TW201506387A - Map comparison apparatus, comparison method, and comparison program - Google Patents

Abstract

To perform an accurate and rapid inspection of the state in which a chip has been picked up even when a dicing sheet is partially distorted, by performing a calculation that enables the position of a chip to be rapidly specified based only on the characteristics thereof, the calculation being performed in consideration of the chip displacement direction and degree due to distension of the dicing sheet. The present invention has: a displacement calculation unit (105c) for calculating, on the basis of synthesized image data for generating the image of a dicing sheet (D) after a chip (S) is picked up, the direction and degree of displacement of the chip (S) due to distension of the dicing sheet (D), and map image data for generating an image of a chip (S) that is to be picked up, or a chip that is not to be picked up; a correction unit (105d) for correcting the synthesized image data on the basis of the direction and degree of displacement; and an assessment unit (105f) for assessing consistency or non-consistency by comparing the synthesized image data and the map image data.

Description

Alignment comparison device, comparison method and comparison program

The present invention relates to a technique for verifying the results of picking up chips from a wafer attached to a dicing sheet.

In the manufacturing process of semiconductors, after the wafer attaching engineering and cutting engineering, a mounting process and a die bonding process are carried out. The wafer attaching process is a process in which a wafer before being sliced is attached to a wafer having an adhesive surface attached thereto, and then attached to the ring.

The cutting process is a process of cutting a wafer attached to a dicing sheet and dividing it into a sliced semiconductor element (hereinafter referred to as a wafer). The die-bonding project is a process in which a sliced wafer is sequentially picked up and adhered to a lead frame or a substrate. The solid crystal engineering is a process in which a lead wire and a wafer are joined by a gold wire or the like.

For each wafer included in the wafer before the die bonding process, the probe for checking the electrical characteristics is inspected in advance by the stylus, and the result is that each wafer is a good product, a defective product, and a position thereof. Phase The information is kept at the control device. The information obtained by such probe inspection is called map data.

Further, for each of the wafers before picking up, the visual inspection may be performed based on an image taken by an imaging unit such as a camera. In the case of visual inspection in addition to the probe inspection, the result of the probe inspection and the result of the visual inspection are sometimes referred to as a pair of map data.

Further, the pick-up in the die-bonding process is performed on the wafer which is judged to be good in the result of the probe inspection (including the result of the visual inspection as the case may be). This is to prevent the wafer of defective products from flowing out into a product.

[Previous Technical Literature] [Patent Document]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-61069

Since the wafer included in the wafer is extremely fine, there is a possibility of error in picking up. At this time, the most serious problem is that the position information of the wafer on the image of the substrate and the reference image as a reference are misaligned due to the picking mistake, that is, the alignment is misaligned, and the subsequent wafer is misaligned. It is picked up in the situation, causing the defective product to flow out as a good product.

Therefore, it is necessary to check whether or not a defective product has been picked up, and when a defective product flows out, measures such as stopping the device are taken. As the witness The method is to perform a process of copying an image obtained by photographing a wafer remaining on a dicing sheet after picking up, and a good product or a defective product position based on the image of the inspection result. The images were copied and the films were superimposed and visually compared.

However, such a verification method has the following problems. First, the premise is that the wafers which are sliced after the dicing are closely adhered to each other without a gap. Therefore, after the dicing, in order to facilitate the pick-up before picking up, the following matters are performed, that is, the dicing sheet is stretched (expanded), and the gap is opened between the diced wafers.

Therefore, when the above-mentioned visual comparison is performed, the picked-up dicing sheet is removed from the ring, and the expanded state is released, and then the remaining wafer on the dicing sheet is taken, and the image is used for and based on the map data. Like doing comparisons.

However, partial deformation occurs between the expanded dicing sheet and the dicing sheet after the expanded state is released. Therefore, a partial misalignment may occur between the position of the wafer on the image obtained by taking the picked-up dicing sheet and the position of the wafer on the image based on the enant image data. Therefore, according to the above comparison method, it may not be able to check correctly. In addition, the comparison is performed visually, so there may be a missed look.

Further, the visual comparison is performed by removing the dicing sheet from the ring and releasing the expanded state, and therefore, it is performed off-line from the line of the apparatus. Therefore, the comparison method takes labor and time and becomes a factor of reduced productivity.

In addition, Patent Document 1 proposes a technique for causing a cause The detection of the dicing groove caused by the stretching of the dicing sheet and the discriminating of the presence or absence of the wafer are performed, and the gap between the wafers is considered and then compared. However, although the contrast between the wafer and the dicing sheet is relatively clear, the fine dicing groove formed on the dicing sheet is not easily determined by the image.

Moreover, the amount of stretch of the expanded dicing sheet and its direction may vary depending on the position of the dicing sheet and the presence or absence of the wafer. Therefore, the position of the dicing groove and the wafer may be partially deformed and cannot be properly inspected.

The present invention has been made to solve the above problems of the prior art, and an object of the present invention is to provide a mapping comparison device, a comparison method, and a comparison program, which can quickly find out the position of the wafer only by the characteristics of the wafer, and The calculation is performed in consideration of the displacement direction and the displacement amount of the wafer caused by the stretching of the dicing sheet, whereby the wafer pick-up state inspection can be performed at high speed and correctly even in the case where there is a partial deformation on the dicing sheet.

In order to achieve the above object, the present invention is characterized in that: the displacement alignment unit has a displacement calculation unit for calculating the change of the wafer caused by the extension of the dicing sheet based on the composite image data and the alignment map data. a bit direction and a displacement amount, wherein the composite image data is used to generate a slice image obtained by stretching a dicing sheet attached to the diced wafer to pick up a wafer into which the wafer is divided into slices. The alignment map data is an arrangement indicating wafers that should be picked up or not picked up; and the correction unit corrects the composite image data and the pair according to the displacement direction and the displacement amount calculated by the displacement calculation unit At least one of the map arrangement data; and In the above-mentioned composite image data and the above-mentioned map arrangement data, the data of the corrected one is compared with the data of the other party that has not been corrected, thereby determining whether the data is consistent or inconsistent.

The displacement calculation unit may divide the wafer on the dicing sheet into a plurality of regions, and calculate a displacement direction and a displacement amount for each of the plurality of regions.

The synthetic image data may be image data based on a dicing sheet that is stretched by a force in a direction from the inner side of the circle surrounding the wafer to the outer side.

The feature extraction unit may be configured to extract feature points of each wafer according to the composite image data and the alignment map data, so as to perform calculation by the displacement calculation unit.

It is also possible to have a composite image generating unit that generates the composite image data based on image data captured corresponding to the pickup of each wafer.

It is also possible to have an inspection unit that performs visual inspection of each wafer based on image data taken in response to pickup of each wafer.

The mapping arrangement may also be performed, and the mapping data may be formed according to the mapping data, and the mapping material includes a good product about the wafer in the wafer and its position, and the wafer in the wafer. Information on at least one of the defective products and their location.

The correction unit may correct the composite image data.

The display data generating unit may be configured to generate display data for causing the determination result by the determination unit to be displayed on the display unit.

The display data may be image data for distinguishing between the composite image data and the alignment map data for the wafer on the dicing sheet.

The display data may also be image data that distinguishes the wafers that should not be picked up on the dicing sheet but are picked up.

The aforementioned feature points can also be set as the corners of the respective wafers.

The displacement direction and the displacement amount of any one of the plurality of regions may be calculated according to the displacement direction and the displacement amount of the other regions.

The analysis unit may determine the tendency of the pickup result by analyzing the determination result by the determination unit.

Further, a method of executing the above-described functions by a computer or an electronic circuit and a program for executing the computer are also an aspect of the present invention.

According to the present invention, it is possible to provide a mapping comparison device, an alignment method, and a comparison program, which can quickly ascertain the position of the wafer by the characteristics of the wafer, and consider the displacement direction and displacement of the wafer caused by the extension of the cutting piece. After the amount is calculated, the wafer pick-up state inspection can be performed at high speed and correctly even in the case where there is a partial deformation on the dicing sheet.

D‧‧‧ cutting piece

R‧‧‧ Ring

S‧‧‧ wafer

W‧‧‧ wafer

1‧‧‧ picking device

2‧‧‧Circular mobile agencies

3‧‧‧Extension agency

4‧‧‧Separation agency

5‧‧‧ picking institutions

6‧‧‧ camera organization

21‧‧‧ ring bracket

30‧‧‧ Input Department

31‧‧‧Stretching Department

40‧‧‧Output Department

41‧‧ ‧ sales

51‧‧‧Adsorption nozzle

61‧‧‧Photography Department

62‧‧‧稜鏡

100‧‧‧Diagram comparison device

101‧‧‧Institutional Control Department

102‧‧‧Inspection Department

103‧‧‧Composite image generation department

104‧‧‧Dynamic map arrangement

105‧‧‧Comparative Department

105a‧‧‧Adjustment Department

105b‧‧‧Feature Extraction Department

105c‧‧‧Transpositional Calculation Department

105d‧‧‧Amendment

105e‧‧‧Comparative Processing Department

105f‧‧‧Decision Department

106‧‧‧Display data generation department

107‧‧‧Memory Department

Fig. 1 is a schematic side view showing a configuration of a pick-up device used in an embodiment of the present invention.

Fig. 2 is a schematic plan view showing a ring and a dicing sheet attached thereto according to an embodiment of the present invention.

Fig. 3 is a schematic block diagram showing an arrangement of an enantiomeric comparison device in an embodiment of the present invention.

[Fig. 4] Fig. 3 is a schematic block diagram of the alignment portion.

[Fig. 5] Schematic diagram of a schematic diagram of the enantiomeric comparison function.

Fig. 6 is a schematic explanatory diagram of an enant image which is based on an enantiomeric arrangement data prepared from enantiomeric data.

Fig. 7 is a flow chart showing the processing procedure of the enantiomeric comparison device in the embodiment of the present invention.

FIG. 8 is a schematic flow chart of the comparison processing procedure in FIG. 7. FIG.

[Fig. 9] A schematic explanatory view of a captured image and a composite image after picking up.

FIG. 10 is a schematic explanatory diagram of feature point extraction processing. FIG.

[Fig. 11] A schematic explanatory view of a direction detecting process of a corner.

[Fig. 12] Schematic diagram of a feature point to be detected.

FIG. 13 is a schematic explanatory diagram showing a result of calculation processing of a vector of a displacement direction and a displacement amount. FIG.

FIG. 14 is a schematic explanatory diagram of a difference image of a composite image and an enant image.

[Fig. 15] Schematic diagram showing the display of the comparison result.

Embodiments of the present invention will be described with reference to the drawings. In addition, various materials used in the present embodiment and images generated based thereon are as As described below.

(1) "Phase mapping data" is information relating to at least one of the following: a good product of the wafer and its position, and defective products of the wafer and their positions. In addition, it also includes non-product wafer information such as a reference chip or a wafer on the ring. The mapping data includes reference mapping data and device management mapping data.

(2) "Reference map data" is the data on the results of probe inspections performed in advance in the previous project, that is, the distribution of good products and defective products (positions in the wafer).

(3) "Device management mapping data" is a combination of data on the visual inspection results, that is, the distribution of good products or defective products, or the data on whether or not each wafer has been picked up. Made of information.

(4) "Alignment map data" is information indicating the arrangement of wafers. The "optical map image" is an image of a wafer that should not be picked up on the dicing sheet. The "optical map arrangement data" is generated inside the map comparison device based on the device management map data, and is used for comparison processing with the composite image data.

(5) "Synthetic image data" is a material used to display a composite image on a screen. The "composite image" is the image of the wafer on the dicing sheet after picking. The "composite image data" is generated by synthesizing image data captured by the image capturing unit, and is used for comparison processing with the map arrangement data.

[1. Pickup device]

First, an example of the pickup device 1 used in the present embodiment will be described with reference to Figs. 1 and 2 . Further, the present embodiment can be applied to various mechanisms, and the mechanism shown below is only an example thereof, so that the description will be simplified.

As shown in FIG. 1, the pickup device 1 includes a ring moving mechanism 2, an expansion mechanism 3, a separating mechanism 4, a pickup mechanism 5, and an image pickup mechanism 6. The ring moving mechanism 2 is a device that moves the wafer ring R assembled to the ring holder 21 in a predetermined direction.

As shown in FIG. 2, the wafer ring R is a plate-like member that attaches and holds the cut piece D so that a circular hole formed inside is covered. The wafer W is attached to the dicing sheet D. Further, the wafer W is cut into a plurality of wafers S by dicing.

The ring moving mechanism 2 is provided so that the ring holder 21 can be positioned in the X-axis direction and the Y-axis direction along a guide rail (not shown). Further, the ring moving mechanism 2 is provided to position the ring holder 21 in the θ direction by transmitting a belt, a pulley, or the like of a driving force of a motor (not shown).

The expansion mechanism 3 is a mechanism for pulling apart the gap between the sliced wafers S by stretching the dicing sheet D. This expansion mechanism 3 has a cylindrical tensile portion 31. The stretched portion 31 is configured to stretch the cut piece D as follows. First, one end of the cylinder of the stretching portion 31 is pressed from the back of the wafer ring R to the opposite side of the bonding surface of the wafer W on the dicing sheet D. Next, the dicing sheet D is sandwiched between the outer circumference of the stretched portion 31 and the inner circumference of the circular hole of the wafer ring R, and moved to protrude toward the front side of the wafer ring R. As a result, the dicing sheet D will be outward from the inside of the circle surrounding the wafer W. The force in the direction of the side stretches. The stretching portion 31 is provided to be advanced and retracted by a cylinder or the like in order to achieve such an action.

The separating mechanism 4 is a device that individually separates the wafer S from the dicing sheet D. The separating mechanism 4 has a pin 41 that faces the wafer S with the dicing sheet D interposed therebetween. The pin 41 is provided so as to be movable in the direction of the wafer S which is pushed to the opposite position by the tip end in accordance with the movement of the ring moving mechanism 2.

The pickup mechanism 5 receives the wafer S separated from the other wafers S by the separation mechanism 4 and delivers them to other engineering mechanisms. The pickup mechanism 5 has an adsorption nozzle 5] for performing vacuum chucking of the wafer S. The adsorption nozzles 51 are arranged to be movable to deliver the adsorbed wafers S to other projects.

The imaging mechanism 6 is a mechanism that takes an image of the dicing sheet D and the wafer S. The imaging unit 6 has an imaging unit 61 and a camera 62. The imaging unit 61 is a camera that outputs the captured material. The 稜鏡62 is an optical member that changes the direction of the optical axis so that the wafer S picked up by the adsorption nozzle 51 can be imaged by the imaging unit 61.

[2. Composition of the mapping device]

Next, the configuration of the enantopic comparison device 100 connected to the pick-up device 1 will be described with reference to the block diagrams of FIGS. 3 and 4, and the explanatory diagrams of FIGS. 5 and 6, as an embodiment of the present invention. The map comparison device 100 includes a mechanism control unit 101, an inspection unit 102, a composite image generation unit 103, an alignment map creation unit 104, a comparison unit 105, and display data generation. The unit 106 and the memory unit 107. The mechanism control unit 101 is a processing unit that controls the operation of each mechanism in the pick-up device 1.

The inspection unit 102 is a processing unit that determines that the wafer S is a good or defective product based on the image data obtained by the imaging unit 61 capturing the wafer after the dicing on the dicing sheet D. The imaging and image capture by the imaging unit 61 is performed by horizontal round-trip scanning.

The horizontal round-trip scanning here is a method of scanning a circle in the ring R surrounding the wafer W from one end of the circle to the opposite end thereof on a plurality of parallel scanning lines. Capture images when going back and forth.

In the present embodiment, the inspection unit 102 may perform visual inspection in response to picking up of each wafer S by the pickup mechanism 5. That is to say, the appearance inspection of each wafer S is performed immediately before the pickup of each wafer S. The imaging unit 61 has a constant imaging range in one imaging, and a plurality of wafers S on the front, rear, left, and right sides of the wafer S in the imaging center are also included in the imaging range once. Therefore, if the wafer S to be picked up is photographed, the wafer S to be picked up next will also enter the imaging range. Therefore, the wafer S to be picked up is visually inspected based on the image taken, whereby the wafer S before the pickup can be visually inspected for scanning, and the processing speed can be increased. . Further, in the present embodiment, the imaging unit 61 is fixed, and the ring moving mechanism 2 moves the dicing sheet D to perform scanning. However, it is also possible to scan by moving the imaging unit 61 side. Further, before the start of the pickup, the inspection unit 102 may perform the visual inspection of the entire wafer W in advance.

The visual inspection result by the inspection unit 102 is combined with the probe inspection result, that is, the reference map data relating to the distribution of the good product and the defective product, and becomes the device management map data, which is memorized by the memory unit 107. The probe inspection is performed on the wafer W in other projects, and the result is reference to the enant image data, which is previously memorized by the memory unit 107.

The mechanism control unit 101 determines whether or not the respective wafers S are picked up by the pickup mechanism 5 in accordance with the device management map data. This judgment can be performed only based on the result of the probe inspection of the previous project, and in the case of the visual inspection, the result of the probe inspection can be matched, and the result of the visual inspection can be performed.

Therefore, the following wafer S will be excluded from the object to be picked up.

(a) A wafer S that is judged to be defective only by probe inspection

(b) A wafer S that is judged to be defective only by visual inspection

(c) Wafer S determined to be defective according to probe inspection and visual inspection

(d) is a wafer which is a non-product wafer S which is a position on the wafer and which is distinguished by a reference mark or the like.

However, the visual inspection may be performed in advance in the inspection unit 102 or another project for the wafer W before the start of the pickup, and the result data and the data of the probe inspection result are combined and stored in advance by the storage unit 107. Map data.

The combined image generating unit 103 is a processing unit that generates a combined image data by capturing and capturing a part of the image data obtained by picking up the cut piece D from the wafer S. Attached to the film before the filming The wafer of the dicing sheet D is cut. Next, the expansion mechanism 3 stretches the dicing sheet D, whereby the gap between the sliced wafers S is pulled apart, and the pickup mechanism 5 is easily picked up. This stretching is performed by the wafer ring R and the stretching portion 31, and is performed by the force of stretching from the inner side of the circle surrounded by the wafer W to the outer side of the wafer W.

The imaging unit 61 performs imaging for generating composite image data, and performs horizontal round-trip scanning as in the above-described visual inspection. The generation processing of the composite image data in this case will be described in further detail. First, as described above, the imaging unit 61 has a constant imaging range in one imaging, and a plurality of wafers S on the front and rear of the wafer S to be imaged are also included in the imaging range once. The moving range (step) of the scanning is matched with the position of each of the expanded wafers S, so that overlapping portions are sequentially generated in each of the captured images. In view of this, for the overlapped portion, the newly captured image is sequentially overwritten while the image is gradually synthesized, whereby the entire image can be generated.

The synthetic image generating unit 103 synthesizes the image data sequentially captured by the horizontal round-trip scanning as described above, thereby generating composite image data. The imaging and composite image data are generated by re-performing horizontal reciprocal scanning after the wafer S is picked up from the dicing sheet D. However, as will be described later, the generation of the captured image and the composite image data may be performed in accordance with the pickup of each wafer by the pickup mechanism 5. That is to say, after "pickup", after the entire wafer W is picked up, the wafer S is also picked up.

Whether it is filming after the wafer W is picked up, or The image data to be picked up and picked up by each wafer, and finally formed synthetic image data, can be image data of the wafer S capable of recognizing the dicing sheet D remaining on the ring R. For example, as shown in FIG. 5(a), in the composite image displayed based on the composite image data, the remaining wafer S is indicated by black.

The pickup by the pick-up mechanism 5 may miss the good wafer S, and may also mishandle the defective wafer S. Further, in the case where the position of the wafer S caused by the expansion of the dicing sheet D and the position of the pickup mechanism 5 which scans the wafer S according to the device management map data are misaligned, the above-described pickup may occur. Mistakes. Therefore, there may be cases where the remaining wafer S is good, and there may be cases where the defective wafer S does not remain.

The map arrangement creating unit 104 is a processing unit that creates a map arrangement data based on the device management map data. In the case where the wafer S of the good product and the defective product after the probe inspection is further subjected to visual inspection, the wafer S of the good product and the defective product including the result is used. Information to indicate whether to pick up the data of each chip. For example, in the device management mapping data, the good and bad products of the probe inspection are recorded, and when the visual inspection is performed, the information that can distinguish the good product, the defective product, the outer ring, the ring, and the reference mark is recorded. After picking up, information about whether or not each wafer S has been picked up is recorded. Fig. 6(a) shows an example of device management map data, but is not limited to this one.

The mapping data is the data of the wafer S that should not remain for picking up objects. For example, the mapping map is arranged to form part 104, The above device management mapping map data is changed to make it easy to visually distinguish the wafer S and the like. In this way, for example, the device management mapping data is transformed into the mapping data as shown in FIG. 5(b) and FIG. 6(b), so that the device can display the ring and the defective product. The wafer S is black and the outer image is gray. In addition, the device of Fig. 6(a) manages the mapping data, and does not originally display the color or color tone to be displayed. Therefore, the color, hue, and the like in Fig. 6(b) do not necessarily coincide with the numerical values shown in Fig. 6(a).

The matching unit 105 is a processing unit that compares the combined image data and the alignment map data and determines the inconsistency. As shown in FIG. 4, the comparison unit 105 includes an adjustment unit 105a, a feature extraction unit 105b, a displacement calculation unit 105c, a correction unit 105d, a comparison processing unit 105e, and a determination unit 105f.

The adjustment unit 105a is a processing unit that converts the composite image data and the alignment map data so as to be suitable for comparison.

The feature extracting unit 105b is a processing unit that extracts feature points of the sliced wafer S from the converted composite image data and the enant image arrangement data. The feature point is, for example, a point indicating the angle of the wafer S. The angle is the ridge of the corner of the outer edge of the wafer S which is the square of the wafer S. Since the angle of each wafer S has 4 points, the feature point has 4 points in one wafer S. The extraction of the feature points can be performed, for example, by the method described later, but is not limited to this method, and any method that can be used now or in the future can be applied.

The displacement calculation unit 105c is a processing unit that calculates the displacement direction and the displacement amount of each wafer S based on the feature points extracted from the alignment map data and the composite image data. Each wafer S in the alignment map data The feature point, and the feature point of the corresponding wafer S in the composite image data, may be displaced (dislocated) due to the difference in the stretching and center position of the dicing sheet D.

This stretching is performed by the force from the inner side of the circle surrounding the wafer W toward the outside as described above. Therefore, the displacement direction and the displacement amount of the feature points differ depending on which position on the dicing sheet D. For example, for the displacement direction, depending on the position of the cutting piece D, there may be a reverse direction or a near reverse direction. Therefore, it is meaningless to determine the direction of displacement of the feature points common to all of the wafers W.

On the other hand, in a part of the dicing sheet D, the displacement direction and the displacement amount of each feature point are common. In view of this, the calculation performed by the displacement calculating unit 105c is to divide the dicing sheet D into a plurality of areas and perform each of the plurality of areas. For example, the displacement calculation unit 105c obtains a vector indicating the displacement direction and the displacement amount for each of the plurality of regions. This can be obtained, for example, by applying the method described later. However, the present invention is not limited to this method, and any method that can be utilized now or in the future can be applied.

The correction unit 105d is a processing unit that corrects the position of the feature point in the composite image data based on the displacement direction and the displacement amount obtained by the displacement calculation unit 105c. This correction is performed by displacing the feature points included in each region to recover the amount of displacement and the amount of displacement of each of the above regions.

Further, the correcting unit 105d can correct the map arrangement data without correcting the composite image data. However, according to the device management mapping data The alignment map data created correctly reflects the spacing of the wafers S. On the other hand, the composite image data contains a misalignment of the position of the wafer S due to the expansion of the dicing sheet D. Therefore, in the present embodiment, the composite image data is corrected based on the map arrangement data.

The comparison processing unit 105e is a processing unit that compares the composite image data with the alignment map data and creates a difference image. The processing for creating the difference image is performed for each of the plurality of divided regions in order to avoid the influence of the displacement. The determination unit 105f is a processing unit that determines the inconsistency of the feature points in the composite image and the map image based on the difference image created by the comparison processing unit 105e.

The memory unit 107 is a processing unit that stores various kinds of information necessary for the present embodiment. Various information, including the above-mentioned inspection results and mapping data based on the same (refer to the mapping data, device management mapping data), capturing image data, synthetic image data, mapping data, determination results, Display data, etc. Further, various settings such as commands, encoder information, threshold values, determination criteria, processing timings, calculation formulas, and image adjustment values are also included in the information stored in the storage unit 107.

Further, the input unit 30 and the output unit 40 are connected to the enantopic comparison device 100. The input unit 30 is a processing unit that inputs information necessary for processing of each unit, selection of input processing, or instruction. The input unit 30 includes an input device that can be used now or in the future, such as an operation panel, a touch panel, a switch, a keyboard, and a mouse.

The output unit 40 is a processing unit that outputs information such as an interface for operation, various materials, images, and processing results. Output unit 40, package Any input device that can be utilized now or in the future, including display devices, printers, and the like.

All or part of the above-described enantiomeric comparison device 100 can be realized by controlling a computer with a predetermined program. The program in this case realizes the above-described various parts processing by physically utilizing the computer hardware including the CPU. The method, the program, and the recording medium on which the program is executed are also an aspect of the present invention.

How to set the range to be handled by the hardware and the range to be processed by the software including the program is not limited to the specific aspect. For example, any of the above-described units may be configured as a circuit for realizing the processing of each.

Further, the output unit 107 can utilize any memory medium available now or in the future. The register used in the calculation can also be regarded as a memory unit. The mode of memory is not limited to the way of maintaining memory for a long time, but also includes temporary memory for processing, and is deleted or updated in a short time. Further, all or a part of each processing unit, the storage unit 107, the input unit 30, and the output unit 40 constituting the mapping comparison apparatus 100 can also be configured by a computer connected via a network.

Further, various images generated and created by the above-described respective processing are image data displayed before the output unit 40 in the case of processing inside the computer. Therefore, in the case where it is not displayed in the output unit 40, it is treated and processed as image data inside the computer.

However, the image data in the above process, either The output unit 40 can be appropriately output (displayed, printed, etc.) so that the operator can visually recognize it. For example, the captured image, the composite image, the enant image, the comparison result image, the feature point extracted image, the image of the displacement calculation result, and the difference image caused by the comparison may also be used. The image after the noise is removed is displayed and printed for confirmation of the processing result.

[3. Function]

An example of the operation of the above embodiment will be described with reference to the flowcharts of Figs. 7 and 8 and the explanatory diagrams of Figs. 5, 6 and 9 to 15. The wafer W attached to the dicing sheet D is subjected to probe inspection in advance, and the reference map data is stored in the memory unit 107 as a probe inspection result. Further, the mechanism control unit 101 operates the expansion mechanism 2 to stretch the dicing sheet D and enlarge the interval between the wafers S.

[3-1. Summary of Processing]

In the present embodiment, the composite image data and the alignment map are arranged to generate display data that can be checked for consistency and inconsistency. The composite image data is, for example, data for displaying the composite image as shown in FIG. 5(a) on the output unit 40. The image data is synthesized, and the correction portion 105d corrects the displacement caused by the stretching of the cutting piece D. The map arrangement data is, for example, data for displaying the map image as shown in FIG. 5(b) on the output unit 40. The display material is, for example, data for displaying the comparison result image (c) as shown in FIG. 5(c) on the output unit 40.

[3-2. Processing details]

Next, the details of the above processing will be described with reference to the flowchart of FIG. First, the mechanism control unit 101 waits for the program command "W" indicating the scanned wafer W and the encoder information X, Y (step 101). The encoder information X, Y is based on the device management mapping data reflecting the probe inspection result, that is, the reference mapping data, so that the ring moving mechanism 2 is moved so that the adsorption nozzle 51 scans and locates the expanded wafer. Information of S.

The mechanism control unit 101 that has received the command "W" and the encoder information X, Y causes the ring moving mechanism 2, the separating mechanism 4, the pickup mechanism 5, and the imaging mechanism 6 (step 102). That is, the mechanism control unit 101 operates the ring moving mechanism 2 so that the wafer S to be picked up is positioned at the adsorption nozzle 51. Further, as described above, the inspection unit 102 may cause the imaging unit 61 to capture the wafer S immediately before the pickup, and perform an appearance check based on the result of the imaging to determine that the wafer S is a good or defective product. In this case, the visual inspection results will also be reflected in the device management map data. When the wafer S is a good product, the separating mechanism 4 pushes the wafer S of the object by the pin 41 to be separated from the other wafer S. The adsorption nozzle 51 adsorbs the separated wafer S and delivers it to other projects. The above processing proceeds from the beginning of the wafer S in the wafer W to the end (NO in step 103). Further, as a result of the visual inspection, whether or not each of the wafers S is picked up is combined with the probe inspection result, that is, the data on the distribution of the good products and the defective products, and the device management map data is stored by the memory unit 107.

By the above procedure, the pickup of one wafer W (including the visual inspection including the case) is completed (YES in step 103). then, The mechanism control unit 101 operates the ring moving mechanism 2 to return the imaging position of the imaging unit 61 (the position of the adsorption nozzle 51) to the head position of the first line to be scanned.

Thereafter, the mechanism control unit 101, after the ring moving mechanism 2 returns to the head position of the first line to be scanned (step 104), waits for the instruction "W" indicating the scanning of the wafer W and the encoder information X, Y (step 105). When receiving the command "W", the mechanism control unit 101 operates the ring moving mechanism 2 and the imaging unit 6 in accordance with the encoder information X, Y (step 106).

In other words, the mechanism control unit 101 operates the ring moving mechanism 2 to cause the imaging unit 61 to perform horizontal reciprocal scanning. The imaging unit 61 gradually captures image data at a position corresponding to each wafer S (step 107).

Next, the storage unit 107 sequentially records the captured image data so that the combined image generating unit 103 can bond the captured image data to create the entire image data (step 108). For example, the captured images (1) to (3) in FIG. 9 are images generated based on the captured image data obtained by horizontal round-trip scanning.

The mechanism control unit 101, after capturing part of the image data, when all of the partial image data has not been retrieved (NO at step 109), the mechanism control unit 101 performs the above-described waiting command to lower the processing (step 105). ~108).

The mechanism control unit 101, when the final position of the last line to be scanned is reached, and all of the partial image data is completed, the flag is erected (YES of step 109).

The synthetic image generating unit 103 attaches and combines the captured image data, and adjusts the image data to be the entire image data, thereby generating the composite image data and storing it in the storage unit 107 (step 110). In the example of the composite image based on the composite image data of Fig. 9, the portion indicated by black is the wafer S remaining on the ring or not picked up.

On the other hand, the enantio map arrangement creating unit 104 converts the device management map data (the result of the probe inspection and the visual inspection) to create a pair map arrangement data (step 111). An example of an enant image of an enantiomeric arrangement data created in this manner is shown in Fig. 6(b). In Fig. 6(b), as described above, the wafer S on the ring and the defective product is black, and the outer ring is shown in gray. However, the enant image is not an actual captured image, but a so-called hypothetical image generated by arranging data according to the engraving map.

Next, the matching unit 105 performs a matching process of the composite image data and the enantiomeric arrangement data (step 112). The details of the comparison processing will be described with reference to the flowchart of FIG. First, the adjustment unit 105a performs conversion of the composite image data and conversion of the alignment map data so as to be suitable for comparison (steps 201, 202).

Next, the feature extracting unit 105b extracts the feature points of the synthesized image data and the wafer S image in the map arrangement data (step 203). In the present embodiment, four points of the corners of the wafer S are extracted. The extraction of the feature points, for example, uses the following method. This is one of the ways to perform angle detection in image data at high speed.

An example of the processing performed by this method will be described below. First, the image shown in Fig. 10(a) is enlarged, as shown in Fig. 10. (b) is shown. As shown in FIG. 10(b), as shown in FIG. 10(b), a loop filter composed of pixels from 1 to 16 is set. Next, in the case where the pixels constituting the filter 1 to 16 are more than 10 pixels brighter than the center pixel p of the filter and 4 or more pixels darker than the center pixel p, the center is The pixel p is detected as an angle.

Further, in the case where the slit of the filter is cut by a darker pixel than the background to have a slightly C shape, the direction of the corner can be detected by the position of the slit. For example, FIGS. 11(a) to (d) are examples in which a slit is formed in the lower right, lower left, upper right, and upper left of the screen, and the direction can be known by the position of the slit.

Fig. 12 (b) discloses an example of extracting an image based on feature points in which image data is extracted from feature points extracted from the map arrangement data. Figure 12 (a) is an enant image of an arrangement of data based on an enantiomeric map. In addition, in Fig. 12(b), the angle in the ring is also extracted as a feature point and displayed.

Next, the displacement calculating unit 105c calculates the displacement direction and the displacement amount of the feature points in the composite image data based on the extracted feature points (step 204). As described above, the calculation is performed by dividing into a plurality of regions and obtaining a vector for each of the regions. The number of divided regions is not limited to a specific number and can be freely set. However, the more the number of divisions, the more correctly correcting the displacement of each part. For example, on the premise that a common vector capable of correcting the displacement correctly and at high speed is obtained, it is desirable to set the square of the circle surrounding the ring to 9 or more of 3×3. The size of the divided area can also be freely divided into equal parts or changed according to location.

Then, the calculation of the displacement direction and the displacement amount of the feature points, It is desirable to use a method of establishing a correspondence between feature points between two or more images. In the present embodiment, the following feature is used to associate feature points between two images at high speed. In this method, a vector having a common direction is extracted from a feature point of a composite image and a vector having a feature point of the enant image as an end point. The search for the feature points of the two images may be all snare, but the vector may also be used in the case where there is a common vector within a predetermined threshold when randomly tested.

Fig. 13 (c) shows the result of comparing the feature points of the composite image (a) based on the composite image data with the feature points of the enan map image (b) based on the alignment map data. The arrows in the figure are examples of abbreviated vectors that are extracted. As shown in FIG. 13(c), the displacement direction and the displacement amount in each region are different from each other.

Next, the correcting unit 105d extracts the feature points of the synthesized image data from the feature points of the synthesized image data, and corrects them according to each region (step 205). That is to say, the position of the feature points included in each region is moved by the inverse vector of the vector obtained for each region.

The comparison processing unit 105e creates a difference image resulting from the comparison of the corrected composite image data and the alignment map data for each region (step 206). For example, as shown in FIG. 14(a), the pixel data of the same portion will be subtracted from the similar value, and the value will become smaller, so that it will become a black color in the gray scale.

Inconsistent part of the pixel data, will subtract the larger value, the absolute value will become larger, so it will become close to white in the gray level color. In addition, in Fig. 14 (a), the enant image is superimposed and displayed in gray.

Further, the matching processing unit 105e removes noise caused by a misalignment of about 1 to 2 pixels. The image after the noise is removed is shown in Fig. 14(b). In Fig. 14(b), as a result of the comparison, the wafer S is in a state of being aligned.

The determination unit 105f determines the inconsistency by, for example, binarization of the grayscale image, profile analysis, and features such as shape and size (step 207). The judgment result includes information such as the position and quantity of the inconsistency. However, the method of determining the inconsistency is not limited to this. Any other method that can be used now or in the future can also be applied, such as normalized correlation.

Returning to the flowchart of Fig. 7, the display material generating unit 106 generates display data for displaying the determination result based on the determination result by the comparison processing (step 113). The mapping comparison device 100 transmits the generated display material to the output unit 40 (step 114), and the output unit 40 displays the display material (step 115).

For example, an example of a display image based on display data indicating a determination result is as shown in FIG. Fig. 15(a) shows the case where the alignment is identical. In the case where the comparison is the same, it is the case that there is no picking mistake. Fig. 15(b) shows the case where the alignment is inconsistent.

The case where the comparison is inconsistent is the case where the wafer S to be picked up is not picked up, the wafer S which should not be picked up is picked up by mistake, and the crystal is picked up. The case where the sheet S is peeled off from the dicing sheet D, and the like. In such a case, it can be determined that there is an inconsistency. For example, in Fig. 15(b), the result of the inconsistency (the portion circled in the figure) is displayed in different colors (red, etc.). The difference display can be various shapes such as different colors, flicker, and brightness emphasis. It is also possible to distinguish the display by enclosing the inconsistency pattern on the display screen and indicating the arrow of the inconsistency. These aspects can also be used in combination. In addition, when the wafer S which should not be picked up disappears from the dicing sheet, it may flow out as a defective product, and the importance of the problem is high, so that the difference between the wafer S which should not be picked up and the remaining portion can be further displayed. The difference is displayed, and only the difference in the position where the wafer S that should not be picked up does not remain can be displayed. Further, in the case where the outflow of the wafer S which should not be picked up such as defective products reaches a predetermined threshold or more, control such as outputting a warning to the output portion 40 and stopping the device to prevent further outflow can be performed.

[4. Effect]

The effects of the above embodiment are as follows.

(1) It is possible to find out the position of the wafer S on the dicing sheet D after the pick-up, and to calculate the displacement direction and the displacement amount of the wafer S caused by the severing of the dicing sheet D, thereby performing calculations. In the case where there is a partial deformation on the dicing sheet D, the wafer W pick-up result comparison can still be performed at high speed and correctly. In particular, the situation can be accurately determined by eliminating the influence of the deformation as compared with the case where the dicing sheet D is detached from the apparatus and compared with the case of detecting the dicing groove.

(2) In the enantiomeric comparison device 100, the calculation of the cutting piece D is performed. The displacement direction and displacement amount of the wafer S caused by the same, and according to the result, the synthetic image data or the alignment map data is corrected and compared. Therefore, it is not necessary to detach the cutting piece D from the ring R for inspection, and the pickup result can be correctly checked in the apparatus for a short time.

(3) The wafer W on the dicing sheet D is divided into a plurality of regions, and the displacement direction and the displacement amount are calculated for each of the plurality of regions, so that even if the position of the dicing sheet D is changed, there is a displacement direction and The difference in the amount of displacement can still be corrected more correctly.

In particular, since the dicing sheet D is stretched by a force in a direction from the inner side of the circle surrounding the wafer W, the displacement direction and the amount of displacement are caused by the position of the dicing sheet D and the presence or absence of the wafer S. Various ways. However, in the present embodiment, since the calculation is performed by dividing into a plurality of regions, the displacement direction and the displacement amount common to each region can be obtained, and the correction can be further accurately corrected.

(4) In order to calculate the displacement direction and the displacement amount, the feature points of each wafer are extracted. Since the contrast between each wafer S and the dicing sheet D is relatively clear, the feature points can be surely extracted.

In particular, by using such feature points, the above method can be applied. The processing for obtaining vectors by the above method is very fast, so that the processing speed can be further improved.

Further, since the feature points are set as the corners of the respective wafers, a plurality of feature points can be extracted, so that the number of samples is increased, and as a result, the displacement direction and the displacement amount can be more accurately determined. In particular, the extraction of the feature points uses the above-described method suitable for high-speed angle detection, so that the processing can be speeded up. Even if there is a displacement, the direction of the wafer S is almost fixed, so that it is easy to detect the direction of the angle.

(5) The image for one of the comparisons is an alignment map data created by managing the map data according to the device of the map comparison device 100, so that no special information is required. , you can check in the device. Further, the correction by the correction unit 105d is performed for the composite image data, whereby the accuracy of the position of the wafer S in the alignment pattern data is maintained.

(6) The determination result is displayed on the output unit 40 with an image that can understand the distribution of the wafer S in the ring. Therefore, the operator is easy to recognize consistent and inconsistent. In particular, by distinguishing the inconsistencies, the picking mistakes can be more easily and correctly identified. Moreover, by distinguishing the places where the defective products are not left, the problem of high importance of the outflow of defective products can be recognized reliably and early.

[5. Other embodiments]

Further, the present invention is not limited to the above embodiment. For example, in the above-described embodiment, the generation of the composite image data is performed based on the horizontally scanned image after the entire wafer W is picked up. However, the composite image data may be generated based on the image captured by the imaging unit 61 corresponding to each wafer S. That is to say, if the wafer S immediately before the pickup is taken, the wafer S is not present in the position of the wafer S picked up last time in the imaging range. Therefore, as described above, the overlapping portions are sequentially overwritten with the latest image data, thereby generating the synthesized composition after the pickup. Image data. In this manner, if the imaging unit 61 captures the image pickup unit 5 as the pickup unit 5 picks up, the processing time can be shortened.

In addition, in a specific area, even if the number of feature points is small, in order to correctly determine the displacement direction and the amount of displacement, the information of the displacement direction and the displacement amount of the surrounding area can be used to determine the The direction of displacement and the amount of displacement of a particular area. For example, when the number of feature points of a specific region is below a predetermined threshold, the displacement calculation unit 105c may combine the vector elements by the average vector of the vector information of the surrounding complex region or the positional relationship of the surrounding regions. And determine the vector of the region by combining the vectors. As an example, assume that the upper left area is the area where the number of feature points is small. The area on the right side of the area is strongly stretched upwards. In addition, the area below the area is strongly stretched toward the left. In view of this, it is also a method to determine the vector by combining the vertical elements of the vector of the region from the region on the right and the region on the lateral from the region below.

The configuration of the pickup device 1 is not limited to the above. For example, the ring moving mechanism 2 and the picking mechanism 5 may be configured to pick up in a vertical direction with respect to the ring R disposed horizontally. Further, the pick-up mechanism 5 and the image pickup mechanism 6 may be moved without moving the ring moving mechanism 2 to be positioned to the wafer S on the ring moving mechanism 2.

The mapping comparison device 100 may have at least a configuration for performing the following items, that is, according to the inspection result of the probe inspection of the previous project, and in the case of performing the visual inspection, the inspection result based on the combined result is obtained. To verify that the picking is correct. Therefore, the mapping comparison device 100, it is not always necessary to have the mechanism control unit 101, the inspection unit 102, and the like. That is, the so-called enant map comparison device 100 refers to a device that can check the pickup result by using the data of the above-described inspection result.

Display information, but also free to decide whether to make it display normal. The normal point is where the wafer S to be picked up does not remain, and where the wafer S that should not be picked up remains, in the above example, it is aligned by comparison. It is also easier to identify the problem by not showing it normal. Further, the determination made by the determination unit 105f may also determine the coincidence. For example, the map arrangement data is set to generate data of the wafer S image to be picked up, and when it is consistent with the composite image data, it can be determined that the wafer S is a good one but is not carried out.

By accumulating the determination result by the determination unit 105f in the storage unit 107, it is possible to determine that the picking error is likely to occur, and the initial stage of the operation tends to occur or tend to occur as the operation progresses. It is also possible to provide an analysis unit that analyzes the determination result, and causes the output unit 40 to display such a tendency by the text information or the image of the analysis result by the analysis unit. For example, it is also possible to distinguish the display by superimposing the occurrence of frequent picking errors (beyond the predetermined threshold) and superimposing on the display of the above-described determination result. It is also possible to display the time when the picking mistake occurs frequently in the output unit 40.

The specific contents and values of the information used in the present invention are free and are not limited to specific contents and numerical values. In the judgment of the size of the threshold, the determination of the agreement, the inconsistency, and the like, it is also possible to determine whether to include the value by the above or below, or to use the value greater than, less than, exceeded, not exceeded, raised, or lower. Not the way to not include values Judge. For example, depending on the setting of the value, even if "above" is interpreted as "greater than", "exceeded" or "higher", the following is interpreted as "less than", "not exceeded", "below", "Unsatisfied" is essentially the same.

The above-described embodiments are merely examples, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. The embodiments and variations thereof are included in the invention described in the claims and their equivalents.

Claims (16)

A mapping comparison device, characterized in that: a displacement calculation unit is configured to calculate a displacement direction of a wafer caused by stretching of a dicing sheet according to a composite image data and an alignment map data. a displacement amount, wherein the composite image material is used to generate a dicing sheet obtained by dicing a dicing sheet attached to the diced wafer to pick up chips into which the wafer is divided into divided pieces (divided) An image, the alignment arrangement data is an arrangement of wafers that should be picked up or not picked up; and a correction unit that corrects the composite image data according to a displacement direction and a displacement amount calculated by the displacement calculation unit And at least one of the mapping data of the mapping; and the determining unit, comparing the data of the corrected one with the data of the other party that is not corrected in the synthetic image data and the mapping data of the mapping In this way, the agreement is consistent or inconsistent. The enantioment comparison device of claim 1, wherein the displacement calculation unit divides the wafer on the dicing sheet into a plurality of regions, and calculates a displacement direction for each of the plurality of regions. The amount of displacement. The enantioment comparison device according to claim 1 or 2, wherein the synthetic image data is extended based on a force in a direction from an inner side of the circle surrounding the wafer to the outer side. The image data of the cut piece. For example, the mapping of any of items 1 to 3 of the patent application scope The comparison device includes a feature extraction unit that extracts feature points of the respective wafers based on the composite image data and the alignment map data to perform calculation by the displacement calculation unit. The enantioment comparison device according to any one of claims 1 to 4, wherein the composite image generation unit generates the synthesis based on image data captured corresponding to the pickup of each wafer. Image data. The enantioment comparison device according to any one of claims 1 to 5, wherein the inspection unit performs an appearance inspection of each wafer according to image data taken corresponding to pickup of each wafer. . The enantioment comparison device according to any one of claims 1 to 6, wherein the enantiograph arrangement is performed, and the enantiomeric arrangement data is created according to the enant image data, and the mapping is performed. The map material contains information about at least one of the wafer in the wafer and its location, as well as the defective product of the wafer and its location. The enantioment comparison device according to any one of claims 1 to 7, wherein the correction unit corrects the composite image data. The enantioment comparison device according to any one of claims 1 to 8, further comprising a display data generating unit that generates display data for causing the determination result by the determination unit to be displayed on the display unit. The enantioment comparison device of claim 9, wherein the display data is a uniform or inconsistent between the synthetic image data and the alignment map data for the wafer on the dicing sheet. The image data to be displayed separately. The enantioment comparison device according to any one of the items 1 to 10, wherein the display data is image data which is displayed separately when a wafer which should not be picked up on the dicing sheet is picked up. . The enantiomeric alignment device of claim 4, wherein the aforementioned feature points are the corners of the respective wafers. The enantioment comparison device according to item 2 of the patent application scope, wherein the displacement direction and the displacement amount of any one of the plurality of regions are calculated based on the displacement direction and the displacement amount of the other regions. The enantioment comparison device according to any one of the items 1 to 13, wherein the analysis unit determines the tendency of the pickup result by analyzing the determination result by the determination unit. A method for comparing maps, characterized in that: computer or electronic circuit is performed by: displacement calculation processing, based on synthetic image data and alignment map data, to calculate the displacement of the wafer caused by the extension of the cutting piece Direction and displacement amount, wherein the composite image data is used to generate a slice image after the wafer is sliced and sliced by stretching the dicing sheet attached to the diced wafer, The alignment map data indicates an arrangement of wafers that should be picked up or not picked up; the correction processing corrects the synthesized image data and the aforementioned mapping according to the displacement direction and the displacement amount calculated by the displacement calculation processing. At least one of the map arrangement data; and the determination processing, the synthesized image data and the foregoing enant map arrangement In the material, the information of the party to be corrected is compared with the data of the other party that has not been corrected, thereby determining the agreement or inconsistency. A mapping comparison program, which is characterized in that: computer execution: displacement calculation processing, based on synthetic image data and alignment map data, to calculate the displacement direction and displacement of the wafer caused by the extension of the cutting piece And the composite image data is used to generate a slice image after the wafer is sliced and sliced by stretching the dicing sheet attached to the diced wafer, and the alignment image is arranged. The data is used to indicate the arrangement of the wafers that should be picked up or not to be picked up; the correction processing corrects the composite image data and the aforementioned alignment map arrangement according to the displacement direction and the displacement amount calculated by the displacement calculation processing At least one of the data; and the determination process, in the synthetic image data and the alignment map data, the data of the corrected party is compared with the data of the other party that has not been corrected, thereby determining the agreement or Inconsistent.