TW201447047A - Substrate plating device - Google Patents

Abstract

The purpose of the present invention is to provide a plating device, whereby it becomes possible to increase the flow rate of a plating solution and to make the flow rate of the plating solution to become uniform in an area located between the bottom of a plating bath and the solution level of the plating solution without the need of providing a circulating pump at the outside of the plating bath, and therefore it becomes possible to form a plating film having a uniform thickness over the entire area of a substrate and to perform the plating procedure at a high deposition rate. A plating device equipped with a plating bath in which a plating solution is to be placed, a substrate holder which can hold a substrate in such a manner that the substrate can be detached freely, an anode which is arranged so as to face the substrate that is held by the substrate holder, a rail part which is arranged above the plating bath in parallel to the substrate holder, and a paddle which is held by the rail part in a suspended state and can reciprocate along the rail part, said plating device being characterized in that the paddle is provided with a vane part in a suspended state, wherein the vane part is rotatable about the axis of the paddle or is povitable around the axis.

Description

Substrate plating device

The present invention relates to a plating apparatus which immerses a substrate in a plating solution and performs plating on the surface of the substrate.

Conventionally, in a plating apparatus for a semiconductor substrate in which a plating fixture for holding a substrate is vertically provided and a plating solution is poured from a bottom surface of a plating tank and overflows from the surface, it is known that a plating fixture can be provided. A paddle that reciprocates from the anode, and the plating solution is uniformly supplied to all areas of the plated surface of the substrate during the plating process.

In the case where the stirring blade is used for the stirring, the substrate is held by the plating fixture, and the stirring blade is reciprocated while being plated. However, the direction of the liquid flow is opposite to the traveling direction of the stirring blade, and there is a flow due to the flow. The direction becomes an issue that alternates and cannot accelerate the flow velocity on the surface.

For this reason, Patent Document 1 discloses a plating apparatus that vortexes a plating solution supplied from a lower portion of a plating tank by a vortex generator that vortexes a plating solution.

However, in the case of the plating apparatus, it is necessary to provide a circulation pump for sending the plating liquid to the vortex generator outside the plating tank, except for the space change. In addition, since the plating liquid is supplied to the vortex generator from the lower portion of the plating tank, it is difficult to make the flow velocity uniform in the upper and lower sides of the surface to be plated.

[Patent Document 1] Japanese Patent Laid-Open No. 2004-345066

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an overcoming of the above-mentioned disadvantages of the conventional plating apparatus which can increase the flow rate of the plating solution without providing a circulation pump outside the plating tank, and the flow rate from the bottom of the plating tank to the liquid surface. In the same manner, as a result, a plating apparatus having a uniform plating thickness and a rapid deposition rate can be applied over the entire area of the substrate.

In order to solve the above problems, the present invention provides a plating apparatus including: a plating tank for accommodating a plating solution; a substrate holder for detachably holding the substrate; and a substrate held by the substrate holder a relatively disposed anode; a rail portion that is stretched over the plating tank in a manner parallel to the substrate holder; and a stirring paddle that is supported by the rail portion and reciprocally movable along the rail portion In the plating apparatus, a wing portion that is rotatable or freely rotatable about a shaft portion is provided in the stirring paddle.

The plating apparatus of the present invention is provided with a freely rotatable or rotatable wing portion of a stirring paddle that can reciprocate along the rail portion, thereby adjusting the flow velocity or direction against the substrate, and the entire substrate flows smoothly. Evenly and evenly, the thickness of the plating film can be made uniform.

Further, in the plating apparatus of the present invention, the flow of the vicinity of the surface to be plated of the substrate of the stirring blade is constantly rotated in a certain direction in a single direction, and the flow can be quickly increased with a small amount of power. Touch the surface of the substrate.

Further, in the plating apparatus of the present invention, the wing portion of the stirring blade is rotated (oscillated) within a predetermined angle range, and the liquid flow vertically abuts against the plated surface of the substrate W, and flows over the substrate W. Fully offset, so plating can be performed uniformly.

1‧‧‧ plating tank

2‧‧‧Substrate holder

3‧‧‧Anode

4‧‧‧Agitating paddle

5‧‧‧Roads

41‧‧‧ wing

42‧‧‧Axis

43‧‧ ‧Motor Department

44‧‧‧Support Department

45‧‧‧ Coverage

W‧‧‧Substrate

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic plan view of a plating apparatus of the present invention.

Fig. 2 is a schematic cross-sectional view showing a plating apparatus of the present invention.

Figure 3 is a schematic plan view of a different embodiment of the plating apparatus of the present invention.

Figure 4 is a schematic cross-sectional view showing a different embodiment of the plating apparatus of the present invention.

Fig. 5 (a) is a front view showing an embodiment of a stirring blade of the plating apparatus of the present invention, and (b) is a cross-sectional view showing an embodiment of a stirring blade of the plating apparatus of the present invention.

Hereinafter, an embodiment of the plating apparatus of the present invention will be specifically described based on the drawings. However, the invention is not limited in any way by these embodiments.

1 is a schematic plan view of a plating apparatus of the present invention, and FIG. 2 is a schematic front view of a plating apparatus of the present invention. As shown in the figure, the plating apparatus of the present invention includes a plating tank 1 for accommodating a plating solution, a substrate holder 2 for detachably holding a substrate, and a substrate W held by the substrate holder 2 And the rail portion 5 that is disposed above the plating tank 1 in parallel with the substrate holder 2; and is supported by the rail portion 5 and along the rail portion 5 The stirring paddle 4 that moves back and forth. Each member will be described below.

As shown in the figure, the rail portion 5 is placed above the plating tank 1 so as to be parallel to the substrate holder 2, and is between the substrate holder 2 and the anode 3. Next, the rail portion 5 is suspended and supported by a stirring blade 4 having a driving means (not shown) for reciprocating left and right along the rail portion 5. The agitating paddle 4 includes a motor 43 as a rotational driving means for the wing portion 41, and has a shaft portion 42 that is rotatably suspended in conjunction with the motor 43.

The two wing portions 41 that protrude in opposite directions are formed in the shaft portion 42 of the stirring blade 4, and are rotatably provided by the rotational force transmitted from the motor 43 through the shaft portion 42. In this embodiment, the wing portion 41 is formed in a rectangular cross section, but may be formed as an impeller. The direction of rotation of the rotation has a concave arc shape. By providing the concave surface, the wing portion 41 can efficiently collect the plating solution to increase the flow rate. Further, the number of the wings 41 is not particularly limited, but two are preferable. Further, it is preferable that the width of the wing portion 41 (the length in the vertical direction on the drawing) is at least the width of the height of the plated surface on which the lid substrate W can be covered.

The agitating paddle 4 of the present embodiment reciprocates back and forth along the rail portion 5, but at this time, the wing portion 41 constantly rotates in a single direction. For example, in the aspect of Fig. 1, the wing portion 41 is constantly rotated in a clockwise manner while the agitating paddle 4 is reciprocating. As described above, regardless of the traveling direction of the stirring blade 4, the rotation direction of the wing portion 41 is constant, and the liquid flow in the vicinity of the plated surface of the substrate W becomes a single direction, and the power can be reduced with less power. The liquid flow is at high speed against the surface of the substrate.

3 and 4 show a second embodiment of the plating apparatus of the present invention. The second embodiment is the same as the first embodiment in that the agitating paddle 4 supported by the rail portion 5 that is suspended above the plating tank 1 is reciprocally supported. Next, in the second embodiment, the features are as follows. That is, in the present embodiment, the wing portion 41 of the agitating paddle 4 is set to be within a predetermined angular range, and is rotatably (swinged) by the motor 43. Specifically, the wing portion 41 provided by the shaft portion 42 protruding in the direction of the substrate W is rotated to the left and right by a position at a right angle with respect to the substrate W as indicated by an arrow in the figure. At this time, the rotation angle of the wing portion 41 is not particularly limited, but is preferably set at 30 to 90 degrees in order to generate a liquid flow with a minimum of power efficiency (single with respect to a perpendicular to the substrate W) The range of 15 degrees to 45 degrees on the side is better. Further, the number of the wings 41 is not limited. However, if the number is increased, useless liquid flow is generated, so that it is preferable to set one as shown.

As described above, in the second embodiment, the wing portion 41 is rotated in a predetermined angular range, and the agitating paddle 4 is reciprocated to the left and right along the rail portion 5, so that the liquid flow vertically abuts against the substrate. Since the surface of W is plated, and the liquid flow is completely in contact with the substrate W, the plating treatment can be performed uniformly.

However, in the plating apparatus of the second embodiment, the stirring blade 4 may be moved while keeping the wing portion 41 unrotated while maintaining the traveling direction of the stirring blade 4 at a constant angle. According to this method, since the liquid flow can be efficiently brought into contact with the surface to be plated of the substrate W, the plating treatment can be uniformly performed with less power.

Further, in the plating apparatus of the second embodiment, the wing portion 41 can be held in a freely rotatable manner, and the stirring paddle 4 is provided with a stopper for restricting the rotation angle of the wing portion 41 within a predetermined range. Pieces. In this aspect, since the resistance of the liquid to the wing portion 41 changes in accordance with the traveling direction of the stirring blade 4, the direction and angle of the wing portion 41 are changed and held in accordance with the movement of the stirring blade 4. Thereby, since the liquid flow can be efficiently contacted against the surface to be plated of the substrate W, the plating treatment can be performed uniformly with less power.

Fig. 5 is a view showing a different embodiment of the stirring paddle of the plating apparatus of the present invention. The agitating paddle system of the present embodiment is called a so-called cross-flow impeller type, and between the upper and lower disc-shaped support portions 44, two wings The portion 41 is symmetrically suspended across the rotating shaft portion. The wing portion 41 is formed to be rotatable as a rotation axis of the shaft portion 42 of the support portion 44 that is connected to the upper portion. Further, the agitating paddle 4 of the present embodiment is provided with a covering portion 45 that is curved in a semicircular shape along a side surface facing the anode 3 side. As described above, by forming the agitating paddle of the plating apparatus of the present invention into a cross-flow impeller type, the flow penetrates all over the substrate W, so that the plating treatment can be performed uniformly.

1‧‧‧ plating tank

2‧‧‧Substrate holder

3‧‧‧Anode

4‧‧‧Agitating paddle

5‧‧‧Roads

41‧‧‧ wing

42‧‧‧Axis

W‧‧‧Substrate

Claims (5)

A plating apparatus comprising: a plating tank for accommodating a plating solution; a substrate holder for detachably holding the substrate; and an anode disposed to face the substrate held by the substrate holder; a railing device that is erected in a parallel manner above the plating tank; and a plating device that is suspended and supported by the stirring blade that is reciprocally movable along the rail portion, and is characterized in that The agitating paddle is provided with a wing portion that is rotatable or freely rotatable about the shaft portion. A plating apparatus according to claim 1, wherein the wing portion is constantly rotated in a single direction by a driving means. A plating apparatus according to claim 1, wherein the wing portion is rotated by a driving means within a predetermined angle range. The plating apparatus according to the first aspect of the invention, wherein the shaft portion of the support portion that is connected to the upper portion is rotatably formed as a rotating shaft and has a disk shape that is vertically suspended. a set of wings between the support sections. The plating apparatus of claim 4, wherein the agitating paddle is provided with a covering portion that is bent in a semicircular shape along the side surface.