TW201500165A - Method for manufacturing insulating casing - Google Patents

Abstract

A method for manufacturing an insulating casing is provided. In this method, a plastic casing is formed by Gas-Assisted Injection Molding (GAIM). The plastic casing has at least one airtight chamber. Therefore, the insulating casing has better insulating effect.

Description

Method of forming insulated housing

The present invention relates to a method of forming an insulated housing, and more particularly to a method of forming an insulated housing formed by injection molding.

With the advancement of technology and the development of high-tech industries, the performance of electronic devices is also improving. Therefore, in order to meet consumer performance requirements for electronic devices, the industry has invested considerable R&D costs to improve the performance of electronic devices.

As the performance of the electronic device is increased, the amount of heat generated by the electronic device is also increased, thereby increasing the temperature of the entire electronic device. When the surface temperature of the electronic device is too high and the user directly contacts the surface of the electronic device, the user is liable to feel uncomfortable due to the high temperature of the surface of the electronic device. In order to avoid the surface temperature of the electronic device is too high, the aluminum foil or graphite sheet is generally disposed on the plastic casing, and the heat can be quickly transmitted through the above-mentioned components to achieve the heat dissipation effect. However, the practice of attaching such an aluminum foil or graphite sheet to a plastic material must be completed by post-processing, which increases production costs. Furthermore, in recent years, in order to meet the ergonomic design of the casing, the cross-sectional shape of the casing may be polygonal or have a plurality of curved surfaces, so that the aluminum foil or the graphite sheet cannot be uniformly attached to the casing, thereby affecting the heat dissipation effect. In view of this, how to make a casing, It can omit the processing of aluminum foil or graphite sheet, and it can also have good heat dissipation efficiency, which is a problem that must be solved in the industry.

In view of the above problems, the present invention discloses a method of forming an insulated housing, thereby improving the current heat dissipation problem of the housing.

An embodiment of the invention discloses a method for forming an insulated casing, the method comprising: forming a plastic casing in a gas-assisted injection molding manner, the plastic casing having at least one airtight cavity room.

In the method for forming the heat insulating casing disclosed in the present invention, since the airtight chamber is disposed in the plastic casing, the airtight chamber can block the conduction of heat, effectively improve the heat dissipation control, and thereby achieve the effect of improving the overall heat dissipation effect. In addition, the insulated housing of the present invention does not require the attachment of aluminum foil or graphite sheets to the surface of the housing, thereby eliminating the processing costs associated with attaching aluminum foil or graphite sheets to the surface of the housing in the prior art.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

10,11,12,13,14,15,16‧‧‧Insulated housing

110‧‧‧ upper surface

200, 210, 220, 230, 240, 250, 260, 270‧‧ ‧ plastic housing

200‧‧‧ airtight chamber

300‧‧‧ phase change material microcapsules

310‧‧‧ capsule

320‧‧‧ nucleus

Fig. 1 is a flow chart showing a method of forming an insulated casing according to a first embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view showing the heat insulating casing according to the first embodiment of the present invention.

Figure 3 is a schematic cross-sectional view of a thermally insulated housing in accordance with a second embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view showing a heat insulating casing according to a third embodiment of the present invention.

Fig. 5 is a flow chart showing a method of forming a heat insulating casing according to a fourth embodiment of the present invention.

Figure 6 is a schematic cross-sectional view showing a heat insulating casing according to a fourth embodiment of the present invention.

Figure 7 is a schematic cross-sectional view showing a phase change material microcapsule according to an embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view showing a heat insulating casing according to a fifth embodiment of the present invention.

Figure 9 is a schematic cross-sectional view showing a heat insulating casing in accordance with a sixth embodiment of the present invention.

Figure 10 is a schematic cross-sectional view showing a heat insulating casing according to a seventh embodiment of the present invention.

The detailed features and advantages of the present invention are described in detail below in the Detailed Description of the invention. The technical content is embodied in accordance with the present disclosure, and the objects and advantages of the present invention can be readily understood by those skilled in the art in light of the disclosure. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

In the present invention, "upper", "lower", "left", and "right" refer to the description of the relative positions of the two elements in the drawings, but these words are not intended to limit the elements, components, and regions, and do not deviate from the present. The spirit and scope of the invention.

An embodiment of the present invention provides a method of forming a heat-insulating housing, thereby improving heat dissipation efficiency of the heat-insulating housing.

In the present invention, the insulated housing can be applied to an electronic device such as a notebook computer, a portable mobile phone, a tablet computer, an electronic dictionary or a portable electronic game machine, but is not intended to limit the present invention. Furthermore, the accommodating space in the heat insulating housing can accommodate at least one electronic component. When an electronic device is used, the electronic component operates to generate heat, thereby heating the accommodating space, and the heat is conducted to the heat insulating casing.

Please refer to "1st picture" and "2nd picture" at the same time. Fig. 1 is a flow chart showing a method of forming a heat insulating casing according to a first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing the heat insulating casing according to the first embodiment of the present invention.

An embodiment of the present invention provides a method for forming an insulated housing 10 comprising: S1: forming a plastic housing 100 in a gas-assisted injection molding (GAIM) manner, and forming a plastic shell The body 100 has at least one airtight chamber 200. The airtight chamber 200 is a closed space, and the outside air cannot enter the airtight chamber 200, so that the heat insulation effect can be achieved. The plastic housing 100 has an upper surface 110. In addition, the volume of each of the airtight chambers 200 is between 0.125 cubic centimeters (mm ³ ) and 8 mm ³ . In the present embodiment, the number of the airtight chambers 200 is one, but the number and the set positions are not intended to limit the present invention. The cross-sectional shape of the hermetic chamber 200 may be square, rectangular, circular, elliptical, or polygonal, but the cross-sectional shape thereof is not intended to limit the present invention. The number, cross-sectional shape, and installation position of the airtight chamber 200 are adjusted according to actual conditions and needs. Moreover, in the present embodiment, the material of the plastic case 100 is a mixture of polycarbonate (Polycarbonate, PC for short) and ABS resin (Acrylonitrile Butadiene Styrene Resin, ABS Resin for short), but is not limited thereto.

In gas-assisted injection molding, plastic injection molding is carried out by a gas such as nitrogen, and the pressure in the chamber in the plastic is maintained. When the plastic casing 100 is formed to end the mold opening and cooling, the gas in the airtight chamber 200 can be recovered or discharged. In this way, air can remain in the airtight chamber 200. The heat transfer coefficient of air is low relative to the plastic housing 100. Therefore, the airtight chamber 200 can be a good heat insulating space to improve the heat dissipation control of the plastic housing 100 as a whole, and further improve the heat dissipation efficiency. Therefore, the present invention does not require attaching an aluminum foil or a graphite sheet to the surface of the plastic casing 100, thereby solving the problem in the prior art that the aluminum foil or the graphite sheet is attached to the plastic casing 100 in order to enhance the heat dissipation effect. Additional processing costs incurred by the surface.

In other embodiments, the number of hermetic chambers 200 can be a positive integer greater than one. As shown in Fig. 3, it is a schematic cross-sectional view of the heat insulating casing according to the second embodiment of the present invention. The present embodiment is similar to the structure of the first embodiment, so the same reference numerals are used for similar structures, and the similarities are not described again. In the present embodiment, the plastic housing 100 of the heat insulating housing 11 is formed by gas-assisted injection molding, and the plastic housing 100 has four airtight chambers 200, 210, 220, 230, which are evenly disposed on the plastic housing. Within 100. In this way, the heat dissipation efficiency of the plastic casing 100 can be improved.

Please refer to FIG. 4, which is a schematic cross-sectional view of a heat insulating casing according to a third embodiment of the present invention. This embodiment is similar to the structure of the first embodiment, so the same reference numerals are used for the similar structures, and the similarities are not described again. In the present embodiment, the plastic housing 100 that forms the thermally insulated housing 12 by gas-assisted injection molding has eight airtight chambers 200, 210, 220, 230, 240, 250, 260, 270. The airtight chambers 200, 210, 220, 230 are arranged in a row. The airtight chambers 240, 250, 260, 270 are arranged in another row and adjacent to the outer surface 110. Further, the airtight chamber 240 is disposed on the airtight chamber 200, the airtight chamber 250 is disposed on the airtight chamber 210, and the airtight chamber 260 is disposed on the airtight chamber 220, the airtight chamber The chamber 270 is disposed on the airtight chamber 230. Such a plurality of arrayed airtight chambers 200, 210, 220, 230, 240, 250, 260, 270 can increase the heat dissipation efficiency of the plastic housing 100.

Please refer to "figure 5" and "figure 6" at the same time. "5th picture" is the root A flow chart of a method of forming an insulated casing according to a fourth embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing the heat insulating casing according to the fourth embodiment of the present invention. This embodiment is similar to the structure of the first embodiment, so the same reference numerals are used for the similar structures, and the similarities are not described again.

In the method for forming the heat insulating casing 13 according to an embodiment of the present invention, first, S1 is performed to form a plastic casing 100 in a gas-assisted injection molding manner, and the plastic casing 100 has an airtight chamber. 200. Next, S2 is performed to fill a phase change material in an airtight chamber 200.

In the present invention, the phase change material has a great latent heat, that is, the phase change material can absorb a great amount of heat when the phase changes. As a result, the heat dissipation effect of the plastic housing 100 can be further improved. Furthermore, in the heat insulating casing 13, it is not necessary to attach an aluminum foil or a graphite sheet to the upper surface 110 or other surface of the plastic casing 100. Therefore, the additional processing cost of attaching the aluminum foil or the graphite sheet to the surface of the plastic casing 100 in order to improve the heat dissipation effect is solved in the prior art.

Please refer to FIG. 6 and FIG. 7 simultaneously. FIG. 7 is a schematic cross-sectional view of a phase change material microcapsule according to an embodiment of the present invention. In this embodiment, the phase change material is included in a plurality of phase change material microcapsules 300, each of which individually includes a capsule 310 and a nucleus 320, and the nucleus 320 is located inside the capsule 310. The material of the capsule 310 is a high molecular polymer, and the material of the core 320 is the phase change material described above. In this embodiment, the high molecular polymer constituting the capsule 310 may be a mixture of polycarbonate and glass fiber (Glass Fiber, GF for short). The phase change material constituting the core 320 is paraffin or alkane. Furthermore, in one embodiment, the phase change material of the core sac 320 may be eicosane. Thus, when the electronic device operates to raise the temperature of the heat insulating casing 13, the surface temperature of the plastic casing 100 can be controlled to be controlled at about thirty-seven degrees Celsius. In another embodiment, the phase change material of the capsule core 320 may be triacontane. When the electronic device operates to increase the temperature of the heat insulating housing 13, the surface temperature of the plastic housing 100 can be controlled to be controlled at about six degrees Celsius. Sixteen degrees. Therefore, the heat dissipation control of the heat insulating casing 13 is improved.

However, the phase change material described above is a phase change material microcapsule 300, but is not intended to limit the invention. In other embodiments, the phase change material is a non-microencapsulated phase change material. The non-microcapsule phase change material can be a high latent heat material such as paraffin or an alkane. The alkane can be eicosane or triacontane, but can be adjusted according to actual needs.

However, the number of hermetic chambers 200 is not intended to limit the invention. Please refer to FIG. 8 , which is a schematic cross-sectional view of a heat insulating casing according to a fifth embodiment of the present invention. The structure of the present embodiment is similar to that of the fourth embodiment, so the same reference numerals are used for similar structures, and the similarities are not described again. In the present embodiment, the plastic housing 100 of the insulated housing 14 has eight airtight chambers 200, 210, 220, 230, 240, 250, 260, 270, and each airtight chamber 200, 210, 220, A plurality of phase change material microcapsules 300 are housed in 230, 240, 250, 260, and 270. In this way, the heat dissipation efficiency of the heat insulating casing 13 can be improved.

In the present invention, the airtight chamber 200 can accommodate the phase change material microcapsule 300 or the airtight chamber 200 can accommodate only gas. Please refer to "Figure 9", which A schematic cross-sectional view of a thermally insulated housing in accordance with a sixth embodiment of the present invention. The structure of the present embodiment is similar to that of the fourth embodiment, so the same reference numerals are used for similar structures, and the similarities are not described again. In the plastic case 100 of the present embodiment, in order to make the right side of the plastic case 100 of the heat insulating case 15 in the figure require a relatively high heat dissipation capability, the airtight chambers 220, 230, 260, and 270 respectively have a plurality of The phase change material microcapsules 300, while the airtight chambers 200, 210, 240, 250 only contain air. In this manner, since the heat insulating capability of the right side of the heat insulating casing 15 is high in the drawing, the heat insulating casing 15 is further controlled to achieve heat dissipation.

Please refer to FIG. 10, which is a schematic cross-sectional view of a heat insulating casing according to a seventh embodiment of the present invention. The structure of the present embodiment is similar to that of the fourth embodiment, so the same reference numerals are used for similar structures, and the similarities are not described again. In the insulated housing 16 of the present embodiment, the airtight chambers 240, 250, 260, and 270 respectively have a plurality of phase transitions in order to make the upper surface 110 of the plastic housing 100 require more heat dissipation capability. The material microcapsules 300, while the airtight chambers 200, 210, 220, 230 only contain air. As such, when the heat insulating capability near the upper surface 110 of the plastic casing 100 can be improved, the heat dissipation control of the heat insulating casing 16 can be improved.

In the method for forming the heat insulating casing disclosed in the present invention, since the airtight chamber is disposed in the plastic casing, the airtight chamber can block the conduction of heat, thereby achieving the effect of improving the heat dissipation effect. In addition, the insulated housing of the present invention does not require the attachment of aluminum foil or graphite sheets to the surface of the housing, thereby eliminating the processing costs associated with attaching aluminum foil or graphite sheets to the surface of the housing in the prior art. Moreover, the phase change material in the airtight chamber can further improve the heat insulation effect of the heat insulating shell, and further Improve overall thermal control and cooling efficiency. The phase change material may be a phase change material microcapsule or a non-microcapsule phase change material.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

Claims (10)

A method of forming an insulated casing, comprising: forming a plastic casing in a Gas-Assisted Injection Molding manner, the plastic casing having at least one airtight chamber. The method for forming an insulated casing according to claim 1, further comprising: filling a phase change material in the at least one airtight chamber. A method of forming an insulated casing according to claim 2, wherein the phase change material is contained in a plurality of phase change material microcapsules. A method of forming an insulated casing according to claim 3, wherein the phase change material is a paraffin or an alkane. The method for forming an insulated casing according to claim 2, wherein the phase change material microcapsules individually comprise a capsule shell and a capsule core, the capsule core being located inside the capsule shell, the material of the capsule shell being a A high molecular polymer, the material of the core is the phase change material. The method for forming an insulated casing according to claim 5, wherein the high molecular polymer is a mixture of polycarbonate and glass fibers, and the phase change material is paraffin or alkane. A method of forming an insulated casing according to claim 5, wherein the phase change material is eicosane or triacontane. The method for forming an insulated casing according to the first aspect of the patent application, wherein the plastic casing is made of polycarbonate (Polycarbonate, PC for short) and ABS. A mixture of resin (Acrylonitrile Butadiene Styrene Resin, ABS Resin for short). The method of forming an insulated casing according to claim 1, wherein the number of the at least one airtight chamber is plural. A method of forming an insulated casing according to claim 1, wherein each of the at least one airtight chamber has a volume of from 0.125 mm ³ to 8 mm ³ .