JP2003328197A - Stirring apparatus for plating solution - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stirring apparatus for a plating solution capable of applying a uniform plating treatment even to substrate products having blind via holes in particular by enhancing stirring efficiency of the plating solution and making the current density of the plating solution uniform. <P>SOLUTION: Bladed stirring members 6 having perpendicular stirring elements 7 are interposed between the substrate products W put into the plating solution and anodes. The stirring elements 7 of the members 6 are linearly oscillated back and forth to a direction opposite from the forward and backward linear oscillation of the substrate products so as to traverse the entire transverse width of the substrate surfaces of the substrate products along the neighborhood of the substrate surfaces with respect to the substrate products W under the forward and backward linear oscillation. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a stirrer for a plating solution in a plating apparatus.

[0002]

2. Description of the Related Art A cathode swing method is known as an example of a stirrer for a plating solution in a plating apparatus. In this cathode swing method, a cathode (work) supported in a suspended state by a jig is horizontally moved in a plating solution in a plating tank by reciprocating linearly moving the cathode bar in a horizontal direction. It is designed to reciprocate linearly in the direction.

[0003]

However, since the cathode swing method simply swings the cathode (workpiece) back and forth in the plating solution in the horizontal direction, the stirring efficiency of the plating solution is inferior. Therefore, it is difficult to make the current density of the plating solution uniform and to perform uniform plating treatment on the product. In particular, according to the conventional cathode oscillating method, it has been difficult to apply a uniform plating treatment to a substrate product having a so-called blind via hole having a recess formed on the substrate surface.

The stirrer for a plating solution provided by the present invention enhances the stirring efficiency of the plating solution and makes the current density of the plating solution uniform so that the substrate product can be uniformly plated. In particular, the present invention makes it possible to perform uniform plating treatment even on a substrate product having a blind via hole.

[0005]

An agitator for a plating solution according to the present invention as set forth in claim 1 is supported by a cathode bar in a state of being suspended in a horizontal posture parallel to the cathode bar via a jig, A substrate product placed in a plating solution in a plating tank, an anode placed in the plating solution in the plating tank and arranged to face the substrate surface of the substrate product, and in parallel with the cathode bar. A stirring member with blades, which is supported by a supporting bar provided in a suspended state, is interposed between the substrate product and the anode, and has a vertical stirring blade that is disposed to face and face the substrate surface of the substrate product. And horizontally reciprocating the cathode bar horizontally in the lateral direction by horizontally reciprocating the cathode bar in the axial direction. And the above By interlocking with the reciprocating linear movement of the pole bar, the supporting bar is reciprocating linearly moving in the same horizontal direction and in the opposite direction to the cathode bar, whereby the stirring member with blades supported by the supporting bar in a suspended state. In the direction opposite to the reciprocating linear swing of the substrate product so as to cross the entire lateral width of the substrate surface along the vicinity of the substrate surface of the substrate product with respect to the substrate product in the reciprocating linear swing of the vertical stirring blade. It is configured to reciprocate linearly.

The plating solution agitator of the present invention as defined in claim 2 is supported by a cathode bar in a state of being suspended in a horizontal posture parallel to the cathode bar through a jig, and is installed in a plating tank. A substrate product placed in a plating solution, an anode placed in the plating solution in the plating tank and arranged to face the substrate surface of the substrate product, and a cathode product arranged in parallel with the cathode bar. A winged stirring member that is supported by a support bar in a suspended state, is interposed between the substrate product and the anode, and has a vertical stirring blade that is disposed to face and face the substrate surface of the substrate product. By vertically reciprocally moving the support bar horizontally in the axial direction, the vertical stirring blade of the bladed stirring member supported by the support bar in a suspended state is moved along the substrate surface of the substrate product in the plating solution. Reciprocating linear swing in the horizontal direction The stirring member with blades, the stirring blade supporting member supported in a suspended state on the support bar, and the stirring blade supporting member vertically pivoted to the stirring blade supporting member, with respect to the substrate surface of the substrate product. And a plate-shaped vertical stirring blade configured to be rotatably restricted in an inverted C-shaped angle range, when the resistance surface of the vertical stirring blade is linearly oscillated back and forth in the plating solution. In addition, due to the resistance of the plating solution, the forward and backward movements are configured so as to have opposite inclinations within an inverted C-shaped angle range.

The stirrer according to claim 2 is applied to a substrate product to be plated, which is placed in a stationary state in a plating solution in a plating tank. It is also applied to a so-called carrier transfer type plating device that allows a substrate product supported in a suspended state in a horizontal position parallel to the cathode bar to be plated horizontally in a plating solution in a plating tank while being horizontally advanced. it can.

The stirrer for plating solution of the present invention according to claim 3 is the stirrer according to claim 1, wherein the stirring member with blades is limited. , A stirring blade supporting member supported in a suspended state by the supporting bar, and pivotally mounted vertically to the stirring blade supporting member, and freely rotatable in an inverted C-shaped angle range with respect to the substrate surface of the substrate product. And a plate-shaped vertical stirring blade configured so as to be regulated in accordance with the above, and when the resistance surface of the vertical stirring blade is linearly oscillated back and forth in the plating solution, the forward and backward movements are caused by the resistance of the plating solution. And are configured so as to have opposite inclinations within the inverted C-shaped angle range.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described with reference to the drawings. 1 is a schematic front view showing the stirring device of the present invention, FIG. 2 is a schematic plan view showing the stirring device of the present invention, FIG. 3 is a schematic side view showing the stirring device of the present invention, and FIG. 4 is the present invention. FIG. 3 is an enlarged plan view of an essential part showing the stirring device of FIG. 1 to 4, the stirring device according to claim 1 and the stirring member with blades limited to claim 3 are shown.

The stirring device of the present invention comprises a cathode bar 1 and a jig 2
A substrate product (W) which is supported in a state of being suspended in a horizontal posture parallel to the cathode bar 1 via a substrate and is a cathode contained in the plating solution (A) in the plating tank 3, and the plating tank 3 An anode 4 placed in the plating solution (A) inside and disposed on both sides of the substrate of the substrate product (W) so as to face each other, and arranged on both sides of the cathode bar 1 in parallel with the cathode bar 1. Each of the two support bars 5 provided is supported in a suspended state and interposed between the substrate product (W) and the anode 4.
The substrate bar of the substrate product (W) is provided with a blade stirring member 6 having vertical stirring blades 7 arranged so as to face each other, and the cathode bar 1 is horizontally reciprocated linearly in the axial direction. Thus, the substrate product (W) supported by the cathode bar 1 in a horizontally suspended state is configured to horizontally reciprocate linearly in the horizontal direction, and
The support bar 5 is supported in a suspended state by the reciprocating linear movement of the supporting bar 5 in the same horizontal direction as the cathode bar 1 but in the opposite direction in conjunction with the reciprocating linear movement of the cathode bar 1. Vertical stirring blade 7 of stirring member 6 with blades
With respect to the substrate product (W) undergoing reciprocating linear swing, the reciprocating linear swing of the substrate product (W) along the vicinity of the substrate surface of the substrate product (W) across the entire lateral width of the substrate product (W). It is constructed so as to reciprocate linearly in the opposite direction to the motion. The substrate product (W) and the vertical stirring blade 7 are reciprocally linearly oscillated in the opposite directions at the same oscillating speed at the same oscillating stroke.
As shown in FIG. 4, the substrate product (W) on the right side is moved to the left and at the same time the vertical stirring blade 7 on the left side moves along the substrate surface of the moving substrate product (W). The substrate product (W) that has been moved to the right across the entire width and moved to the left is again moved to the right, and at the same time the vertical stirring blade 7 that has been moved to the right is moving again. It is moved leftward along the substrate surface of (W) so as to traverse the entire width of the substrate surface, and such reciprocating linear swing is continued. As shown in FIG. 3, the vertical stirring blade 7 is formed by vertically extending the stirring blade to a length exceeding the vertical width of the substrate product (W).

A swing drive device 1 for linearly moving the cathode bar 1 and the support bar 5 in the same horizontal direction and in opposite directions.
In this embodiment, the crank mechanism that changes the rotary motion into the reciprocating linear motion is used. A rotary body (crank arm) 13 fixed to a drive shaft 12 connected to a rotary shaft of a motor 11 and a roller 14a rotatably supported by a machine frame (not shown) horizontally reciprocally supported linearly. Connecting rod 1 with one end side of the cathode bar 1
The cathode bar 1 is linearly reciprocally moved in a horizontal direction with a constant stroke at a constant speed by linking with each other via 5a and rotating the rotating body (crank arm) 13 at a constant speed. Further, a rotary body (crank arm) 13 fixed to the driving shaft 12 and rollers 14b arranged in parallel on both sides of the cathode bar 1 and rotatably supported by a machine frame (not shown) horizontally reciprocate. One end of the support bar 5 supported so as to be linearly movable is linked to each other through a connecting rod 15b, and the support bar 5 is fixed by rotating the rotating body (crank arm) 13 at a constant speed. The stroke is linearly moved back and forth horizontally at a constant speed. The cathode bar 1 and the support bar 5 are respectively connected to the connecting rods 15a and 15b at symmetrical positions displaced by 180 degrees with respect to the rotation circumference (C) of each rotating body (crank arm) 13 fixed to the coaxial driving shaft 12. The cathode bar 1 and the support bar 5 are configured to be linearly reciprocated in conjunction with each other so that when the cathode bar 1 or the support bar 5 moves forward, the other moves backward. In addition,
The oscillating drive device is not limited to the device of the illustrated embodiment, and another mechanism for converting a rotary motion into a reciprocating linear motion can be used, and in addition, for example, a reciprocating linear drive by an air cylinder can also be used. .

In this embodiment, the stirring member 6 with blades is supported by the supporting bar 5 in a suspended state, and the stirring blade supporting member 20 is vertically mounted on the stirring blade supporting member 20 in a vertical state. A plate-shaped vertical stirring blade 7 configured to be rotatably restricted in an inverted C-shaped angle range with respect to the substrate surface of the product (W), and the resistance surface of the vertical stirring blade 7 Is reciprocally swung in the plating solution (A), the resistance of the plating solution causes the forward and backward movements to have opposite inclinations in an inverted C-shaped angular range. Specifically, as shown in FIGS. 3 and 4, a round shaft 22 is rotatably supported in a vertically standing state by a support shaft 21 vertically provided on the stirring blade support member 20. The plate-shaped vertical stirring blade 7 is fixed to the round pipe 22 that functions as this pivot. As described above, the vertical stirring blade 7 is formed by vertically extending the stirring blade to a length exceeding the vertical width of the substrate product (W). In the figure, reference numeral 23
Indicates a stopper for restricting the rotation range of the vertical stirring blade 7 to an inverted C-shaped angle range. As shown in FIG. 4, when the resistance surface of the vertical stirring blade 7 is linearly oscillated back and forth in the plating solution (A), the vertical stirring blade 7 moves forward due to the resistance of the plating solution. It is configured so that the backward movement and the reverse inclination occur within the inverted C-shaped angular range. That is, as shown in FIG. 4, the vertical stirring blade 7 on the left side is
When it is moved to the right, it has an inclination shown by the solid line due to the resistance of the plating solution, and conversely, when the vertical stirring blade 7 on the right side is moved to the left, it is the reverse shown by the dashed line due to the resistance of the plating solution. It is configured to be inclined. As described above, according to the vertical stirring blade 7 of this embodiment, the vertical stirring blade 7 is swung along the substrate surface near the substrate surface of the substrate product (W) as if it were fan-shaped. Therefore, the stirring efficiency can be increased. The stirring member 6 with blades placed in the plating solution is made of a non-conductive plastic material.

Reference numeral 30 in FIG. 3 is a guide for preventing the jig 2 (that is, the substrate product W supported by the jig 2) from shaking.

[0014]

EXAMPLE The substrate product (W) and the vertical stirring blade 7 shown in the drawings have a swing stroke of about 300 mm and a swing speed of 15 to 30 m / min.

[0015]

According to the stirrer of the present invention as set forth in claim 1, the vertical stirring blade of the stirring member with blades is close to the substrate surface of the substrate product with respect to the substrate product which is reciprocating linearly swinging. Since it is configured so as to traverse the entire lateral width of the substrate surface along the reciprocating linear reciprocal swing of the substrate product, the stirring efficiency of the plating solution is increased, Since the current density of is uniformized, it is possible to perform uniform plating treatment on the substrate product. Moreover, the swinging stroke of the vertical stirring blade can be halved due to so-called cross swinging in which the vertical stirring blades swing in opposite directions.

According to the agitating member with blades of the agitator according to the second or third aspect, when the resistance surface of the vertical agitating blade is linearly oscillated back and forth in the plating solution, it is moved forward by the resistance of the plating solution. The vertical stirring blade is fanned by a fan along the substrate surface near the substrate surface of the substrate product, since the vertical stirring blade is configured to have the opposite inclination in the inverted C-shaped angle range. Thus, the stirring efficiency can be increased.

[Brief description of drawings]

FIG. 1 is a schematic front view showing a stirring device of the present invention.

FIG. 2 is a schematic plan view showing a stirring device of the present invention.

FIG. 3 is a schematic side view showing a stirring device of the present invention.

FIG. 4 is an enlarged plan view of an essential part showing a stirring device of the present invention.

[Explanation of symbols]

1 cathode bar 2 jigs 3 plating tank 4 anode 5 Support bar 6 Stirrer with blade 7 Vertical stirring blade 10 Swing drive device A plating solution W board products

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akiko Hirano             Hitachi A 4-5 Kashiwara, Ishioka-shi, Ibaraki             Icy Corporation (72) Inventor Yuushi Ushiyama             Hitachi A 4-5 Kashiwara, Ishioka-shi, Ibaraki             Icy Corporation (72) Inventor Yosuke Kato             Hitachi A 4-5 Kashiwara, Ishioka-shi, Ibaraki             Icy Corporation (72) Inventor Yosuke Okubo             Hitachi A 4-5 Kashiwara, Ishioka-shi, Ibaraki             Icy Corporation

Claims (3)

[Claims] 1. A substrate product, which is supported by a cathode bar in a state of being suspended in a horizontal posture parallel to the cathode bar through a jig, and is placed in a plating solution in a plating tank, and a substrate product in the plating tank. An anode placed in a plating solution and disposed facing the substrate surface of the substrate product, and a support bar disposed in parallel with the cathode bar are supported in a suspended state to support the substrate product and the anode. A blade-equipped stirring member having a vertical stirring blade disposed so as to face each other in the vicinity of the substrate surface of the substrate product, and the cathode bar is linearly reciprocated horizontally in the axial direction, The substrate product, which is supported by the cathode bar in a suspended state in a horizontal position, is configured to horizontally reciprocate linearly in a horizontal direction, and
The bladed stirring member supported in a suspended state on the support bar by reciprocating linearly moving the supporting bar in the same horizontal direction as the cathode bar and in the opposite direction in conjunction with the reciprocating linear movement of the cathode bar. Opposite to the reciprocating linear swing of the substrate product so as to traverse the entire lateral width of the substrate surface along the vicinity of the substrate surface of the substrate product with respect to the substrate product during the reciprocating linear swing of the vertical stirring blade of A stirrer for a plating solution, characterized in that the stirrer is reciprocally swung in a straight line. 2. A substrate product, which is supported by a cathode bar in a horizontal posture parallel to the cathode bar via a jig and is placed in a plating solution in a plating tank, and a substrate product in the plating tank. An anode placed in a plating solution and disposed facing the substrate surface of the substrate product, and a support bar disposed in parallel with the cathode bar are supported in a suspended state to support the substrate product and the anode. A winged stirring member having a vertical stirring wing disposed so as to face each other in the vicinity of the substrate surface of the substrate product, and the support bar is linearly reciprocated horizontally in the axial direction, A vertical stirring blade of the stirring member with blades supported in a suspended state on the support bar is configured to reciprocate linearly in the plating solution in the horizontal direction along the substrate surface of the substrate product; Attach the bladed stirring member to the support bar. A stirring blade supporting member supported in a hanging state, and vertically installed on the stirring blade supporting member so that the stirring blade supporting member is rotatably restricted in an inverted C-shaped angle range with respect to the substrate surface of the substrate product. And a plate-shaped vertical stirring blade configured as described above, and when the resistance surface of the vertical stirring blade is linearly oscillated back and forth in the plating solution, the resistance of the plating solution causes the forward and reverse movements to form an inverted C-shape. A stirrer for a plating solution, wherein the stirrer is configured to have an opposite inclination within a range of angular angles. 3. The stirring device according to claim 1, wherein the stirring member with blades is supported by the supporting bar in a suspended state, and the stirring member is vertically installed on the stirring blade support member in a vertical state. , A plate-shaped vertical stirring blade configured to be rotatably restricted in an inverted C-shaped angle range with respect to the substrate surface of the substrate product, and the resistance surface of the vertical stirring blade is plated. Stirring of the plating solution, characterized in that when the solution is swung back and forth in a straight line, the resistance of the plating solution causes the forward and backward movements to have opposite inclinations within an inverted C-shaped angle range. apparatus.