference position in a drawing head 31 and a substrate in a direction perpendicular to the substrate, and performs an autofocus operation that matches the focal position of drawing light emitted from the drawing head 31 to the substrate on the basis of the separation distance. An autofocus control unit 43 causes the autofocus mechanism 5 to perform the autofocus operation during a relative movement of a stage in a scanning direction, and disables the autofocus operation if the measurement position of the separation distance overlaps a given area of a non-drawing area on the substrate. As a result, even if an abnormality occurs during the autofocus operation, its effect on drawing in the drawing area can be prevented.SELECTED DRAWING: Figure 6

Description

The present invention relates to a drawing apparatus, drawing method and program.

2. Description of the Related Art Conventionally, a drawing apparatus that draws a pattern on a photosensitive material on a substrate without using a mask has been put into practical use. 2. Description of the Related Art A drawing apparatus employs an autofocus mechanism that adjusts the focal position of drawing light emitted from a drawing head to the surface of a substrate. In a typical autofocus mechanism, the surface position of the substrate is measured by irradiating the substrate surface with laser light and receiving the reflected light of the laser light (see, for example, Patent Documents 1 and 2). By constantly using the autofocus mechanism while the pattern is being drawn, it is possible to appropriately draw the pattern even when the thickness of the substrate varies or the substrate is warped. Become.

Japanese Unexamined Patent Application Publication No. 2020-181132 Japanese Unexamined Patent Application Publication No. 2016-31502

By the way, when a pattern is drawn on a board having holes (long holes, drill holes, etc.) such as a printed wiring board, reflected light of the laser light from the board surface cannot be obtained from the hole. In this case, the autofocus mechanism may erroneously detect the surface position of the substrate and place the focal position of the drawing light at a position greatly deviated from the substrate surface. That is, an abnormality occurs in the autofocus operation. Normally, the hole area is a non-rendering area where no drawing is performed. However, if an abnormality occurs in the autofocus operation in the hole, it is impossible to immediately adjust the focal position of the drawing light to the substrate surface in the drawing area adjacent to the hole, making it impossible to draw the pattern appropriately. The above problems can occur not only in substrates with holes formed thereon but also in substrates with relatively large unevenness (eg, high pads).

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to prevent or suppress the occurrence of an abnormality in the autofocus operation that affects drawing in the drawing area.

According to a first aspect of the present invention, there is provided a drawing apparatus for drawing a pattern, comprising: a stage for holding a substrate; a drawing head for emitting modulated drawing light toward the substrate on the stage; a moving mechanism that moves continuously in a scanning direction along the substrate relative to the drawing head; an autofocus mechanism for performing an autofocus operation for adjusting the focal position of the drawing light emitted from the drawing head on the substrate based on the separation distance, and parallel to the relative movement of the stage in the scanning direction; and causing the autofocus mechanism to perform the autofocus operation, and turning off the autofocus operation when the measurement position of the separation distance overlaps a predetermined area included in the non-drawing area on the substrate. and an autofocus control unit.

The invention according to claim 2 is the drawing apparatus according to claim 1, wherein the predetermined area includes at least a hole area.

The invention according to claim 3 is the drawing apparatus according to claim 1 or 2, wherein design data indicating a pattern image to be drawn on the substrate is prepared, and relative to the scanning direction of the stage. setting a line on the pattern image corresponding to a path on the substrate through which the separation distance measurement position passes by movement, and generating switching data indicating switching between a pattern area and a non-pattern area on the line; A data generation unit is further provided, and the autofocus control unit switches the autofocus operation between an ON state and an OFF state according to the switching data.

The invention according to claim 4 is the drawing apparatus according to any one of claims 1 to 3, wherein the autofocus mechanism emits the detection light toward the substrate and emits the detection light from the substrate. a distance measuring unit that measures the separation distance by receiving reflected light of the detection light, and the autofocus control unit is operated while at least a part of the spot of the detection light on the substrate overlaps the predetermined area; , the autofocus operation is turned off.

The invention according to claim 5 is the lithography apparatus according to claim 4, wherein the width direction perpendicular to the scanning direction and along the substrate and/or the scanning direction is designed to detect the detected light. While at least a part of the area obtained by expanding the spot area by the set value overlaps with the predetermined area, the autofocus control section turns off the autofocus operation.

According to a sixth aspect of the present invention, there is provided a drawing method for drawing a pattern using a drawing device, wherein the drawing device includes a stage holding a substrate and a drawing light modulated toward the substrate on the stage. a drawing head for emitting light; a moving mechanism for continuously moving the stage relative to the drawing head in a scanning direction along the substrate; and a reference position in the drawing head in a direction perpendicular to the substrate. an autofocus mechanism that measures the separation distance between the drawing head and the substrate, and performs an autofocus operation for adjusting the focus position of the drawing light emitted from the drawing head based on the separation distance to the substrate, The drawing method comprises: a) drawing a pattern on the substrate by the drawing head while relatively moving the stage in the scanning direction by the moving mechanism; causing a focus mechanism to perform the autofocus operation, and turning off the autofocus operation when the measurement position of the separation distance overlaps a predetermined area included in the non-drawing area on the substrate. .

According to a seventh aspect of the present invention, there is provided a program for drawing a pattern using a drawing device, wherein the drawing device includes a stage holding a substrate and emitting modulated drawing light toward the substrate on the stage. a moving mechanism for continuously moving the stage relative to the drawing head in a scanning direction along the substrate; and a reference position in the drawing head in a direction perpendicular to the substrate. an autofocus mechanism that measures a separation distance from the substrate and performs an autofocus operation to adjust the focal position of the drawing light emitted from the drawing head based on the separation distance to the substrate; Execution of a program by a computer causes the computer to perform a) a step of drawing a pattern on the substrate with the drawing head while relatively moving the stage in the scanning direction by the moving mechanism, and b) the step a). In parallel, the autofocus mechanism is caused to perform the autofocus operation, and the autofocus operation is turned off when the measurement position of the separation distance overlaps a predetermined area included in the non-drawing area on the substrate. to be executed.

According to the present invention, it is possible to prevent or suppress the occurrence of an abnormality in the autofocus operation that affects drawing in the drawing area.

1 is a perspective view showing the configuration of a drawing device; FIG. 3 is a perspective view showing a drawing head; FIG. FIG. 4 is a diagram for explaining pattern drawing by a plurality of drawing heads; FIG. 4 is a side view showing part of the drawing head; It is a figure which shows the structure of a computer. 3 is a block diagram showing the functional configuration of a control unit; FIG. FIG. 4 is a diagram showing the flow of operations for drawing a pattern by a drawing device; It is a figure which shows the upper surface of a board|substrate. It is a figure which shows the upper surface of a board|substrate and an SR pattern image. It is a figure which shows the upper surface of a board|substrate and an SR pattern image. It is a figure which shows a part of SR pattern image. It is a figure which shows a part of SR pattern image. It is a figure which shows a part of SR pattern image. It is a figure which shows a part of SR pattern image. It is a figure which shows a part of SR pattern image.

FIG. 1 is a perspective view showing the configuration of a drawing device 1 according to one embodiment of the present invention. In FIG. 1, three directions orthogonal to each other are indicated by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1, the X and Y directions are horizontal and the Z direction is vertical.

The drawing apparatus 1 is a direct drawing apparatus that draws a pattern by irradiating a photosensitive material on a substrate 9 with spatially modulated light and scanning the irradiation area of the light on the substrate 9 . The substrate 9 is, for example, a substantially rectangular plate member in a plan view. The substrate 9 is, for example, a flexible printed wiring board. In the present embodiment, a circuit pattern is already formed on the main surface (upper surface 91 described later) of the substrate 9, and a solder resist film, which is a photosensitive material, is provided so as to cover substantially the entire main surface. ing. The drawing device 1 draws a pattern of a solder resist layer on the solder resist film of the substrate 9 . In a post-process, processing such as development is performed, and a substrate 9 having a solder resist layer formed on the circuit pattern is obtained. The photosensitive material film on the substrate 9 is not limited to a solder resist film, and may be, for example, a resist film used in forming a circuit pattern.

The drawing apparatus 1 includes a stage 21, a stage moving mechanism 22, a drawing section 3, a control section 4, and an autofocus mechanism 5 (see FIG. 4 described later). The control unit 4 controls the stage moving mechanism 22, the drawing unit 3, the autofocus mechanism 5, and the like. The stage 21 is a substantially flat plate-like holding portion that holds the horizontal substrate 9 from below below the drawing portion 3 (that is, on the (−Z) side). The (+Z) side principal surface of the substrate 9 placed on the stage 21 (hereinafter referred to as “upper surface 91”) is substantially perpendicular to the Z direction and substantially parallel to the X and Y directions. be. The stage 21 may be one that grips the outer edge of the substrate 9 or the like.

The stage moving mechanism 22 includes a support plate 23 , a base plate 24 , a base 25 , a rotating mechanism 26 , a main scanning mechanism 27 and a sub-scanning mechanism 28 . The support plate 23 supports the stage 21 from below. The rotating mechanism 26 has, for example, a linear motor and a rotating shaft. The linear motor has a mover attached to the end of the stage 21 and a stator provided on the upper surface of the support plate 23 . The rotation axis is substantially parallel to the Z direction and provided at the center of the lower surface of the stage 21 . By driving the linear motor, the stage 21 rotates within a predetermined angular range around the rotation axis.

The sub-scanning mechanism 28 has, for example, a linear motor and a pair of guides. The linear motor has a mover attached to the lower surface of the support plate 23 and a stator provided on the upper surface of the base plate 24 . A pair of guide portions extend in the X direction and are provided between the support plate 23 and the base plate 24 . By driving the linear motor, the support plate 23 moves in the X direction along the guide portion on the base plate 24 .

The main scanning mechanism 27 has, for example, a linear motor and a pair of guides. The linear motor has a mover attached to the lower surface of the base plate 24 and a stator provided on the upper surface of the base 25 . A pair of guide portions extend in the Y direction and are provided between the base plate 24 and the base 25 . By driving the linear motor, the base plate 24 moves in the Y direction along the guide portion on the base 25 . In other words, main scanning mechanism 27 moves substrate 9 and stage 21 in the Y direction along upper surface 91 of substrate 9 . In the following description, the Y direction is called the "scanning direction", and the X direction perpendicular to the scanning direction and along the upper surface 91 of the substrate 9 is called the "width direction". The driving source of the rotating mechanism 26, the sub-scanning mechanism 28 and the main scanning mechanism 27 may be other than a linear motor, for example, a ball screw with a motor attached thereto may be used. The stage moving mechanism 22 may be provided with a stage lifting mechanism that lifts and lowers the stage 21 in the Z direction. Also, the rotation mechanism 26 may be omitted.

The drawing unit 3 includes a plurality of drawing heads 31 arranged in the width direction. Although the number of drawing heads 31 is five in this embodiment, it may be four or less, or six or more. A plurality of drawing heads 31 are supported above the stage 21 by a head support section 19 provided across the stage 21 .

FIG. 2 is a perspective view showing one drawing head 31. FIG. The multiple drawing heads 31 have substantially the same structure. A light source unit 36 and an illumination optical system 37 are connected to each drawing head 31 . The light source unit 36 has a light source such as an LED, and emits light of a predetermined wavelength. The light source section 36 may have other types of light sources. The illumination optical system 37 has, for example, a rod integrator and lenses. Light emitted from the light source unit 36 is guided to the drawing head 31 via the illumination optical system 37 .

The drawing head 31 includes an optical modulator 32 and a projection optical system 33 . The light modulation unit 32 is, for example, a DMD (digital mirror device) in which a plurality of micromirrors are arranged two-dimensionally. Light from the illumination optical system 37 is applied to a plurality of light modulating elements (here, a plurality of micromirrors) in the light modulating section 32 . In each light modulation element, the attitude of reflecting light toward the projection optical system 33 (ON state) and the attitude of reflecting light in a direction different from that of the projection optical system 33 (OFF state) are controlled by the control unit 4. can be switched by Of the light irradiated to the light modulating section 32 , the light reflected by the light modulating element in the ON state enters the projection optical system 33 . That is, the light spatially modulated from the light modulating section 32 is emitted toward the projection optical system 33 . The projection optical system 33 magnifies the light to a predetermined magnification, and irradiates the upper surface 91 of the substrate 9 with the light. An image of the light modulation section 32 is projected (formed) on the upper surface 91 . In the following description, the modulated light emitted from each drawing head 31 toward the substrate 9 is referred to as "drawing light". Note that the light modulation section 32 may be a modulator or the like in which a plurality of light modulation elements are arranged one-dimensionally.

FIG. 3 is a diagram for explaining pattern drawing on the substrate 9 by a plurality of drawing heads 31. As shown in FIG. In drawing a pattern, first, the main scanning mechanism 27 shown in FIG. 1 causes the stage 21 to move (main scan) continuously from the (+Y) side to the (−Y) direction. As a result, as shown in FIG. 3, the irradiation area A1 of the drawing light emitted from each drawing head 31 (indicated by a rectangle with parallel oblique lines) illuminates the upper surface 91 of the substrate 9 from the (-Y) side ( +Y) direction, and a pattern is drawn in a band-like region R1 extending in the scanning direction on the upper surface 91 . At this time, in the width direction (X direction), gaps are provided between the irradiation areas A1 of the plurality of drawing heads 31, and gaps are also provided between the plurality of band-shaped areas R1. When the irradiation area A1 reaches the end of the substrate 9 on the (+Y) side, the sub-scanning mechanism 28 moves (sub-scans) the stage 21 in the (-X) direction by a predetermined distance. Typically, the moving distance of the stage 21 in the width direction is the same as or slightly smaller than the width of the band-shaped region R1 (the same applies hereinafter).

Subsequently, the stage 21 continuously moves in the (+Y) direction from the (-Y) side, and the irradiation area A1 of the drawing light moves on the upper surface 91 from the (+Y) side in the (-Y) direction. As a result, a pattern is drawn in a strip-shaped region R2 that is in contact with each strip-shaped region R1 on the (+X) side and extends in the scanning direction. The strip-shaped region R2 may partially overlap with the strip-shaped region R1. When the irradiation area A1 reaches the (−Y) side end of the substrate 9, the sub-scanning mechanism 28 moves the stage 21 in the (−X) direction by a predetermined distance.

After that, the stage 21 continuously moves from the (+Y) side to the (-Y) direction, and the drawing light irradiation area A1 moves from the (-Y) side to the (+Y) direction on the upper surface 91 . As a result, a pattern is drawn in a strip-shaped region R3 that is in contact with each strip-shaped region R2 on the (+X) side and extends in the scanning direction. Each strip-shaped region R3 except for the strip-shaped region R3 closest to the (+X) side is also in contact with the strip-shaped region R1 located on the (+X) side. The strip-shaped region R3 may partially overlap with the strip-shaped regions R1 and R2. By the above operation, the pattern is drawn on the entire drawing target area on the upper surface 91 . In the present embodiment, the stage 21 moves continuously relative to the drawing head 31 in the scanning direction (hereinafter simply referred to as "main scanning of the stage 21") three times, thereby forming a pattern on the upper surface 91. Drawing is completed.

In the drawing apparatus 1, the pattern may be drawn on the entire drawing target area by performing the main scanning of the stage 21 twice, or four times or more. Alternatively, pattern drawing may be completed by one main scan of the stage 21 . In this case, the sub-scanning mechanism 28 may be omitted. Furthermore, the movement of the irradiation area A1 in the scanning direction may be realized by moving the drawing head 31 . The same applies to the movement of the irradiation area A1 in the width direction. Of course, both the stage 21 and the drawing head 31 may move.

FIG. 4 is a side view showing part of the drawing head 31. As shown in FIG. Each drawing head 31 is provided with an autofocus mechanism 5 . The autofocus mechanism 5 includes a distance measuring section 51, an elevating mechanism 52, and a computing section (not shown). The distance measurement unit 51 includes an irradiation unit 511 and a light reception unit 512 . In the example of FIG. 4, the irradiation unit 511 and the light receiving unit 512 are attached to the lens barrel of the projection optical system 33 via the attachment 513 . The irradiation unit 511 has a light source for detection light, which is laser light, and emits the detection light toward the upper surface 91 of the substrate 9 . The detection light is directed to the top surface 91 along an axis tilted with respect to the Z direction perpendicular to the substrate 9 to form a spot of the detection light on the top surface 91 .

The light receiving unit 512 has, for example, a line sensor (position sensor) extending approximately in the Z direction. In the light receiving section 512, the reflected light of the detection light from the substrate 9 is received by the line sensor. On the line sensor, when the light receiving position of the reflected light shifts from the predetermined position, there is a difference between the reference position of the drawing head 31 and the upper surface 91 of the substrate 9 (more precisely, the surface of the solder resist film) in the Z direction. is detected. That is, the separation distance D1 is substantially measured. A measured value of the separation distance D1 (which may be a value indicating the amount of deviation from the predetermined position) is output to the calculation unit. The reference position of the drawing head 31 is a position fixed with respect to the irradiation unit 511 and the light receiving unit 512 , such as the lower end of the projection optical system 33 . In the following description, the position M1 on the upper surface 91 irradiated with the detection light, that is, the center position M1 of the spot of the detection light is referred to as "measurement position M1". The measurement position M1 is positioned near the optical axis J1 of the projection optical system 33 .

The lifting mechanism 52 has a moving body attached to the lens barrel of the projection optical system 33 and a fixed body attached to the head support section 19 . The lift mechanism 52 moves the projection optical system 33 in the Z direction together with the movable body under the control of the calculation unit based on the measured value of the separation distance D1, and the light receiving position of the reflected light of the detection light on the line sensor of the light receiving unit 512 changes. put back into place. As a result, an image of the light modulating portion 32 is formed on the upper surface 91 of the substrate 9 (more precisely, the surface of the solder resist film). That is, the drawing light is focused on the upper surface 91 of the substrate 9 . An example of the lifting mechanism 52 is a combination of a mechanism that drives a ball screw with a motor and a mechanism that guides the moving body in the Z direction. A linear motor or the like may be used as a drive source for the lifting mechanism 52 .

As described above, in the autofocus mechanism 5 provided in each drawing head 31, the separation distance D1 is measured, and an autofocus operation is performed to adjust the focal position of the drawing light to the substrate 9 based on the separation distance D1. The distance measurement unit 51 may measure the separation distance D1 by a method that does not use detection light (for example, using ultrasonic waves). In the example of FIG. 4, a part of the drawing head 31 is moved in the Z direction by the elevating mechanism 52, but the entire drawing head 31 may be moved in the Z direction. Also, when only one drawing head 31 is provided, the stage 21 may move in the Z direction.

FIG. 5 is a diagram showing the configuration of the computer 11. As shown in FIG. The computer 11 has a configuration of a general computer system including a CPU 111 that performs various arithmetic processing, a ROM 112 that stores basic programs, and a RAM 113 that stores various information. The computer 11 includes a fixed disk 114 for storing information, a display section 115 for displaying various information, a keyboard 116a and a mouse 116b for receiving input from an operator as an input section 116, an optical disk, a magnetic disk, and a magneto-optical disk. A reading/writing device 118 for reading information from or writing information to a computer-readable recording medium 12 such as a computer-readable recording medium 12; .

In the computer 11 , the program 120 is previously read from the recording medium 12 via the read/write device 118 and stored in the fixed disk 114 . Programs 120 may be stored on fixed disk 114 over a network. The computer 11 functions as the control unit 4 in the drawing apparatus 1 of FIG. do. The control unit 4 may be constructed by a dedicated electric circuit, or partially using a dedicated electric circuit. The control unit 4 may be implemented by cooperation of a plurality of computers, and in this case, the plurality of computers may be provided at positions separated from each other.

FIG. 6 is a block diagram showing the functional configuration of the control section 4 realized by the computer 11. As shown in FIG. In FIG. 6, configurations other than the control unit 4 are also shown. The control unit 4 includes a storage unit 41 , a switching data generation unit 42 , an autofocus control unit 43 and a drawing control unit 44 . The storage unit 41 is mainly realized by the RAM 113 and the fixed disk 114, and stores various information such as design data. The design data indicates pattern images to be drawn on the substrate 9 . The switching data generation unit 42 , the autofocus control unit 43 and the drawing control unit 44 are mainly realized by the CPU 111 . The switching data generator 42 generates switching data, which will be described later. The autofocus control unit 43 switches the autofocus operation of the autofocus mechanism 5 between an ON state and an OFF state according to the switching data. The drawing control unit 44 executes drawing on the substrate 9 by controlling the stage moving mechanism 22, the drawing head 31, and the like.

FIG. 7 is a diagram showing the flow of operations for drawing a pattern by the drawing apparatus 1. As shown in FIG. When the drawing apparatus 1 draws a pattern, first, design data indicating a pattern image to be drawn on the substrate 9 is stored in the storage unit 41 and prepared (step S11). The design data is, for example, CAD (Computer-Aided Design) data and vector data. The design data may be raster data.

FIG. 8 is a diagram showing an upper surface 91 of the substrate 9 (substrate 9 to be processed) placed on the stage 21. As shown in FIG. As described above, the upper surface 91 of the substrate 9 is already formed with circuit patterns. In FIG. 8, a region 911 in which a circuit pattern is formed is indicated by a rectangle. The pattern image indicated by the design data indicates the pattern of the solder resist layer to be formed on the substrate 9 . The pattern image is hereinafter referred to as "SR pattern image". In practice, the substrate 9 is provided with a solder-resist film covering substantially the entire upper surface 91, but the illustration of the solder-resist film is omitted in FIG.

9A and 9B are diagrams showing part of the upper surface 91 of the substrate 9 and part of the SR pattern image 8. FIG. The left side of FIG. 9A shows the circuit pattern included in the area 912 surrounded by thin lines on the upper surface 91 of FIG. 8, and the right side of FIG. 9A shows the area of the SR pattern image 8 corresponding to the area 912 . The left side of FIG. 9B shows the circuit pattern included in the area 913 surrounded by thin lines on the upper surface 91 of FIG. 8, and the right side of FIG. 9B shows the area of the SR pattern image 8 corresponding to the area 913 . As described above, the SR pattern image 8 indicates the pattern to be drawn on the upper surface 91 of the substrate 9. FIG. Therefore, "the region of the SR pattern image 8 corresponding to one region of the upper surface 91" means the region of the SR pattern image 8 that overlaps with the one region when the SR pattern image 8 is superimposed on the upper surface 91. .

On the left side of FIGS. 9A and 9B, hole regions 921 (some of the hole regions are denoted by reference numerals 921a to 921d) and pad regions 922 (some of the pad regions are denoted by reference numerals 922a and 922b) on the upper surface 91. ) are marked with diagonal lines. On the right side of FIGS. 9A and 9B, the non-pattern area 81 in the SR pattern image 8 is hatched. A non-pattern region 81 indicates a non-drawing region of (the solder resist film of) the upper surface 91, that is, a region where no solder resist layer is formed. As shown in FIGS. 9A and 9B, the areas of the SR pattern image 8 corresponding to the hole areas 921 and pad areas 922 on the top surface 91 are non-pattern areas 81 . On the other hand, most of the region of the SR pattern image 8 that does not correspond to the hole region 921 and the pad region 922 on the upper surface 91 (that is, the region other than the region corresponding to the hole region 921 and the pad region 922 in the SR pattern image 8) , the pattern area 82 . A pattern region 82 indicates a drawing region (a region irradiated with light from the drawing head 31) on the upper surface 91, that is, a region where a solder resist layer is formed. Typically, the area of the SR pattern image 8 corresponding to the wiring area or the like on the upper surface 91 is included in the pattern area 82 .

In the present embodiment, as described above, the stage 21 moves continuously relative to the drawing head 31 in the scanning direction (that is, the main scanning of the stage 21) three times, thereby forming a pattern on the upper surface 91. drawing is completed. In the main scanning of the stage 21, the switching data generator 42 obtains the path on the substrate 9 through which the measurement position M1 (see FIG. 4) of the distance measuring section 51 of each drawing head 31 passes. In FIG. 8, the path K1 through which the measurement position M1 passes in the first main scanning of the stage 21, the path K2 through which the measurement position M1 passes in the second main scanning of the stage 21, and the third main scanning of the stage 21 A path K3 through which the measurement position M1 passes is indicated by a dashed line. In the present embodiment, routes K1 and K3 run from the (-Y) side to the (+Y) side, and route K2 runs from the (+Y) side to the (-Y) side. Note that the switching data generation unit 42 may be shared by a plurality of drawing apparatuses 1, and in this case, a route is obtained according to the model of the target drawing apparatus 1. FIG.

Subsequently, in the SR pattern image 8, the switching data generator 42 sets lines corresponding to the routes K1 to K3. As shown in FIG. 8 and on the left side of FIGS. 9A and 9B, regions 912 and 913 of the upper surface 91 overlap the path K2, and in the SR pattern image 8 shown on the right side of FIGS. A line L2 (indicated by a dashed line) corresponding to is set. On the right side of FIGS. 9A and 9B, line L2 extends in the longitudinal direction on substrate 9 corresponding to the scanning direction. In the SR pattern image 8, each position along the line L2 indicates a position on the substrate 9 in the scanning direction.

The switching data generator 42 generates switching data indicating switching between the pattern area 82 and the non-pattern area 81 in each line in the SR pattern image 8 (step S12). Specifically, in the example on the right side of FIG. 9A, when viewing the line L2 from the upper side to the lower side of the drawing, the pattern area 82 is switched to the non-pattern area 81 at the point P11, and the non-pattern area 81 is switched at the point P12. The area 81 is switched to the pattern area 82 . Also, the pattern area 82 is switched to the non-pattern area 81 at the point P13, and the non-pattern area 81 is switched to the pattern area 82 at the point P14. Further, the pattern area 82 is switched to the non-pattern area 81 at the point P15, and the non-pattern area 81 is switched to the pattern area 82 at the point P16. In the example on the right side of FIG. 9A, switching data is generated that indicates the positions of the points P11 to P16 and whether to switch to the non-pattern area 81 or the pattern area 82 at the points P11 to P16. In FIG. 9A, points P11 and P12 correspond to the (+Y) side and (−Y) side ends of the pad area 922a (the ends on the path K2; the same applies hereinafter). Points P13 and P14 correspond to the (+Y) and (-Y) side ends of the hole region 921a, and points P15 and P16 correspond to the (+Y) and (-Y) side ends of the hole region 921b. corresponds to

Similarly, in the example on the right side of FIG. 9B, when viewing the line L2 from the upper side to the lower side of the drawing, the pattern area 82 is switched to the non-pattern area 81 at the point P21, and the non-pattern area is switched at the point P22. 81 is switched to the pattern area 82 . Further, the pattern area 82 is switched to the non-pattern area 81 at the point P23, and the non-pattern area 81 is switched to the pattern area 82 at the point P24. Further, the pattern area 82 is switched to the non-pattern area 81 at the point P25, and the non-pattern area 81 is switched to the pattern area 82 at the point P26. In the example on the right side of FIG. 9B, switching data is generated that indicates the positions of the points P21 to P26 and whether to switch to the non-pattern area 81 or the pattern area 82 at the points P21 to P26. In FIG. 9B, points P21 and P22 correspond to the (+Y) side and (−Y) side ends of the pad area 922b (the ends on the path K2). Points P23 and P24 correspond to the (+Y) and (-Y) side ends of the hole region 921c, and points P25 and P26 correspond to the (+Y) and (-Y) side ends of the hole region 921d. corresponds to

As described above, each position along the line L2 indicates a position on the substrate 9 in the scanning direction. Further, as will be described later, in the control of the autofocus mechanism 5 by the autofocus control unit 43, the position where the pattern area 82 is switched to the non-pattern area 81 indicates the position at which the autofocus operation is turned off. The position where the non-pattern area 81 is switched to the pattern area 82 indicates the position where the autofocus operation is turned on. Therefore, the switching data generated in the example on the right side of FIG. 9A includes the positions in the scanning direction on the substrate 9 corresponding to the points P11 to P16, and the autofocus operation to be turned OFF at the points P11 to P16, or , is data for instructing to turn ON. The switching data generated in the example on the right side of FIG. It becomes the data that instructs to set the state.

When the switching data is generated, under the control of the drawing control unit 44, the stage 21 moves continuously in the scanning direction relative to the drawing head 31, and in parallel with this, a plurality of drawing operations are performed. Modulated drawing light is emitted from the head 31 toward the substrate 9 on the stage 21 . Thereby, a pattern is drawn on the substrate 9 (step S13). Typically, the control unit 4 generates drawing data for control from design data representing the SR pattern image 8, and controls each drawing head 31 according to the drawing data. As described with reference to FIG. 3, in the present embodiment, continuous movement of the stage 21 in the scanning direction (main scanning of the stage 21) is performed three times. Note that the drawing data may be corrected according to deformation of the substrate 9 on the stage 21 .

Further, the autofocus control unit 43 causes the autofocus mechanism 5 to perform an autofocus operation in parallel with the main scanning of the stage 21 in pattern drawing (step S14). At this time, the ON state and the OFF state of the autofocus operation are switched according to the switching data. Therefore, in the example on the left side of FIG. 9A where the measurement position M1 of the distance measurement unit 51 moves along the path K2 on the substrate 9 from the (+Y) side toward the (−Y) side, the measurement position M1 is located on the pad area 922a. When the (+Y) side end is reached, the autofocus operation is turned off, and when the measurement position M1 reaches the (−Y) side end of the pad region 922a, the autofocus operation is turned on. It is said that Also, when the measurement position M1 reaches the (+Y) side end of the hole region 921a, the autofocus operation is turned off, and the measurement position M1 reaches the (−Y) side end of the hole region 921a. When it arrives, the autofocus operation is turned on. Furthermore, when the measurement position M1 reaches the (+Y) side end of the hole region 921b, the autofocus operation is turned off, and the measurement position M1 reaches the (−Y) side end of the hole region 921b. When it arrives, the autofocus operation is turned on.

As described above, in the example on the left side of FIG. 9A, while the autofocus operation is being performed, the measurement position M1 of the separation distance D1 is located in the pad area 922a and the hole areas 921a and 921b included in the non-drawing area on the substrate 9. When overlapping, the autofocus operation is turned off. The example on the left side of FIG. 9B is similar, and the measurement position M1 of the separation distance D1 overlaps the pad area 922b and the hole areas 921c and 921d included in the non-drawing area on the substrate 9 while performing the autofocus operation. At this time, the autofocus operation is turned off. When the pattern is drawn on the entire drawing target area on the upper surface 91, the drawing of the pattern in the drawing device 1 is completed.

Here, in parallel with the main scanning of the stage 21, a drawing apparatus of a comparative example in which the autofocus operation is always turned on will be described. In the drawing apparatus of the comparative example, when the measurement position M1 of the separation distance D1 overlaps the hole area on the substrate 9, the light receiving section 512 cannot properly receive the reflected light of the detection light. In this case, it is determined that the separation distance D1 exceeds the detectable range (the separation distance D1 is erroneously detected), and the autofocus mechanism 5 deviates the focal position of the drawing light from the upper surface 91 of the substrate 9 by a large amount. may be placed in position. That is, an abnormality occurs in the autofocus operation. As a result, in the drawing area immediately after passing through the hole area, which is a non-drawing area, the focus position of the drawing light cannot be immediately aligned with the upper surface 91, and the pattern cannot be drawn appropriately. Similarly, when the measurement position M1 of the separation distance D1 overlaps the pad area on the substrate 9, an abnormality may occur in the autofocus operation.

In the drawing apparatus of the comparative example, when it is determined that the separation distance D1 exceeds the detectable range, the amount of shift of the focal position of the drawing light is limited to prevent the occurrence of the abnormality in the autofocus operation. However, in this case, the autofocus operation cannot follow the large warp of the substrate 9. FIG. As described above, in the drawing apparatus of the comparative example, it is difficult to make the autofocus operation follow a large warp of the substrate 9 and to prevent the occurrence of abnormalities in the autofocus operation in the hole area and the like. .

On the other hand, the autofocus control unit 43 of the drawing apparatus 1 causes the autofocus mechanism 5 to perform an autofocus operation in parallel with the relative movement of the stage 21 in the scanning direction, and the measurement position M1 of the separation distance D1 is set to , the auto-focus operation is turned off when it overlaps a predetermined area included in the non-drawing area on the substrate 9 . As a result, it is possible to prevent or suppress the occurrence of an abnormality in the autofocus operation in the predetermined area, which affects drawing in the drawing area. In the drawing apparatus 1, the autofocus operation can also follow a large warp of the substrate 9. FIG.

Since erroneous detection of the separation distance D1 is likely to occur when the measurement position M1 overlaps the hole area, the drawing apparatus 1 may turn off the autofocus operation only when the measurement position M1 overlaps the hole area. . In other words, it is preferable that the predetermined area in which the autofocus operation is turned off includes at least the hole area. As a result, it is possible to prevent or suppress the occurrence of an abnormality in the autofocus operation in the hole area, which affects drawing in the drawing area.

By the way, in order to turn off the autofocus operation only when the measurement position M1 overlaps the hole area, image data or the like indicating only the hole area on the substrate 9 is required. However, circuit pattern design data includes a variety of information, and it is not easy to prepare data indicating only hole regions. Although it is possible for the operator to input the position and range of the hole area on the substrate 9 in the image obtained by picking up the substrate 9, complicated work is required.

On the other hand, in the drawing apparatus 1, design data representing a pattern image (SR pattern image 8) of the solder resist layer is prepared. In the switching data generator 42, a line on the SR pattern image 8 corresponding to the path on the substrate 9 through which the measurement position M1 passes due to the relative movement of the stage 21 in the scanning direction is set, and the pattern area 82 on the line is set. Switching data indicating switching with the non-pattern area 81 is generated. The autofocus control unit 43 switches the autofocus operation between the ON state and the OFF state according to the switching data. In the SR pattern image 8, all the hole areas are included in the non-pattern area 81. Therefore, by generating the switching data from the SR pattern image 8 (design data), the autofocus operation can be performed when the measurement position M1 overlaps the hole area. can be turned off more reliably and easily.

As described above, the application of the drawing apparatus 1 is not limited to drawing a pattern of a solder resist layer. That is, the design data may indicate patterns (circuit patterns, etc.) other than the SR pattern image 8 . In this case also, by generating switching data from the design data, the autofocus operation is turned ON when the measurement position M1 overlaps the drawing area, and the autofocus operation is turned OFF when the measurement position M1 overlaps the non-drawing area. can be accurately controlled. In the drawing apparatus 1, a method that does not use design data, such as an operator inputting an area on the substrate 9 in which the autofocus operation is to be turned off, is not excluded.

Next, a method for generating preferable switching data will be described. 10A and 10B are diagrams showing part of the SR pattern image. A non-patterned area 81 shown in FIGS. 10A and 10B corresponds to one hole area on the substrate 9 (similar to FIGS. 11A to 11C described below). In this processing example, in generating the switching data, when detecting the point of switching from the pattern area 82 to the non-pattern area 81 and the point of switching from the non-pattern area 81 to the pattern area 82 along the line L2, the detection light The size (diameter) of the spot is considered.

Specifically, the size of the spot of the detection light on the substrate 9 (designed size) is set in advance in the switching data generator 42 . When the area M20 (hereinafter referred to as "spot area M20") corresponding to the spot on the SR pattern image is moved from the upper side of the figure toward the lower side along the line L2, the outer edge of the spot area M20 A position P31 at the center of the spot area M20 when the lower side touches the non-pattern area 81 is specified as a position at which the autofocus operation is switched from the ON state to the OFF state. Further, when the entire spot region M20 does not overlap the non-pattern region 81 (the upper side of the outer edge of the spot region M20 touches the non-pattern region 81), the position P32 of the center of the spot region M20 is in the OFF state of the autofocus operation. is specified as a position to be turned ON. Thus, switching data is generated.

10A, in which the line L2 passes through approximately the center of the non-pattern region 81, and the example in FIG. In the example, the position P31 at which the autofocus operation is turned off is shifted lower than in the example of FIG. 10A. In actual pattern drawing, the position at which the autofocus operation is turned off shifts to the (-Y) side (the timing at which the autofocus operation is turned off is delayed). Similarly, in the example of FIG. 10B, the position P32 at which the autofocus operation is turned on is shifted upward from the example of FIG. 10A. +Y) side (timing to turn on is quicker). In this processing example, it can be considered that the switching data is generated by determining the switching between the pattern area 82 and the non-pattern area 81 on the line L2 using the spot area M20.

As described above, the drawing apparatus 1 generates switching data in consideration of the spot size of the detected light. This allows the autofocus control section 43 to turn off the autofocus operation while at least part of the spot of the detection light on the substrate 9 overlaps the hole region. As a result, it is possible to more reliably prevent or suppress the occurrence of an abnormality in the autofocus operation in the hole area, which affects the drawing in the drawing area. The same applies to the case of preventing or suppressing the occurrence of an abnormality in the autofocus operation in other predetermined areas included in the non-drawing area, such as the pad area. Depending on the design of the drawing apparatus 1, the autofocus operation may be turned off only while substantially the entire spot of the detection light overlaps the predetermined area.

Next, a method for generating other preferable switching data will be described. 11A to 11C are diagrams showing part of the SR pattern image. In this processing example, in generating the switching data, when detecting the point of switching from the pattern area 82 to the non-pattern area 81 and the point of switching from the non-pattern area 81 to the pattern area 82 along the line L2, the detection light and the mounting error (mounting gap) of the distance measuring part 51 in the width direction are considered.

Specifically, in the switching data generator 42, the size of the spot of the detection light on the substrate 9 and the set values regarding the mounting error are set in advance. The set value is, for example, the tolerance of the mounting position of the distance measuring section 51 . As a result, as shown in FIG. 11A, on the SR pattern image, when the position of the designed spot area corresponding to the spot is shifted to both sides in the horizontal direction within the range corresponding to the set value, these spot areas An area M30 (hereinafter referred to as an "enhanced spot area M30") is set to include the entirety of. In FIGS. 11A to 11C, the designed spot area M20 is indicated by a chain double-dashed line. Further, the spot area M20 arranged at the end of the extended spot area M30 (hereinafter referred to as the "spot area M20 with maximum deviation") is indicated by a solid line, and the inside thereof is hatched.

Subsequently, when the extended spot region M30 is moved from the upper side to the lower side of the figure along the line L2, as shown in FIG. A position P41 at the center of the designed spot area M20 (spot area M20 indicated by a two-dot chain line) is specified as a position at which the autofocus operation is switched from the ON state to the OFF state. Further, as shown in FIG. 11C, the designed spot area M20 when the entire extended spot area M30 does not overlap the non-pattern area 81 (the upper side of the outer edge of the extended spot area M30 is in contact with the non-pattern area 81). A central position P42 is specified as a position for turning the autofocus operation from the OFF state to the ON state. Thus, switching data is generated.

Here, in FIG. 11B, the designed spot area M20 does not overlap the non-pattern area 81, but due to mounting error of the distance measuring unit 51, the actual spot of the detected light may be different from the spot area M20 with the maximum deviation. may overlap the non-patterned area 81 at position P41 in the vertical direction. Therefore, the position P41 on the line L2 is positioned to turn off the autofocus operation. In this case, the position at which the autofocus operation is turned off is shifted to the (+Y) side from the position determined using only the designed spot area M20 (the timing at which the autofocus operation is turned off is earlier).

In FIG. 11C, the design spot area M20 does not overlap the non-pattern area 81 at a position above the position P42 in the vertical direction of the drawing. Thus, there is a possibility that the spot area corresponding to the spot of the actual detected light overlapped the non-pattern area 81 at that position. Therefore, the position P42 on the line L2 where the entire extended spot region M30 does not overlap the non-pattern region 81 is the position where the autofocus operation is turned on. In this case, the position at which the autofocus operation is turned ON is shifted to the (-Y) side of the position determined using only the designed spot area M20 (timing at which the ON state is turned on is delayed). In this processing example, it can be considered that switching data is generated by determining switching between the pattern area 82 and the non-pattern area 81 on the line L2 using the extended spot area M30.

In the example of FIGS. 11A to 11C, since the mounting error of the distance measuring part 51 in the width direction is taken into consideration, the extended spot region M30 extending in the horizontal direction corresponding to the width direction is set, but the vertical spot region M30 corresponding to the scanning direction is set. An extended spot area extending also in the direction may be set, and mounting errors of the distance measurement unit 51 in the width direction and the scanning direction may be taken into consideration. Alternatively, an extended spot area extending only in the vertical direction may be set, and mounting errors of the distance measuring unit 51 only in the scanning direction may be considered.

As described above, the drawing apparatus 1 generates the switching data in consideration of the spot size of the detected light and the mounting error of the distance measuring section 51 . As a result, while at least a part of the area obtained by expanding the design detection light spot area by the set value in the width direction and/or the scanning direction overlaps the hole area, the autofocus control unit 43 performs autofocus. It is possible to turn off the operation. As a result, it is possible to more reliably prevent or suppress the occurrence of an abnormality in the autofocus operation in the hole area, which affects drawing in the drawing area. The same applies to the case of preventing or suppressing the occurrence of an abnormality in the autofocus operation in other predetermined areas included in the non-drawing area, such as the pad area.

Various modifications are possible in the drawing apparatus 1 and the drawing method described above.

As described above, the drawing apparatus 1 may be used for drawing patterns other than the pattern of the solder resist layer. The substrate 9 on which the pattern is drawn may be a substrate on which no hole region is provided. Further, the substrate 9 may be a semiconductor substrate, a glass substrate, or the like, other than the printed wiring board.

The configurations in the above embodiment and each modified example may be combined as appropriate as long as they do not contradict each other.

1 drawing device 5 autofocus mechanism 8 pattern image 9 substrate 11 computer 21 stage 22 stage movement mechanism 31 drawing head 42 switching data generation section 43 autofocus control section 51 distance measurement section 81 non-pattern area 82 pattern area 120 program 921, 921a~ 921d Hole area D1 Spacing distance K1~K3 Path L2 Line M1 Measurement position S11~S14 Step

Claims (7)

A drawing device for drawing a pattern,
a stage holding the substrate;
a drawing head that emits modulated drawing light toward the substrate on the stage;
a moving mechanism for continuously moving the stage relative to the drawing head in a scanning direction along the substrate;
measuring a distance between a reference position of the drawing head and the substrate in a direction perpendicular to the substrate, and adjusting a focal position of the drawing light emitted from the drawing head to the substrate based on the separation an autofocus mechanism that performs a matching autofocus operation;
In parallel with the relative movement of the stage in the scanning direction, the autofocus mechanism is caused to perform the autofocus operation, and the measurement position of the separation distance is set to a predetermined area included in the non-drawing area on the substrate. an autofocus control unit that turns off the autofocus operation when overlapping;
A rendering device comprising: The drawing apparatus according to claim 1,
A drawing apparatus, wherein the predetermined area includes at least a hole area. The drawing apparatus according to claim 1 or 2,
Design data indicating a pattern image to be drawn on the substrate is prepared, and the pattern image corresponding to the path on the substrate through which the measurement position of the separation distance passes due to the relative movement of the stage in the scanning direction. and a switching data generation unit that generates switching data indicating switching between the pattern area and the non-pattern area on the line,
The drawing apparatus, wherein the autofocus control unit switches the autofocus operation between an ON state and an OFF state according to the switching data. The drawing apparatus according to any one of claims 1 to 3,
The autofocus mechanism includes a distance measurement unit that emits detection light toward the substrate and receives reflected light of the detection light from the substrate to measure the separation distance,
The drawing apparatus, wherein the autofocus control unit turns off the autofocus operation while at least part of the spot of the detection light on the substrate overlaps the predetermined area. The drawing device according to claim 4,
At least a part of an area obtained by expanding the designed detection light spot area by a set value in a width direction along the substrate perpendicular to the scanning direction and/or in the scanning direction overlaps the predetermined area. The drawing apparatus, wherein the autofocus control unit turns off the autofocus operation while the image is being drawn. A drawing method for drawing a pattern using a drawing device,
The drawing device
a stage holding the substrate;
a drawing head that emits modulated drawing light toward the substrate on the stage;
a moving mechanism for continuously moving the stage relative to the drawing head in a scanning direction along the substrate;
measuring a distance between a reference position of the drawing head and the substrate in a direction perpendicular to the substrate, and adjusting a focal position of the drawing light emitted from the drawing head to the substrate based on the separation an autofocus mechanism that performs a matching autofocus operation;
with
The drawing method is
a) drawing a pattern on the substrate with the drawing head while relatively moving the stage in the scanning direction by the moving mechanism;
b) In parallel with the step a), causing the autofocus mechanism to perform the autofocus operation, and when the measurement position of the separation distance overlaps a predetermined area included in the non-drawing area on the substrate, a step of turning off the autofocus operation;
A drawing method comprising: A program for drawing a pattern using a drawing device,
The drawing device
a stage holding the substrate;
a drawing head that emits modulated drawing light toward the substrate on the stage;
a moving mechanism for continuously moving the stage relative to the drawing head in a scanning direction along the substrate;
measuring a distance between a reference position of the drawing head and the substrate in a direction perpendicular to the substrate, and adjusting a focal position of the drawing light emitted from the drawing head to the substrate based on the separation an autofocus mechanism that performs a matching autofocus operation;
with
Computer execution of the program causes the computer to:
a) drawing a pattern on the substrate with the drawing head while relatively moving the stage in the scanning direction by the moving mechanism;
b) In parallel with the step a), causing the autofocus mechanism to perform the autofocus operation, and when the measurement position of the separation distance overlaps a predetermined area included in the non-drawing area on the substrate, a step of turning off the autofocus operation;
A program characterized by causing the execution of

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