CN105209670A - Substrate plating device - Google Patents
Substrate plating device Download PDFInfo
- Publication number
- CN105209670A CN105209670A CN201480026900.1A CN201480026900A CN105209670A CN 105209670 A CN105209670 A CN 105209670A CN 201480026900 A CN201480026900 A CN 201480026900A CN 105209670 A CN105209670 A CN 105209670A
- Authority
- CN
- China
- Prior art keywords
- plating
- substrate
- blade
- plating apparatus
- substrate holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Abstract
The purpose of the present invention is to provide a plating device, whereby it becomes possible to increase the flow rate of a plating solution and to make the flow rate of the plating solution to become uniform in an area located between the bottom of a plating bath and the solution level of the plating solution without the need of providing a circulating pump at the outside of the plating bath, and therefore it becomes possible to form a plating film having a uniform thickness over the entire area of a substrate and to perform the plating procedure at a high deposition rate. A plating device equipped with a plating bath in which a plating solution is to be placed, a substrate holder which can hold a substrate in such a manner that the substrate can be detached freely, an anode which is arranged so as to face the substrate that is held by the substrate holder, a rail part which is arranged above the plating bath in parallel to the substrate holder, and a paddle which is held by the rail part in a suspended state and can reciprocate along the rail part, said plating device being characterized in that the paddle is provided with a vane part in a suspended state, wherein the vane part is rotatable about the axis of the paddle or is povitable around the axis.
Description
Technical field
The present invention relates to plating apparatus substrate proofing being carried out in plating solution plating at substrate surface.
Background technology
In the past, there will be a known and arrange at the plating fixture vertical by maintaining substrate, make plating solution by plating coating groove bottom surface flow into and from the semiconductor substrate plating apparatus of overflow above, be provided with can between plating fixture and anode reciprocating blade (paddle), plating solution to be supplied to equably all zones of the plated flush coat of substrate in plating process.
When utilizing the stirring of this blade, plating fixture is utilized to keep substrate, one side makes blade to-and-fro movement one side carry out plating, but the direction of liquid stream is contrary with the direct of travel of blade, there is the problem cannot accelerating the flow velocity on surface because liquid flow path direction replaces.
Therefore, Patent Document 1 discloses the eddy generator that a kind of utilization makes plating solution eddy generation, make the plating apparatus of the plating solution eddy generation of the underfeed from plating coating groove.
But, when this plating apparatus, must arrange outward recycle pump in order to plating solution to be delivered to eddy generator at plating coating groove, not only installation space can become large, also because plating solution is from the underfeed of plating coating groove to eddy generator, and be difficult to make flow velocity at plated flush coat even up and down.
[patent documentation 1] Japanese Unexamined Patent Publication 2004-345066
Summary of the invention
(inventing problem to be solved)
Therefore, problem of the present invention is to provide a kind of above-mentioned shortcoming overcoming existing plating apparatus, recycle pump need not be set outside plating coating groove, just can improve the flow velocity of plating solution, and make flow velocity identical to liquid level from the bottom of plating coating groove, its result, throughout substrate all zones ground, can carry out plating uniform film thickness and the plating apparatus of speed of separating out also plating process fast.
(measure of dealing with problems)
The present invention is used for solving the problem, and provides a kind of plating apparatus, possesses; The plating coating groove of collecting plating solution; Dismounting keeps the substrate holder of substrate freely; The anode configured oppositely with the substrate that substrate holder keeps; The orbit portion of the top of plating coating groove is erected in the mode parallel with substrate holder; And being supported in this orbit portion and the blade that can reciprocate along orbit portion by pendency, the feature of described plating apparatus is: on described blade, be vertically installed with blade part that is rotatable or that rotate freely centered by axle portion.
(effect of invention)
Plating apparatus of the present invention arranges blade part that is rotatable or that rotate freely on the blade that can reciprocate along orbit portion, adjustable is to the flow velocity touched in substrate or direction accordingly, liquid stream without irregular, therefore can make plating uniform film thickness to touching whole substrate fifty-fifty.
In addition, in plating apparatus of the present invention, the blade part of blade always rotates with constant direction, makes the liquid stream near the plated flush coat of substrate become single direction, and just can make liquid stream with at a high speed to touching in substrate surface with little power.
In addition, in plating apparatus of the present invention, the blade part of blade is carried out rotating (swing) in the angular range of regulation, makes liquid stream vertically to the plated flush coat touched in substrate W, and liquid is flowed through and substrate W all sidedly to touching, therefore can carry out plating process equably.
Accompanying drawing explanation
Fig. 1 is the general view of plating apparatus of the present invention.
Fig. 2 is the summary section of plating apparatus of the present invention.
Fig. 3 is the general view of embodiments different in plating apparatus of the present invention.
Fig. 4 is the summary section of embodiments different in plating apparatus of the present invention.
(a) of Fig. 5 is the front view of an embodiment of the blade showing plating apparatus of the present invention, and (b) is the sectional view of an embodiment of the blade showing plating apparatus of the present invention.
Embodiment
Below with reference to the accompanying drawings, the embodiment of plating apparatus of the present invention is illustrated.In addition, the present invention is not by any restriction of these embodiments.
Fig. 1 is the general view of plating apparatus of the present invention, and Fig. 2 is the summary section of plating apparatus of the present invention.As shown in the figure, plating apparatus of the present invention possesses: the plating coating groove 1 of collecting plating solution; Dismounting keeps the substrate holder 2 of substrate freely; The anode 3 configured oppositely with the substrate W that substrate holder 2 keeps; The orbit portion 5 of the top of plating coating groove 1 is erected in the mode parallel with substrate holder 2; And pendency is supported in this orbit portion 5 and the blade 4 that can reciprocate along orbit portion 5.Each component is below described.
As shown in the figure, orbit portion 5 to be set up in above plating coating groove 1 in the mode parallel with substrate holder 2 and between substrate holder 2 and anode 3.On this orbit portion 5, pendency support has the blade 4 of the drive unit (non-icon) possessed for reciprocating along orbit portion about 5.This blade 4 possesses the motor 43 as the rotating driving device of blade part 41, and has with motor 43 interlock and rotatably vertically disposed axle portion 42.
The axle portion 42 of blade 4 is formed 2 blade parts 41 that direction towards the opposite is outstanding respectively, is set under the effect of the revolving force transmitted via axle portion 42 from motor 43 rotatable.In the present embodiment, it is rectangular that blade part 41 is formed as section, but also can be formed as the arcuation at the rotation direct of travel of impeller with concave surface.By arranging this concave surface, blade part 41 efficiency can trap plating solution and flow velocity is improved well.In addition, about the number of blade part 41, though be not particularly limited, especially 2 are preferably.In addition, preferably at least having about the width length of above-below direction (on the drawing for) of blade part 41 can the width of height of plated flush coat of covered substrate W.
Along orbit portion 5, left and right reciprocates the blade 4 of present embodiment, but now, blade part 41 rotates towards single direction all the time.Such as, in the embodiment of figure l, blade part 41, in the reciprocating of blade 4, rotates with clockwise all the time.Like this, regardless of the direct of travel of blade 4, make the sense of rotation of blade part 41 constant all the time, the liquid stream near the plated flush coat of substrate W accordingly becomes single direction, liquid stream just can be made at high speed to touching in substrate surface with little power.
Fig. 3 and Fig. 4 is the second embodiment of display plating apparatus of the present invention.This second embodiment dangle on the orbit portion 5 be set up in above plating coating groove 1 support blade 4 can reciprocate in, identical with the first embodiment.In this second embodiment, in the following areas there is feature.That is, in the present embodiment, the blade part 41 of blade 4 is set to rotate (swing) freely by means of motor 43 in the angular range of regulation.Specifically, give prominence to from axle portion 42 towards substrate W direction and the blade part 41 arranged as shown by the arrow, relative to substrate W from the position at right angle towards left-right rotation.Now, the rotational angle of blade part 41 is not particularly limited, but in order to efficiency produces liquid stream well with minimum power, is preferably set to the scope of 30 degree ~ 90 degree (be one-sided 15 degree ~ 45 degree relative to the vertical lines about substrate W).In addition, about the number of blade part 41, also do not limit, but if number increase, unnecessary liquid stream can be produced, be therefore preferably set to 1 as shown in the figure.
As mentioned above, in this second embodiment, blade part 41 one side is rotated in the angular range of regulation, one side makes blade 4 reciprocate along orbit portion about 5, therefore liquid fails to be convened for lack of a quorum vertically to the plated flush coat touched in substrate W, and liquid is flowed through and substrate W all sidedly to touching, therefore can carry out plating process equably.
In addition, in the plating apparatus of the second embodiment, blade part 41 also can not be made to rotate, but while the direct of travel relative to blade 4 keeps constant angle, blade 4 be moved.By this method, liquid stream can be made efficiently to the plated flush coat touched in substrate W, therefore just can carry out plating process equably with little power.
In addition, in the plating apparatus of the second embodiment, also blade part 41 can be remained the mode of freely rotating, and the retainer being used for being limited in by the rotational angle of blade part 41 in specialized range is set on blade 4.In this way, liquid can be corresponding with the direct of travel of blade 4 and change for the resistance of blade part 41, and therefore the direction of blade part 41 and angle can change according to the movement of blade 4, keep.Accordingly, liquid stream efficiency can be made well to the plated flush coat touched in substrate W, therefore can carry out plating process equably with little power.
Fig. 5 is the different embodiment of the blade showing plating apparatus of the present invention.The blade of present embodiment is called as the type of so-called cross-stream impeller, and between upper and lower discoideus support section 44,2 blade parts 41 are vertically arranged symmetrically across turning axle part.It is rotatable for turning axle that this blade part 41 is set to be arranged on continuously axle portion 42 in the support section 44 on top.In addition, on the blade 4 of present embodiment, along the side opposite with anode 3 side, the covering part 45 with semi-circular curvature is provided with.As mentioned above, by the paddle-shaped of plating apparatus of the present invention is become cross-stream impeller-type, liquid is flowed through and substrate W carries out all sidedly to touching, and therefore can carry out plating process equably.
(explanation of Reference numeral)
1: plating coating groove; 2: substrate holder; 3: anode; 4: blade; 5: orbit portion; 41: blade part;
42: axle portion; 43: motor section; 44: support section; 45: covering part.
Claims (5)
1. a plating apparatus, possesses;
The plating coating groove of collecting plating solution; Dismounting keeps the substrate holder of substrate freely; The anode configured oppositely with the substrate that substrate holder keeps; The orbit portion of the top of plating coating groove is erected in the mode parallel with substrate holder; Pendency is supported in described orbit portion and the blade that can reciprocate along orbit portion,
It is characterized in that: on described blade, be vertically installed with blade part that is rotatable centered by axle portion or that rotate freely.
2. plating apparatus as claimed in claim 1, it is characterized in that, described blade part always rotates with single direction by means of drive unit.
3. plating apparatus as claimed in claim 1, is characterized in that, described blade part rotates in the angular range of regulation by means of driving means.
4. plating apparatus as claimed in claim 1, it is characterized in that, on described blade, the one group of blade part be vertically set between upper and lower discoideus support section is formed to be arranged on continuously axle portion in the support section on top for turning axle and rotatable mode.
5. plating apparatus as claimed in claim 4, is characterized in that, on described blade, be provided with and laterally bend to semicircular covering part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-101338 | 2013-05-13 | ||
| JP2013101338 | 2013-05-13 | ||
| PCT/JP2014/058713 WO2014185159A1 (en) | 2013-05-13 | 2014-03-27 | Substrate plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105209670A true CN105209670A (en) | 2015-12-30 |
Family
ID=51898143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480026900.1A Pending CN105209670A (en) | 2013-05-13 | 2014-03-27 | Substrate plating device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20160138181A1 (en) |
| JP (1) | JPWO2014185159A1 (en) |
| KR (1) | KR20160009035A (en) |
| CN (1) | CN105209670A (en) |
| TW (1) | TW201447047A (en) |
| WO (1) | WO2014185159A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111441040A (en) * | 2018-12-26 | 2020-07-24 | 株式会社杰希优 | Wet processing device for resin film |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022254690A1 (en) * | 2021-06-04 | 2022-12-08 | 株式会社荏原製作所 | Plating device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06330397A (en) * | 1993-05-18 | 1994-11-29 | Kida Seiko Kk | Surface covering treatment device |
| JPH11100698A (en) * | 1997-09-26 | 1999-04-13 | Nec Ibaraki Ltd | Plating apparatus |
| US20040222101A1 (en) * | 2003-04-18 | 2004-11-11 | Applied Materials, Inc. | Contact ring spin during idle time and deplate for defect reduction |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5439327A (en) * | 1977-09-05 | 1979-03-26 | Kawasaki Steel Co | Apparatus for electrolytically treating strips |
| JPS61133397A (en) * | 1984-11-30 | 1986-06-20 | Nippon Kokan Kk <Nkk> | Plating device for pipe end |
| JPH0585859U (en) * | 1991-07-05 | 1993-11-19 | 住友金属工業株式会社 | Electroplating equipment |
| US5904827A (en) * | 1996-10-15 | 1999-05-18 | Reynolds Tech Fabricators, Inc. | Plating cell with rotary wiper and megasonic transducer |
| JP2003328197A (en) * | 2002-05-16 | 2003-11-19 | Marunaka Kogyo Kk | Stirring apparatus for plating solution |
| JP3775744B2 (en) | 2003-05-26 | 2006-05-17 | 有限会社エフ・エー電子 | Wire tension control device for wire cut electrical discharge machine |
| JP2006041172A (en) * | 2004-07-27 | 2006-02-09 | Univ Waseda | Method and device for plating printed wiring board having through hole |
-
2014
- 2014-03-27 KR KR1020157032809A patent/KR20160009035A/en not_active Application Discontinuation
- 2014-03-27 US US14/889,954 patent/US20160138181A1/en not_active Abandoned
- 2014-03-27 JP JP2015516981A patent/JPWO2014185159A1/en active Pending
- 2014-03-27 CN CN201480026900.1A patent/CN105209670A/en active Pending
- 2014-03-27 WO PCT/JP2014/058713 patent/WO2014185159A1/en active Application Filing
- 2014-04-17 TW TW103114013A patent/TW201447047A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06330397A (en) * | 1993-05-18 | 1994-11-29 | Kida Seiko Kk | Surface covering treatment device |
| JPH11100698A (en) * | 1997-09-26 | 1999-04-13 | Nec Ibaraki Ltd | Plating apparatus |
| US20040222101A1 (en) * | 2003-04-18 | 2004-11-11 | Applied Materials, Inc. | Contact ring spin during idle time and deplate for defect reduction |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111441040A (en) * | 2018-12-26 | 2020-07-24 | 株式会社杰希优 | Wet processing device for resin film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2014185159A1 (en) | 2017-02-23 |
| TW201447047A (en) | 2014-12-16 |
| US20160138181A1 (en) | 2016-05-19 |
| WO2014185159A1 (en) | 2014-11-20 |
| KR20160009035A (en) | 2016-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FI124960B (en) | Device for mixing soil material | |
| US20180221835A1 (en) | Paddle, plating apparatus equipped with the paddle, and plating method | |
| CN105209670A (en) | Substrate plating device | |
| RU2010140034A (en) | PULSATOR DEVICE USED WITH A WASHING MACHINE AND A WASHING MACHINE CONTAINING IT | |
| JP2012234153A5 (en) | ||
| CN1148471C (en) | Electroplating machine | |
| CN106149022A (en) | A kind of upper sand equipment of electroplated diamond line | |
| CN101448983B (en) | Set for creating a process reactor for forming metallic layers on at least one substrate | |
| CN104096693B (en) | The cleaning equipment of liquid crystal glass base | |
| TW201413050A (en) | Method for homogeneous reacting of chemical liquid and substrate surface and apparatus thereof | |
| CN107002631A (en) | Water turbine component | |
| CN203741428U (en) | Pickling bath | |
| CN103344410A (en) | Simulation device of continuous and stable flowing water body | |
| CN103994103A (en) | Air guide wheel for fan | |
| JP5287666B2 (en) | Cooling device for rotating electrical machine | |
| EP2796707A1 (en) | Hydroelectric plant with an Archimedean screw rotor | |
| JP2017036717A (en) | Vortex prevention device and pump system | |
| CN205699607U (en) | The degreasing unit of degreasing bath | |
| RU2006102739A (en) | DEVICE FOR CLEANING PROCESS WATER FROM WEIGHTED PARTICLES | |
| CN205760881U (en) | The solution pool of disperser is set | |
| US1874450A (en) | Deep-well turbine pump | |
| KR101125028B1 (en) | Annular Flume using Angle adjustable side walls and lid | |
| CN105771325B (en) | The degreasing unit of degreasing bath | |
| TW201445010A (en) | Substrate plating device | |
| SU678317A1 (en) | Flow metering apparatus hydrostatic pressure reservoir |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151230 |
|
| WD01 | Invention patent application deemed withdrawn after publication |