TW201504793A - Heat dissipation structure for hand-held mobile device - Google Patents

Abstract

A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Description

Heat dissipation structure of handheld mobile device

A heat dissipating structure of a hand-held mobile device, in particular, a heat dissipating structure of a hand-held mobile device capable of improving the heat dissipating performance of the handheld mobile device.

With the increasing efficiency of the current handheld mobile devices, the internal central processing unit is moving toward dual-core or quad-core and even higher performance, and the faster the processing power of the central processing unit is, the faster the heat is generated. It is bound to become higher and higher, so how to solve the heat has become a very important issue.
In the prior art, a graphite material is attached to the heat source of the handheld mobile device, and the graphite material is used for heat conduction. However, since the internal space of the mobile device is designed to realize the concept of lightness and thinness, there is no space for arranging graphite material for heat conduction. Because the graphite material is bound to increase the overall thickness or volume or weight of the mobile device, it is still a great problem for the handheld mobile device to set a heat dissipation structure in a very small space enough to effectively solve the heat dissipation problem.

Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipation structure of a hand-held mobile device capable of improving the heat dissipation performance of the handheld mobile device.
In order to achieve the above object, the present invention provides a heat dissipating structure of a hand-held mobile device, comprising: a support body having a first side and a second side and at least one heat dissipating portion, wherein the heat dissipating portion is provided with a heat dissipating component.
The heat dissipating component 14 is embedded on the support body 1 , and the surface of the heat dissipating component 14 is at least aligned with or simultaneously with either side of the first side 11 and the second side 12 of the support body 1 . The first and second sides 11, 12 indicate that the heat dissipating member 14 does not protrude from the first and second sides 11 and 12 of the support body 1 without additionally increasing the thickness of the support body 1.
The heat dissipation structure of the hand-held mobile device of the present invention not only solves the problem of heat dissipation of the hand-held mobile device, but also provides a structure for de-heating in a limited space without additionally increasing the thickness or overall volume of the hand-held mobile device, effectively achieving Improve the cooling performance of handheld mobile devices.

1‧‧‧Support
11‧‧‧ first side
12‧‧‧ second side
13‧‧‧ Department of heat dissipation
14‧‧‧Heat components
141‧‧ ‧heat absorption surface
142‧‧‧heating surface
143‧‧ ‧ chamber
1431‧‧‧Capillary structure
1432‧‧‧Working fluid
2‧‧‧Electronic components
3‧‧‧Shell
4‧‧‧Fever unit

1 is an exploded perspective view of a first embodiment of a heat dissipation structure of a hand-held mobile device of the present invention;
2 is a perspective assembled view of a first embodiment of a heat dissipation structure of the handheld mobile device of the present invention;
Figure 3 is a cross-sectional view showing the combination of the first embodiment of the heat dissipation structure of the hand-held mobile device of the present invention;
4 is a perspective exploded view of a second embodiment of a heat dissipation structure of the handheld mobile device of the present invention;
Figure 5 is a perspective assembled view of a second embodiment of the heat dissipation structure of the hand-held mobile device of the present invention;
Figure 6 is a cross-sectional view showing a combination of a second embodiment of the heat dissipation structure of the hand-held mobile device of the present invention;

Figure 7 is a perspective exploded view of a third embodiment of the heat dissipation structure of the hand-held mobile device of the present invention;
Figure 8 is a perspective assembled view of a third embodiment of the heat dissipation structure of the hand-held mobile device of the present invention;
Figure 9 is a cross-sectional view showing the heat dissipating component of the heat dissipating structure of the hand-held mobile device of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
Please refer to Figures 1, 2 and 3, which are perspective exploded, combined and combined cross-sectional views of a first embodiment of a heat dissipating structure of a hand-held mobile device of the present invention. As shown, the heat dissipating structure of the handheld mobile device of the present invention is shown. The support body 1 is used for carrying electronic components or display units or batteries (not shown) inside the handheld mobile device.
. The support body 1 has a first side 11 and a second side 12 and at least one heat dissipating portion 13 . The heat dissipating portion 13 is provided with a heat dissipating member 14 .
The heat dissipating component 13 is a slot, the slot penetrates the support body 1 and communicates with the first and second sides 11 and 12, and the heat dissipating component 14 is correspondingly embedded in the slot. 14 has a heat absorbing surface 141 and a heat dissipating surface 142 which is aligned with the first side 11 of the support body 1 and which is aligned with the second side 12 of the support body 1 .
The heat dissipating component 14 is selected as a temperature equalizing plate or a thin heat pipe. In this embodiment, a temperature equalizing plate is used as an illustration, but not limited thereto, and the heat dissipating component 14 is combined with the supporting body 1 . It is combined with the support body 1 by riveting or diffusion bonding or welding or gluing, and of course, other combinations are not limited.
4, 5, and 6 are perspective exploded, combined, and combined cross-sectional views of a second embodiment of a heat dissipating structure of a hand-held mobile device of the present invention. As shown, the present embodiment is related to the first embodiment. The structure of the example is the same, so it will not be described here. However, the difference between the embodiment and the first embodiment is that the heat dissipating portion 13 is a groove, and the groove is recessed. The heat dissipating component 14 has a heat absorbing surface 141 and a heat dissipating surface 142. The heat absorbing surface 141 is attached to the heat generating unit 4 and is aligned with the heat dissipating surface 141. On one side 11, the heat dissipation surface 142 is attached to the groove of the support body 1.
Please refer to FIG. 7 and FIG. 8 , which are perspective exploded and combined views of a third embodiment of the heat dissipation structure of the handheld mobile device of the present invention. As shown in the figure, the embodiment has the same structure as that of the first embodiment. Therefore, the difference between this embodiment and the foregoing first embodiment is that the present embodiment further has at least one electronic component 2 and at least one housing 3, and the first and second sides are The heat dissipating surface 141 is further disposed with a heat absorbing surface 141 and a heat dissipating surface 142. The heat absorbing surface 141 is attached to at least one heat generating unit 4, and the heat dissipating surface 141 is disposed. The surface 142 is attached to the casing 3 (or directly formed integrally with the casing 3, and the heat dissipation surface 142 is directly exchanged with outside air), and the heat generating unit 4 may be a separate component or an electronic component 2. An accessory component, the electronic component 2 being any one of a substrate or a wafer or a liquid crystal display, and the heat generating unit 4 is any one of a wafer or a central processing unit or a battery.
9 is a cross-sectional view of a heat dissipating component of a heat dissipating structure of the hand-held mobile device of the present invention. The heat dissipating component 14 of the first to third embodiments further has a chamber 143, and the chamber 143 There is a capillary structure layer 1431 and a working fluid 1432 therein.
The heat dissipation structure of the handheld mobile device of the present invention is applied to various handheld mobile devices, such as mobile phones, tablet computers, PDAs, and digital display devices, and is quickly handheld through the heat dissipation structure of the handheld mobile device of the present invention. The heat inside the mobile device is quickly transmitted to other places, so that no heat inside the handheld mobile device can quickly direct the heat to the outside.
Furthermore, the heat dissipation structure of the handheld mobile device of the present invention not only further improves the problem of internal heat dissipation of the handheld mobile device, but also directly combines the heat dissipating component with the support body, and the heat dissipating component directly directly combines with the support body. Therefore, the thickness is not increased, and the heat dissipating component is added in a limited space without increasing the thickness and volume, and the space cannot be set due to the narrow space, thereby achieving the most effective heat dissipation performance.

1‧‧‧Support

11‧‧‧ first side

12‧‧‧ second side

13‧‧‧ Department of heat dissipation

14‧‧‧Heat components

141‧‧ ‧heat absorption surface

142‧‧‧heating surface

Claims (7)

A heat dissipation structure of a handheld mobile device, comprising:
A support body has a first side and a second side and at least one heat dissipating portion, and the heat dissipating portion is provided with a heat dissipating component. The heat dissipation structure of the hand-held mobile device according to claim 1, wherein the heat dissipation portion is a slot, the slot penetrates the support body and communicates with the first and second sides, and the heat dissipation component Correspondingly embedded in the slot, the heat dissipating component has a heat absorbing surface and a heat dissipating surface, the heat absorbing surface is aligned with the first side of the supporting body, and the heat dissipating surface is aligned with the second side of the supporting body. The heat dissipation structure of the hand-held mobile device of claim 1, wherein the heat dissipation component is selected to be either a uniform temperature plate or a thin heat pipe. The heat dissipating structure of the hand-held mobile device of claim 1, wherein the heat dissipating component is coupled to the support by any means such as riveting or diffusion bonding or welding or gluing. The heat dissipation structure of the hand-held mobile device of claim 1, wherein the first and second sides respectively have at least one electronic component and at least one housing, and the heat dissipation component further has a heat absorption surface and a heat dissipating surface is attached to the at least one heat generating unit, and the heat dissipating surface is attached to the casing. The heat dissipating structure of the hand-held mobile device of claim 1, wherein the heat dissipating portion is a groove, the groove is recessed with the first side of the supporting body, and the heat dissipating component is correspondingly embedded in the In the recess, the heat dissipating component further has a heat absorbing surface and a heat dissipating surface, and the heat absorbing surface is attached to the heat generating unit and aligned with the first side, and the heat dissipating surface is attached to the groove of the supporting body. The heat dissipating structure of the hand-held mobile device according to claim 1, wherein the heat dissipating component further has a chamber, and the chamber has a capillary structure layer and a working fluid.