TW201420339A - Base material sheet for packing electronic parts, multilayered sheet for packing electronic parts, carrier tape for packing electronic parts, and carrier of electronic parts - Google Patents

Abstract

Provided is a base material sheet for packing electronic parts, a multilayered sheet for packing electronic parts, a carrier tape for packing electronic parts and a carrier of electronic parts, which is capable of reducing effect of burr caused by condition of punching. Such a base material sheet for packing electronic parts is constituted from resin composition containing polystyrene resin (A) and impact-resistant polystyrene resin (B), in which the content of the polystyrene resin (A) is 1 weight % or more and 50 weight % or less, and the content of the impact-resistant polystyrene resin (B) is 50 weight % or more and 99 weight % or less.

Description

Substrate sheet for electronic component packaging, multilayer sheet for electronic component packaging, mounting tape for electronic component packaging, and electronic component carrier

The present invention relates to a substrate sheet for electronic component packaging, a multilayer sheet for electronic component packaging, a mounting tape for electronic component packaging, and an electronic component carrier.

The present invention claims priority based on Japanese Patent Application No. 2012-148672, filed on Jan.

In the conventional multilayer sheet for mounting tape, there is a case where burrs are generated in the sprocket hole and the embossed portion, and the burr is cut off during use, and the foreign matter adheres to the component.

Further, recently, due to the miniaturization of electronic components, the influence of the falling of the burrs has become large, and the burr removing device or the material surface for preventing the burrs from falling has been improved.

As a conventional method for removing the burrs of the mounting tape, the prior art proposes a method of removing the burrs by ultrasonic waves or lasers after punching as in Patent Documents 1 and 2. Further, as disclosed in Patent Document 3, the amount of rubber of the acrylonitrile-butadiene-styrene copolymer (ABS) is adjusted, the adhesion strength between the layers of the sheet is improved, and the burr removal and the generation of burrs are reduced. However, after the blanking, the hair will be The method of removing the side requires additional equipment and additional steps, which is a cause of cost increase. Further, the increase in the adhesion strength between the sheet layers has an effect of suppressing the occurrence of burrs to some extent, but this effect has a limit.

[Practical Technical Literature] [Patent Literature]

Patent Document 1 Japanese Patent Laid-Open Publication No. 2003-136545

Patent Document 2 Japanese Patent Laid-Open Publication No. 2002-321229

Patent Document 3 WO2006/030871

It is an object of the present invention to provide a substrate sheet for electronic component packaging, a multilayer sheet for electronic component packaging, a mounting tape for electronic component packaging, and an electronic component to be transported, which have a reduced influence of burrs generated by punching conditions. body.

These objects are achieved by the present invention of the following (1) to (13).

(1) A substrate sheet for electronic component packaging comprising a resin composition containing a polystyrene resin (A) and a retanning polystyrene resin (B), characterized in that the polystyrene resin ( The content of the A) is 1% by weight or more and 50% by weight or less, and the content of the impact-resistant polystyrene resin (B) is 50% by weight or more and 99% by weight or less.

(2) The substrate sheet for electronic component packaging according to the above (1), wherein the punch-resistant polystyrene resin (B) has an MFR (Metal FLOW RATE) of 200 ° C × 5 kgf under ISO 1133 ) is 2 g/10 min or more and 8 g/10 min or less.

The substrate sheet for electronic component packaging according to the above aspect (1), wherein the impact-resistant polystyrene resin (B) contains a styrene-butadiene copolymer.

(4) A multilayer sheet for electronic component packaging, which is provided on one or both sides of a substrate sheet for electronic component packaging according to any one of the above (1) to (3) A conductive sheet of a conductive resin composition.

(5) The multilayer sheet for electronic component discharge according to the above (4), wherein the conductive resin composition contains a conductive polystyrene resin.

(6) The multilayer sheet for electronic component discharge according to the above (4) or (5), wherein the conductive resin composition contains carbon black.

(7) The multilayer sheet for electronic component packaging according to any one of the above-mentioned, wherein the conductive sheet is a volume ratio of the thickness of the base sheet to the conductive sheet. More than 5% of the total, 40% or less.

(8) The multilayer sheet for electronic component packaging according to any one of the above (4), wherein the penetration energy per unit thickness of the surface of the multilayer sheet for electronic component packaging is 1.7J/mm or more, 3J/mm or less.

(9) The multilayer sheet for electronic component packaging according to any one of the above-mentioned items, wherein the multilayer sheet for electronic component packaging is laminated by a plurality of layers.

(10) A multi-layer sheet for electronic component packaging according to any one of the above (4) to (9), which has a storage portion for accommodating electronic components.

(11) An electronic component transporting body characterized by comprising the mounting tape for electronic component packaging according to (10) above, an electronic component housed in the housing portion, and a cover tape covering a top surface opening of the housing portion. .

By the present invention, the removal step of the burr is not required, and the energy consumption and cost in the equipment and the steps can be reduced without adding equipment and steps, and the occurrence of defects caused by the attachment of the burrs to the parts can be reduced due to the reduction of the burrs.

1‧‧‧First conductive sheet

2‧‧‧Substrate sheet

3‧‧‧Second conductive sheet

10‧‧‧Multilayer sheet

100‧‧‧Loading belt manufacturing equipment

110‧‧‧Vacuum forming device

111‧‧‧Moveable type

112‧‧‧Fixed forming

113‧‧‧Reducing device

120‧‧‧Contact heater unit

121~124‧‧‧ hot plate device

121a~124a‧‧‧ movable hot plate

121b~124b‧‧‧Fixed hot plate

Ds‧‧‧Resin composition sheet transport direction

Figure 1 is a cross-sectional view showing a multilayer sheet according to an embodiment of the present invention.

Fig. 2 is a schematic perspective view of a mounting belt manufacturing apparatus according to an embodiment of the present invention.

Fig. 3 is a schematic side view of a mounting belt manufacturing apparatus according to an embodiment of the present invention.

[Best Mode for Carrying Out the Invention]

Hereinafter, the substrate sheet for electronic component packaging, the multilayer sheet for electronic component packaging, the mounting tape for electronic component packaging, and the electronic component carrier of the present invention will be described in detail based on specific embodiments.

The base material sheet for electronic component packaging of the present invention is a base material sheet for electronic component packaging comprising a resin composition containing a polystyrene resin (A) and a retanning polystyrene resin (B). The content of the polystyrene resin (A) is 1% by weight or more and 50% by weight or less, and the content of the impact-resistant polystyrene resin (B) is 50% by weight or more and 99% by weight or less.

A multilayer sheet for electronic component packaging according to the present invention is characterized in that a conductive sheet containing a conductive resin composition is provided on one surface or both surfaces of the substrate sheet for electronic component packaging.

The mounting tape for electronic component packaging of the present invention is characterized in that the multilayer sheet for electronic component packaging has a housing portion for housing electronic components.

An electronic component transporting body according to the present invention is characterized in that the electronic component packaging mounting tape, the electronic component housed in the housing portion, and a cover tape covering the top surface opening of the housing portion are formed.

<Substrate Sheet for Electronic Parts Packaging>

First, the substrate sheet for electronic component packaging of the present invention will be described.

The substrate sheet for electronic component packaging of the present invention is, for example, a substrate sheet for electronic component packaging comprising a resin composition containing a polystyrene resin (A) and a retanning polystyrene resin (B). The content of the polystyrene resin (A) is 1% by weight or more and 50% by weight or less, and the content of the impact-resistant polystyrene resin (B) is 50% by weight or more and 99% by weight or less.

The base material sheet for electronic component packaging contains 1% by weight or more and 50% by weight or less of the polystyrene resin (A). More preferably, it is 1% by weight or more and 30% by weight or less, and more preferably 5% by weight or more and 20% by weight or less. When the content of the polystyrene resin (A) is within this range, the occurrence of burrs is reduced, and the breakage of the tape is less likely to occur during use of the mounting tape.

The polystyrene resin (A) is not particularly limited, but preferably has an MFR of 200 ° C × 5 kgf under ISO 1133 of 2 g/10 min or more, 8 g/10 min or less, more preferably 2 g/10 min or more, and 7 g/10 min or less. Further preferably, it is 2 g/10 min or more and 5 g/10 min or less. When the MFR of 200 ° C × 5 kgf under ISO 1133 is within this range, the dispersion with the impact-resistant polystyrene is good, and the sheet breakage at the time of melting in the case where the sheet is applied is less likely to occur.

The base material sheet for electronic component packaging contains 50% by weight or more and 99% by weight or less of the impact-resistant polystyrene resin (B). More preferably, it is 70% by weight or more and 99% by weight or less, and more preferably 80% by weight or more and 95% by weight or less. When the content of the impact-resistant polystyrene resin (B) is within this range, the occurrence of burrs is reduced, and the breakage of the tape is less likely to occur during use of the mounting tape.

The impact-resistant polystyrene (B) is obtained by copolymerizing polystyrene and a rubber-like elastomer in order to improve the punching resistance of the polystyrene resin. Examples of the rubber-like elastomer to be copolymerized include butadiene rubber, propylene rubber, acrylonitrile-butadiene rubber, natural rubber, and the like. Among them, the copolymerization of the butadiene rubber is preferable in terms of handling, performance, and price. That is, the impact-resistant polystyrene (B) preferably contains a styrene-butadiene copolymer.

The impact-resistant polystyrene resin (B) is not particularly limited, but preferably has an MFR of 200 ° C × 5 kgf under ISO 1133 of 2 g/10 min or more, 8 g/10 min or less, more preferably 2 g/10 min or more, and 7 g/10 min. Hereinafter, it is more preferably 2 g/10 min or more and 5 g/10 min or less. When the MFR of 200 ° C × 5 kgf under ISO 1133 is within this range, the dispersion with the impact-resistant polystyrene is good, and the sheet breakage at the time of melting in the case where the sheet is applied is less likely to occur.

The measurement method of this MFR is as follows.

The pressure cylinder temperature was set to 200 ° C and about 6 g of the sample was filled into the pressure cylinder, and the material was compressed using a filling rod. After 4 minutes from the end of the filling of the sample, the load was applied with a weight of 5 kg to lower the piston. After extruding the non-foamed filaments, the samples were taken every 30 seconds and the weight was measured so that the weight per 10 minutes was MFR.

When the content of the polystyrene resin (A) is 1% by weight or more and 50% by weight or less, the content of the impact-resistant polystyrene resin (B) is 50% by weight or more and 99% by weight or less, and The MFR of 200°C×5kgf under ISO1133 is 2g/10min or more and 8g/10min or less, which does not easily cause breakage of the mounting tape, and the material strength can be expressed. Further, in the case of punching, the punching strength is not excessively large. The punching is simply broken under the punch, so it has good punching characteristics.

The resin composition may contain other components such as a flame retardant, an anti-drip agent, a dyeing pigment, a heat stabilizer, an ultraviolet absorber, and a firefly, as long as the physical properties of the substrate sheet for electronic component packaging are not damaged. Optical brighteners, lubricants, plasticizers, processing aids, dispersants, mold release agents, thickeners, antioxidants, antistatic additives, extenders, and the like.

In the method for producing a substrate sheet for electronic component packaging, for example, a premixing device such as a closed kneader, a tumbler mixer, a spiral ribbon mixer, or a high-speed mixer may be used as the resin composition. After kneading and granulating a melt kneading device such as a weight type feeder, a uniaxial extruder, a twin-screw extruder, or a continuous kneader, the method is manufactured by a conventional method such as extrusion molding or roll forming. .

The thickness of the substrate sheet for electronic component packaging produced by the production method is not particularly limited, but is preferably 100 μm or more and 400 μm or less, more preferably 200 μm or more and 400 μm or less, and further preferably 200 μm or more and 300 μm or less. . When the thickness of the substrate sheet for electronic component packaging is within this range, the effect of suppressing the occurrence of burrs is enhanced, and when it is placed on the tape, it is less likely to cause cracking or cracking.

<Multilayer sheet for electronic parts packaging>

Next, the multilayer sheet will be described.

A multilayer sheet for electronic component packaging according to the present invention is characterized in that a conductive sheet containing a conductive resin composition is provided on one surface or both surfaces of the substrate sheet for electronic component packaging.

1 is a cross-sectional view for explaining a multilayer sheet for electronic component packaging of the present invention, a multilayer sheet 10 for electronic component packaging (hereinafter referred to as a multilayer sheet 10), a first conductive sheet 1, and the above-mentioned electronic The base material sheet 2 for component packaging (hereinafter referred to as the base material sheet 2) and the second conductive sheet 3 are laminated in this order.

The conductive resin composition is not particularly limited as long as it is a conductive resin composition. For example, conductive polystyrene, conductive polycarbonate, conductive polyester, and the like are preferably contained, and conductive polystyrene is more preferable. By using conductive polystyrene, the adhesion to the substrate sheet is excellent, and the generation of burrs can be reduced.

The conductive resin composition may also contain a conductive filler. The conductive filler is not particularly limited, and examples thereof include carbon black or carbon fiber. Among them, carbon black should be used in view of ease of handling. Examples of the carbon black include furnace black, channel black, Ketjen Black, and acetylene black. Further, in the carbon blacks, from the viewpoint of obtaining a high conductivity from a large specific surface area and a small amount of the resin, it is preferably Ketjen black or acetylene black. The conductive resin composition preferably contains 10% by weight or more and 30% by weight or less of the conductive filler, and more preferably 15% by weight or more and 25% by weight or less, depending on the type of the conductive filler.

The penetration energy per unit thickness of the surface of the multilayer sheet 10 is not particularly limited, but is preferably 1.7 J/mm or more and 3 J/mm or less. By providing the multilayer sheet 10 with such penetration energy, generation of burrs in the sprocket hole and the embossed portion can be suppressed, and defects such as sheet breakage can be suppressed.

In addition, the penetration energy per unit thickness of the surface of the multilayer sheet 10 is preferably 1. 9 J/mm or more and 2.7 J/mm or less, and further preferably 2.1 J/mm or more and 2.5 J/mm or less. By setting it to the lower limit or more, it is possible to further suppress defects such as sheet breakage in the sprocket hole and the embossed portion, and to reduce cracking when the mounting tape is processed. In addition, by setting it to the upper limit or less, the effect of suppressing the occurrence of burrs in the sprocket hole and the embossed portion can be further improved, and sufficient moldability can be ensured.

The penetration energy per unit thickness of the surface of the multilayer sheet 10 is the permeation energy per unit thickness in the temperature of the assumption of the sprocket hole and the embossed portion, for example, a temperature of 10 ° C or more and 40 ° C or less. Through energy in the middle. These penetration energies can be calculated, for example, by changes in the load from the break of the multilayer sheet. Specifically, a multilayer sheet of φ 40 mm was produced, and the periphery was fixed, and a ram member having a front end R10 mm, a falling speed of 2.6 m/min, and a load of 1.02 kg was dropped from the vicinity of the multilayer sheet to be measured in multiple layers. The load change until the sheet is broken is used for calculation. In detail, after the multilayer sheet is contacted with the load cell and the multilayer sheet is broken, the displacement amount of the multilayer sheet and the load applied to the load cell are changed to prepare a load-displacement curve, and the area is obtained from the area. Through the energy.

Further, the first conductive sheet 1 and the second conductive sheet 3 may use the same sheet or different sheets, but in order to lower the warpage of the multilayer sheet 10, the same sheet is preferably used.

The thickness of the multilayer sheet 10 is not particularly limited, but is preferably 100 μm or more and 400 μm or less, more preferably 200 μm or more and 400 μm or less, and still more preferably 200 μm or more and 300 μm or less. When the thickness is equal to or higher than the lower limit value, the fracture or cracking of the mounting tape is less likely to occur, and the formation and processing of the mounting tape can be easily performed by setting the upper limit or lower.

The thickness of the base material sheet 2 is preferably 60% or more and 95% or less of the entire multilayer sheet 10, and more preferably 70% or more and 90% or less. When the thickness is equal to or higher than the lower limit, the effect of suppressing the occurrence of burrs is increased, and when the multilayer sheet 10 is used as a mounting tape, the static electricity can be sufficiently prevented. produce.

In order to satisfy the above-mentioned value of the penetration energy, the multilayer sheet 10 of the present invention preferably has a first conductive The sheet 1, the substrate sheet 2, and the second conductive sheet 3 are sufficiently adhered to each other, and it is preferable that the substrate sheet 2 satisfy the relationship of the main component in the multilayer sheet 10. Thereby, the value of the penetration energy of the multilayer sheet 10 is determined by the physical properties of the substrate sheet 2. Thus, the multilayer sheet of the present invention can be obtained by selecting the composition of the substrate sheet 2 within the above range.

In the present embodiment, an embodiment in which the conductive sheets (the first conductive sheet 1 and the second conductive sheet 3) are formed on both surfaces of the substrate sheet 2 will be described, but the present invention is not limited thereto. A conductive sheet is formed only on the side of one side of the substrate sheet.

In the method for producing the multilayer sheet, for example, all or a part of the above components may be mixed using a premixing device such as a closed kneader, a tumbler mixer, a spiral belt mixer, or a high-speed mixer. After kneading and granulating by a melt kneading device such as a weight type feeder, a uniaxial extruder, a biaxial extruder, or a continuous kneader, and the like, a conventional method such as extrusion molding or roll forming is used. Manufacturing.

<Loading tape for electronic parts packaging>

The mounting tape for electronic component packaging of the present invention is characterized in that the multilayer sheet for electronic component packaging has a housing portion for housing electronic components.

The accommodating portion is, for example, a concave shape, and is configured by four side wall portions which are formed in a reverse pyramid shape toward the bottom portion. In the mounting tape for electronic component packaging, the plurality of concave accommodating portions are formed at regular intervals along the longitudinal direction of the mounting tape.

As a method of forming the accommodating portion in the mounting tape for electronic component packaging, the multilayer sheet for electronic component packaging can be softened by heating by a contact heating device, and then formed by vacuum molding, press molding, and compressed air molding. A known forming method such as plug assist molding is manufactured.

<Electronic parts carrier>

An electronic component transporting body according to the present invention is characterized in that the electronic component packaging mounting tape, the electronic component housed in the housing portion, and a cover tape covering the top surface opening of the housing portion are formed.

Examples of the electronic components housed in the housing portion include an IC, an LED (light emitting diode), a resistor, a liquid crystal, a capacitor, a transistor, a piezoelectric element register, a filter, a crystal oscillator, a crystal vibrator, and a diode. Body, connector, switch, knob, relay, inductor, etc. The form of the IC is not particularly limited, and examples thereof include SOP, HEMT, SQFP, BGA, CSP, SOJ, QFP, PLCC, and the like.

As the cover tape, for example, a support (a support made of paper, a plastic film, a sheet, or the like) and a heat-adhesive layer (a polyolefin resin or a surface provided on one side of the support) can be used. A cover tape composed of a thermal adhesive layer made of a base polymer such as a propylene resin or the like. Such a cover tape having a heat-adhesive layer can be covered by, for example, heat-bonding (heat-sealing) to a mounting tape for electronic component packaging to cover the top surface opening of the accommodating portion.

The electronic component carrier obtained in this manner can transport the electronic components in a plurality of pieces as a whole, and has simple handleability and can suppress damage or deterioration of the electronic components.

[Examples]

Hereinafter, the present invention will be described in more detail by showing examples and comparative examples, but the present invention is not limited thereto.

(Example 1)

(1) Production of pellets

80% by weight of the impact-resistant polystyrene resin (manufactured by PS JAPAN, 475D), 20% by weight of polystyrene resin (G9504 manufactured by PS JAPAN), and mixed into a biaxial extruder having a cylinder diameter of 45 mm. The pellets of the resin composition constituting the substrate sheet were produced.

Further, 30 parts by weight of a mixture of 98% by weight of a punch-resistant polystyrene resin and 2% by weight of a vinyl acetate copolymer, 30 parts by weight of mixed carbon, and a mixture was placed in a biaxial extruder having a cylinder diameter of 45 mm, and kneaded to prepare a composition. A pellet of a resin composition of a conductive sheet.

(2) Production of multilayer sheets

Each of the pellets obtained as described above was kneaded by a uniaxial extruder having a cylinder bore of 50 mm, and the first conductive sheet and the second layer were formed on the surfaces of both sides of the substrate sheet by a multi-manifold mold. The conductive sheets were laminated, allowed to cool and a 300 μm thick multilayer sheet was produced by a take-up mechanism.

The thickness of the first conductive sheet was 15 μm, the thickness of the substrate sheet was 270 μm, and the thickness of the second conductive sheet was 15 μm. Further, the physical properties of the produced multilayer sheet were measured. The tensile modulus of elasticity at 25 ° C was 1900 MPa, and the penetration energy for surface punching at 25 ° C was 1.8 J/mm.

(3) Production of the mounting tape

In the mounting tape manufacturing apparatus shown in FIG. 2 and FIG. 3 described above, the above-mentioned multilayer tape was supplied, and the heater was formed at a heater temperature of 200° C., and the sprocket hole was opened to manufacture a mounting tape.

(4) Observation of the occurrence of burrs in the production of the mounting tape

With respect to the mounting tape manufactured as described above, the occurrence of the burrs of the sprocket holes at 20 points and the presence or absence of burrs in the embossed portions were confirmed by a microscope, and it was confirmed that burrs of 0.15 mm or more were generated. The observation of the same mounting tape was repeated 20 times, and the evaluation results were classified as follows. The results are shown in Table 1.

◎: The burrs of 0.15 mm or more were observed 0 times in 20 observations.

○: The burrs of 0.15 mm or more were observed once in 20 observations.

△: The burrs of 0.15 mm or more were observed twice in 20 observations.

×: The burrs of 0.15 mm or more were observed three times or more in 20 observations.

(Example 2)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 1.7 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

(Example 3)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 1.5 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

(Example 4)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 1.8 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

(Example 5)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 1.7 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

(Example 6)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 2.6 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

(Example 7)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 2.2 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

(Comparative Example 1)

A mounting tape was produced in the same manner as in Example 1 except that the changes were as shown in Table 1. The penetration energy generated by the surface punching at 25 ° C of the produced multilayer sheet was 1.1 J/mm. In the same manner as in the first embodiment, the state of occurrence of the burrs of the produced mounting tape was confirmed. The results are shown in Table 1.

【Table 1】

As is apparent from Table 1, Examples 1 to 7 suppressed the generation of burrs in the bore of the sprocket hole and the embossed portion, and the comparative example did not obtain sufficient results.

[Industrial use]

The present invention can be applied to a substrate sheet for electronic component packaging, a multilayer sheet for electronic component packaging, a mounting tape for electronic component packaging, and an electronic component carrier for reducing the influence of burrs generated by punching conditions. .

1‧‧‧First conductive sheet

2‧‧‧Substrate sheet

3‧‧‧Second conductive sheet

10‧‧‧Multilayer sheet

Claims (11)

A substrate sheet for packaging an electronic component comprising a resin composition containing a polystyrene resin (A) and a retanning polystyrene resin (B), characterized in that the polystyrene resin (A) is contained The amount is 1% by weight or more and 50% by weight or less, and the content of the impact-resistant polystyrene resin (B) is 50% by weight or more and 99% by weight or less. The substrate sheet for electronic component packaging according to claim 1, wherein the impact-resistant polystyrene resin (B) has an MFR (MELT FLOW RATE) of 200 ° C × 5 kgf under ISO 1133. 2g/10min or more, 8g/10min or less. The substrate sheet for electronic component packaging according to claim 1 or 2, wherein the impact-resistant polystyrene resin (B) contains a styrene-butadiene copolymer. A multilayer sheet for electronic component packaging, which has a conductive resin composition on one or both sides of a substrate sheet for electronic component packaging according to any one of claims 1 to 3. Conductive sheet. The multilayer sheet for electronic component packaging according to the fourth aspect of the invention, wherein the conductive resin composition contains a conductive polystyrene resin. The multilayer sheet for electronic component packaging according to the fourth or fifth aspect of the invention, wherein the conductive resin composition contains carbon black. The multilayer sheet for electronic component packaging according to the fourth or fifth aspect of the invention, wherein the volume ratio of the thickness of the substrate sheet for electronic component packaging to the thickness of the conductive sheet is 5% or more of the total of the conductive sheet. 40% or less. The multilayer sheet for electronic component packaging according to the fourth or fifth aspect of the patent application, wherein the penetration energy per unit thickness of the surface of the multilayer sheet for electronic component packaging is 1.7 J/mm or more, 3 J/mm. the following. The multilayer sheet for electronic component packaging according to the fourth or fifth aspect of the invention, wherein the multilayer sheet for electronic component packaging is laminated by multi-layer extrusion molding. A mounting sheet for electronic component packaging according to any one of claims 4 to 9, which has a accommodating portion for accommodating electronic components. An electronic component transporting body comprising: a mounting tape for electronic component packaging according to claim 10; an electronic component housed in the accommodating portion; and a cover tape covering a top surface opening of the accommodating portion.