TWI510158B - Method for manufacturing case of electronic devices and manufactured case structure of electronic devices - Google Patents

Description

Method for forming electronic device housing and fabricated electronic device housing structure

The present invention relates to a method for forming an electronic device housing and a fabricated electronic device housing structure, and more particularly to a method for forming an electronic device housing using a phase change material (PCM) microcapsule The electronic device housing structure.

With the advancement of technology, the market competition of electronic devices (such as notebook computers, portable mobile phones, tablet computers, electronic dictionaries or portable video game machines) has become increasingly fierce. In order to meet consumer demand for electronic devices, the industry has invested considerable R&D costs to improve the performance of electronic devices. As the performance of electronic devices increases, more and more heat is generated during the operation of electronic devices. In order to improve the heat dissipation problem of the electronic device, in general, an aluminum foil or a graphite sheet is usually attached to the plastic case to achieve the heat dissipation effect. However, this method must be processed after the completion of the preparation of the plastic casing, thereby increasing the production cost of the casing. On the other hand, different types of casings usually have different sizes, so that the same specifications of aluminum foil or graphite sheets cannot be uniformly attached to different types of casings, thereby affecting the heat dissipation effect. Therefore, how to design a housing forming method and a housing structure to solve the problem that the manufacturing of the housing in the prior art is complicated and the heat dissipation effect of the manufactured housing structure is not good has become a problem that the designer must solve. .

In view of the above problems, the present invention relates to a method for forming an electronic device housing and a fabricated electronic device housing structure, thereby solving the prior art that the manufacturing of the housing is complicated, and the heat dissipation effect of the manufactured housing structure is not Good question.

In the present invention, the electronic device housing can be applied to, for example, an electronic device such as a notebook computer, a portable mobile phone, a tablet computer, an electronic dictionary, or a portable electronic game machine, but is not intended to limit the present invention. Furthermore, the accommodating space in the housing of the electronic device can accommodate at least one electronic component. When an electronic device is used, the electronic component operates to generate heat, thereby heating the accommodating space, and the heat is re-conducted to the electronic device housing.

A method of forming an electronic device housing according to an embodiment of the invention includes the following steps. Provide a plastic. A plurality of phase change material microcapsules are provided. The mixed plastic and the plurality of phase change material microcapsules are a shell material. The housing material is formed into an electronic device housing by injection molding.

In the present invention, the electronic device housing can be applied to, for example, an electronic device such as a notebook computer, a portable mobile phone, a tablet computer, an electronic dictionary, or a portable electronic game machine, but is not intended to limit the present invention. Furthermore, the accommodating space in the housing of the electronic device can accommodate at least one electronic component. When an electronic device is used, the electronic component operates to generate heat, thereby heating the accommodating space, and the heat is re-conducted to the electronic device housing.

An electronic device housing structure according to an embodiment of the invention comprises a plastic layer and a plurality of phase change material microcapsules. The phase change material microcapsules are dispersed in the plastic layer.

According to the method for forming an electronic device housing and the electronic device housing structure, the plastic and the phase change material microcapsules are mixed and then borrowed. The electronic device housing is formed by the method of injection molding, so that no additional processing is required after the manufacture of the electronic device housing, which is simplified in the manufacturing process. On the other hand, since the fabricated electronic device housing structure contains phase change material microcapsules. Therefore, the electronic device housing structure can absorb thermal energy by using the phase change material microcapsule, thereby achieving better heat dissipation effect. In this way, the problem that the manufacturing of the casing in the prior art is complicated and the heat dissipation effect of the manufactured casing structure is not good is solved.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

10‧‧‧Electronic device housing structure

20‧‧‧ plastic

20'‧‧‧ plastic layer

30‧‧‧ phase change material microcapsules

32‧‧‧ capsule

34‧‧‧ nucleus

FIG. 1 is a flow chart of a method for forming an electronic device housing according to an embodiment of the invention.

Fig. 2 is a schematic cross-sectional view showing the phase change material microcapsule of the step S102 of Fig. 1.

Fig. 3 is a schematic view showing the casing material of the step S103 of Fig. 1.

Fig. 4 is a schematic cross-sectional view showing a part of the structure of the electronic device casing manufactured according to the flow of Fig. 1.

The detailed features and advantages of the present invention are set forth in the detailed description of the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but do not limit the scope of the invention in any way.

Please refer to FIG. 1 to FIG. 3 , FIG. 1 is a diagram of an embodiment of the present invention. A flow chart of a method of forming a housing of an electronic device. Fig. 2 is a schematic cross-sectional view showing the phase change material microcapsule of the step S102 of Fig. 1. Fig. 3 is a schematic view showing the casing material of the step S103 of Fig. 1.

First, a plastic is provided (step S101). In the present embodiment, a polycarbonate/acrylonitrile-butadiene-styrene copolymer (PC/ABS) is used as the material of the plastic, however, the material of the plastic is not intended to limit the present invention.

Next, a plurality of phase change material microcapsules are provided (step S102) (as shown in Fig. 2). In the present embodiment, the phase change material microcapsule 30 comprises a capsule 32 and a nucleus 34. The nucleus 34 is located within the capsule 32. The material of the capsule 32 is a high molecular polymer, and the material of the core 34 is a phase change material. The phase change material has a melting point of from 20 ° C to 75 ° C, preferably from 35 ° C to 55 ° C. In this embodiment, the material of the capsule 32 comprises a mixture of polycarbonate (PC) and glass fiber (GF), and in this embodiment and some other embodiments, the quality of the glass fiber (GF) occupies the capsule 32. The total mass is 35 to 45%, preferably 40%. On the other hand, the material of the core 34 is a phase change material such as paraffin, an alkane (for example, twenty to thirty decane), an alcohol (for example, n-nonanol to eicosyl alcohol), and an acid. A heat absorbing substance such as (n-decanoic acid to hexadecanoic acid). However, the material of the capsule 32 and the core 34 and its composition are not intended to limit the invention. In the present embodiment, the phase change material microcapsules have a particle diameter of 0.1 to 1000 μm, preferably 10 to 30 μm, more preferably 20 to 30 μm.

It should be noted that the material of the capsule 32 is matched to plastic. In detail, the melting point of the capsule 32 is higher than the melting point of the plastic. For example, the melting point of the shell 32 (polycarbonate/glass fiber) of the present embodiment is about 285 ° C, and the melting point of the plastic (polycarbonate / acrylonitrile-butadiene-styrene copolymer) is about 230. °C.

Then, the mixed plastic and the phase change material microcapsules are a casing material (step S103) (as shown in Fig. 3). The volume ratio of plastic to phase change material microcapsules may range from 4:1 to 99:1, preferably from 4:1 to 9:1. In the present embodiment, the plastic 20 and the phase change material microcapsule 30 are mixed at a volume ratio of 4:1. However, the user is not limited thereto, and the user can adjust the plastic 20 and the phase change material microcapsule 30 according to the needs thereof. Volume ratio. After the mixing process of step S103, the phase change material microcapsules 30 are uniformly dispersed in the plastic 20.

Finally, the casing material is formed into an electronic device casing by injection molding (step S104). In detail, the casing material is passed through an injection molding machine (not shown), and the casing material is molded into an electronic device casing at a reaction temperature. It should be noted that the reaction temperature of the casing material passing through the machine is lower than the melting point of the capsule of the phase change material microcapsule, and the reaction temperature is higher than the melting point of the plastic. In this way, during the reaction, the plastic will be liquefied due to the high temperature, so the user can shape the plastic into the desired shape according to the needs of the user. On the other hand, during the reaction, the capsule will remain solid and the nucleus can be confined within the capsule.

Please refer to FIG. 4, which is a cross-sectional view showing a part of the structure of the electronic device casing manufactured according to the flow of FIG. 1. The fabricated electronic device housing structure 10 includes a plastic layer 20' and a plurality of phase change material microcapsules 30. The phase change material microcapsules 30 are dispersed in the plastic layer 20'. In detail, the phase change material microcapsule 30 includes a capsule 32 and a nucleus 34, and the nucleus 34 is located within the capsule 32. The material of the capsule 32 and the capsule core 34 and the properties thereof are as described above, and therefore will not be described again.

Since the fabricated electronic device housing structure 10 includes the phase change material microcapsule 30, and the material of the capsule core 34 in the phase change material microcapsule 30 is a phase change material, and because the phase change material has a high latent heat, For example, when a large amount of heat generated by an electronic component is transferred to an electronic device In the case of the casing structure 10, the phase change material can absorb and store thermal energy for phase change, and maintain the temperature within a certain value during the phase change, and the temperature can be adjusted by adjusting the nucleus of the phase change material microcapsule 30. 34 to control. In this way, the phase change material can slow down the temperature rise of the heat source, thereby effectively improving the heat dissipation efficiency of the electronic device housing structure 10. Further, the temperature of the surface of the electronic device housing structure 10 can be controlled by constant temperature heat dissipation.

According to the method for forming an electronic device casing and the fabricated electronic device casing structure according to the embodiments of the present invention, the plastic device is mixed with the phase change material microcapsule, and then the electronic device is formed by injection molding. The housing, thus eliminating the need for additional processing after the manufacture of the electronics housing, is simplified in the process. On the other hand, since the fabricated electronic device housing structure contains phase change material microcapsules. Therefore, the electronic device housing structure can absorb thermal energy by using the phase change material microcapsule, thereby achieving better heat dissipation effect. In this way, the problem that the manufacturing of the casing in the prior art is complicated and the heat dissipation effect of the manufactured casing structure is not good is solved.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.

Claims (8)

A method for forming an electronic device housing, comprising: providing a plastic; providing a plurality of phase change material microcapsules; mixing the plastic with the plurality of phase change material microcapsules as a casing material; and ejecting the casing material Forming an electronic device housing; wherein the plurality of phase change material microcapsules respectively comprise a capsule shell and a capsule core, wherein the capsule core is located in the capsule shell, and the capsule shell is made of a polymer The material of the core is a phase change material, and the phase change material has a melting point of 20 ° C to 75 ° C. The method of forming an electronic device housing according to claim 1, wherein a melting point of the capsule of the plurality of phase change material microcapsules is higher than a melting point of the plastic. The method for forming an electronic device casing according to claim 2, wherein the casing material is formed by injection molding at a reaction temperature, and the reaction temperature is lower than the plurality of phase change materials. The melting point of the capsule of the capsule, the reaction temperature being higher than the melting point of the plastic. The method for forming an electronic device casing according to claim 1, wherein in the step of mixing the plastic and the plurality of phase change material microcapsules into a casing material, the plastic and the plurality of phase change material microcapsules The volume ratio is between 4:1 and 99:1. An electronic device housing structure comprising: a plastic layer; and a plurality of phase change material microcapsules dispersed in the plastic layer; wherein the plurality of phase change material microcapsules respectively comprise a capsule and a capsule core, The nucleus is located in the capsule, and the material of the capsule is a high molecular polymer, and the material of the nucleus is one phase A variable material having a melting point of from 20 ° C to 75 ° C. The electronic device housing structure of claim 5, wherein a melting point of the capsule of the plurality of phase change material microcapsules is higher than a melting point of the plastic layer. The electronic device housing structure of claim 5, wherein the material of the plurality of phase change material microcapsules comprises a polycarbonate and a glass fiber. The electronic device housing structure of claim 5, wherein a volume ratio of the plastic layer to the plurality of phase change material microcapsules is between 4:1 and 99:1.