TW201440936A - Laser beam irradiation apparatus and apparatus for manufacturing optical member affixed body - Google Patents

Abstract

A laser beam irradiation apparatus includes, a table that has a supporting surface which supports an object, a laser beam oscillator configured to oscillate a laser beam, a scanner configured to scan the laser beam two-dimensionally in a plane parallel to the supporting surface, moving device configured to move the table and the scanner relatively with each other, and a controller configured to control the scanner and the moving device, wherein the controller is capable of forming an overlapping portion on a laser processing line by relatively moving the scanner and the table with each other along the laser processing line while deflecting the laser beam by using the scanner, the overlapping portion being a portion where the laser beam is irradiated for plurality of times.

Description

Laser light irradiation device and optical component bonding body manufacturing device

The present invention relates to a laser light irradiation device and a manufacturing device for an optical component bonding body. The present invention claims priority from Japanese Patent Application No. 2013-026099, filed on Feb. 13, 2013, the content of which is incorporated herein.

Conventionally, a laser light irradiation device that irradiates laser light to a target object and performs specific processing is known. The laser light irradiation device can be used for the film cutting process and the like, and is preferably applied to, for example, the method for producing a polarizing film described in Patent Document 1.

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

In general, when laser light is irradiated onto a target object to perform cutting processing, in order to reliably cut the target object, the output of the laser light is increased, or the cutting speed is slowed down. However, in this case, the cut surface of the object object may cause defects such as breakage or cracking, resulting in a low quality of the cut.

In view of such matters, the object of the present invention is to provide a laser light irradiation device and an optical component bonding body which can suppress defects such as breakage or cracking which are generated on a cut surface of a target object, and which can be cut in a low quality. Device.

In order to achieve the above object, the present invention employs the following means. (1) A first aspect of the present invention is a laser light irradiation apparatus comprising: a pedestal having a holding surface for holding a target object; a laser light oscillating device for oscillating the laser light; and a scanner for illuminating the laser light. Performing a two-dimensional scan in a parallel plane of the holding surface; moving the device to move the pedestal relative to the scanner; and controlling the device to control the scanner and the moving device; wherein the control device The laser light is deflected by the scanner, and the scanner is moved relative to the pedestal along the laser processing line, whereby the laser beam is superimposed on the laser processing line to form a subject. The overlapping portion of the illumination.

(2) The aspect of (1) above, wherein the control device rotates the laser light by the scanner while moving the scanner relative to the pedestal along the laser processing line.

(3) The aspect of (2) above, wherein the scanner deflects the laser light toward a remaining portion outside the laser processing line.

(4) The aspect of (1) above, wherein the control device linearly vibrates the laser light along the laser processing line by the scanner, and causes the scanner along the laser processing line Move relative to the pedestal.

(5) The aspect of any of (1) to (4) above, further comprising a collecting lens such that the laser light emitted from the scanner is concentrated toward the holding surface.

(6) Another aspect of the present invention is an apparatus for manufacturing an optical component bonding body, which is a manufacturing apparatus for bonding an optical component to an optical display component to form an optical component bonding body, the manufacturing apparatus comprising: a bonding device, Attaching an optical component layer larger than a display area of the optical display component to the optical display component to form a bonding layer; and a cutting device for opposing portions of the display region in the optical component layer The remaining portion of the opposite portion is cut off, and an optical component corresponding to the size of the display region is cut out from the optical component layer, thereby cutting and including the optical display component from the bonding layer The optical component bonding body of the optical component, wherein the cutting device is configured by the laser light irradiation device according to any one of (1) to (5), wherein the laser beam is irradiated from the laser beam irradiation device The light is emitted to cut off the optical component layer as the target object.

According to the aspect of the invention, it is possible to suppress defects such as breakage or cracking which are generated on the cut surface of the target object, and it is possible to suppress the problem of the deterioration of the cutting quality.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In addition, in the following drawings, the dimensions, ratios, and the like of the respective structural elements are appropriately changed for the sake of clarity of the drawings. In the following description and the drawings, the same or corresponding elements are given the same reference numerals, and the repeated description is omitted.

(Laser Light Irradiation Device) Fig. 1 is a perspective view showing an example of a laser beam irradiation device 100 used as a cutting device.

In the following description, the XYZ orthogonal coordinate system is set according to the requirements, and the positional relationship of each component is described with reference to the XYZ orthogonal coordinate system. In the present embodiment, the X direction is a first direction parallel to the holding surface of the holding target object, the Y direction is orthogonal to the X direction inside the holding surface, and the Z direction is orthogonal to the X direction and the Y direction. The direction.

As shown in Fig. 1, the laser beam irradiation apparatus 100 includes a pedestal 101, a laser oscillator 102, and an acousto-optic element 103 constituting an electron beam shaping 130 (EBS, Electrical Beam Shaping: see Fig. 2); Rail 104 (IOR, Imaging Optics Rail); scanner 105; mobile device 106; and control device 107 for overall control of the aforementioned devices.

The pedestal 101 has a holding surface 101s that holds the target object 110. The pedestal 101 is rectangular when viewed from the normal direction of the holding surface 101s. The holding surface 101s includes a rectangular first holding surface 101s1 having a long side in the first direction (X direction), and a second holding surface 101s2 disposed adjacent to the first holding surface 101s1 and having the same shape as the first holding surface 101s1. .

The laser oscillator 102 is a component that oscillates the laser light L. For example, the laser oscillator 102 can use a CO ₂ laser oscillator (carbon dioxide laser oscillator), an ultraviolet (UV) laser oscillator, a semiconductor laser oscillator, a yttrium aluminum garnet (YAG) laser oscillator, An oscillator such as an excimer laser oscillator, but the specific structure is not particularly limited. More preferably, the CO ₂ laser oscillator in the illustrated oscillator can oscillate, for example, high output laser light suitable for cutting processing of optical components such as a polarizing film.

Fig. 2 is a schematic view showing the structure of electron beam forming 130. As shown in FIG. 2, the electron beam forming 130 has an acousto-optic element 103 disposed on the optical path of the laser light oscillated by the laser oscillator 102, a driver 131 electrically connected to the acousto-optic element 103, and a control ray. The control device 107 (corresponding to the laser control unit 171 described later) that emits light through the timing of the acousto-optic element 103. The electron beam shaping 130 shields the laser light until the output of the laser light reaches a stable state.

The acousto-optic element 103 is an optical element for shielding the laser light oscillated by the laser oscillator 102.

The acousto-optic element 103 is, for example, a piezoelectric element bonded to an acousto-optic medium composed of a single crystal such as cerium oxide (TeO ₂ ) or lead molybdate (PbMoO ₄ ) or glass. Applying an electrical signal to the piezoelectric element produces an ultrasonic wave that propagates into the acousto-optic medium to control the passage and non-passing (shadowing) of the laser light.

Further, in the present embodiment, the acousto-optic element 103 is used as the structural component of the electron beam shaping 130, but the invention is not limited thereto. Other optical components can be used as long as the laser light oscillated by the laser oscillator 102 can be shielded.

The driver 131 supplies an electronic signal (control signal) for generating ultrasonic waves to the acousto-optic element 103 under the control of the control device 107, and adjusts the shielding time of the laser light by the acousto-optic element 103.

The control device 107 removes, for example, the rising portion and the falling portion of the laser light oscillated by the laser oscillator 102 to control the timing at which the laser light passes through the acousto-optic element 103.

Further, the manner in which the timing is controlled by the control device 107 is not limited to this. For example, the control device 107 can selectively remove the rising portion of the laser light oscillated by the laser oscillator 102 to control the timing of the passage of the laser light through the acousto-optic element 103. In particular, in the case where the width (time) of the laser light falling portion oscillated by the laser oscillator 102 is shorter than the width (time) of the rising portion of the laser light, the actual benefit of removing the laser light falling portion is small. Therefore, in this case, only the portion of the laser light that is oscillated by the laser oscillator 102 can be selectively removed.

With such a configuration, the electron beam forming 130 emits the laser light oscillated by the laser oscillator 102 in a state where the output is stable, according to the control of the control device 107.

The imaging optical slide 104 removes an edge portion of the laser light intensity distribution that does not contribute to the cutting of the object 110.

Figure 3 is a perspective view showing the internal structure of the imaging optical slide 104. As shown in FIG. 3, the imaging optical slide 104 has a first condensing lens 141 that focuses the laser light emitted by the electron beam shaping 130, and a first holding frame 142 that holds the first condensing lens 141; a diaphragm assembly 143 for focusing laser light focused by the condenser lens 141; a holding assembly 144 for holding the aperture assembly 143; a collimating lens 145 for collimating the laser light concentrated by the aperture assembly 143; and maintaining the collimating lens 145 a second holding frame 146; and a moving mechanism 147 that enables the first holding frame 142, the holding assembly 144, and the second holding frame 146 to move relative to each other.

4 is a cross-sectional view showing an arrangement structure of the first collecting lens 141, the diaphragm assembly 143, and the collimator lens 145.

As shown in FIG. 4, a pinhole 143h for concentrating the laser light focused by the first condensing lens 141 is formed in the aperture unit 143. The center of each of the first condenser lens 141, the pinhole 143h, and the collimator lens 145 is disposed at a position overlapping the optical axis C of the laser beam emitted from the electron beam shaping 130.

Preferably, the aperture assembly 143 is disposed in the vicinity of the rear focus of the first condenser lens 141.

Here, "the vicinity of the focus of the rear side of the first condensing lens 141" means that the arrangement position may be slightly in a range in which the position of the aperture unit 143 is not greatly displaced from the position of the back focus of the first condensing lens 141. difference. For example, if after the first condenser lens 141 from the center 141 of the first condensing lens focal point distance K ₁ side, a first condensing lens 141 away from the center 143 of the pinhole aperture unit 143h center K _2, K ₁ and the distance The ratio of the distance K ₂ is K ₁ /K ₂ = 0.9/1 or more and 1.1/1 or less, and the aperture assembly 143 can be referred to as being disposed in the vicinity of the rear focus of the first condensing lens 141. As long as it is within this range, the laser light focused by the first collecting lens 141 can be efficiently concentrated.

Further, it is preferable that the diaphragm unit 143 is disposed in the vicinity of the focus of the rear side of the first condensing lens 141, but the arrangement position of the diaphragm unit 143 is not necessarily limited to this position. As long as the arrangement position of the aperture unit 143 is located on the optical path between the first condensing lens 141 and the collimator lens 145, it is not limited to the vicinity of the focus of the rear side of the first condensing lens 141.

Returning to Fig. 3, the moving mechanism 147 has a slider mechanism 148 that allows each of the first holding frame 142, the holding unit 144, and the second holding frame 146 to move in a direction parallel to the direction in which the laser light is directed; and the holding slider The holding station 149 of the mechanism 148.

For example, in a state where the holding unit 144 is disposed at a fixed position, the first holding frame 142 and the second holding frame 146 can be moved in the parallel direction of the direction in which the laser light is directed to determine the first holding frame 142 and the holding assembly. The mutual position of 144 and second holding frame 146. Specifically, the aperture unit 143 is disposed at a position of the front side focus of the collimator lens 145 and at a position of the rear side focus of the first condensing lens 141.

Returning to Fig. 1, the scanner 105 performs two-dimensional scanning with laser light in a parallel plane (in the XY plane) of the holding surface 101s. That is, the scanner 105 moves the laser light independently of the pedestal 101 in the X direction and the Y direction. Thereby, the laser light can be irradiated to any position of the object 110 held on the pedestal 101 with good precision.

The scanner 105 includes a first irradiation position adjusting device 151 and a second irradiation position adjusting device 154.

The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are constituted by scanning elements that perform two-dimensional scanning of the laser light emitted from the imaging optical slide 104 in parallel planes of the holding surface 101s. For example, a current scanner can be used as the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. In addition, the scanning element is not limited to the use of a current scanner, and a gimbal can also be used.

The first irradiation position adjusting device 151 is provided with an actuator 153 that sets the angle between the mirror 152 and the adjusting mirror 152. The actuator 153 has a rotary axis parallel to the Z direction. The actuator 153 rotates the mirror 152 about the Z axis in accordance with the control of the control unit 107.

The second irradiation position adjusting device 154 is provided with an actuator 156 that sets the angle between the mirror 155 and the adjusting mirror 155. The actuator 156 has a rotary axis parallel to the Y direction. The actuator 156 rotates the mirror 155 about the Y axis in accordance with the control of the control unit 107.

On the optical path between the scanner 105 and the pedestal 101, a second condensing lens 108 that focuses the laser light passing through the scanner 105 toward the holding surface 101s is disposed.

For example, an fθ lens can be used as the second collecting lens 108. Thereby, the laser light from the mirror 155 and parallel to the second condensing lens 108 can be focused in parallel on the object object 110.

Further, the optical path between the scanner 105 and the pedestal 101 may be a structure in which the second condensing lens 108 is not disposed.

The laser light L oscillated by the laser oscillator 102 is irradiated onto the object object 110 held by the pedestal 101 via the acousto-optic element 103, the imaging optical slide 104, the mirror 152, the mirror 155, and the second condensing lens 108. The first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 adjust the laser light irradiation position from the laser oscillator 102 toward the target object 110 held by the pedestal 101 in accordance with the control of the control device 107.

The laser beam processing region (hereinafter referred to as the scanning region 105s) controlled by the scanner 105 has a rectangular shape when viewed from the normal direction of the holding surface 101s. In the present embodiment, the area of the scanning area 105s is smaller than the area of the first holding surface 101s1 and the second holding surface 101s2.

The mobile device 106 can move the pedestal 101 relative to the scanner 105. The moving device 106 has a first slider mechanism 161 that moves the pedestal 101 in a first direction (X direction) parallel to the holding surface 101s; and a second slider mechanism 162 that allows the first slider mechanism 161 to be parallel to The holding surface 101s moves in a second direction (Y direction) orthogonal to the first direction (hereinafter, the first slider mechanism 161 and the second slider mechanism 162 are collectively referred to as a slider mechanism). The moving device 106 can be actuated by a linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162, and moves the pedestal 101 in all directions of XY.

The linear motor that is pulse-driven in the slider mechanism (the first slider mechanism 161 and the second slider mechanism 162) can finely control the rotation angle of the output shaft through the pulse signal supplied to the linear motor. Therefore, the position of the pedestal 101 supported by the slider mechanism (the first slider mechanism 161 and the second slider mechanism 162) in the XY directions can be controlled with higher precision. Further, the position control of the pedestal 101 is not limited to the position control using a pulse motor, and may be realized by feedback control using a servo motor or any other control method.

The control device 107 includes a laser control unit 171 that controls the laser oscillator 102 and the acousto-optic element 103 (driver 131), a scanner control unit 172 that controls the scanner 105, and a slider control unit that controls the mobile device 106. 173.

Specifically, the laser control unit 171 performs: ON/OFF of the laser oscillator 102; output of the laser light oscillated by the laser oscillator 102; and passage of the laser light L oscillated by the laser oscillator 102 The timing of the acousto-optic element 103; and the control of the driver 131. The scanner control unit 172 performs drive control of the actuator 153 of the first irradiation position adjusting device 151 and the actuator 156 of the second irradiation position adjusting device 154. The slider control unit 173 performs actuation control of a linear motor incorporated in each of the first slider mechanism 161 and the second slider mechanism 162.

Fig. 5 is a view showing the structure of a control system of the laser light irradiation device 100. As shown in Fig. 5, an input device 109 capable of inputting an input signal is connected to the control device 107. The input device 109 has an input device such as a keyboard or a mouse, or a communication device for inputting data from an external device. The control device 107 may include a display device such as a liquid crystal display that displays an operation state of each portion of the laser light irradiation device 100, and may be connected to the display device.

When the user inputs the processing information to the input device 109 to complete the initial setting, the laser light is oscillated from the laser oscillator 102 in accordance with the control of the laser control unit 171 of the control device 107. At this time, the mirror constituting the scanner 105 is started to be rotationally driven by the control of the scanner control unit 172 of the control device 107. At the same time, the motor provided in the slider mechanism (the first slider mechanism 161 and the second slider mechanism 162) is detected by a sensor such as a rotary encoder under the control of the slider control unit 173 of the control device 107. The speed of the drive shaft.

The control device 107 immediately corrects each coordinate value and emits the laser light to a coordinate consistent with the processing information, that is, allows the laser light to trace a specific trajectory at the target object 110 (refer to FIG. 1), and controls the mobile device 106 and Scanner 105. For example, the scanning of the laser light is mainly performed by the mobile device 106, and the area of the laser light irradiation position where the mobile device 106 cannot control the accuracy is adjusted by the scanner 105.

6(a) to 6(d) are diagrams for explaining the action of the electron beam forming 130. Fig. 6(a) shows a control signal of the laser light oscillated by the laser oscillator 102. The sixth (b) diagram shows the output characteristics of the laser light oscillated by the laser oscillator 102, that is, the laser light output characteristics of the laser light oscillated by the laser oscillator 102 before passing through the acousto-optic element 103. The sixth (c) diagram shows the control signal of the acousto-optic element 103. The sixth (d) diagram shows the laser light output characteristics of the laser light oscillated by the laser oscillator 102 after passing through the acousto-optic element 103. In each of Figs. 6(b) and 6(d), the horizontal axis is time and the vertical axis is laser light intensity. Figures 7(a) and 7(d) are schematic diagrams of one pulse of laser light in Figures 6(a) and 6(d). In the following description, the "control signal of the laser light oscillated by the laser oscillator 102" is referred to as a "laser light control signal". The "laser light output characteristic before the laser light oscillated by the laser oscillator 102 passes through the acousto-optic element 103" is referred to as "the laser light output characteristic before passing through the acousto-optic element 103". The laser light output characteristic after the laser light oscillated by the laser oscillator 102 passes through the acousto-optic element 103 is referred to as "the laser light output characteristic after passing through the acousto-optic element 103".

As shown in Fig. 6(a) and Fig. 7(a), the pulse Ps1 of the laser light control signal is a rectangular pulse. As shown in Fig. 6(a), the laser light control signal periodically switches the ON/OFF signal toward the laser oscillator 102 to generate a plurality of pulses Ps1, so-called timing pulses.

In the sixth (a)th and seventh (a)th drawings, the peak of the pulse Ps1 is in a state in which the ON signal is transmitted to the laser oscillator 102, that is, the ON state of the laser light is oscillated from the laser oscillator 102. The valley of the pulse Ps1 is in a state in which the OFF signal is transmitted to the laser oscillator 102, that is, the OFF state of the laser light is not oscillated from the laser oscillator 102.

As shown in Fig. 6(a), three pulses Ps1 are arranged at a short interval to form one collective pulse PL1. Three collective pulses PL1 are arranged at a longer interval than the arrangement interval of the three pulses Ps1. For example, the interval between adjacent two pulses Ps1 is 1 ms, and the interval between adjacent two collective pulses PL1 is 10 ms.

Further, in the present embodiment, the three pulses Ps1 are arranged at a short interval, and one set pulse PL1 is formed, but the present invention is not limited thereto. For example, two or more than a plurality of pulses may be arranged at a short interval to form one set pulse. Further, it is not limited to the periodic formation of a plurality of pulses, and one pulse may be formed with a long width. That is, the specific intensity laser light may be oscillated only for a predetermined time from the ON signal to the OFF signal of the laser oscillator.

As shown in FIGS. 6(b) and 7(b), the pulse Ps2 of the laser light output characteristic before the acousto-optic element 103 has a pulse waveform of the rising portion G1 and the falling portion G2.

Here, the rising portion G1 is a portion during which the intensity of the laser light in the pulse Ps2 is from zero to the strength at which the object can be cut. The descending portion G2 is a portion during which the intensity of the laser light in the pulse Ps2 of the laser light output characteristic is from the time when the strength of the object to be cut reaches zero. The intensity of the object to be cut may vary depending on the material or thickness of the object and the laser light output value. For example, as shown in Fig. 7(b), the intensity of the peak intensity of the laser light (100%) is 50%.

As shown in Fig. 6(b) and Fig. 7(b), the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. In other words, the laser light rising portion G1 oscillated by the laser oscillator 102 takes a longer time than the laser light falling portion G2. For example, the rising portion G1 has a width of 45 μs and the falling portion G2 has a width of 25 μs.

Further, in the present embodiment, an example in which the width of the rising portion G1 of the pulse Ps2 is longer than the width of the decreasing portion G2 is described, but the present invention is not limited thereto. For example, the case where the width of the rising portion G1 of the pulse Ps2 is substantially equal to the width of the falling portion G2, and the case where the width of the rising portion G1 of the pulse Ps2 is shorter than the width of the falling portion G2 can be applied to the present invention.

As shown in Fig. 6(b), the three pulses Ps2 are arranged at positions corresponding to the three pulses Ps1 shown in Fig. 6(a), thereby forming one collective pulse PL2. The three collective pulses PL2 are arranged in Corresponds to the position of the three collective pulses PL1 shown in Fig. 6(a).

As shown in Fig. 6(c) and Fig. 7(c), the pulse Ps3 of the control signal of the acousto-optic element 103 is a rectangular pulse. As shown in FIG. 6(c), the acousto-optic element 103 control signal periodically switches the control signal toward the driver 131 to periodically switch the timing of the laser light passing through the acousto-optic element 103, thereby generating a plurality of pulses Ps3. , the so-called timing pulse.

In the fifth (c)th and sixth (c)th views, the peak of the pulse Ps3 is a state in which the laser light passes, that is, a light transmitting state in which the laser light is transmitted. The valley of the pulse Ps3 is a state in which the laser light is not allowed to pass, that is, a light blocking state in which the laser light is blocked.

As shown in Fig. 6(c), the valley portion of each pulse Ps3 is arranged such that both the rising portion G1 and the falling portion G2 of the respective pulses Ps2 shown in Fig. 6(b) are overlapped.

As shown in Fig. 7(c), for the observation of one pulse Ps3, the width of the valley V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the valley V2 on the rear side of the pulse Ps3 and the pulse Ps2. The width of the descending portion is roughly equal. For example, the width of the valley portion V1 on the front side of the pulse Ps3 is 45 μs, and the width of the valley portion V2 on the rear side of the pulse Ps3 is 25 μs. As a result, the electron beam forming 130 has a switching function with a fast response characteristic.

Thereby, the laser light rising portion G1 and the falling portion G2 can be removed, and the laser light intensity portion of the target object can be selectively cut out in the pulse Ps2 of the laser light output characteristic.

As a result, in the fifth (d) and sixth (d) diagrams, the pulse Ps4 of the laser light output characteristic after the acousto-optic element 103 passes does not have the rising portion G1 and the falling portion G2, and is a sharply protruding pulse.

Further, in the present embodiment, the width of the valley portion V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the valley portion V2 on the rear side of the pulse Ps3 is substantially equal to the width of the falling portion of the pulse Ps2. Description, but is not limited to this. For example, it can be appropriately adjusted according to requirements such that the width of the valley portion V1 on the front side of the pulse Ps3 is substantially equal to the width of the rising portion G1 of the pulse Ps2, or the width of the valley portion V2 on the rear side of the pulse Ps3 is larger than the width of the falling portion of the pulse Ps2.

Fig. 8 is a diagram for explaining the action of the imaging optical slide 104. The graph on the left side of Fig. 8 shows the intensity distribution of the laser light before passing through the pinhole 143h. The figure on the upper left side of Fig. 8 is a plan view, and the figure on the left side in the left side of Fig. 8 is a perspective view, and the figure on the lower left side of Fig. 8 shows a position on the horizontal axis and the intensity on the vertical axis. The graph on the right side of Fig. 8 is an intensity distribution diagram of the laser light after passing through the pinhole 143h. The figure on the upper right side of Fig. 8 is a plan view, the middle view on the right side of Fig. 8 is a perspective view, and the figure on the lower right side of Fig. 8 shows a position on the horizontal axis and the intensity on the vertical axis.

As shown in the diagram on the left side of Fig. 8, the intensity distribution of the laser light passing through the pinhole 143h is a strong intensity at the center portion of the beam and a weak intensity at the outer peripheral portion of the beam.

In this regard, as shown in the figure on the right side of Fig. 8, the intensity distribution of the laser light after passing through the pinhole 143h is to remove the edge portion of the intensity distribution of the laser light which does not contribute to the cutting of the polarizing plate, and the intensity distribution of the laser light. For an ideal Gaussian distribution. The half-width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half-width of the intensity distribution of the laser light passing through the pinhole 143h.

The control device 107 of the present embodiment rotates the laser light emitted from the imaging optical slide 104 by the scanner 105 and moves the scanner 105 and the pedestal 101 along the laser beam processing line WCL (refer to FIG. 9). control.

Figure 9 is a schematic diagram of a laser light processing line. In the present embodiment, as shown in FIG. 9, a case where the plan view of the laser beam processing line WCL has a rectangular frame shape is taken as an example. Specifically, for example, a target object 110 having a rectangular shape in plan view is disposed along the object object 110. The case where four sides are rotated clockwise to perform laser processing in a rectangular frame shape will be described. For example, the rectangular portion inside the laser light processing line WCL after the laser processing of the target object 110 is the use portion AR1 used for the product or the like. The rectangular frame portion outside the laser light processing line WCL is the remaining portion AR2 that is not used.

Fig. 10 is a view showing a trajectory of laser light movement when a target object is cut using a laser light irradiation device of a comparative example. Here, the laser light irradiation device of the comparative example directly irradiates the scanner with the pedestal along the laser beam processing line WCL, that is, the movement trajectory of the laser light (hereinafter, referred to as a laser light trajectory) UrX) is a linear laser light irradiation device along the laser light processing line WCL. Fig. 11 is a schematic view showing a trajectory of laser light movement when a target object is cut by using the laser light irradiation device of the present embodiment. In Fig. 11, the symbol Ur is a laser light moving trajectory, and the symbol Us is a trajectory (hereinafter referred to as a relative moving trajectory) at which a moving trajectory is projected at a target object when the scanner 105 and the pedestal 101 are relatively moved, and the symbol is Up. It is an overlapping portion (hereinafter, referred to as an overlapping portion) of the laser light moving track Ur and the relative moving track Us. Further, Fig. 10 and Fig. 11 are enlarged views of the chain line surrounding portion K of the laser light processing line WCL in Fig. 9.

As shown in Fig. 10, in the laser light irradiation apparatus of the comparative example, the laser light trajectory UrX is linear. In this case, in order to surely cut the target object and increase the output of the laser light or slow down the cutting speed, defects such as cracks or defects may occur on the cut surface of the target object.

On the other hand, as shown in Fig. 11, in the laser beam irradiation apparatus 100 including the control device 107 of the present embodiment, the laser beam trajectory Ur is vibrated in the orthogonal direction of the laser beam processing line WCL, and is overlapped plural times. The irradiated light forms a plurality of irradiated overlapping portions Up along the laser light processing line WCL.

In the example of Fig. 11, the laser light trajectory Ur has a spiral shape having an elliptical annular portion. For example, the annular portion of the laser light moving path Ur has a long axis in the orthogonal direction of the laser beam processing line WCL, and the width Uw in the long axis direction is about 100 μm.

The end portion of the annular portion of the laser light moving locus Ur (the end portion on the side of the relative movement trajectory Us) partially overlaps with one of the relative movement trajectories Us. The overlapping portion Up is substantially a portion that is irradiated twice by the laser light.

The overlapping portions Up are arranged along the laser light processing line WCL at a specific interval. On the laser light processing line WCL, a portion where the laser light is irradiated only once and a portion where the laser light is repeatedly irradiated twice (overlap portion Up) are alternately arranged. The overlapping portion Up is formed in a line shape along the laser light processing line WCL.

The laser light irradiation region of the present embodiment is expanded toward the remaining portion AR2 side. The relative movement track Us is configured along the outermost edge line of the use portion AR1. The laser light moving trajectory Ur is arranged at intervals in the remaining portion AR2.

In the present embodiment, the laser beam is irradiated to the overlapping portion Up substantially at a plurality of times (for example, twice in the present embodiment). Therefore, the output of the laser light can be made smaller than the output (hereinafter referred to as the cutoff output) when the target object is cut by one laser irradiation.

The output of the laser light may be an output that can cut off the object by two laser irradiations. For example, the output of the laser light is set to 60% of the cut output. In the present embodiment, since the arrangement interval of the overlapping portions Up is extremely small, such an output can reliably cut the target object.

As described above, according to the laser beam irradiation apparatus 100 of the present embodiment, the control device 107 deflects the laser light by the scanner 105 and relatively moves the scanner 105 and the pedestal 101 along the laser beam processing line WCL. The laser beam is superimposed on the laser beam processing line WCL to form an irradiated overlapping portion Up. Therefore, it is possible to suppress the occurrence of defects such as breakage or cracking of the cut surface of the target object 110, and it is possible to suppress the problem of the deterioration of the cutting quality.

Further, the scanner 105 biases the laser light toward the remaining portion AR2 outside the laser beam processing line WCL. Therefore, the above effects can be obtained without affecting the use portion AR1 used as a product or the like. Further, since the laser beam processing line WCL is expanded toward the remaining portion AR2 side, the remaining portion AR2 of the target object 110 is thinned in a wide range. Therefore, the remaining portion AR2 of the object object 110 can be easily peeled off from the use portion AR1.

Further, the annular portion of the laser light moving locus Ur is an elliptical shape having a short axis in the parallel direction of the laser beam processing line WCL. Therefore, the length of the minor axis of the ellipse is controlled to be short, whereby the overlapping portion Up can be made dense along the laser light processing line WCL. Therefore, the arrangement interval of the overlapping portion Up can be easily reduced, and the object object 110 can be cut more surely.

Further, since the second condensing lens 108 is disposed on the optical path between the scanner 105 and the pedestal 101, the laser light passing through the scanner 105 can be focused on the object 110 in parallel. Therefore, the object 110 can be cut with better precision.

Further, in the laser beam irradiation apparatus 100 of the present embodiment, the laser beam is mainly scanned by the mobile device 106, and the area of the laser beam irradiation position where the mobile device 106 cannot control the accuracy is adjusted by the scanner 105. Therefore, the laser light irradiation position can be controlled with good precision over a wide range as compared with the case where the laser beam scanning is performed only by the moving device 106 or only the scanner 105.

However, in the present embodiment, the control device 107 performs control, and the laser light emitted from the imaging optical slide 104 is rotated by the scanner 105, and the scanner 105 and the pedestal are placed along the laser beam processing line WCL. 101 is described as an example of moving, but is not limited thereto. Various configurations may be employed. For example, the control device 107 deflects the laser light emitted from the imaging optical slide 104 by the scanner 105, and moves the scanner 105 and the pedestal 101 along the laser light processing line WCL. On the light-emitting processing line WCL, the laser light is superimposed a plurality of times to form an overlapped portion to be irradiated.

Further, in the present embodiment, the laser light trajectory Ur has an elliptical annular spiral shape, but is not limited thereto. Various shapes can also be suitably employed as the laser light trajectory.

(First Modification of Least Light Movement Trajectory) Fig. 12 is a schematic view showing a first modification of the laser light movement locus of the present embodiment.

In the above-described embodiment, as shown in Fig. 11, an example in which the annular portion of the laser light trajectory Ur is an elliptical shape has been described. On the other hand, in the laser beam trajectory Ur1 of the present modification, the annular portion as shown in Fig. 12 is circular.

The laser light trajectory Ur1 of the present modification can also suppress the occurrence of defects such as breakage or cracking of the cut surface of the target object 110, and can suppress the problem of low cutting quality. In the case of the present embodiment, the overlapping portion Up1 can be densely distributed along the laser beam processing line WCL by controlling the diameter of the circle to be short. Therefore, the object 110 can be cut more surely.

(Second Modification of Least Light Movement Trajectory) Fig. 13 is a view showing a second modification of the laser light movement locus of the present embodiment. In Fig. 13, for the sake of convenience, the laser light moving path Ur2 and the relative moving track Us are shown as being separated. However, actually, the laser light moving trajectory Ur2 overlaps with one of the relative moving trajectories Us.

As shown in Fig. 13, the annular portion of the laser light moving locus Ur2 of the present modification has a rectangular outer shape.

According to the laser light trajectory Ur2 of the present modification, since the overlapping portion Up2 is not a dot shape but a line shape, the target object can be cut more reliably.

(Third Modification of Least Light Movement Trajectory) Fig. 14 is a view showing a third modification of the laser light movement locus of the present embodiment. In Fig. 14, for the sake of convenience, the laser light moving path Ur3 is displayed as two straight lines separately from the relative moving track Us. However, actually, the laser light moving trajectory Ur3 overlaps with one of the relative moving trajectories Us.

The control device 107 of the above-described embodiment controls the laser light emitted from the imaging optical slide 104 by the scanner 105, and moves the scanner 105 and the pedestal 101 along the laser beam processing line WCL. On the other hand, the control device of the present modification controls the laser light emitted from the imaging optical slide 104 by the scanner 105, and causes the scanner 105 and the pedestal 101 to proceed along the laser beam processing line WCL. mobile.

As shown in Fig. 14, the laser light trajectory Ur3 of the present modification is linear. The laser light trajectory Ur3 vibrates up and down (moving back and forth).

The laser light irradiation region of the present embodiment is linear along the laser light processing line WCL. Specifically, the relative movement trajectory Us is arranged along the outermost edge line of the use portion AR1. The laser light moving trajectory Ur3 is arranged at intervals along the line connecting the outermost edges of the portion AR1.

According to the laser beam trajectory Ur3 of the present modification, since the overlapping portion Up3 is not a dot shape but a line shape, the laser beam is substantially irradiated three times at the overlapping portion Up3, so that the target object 110 can be more reliably cut.

(Manufacturing Apparatus of Optical Component Bonding Body) Hereinafter, a film bonding system 1 for manufacturing an optical component bonding body according to an embodiment of the present invention will be described with reference to the drawings. In the film bonding system 1 of the present embodiment, the laser light irradiation device 100 constitutes a cutting device.

Fig. 15 is a schematic view showing a schematic configuration of a film bonding system 1 of the present embodiment. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, an antireflection film, or a light diffusing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel.

In the following description, the XYZ orthogonal coordinate system is set according to requirements, and the positional relationship of each component is described with reference to the XYZ orthogonal coordinate system. In the present embodiment, the X direction is the transport direction of the liquid crystal panel of the optical display member, and the Y direction is the direction in which the inside of the liquid crystal panel is orthogonal to the X direction (the width direction of the liquid crystal panel), and the Z direction is the X direction and the Y direction. Orthogonal direction.

As shown in Fig. 15, the film bonding system 1 of the present embodiment is provided as a process for manufacturing a production line of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by the control unit 40 of the electronic control unit.

Fig. 16 is a plan view of the liquid crystal panel P as viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate. Between P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view, and a region located inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Figure 17 is a cross-sectional view taken along line A-A of Figure 16. On the front/rear side of the liquid crystal panel P, the first optical component layer F1 and the second optical component layer F2 (refer to FIG. 15, hereinafter collectively referred to as the optical component layer FX) are respectively bonded to each other. The first optical component F11 and the second optical component F12 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical unit F11 and the second optical unit F12 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P.

A frame portion G having a specific width such as a sealant that bonds the first substrate and the second substrate of the liquid crystal panel P is disposed on the outer side of the display region P4.

Further, the first layer F1m and the second layer sheet F2m (hereinafter collectively referred to as an optical component layer) which will be described later are formed by cutting the remaining portions on the outer side of the bonding surface to form the first optical component F11 and the second. Optical component F12. The bonding surface is described later.

Fig. 18 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-like optical module body F1a, an adhesive layer F2a provided on one side of the optical component body F1a (upper side of FIG. 18), and can be separately laminated to the optical layer via the adhesive layer F2a. A separation layer F3a on the one side of the module body F1a; and a surface protection film F4a laminated on the other side (the lower side of FIG. 18) of the optical unit body F1a. The optical module body F1a has a function of a polarizing plate across the entire area of the display area P4 of the liquid crystal panel P and its peripheral area. In addition, the hatching of each layer in Fig. 18 is omitted for the sake of convenience of the drawings.

The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point. Further, the optical component layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical component body F1a.

The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of the present embodiment will be described in detail. As shown in Fig. 15, the film bonding system 1 of the present embodiment includes a downstream side (+X direction side) in the transport direction of the liquid crystal panel P on the right side in the drawing, and a downstream side in the transport direction of the liquid crystal panel P on the left side in the drawing ( In the -X direction side, the drive type roller conveyor 5 which conveys the liquid crystal panel P in the horizontal state is carried out.

The reversing device 15 described later on the roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7. In the upstream conveyor 6, the liquid crystal panel P is conveyed along the short side of the display area P4 as a conveyance direction. On the other hand, in the downstream conveyor 7, the liquid crystal panel P is conveyed along the long side of the display area P4 as a conveyance direction. The layer FXm (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length cut out from the strip-shaped optical component layer FX is bonded to the front/rear surface of the liquid crystal panel P.

Further, the upstream conveyor 6 is provided in a first adsorption device 11 to be described later, and includes a free roller conveyor 24 that is independent of the downstream side. On the other hand, the downstream conveyor 7 is attached to the second adsorption device 20, which will be described later, and includes a free roller conveyor 24 that is independent of the downstream side.

The film bonding system 1 of the present embodiment includes a first adsorption device 11, a first dust collecting device 12, a first bonding device 13, a first detecting device 41, a first cutting device 31, and a reversing device 15. The second dust collecting device 16, the second bonding device 17, the second detecting device 42, the second cutting device 32, and the control unit 40.

The first adsorption device 11 adsorbs the liquid crystal panel P and transports it to the upstream conveyor 6, and performs calibration (determination of position) of the liquid crystal panel P. The first adsorption device 11 includes a panel holding portion 11a, a calibration camera 11b, and a rail R.

The panel holding portion 11a is movable in the vertical direction and the horizontal direction, and holds the liquid crystal panel P of the stopper S on the downstream side by the upstream conveyor 6, and aligns the liquid crystal panel P. The panel holding portion 11a sucks and holds the upper surface of the liquid crystal panel P that is in contact with the stopper S by vacuum suction. The panel holding portion 11a moves on the rail R while the liquid crystal panel P is in the state of being sucked and held, and conveys the liquid crystal panel P. The panel holding portion 11a releases the suction holding when the conveyance is completed, and transmits the liquid crystal panel P to the free roller conveyor 24.

The calibration camera 11b captures a calibration mark or a front end shape of the liquid crystal panel P when the panel holding portion 11a is held in contact with the liquid crystal panel P of the stopper S. The photographic data of the calibration camera 11b is transmitted to the control unit 40, and the panel holding unit 11a is activated based on the photographic data, and the liquid crystal panel P is calibrated to the destination free roller conveyor 24. In other words, the liquid crystal panel P is transported to the free roller in a state in which the amount of deviation in the direction orthogonal to the transport direction, the transport direction, and the direction perpendicular to the vertical axis of the liquid crystal panel P is adjusted in the transport direction. Conveyor 24. Here, the liquid crystal panel P conveyed along the rail R by the panel holding portion 11a is attached to the nip roller 23 together with the layer FXm in a state of being adsorbed to the suction tray 26.

The first dust collecting device 12 is disposed on the upstream side of the liquid crystal panel P of the nip roller 23 at the bonding position of the first bonding device 13. The first dust collecting device 12 performs static elimination and dust collection to remove dust around the liquid crystal panel P before being guided to the bonding position, in particular, dust on the lower side of the liquid crystal panel P.

The first bonding apparatus 13 is provided on the downstream side of the panel conveyance of the first adsorption device 11. The first bonding apparatus 13 is bonded to the lower side surface of the liquid crystal panel P that is guided to the bonding position, and is bonded to the bonding layer sheet F5 (corresponding to the first layer sheet F1m) of a specific size.

The first bonding apparatus 13 includes a conveying device 22 and a nip roller 23 .

The transport device 22 winds up the optical component layer FX from the roll drum R1 around which the optical component layer FX is wound, and conveys the optical component layer FX along the longitudinal direction of the optical component layer FX. The conveying device 22 conveys the bonding layer sheet F5 with the separation layer sheet F3a as a carrier. The conveying device 22 has a drum holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a blade 22d, and a winding portion 22e.

The roller holding portion 22a holds the roll drum R1 around which the strip-shaped optical component layer FX is wound, and winds up the optical component layer FX in the longitudinal direction of the optical component layer FX. The plurality of guide rollers 22b guide the optical component layer FX unwound from the take-up reel R1 along a specific conveyance path to wind the optical component layer FX. The cutting device 22c applies a half cut to the optical component layer FX on the transport path. The blade 22d winds the half-cut optical component layer FX at an acute angle so that the bonding layer sheet F5 is separated from the separation layer sheet F3a and the bonding layer sheet F5 is supplied to the bonding position. The take-up portion 22e holds the separation roller R2 that winds up the separation layer sheet F3a that is uniquely passed after passing through the blade edge 22d.

The roller holding portion 22a located at the beginning of the conveying device 22 and the winding portion 22e located at the end of the conveying device 22 are driven in synchronization with each other, for example. Thereby, the roller holding portion 22a winds up the optical component layer FX in the conveyance direction of the optical component layer FX, and the winding portion 22e winds up the separation layer sheet F3a which passes through the blade edge 22d. In the conveyance device 22, the upstream side in the conveyance direction of the optical component layer FX (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the layer conveyance downstream side.

Each of the guide rollers 22b changes the traveling direction of the optical component layer FX during transport along the transport path, and at least a part of the plurality of guide rollers 22b is movable to adjust the tension of the optical component layer FX during transport.

Further, a tension roller (not shown) may be disposed between the roller holding portion 22a and the cutting device 22c. The tension roller absorbs the amount of winding of the optical component layer FX conveyed by the roller holding portion 22a while the optical device layer FX is being cut by the cutting device 22c.

Fig. 19 is a schematic view showing the operation of the cutting device 22c of the present embodiment. As shown in Fig. 19, when the optical device layer FX of a specific length is wound up, the cutting device 22c performs the thickness of the optical component layer FX across the entire width in the width direction orthogonal to the longitudinal direction of the optical component layer FX. One half of the direction is cut off by a half cut. The cutting device 22c of the present embodiment is provided for feeding/retracting from the opposite side of the separation layer sheet F3a to the optical module layer FX with respect to the optical module layer FX.

The cutting device 22c is half-cut, that is, the tension in the optical component layer FX is conveyed, and the optical component layer FX (separation layer sheet F3a) is not broken (the specific thickness separation layer F3a remains). Next, the front and rear positions of the cutting blade are adjusted, and the cutting is performed until the position near the interface between the adhesive layer F2 and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the half-cut optical component layer FX, the optical module body F1a and the surface protective film F4a are cut in the thickness direction to form cutting lines L1, L2 across the entire width in the width direction of the optical component layer FX. The cutting lines L1, L2 are formed in a plurality of side by side in the longitudinal direction of the strip-shaped optical component layer FX. For example, in the case of a bonding step of transporting the liquid crystal panel P of the same size, a plurality of cutting lines L1, L2 are formed at equal intervals in the longitudinal direction of the optical component layer FX. The optical component layer FX divides a plurality of partitions in the longitudinal direction by a plurality of cutting lines L1, L2. In the longitudinal direction of the optical component layer FX, the partitions sandwiched by the adjacent pair of cutting lines L1, L2 are each one of the laminated layers F5. The layer FXm is a layer that is larger than the layer of the optical component layer FX outside the liquid crystal panel P.

Returning to Fig. 15, the blade 22d is disposed below the upstream conveyor 6, and is formed to extend at least the entire width of the optical module layer FX in the width direction. The side of the separation layer sheet F3a of the optical component layer FX after the half cutting is wound around the blade edge 22d in a sliding contact manner.

The blade 22d has a first surface configured to face downward in a width direction of the optical module layer FX (width direction of the upstream conveyor 6); and a second surface from the optical component above the first surface The width direction of the layer FX is arranged at an acute angle with respect to the first surface; and the front end portion is located at the intersection of the first surface and the second surface.

In the first bonding apparatus 13, the blade 22d is wound around the front end portion so that the first optical component layer F1 is wound at an acute angle. When the first optical component layer F1 is folded back at an acute angle due to the front end portion of the blade 22d, the layer sheet (the first layer sheet F1m) of the bonded layer sheet F5 is separated from the separation layer sheet F3a. The front end portion of the blade 22d is disposed on the downstream side of the panel conveyance close to the nip roller 23. The first layer sheet F1m separated from the separation layer sheet F3a by the blade edge 22d is superposed on the lower side surface of the liquid crystal panel P adsorbed to the first adsorption device 11, and guided to the pair of bonding rollers of the nip roller 23. Between 23a. The first layer F1m is a layer which is larger in size than the first optical component layer F1 outside the liquid crystal panel P.

On the other hand, the separation layer sheet F3a separated from the bonding layer sheet F5 by the blade edge 22d faces the winding portion 22e. The winding unit 22e winds up the separated layer sheet F3a separated from the bonding layer sheet F5 and collects it.

The nip roller 23 causes the conveying device 22 to bond the first layer sheet F1m separated from the first optical unit layer F1 to the lower side surface of the liquid crystal panel P conveyed by the upstream side conveyor 6. Here, the nip roller 23 corresponds to the bonding apparatus described in the patent application scope.

The nip roller 23 has a pair of bonding rolls 23a and 23a which are arranged in parallel with each other in the axial direction (the upper bonding roll 23a can move up and down). A predetermined gap is formed between the pair of bonding rolls 23a, 23a, and the gap is the bonding position of the first bonding apparatus 13.

The liquid crystal panel P and the first layer sheet F1m are superposed and introduced into the gap. The liquid crystal panel P and the first layer sheet F1m are pinched between the respective bonding drums 23a, and are sent to the downstream side of the panel conveyance of the upstream conveyor 6. In the present embodiment, the first layer sheet F1m can be bonded to the surface on the backlight side of the liquid crystal panel P by the nip roller 23 to form the first optical component bonding body PA1.

The first detecting device 41 is provided on the downstream side of the panel conveyance of the first bonding device 13. The first detecting device 41 detects the edge of the bonding surface of the liquid crystal panel P and the first layer sheet F1m (hereinafter referred to as the first bonding surface).

Fig. 20 is a plan view showing the detecting step of the edge ED of the first bonding surface SA1. For example, as shown in FIG. 20, the first detecting device 41 detects the edge ED of the first bonding surface SA1 among the four inspection areas CA provided on the transport path of the upstream conveyor 6. Each of the inspection regions CA is disposed at a position corresponding to the four corner portions of the first bonding surface SA1 having a rectangular outer shape. The edge ED is detected for each liquid crystal panel P conveyed on the production line. The edge ED data detected by the first detecting device 41 is stored in a memory portion not shown in the drawing.

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side).

Figure 21 is a schematic view of the first detecting device 41. In Fig. 21, for the sake of convenience, the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded is the upper side, and the structure of the first detecting device 41 is shown as being vertically opposite.

As shown in Fig. 21, the first detecting device 41 includes an illumination light source 44 that illuminates the bright edge ED, and an imaging device 43 that is disposed such that the normal direction of the first bonding surface SA1 is closer to the edge ED. In a state in which the inside of the first bonding surface SA1 is inclined, a screen on which the edge ED is imaged from the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded is attached.

The illumination light source 44 and the imaging device 43 are disposed in each of the four inspection areas CA (corresponding to the four corners of the first bonding surface SA1) shown in Fig. 20 .

The angle between the normal line of the first bonding surface SA1 and the normal line of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the inclination angle θ of the imaging device 43) can preferably be set to a deviation when the panel is broken or The burrs or the like do not enter the field of view of the photographing device 43. For example, in a case where the end surface of the second substrate P2 is shifted to the outside of the end surface of the first substrate P1, the inclination angle θ of the photographing device 43 can be set so as not to enter the end edge of the second substrate P2 into the photographing field of view of the photographing device 43.

The inclination angle θ of the photographing device 43 is preferably set to match the distance between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the height H of the imaging device 43). For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 can be preferably set to an angle of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 43 and the tilt angle θ of the photographing device 43 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle θ of the imaging device 43 is set to 10°.

The illumination light source 44 is fixed to the imaging device 43 and disposed in each of the inspection areas CA.

Further, the illumination light source 44 and the imaging device 43 may be arranged to be movable along the edge ED of the first bonding surface SA1. In this case, one set of the illumination light source 44 and the photographing device 43 may be provided. Further, by this, the illumination light source 44 and the imaging device 43 can move at a position where the edge ED of the first bonding surface SA1 can be easily photographed.

The illumination light source 44 is disposed on the opposite side to the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded. The illumination light source 44 is disposed in a state in which the normal direction of the first bonding surface SA1 is inclined toward the outside of the first bonding surface SA1 from the edge ED. In the present embodiment, the optical axis of the illumination light source 44 is parallel to the normal line of the imaging surface 43a of the imaging device 43.

In addition, the illumination light source 44 may be disposed on the side of the first optical component bonding body PA1 to which the first layer sheet F1m is bonded.

Further, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may also intersect each other with a slight inclination.

The cutting position of the first layer sheet F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control unit 40 (refer to FIG. 15) acquires the edge ED data stored in the first bonding surface SA1 of the memory unit to determine the cutting position of the first layer F1m so that the first optical component F11 does not exceed the liquid crystal. The size of the outer side of the panel P (outside of the first bonding surface SA1). The first cutting device 31 cuts the first layer sheet F1m at the cutting position determined by the control unit 40.

Returning to Fig. 15, the first cutting device 31 is provided on the downstream side of the panel conveyance of the first detecting device 41. The first cutting device 31 performs laser cutting along the edge ED so as to extend the first layer F1m from the first optical component bonding body PA1 beyond the outer portion of the first bonding surface SA1 (the remaining of the first layer F1m) Partially, the cutting is performed to form an optical component (first optical component F11) corresponding to the size of the first bonding surface SA1. Here, the first cutting device 31 corresponds to the cutting device described in the patent application.

Here, "corresponding to the size of the first bonding surface SA1" indicates the size of the outer shape of the first substrate P1. However, it is a region which is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region of a functional portion such as an electronic component mounting portion.

By the first cutting device 31, the remaining portion of the first layer sheet F1m is cut from the first optical unit bonding body PA1, and the first optical unit F11 is bonded to the surface of the backlight side of the liquid crystal panel P to form a second portion. The optical component is bonded to the body PA2. The remaining portion cut from the first layer sheet F1m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

The inversion device 15 reverses the front/back surface of the second optical component bonding body PA2 facing the upper side on the display surface side of the liquid crystal panel P, and causes the backlight side of the liquid crystal panel P to face the upper side, and the second bonding device 17 Perform calibration of the liquid crystal panel P.

The inverting device 15 has the same calibration function as the panel holding portion 11a of the first adsorption device 11. The reversing device 15 is provided with the same calibration camera 15c as the calibration camera 11b of the first adsorption device 11.

The inverting device 15 determines the width direction and the direction of rotation of the second optical component bonding body PA2 of the second bonding device 17 based on the optical axis direction inspection data stored in the control unit 40 and the imaging data of the calibration camera 15c. s position. In this state, the second optical component bonding body PA2 is guided to the bonding position of the second bonding device 17.

Since the second adsorption device 20 has the same configuration as that of the first adsorption device 11, the same components are denoted by the same reference numerals. The second adsorption device 20 adsorbs the second optical component bonding body PA2 and conveys it to the downstream conveyor 7, and performs calibration (determination of position) of the second optical component bonding body PA2. The second adsorption device 20 includes a panel holding portion 11a, a calibration camera 11b, and a rail R.

The panel holding portion 11a is movable in the vertical direction and the horizontal direction, and holds the second optical component bonding body PA2 that is in contact with the downstream side stopper S by the downstream conveyor 7, and performs the second optical component bonding. Calibration of the fitted PA2. The panel holding portion 11a sucks and holds the upper surface of the second optical component bonding body PA2 that abuts against the stopper S by vacuum suction. The panel holding portion 11a moves on the rail R while the second optical unit bonding body PA2 is being sucked and held, and conveys the second optical unit bonding body PA2. The panel holding portion 11a releases the suction holding when the conveyance is completed, and transmits the second optical component bonding body PA2 to the free roller conveyor 24.

The calibration camera 11b picks up a calibration mark or a front end shape of the second optical component bonding body PA2 when the panel holding portion 11a is held in contact with the second optical component bonding body PA2 that abuts against the stopper S. The photographic data of the calibration camera 11b is transmitted to the control unit 40, and the panel holding unit 11a is actuated based on the photographic data, and the second optical unit bonding body PA2 is calibrated to the destination free roller conveyor 24. In other words, the second optical component bonding body PA2 is opposed to the free roller conveyor 24 in the direction in which the conveying direction is adjusted, the direction in which the conveying direction is orthogonal, and the amount of deviation in the direction of rotation about the vertical axis of the second optical component bonding body PA2. In this state, it is conveyed to the free roller conveyor 24.

The second dust collecting device 16 is provided on the upstream side in the conveying direction of the liquid crystal panel P with respect to the nip roller 23 at the bonding position of the second bonding device 17 . The second dust collecting device 16 performs static elimination and dust collection to remove dust around the second optical component bonding body PA2 before the bonding position, particularly the dust on the lower side.

The second bonding apparatus 17 is provided on the downstream side of the panel conveyance of the second dust collecting device 16. The second bonding apparatus 17 is bonded to the lower side surface of the second optical component bonding body PA2 that is guided to the bonding position, and is bonded to the bonding layer sheet F5 (corresponding to the second layer sheet F2m) of a specific size. The second bonding apparatus 17 includes the same conveying device 22 and the nip roller 23 as the first bonding device 13 .

The second optical component bonding body PA2 and the second layer sheet F2m are superposed and introduced into the gap between one of the nip rollers 23 and the bonding roller 23a (the bonding position of the second bonding device 17). The second layer F2m is a layer of the second optical component layer F2 that is larger in size than the display region P4 of the liquid crystal panel P.

The second optical component bonding body PA2 and the second layer sheet F2m are pinched between the bonding rollers 23a, and are sent to the downstream side of the panel conveyance of the downstream conveyor 7. In the present embodiment, the second layer sheet F2m can be bonded to the surface on the display surface side of the liquid crystal panel P by the nip roller 23 (the first optical component F11 to which the second optical component bonding body PA2 is bonded) The opposite side of the face) to form the third optical component bonding body PA3.

The second detecting device 42 is provided on the downstream side of the panel conveyance of the second bonding device 17. The second detecting device 42 detects the edge of the bonding surface of the liquid crystal panel P and the second layer sheet F2m (hereinafter referred to as the second bonding surface). The edge data detected by the second detecting device 42 is stored in a memory portion not shown in the drawing.

The cutting position of the second layer F2m is adjusted according to the detection result of the edge of the second bonding surface. The control unit 40 (refer to FIG. 15) acquires the data of the edge of the second bonding surface stored in the memory unit to determine the cutting position of the second layer F2m so that the second optical component F12 does not exceed the liquid crystal panel P. The size of the outer side (outside of the second bonding surface). The second cutting device 32 cuts the second layer sheet F2m at the cutting position determined by the control unit 40.

The second cutting device 32 is provided on the downstream side of the panel conveyance of the second detecting device 42. The second cutting device 32 performs laser cutting along the edge of the second bonding surface to extend the second layer F2m from the third optical component bonding body PA3 beyond the outer portion of the second bonding surface (second layer film) The remaining portion of F2m is cut to form an optical component (second optical component F12) corresponding to the size of the second bonding surface.

By the second cutting device 32, the remaining portion of the second layer F2m is cut from the third optical component bonding body PA3, and the second optical component F12 is bonded to the surface of the display surface side of the liquid crystal panel P, and The first optical component F11 is bonded to the surface of the backlight side of the liquid crystal panel P to form a fourth optical component bonding body PA4 (optical component bonding body). The remaining portion cut from the second layer sheet F2m is peeled off from the liquid crystal panel P by the peeling device omitted in the drawing and recovered.

Here, the first cutting device 31 and the second cutting device 32 are constituted by the above-described laser light irradiation device 100. The first cutting device 31 and the second cutting device 32 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the bonding surface.

A bonding inspection device omitted in the drawings is provided on the downstream side of the panel conveyance of the second bonding apparatus 17. The bonding inspection device inspects the workpiece to which the film is bonded (the liquid crystal panel P) by an inspection device omitted in the drawing (determines whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance range) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

Further, in the present embodiment, the control unit 40 as an electronic control unit that integrally controls each part of the film bonding system 1 is included in a computer system. The computer system includes an arithmetic processing unit such as a CPU, and a memory unit such as a memory or a hard disk.

The control unit 40 of the present embodiment includes an interface that can communicate with an external device of the computer system. An input device capable of inputting an input signal can be connected to the control unit 40. The above input device includes an input device such as a keyboard or a mouse, or a communication device that can input data from an external device of the computer system. The control unit 40 may include a display device such as a liquid crystal display that displays the operation state of each part of the film bonding system 1, and may be connected to the display device.

An operating system (OS) for controlling the computer system is installed in the memory unit of the control unit 40. At the memory unit of the control unit 40, the arithmetic processing unit controls each part of the film bonding system 1 to store a program for executing the process of accurately transporting the optical unit layer FX to each part of the film bonding system 1. Various pieces of information including a program stored in the memory unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an application specific integrated circuit (ASIC) that performs various processes required for controlling the respective parts of the film bonding system 1.

The memory unit includes a semiconductor memory such as a random access memory (RAM), a read only memory (ROM), or a hard disk, a CD-ROM reading device, or a disk type memory medium. The concept of an external storage device, etc. In terms of functionality, the memory unit is configured to: store the first adsorption device 11, the first dust collection device 12, the first bonding device 13, the first detection device 41, the first cutting device 31, and the reverse The memory area of the program software of the control sequence of the operation of the rotating device 15, the second adsorption device 20, the second dust collecting device 16, the second bonding device 17, and the second detecting device 42; and other various memory regions.

Hereinafter, an example of a method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P will be described with reference to FIG.

First, as shown in Fig. 22(a), a plurality of checkpoints CP are set in the width direction of the optical component layer FX, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time at which the optical axis is detected may be the time when the roll drum R1 is manufactured, or may be the period before the half of the optical unit layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX is stored in a memory device omitted from the drawing, in the same manner as the position of the optical component layer FX (the position in the longitudinal direction and the width direction of the optical component layer FX).

The control unit 40 acquires the optical axis data (inspection data distributed in the in-plane of the optical axis) of each of the inspection points CP from the memory device to detect the optical component layer FX (which is divided by the transverse line CL) of the portion in which the slice FXm is cut out. The average optical axis direction of the area).

For example, as shown in FIG. 22(b), the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time, and the maximum angle (maximum offset angle) among the offset angles is obtained. When θmax and the minimum angle (minimum offset angle) are θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Further, the average offset angle θmid direction of the edge line EL with respect to the optical component layer FX is detected as the average optical axis direction of the optical component layer FX. Further, the offset angle is calculated, for example, by the edge line EL of the optical component layer FX, the counterclockwise direction being a positive angle, and the clockwise direction being a negative angle.

Further, the average optical axis direction of the optical component layer FX detected by the above method is at a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P, and the bonding of the layer FXm with respect to the liquid crystal panel P is determined. Position (relative fit position). For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.

The cutting device (the first cutting device 31 and the second cutting device 32) detects the outer peripheral edge of the display region P4 of the liquid crystal panel P by a detecting mechanism such as a camera, and cuts the patch continuously along the outer periphery of the bonding surface. The layer FXm of the liquid crystal panel P is joined. The outer edge of the bonding surface is detected by photographing the edge of the bonding surface. In the present embodiment, the laser cutting is performed by the respective cutting devices (the first cutting device 31 and the second cutting device 32) along the outer periphery of the bonding surface.

The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than the vibration amplitude (tolerance) of the cutting blade. Therefore, in the present embodiment, it is easier to cut along the outer periphery of the bonding surface than in the case where the optical module layer FX is cut by the cutting blade, and the liquid crystal panel P can be downsized and/or displayed. The size of the area P4 is large. This can be effectively applied to a high-performance mobile device that requires a display screen to be enlarged under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.

Moreover, in the case where the layer on which the optical component layer FX is integrated in the display region P4 of the liquid crystal panel P is cut and then bonded to the liquid crystal panel P, the dimensional tolerances of the layer and the liquid crystal panel P, and the like The dimensional tolerances of the relative fit positions are superimposed. Therefore, it is difficult to narrow the width of the frame portion G of the liquid crystal panel P (so that the display region is difficult to expand).

On the other hand, the layer FXm of the optical component layer FX having a size exceeding the outer side of the liquid crystal panel P is cut out from the optical component layer FX, and the cut layer FXm is bonded to the liquid crystal panel P, and then cut according to the bonding surface. In this case, it is only necessary to consider the vibration tolerance of the cutting line, and it is possible to reduce the tolerance of the width of the frame portion G (±0.1 mm or less). This also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).

Further, since the layer FXm is cut by the laser of the non-profit blade, stress is not applied to the liquid crystal panel P at the time of cutting, so that cracks or cracks are less likely to occur at the edge of the substrate of the liquid crystal panel P, and the heat cycle and the like can be improved. Durability. Similarly, since the liquid crystal panel P is non-contact-processed, damage to the electronic component mounting portion P5 is also small.

Fig. 23 is a view showing a rectangular scanning using laser light on the layer FXm when the laser light emitting device 100 shown in Fig. 1 is used as the cutting device to cut the layer FXm into a specific size optical module F1X. Schematic diagram of the control method.

Further, in Fig. 23, the symbol Tr indicates the movement trajectory of the laser light (a specific trajectory. Hereinafter, it is referred to as a laser light trajectory). The symbol Tr1 is a trajectory (hereinafter, referred to as a light source movement trajectory) in which the movement trajectory when the pedestal 101 and the scanner 105 are relatively moved is projected on the layer FXm. The light source movement trajectory Tr1 is a curved shape in which four corner portions of the laser light trajectory Tr having a rectangular shape are curved. The symbol K1 is a straight section other than the corner, and the symbol K2 is a curved section of the corner. When the scanner Tr2 displays the scanner 105 to relatively move the light source movement trajectory Tr1, the first irradiation position adjusting means 151 and the second irradiation position adjusting means 154 cause the laser light irradiation position to be orthogonal to the light source movement trajectory Tr1. The degree of offset (whether it has been adjusted) curve (hereinafter referred to as the adjustment curve). The amount of deviation (adjustment amount) of the laser irradiation position is expressed as the distance between the adjustment curve Tr2 of the orthogonal direction of the light source movement trajectory Tr1 and the laser light movement trajectory Tr.

As shown in Fig. 23, the light source moving locus Tr1 is a moving locus of a rectangular shape in which the corner portion is curved. The light source movement trajectory Tr1 and the laser light movement trajectory Tr are substantially identical, and only the shape of the narrow portion at the corner portion is different. When the light source movement trajectory Tr1 has a rectangular outer shape, the scanning speed of the scanner 105 at the rectangular corner portion becomes slow, and the corner portion may be expanded or undulated due to the heat of the laser light. Therefore, in Fig. 23, the corner portion of the light source moving locus Tr1 is curved, and the moving speed of the scanner 105 is approximately constant as a whole of the light source moving locus Tr1.

When the scanner 105 moves the scanner 105 in the linear section K1, since the light source movement trajectory Tr1 and the laser light movement trajectory Tr are identical, the control unit 107 does not adjust by the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154. The laser light illuminates the position and directly irradiates the laser light from the scanner 105 to the layer FXm. On the other hand, when the scanner 105 moves in the bending section K2, since the light source movement trajectory Tr1 does not coincide with the laser light movement trajectory Tr, the first irradiation position adjusting means 151 and the second irradiation position adjusting means 154 are used to control the lightning. The light irradiation position is such that the laser light irradiation position falls on the laser light moving track Tr. For example, when the scanner 105 moves to the position indicated by the symbol M1, the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 cause the laser light to be irradiated in the orthogonal direction N1 of the light source moving locus Tr1. The upper side is offset by the distance W1. The distance W2 between the adjustment curve Tr2 and the laser light moving locus Tr in the orthogonal direction N1 of the W1 system and the light source movement locus Tr1 is the same. The light source movement trajectory Tr1 is disposed inside the laser light movement trajectory Tr, but the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 can shift the laser light irradiation position to the outside of the laser light movement trajectory Tr, so that These deviations are pinned so that the laser light irradiation position is placed on the laser light trajectory Tr.

As described above, the control device 107 deflects the laser light by the scanner 105, and causes the scanner 105 to move relative to the pedestal 101 along the laser beam processing line WCL, whereby the laser light processing line WCL is applied plural times. The laser beam is superimposed to form an illuminated overlapping portion Up. When the control device 107 moves the scanner 105 in the linear section K1, the scanner 105 deflects the laser light toward the outside of the laser light trajectory TR. On the other hand, when the scanner 105 moves in the bending section K2, the scanner 105 is directed outward of the adjustment curve TR2 to deflect the laser light.

As described above, according to the film bonding system 1 of the present embodiment, the first cutting device 31 and the second cutting device 32 are constituted by the above-described laser beam irradiation device. Therefore, the layer sheets (the first layer sheet F1m and the second layer sheet F2m) can be sharply cut, and the problem of low cutting quality can be suppressed.

Further, by the control of the control device 107, the mobile device 106 and the scanner 105 can be controlled to draw the desired laser light trajectory Tr at the layer FXm. In this configuration, the laser light irradiation section adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only at the narrow bending section K2. In addition, the wider linear section K1 is scanned by the moving device 106 by the pedestal 101 to scan the layer FXm with laser light. In the present embodiment, the laser beam scanning is mainly performed by the mobile device 106, and the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 are only used to adjust the laser light irradiation position at which the mobile device 106 cannot control the precision. Area. Therefore, the laser light irradiation position can be controlled with good precision over a wide range as compared with the case where the laser scanning is performed only by the mobile device 106 or only the scanner 105.

Further, the photographing direction of the photographing device 43 is obliquely intersected with respect to the normal direction of the first bonding surface SA1. That is, the photographing direction of the photographing device 43 is set such that the end edge of the second substrate P2 does not enter the photographing field of view of the photographing device 43. Therefore, when the first layer F1m is penetrated and the edge ED of the first bonding surface SA1 is detected, the edge of the second substrate P2 is not erroneously detected, and only the first bonding surface can be detected. The edge ED of SA1. Therefore, the edge ED of the first bonding surface SA1 can be accurately detected.

Moreover, the layer sheets (the first layer sheet F1m and the second layer sheet F2m) having a size beyond the outer side of the liquid crystal panel P are bonded to the liquid crystal panel P, respectively, and the layer sheets are cut (the first layer sheet F1m and the second layer sheet F2m). The remaining portion can be formed on the surface of the liquid crystal panel P by optical components (the first optical component F11 and the second optical component F12) corresponding to the size of the bonding surface. Thereby, the optical components (the first optical component F11 and the second optical component F12) can be provided with good precision up to the edge of the bonding surface, and the frame portion G outside the display region P4 can be reduced, and the display region can be enlarged and the machine can be miniaturized. purpose.

Further, the layer sheets (the first layer sheet F1m and the second layer sheet F2m) having a size beyond the outside of the display region P4 are bonded to the liquid crystal panel P, even if the optical axis direction is due to the layer sheet (the first layer sheet F1m and the second layer) When the position of the layer F2m) is changed, the liquid crystal panel P can be aligned and bonded in accordance with the direction of the optical axis. Thereby, the accuracy of the optical axis direction of the optical components (the first optical component F11 and the second optical component F12) with respect to the liquid crystal panel P can be improved, and the color degree and contrast of the optical display device can be improved.

Further, in the case where the cutting device (the first cutting device 31 and the second cutting device 32) cuts the layer sheets (the first layer sheet F1m and the second layer sheet F2m) by laser, the layer is cut by using a sharp edge ( In the case of the first layer sheet F1m and the second layer sheet F2m), stress is not applied to the liquid crystal panel P, so that cracks or cracks are less likely to occur, and the stability and durability of the liquid crystal panel P can be obtained.

Further, in the present embodiment, the configuration in which the laser beam is irradiated onto the target object and the specific processing is performed is described as a configuration in which the layer sheet is cut, but the invention is not limited thereto. For example, the layer may be divided into at least two layers, a layer that penetrates the layer by a slit, or a groove portion (cut) formed at a predetermined depth in the layer. More specifically, there are, for example, cutting (cutting), half cutting, marking processing, and the like of the end portions of the plies.

Further, in the present embodiment, the case where the laser light drawing trajectory irradiated by the laser beam irradiation device has a rectangular outer shape (square shape) in plan view is described, but the present invention is not limited thereto. For example, the laser light trajectory illuminated by the laser light irradiation device may have a triangular shape in plan view, and may also have a polygonal shape above a pentagon shape in plan view. Further, the present invention is not limited thereto, and the star shape, the geometric shape, and the like may be used in the plan view. These depicted traces can be adapted to the present invention.

Further, in the present embodiment, the optical component layer FX is unwound from the roll drum, and the layer FXm having a size beyond the outer side of the liquid crystal panel P is bonded to the liquid crystal panel P, and the corresponding layer is cut out from the layer FXm. The optical module F1X of the size of the bonding surface of the liquid crystal panel P is described, but is not limited thereto. For example, a case where a single-piece optical film slice cut out beyond the outer dimension of the liquid crystal panel P is bonded to the liquid crystal panel without using a roll cylinder can also be applied to the present invention.

Although the preferred embodiments of the present embodiment have been described above with reference to the attached drawings, the present invention is not limited to the examples. The respective shapes, combinations, and the like of the respective components shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the gist of the invention.

1. . . Film bonding system

5. . . Roller conveyor

6. . . Upstream conveyor

7. . . Downstream conveyor

11. . . First adsorption device

11a. . . Panel holding unit

11b. . . Calibration camera

12. . . First dust collecting device

13. . . First bonding device

15. . . Reversing device

15c. . . Calibration camera

16. . . Second dust collecting device

17. . . Second bonding device

20. . . Second adsorption device

twenty two. . . Transport device

22a. . . Roller holder

22b. . . Guide roller

22c. . . Cutting device

22d. . . Blade

22e. . . Coiling department

twenty three. . . Clamping roller

23a. . . Fitting roller

twenty four. . . Free roller conveyor

26. . . Adsorption plate

31. . . First cutting device

32. . . Second cutting device

40. . . Control department

41. . . First detecting device

42. . . Second detecting device

43. . . Photography device

43a. . . Shooting surface

44. . . Illumination source

100. . . Laser light irradiation device

101. . . Pedestal

101s. . . Keep face

101s1. . . First holding surface

101s2. . . Second holding surface

102. . . Laser oscillator

103. . . Acousto-optic component

104. . . Imaging optical slide

105. . . Scanner

105s. . . Scanning area

106. . . Mobile device

107. . . Control device

108. . . Second concentrating lens

109. . . Input device

110. . . Object object

130. . . Electron beam forming

131. . . driver

141. . . First collecting lens

142. . . First holding frame

143. . . Aperture assembly

143h. . . Pinhole

144. . . Holding component

145. . . Collimating lens

146. . . Second holding frame

147. . . Mobile agency

148. . . Sliding mechanism

149. . . Keep the table

151. . . First illumination position adjusting device

152,155. . . mirror

153,156. . . Actuator

154. . . Second irradiation position adjusting device

161. . . First slider mechanism

162. . . Second slider mechanism

171. . . Laser control department

172. . . Scanner control unit

173. . . Slider control unit

AR1. . . Use part

AR2. . . The remaining part

CA. . . Inspection area

C. . . Optical axis

CL. . . Transverse line

CP. . . checking point

ED. . . End edge

EL. . . Edge line

F1X. . . Optical component

F1. . . First optical component layer

F11. . . First optical component

F12. . . Second optical component

F1a. . . Optical component body

F1m. . . First layer

F2. . . Second optical component layer

F2a. . . Adhesive layer

F2m. . . Second layer

F3a. . . Separation layer

F4a. . . Surface protection film

F5. . . Fitting layer

F6. . . Polarizer

F7. . . First film

F8. . . Second film

FX. . . Optical component layer

FXm. . . Layer

G. . . Border part

G1. . . Rising part

G2. . . Falling part

H. . . height

K. . . Chain line surrounding part

K1. . . Straight line interval

K2. . . Bending interval

L. . . laser

L1, L2. . . Cutting line

M1. . . symbol

N1. . . Orthogonal direction

P. . . LCD panel

P1. . . First substrate

P2. . . Second substrate

P3. . . Liquid crystal layer

P4. . . Display area

PA1. . . First optical component bonding body

PA2. . . Second optical component bonding body

PA3. . . Third optical component bonding body

PA4. . . Fourth optical component bonding body

PL1, PL2. . . Collection pulse

Ps1, Ps2, Ps3, Ps4. . . pulse

R. . . track

R1. . . Roll roller

R2. . . Separation roller

S. . . Stopper

SA1. . . First fit surface

Tr. . . Laser light trajectory

Tr1. . . Light source movement track

Tr2. . . Adjustment curve

Ur, Ur1, Ur2. . . Laser light trajectory

Ur3, UrX. . . Laser light trajectory

Us. . . Relative movement track

Up, Up1, Up2, Up3. . . Overlapping part

Uw. . . width

V1. . . Valley

V2. . . Valley

W1, W2. . . distance

WCL. . . Laser light processing line

θ. . . slope

Θmax. . . Maximum offset angle

Θmin. . . Minimum offset angle

Θmid. . . Average offset angle

Fig. 1 is a perspective view showing a laser beam irradiation apparatus according to an embodiment of the present invention. Fig. 2 is a schematic view showing the structure of an electron beam forming (EBS). Fig. 3 is a perspective view showing the internal structure of an imaging optical track (IOR, Imaging Optics Rail). Fig. 4 is a cross-sectional view showing the arrangement of the first collecting lens, the diaphragm assembly, and the collimator lens. Fig. 5 is a view showing the structure of a control system of a laser light irradiation device. Fig. 6 is a diagram for explaining the function of EBS. Figure 7 is a schematic diagram of a pulse for laser light in Figure 6. Fig. 8 is a diagram for explaining the action of the IOR. Figure 9 is a schematic diagram of a laser light processing line. Fig. 10 is a view showing a trajectory of laser light movement when a target object is cut using a laser light irradiation device of a comparative example. Fig. 11 is a schematic view showing a trajectory of laser light movement when a target object is cut by using the laser light irradiation device of the present embodiment. Fig. 12 is a view showing a first modification of the laser light trajectory of the embodiment. Fig. 13 is a view showing a second modification of the laser light trajectory of the embodiment. Fig. 14 is a view showing a third modification of the laser light trajectory of the embodiment. Fig. 15 is a schematic view showing a manufacturing apparatus of an optical component bonding body according to an embodiment of the present invention. Figure 16 is a plan view of a liquid crystal panel. Figure 17 is a cross-sectional view taken along line A-A of Figure 16. Figure 18 is a cross-sectional view of the optical component layer. Fig. 19 is a schematic view showing the operation of the cutting device. Figure 20 is a plan view showing the detecting step of the edge of the bonding surface. Figure 21 is a schematic view of the detecting device. Fig. 22 is a view showing an example of a method of determining the bonding position of the layer of the liquid crystal panel. Figure 23 is a schematic diagram showing a control method for drawing a specific trajectory by laser light.

100. . . Laser light irradiation device

101. . . Pedestal

101s. . . Keep face

101s1. . . First holding surface

101s2. . . Second holding surface

102. . . Laser oscillator

103. . . Acousto-optic component

104. . . Imaging optical slide

105. . . Scanner

105s. . . Scanning area

106. . . Mobile device

107. . . Control device

108. . . Second concentrating lens

110. . . Object object

151. . . First illumination position adjusting device

152,155. . . mirror

153,156. . . Actuator

154. . . Second irradiation position adjusting device

161. . . First slider mechanism

162. . . Second slider mechanism

171. . . Laser control department

172. . . Scanner control unit

173. . . Slider control unit

L. . . laser

Claims (6)

A laser light irradiation device comprises: a pedestal having a holding surface for holding a target object; a laser light oscillating device for oscillating the laser light; and a scanner for performing the laser light in a parallel plane of the holding surface a scanning device; a moving device that moves the pedestal relative to the scanner; and a control device that controls the scanner and the mobile device; wherein the control device causes the ray to be caused by the scanner The light is deflected and the scanner is moved relative to the pedestal along the laser processing line, whereby the laser beam is superimposed on the laser processing line to form an illuminated overlapping portion. The laser light irradiation device of claim 1, wherein the control device rotates the laser light by the scanner and moves the scanner relative to the pedestal along the laser processing line. The laser light irradiation device of claim 2, wherein the scanner deflects the laser light toward a remaining portion of the outer side of the laser processing line. The laser light irradiation device of claim 1, wherein the control device linearly vibrates the laser light along the laser processing line by the scanner, and causes the scanner along the laser processing line. Move relative to the pedestal. The laser light irradiation device of claim 1, further comprising a collecting lens such that the laser light emitted from the scanner is concentrated toward the holding surface. A manufacturing device for an optical component bonding body is a manufacturing device for bonding an optical component to an optical display component to form an optical component bonding body, the manufacturing device comprising: a bonding device for displaying a display area of the optical display component a larger optical component layer is attached to the optical display component to form a conforming layer; and a cutting device is used to cut the opposing portion of the display region in the optical component layer from the remaining portion of the opposite portion of the opposing portion Cutting an optical component corresponding to the size of the display area from the optical component layer, thereby cutting an optical component bonding body including the optical display component and the optical component overlapping the optical display component from the bonding layer; The cutting device is constituted by the laser beam irradiation device described in claim 1, and the optical component layer as the target object is cut by the laser light irradiated from the laser beam irradiation device.