TW201447221A - Uneven film thickness inspection device - Google Patents

Abstract

The present invention provides an uneven film thickness inspection device that ensures an amount of light that is effective for inspection and excellent energy efficiency. The present invention is a device that is used to inspect, for an inspection target that comprises a transparent substrate on which a resin material is coated, the uneven thickness of the film of the resin material and comprises an illumination portion and an imaging portion. The illumination portion comprises a plurality of LED chips, a first diffuser board, and a second diffuser board with an air layer interposed between the first diffuser board and a second diffuser board. Light emitted from the plurality of LED chips passes in sequence through the first diffuser board, the air layer, and the second diffuser board to irradiate the inspection target.

Description

Film thickness unevenness inspection device

The present invention relates to an apparatus for inspecting a film thickness unevenness of a resin material coated on a transparent substrate.

Color pixels (R, G, B) are formed on the glass substrate or the film sheet as a transparent substrate. Further, in order to prevent color blurring and reduce light leakage, a layer of a lattice pattern formed of a metal or black resin material (ie, resin black) called a black matrix is formed between the color pixels (ie, a BM layer). ). In order to form the BM layer, a uniform material for the BM layer is applied to the entire substrate, and patterned by photolithography.

Immediately after the formation of the BM layer by coating, the film thickness of the BM layer is examined for unevenness (i.e., film thickness unevenness inspection) (for example, Patent Document 1).

In the film thickness unevenness inspection device, the substrate after the application to be inspected is irradiated with illumination light from the lower side, and is photographed by a camera disposed at a position facing the illumination light via the substrate. Uneven film thickness inspection (so-called through illumination). Further, the illumination light is a white light illumination such as a fluorescent lamp or a halogen illumination, and a band pass filter that passes light of a specific wavelength is used, and it is determined that the film thickness of the color film (R, G, B) to be inspected is not The unevenness of the light produced by the light is used to check the unevenness of the film thickness.

Further, regarding a surface light source using an LED (Light Emitting Diode), a technique in which two diffusion plates are used to reduce luminance unevenness has been disclosed (for example, Patent Document 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-219108

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-133006

The brightness of the surface of the illumination such as the fluorescent lamp used in the previous inspection device is uniform, and it is suitable for checking the unevenness of the film thickness. However, since the light of the wavelength component of the unnecessary wavelength is checked by the filter after the light of the multi-wavelength component is emitted, the energy efficiency is poor.

On the other hand, it is difficult to set a common inspection condition (that is, the interval or thickness of the diffusion plate) for a plurality of types of inspection objects by using only two diffusion plates, and it is necessary to reset the optimum interval or each type to be inspected. thickness.

Accordingly, it is an object of the present invention to provide a film thickness unevenness inspection device which ensures an effective amount of light for inspection and which is energy efficient.

In order to solve the above problems, an aspect of the present invention is to provide an apparatus for inspecting a thickness unevenness of a resin material of an inspection object coated with a resin material on a transparent substrate, and comprising: an illumination unit, which is The inspection target object is irradiated with illumination light for inspection; and the imaging unit is disposed at a position facing the illumination unit via the inspection object; the illumination unit includes a plurality of LED chips, a first diffusion plate, and a diffusing plate; an air layer is disposed between the first diffusing plate and the second diffusing plate, and the light emitted from the plurality of LED chips sequentially passes through the first diffusing plate, the air layer, and the second diffusing plate; And it is irradiated to the above-mentioned inspection object.

Therefore, it is possible to prevent the light amount from being lowered, and an improvement in brightness unevenness can be achieved.

Further, in the above aspect, the thickness of the first diffusion plate may be set to be thicker than the thickness of the second diffusion plate.

Further, in the above aspect, at least one of the first diffusing plate or the second diffusing plate may be provided with a thickness direction moving actuator mechanism, and the first diffusing plate or the second diffusing plate may be used The diffusion plate adjusts the set position in the thickness direction; and the inspection condition registration unit registers the inspection condition; and the inspection condition registration unit registers the set position of the thickness direction movement actuator mechanism for each inspection type.

Further, in the above aspect, at least one of the first diffusion plate or the second diffusion plate may have a cross-sectional shape in which the thickness is continuously or stepwise, and the first diffusion plate or the first diffusion plate may be used. 2: a diffuser plate includes: an actuator mechanism for changing a thickness, wherein the set position is adjusted along a direction in which the thickness of the first diffuser or the second diffuser changes; and an inspection condition registration unit that registers an inspection condition; In the inspection condition registration unit, the setting position of the above-described plate thickness changing actuator mechanism is registered for each inspection type.

Moreover, in the above aspect, the plurality of LED chips may be a plurality of infrared LED chips emitting infrared wavelength light.

Moreover, in the above aspect, the plurality of LED chips may be provided with a plurality of red LED chips emitting red wavelength light and a plurality of infrared LED chips emitting infrared wavelength light, the red LED chip and the infrared LED chip. Interleaved on one line.

Moreover, in the above aspect, The plurality of LED chips each include a plurality of red LED chips emitting red wavelength light and a plurality of infrared LED chips emitting infrared wavelength light, and the red LED chips are arranged adjacent to the infrared LED chip on one line.

The present invention can provide a film thickness unevenness inspection device which ensures an amount of light effective for inspection and which is energy efficient.

1‧‧‧ Film thickness unevenness inspection device

1b‧‧‧ Film thickness unevenness inspection device

1c‧‧‧ Film thickness unevenness inspection device

2‧‧‧Lighting Department

2b‧‧‧Lighting Department

2c‧‧‧Lighting Department

2e‧‧‧Lighting Department

2f‧‧‧Lighting Department

3‧‧‧Photography Department

4‧‧‧Image Processing Department

6‧‧‧Check condition registration department

9‧‧‧Control Department

20‧‧‧Lighting unit

20c‧‧‧LED chip

20r‧‧‧Red LED chip

20ir‧‧‧Infrared LED chip

20d‧‧‧Power supply unit

21‧‧‧1st diffuser

21d‧‧‧1st actuator for thickness direction movement

22‧‧‧2nd diffuser

22d‧‧‧2nd actuator for thickness direction movement

26‧‧‧1st diffuser plate (plate thickness changes stepwise)

26d‧‧‧1st actuator for thickness change

27‧‧‧2nd diffuser plate (plate thickness changes continuously)

27d‧‧‧2nd actuator for plate thickness change

30‧‧‧Photographic components

31‧‧‧ camera camera

32‧‧‧ lens

33‧‧‧ indicates the dotted line at the perspective

B‧‧‧Brightness

F‧‧‧Resin materials

K‧‧‧Transparent materials

P‧‧‧Photography location

R‧‧‧Video area

SL0‧‧‧Brightness signal (diffusion plate fixed)

SL1‧‧‧Brightness signal (optimization of diffuser position)

SL6‧‧‧Brightness signal (diffusion plate fixation)

SL7‧‧‧Brightness signal (optimization of diffuser position)

V‧‧‧ arrow (substrate transport direction)

W‧‧‧Inspection object

Fig. 1 is a side view showing an example of a form in which the present invention is embodied.

Fig. 2 is a front view showing an example of a form in which the present invention is embodied.

Fig. 3 is a conceptual diagram of a luminance signal in an example of a form in which the present invention is embodied.

Fig. 4 is a system configuration diagram showing a third example of the embodiment of the present invention.

Fig. 5 is a conceptual diagram of a luminance signal in a third example of a form in which the present invention is embodied.

Fig. 6 is a front elevational view showing a fourth example of the embodiment of the present invention.

Fig. 7 is a front elevational view showing a sixth example of a form in which the present invention is embodied.

Fig. 8 is a conceptual diagram of a luminance signal in a sixth example of the embodiment of the present invention.

Fig. 9 is a front elevational view showing a seventh example of a form in which the present invention is embodied.

Hereinafter, the film thickness unevenness inspection apparatus 1 of the present invention will be described with reference to Fig. 1 .

In the film thickness unevenness inspection apparatus 1 , the resin material F is applied to the transparent material K as the inspection object W, and the film thickness unevenness of the resin material F is inspected.

In the figure, the horizontal direction is the X direction and the Y direction, and the conveyance direction of the inspection object W is set to the X direction, and the width direction orthogonal to the conveyance direction of the inspection object W is set to the Y direction. Further, the upward direction of gravity orthogonal to the X and Y directions is defined as the Z direction (hereinafter, the same in each drawing).

Fig. 1 is a side view showing an example of a form in which the present invention is embodied. Also, Figure 2 is A front view showing an example of a form in which the present invention is embodied.

The film thickness unevenness inspection device 1 is configured to include an illumination unit 2 and an imaging unit 3.

In the inspection object W exemplified herein, the acrylic-free glass for the liquid crystal color filter is exemplified as the transparent material K, and a black resin material (that is, resin black) is exemplified as the resin material F. Further, as the type of the resin black, a resin in which a black pigment is dispersed and blended, that is, a portion which is exposed to light by exposure to a pattern such as ultraviolet light (that is, a UV-curable acrylic resin) or a photoresist must be used. A non-photosensitive polyimide film or the like which is subjected to an etching treatment after the pattern is exposed.

The resin material F is applied to substantially the entire surface of the upper surface of the transparent material K of the inspection object W (the number of circumferences necessary for the removal operation).

The illuminating unit 2 is a person who irradiates the inspection object W with the illumination light for inspection.

The illumination unit 2 includes an illumination unit 20, a first diffusion plate 21, and a second diffusion plate 22.

The illumination unit 20 includes a box-shaped casing having a long opening in the Y direction and a plurality of LED chips 20c disposed inside the casing. The LED unit 20 causes the light emitted from the plurality of LED chips 20c to be irradiated upward from the opening of the casing as the illumination light for inspection. More specifically, a plurality of LED chips 20c are arranged in the illumination unit 20 in the Y direction.

The first diffusion plate 21 transmits light emitted from the plurality of LED chips 20c and achieves uniformity. However, this state is a state in which it is not completely uniformized.

The second diffusion plate 22 is disposed at a predetermined interval from the first diffusion plate 21, and has an air layer therebetween. The second diffusion plate 22 is formed by transmitting light from the plurality of LED chips 20c and passing through the first diffusion plate 21 to achieve uniformization.

Specifically, the first diffusion plate 21 and the second diffusion plate 22 are white translucent plastic resin having a thickness of 2.5 mm, and the interval (air layer) between the first diffusion plate 21 and the second diffusion plate 22 is set to 10 mm. . Further, the first diffusion plate 21 and the second diffusion plate 22 are subjected to a long glass-like unevenness treatment on the surface, and a smoothing treatment is applied as needed, and the penetration is provided. The characteristic of the light that is emitted and diffused (so-called diffusivity).

The imaging unit 3 is disposed at a position facing the illumination unit with the inspection object W interposed therebetween, and images the imaging area R set on the inspection object W. The imaging unit 3 includes an imaging camera 31 and a lens 32 including an imaging element 30.

The imaging camera 31 captures the surface of the resin material F of the observation object W, and captures the intensity of the light when the illumination light for inspection irradiated from the illumination unit 2 passes through the resin material F of the observation object W. Further, the imaging camera 31 is configured to observe the range of the angle of view indicated by the broken line 33.

The lens 32 is used to image the subject of the imaging region R to the imaging element 30 of the imaging camera 31. Specifically, the lens 32 can be exemplified by a convex lens or a concave lens, and the number of suitable sheets or the set position can be determined in accordance with the viewing angle or imaging characteristics.

In addition, the case where the imaging unit 3 is composed of two groups is illustrated, but it may be composed of one set or a complex array. That is, the number of groups of the observation unit 3 can be appropriately selected and arranged in accordance with the balance with the angle of view of the imaging camera 31.

Fig. 3 is a conceptual diagram of a luminance signal in an example of a form in which the present invention is embodied. In FIG. 3, the horizontal axis represents the imaging position P, and the vertical axis represents the luminance B. Fig. 3 shows the luminance signal SL0 in the previous form (in the case where the diffusion plate has a thickness of 5 mm) and the form of the invention (the case where the diffusion plate having a thickness of 2.5 mm is two sheets and the air layer is 10 mm). The brightness signal SL1.

From the comparison of the brightness signals shown in the figure, it can be judged that the unevenness of the brightness is improved by the diffusion plate having half the thickness of the sheet as compared with the previous one. Also, there is no reduction in the amount of light.

Since the film thickness unevenness inspection apparatus 1 of the present invention has such a configuration, even if the illumination unit 30 using a plurality of LED chips C is used, the amount of light can be prevented by the two diffusion plates 26 and 27 and the air layer therebetween. Reduced, and an improvement in brightness unevenness can be achieved.

(the second aspect)

In the above, the inspection object W is exemplified and the resin material F is applied to the transparent material K. However, in the case of the other resin material F1, similarly to the above-described aspect (hereinafter referred to as the first aspect), even if the number of the diffusion plates is two, there is a case where the brightness is uneven.

Therefore, in the second aspect, it is preferable to set the thickness of the first diffusion plate to be thicker than the thickness of the second diffusion plate, in addition to the configuration of the first aspect.

Specifically, the first diffusion plate 21 has a thickness of 3 mm, the second diffusion plate 22 has a thickness of 2 mm, and is made of a white translucent plastic resin, and the first diffusion plate 21 and the second diffusion plate are exemplified. The interval of 22 (air layer) is set to 10 mm.

In this case, the total thickness of the two diffusion plates 21, 22 is the same as that of the first aspect. However, the film thickness unevenness inspection apparatus according to the second aspect is configured such that the thickness of the first diffusion plate 21 close to the LED wafer C is thicker than that of the second diffusion plate 22, whereby the observation region R can be used. The amount of light is prevented from being lowered, and the improvement in brightness unevenness can be achieved.

Further, in the first aspect and the second aspect, the position of the diffusion plate is appropriately set, and depending on the type of the object to be inspected, adjustment or pre-preparation and trial processing can be appropriately performed.

(3rd aspect)

The film thickness unevenness inspection apparatus 1b of the present invention may be configured such that, in addition to the configuration of the film thickness unevenness inspection device of the first or second aspect, 1) only the first diffusion plate, 2) only In the second diffusing plate, 3) one of the first diffusing plate and the second diffusing plate, which is one of the first to third), and is provided to move in the thickness direction in which the position of the diffusing plate is adjusted in the thickness direction. Further, the device includes a check condition registration unit that registers the check condition.

Fig. 4 is a system configuration diagram showing a third example of the embodiment of the present invention, and shows a specific system configuration of the film thickness unevenness inspection device 1b. The film thickness unevenness inspection device 1b of the present invention includes an illumination unit 2b, an imaging unit 3, an inspection condition registration unit 6, and a control unit 9.

The illumination unit 2b is configured to include the first diffusion plate 21, the second diffusion plate 22, and the thickness direction. Actuator mechanism for movement.

The actuator mechanism for moving the thickness direction can adjust at least one of the first diffusion plate 21 or the second diffusion plate 22 to a set position in the thickness direction of the diffusion plate.

In the embodiment shown in FIG. 4, the first thickness direction movement actuator mechanism 21d for adjusting the position of the first diffusion plate 21 in the thickness direction (Z direction) and the second diffusion plate 22 are provided along the same The second thickness direction movement actuator mechanism 22d is adjusted in the thickness direction (Z direction).

The inspection condition registration unit 6 is configured to register the set positions of the first and second thickness direction movement actuator mechanisms 21d and 22d for each inspection type.

The control unit 9 is connected to the inspection condition registration unit 6 to which the inspection condition is registered, and is used to appropriately read the inspection condition registered in advance in the inspection condition registration unit 6. Moreover, the control unit 9 is connected to the first and second thickness direction movement actuator mechanisms 21d and 22d, and outputs a control signal to the actuator mechanisms based on the inspection conditions. Moreover, the control unit 9 controls the lighting and extinguishing of the LED chip 20C in accordance with the timing at which the image pickup unit 3 acquires an image, and is connected to the lighting drive circuit 20d that controls the amount of light emitted.

Further, the control unit 9 may be configured to be connected to the image processing unit 4, and the image processing unit 4 acquires an image acquired from the imaging unit 3 and performs image processing.

In addition, the actuator mechanism for the thickness direction movement of the present invention may be configured to include both the first thickness direction movement actuator mechanism 21d and the second thickness direction movement actuator mechanism 22d. The form of either party.

Since the film thickness unevenness inspection device 1b has such a configuration, even when the inspection target object has a plurality of types, the first diffusion plate 21 or the second diffusion plate 22 can be read by appropriately reading the inspection conditions registered in advance. The position in the Z direction is automatically set to the optimum position. Therefore, it is possible to improve the luminance unevenness depending on the type of the object to be inspected, and further, by combining with the second aspect, the multiplication effect of improving the luminance unevenness can be increased. Moreover, the type switching can be quickly performed without manual adjustment or pre-preparation and trial processing. Manual adjustment is better than positional reproducibility, so it is preferable.

(the fourth aspect)

In the film thickness unevenness inspection apparatus of the present invention, the configuration of the film thickness unevenness inspection device of the first to second aspects described above can be added as follows.

This configuration is such that 1) only the first diffusing plate, 2) only the second diffusing plate, and 3) either of the first diffusing plate and the second diffusing plate, 1) to 3), and having the diffusing plate In the cross-sectional shape in which the thickness of the plate is increased in a stepwise or stepwise manner, and the diffuser plate is provided with an actuator mechanism for changing the set position in the direction in which the thickness of the diffuser plate changes, and further includes a registration check. Condition check condition registration unit.

Fig. 5 is a front view showing a fourth example of the embodiment of the present invention, and shows a specific configuration of the illumination unit 2c of the film thickness unevenness inspection device 1c of the present invention.

Fig. 6 is a system configuration diagram showing a third example of the embodiment of the present invention, and shows a specific system configuration of the film thickness unevenness inspection device 1c. The film thickness unevenness inspection device 1c of the present invention includes an illumination unit 2c, an imaging unit 3, an inspection condition registration unit 6, and a control unit 9.

The illumination unit 2c includes an illumination unit 20, a first diffusion plate 26, a second diffusion plate 27, a first plate thickness changing actuator mechanism 26d, and a second plate thickness changing actuator mechanism 27d.

The first diffusion plate 26 has a cross-sectional shape in which the thickness of the plate is changed stepwise (that is, in a step type), and is attached to the first plate thickness changing actuator mechanism 26d. The first plate thickness changing actuator mechanism 26d is for adjusting the set position of the first diffusion plate 26, and changes the thickness of the portion through which the light emitted from the LED chip 20C passes through the first diffusion plate 26.

On the other hand, the second diffusion plate 27 has a cross-sectional shape in which the thickness of the plate is continuously changed (that is, a wedge shape), and is attached to the second plate thickness changing actuator mechanism 27d. The second plate thickness changing actuator mechanism 27d is for adjusting the setting position of the second diffusion plate 27, and changing the thickness of the portion through which the light emitted from the LED chip 20C passes through the second diffusion plate 27.

The inspection condition registration unit 6 is configured to register the set positions of the first and second thickness-changing actuator mechanisms 26d and 27d for each inspection type.

The control unit 9 is connected to the inspection condition registration unit 6 to which the inspection condition is registered, and is used to appropriately read the inspection condition registered in advance in the inspection condition registration unit 6. Further, the control unit 9 is connected to the first and second plate thickness changing actuator mechanisms 26d and 27d, and outputs a control signal to the actuator mechanisms based on the inspection conditions. Moreover, the control unit 9 controls the lighting and extinguishing of the LED chip 20C in accordance with the timing at which the image pickup unit 3 acquires an image, and is connected to the lighting drive circuit 20d that controls the amount of light emitted.

Further, the control unit 9 may be configured to be connected to the image processing unit 4, and the image processing unit 4 acquires an image acquired from the imaging unit 3 and performs image processing.

In addition, when the thickness of the actuator for changing the thickness of the present invention is changed, 1) if only the first diffusion plate is provided, only the first plate thickness changing actuator mechanism 26d is provided, and 2) In the second diffusion plate, only the second plate thickness changing actuator mechanism 27d is provided, and 3) both the first diffusion plate and the second diffusion plate are provided with both the plate thickness changing actuator mechanisms 26d and 27d.

Further, it can be combined with the form shown in the second aspect described above. Further, regarding 1) only the first diffusion plate, 2) only the second diffusion plate, and 3) both the first diffusion plate and the second diffusion plate, the thickness direction of the diffusion plate as shown in the third aspect described above may be further combined. Actuator mechanism for movement.

Since the film thickness unevenness inspection device 1c has such a configuration, even when the inspection target object has a plurality of types, the inspection conditions registered in advance can be appropriately read, and the first diffusion plate 26 or the second diffusion plate can be read. The position of the X direction of 27 is automatically set to the optimum position. Therefore, it is possible to improve the luminance unevenness depending on the type of the object to be inspected, and further, by combining with the second aspect or the third aspect, the multiplication effect of improving the luminance unevenness can be increased. Further, it is not necessary to perform manual adjustment, pre-preparation, and trial processing, and the type switching can be quickly performed, and the position reproducibility is improved as compared with the manual adjustment, which is preferable.

(5th aspect)

In the case of the film thickness unevenness inspection device of the present invention, when the object to be inspected for uneven film thickness is a black resin material (that is, resin black), the illumination units 2, 2b, and 2c can be used as described above. The illumination unit 2d is configured below. That is, a white LED or a red LED may be used as the plurality of LED chips for inspection, but it is more preferably composed of a plurality of infrared LED chips emitting infrared wavelength light.

In this case, when the film thickness unevenness is examined for a black resin material having a high light-shielding rate of visible light, the illumination light of the infrared wavelength region having a relatively high transmittance can be inspected. Further, as the imaging element 30 used in the imaging camera 31, a general-purpose product having a light-receiving sensitivity having an infrared wavelength using visible light as a main light-receiving sensitivity can be used. Alternatively, when the image pickup device 30 is used as a general-purpose product in which an infrared cut filter is mounted, the infrared cut filter can be removed and used.

Therefore, in the case where the inspection object of the film thickness unevenness is a black resin material (resin black), if a fluorescent lamp or a halogen illumination is used as the illumination light in the past, by applying the present invention, the self-infrared light can be used. The light emitted by the infrared LED acts as illumination light. Therefore, the film thickness unevenness inspection apparatus of the present invention is superior in energy efficiency as compared with the prior art. Further, by combining with any of the first to fourth aspects described above, the film thickness unevenness inspection device of the present invention can ensure the amount of light effective for inspection and can achieve uniform brightness, which is preferable.

(6th aspect)

When the black resin material (resin black), the green resin material (G resist), or the blue resin material (B resist) is mixed in the object to be examined for uneven film thickness, the film thickness is uneven in the present invention. In the inspection apparatus, the illumination units 2 to 2d can be configured as the illumination unit 2e having the following configuration.

Fig. 7 is a front elevational view showing a sixth example of a form in which the present invention is embodied.

Specifically, the illumination unit 20e of the illumination unit 2e is configured to include a plurality of infrared LED chips 20ir that emit light of an infrared wavelength and a plurality of red LED chips 20r that emit light of a red wavelength as a plurality of LED chips, and the like They are alternately arranged on one line in the Y direction.

Also, when examining the black resin material (resin black), a plurality of infrared rays are used. The LED chip 20ir is used as illumination light. On the other hand, in the case of inspecting a green resin material (G resist) or a blue resin material (B resist), a plurality of red LED chips 20r are used as illumination light. At this time, the plurality of infrared LED chips 20ir and the plurality of red LED chips 20r are arranged at the same position in the X direction.

Therefore, even in the case where a black resin material (resin black), a green resin material (G resist), or a blue resin material (B resist) is mixed in the inspection object having uneven film thickness, the self-illumination unit 20e emits The main optical axis of the illumination light and the imaging camera 31 are also not shifted in the X direction. Therefore, it is preferable to adjust the relative position of the illumination unit 20e and the imaging camera 31 or to perform pre-preparation and trial processing.

Fig. 8 is a conceptual diagram of a luminance signal in a sixth example of a form in which the present invention is embodied.

The horizontal axis represents the imaging position P, and the vertical axis represents the luminance B.

In the case of using the illumination unit 2e of the above-described embodiment, the plurality of LED chips that simultaneously emit light during the inspection are spaced apart from each other. Therefore, as indicated by the luminance signal SL6, luminance unevenness is likely to occur.

However, by combining with the above first aspect, as shown by the luminance signal SL7, luminance unevenness is improved. Therefore, it is preferable to ensure the amount of light effective for inspection and to achieve uniformity of brightness. Further, by combining with any of the second to fourth aspects described above, the multiplication effect of the improvement in luminance unevenness is achieved.

(7th aspect)

In the case where a high-density black resin material (resin black), a green resin material (G resist), or a blue resin material (B resist) is mixed in the object to be examined for uneven film thickness, the film of the present invention is used. In the thickness unevenness inspection device, the illumination units 2 to 2d can be configured as the illumination unit 2f having the following configuration.

Fig. 9 is a front elevational view showing a seventh example of a form in which the present invention is embodied.

Specifically, the illumination unit 20f of the illumination unit 2f is configured to include a plurality of infrared LED chips 20ir that emit light of an infrared wavelength and a plurality of reds that emit light of a red wavelength. The LED chips 20r are arranged adjacent to each other in the Y direction. More specifically, a state in which the infrared LED chip 20ir and the red LED chip 20r are alternately arranged one by one is exemplified, and the configuration is such that two or one interleaving or two two interlacing are arranged.

Further, in the case of inspecting a high concentration of a black resin material (resin black), a plurality of infrared LED chips 20ir are used as illumination light. On the other hand, in the case of inspecting a green resin material (G resist) or a blue resin material (B resist), a plurality of red LED chips 20r are used as illumination light. At this time, the plurality of infrared LED chips 20ir and the plurality of red LED chips 20r are arranged at the same position in the X direction.

Therefore, even in the case where a high-density black resin material (resin black), a green resin material (G resist), or a blue resin material (B resist) is mixed in the inspection object having uneven film thickness, self-illumination is performed. The main optical axis of the illumination light emitted by the unit 20e and the imaging camera 31 are also not shifted in the X direction. Therefore, it is preferable to adjust the relative position of the pre-preparation and trial processing illumination unit 20e and the camera camera 31.

Moreover, in the case where the form of the LED chip is arranged in this manner, since the LEDs that emit light are spaced apart from each other, the luminance unevenness is more likely to occur. However, by combining with the above first, the luminance unevenness is improved. Therefore, it is preferable to ensure the amount of light effective for inspection and to achieve uniformity of brightness. Further, by combining with any of the second to fourth aspects described above, the multiplication effect of the improvement in luminance unevenness is achieved.

1‧‧‧ Film thickness unevenness inspection device

2‧‧‧Lighting Department

3‧‧‧Photography Department

20‧‧‧Lighting unit

20c‧‧‧LED chip

21‧‧‧1st diffuser

22‧‧‧2nd diffuser

30‧‧‧Photographic components

31‧‧‧ camera camera

32‧‧‧ lens

F‧‧‧Resin materials

K‧‧‧Transparent materials

V‧‧‧ arrow (substrate transport direction)

W‧‧‧Inspection object

Claims (11)

A film thickness unevenness inspection device which is characterized in that the thickness of the resin material of the inspection object coated with the resin material on the transparent substrate is uneven, and includes an illumination portion facing the inspection object Illumination light for inspection of the object; and an imaging unit disposed at a position facing the illumination unit across the inspection object; the illumination unit including: a plurality of LED chips, a first diffusion plate, and a second diffusion plate Providing an air layer between the first diffusion plate and the second diffusion plate, and the light emitted from the plurality of LED chips sequentially passes through the first diffusion plate, the air layer, and the second diffusion plate, and is irradiated The object to be inspected as described above. The film thickness unevenness inspection device according to claim 1, wherein the thickness of the first diffusion plate is set to be thicker than the thickness of the second diffusion plate. The film thickness unevenness inspection device according to claim 2, wherein at least one of the first diffusion plate or the second diffusion plate includes a thickness direction movement actuator mechanism, and the first diffusion plate or the first diffusion plate 2: The diffusion plate is adjusted in the thickness direction; and the inspection condition registration unit registers the inspection condition; and the inspection condition registration unit registers the set position of the thickness direction movement actuator mechanism for each inspection type. The film thickness unevenness inspection device according to claim 1, wherein at least one of the first diffusion plate or the second diffusion plate includes a thickness direction movement actuator mechanism, and the first diffusion plate or the first diffusion plate (2) the diffusion plate is adjusted in the thickness direction; and the inspection condition registration unit registers the inspection condition; and the inspection condition registration unit registers the thickness direction shift for each inspection type. The set position of the actuator mechanism is used. The film thickness unevenness inspection device according to claim 1, wherein at least one of the first diffusion plate or the second diffusion plate has a cross-sectional shape in which the thickness is continuously or stepwise, and the first diffusion plate Or the second diffusion plate includes: an actuator mechanism for changing the thickness of the first diffusion plate or the second diffusion plate, wherein the set position is adjusted in a direction in which the thickness of the first diffusion plate or the second diffusion plate changes; and an inspection condition registration unit; In the inspection condition registration unit, the setting position of the above-described plate thickness changing actuator mechanism is registered for each inspection type. The film thickness unevenness inspection device according to claim 2, wherein at least one of the first diffusion plate or the second diffusion plate has a cross-sectional shape in which the thickness is continuously or stepwise, and the first diffusion plate Or the second diffusion plate includes: an actuator mechanism for changing the thickness of the first diffusion plate or the second diffusion plate, wherein the set position is adjusted in a direction in which the thickness of the first diffusion plate or the second diffusion plate changes; and an inspection condition registration unit; In the inspection condition registration unit, the setting position of the above-described plate thickness changing actuator mechanism is registered for each inspection type. The film thickness unevenness inspection device according to claim 3, wherein at least one of the first diffusion plate or the second diffusion plate has a cross-sectional shape in which the thickness is continuously or stepwise, and the first diffusion plate Or the second diffusion plate includes: an actuator mechanism for changing the thickness of the first diffusion plate or the second diffusion plate, wherein the set position is adjusted in a direction in which the thickness of the first diffusion plate or the second diffusion plate changes; and an inspection condition registration unit; condition; The inspection condition registration unit registers the set position of the above-described plate thickness changing actuator mechanism for each inspection type. The film thickness unevenness inspection device according to claim 4, wherein at least one of the first diffusion plate or the second diffusion plate has a cross-sectional shape in which the thickness is continuously or stepwise, and the first diffusion plate Or the second diffusion plate includes: an actuator mechanism for changing the thickness of the first diffusion plate or the second diffusion plate, wherein the set position is adjusted in a direction in which the thickness of the first diffusion plate or the second diffusion plate changes; and an inspection condition registration unit; In the inspection condition registration unit, the setting position of the above-described plate thickness changing actuator mechanism is registered for each inspection type. The film thickness unevenness inspection device according to any one of claims 1 to 8, wherein the plurality of LED chips are a plurality of infrared LED chips emitting infrared wavelength light. The film thickness unevenness inspection device according to any one of claims 1 to 8, wherein the plurality of LED chips are provided with a plurality of infrared LED chips emitting infrared wavelength light and a plurality of red LED chips emitting red wavelength light, The infrared LED chip and the red LED chip are alternately arranged on one line. The film thickness unevenness inspection device according to any one of claims 1 to 8, wherein the plurality of LED chips are provided with a plurality of infrared LED chips emitting infrared wavelength light and a plurality of red LED chips emitting red wavelength light, The infrared LED chip is disposed on one line adjacent to the red LED chip.