TW201439470A - Lamp and method for manufacturing the same - Google Patents

Lamp and method for manufacturing the same Download PDF

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Publication number
TW201439470A
TW201439470A TW102113221A TW102113221A TW201439470A TW 201439470 A TW201439470 A TW 201439470A TW 102113221 A TW102113221 A TW 102113221A TW 102113221 A TW102113221 A TW 102113221A TW 201439470 A TW201439470 A TW 201439470A
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Taiwan
Prior art keywords
lamp
luminaire
lamp cover
opening
light source
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TW102113221A
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Chinese (zh)
Inventor
Te-Yuan Kung
Chueh-Kuang Chan
Hang-Yu Gao
Tao Niu
Kuang-Ming Hsiao
Chun-Wei Liang
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Hon Hai Prec Ind Co Ltd
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Publication of TW201439470A publication Critical patent/TW201439470A/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A lamp includes a head, a base connected to the head, a light source mounted on the base and a cover covering the light source. The cover has a plurality of elongated openings to allow light emitted from the light source to radiate out of the cover. The lamp has a high heat dissipation efficiency. A method for manufacturing the lamp is also provided.

Description

燈具及其製造方法Lamp and its manufacturing method

本發明涉及一種發光裝置,特別是指一種燈具。The invention relates to a lighting device, in particular to a lighting fixture.

習知的燈具一般由燈座、燈罩、光源及燈頭組成的。光源安裝於燈座上,並與燈頭導電連接。燈罩固定於燈座上並密封住光源。然而,對於一些對熱量比較敏感的光源,例如發光二極體等,由於光源被密封於燈罩內,導致燈罩內的熱量不易從燈罩內散發出去,影響到此類光源的正常工作。Conventional luminaires generally consist of a lamp holder, a lamp cover, a light source and a lamp holder. The light source is mounted on the lamp holder and electrically connected to the lamp cap. The lamp cover is fixed to the lamp holder and seals the light source. However, for some light sources that are sensitive to heat, such as light-emitting diodes, etc., since the light source is sealed in the lamp cover, the heat in the lamp cover is not easily dissipated from the lamp cover, which affects the normal operation of such a light source.

因此,有必要提供一種散熱效率高的燈具及其製造方法。Therefore, it is necessary to provide a lamp having high heat dissipation efficiency and a method of manufacturing the same.

一種燈具,包括燈座、安裝於燈座上的光源、連接燈座的燈頭及罩設光源的燈罩,燈罩上設有長形的開孔。A lamp comprises a lamp holder, a light source mounted on the lamp holder, a lamp cap connecting the lamp holder and a lamp cover covering the light source, wherein the lamp cover is provided with an elongated opening.

一種燈具的製造方法,包括:提供板材;加工板材,形成具有長形的開孔的燈罩;將燈罩接合於安裝有光源的燈座上。A method of manufacturing a lamp, comprising: providing a plate; processing the plate to form a lamp cover having an elongated opening; and bonding the lamp cover to the lamp holder on which the light source is mounted.

由於燈罩上設有開孔,因此光源所發出的熱量可經由燈罩的開孔直接向外散發,從而提升整個燈具的散熱效率。Since the lamp cover is provided with an opening, the heat generated by the light source can be directly radiated outward through the opening of the lamp cover, thereby improving the heat dissipation efficiency of the entire lamp.

10...燈具10. . . Lamp

20...燈頭20. . . Lamp head

22...側壁twenty two. . . Side wall

220...螺紋220. . . Thread

24...接點twenty four. . . contact

26...絕緣帶26. . . Insulating tape

30...燈座30. . . Lamp holder

300...空間300. . . space

32...基板32. . . Substrate

320...頂面320. . . Top surface

322...底面322. . . Bottom

324...穿孔324. . . perforation

34...套筒34. . . Sleeve

342...底面342. . . Bottom

36...套接部36. . . Socket

360...螺紋360. . . Thread

38...凸緣38. . . Flange

380...頂面380. . . Top surface

382...底面382. . . Bottom

40...光源40. . . light source

42...發光二極體42. . . Light-emitting diode

44...電路板44. . . Circuit board

50...燈罩50. . . lampshade

52...殼體52. . . case

520...開孔520. . . Opening

54...折邊54. . . Folding

60...驅動模組60. . . Drive module

70...導線70. . . wire

80...配光曲線80. . . Light distribution curve

90...配光曲線90. . . Light distribution curve

50a...金屬板材50a. . . Sheet metal

52a...模型52a. . . model

54a...板體54a. . . Plate body

56a...側板56a. . . Side panel

50b...燈罩50b. . . lampshade

51b...連接部51b. . . Connection

52b...殼體52b. . . case

520b...開孔520b. . . Opening

53b...連接部53b. . . Connection

54b...折邊54b. . . Folding

56b...鰭片56b. . . Fin

圖1示出了本發明一實施例的燈具的立體圖。Fig. 1 shows a perspective view of a lamp according to an embodiment of the present invention.

圖2為圖1的燈具的倒置圖。2 is an inverted view of the luminaire of FIG. 1.

圖3為圖1的燈具的分解圖,其中光源被移去以方便觀察。3 is an exploded view of the luminaire of FIG. 1 with the light source removed for ease of viewing.

圖4為圖3的燈具的倒置圖。4 is an inverted view of the luminaire of FIG.

圖5為圖1的燈具的剖面圖。Figure 5 is a cross-sectional view of the luminaire of Figure 1.

圖6為圖1的燈具的配光曲線。Figure 6 is a light distribution curve of the lamp of Figure 1.

圖7為本發明另一實施例的燈具的剖面圖。Figure 7 is a cross-sectional view of a lamp according to another embodiment of the present invention.

圖8-13為圖1的燈具的各個製造步驟。8-13 are various manufacturing steps of the luminaire of Fig. 1.

圖14為本發明又一實施例的燈具的燈罩的立體圖。Figure 14 is a perspective view of a lampshade of a lamp according to still another embodiment of the present invention.

請參閱圖1及圖5,示出本發明一實施例的燈具10。燈具10包括一燈頭20、一燈座30、一光源40及一燈罩50。Referring to Figures 1 and 5, a light fixture 10 in accordance with one embodiment of the present invention is illustrated. The lamp 10 includes a lamp cap 20, a lamp holder 30, a light source 40, and a lamp cover 50.

請一併參閱圖2-4,燈座30由導熱且絕緣的材料製成,如陶瓷、導熱塑膠等。本實施例中,燈座30由陶瓷一體成型。燈座30包括一基板32、一從基板32周緣向燈頭20方向延伸的套筒34及一形成於套筒34底端的套接部36。基板32呈圓盤狀,其包括一頂面320及與頂面320平行的底面322。基板32上開設有從其頂面320貫穿至底面322的四穿孔324。該四穿孔324均勻分佈於基板32上,且靠近基板32外側周緣。可以理解,所述穿孔324的數量也可以為兩個、三個等,其位置也不限於在基板32的邊緣。套筒34自基板32的外側周緣向下垂直延伸而出。本實施例中,套筒34呈圓筒形,其厚度大於基板32的厚度。套筒34在其外側周面靠近底部的位置處形成一外凸的凸緣38。該凸緣38呈圓環形,其頂面380低於基板32頂面320,其底面382高於套筒34的底面342。並且,凸緣38的頂面380與基板32頂面320的間距大於凸緣38底面382與套筒34底面342的間距。本實施例中,凸緣38的底面382呈傾斜狀,其朝向套筒34的底面342呈漸縮的錐形。套筒34的內逕自上至下保持一致,套筒34在高於凸緣38位置處的外徑大於低於凸緣38位置處的外徑。套接部36連接套筒34的底端。套接部36的內徑與套筒34的內徑相同,外徑小於套筒34的最小外徑。套接部36的內側周面、套筒34的內側周面及基板32的底面322共同圍設出一圓柱形空間300,用於收容一驅動模組60。該空間300通過基板32的四穿孔324與基板32上方的空間連通。套接部36的外側周面上形成螺紋360,用於與燈頭20螺接。Please refer to FIG. 2-4 together. The lamp holder 30 is made of a heat-conductive and insulating material such as ceramics and heat-conductive plastic. In this embodiment, the socket 30 is integrally formed of ceramic. The lamp holder 30 includes a substrate 32, a sleeve 34 extending from the periphery of the substrate 32 toward the base 20, and a sleeve portion 36 formed at the bottom end of the sleeve 34. The substrate 32 has a disk shape and includes a top surface 320 and a bottom surface 322 parallel to the top surface 320. The substrate 32 is provided with four through holes 324 extending from the top surface 320 thereof to the bottom surface 322. The four through holes 324 are evenly distributed on the substrate 32 and close to the outer periphery of the substrate 32. It can be understood that the number of the through holes 324 may also be two, three, etc., and the position thereof is not limited to the edge of the substrate 32. The sleeve 34 extends vertically downward from the outer periphery of the substrate 32. In the present embodiment, the sleeve 34 has a cylindrical shape with a thickness greater than the thickness of the substrate 32. The sleeve 34 is formed with a convex flange 38 at a position where its outer peripheral surface is close to the bottom. The flange 38 is annular in shape with a top surface 380 that is lower than the top surface 320 of the substrate 32 and a bottom surface 382 that is higher than the bottom surface 342 of the sleeve 34. Moreover, the spacing of the top surface 380 of the flange 38 from the top surface 320 of the substrate 32 is greater than the spacing of the bottom surface 382 of the flange 38 from the bottom surface 342 of the sleeve 34. In the present embodiment, the bottom surface 382 of the flange 38 is inclined and tapered toward the bottom surface 342 of the sleeve 34. The inner diameter of the sleeve 34 is uniform from top to bottom, and the outer diameter of the sleeve 34 at a position higher than the flange 38 is greater than the outer diameter at a position lower than the flange 38. The ferrule 36 connects the bottom end of the sleeve 34. The inner diameter of the socket portion 36 is the same as the inner diameter of the sleeve 34, and the outer diameter is smaller than the minimum outer diameter of the sleeve 34. The inner circumferential surface of the socket portion 36, the inner circumferential surface of the sleeve 34, and the bottom surface 322 of the substrate 32 collectively define a cylindrical space 300 for receiving a driving module 60. The space 300 communicates with the space above the substrate 32 through the four perforations 324 of the substrate 32. A thread 360 is formed on the outer circumferential surface of the socket portion 36 for screwing with the base 20.

光源40包括一電路板44及安裝於電路板44上的一發光二極體42。電路板44優選為金屬基電路板(即以金屬作為基底,然後依次在金屬基底上形成絕緣層及電路層),以提供較強的導熱能力。發光二極體42的晶片(圖未示)直接安裝於電路板44(chip on board)上,由此,晶片工作時所產生的熱量可直接傳導至電路板44上,從而提升傳熱效率。發光二極體42的晶片優選為由氮化鎵、氮化銦鎵、氮化鋁銦鎵等半導體發光材料製成,其在受到電流激發下將發出藍色的光線。晶片的二電極通過二導線或者通過倒裝技術直接連接於電路板44的二電極(圖未示)上,從而與電路板44電導通。發光二極體42還包括覆蓋晶片的封裝層(圖未示)。封裝層優選由透光性材料製成,如環氧樹脂、矽膠等等。封裝層內進一步摻雜有螢光粉。螢光粉可由釔鋁石榴石、矽酸鹽、氧化物、氮氧化物等螢光材料製成,其可在晶片藍光的激發下發出黃光,進而與藍光混合成白光。電路板44的二電極通過穿過基板32穿孔324的導線70與驅動模組60連接,從而為晶片提供電能。The light source 40 includes a circuit board 44 and a light emitting diode 42 mounted on the circuit board 44. The circuit board 44 is preferably a metal-based circuit board (i.e., a metal is used as a substrate, and then an insulating layer and a circuit layer are sequentially formed on the metal substrate) to provide a strong thermal conductivity. The wafer (not shown) of the light-emitting diode 42 is directly mounted on the chip on board 44, whereby heat generated during operation of the wafer can be directly conducted to the circuit board 44, thereby improving heat transfer efficiency. The wafer of the light-emitting diode 42 is preferably made of a semiconductor light-emitting material such as gallium nitride, indium gallium nitride or aluminum indium gallium nitride, which emits blue light when excited by current. The two electrodes of the wafer are directly connected to the two electrodes (not shown) of the circuit board 44 through two wires or by flip chip technology, thereby being electrically connected to the circuit board 44. The LED 42 further includes an encapsulation layer (not shown) covering the wafer. The encapsulating layer is preferably made of a light transmissive material such as epoxy resin, silicone rubber or the like. The encapsulation layer is further doped with phosphor powder. The phosphor powder can be made of a fluorescent material such as yttrium aluminum garnet, citrate, oxide, oxynitride, etc., which can emit yellow light under excitation of the blue light of the wafer, and then mix with blue light to form white light. The two electrodes of circuit board 44 are coupled to drive module 60 by wires 70 that pass through holes 324 in substrate 32 to provide electrical energy to the wafer.

燈罩50由金屬材料一體形成。優選地,本發明採用鋁作為燈罩50的材料,以使燈罩50具有較高的散熱能力。燈罩50的厚度可小於基板32的厚度。燈罩50包括一殼體52及形成於殼體52底端的一折邊54。折邊54從殼體52底部豎直向下延伸。折邊54呈圓環狀,其內徑大於或等於套筒34位於凸緣38上方的外徑。由此,折邊54可套設於套筒34外側周面上,從而將燈罩50卡接於燈座30上。折邊54的外徑小於凸緣38的外徑,因此,折邊54在套設於套筒34上之後,將會抵接於凸緣38的頂面380,從而防止整個燈座30陷入燈罩50內。由於燈罩50可直接通過折邊54卡接於燈座30上,因而燈罩50與燈座30之間的組裝十分方便,從而簡化整個燈具10的組裝過程。殼體52的上半部分呈半球狀,下半部分呈朝下漸縮的錐形。殼體52上開設多個開孔520,本實施例中,該多個開孔520均勻開設在殼體52上。本實施例中,每一開孔520均呈圓形。這些開孔520從殼體52的頂部延伸至靠近殼體52底部的位置處。這些開孔520呈多行環設於殼體52的整個外側周面上。其中,最上面一行的開孔520的數量最少,各行開孔520的數量從殼體52頂部朝向殼體52中部逐漸增多,並從殼體52中部朝向殼體52底部又逐漸減少。換句話說,各行開孔520的數量與殼體52的外徑保持一致的變化趨勢。本實施例中,基板32的高度與最下面一行的開孔520的高度齊平。因此,在燈罩50與燈座30組裝之後,發光二極體42要高於位於最下面一行的開孔520,並大致與下面倒數第二行的開孔520齊平。當然,考慮到安全原因,發光二極體42的高度還可以低於最下面一行開孔520(如圖7所示),從而避免從開孔520中直接看到發光二極體42。The globe 50 is integrally formed of a metal material. Preferably, the present invention employs aluminum as the material of the lamp cover 50 to provide the lamp cover 50 with a high heat dissipation capability. The thickness of the globe 50 can be less than the thickness of the substrate 32. The lamp cover 50 includes a housing 52 and a flange 54 formed at a bottom end of the housing 52. The hem 54 extends vertically downward from the bottom of the housing 52. The hem 54 is annular and has an inner diameter greater than or equal to the outer diameter of the sleeve 34 above the flange 38. Thus, the flange 54 can be sleeved on the outer circumferential surface of the sleeve 34 to engage the lamp cover 50 with the socket 30. The outer diameter of the flange 54 is smaller than the outer diameter of the flange 38. Therefore, after the sleeve 54 is sleeved on the sleeve 34, it will abut against the top surface 380 of the flange 38, thereby preventing the entire socket 30 from falling into the lampshade. Within 50. Since the lamp cover 50 can be directly engaged with the lamp holder 30 through the flange 54, the assembly between the lamp cover 50 and the lamp holder 30 is very convenient, thereby simplifying the assembly process of the entire lamp 10. The upper half of the housing 52 has a hemispherical shape, and the lower half has a tapered shape that tapers downward. A plurality of openings 520 are defined in the housing 52. In the embodiment, the plurality of openings 520 are evenly formed on the housing 52. In this embodiment, each of the openings 520 has a circular shape. These openings 520 extend from the top of the housing 52 to a position near the bottom of the housing 52. These openings 520 are arranged in a plurality of rows on the entire outer circumferential surface of the casing 52. Wherein, the number of the openings 520 of the uppermost row is the smallest, and the number of the openings 520 of each row gradually increases from the top of the casing 52 toward the middle of the casing 52, and gradually decreases from the middle of the casing 52 toward the bottom of the casing 52. In other words, the number of rows of openings 520 is consistent with the outer diameter of the housing 52. In this embodiment, the height of the substrate 32 is flush with the height of the opening 520 of the lowermost row. Therefore, after the lampshade 50 is assembled with the lamp holder 30, the light-emitting diode 42 is higher than the opening 520 located at the lowermost row and is substantially flush with the opening 520 of the penultimate row below. Of course, for safety reasons, the height of the LED 42 can also be lower than the lower row of openings 520 (as shown in FIG. 7), thereby avoiding direct viewing of the LED 42 from the opening 520.

由於燈罩50是由金屬製成,因而其內側壁面具備較高的反射率(當然,也可進一步在燈罩50的內側壁面上塗上一層高反射率的材料,以獲得更佳的反射效果)。發光二極體42發出的一部分光線會直接從燈罩50的開孔520中出射,還有一部分光線會直接照射至燈罩50的內側壁面,然後經由內側壁面的反射從燈罩50的開孔520出射。由於燈罩50內側壁面的反射率較高,因而光線在反射過程中損耗較少,從而使最終的出光效率得到提升。並且,由於開孔520是基本遍佈於整個殼體52上的,再加上光線在殼體52內側壁面上的各方向的反射,因此,從開孔520中射出的光可朝向各個角度及方位出射,從而使整個燈具10獲得近乎360度的全景照明效果。優選地,所述殼體52內側壁面為漫反射面。此外,開孔520均勻開設於殼體52上可確保自燈罩50輸出的光線的均勻性,從而使燈具10各角度的出射光強保持一致(如圖6所示,在兩個相互垂直方向上的配光曲線80、90基本重合)。再者,燈罩50是金屬製造並直接套設於燈座30上的,因此發光二極體42產生熱量可通過燈座30傳輸至燈罩50上,然後經由燈罩50散發至外界環境當中,從而提升整個燈具10的散熱效率。當然,由於燈座30本身也是採用導熱性材料製造,並且也是直接暴露於外界環境當中,因此發光二極體42傳導至燈座30的熱量也可以直接從燈座30散發至外界環境當中。最後,由於燈罩50的內部空間是通過開孔520與外界環境連通的,因此發光二極體42所產生的熱量還可直接散發到發光二極體42周圍的空氣當中,然後這部分被加熱的空氣經由開孔520直接對流至外界環境當中。即是說,本發明的燈具10至少有三條散熱路徑:第一條是經由燈座30傳遞至燈罩50向外散熱,第二條是直接由燈座30向外散熱,第三條是由燈罩50內的空氣通過開孔520與燈罩50外的空氣對流散熱。Since the lamp cover 50 is made of metal, its inner side wall surface has a high reflectance (of course, a high reflectance material may be further applied to the inner side wall surface of the lamp cover 50 to obtain a better reflection effect). A part of the light emitted from the LED 42 is directly emitted from the opening 520 of the lamp cover 50, and a part of the light is directly incident on the inner wall surface of the lamp cover 50, and then is emitted from the opening 520 of the lamp cover 50 through the reflection of the inner wall surface. Since the reflectance of the inner side wall surface of the lamp cover 50 is high, the light is less lost during the reflection process, so that the final light extraction efficiency is improved. Moreover, since the opening 520 is substantially distributed over the entire casing 52, and the light is reflected in various directions on the inner wall surface of the casing 52, the light emitted from the opening 520 can be directed to various angles and orientations. The exit is such that the entire luminaire 10 achieves a nearly 360 degree panoramic illumination effect. Preferably, the inner wall surface of the casing 52 is a diffuse reflection surface. In addition, the opening 520 is evenly disposed on the casing 52 to ensure the uniformity of the light output from the lamp cover 50, so that the light intensity of the lamps 10 at all angles is consistent (as shown in FIG. 6, in two mutually perpendicular directions). The light distribution curves 80, 90 are substantially coincident). Moreover, the lamp cover 50 is made of metal and directly sleeved on the lamp holder 30. Therefore, heat generated by the LED body 42 can be transmitted to the lamp cover 50 through the lamp holder 30, and then radiated to the external environment via the lamp cover 50, thereby lifting The heat dissipation efficiency of the entire luminaire 10. Of course, since the lamp holder 30 itself is also made of a heat conductive material and is also directly exposed to the external environment, the heat conducted by the light emitting diode 42 to the lamp holder 30 can also be directly radiated from the lamp holder 30 to the external environment. Finally, since the inner space of the lamp cover 50 is in communication with the external environment through the opening 520, the heat generated by the light-emitting diode 42 can be directly radiated into the air around the light-emitting diode 42, and then this portion is heated. Air is directly convected through the opening 520 to the outside environment. That is to say, the lamp 10 of the present invention has at least three heat dissipation paths: the first piece is transmitted to the lamp cover 50 via the lamp holder 30 to radiate heat outward, the second piece is directly radiated outward from the lamp holder 30, and the third piece is covered by the lamp cover. The air in 50 passes through the opening 520 to convect heat with the air outside the lamp cover 50.

燈頭20為一通用的燈泡型燈頭,其可與習知的燈泡插座(圖未示)匹配。燈頭20包括一環狀的側壁22、一接點24及一連接接點24及側壁22的絕緣帶26。側壁22的外側周面及內側周面形成對應的螺紋220。側壁22套設於燈座30的套接部36上,其內螺紋220與套接部36的螺紋360干涉配合,從而將燈頭20與燈座30固定。側壁22的外螺紋220用於與習知的燈泡插座的內螺紋配合,從而將燈具10與燈泡插座固定連接。側壁22及接點24均採用金屬材料製成,絕緣帶26連接側壁22及接點24而將二者絕緣。驅動模組60通過二導線70分別連接側壁22及接點24,從而接收自燈頭20輸入的電能。由於燈座30是採用絕緣的陶瓷材料製造,因此金屬燈罩50可與燈頭20通過燈座30絕緣,從而避免燈罩50帶電。The base 20 is a universal bulb-type base that can be mated with conventional bulb sockets (not shown). The base 20 includes an annular side wall 22, a contact 24, and an insulating strip 26 connecting the contacts 24 and the side walls 22. The outer circumferential surface and the inner circumferential surface of the side wall 22 form corresponding threads 220. The side wall 22 is sleeved on the sleeve portion 36 of the socket 30, and the internal thread 220 is interference-fitted with the thread 360 of the socket portion 36 to fix the base 20 to the socket 30. The external threads 220 of the side walls 22 are adapted to mate with the internal threads of a conventional bulb socket to securely attach the luminaire 10 to the bulb socket. Both the side wall 22 and the contact 24 are made of a metal material, and the insulating tape 26 is connected to the side wall 22 and the contact 24 to insulate the two. The driving module 60 is connected to the side wall 22 and the contact 24 through the two wires 70 to receive the electric energy input from the lamp cap 20. Since the lamp holder 30 is made of an insulating ceramic material, the metal lamp cover 50 can be insulated from the lamp cap 20 by the lamp holder 30, thereby preventing the lamp cover 50 from being charged.

如圖8-13所示,本發明進一步提供一種燈具10的製造方法,其主要包括如下步驟:As shown in FIG. 8-13, the present invention further provides a manufacturing method of the lamp 10, which mainly includes the following steps:

首先,如圖8所示提供一金屬板材50a。該金屬板材50a優選為鋁板,以提供較佳的延展性,方便後續的製造過程。金屬板材50a的頂面與底面平行。First, a metal plate 50a is provided as shown in FIG. The sheet metal 50a is preferably an aluminum sheet to provide better ductility for subsequent manufacturing processes. The top surface of the metal sheet 50a is parallel to the bottom surface.

然後,通過衝壓,從金屬板材50a上截取製造出如圖9所示的多個杯狀的模型52a(圖8僅示出一個)。每一模型52a包括一圓形的板體54a及從板體54a的外側周緣向下延伸的一側板56a。側板56a呈圓環形並圍繞板體54a,且側板56a的厚度與板體54a的厚度相等。每一模型52a對應金屬板材50a的一個區域(如圖中所示的A區域)。在衝壓過程中金屬板材50a的A區域逐漸與金屬板材50a的其他部分分離,其中A區域的中部保持原有的水準狀態而形成板體54a,A區域的側邊在模具的壓力作用下向下彎折而形成側板56a。在衝壓過程中,金屬板材50a的厚度基本上不發生變化,即最終形成的模型52a的厚度與金屬板材50a的厚度相等。Then, a plurality of cup-shaped molds 52a (only one shown in Fig. 8) as shown in Fig. 9 were produced by punching from the metal plate 50a. Each of the molds 52a includes a circular plate body 54a and a side plate 56a extending downward from the outer peripheral edge of the plate body 54a. The side plate 56a is annular and surrounds the plate body 54a, and the thickness of the side plate 56a is equal to the thickness of the plate body 54a. Each of the models 52a corresponds to a region of the metal sheet 50a (the A region as shown in the drawing). During the stamping process, the A region of the metal sheet 50a is gradually separated from the other portions of the metal sheet 50a, wherein the middle portion of the A region maintains the original level state to form the plate body 54a, and the side of the A region is depressed by the pressure of the mold. The side plates 56a are formed by bending. During the stamping process, the thickness of the metal sheet 50a does not substantially change, that is, the thickness of the finally formed mold 52a is equal to the thickness of the metal sheet 50a.

之後,如圖10所示對模型52a的側板56a進行拉伸,使其長度增加。由於鋁的良好的延展性,因而在拉伸過程中側板56a不容易發生斷裂,從而確保製造過程的可靠性。側板56a在拉伸之後,長度增大,厚度減小。即是說,經過拉伸的側板56a的厚度要小於板體54a的厚度。Thereafter, the side plate 56a of the mold 52a is stretched as shown in Fig. 10 to increase its length. Due to the good ductility of aluminum, the side plates 56a are less prone to breakage during stretching, thereby ensuring the reliability of the manufacturing process. After stretching, the side plate 56a has an increased length and a reduced thickness. That is, the thickness of the stretched side plate 56a is smaller than the thickness of the plate body 54a.

隨後,如圖11所示再對模型52a的板體54a進行衝壓,使其形成半球狀的結構。在衝壓過程中,板體54a由平板狀變成半球狀,因而面積增大,厚度減小。最終,板體54a的厚度趨於與側板56a的厚度保持一致。可以理解地,板體54a的形狀是由衝壓的模具的形狀所決定的,即半球形的模具可製造出半球形的板體54a,因此,如若需要製造出其他形狀的板體54a(如橢圓形、錐形等等),只需要採用具有相應形狀的模具即可。Subsequently, the plate body 54a of the mold 52a is again pressed as shown in Fig. 11 to form a hemispherical structure. During the pressing process, the plate body 54a is changed from a flat plate shape to a hemispherical shape, so that the area is increased and the thickness is reduced. Finally, the thickness of the plate body 54a tends to coincide with the thickness of the side plate 56a. It can be understood that the shape of the plate body 54a is determined by the shape of the stamped mold, that is, the hemispherical mold can manufacture the hemispherical plate body 54a, and therefore, if necessary, a plate body 54a of other shapes (such as an ellipse) can be manufactured. Shape, cone, etc.), only need to use a mold with a corresponding shape.

然後,如圖12所示在模型52a的表面形成開孔520。在模型52a表面開孔的方式可以有多種,比如,可以先在模型52a的內部套設一具有預先鑽位孔的內模,然後在模型52a的外部用金屬鑽頭在模型52a上對應預先鑽位孔的位置處向內鑽孔;或者是用一中空的內模置入模型52a內以支撐住模型52a,然後將鑽頭放入模型52a內,由內向外鑽孔;又或者是先用一中空的內模置入模型52a內以支撐住模型52a,然後將工具放入模型52a內,由內向外衝壓,從而在模型52a外表面形成凸起,最後再在模型52a外部通過刀具將凸起沿著模型52a表面切除。Then, an opening 520 is formed in the surface of the mold 52a as shown in FIG. There may be various ways of opening the surface of the model 52a. For example, an inner mold having a pre-drilled hole may be firstly sleeved inside the model 52a, and then a pre-drilled position on the model 52a with a metal drill bit outside the model 52a. Drilling inwardly at the location of the hole; or inserting a hollow inner mold into the mold 52a to support the mold 52a, then placing the drill bit into the mold 52a, drilling from the inside to the outside; or using a hollow first The inner mold is placed in the mold 52a to support the mold 52a, and then the tool is placed in the mold 52a, stamped from the inside to the outside, thereby forming a projection on the outer surface of the mold 52a, and finally the convex edge is passed through the cutter outside the mold 52a. The surface of the model 52a is removed.

如圖13所示,再對模型52a的側板56a進行進一步的成型,使其形成直徑自上至下逐漸減小的錐形,並同時在側板56a的底部形成環狀的折邊54。側板56a可採用擠壓旋轉的方式成型,比如將側板56a放入開口漸縮的的旋轉模具當中,通過將側板56a逐漸壓入旋轉模具內,側板被漸縮的開口所擠壓而變形,從而形成帶有環狀折邊54的錐形結構。至此,燈具10的燈罩50已製造完成。As shown in Fig. 13, the side plate 56a of the mold 52a is further molded to form a taper which gradually decreases in diameter from top to bottom, and at the same time, an annular flange 54 is formed at the bottom of the side plate 56a. The side plate 56a may be formed by extrusion rotation, such as placing the side plate 56a into a rotating mold whose opening is tapered. By gradually pressing the side plate 56a into the rotary mold, the side plate is deformed by being pressed by the tapered opening, thereby A tapered structure with an annular flange 54 is formed. So far, the lamp cover 50 of the luminaire 10 has been manufactured.

最後,將已經預裝好燈頭20、光源40及驅動模組60的燈座30對準燈罩50的折邊54,自下至上穿入燈罩50內,直至燈罩50的折邊54套接燈座30的套筒34外側周面並抵接凸緣38的頂面380。由此,完成整個燈具10的組裝過程。Finally, the lamp holder 30, which has been pre-assembled with the lamp holder 20, the light source 40 and the driving module 60, is aligned with the flange 54 of the lamp cover 50, and penetrates into the lamp cover 50 from bottom to top until the flange 54 of the lamp cover 50 is sleeved to the lamp holder. The outer peripheral surface of the sleeve 34 of 30 abuts against the top surface 380 of the flange 38. Thereby, the assembly process of the entire luminaire 10 is completed.

由於本發明是採用金屬作為燈罩50的材料,因此製造過程明顯不同於傳統的玻璃或塑膠燈罩的製造過程。特別地,金屬燈罩50的整個制程相比於傳統的玻璃或塑膠燈罩的制程簡單,並且,在製造和組裝過程中也無需特地注意燈罩50(傳統的玻璃燈罩由於易碎需要特別注意輕拿輕放),因此量產速度更快,可有效增加燈具10在單位時間內的產量。此外,相比於玻璃燈罩,金屬燈罩50的成本更為低廉,可有效地降低整個燈具10的總成本,從而更有利於市場的推廣應用。Since the present invention uses metal as the material of the lamp cover 50, the manufacturing process is significantly different from the manufacturing process of the conventional glass or plastic lamp cover. In particular, the entire process of the metal lampshade 50 is simpler than the conventional glass or plastic lampshade, and there is no need to pay special attention to the lampshade 50 during manufacturing and assembly (the traditional glass lampshade requires special attention to lightness due to fragility). Therefore, the mass production is faster, and the output of the lamp 10 in a unit time can be effectively increased. In addition, the metal lampshade 50 is more cost-effective than the glass lampshade, and can effectively reduce the total cost of the entire lamp 10, thereby facilitating the market promotion and application.

可以理解地,在對模型52a的側板56a進行收窄之後,還可以進一步地對燈罩50外表面進行處理,使之形成光滑的表面,以使燈罩50具有較佳的外觀;或者是在燈罩50內通過電鍍的方式形成高反射率的反射層,以提升反光效果。It can be understood that after narrowing the side plate 56a of the mold 52a, the outer surface of the lamp cover 50 can be further processed to form a smooth surface to give the lamp cover 50 a better appearance; or in the lamp cover 50. A highly reflective reflective layer is formed by electroplating to enhance the reflective effect.

本發明還進一步提供一種具有不同開孔520b形狀的燈具10。請參閱圖14,示出了本發明另一實施例的燈具10的燈罩50b。該燈具10除燈罩50b之外的其他元件均與上一實施例中的相同,故在圖14中均未示出。燈具10的燈罩50b的形狀也與上一實施例的燈罩50形狀相同,不同之處僅在於開孔520b的形狀及排布。這些開孔520b均呈長形,並沿著燈罩50b的殼體52b的周向均勻間隔排列。每一開孔520b從燈罩50b的第一位置朝向燈罩50b的第二位置延伸。燈罩50b的第一位置相比第二位置更靠近燈座30。優選地,第一位置位於靠近燈座30的位置處,第二位置位於遠離燈座30的位置處。即是說,第一位置靠近燈罩50b的底部,第二位置靠近燈罩50b頂部。當然,第一位置也可以位於燈罩50b的中部,第二位置靠近燈罩50b的頂部;也可以第一位置靠近燈罩50b的底部,第二位置位於燈罩50b的中部;或者是其他的下上正對甚至斜對的位置。此外,本實施例中的開孔520b的延伸方向也可以理解為與燈罩50b的折邊54b延伸方向或者是燈罩50b的軸向一致。每一開孔520b的底部終止於燈罩50b的殼體52b底部上方,頂部終止於燈罩50b的殼體52b的頂部下方;由此,燈罩50b在開孔520b未延伸至的殼體52b的頂部及底部分別形成一圓頂形的連接部51b及一圓環形的連接部53b。燈罩50b位於各相鄰二開孔520b之間的部分形成縱長的鰭片56b。每一鰭片56b的寬度自上至下先增大再減小。各鰭片56b的頂部及底部分別通過殼體52b的二連接部51b、53b連接,從而形成一體的構造,以增加燈罩50b的強度。燈罩50b的熱量可經由這些鰭片56b向外界進行散發,從而提升燈具10的散熱效果。並且,由於開孔520b呈長形,因此燈罩50b內的空氣與外界空氣之間的對流將更加通暢,從而進一步提升燈罩50b的散熱效果。此外,由於開孔520b是呈長形,因此開孔520b的成形步驟可在衝壓形成杯狀的模型52a之後即可進行,甚至可以在衝壓金屬板材50a之前就預先形成。在後續的側板56a拉伸過程中,開孔520b會隨同側板56a一起被拉伸。由於所需要的開孔520b本身就呈長形,因此即使被拉伸,也仍然可以滿足對形狀的要求。並且,在後續的側板56a的收窄過程中開孔520b的長形也基本不會受影響。由此,具有長形開孔520b的燈罩50b的制程更加靈活,可根據實際需求排配各製造步驟。The present invention still further provides a luminaire 10 having a shape of different apertures 520b. Referring to Figure 14, a lamp cover 50b of a luminaire 10 in accordance with another embodiment of the present invention is illustrated. The components of the lamp 10 other than the lamp cover 50b are the same as those of the previous embodiment, and are not shown in FIG. The shape of the lamp cover 50b of the lamp 10 is also the same as that of the lamp cover 50 of the previous embodiment, except for the shape and arrangement of the opening 520b. These openings 520b are each elongated and are evenly spaced along the circumferential direction of the casing 52b of the globe 50b. Each opening 520b extends from a first position of the shade 50b toward a second position of the shade 50b. The first position of the shade 50b is closer to the socket 30 than the second position. Preferably, the first position is located adjacent to the socket 30 and the second position is located away from the socket 30. That is, the first position is near the bottom of the lamp cover 50b, and the second position is near the top of the lamp cover 50b. Of course, the first position may also be located in the middle of the lamp cover 50b, and the second position is close to the top of the lamp cover 50b; or the first position may be close to the bottom of the lamp cover 50b, the second position may be located in the middle of the lamp cover 50b; or other lower facing faces Even the diagonally opposite position. In addition, the extending direction of the opening 520b in this embodiment can also be understood to coincide with the extending direction of the folded edge 54b of the lamp cover 50b or the axial direction of the lamp cover 50b. The bottom of each opening 520b terminates above the bottom of the housing 52b of the lamp cover 50b, and the top terminates below the top of the housing 52b of the lamp cover 50b; thus, the lamp cover 50b is at the top of the housing 52b to which the opening 520b does not extend and A dome-shaped connecting portion 51b and a circular connecting portion 53b are formed at the bottom. A portion of the lamp cover 50b located between each of the adjacent two openings 520b forms a vertically long fin 56b. The width of each fin 56b increases first and then decreases from top to bottom. The top and bottom of each fin 56b are respectively connected by the two connecting portions 51b, 53b of the housing 52b, thereby forming an integral structure to increase the strength of the lamp cover 50b. The heat of the lamp cover 50b can be radiated to the outside through the fins 56b, thereby improving the heat dissipation effect of the lamp 10. Moreover, since the opening 520b is elongated, the convection between the air in the lamp cover 50b and the outside air will be more smooth, thereby further improving the heat dissipation effect of the lamp cover 50b. Further, since the opening 520b is elongated, the forming step of the opening 520b can be performed after punching to form the cup-shaped mold 52a, and can be formed in advance even before the metal sheet 50a is punched. During the subsequent stretching of the side panels 56a, the openings 520b are stretched together with the side panels 56a. Since the required opening 520b itself is elongated, the shape requirement can be satisfied even if it is stretched. Also, the elongated shape of the opening 520b is not substantially affected during the narrowing of the subsequent side plate 56a. Thereby, the manufacturing process of the lampshade 50b having the elongated opening 520b is more flexible, and the manufacturing steps can be arranged according to actual needs.

另外,需要指出,本發明中所謂的長形,是指形狀的長度大於寬度即可,並非局限於長方形的定義。比如,兩端呈半圓形、三角形或者其他形狀的長條形均屬於本發明所定義的長形。In addition, it should be noted that the term "long shape" in the present invention means that the length of the shape is larger than the width, and is not limited to the definition of the rectangle. For example, elongated strips having semicircles, triangles or other shapes at both ends are all elongated as defined in the present invention.

本發明之技術內容及技術特點已揭示如上,然而熟悉本項技術之人士仍可能基於本發明之教示及揭示而作種種不背離本發明精神之替換及修飾。因此,本發明之保護範圍應不限於實施例所揭示者,而應包括各種不背離本發明之替換及修飾,並為以下之申請專利範圍所涵蓋。The technical and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

50b...燈罩50b. . . lampshade

51b...連接部51b. . . Connection

52b...殼體52b. . . case

520b...開孔520b. . . Opening

53b...連接部53b. . . Connection

54b...折邊54b. . . Folding

56b...鰭片56b. . . Fin

Claims (20)

一種燈具,包括燈座、安裝於燈座上的光源、連接至燈座的燈頭及罩設光源的燈罩,其改良在於:燈罩上開設長形的開孔。A lamp comprising a lamp holder, a light source mounted on the lamp holder, a lamp cap connected to the lamp holder, and a lamp cover covering the light source, wherein the lamp cover is provided with an elongated opening. 如申請專利範圍第1項所述之燈具,其中燈具為燈泡。The luminaire of claim 1, wherein the luminaire is a light bulb. 如申請專利範圍第1項所述之燈具,其中光源包括發光二極體。The luminaire of claim 1, wherein the light source comprises a light emitting diode. 如申請專利範圍第1項所述之燈具,其中光源發出的部分光線直接從開孔出射,光源發出的另一部分光線經由燈罩的內側壁面反射之後從開孔出射。The luminaire of claim 1, wherein a part of the light emitted by the light source is directly emitted from the opening, and another part of the light emitted by the light source is reflected from the inner side wall surface of the lamp cover and then emerges from the opening. 如申請專利範圍第1項所述之燈具,其中燈罩由不透光材料製造。The luminaire of claim 1, wherein the lampshade is made of an opaque material. 如申請專利範圍第1項所述之燈具,其中燈罩由導熱性材料製造。The luminaire of claim 1, wherein the lampshade is made of a thermally conductive material. 如申請專利範圍第1項所述之燈具,其中燈罩由金屬材料製造。The luminaire of claim 1, wherein the lampshade is made of a metal material. 如申請專利範圍第1至7任一項所述之燈具,其中燈罩的開孔從燈罩的第一位置延伸至燈罩的第二位置,第一位置相比第二位置更靠近燈座。The luminaire of any one of claims 1 to 7, wherein the opening of the lamp cover extends from the first position of the lamp cover to the second position of the lamp cover, the first position being closer to the lamp holder than the second position. 如申請專利範圍第8項所述之燈具,其中第二位置靠近燈罩的頂部,第一位置靠近燈罩的底部。The luminaire of claim 8 wherein the second position is adjacent to the top of the lampshade and the first position is adjacent to the bottom of the lampshade. 如申請專利範圍第1項所述之燈具,其中開孔的數量為多個,相鄰開孔之間形成鰭片。The luminaire of claim 1, wherein the number of the openings is plural, and fins are formed between the adjacent openings. 如申請專利範圍第10項所述之燈具,其中燈罩在開孔的上方及下方分別形成連接部,鰭片的頂部及底部通過相應的連接部連接。The lamp of claim 10, wherein the lamp cover forms a connecting portion above and below the opening, and the top and bottom of the fin are connected by corresponding connecting portions. 如申請專利範圍第11項所述之燈具,其中鰭片中部的寬度大於兩端的寬度。The luminaire of claim 11, wherein a width of a middle portion of the fin is greater than a width of both ends. 如申請專利範圍第1項所述之燈具,其中燈罩包括殼體及從殼體向下延伸的折邊,開孔形成於殼體上,燈罩通過折邊套設於燈座上。The lamp of claim 1, wherein the lamp cover comprises a casing and a flange extending downward from the casing, and the opening is formed on the casing, and the lampshade is sleeved on the lamp socket by the flange. 如申請專利範圍第13項所述之燈具,其中燈座包括支撐光源的基板、從基板周緣向下延伸的套筒及形成於套筒外側周面的凸緣,折邊套設於套筒上並抵接凸緣的頂部。The lamp of claim 13, wherein the lamp holder comprises a substrate supporting the light source, a sleeve extending downward from the periphery of the substrate, and a flange formed on the outer circumferential surface of the sleeve, the flange being sleeved on the sleeve And abut the top of the flange. 一種如權利要求1-7任一項所述的燈具之製造方法,包括:
提供板材;
加工板材,形成具有長形的開孔的燈罩;
將燈罩接合於安裝有光源的燈座上。
A method of manufacturing a luminaire according to any one of claims 1 to 7, comprising:
Provide plates;
Processing the sheet to form a lampshade having an elongated opening;
The lamp cover is joined to a socket on which the light source is mounted.
如申請專利範圍第15項所述之製造方法,其中加工板材的步驟包括對板材進行衝壓,形成杯狀的模型的步驟,模型包括板體及環繞板體的側板。The manufacturing method according to claim 15, wherein the step of processing the sheet material comprises the step of stamping the sheet material to form a cup-shaped mold, the mold comprising the plate body and the side plate surrounding the plate body. 如申請專利範圍第16項所述之製造方法,其中加工板材的步驟包括對模型的側板拉伸的步驟。The manufacturing method of claim 16, wherein the step of processing the sheet material comprises the step of stretching the side panels of the mold. 如申請專利範圍第17項所述之製造方法,其中加工板材的步驟包括對拉伸之後的側板朝向遠離板體的方向進行收窄的步驟。The manufacturing method according to claim 17, wherein the step of processing the sheet material comprises the step of narrowing the side panel after stretching toward a direction away from the sheet body. 如申請專利範圍第17項所述之製造方法,其中加工板材的步驟包括在拉伸側板之前對模型打出開孔的步驟,所形成的開孔在側板的拉伸過程中一同被拉伸。The manufacturing method according to claim 17, wherein the step of processing the sheet material comprises the step of punching the mold before stretching the side panel, and the formed opening is stretched together during the stretching of the side panel. 如申請專利範圍第18項所述之製造方法,其中對側板進行收窄的過程中在側板的底部形成折邊,燈罩通過折邊套設於燈座上。
The manufacturing method according to claim 18, wherein in the process of narrowing the side plate, a flange is formed at the bottom of the side plate, and the lamp cover is sleeved on the lamp holder.
TW102113221A 2013-04-10 2013-04-15 Lamp and method for manufacturing the same TW201439470A (en)

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